TW202241688A - Resin-molding device and method for producing resin molded article - Google Patents

Abstract

The resin-molding device according to the present invention is provided with a table that is at least partially translucent, an illumination unit capable of illuminating the table from below, a resin-material-supplying unit that supplies a resin material onto the table, an imaging unit capable of capturing an image of the resin material supplied onto the table, and a resin-molding unit that performs resin molding using the resin material supplied onto the table.

Description

Resin molding device, and method of manufacturing resin molded product

The present invention relates to a resin molding device and a method for manufacturing a resin molded product.

In recent years, it is desired to reduce the thickness of the semiconductor package, and to achieve in-plane uniformity in the amount of resin supply in order to eliminate variation in package thickness over a wide area and to make the package thickness uniform. Therefore, for example, Patent Document 1 discloses a technique of disposing a release film on a workbench, supplying a liquid resin onto the release film, and photographing it with a camera (see FIG. 3 of Patent Document 1). Wait). In addition, Patent Document 2 discloses a technology in which a release film is placed on a moving table, and then granular resin is supplied to the release film and observed (see paragraphs [0048], [0049] of Patent Document 2. ], Figure 1, etc.). In any of the techniques of the patent documents, the in-plane uniformity of the resin material is recognized by observing the resin material laminated on the release film.

[Prior Art Literature] (patent documents) Patent Document 1: Japanese Patent No. 6218891 Patent Document 2: Japanese Patent Laid-Open No. 2020-82534

[Problem to be solved by the invention] However, although it is not clearly stated in each of the above publications, in the prior art, the camera is arranged above the resin material, and the lighting is also arranged above. Therefore, the illumination direction of the illumination is inclined with respect to the imaging direction. As a result, shading may occur on the resin material and light and shade may be generated, which may be a cause of misunderstanding of in-plane uniformity.

The present invention was made to solve this problem, and an object of the present invention is to provide a resin molding device and a method of manufacturing a resin molded product that can detect the occurrence of thickness variation within a single resin molded product

[Technical means to solve the problem] The resin molding apparatus of the present invention includes: a workbench at least a part of which is translucent; an illuminating unit capable of illuminating the workbench from below; and a resin material supply unit that supplies resin material to the workbench. an imaging unit capable of imaging the resin material supplied on the table from above; and a resin molding unit performing resin molding using the resin material supplied on the table.

The manufacturing method of the resin molded article of the present invention comprises: the step of supplying the resin material onto at least a partially light-transmitting workbench; a step of imaging the resin material; and a step of resin molding using the resin material supplied to the stage.

[Effect of the invention] According to the present invention, it is possible to detect the occurrence of thickness variation within one resin molded product.

Hereinafter, one embodiment of the resin molding apparatus according to the present invention will be described in detail using the drawings. In addition, for easy understanding, appropriate objects may be omitted or exaggerated and schematically drawn in each drawing.

<1. Configuration of resin molding equipment> Fig. 1 is a schematic plan view of a resin molding apparatus 100 according to the present embodiment. The resin molding apparatus 100 is configured to apply resin sealing to a substrate W to which electronic components such as semiconductor chips, resistor elements, and capacitor elements are connected, to manufacture resin molded products. In this resin molding apparatus 100 , a resin seal is applied to the component mounting surface of the substrate W on which electronic components are mounted.

Examples of the substrate W used here include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, ceramic substrates, and the like. The substrate W may also be a carrier used in FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). In the substrate W, wiring may be provided in advance, or no wiring may be provided.

As shown in FIG. 1, the resin molding apparatus 100 has a substrate supply and storage module A (hereinafter also simply referred to as "module A") and two resin molding modules B (hereinafter also simply referred to as "module B"). , a resin material supply module C (hereinafter also simply referred to as “module C”), and a first control unit 14 . As the first control unit, for example, PLC (Programmable Logic Controller, programmable logic controller), PC (Personal Computer, personal computer) or the like can be used. The first control unit 14 is configured to include CPU (Central Processing Unit, central processing unit), RAM (Random Access Memory, random access memory) and ROM (Read Only Memory, read-only memory), etc., to correspond to information Process to execute the control of each module A~C. Hereinafter, each of the modules A to C will be described in detail. In addition, each of the modules A to C can be attached to and detached from other modules and can be exchanged. In addition, in the resin molding apparatus 100, addition and subtraction can be performed for each of the die sets A to C.

