TW202243915A - 可撓性電子裝置之製造方法 - Google Patents

可撓性電子裝置之製造方法 Download PDF

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Publication number
TW202243915A
TW202243915A TW110127671A TW110127671A TW202243915A TW 202243915 A TW202243915 A TW 202243915A TW 110127671 A TW110127671 A TW 110127671A TW 110127671 A TW110127671 A TW 110127671A TW 202243915 A TW202243915 A TW 202243915A
Authority
TW
Taiwan
Prior art keywords
aqueous solution
electronic device
inorganic substrate
film
manufacturing
Prior art date
Application number
TW110127671A
Other languages
English (en)
Chinese (zh)
Inventor
德田桂也
渡邊直樹
奧山哲雄
前田鄉司
Original Assignee
日商東洋紡股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東洋紡股份有限公司 filed Critical 日商東洋紡股份有限公司
Publication of TW202243915A publication Critical patent/TW202243915A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/11—Separation of active layers from substrates
    • H10P95/112—Separation of active layers from substrates leaving a reusable substrate, e.g. epitaxial lift off
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/06—Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/10—Salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/40—Cleaning for reclaiming
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW110127671A 2020-07-29 2021-07-28 可撓性電子裝置之製造方法 TW202243915A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2020-128549 2020-07-29
JP2020-128548 2020-07-29
JP2020128548 2020-07-29
JP2020128549 2020-07-29
JP2020-128550 2020-07-29
JP2020128550 2020-07-29

Publications (1)

Publication Number Publication Date
TW202243915A true TW202243915A (zh) 2022-11-16

Family

ID=80036391

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110127671A TW202243915A (zh) 2020-07-29 2021-07-28 可撓性電子裝置之製造方法

Country Status (5)

Country Link
JP (1) JP7771956B2 (https=)
KR (1) KR20230044351A (https=)
CN (1) CN115668460A (https=)
TW (1) TW202243915A (https=)
WO (1) WO2022024820A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115939263A (zh) * 2023-03-09 2023-04-07 浙江晶科能源有限公司 太阳能电池制备方法、太阳能电池及光伏组件
CN115835740A (zh) 2022-12-13 2023-03-21 浙江晶科能源有限公司 太阳能电池制备方法、太阳能电池及叠层太阳能电池

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55161748A (en) 1979-05-31 1980-12-16 Ricoh Co Ltd Method of controlling collator
JPS5891446A (ja) 1981-11-26 1983-05-31 Dainippon Printing Co Ltd 軟ｘ線リソグラフイ−用フイルムの製造法
JPS6036323A (ja) * 1983-08-09 1985-02-25 Ube Ind Ltd 水酸化カリウム水溶液の精製法
US5227008A (en) * 1992-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method for making flexible circuits
JP4619461B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜デバイスの転写方法、及びデバイスの製造方法
JP2000243943A (ja) 1999-02-23 2000-09-08 Seiko Epson Corp 半導体装置の製造方法
JP4350263B2 (ja) * 2000-04-03 2009-10-21 三菱伸銅株式会社 金属化ポリイミドフィルムおよびその製造方法
JP4544771B2 (ja) * 2001-03-26 2010-09-15 東レエンジニアリング株式会社 金属回路パターン形成方法
JP2006063201A (ja) * 2004-08-27 2006-03-09 Sanyo Chem Ind Ltd 洗浄剤
JP2007141888A (ja) * 2005-11-14 2007-06-07 Muromachi Chemical Kk ポリイミド膜除去用洗浄液および洗浄方法
JP2007157750A (ja) * 2005-11-30 2007-06-21 Tokyo Electron Ltd 洗浄装置及び洗浄方法
JP4952441B2 (ja) * 2007-08-28 2012-06-13 東洋紡績株式会社 ポリイミドの分解・回収方法
JP2009114268A (ja) * 2007-11-02 2009-05-28 Nagase Chemtex Corp ポリイミド用剥離剤
JP5152104B2 (ja) 2009-06-08 2013-02-27 東洋紡株式会社 積層体およびその製造方法
JP5862238B2 (ja) 2011-05-27 2016-02-16 東洋紡株式会社 積層体とその製造方法及びそれを用いたデバイス構造体の製造方法
TWI524991B (zh) 2013-02-04 2016-03-11 東洋紡股份有限公司 A laminated body, a method for producing a laminated body, and a method for manufacturing the flexible electronic device
JP2015199350A (ja) 2014-03-31 2015-11-12 新日鉄住金化学株式会社 フレキシブルデバイスの製造方法、フレキシブルデバイス製造装置、フレキシブルデバイス及び液状組成物
JP6638415B2 (ja) * 2016-01-15 2020-01-29 東洋紡株式会社 フレキシブル電子デバイスの製造方法
JP6746920B2 (ja) * 2016-01-15 2020-08-26 東洋紡株式会社 フレキシブル電子デバイスの製造方法
JP6646073B2 (ja) * 2016-01-22 2020-02-14 富士フイルム株式会社 処理液
JP6981011B2 (ja) * 2017-02-22 2021-12-15 東洋紡株式会社 デバイス形成用仮支持基板およびデバイスの製造方法

Also Published As

Publication number Publication date
KR20230044351A (ko) 2023-04-04
CN115668460A (zh) 2023-01-31
JPWO2022024820A1 (https=) 2022-02-03
JP7771956B2 (ja) 2025-11-18
WO2022024820A1 (ja) 2022-02-03

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