TW202245956A - 用於雷射加工的抽吸裝置以及具有此裝置的雷射加工裝置 - Google Patents

用於雷射加工的抽吸裝置以及具有此裝置的雷射加工裝置 Download PDF

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Publication number
TW202245956A
TW202245956A TW111116688A TW111116688A TW202245956A TW 202245956 A TW202245956 A TW 202245956A TW 111116688 A TW111116688 A TW 111116688A TW 111116688 A TW111116688 A TW 111116688A TW 202245956 A TW202245956 A TW 202245956A
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TW
Taiwan
Prior art keywords
suction
hollow
laser processing
hole
laser
Prior art date
Application number
TW111116688A
Other languages
English (en)
Chinese (zh)
Inventor
嚴泰駿
金聖進
金炳秀
金大裕
Original Assignee
南韓商Ap系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 南韓商Ap系統股份有限公司 filed Critical 南韓商Ap系統股份有限公司
Publication of TW202245956A publication Critical patent/TW202245956A/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW111116688A 2021-05-04 2022-05-03 用於雷射加工的抽吸裝置以及具有此裝置的雷射加工裝置 TW202245956A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0058014 2021-05-04
KR1020210058014A KR20220150707A (ko) 2021-05-04 2021-05-04 레이저 가공용 석션장치 및 이를 포함하는 레이저 가공장치

Publications (1)

Publication Number Publication Date
TW202245956A true TW202245956A (zh) 2022-12-01

Family

ID=83932784

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111116688A TW202245956A (zh) 2021-05-04 2022-05-03 用於雷射加工的抽吸裝置以及具有此裝置的雷射加工裝置

Country Status (3)

Country Link
KR (1) KR20220150707A (ko)
TW (1) TW202245956A (ko)
WO (1) WO2022235003A1 (ko)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100936922B1 (ko) 2007-09-21 2010-01-18 한미반도체 주식회사 레이저 컷팅 장비의 석션후드
KR102264649B1 (ko) * 2014-11-11 2021-06-15 삼성디스플레이 주식회사 레이저 절단 장치
CN106271054A (zh) * 2015-05-30 2017-01-04 中国科学院宁波材料技术与工程研究所 提高扫描振镜系统加工能力的辅助装置及提高方法
JP6441835B2 (ja) * 2016-01-19 2018-12-19 日本電信電話株式会社 レーザーデブリ吸引・排気機構を有するレーザービームデリバリーノズル
KR101882186B1 (ko) * 2016-06-29 2018-07-27 주식회사 필옵틱스 레이저 가공용 파티클 석션 장치
KR102139282B1 (ko) * 2017-08-28 2020-07-30 주식회사 에스디에이 분진흡입기능이 구비된 레이저 가공 장치

Also Published As

Publication number Publication date
KR20220150707A (ko) 2022-11-11
WO2022235003A1 (ko) 2022-11-10

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