<1-1. Module A> Module A is a module that supplies substrates W before sealing and stores substrates W after sealing, and includes a substrate supply unit 1 , a substrate storage unit 2 , a substrate placement unit 3 , and a substrate transfer mechanism 4 . The substrate supply unit 1 is configured to supply the substrate W before sealing to the substrate mounting unit 3 . The substrate storage unit 2 is configured to store the sealed substrate W (resin molded product). The substrate placement unit 3 is configured to move in the arrow Y direction between the corresponding position of the substrate supply unit 1 and the corresponding position of the substrate storage unit 2 . The substrate transfer mechanism 4 is configured to move across the module A and the module B in the arrow X direction and the arrow Y direction, for example, in the module A, the substrate W before sealing on the substrate mounting part 3 is held and Move to module B. Alternatively, the sealed substrate W manufactured in the module B is placed on the substrate mounting portion 3 of the module A. As shown in FIG.

<1-2. Module B> Each die set B is a die set for molding a resin material, has a compression molding part 5, and manufactures a sealed substrate W (resin molded product) by compression molding. In this compression molding, for example, a black granular resin material P is used. The compression molding unit 5 has an upper die 52 , a lower die 51 facing the upper die 52 , and a die fastening mechanism 53 . The upper mold 52 is configured to hold the substrate W on its bottom surface. On the other hand, the lower die 51 has a bottom member and side members for forming the concave cavity 51C. That is, the bottom surface of the chamber 51C is constituted by the bottom surface member, and the side surface of the chamber 51C is constituted by the side members. As will be described later, the resin material P prepared by the die set C is arranged in the chamber 51C. Furthermore, the die fastening mechanism 53 is configured to perform die fastening on the upper die 52 and the lower die 51 on which the resin material P is arranged.

<1-3. Module C> Module C is a module for supplying resin materials. As shown in FIG. 1 , the module C has a moving table 6 , a resin material storage unit 7 , a resin material supply unit 8 , a release film supply unit 9 , an imaging unit 300 , and a resin material transfer mechanism 90 . Furthermore, in this module C, a HDD (Hard Disc Drive, hard disk drive) 200 and a second control unit 150 are provided. This second control unit 150 corresponds to the control unit of the present invention. Each configuration will be described in detail below.

＜1-3-1. Mobile station＞ Fig. 2 is a plan view of the mobile station, and Fig. 3 is a sectional view of Fig. 2 . As shown in FIG. 1 , the moving table 6 is configured to move in the arrow X direction and the arrow Y direction in the module C. As shown in FIG. As shown in FIGS. 2 and 3 , a recess 61 is formed on the top surface of the moving table 6 , and a light guide plate 62 is arranged in the recess 61 . In addition, an LED module 63 is disposed on a side end surface of the light guide plate 62 as an illumination unit. The light irradiated from the LED module 63 enters the light guide plate 62 and diffuses in the light guide plate 62 , so that the top surface of the light guide plate 62 emits light. As the light guide plate 62 , a known plate material made of acrylic resin or the like can be appropriately used, and a reflection film and a diffusion film can be provided as necessary.

On the top surface of the moving table 6, a suction opening (not shown) is formed around the light guide plate 62, and is configured to hold a release film 73 described below by suction.

＜1-3-2. Release film supply part＞ Fig. 4 is a side view illustrating the operation of the release film supply unit. As shown in FIG. 4( a ), a release film supply unit 9 for arranging a release film 73 on the top surface of the movable table 6 is provided on one end side of the movable table 6 . The release film supply unit 9 has a roll 91 on which the release film 73 is wound, a roll-out section 92 that rolls the release film 73 out of the roll 91 and arranges it on the moving table 6, and cuts the release film 73. Cut off part 93.

