TW202306021A - 基板保持裝置 - Google Patents

基板保持裝置 Download PDF

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Publication number
TW202306021A
TW202306021A TW111118647A TW111118647A TW202306021A TW 202306021 A TW202306021 A TW 202306021A TW 111118647 A TW111118647 A TW 111118647A TW 111118647 A TW111118647 A TW 111118647A TW 202306021 A TW202306021 A TW 202306021A
Authority
TW
Taiwan
Prior art keywords
substrate
annular wall
processed
space
gas
Prior art date
Application number
TW111118647A
Other languages
English (en)
Chinese (zh)
Inventor
高橋鉄兵
阪上弘敏
前平謙
Original Assignee
日商愛發科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商愛發科股份有限公司 filed Critical 日商愛發科股份有限公司
Publication of TW202306021A publication Critical patent/TW202306021A/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW111118647A 2021-07-16 2022-05-19 基板保持裝置 TW202306021A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021118302 2021-07-16
JP2021-118302 2021-07-16

Publications (1)

Publication Number Publication Date
TW202306021A true TW202306021A (zh) 2023-02-01

Family

ID=84919300

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111118647A TW202306021A (zh) 2021-07-16 2022-05-19 基板保持裝置

Country Status (5)

Country Link
JP (1) JPWO2023286427A1 (ko)
KR (1) KR20240027065A (ko)
CN (1) CN116802787A (ko)
TW (1) TW202306021A (ko)
WO (1) WO2023286427A1 (ko)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3488334B2 (ja) * 1996-04-15 2004-01-19 京セラ株式会社 静電チャック
JP3834466B2 (ja) * 2000-10-30 2006-10-18 株式会社日立製作所 半導体製造装置の制御方法
JP2010123810A (ja) 2008-11-20 2010-06-03 Ulvac Japan Ltd 基板保持装置及び基板温度制御方法
JP5973841B2 (ja) * 2012-08-22 2016-08-23 日本特殊陶業株式会社 静電チャックのガス制御装置およびガス制御方法
KR102529412B1 (ko) 2017-03-31 2023-05-04 램 리써치 코포레이션 플렉서블 웨이퍼 온도 제어부를 갖는 정전 척 (electrostatic chuck)
JP7486018B2 (ja) * 2018-12-21 2024-05-17 Toto株式会社 静電チャック

Also Published As

Publication number Publication date
KR20240027065A (ko) 2024-02-29
JPWO2023286427A1 (ko) 2023-01-19
WO2023286427A1 (ja) 2023-01-19
CN116802787A (zh) 2023-09-22

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