TW202245956A - 用於雷射加工的抽吸裝置以及具有此裝置的雷射加工裝置 - Google Patents
用於雷射加工的抽吸裝置以及具有此裝置的雷射加工裝置 Download PDFInfo
- Publication number
- TW202245956A TW202245956A TW111116688A TW111116688A TW202245956A TW 202245956 A TW202245956 A TW 202245956A TW 111116688 A TW111116688 A TW 111116688A TW 111116688 A TW111116688 A TW 111116688A TW 202245956 A TW202245956 A TW 202245956A
- Authority
- TW
- Taiwan
- Prior art keywords
- suction
- hollow
- laser processing
- hole
- laser
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2021-0058014 | 2021-05-04 | ||
KR1020210058014A KR20220150707A (ko) | 2021-05-04 | 2021-05-04 | 레이저 가공용 석션장치 및 이를 포함하는 레이저 가공장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202245956A true TW202245956A (zh) | 2022-12-01 |
Family
ID=83932784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111116688A TW202245956A (zh) | 2021-05-04 | 2022-05-03 | 用於雷射加工的抽吸裝置以及具有此裝置的雷射加工裝置 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20220150707A (ko) |
TW (1) | TW202245956A (ko) |
WO (1) | WO2022235003A1 (ko) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100936922B1 (ko) | 2007-09-21 | 2010-01-18 | 한미반도체 주식회사 | 레이저 컷팅 장비의 석션후드 |
KR102264649B1 (ko) * | 2014-11-11 | 2021-06-15 | 삼성디스플레이 주식회사 | 레이저 절단 장치 |
CN106271054A (zh) * | 2015-05-30 | 2017-01-04 | 中国科学院宁波材料技术与工程研究所 | 提高扫描振镜系统加工能力的辅助装置及提高方法 |
JP6441835B2 (ja) * | 2016-01-19 | 2018-12-19 | 日本電信電話株式会社 | レーザーデブリ吸引・排気機構を有するレーザービームデリバリーノズル |
KR101882186B1 (ko) * | 2016-06-29 | 2018-07-27 | 주식회사 필옵틱스 | 레이저 가공용 파티클 석션 장치 |
KR102139282B1 (ko) * | 2017-08-28 | 2020-07-30 | 주식회사 에스디에이 | 분진흡입기능이 구비된 레이저 가공 장치 |
-
2021
- 2021-05-04 KR KR1020210058014A patent/KR20220150707A/ko not_active Application Discontinuation
-
2022
- 2022-04-27 WO PCT/KR2022/005972 patent/WO2022235003A1/ko active Application Filing
- 2022-05-03 TW TW111116688A patent/TW202245956A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20220150707A (ko) | 2022-11-11 |
WO2022235003A1 (ko) | 2022-11-10 |
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