As shown in FIG. 4 (b), the unwinding portion 92 is configured to hold the end of the release film 73 wound on the roller 91, and to roll out the release film 73 by moving away from the roller 91. . At this time, the unwinding unit 92 moves above the moving table 6 from one end portion to the other end portion of the moving table 6 . Thereby, the mold release film 73 is arrange|positioned on the moving table 6. As shown in FIG. The release film 73 on the movable table 6 is sucked by the above-mentioned suction port and held on the movable table 6 . Moreover, as shown in FIG.4(c), the edge part by the side of the roll 91 in the release film 73 is cut|disconnected by the cutting part 93. As shown in FIG. Thereby, the sheet-shaped mold release film 73 is arrange|positioned on the moving table 6. As shown in FIG.

＜1-3-3. Resin material container＞ Next, the resin material housing portion 7 will be described. As shown in FIG. 5( a ), the resin material container 7 has a frame-shaped member 72 and a movement mechanism (not shown) for moving the frame-shaped member 72 . The frame member 72 is formed in a rectangular shape and is arranged on the moving table 6 on which the release film 73 has been arranged by a moving mechanism. Thereby, a concave portion 71 is formed into which a resin material is supplied. That is, the bottom surface of the concave portion 71 is formed by the release film 73 , and the side surfaces of the concave portion 71 are formed by the frame-shaped member 72 . In addition, this concave portion 71 has a space corresponding to the size of the cavity 51C of the lower mold 51 of the die set B. As shown in FIG.

＜1-3-4. Resin material supply part＞ Next, the resin material supply unit 8 will be described. Fig. 6 is a cross-sectional view schematically showing a resin material supply unit. The resin material supply unit 8 is configured to supply a predetermined weight of the resin material P into the recess 71 of the frame member 72 , and has a storage unit 11 , a transport path 12 , a vibrating unit 13 , and a measuring unit 16 . The storage unit 11 temporarily stores the granular resin material P and supplies the resin material P to the transport path 12 . The resin material supplied to the transport path 12 is discharged from the discharge port 121 at the end of the transport path 12 and supplied to the recess 71 of the frame-shaped member 72 . At this time, the conveyance path 12 is vibrated by the vibration part 13, and the resin material P is conveyed to the discharge port side by this.

The measuring unit 16 is configured to measure the weight of the resin material P in the resin material supply unit 8 . The first control unit 14 controls the vibration unit 13 so that the supply amount of the resin material P to the resin material storage unit 7 becomes a target value based on the measurement result obtained by the measurement unit 16 .

The resin material P falling from the discharge port 121 of the resin material supply part 8 is completely covered in the recessed part 71 by the relative movement of the moving table 6 with respect to the discharge port of the resin material supply part 8 .

＜1-3-5. Camera Department＞ Fig. 7 is a diagram for explaining an imaging state obtained by an imaging unit. As shown in FIG. 7, the imaging unit 300 is configured to image the resin material P supplied into the concave portion 71 of the frame member 72 from above to generate image data. The imaging unit 300 images the resin material P in the concave portion 71 , for example, in a state where the moving table 6 is positioned below the imaging unit 300 . The imaging unit 300 is, for example, constituted by a camera module, and the camera module includes a CCD (Charge Coupled Device, Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor, Complementary Metal Oxide Semiconductor) image sensor, etc. image sensor. When this imaging is performed, light is irradiated from below the resin material P via the release film 73 through the light guide plate 62 .

The HDD 200 is configured to store image data generated by the imaging unit 300 . In addition, the HDD200 can also be replaced with other storage media such as a solid-state drive.

The second control unit 150 includes a CPU, a RAM, a ROM, and the like, and is configured to control the imaging unit 300 and the like in accordance with information processing. Various controls performed by the first control unit 14 and the second control unit 150 will be described in detail later.

＜1-3-6. Resin material transfer mechanism＞ As shown in FIG. 1 , the resin material transfer mechanism 90 is configured to move in the arrow X direction and the arrow Y direction in the module B and the module C. As shown in FIG. As shown in FIG. 5( b ), the resin material transfer mechanism 90 separates the frame member 72 and the release film 73 containing the resin material P from the moving table 6 . Furthermore, these are conveyed to the lower mold 51 of the die set B, and the resin material P is supplied to the cavity 51C of the lower mold 51.

＜2. Suppression of thickness variation of resin molded products＞ Next, a method for suppressing the thickness of the resin molded product in the module C having the above configuration will be described.

In recent years, thinning of semiconductor packages (an example of resin molded products) has progressed, and for example, products with a thickness of 0.38 mm or 0.43 mm have been sought in the market. On the other hand, thickness variation may occur within one resin molded product depending on the quality of the molding process. In a thin resin molded product, a small amount of thickness deviation will have a great influence on the quality of the resin molded product. The thickness deviation in one resin molded product is the thickness deviation in the plane of one resin molded product, and refers to the thickness deviation in a plurality of parts in the resin molded product, not when referring to a plurality of resins Thickness variation when comparing the thickness of molded products.

Such a problem becomes conspicuous, for example, in a case where the resin material P is not completely supplied into the concave portion 71 of the frame-shaped member 72 . That is, if the resin molding is performed in a state where the resin material P is insufficient in some regions of the concave portion 71 , the thickness of the completed resin molded product varies in each region.

FIG. 8 is a diagram showing an example of the concave portion 71 in a state where the resin material P is supplied. As shown in FIG. 8, the concave portion 71 includes a region T30 and a region T40. The resin material P is sufficiently supplied in the region T30, but the resin material P is insufficient in the region T40. In a region where the resin material P is insufficient, the bottom surface of the concave portion 71 is exposed. The color of the bottom surface of the concave portion 71 is closer to white than the resin material P. As shown in FIG.

In this resin molding apparatus 100 , before performing resin molding, the resin material P supplied to the frame-shaped member 72 is imaged by the imaging unit 300 . The second control unit 150 analyzes the image data generated by the imaging unit 300, and controls the resin material supply unit 8 based on the analysis result. In the resin molding apparatus 100 , the resin material supply unit 8 is controlled based on the analysis result of the supply state of the resin material P in the recess 71 , so the supply state of the resin material P in the recess 71 can be improved. As a result, according to the resin molding apparatus 100 , it is possible to suppress the occurrence of variations in the thickness of the manufactured resin molded product within one resin molded product. Hereinafter, the operation of the resin molding apparatus 100 will be described in detail.

<3. Operation example of resin molding device> FIG. 9 is a flowchart showing a part of the operation program in the resin molding apparatus 100 . The processing shown in this flowchart is performed in a state where the recessed portion 71 of the frame-shaped member 72 is positioned below the discharge port 121 of the resin material supply unit 8 . The processing shown in the flowchart on the left is executed by the first control unit 14 , and the processing shown in the flowchart on the right is executed by the second control unit 150 .

Referring to the left side of FIG. 9 , the first control unit 14 controls the resin material supply unit 8 to discharge the resin material P toward the concave portion 71 (step S100 ). The first control unit 14 determines whether or not the discharge of the resin material P is completed (step S110 ). When it is determined that the discharge of the resin material P has not been completed (NO in step S110 ), the first control unit 14 continues the processing necessary for the discharge of the resin material P. For example, the first control unit 14 moves the moving table 6 so that the resin material P is supplied into the recessed portion 71 without any gap.

On the other hand, when it is determined that the discharge of the resin material P is completed (Yes in step S110), the first control unit 14 transmits a signal (imaging instruction signal) instructing the imaging unit 300 to perform imaging to the second control unit 150. (step S120).

Referring to the right side of FIG. 9 , the second control unit 150 determines whether an imaging instruction signal from the first control unit 14 has been received (step S200 ). When it is determined that an imaging instruction signal has not been received (NO in step S200 ), the second control unit 150 waits until an imaging instruction signal is received.

On the other hand, when it is determined that the imaging instruction signal is received (Yes in step S200), the second control unit 150 controls the imaging unit 300 to image the resin material P in the concave portion 71 from above and generate image data (step S210). . The second control unit 150 controls the imaging unit 300 to store the image data generated by the imaging unit 300 in the HDD 200 (step S220). The second control unit 150 performs analysis processing of the image data (step S230).

Fig. 10 is a flowchart showing the procedure of the analysis process executed in step S230 of Fig. 9 . Referring to FIG. 10, the second control unit 150 reads the image data stored in the HDD 200 (step S300). The second control unit 150 performs gradation processing and binarization processing on the read image data (step S310).

In the grayscale processing, each pixel of the image data is classified into 256 levels [0 (dark)-255 (bright)]. For example, "255" is assigned to a white pixel, and "0" is assigned to a black pixel. In the binarization process, each pixel of the image data is classified as "white" or "black". For example, pixels whose values assigned by the grayscale processing are above the threshold X1 (for example, 200) are classified as "white", and pixels whose values assigned by the grayscale processing are less than the threshold X1 are classified as "black".

FIG. 11 is a diagram for explaining the area included in the image data representing the concave portion 71 . As shown in FIG. 11, the image data includes areas T1-T18.

Referring to FIG. 10 again, the second control unit 150 calculates the numerical data corresponding to each area T1-T18 included in the image data (step S320). In this embodiment, this numerical data is the number of pixels classified as "white" in each area. That is, in step S320, the number of pixels classified as "white" in each area T1-T18 is calculated. A larger number of pixels classified as "white" means that the surface of the concave portion 71 is widely exposed because the resin material P was not supplied without any omission.

The second control unit 150 compares the numerical data calculated in step S320 with the threshold X2 (for example, 10) to determine whether there is a problem in each area T1-T18 (step S330). The second control unit 150, for example, judges an area where the numerical data exceeds the threshold X2 as "NG" and an area where the numerical data is below the threshold X2 as "OK". That is, in step S330 , it is determined whether there is a shortage of resin material P in each region of the concave portion 71 corresponding to each region T1 - T18 (whether the number of "white" is greater than the threshold value X2 ). The second control unit 150 generates analysis data based on the comparison result in step S330 (step S340).

Fig. 12 is a diagram showing an example of analysis data. As shown in FIG. 12, the analysis data D1 includes the determination result of OK/NG in each area of the image data and the number of pixels classified as "white" in each area of the image data.

Referring to the right side of FIG. 9 again, after the screen analysis in step S230 is completed, the second control unit 150 transmits the analysis data D1 to the first control unit 14 (step S240 ).

Referring again to the left side of FIG. 9 , the first control unit 14 determines whether or not the analysis data D1 from the second control unit 150 has been received (step S130 ). If it is determined that the analysis data D1 has not been received (NO in step S130 ), the first control unit 14 waits until the analysis data D1 is received.

On the other hand, when it is determined that the analysis data D1 has been received (Yes in step S130), the first control unit 14 determines whether there is a problem with the state of the resin material P of the concave portion 71 based on the analysis data D1 (step S140). The first control unit 14, for example, when any of the regions T1-T18 is judged to be "NG", it is determined that the state of the resin material P of the recess 71 has a problem (NG); when any of the regions T1-T18 When none of them is judged as "NG", it is judged that there is no problem (OK) in the state of the resin material P of the concave portion 71 .

When the state of the resin material P of the concave portion 71 is judged to have no problem (OK in step S140), the first control unit 14 controls each component and shifts to a step of performing resin molding (step S150). That is, even when the next control of the resin material supply unit 8 is to be performed, the first control unit 14 maintains the operation state of the resin material supply unit 8 without particularly changing the operation state of the resin material supply unit 8 .

On the other hand, if the state of the resin material P of the concave portion 71 is judged to be problematic (NG in step S140), the first control unit 14 executes the process for the judged to be NG (step S160). That is, the first control unit 14 changes the control content when the resin material supply unit 8 is next controlled, memorizes the changed content, and stops the resin molding apparatus 100 . For example, when the next control of the resin material supply part 8 is to be performed, the first control part 14 controls the resin material supply part 8 so as to eliminate the resin material in the area (T1-T18) determined to be insufficient of the resin material P. The lack of P. More specifically, the first control unit 14 reduces the amount of the resin material P supplied to the region where the shortage of the resin material P does not occur, and increases the amount of the resin material P supplied to the region where the shortage of the resin material P occurs. quantity. Thereby, the resin material P is supplied to the recessed part 71 without a gap.

＜4. Features＞ According to the resin molding apparatus 100 related to this embodiment, the following effects can be obtained.

In the module C, the resin material P is irradiated with light from the lower side of the moving table 6 as described above, and the resin material P is imaged from above by the imaging unit 300 . Therefore, as shown in FIG. 13, for example, the light from the light guide plate 62 passes through the portion where the resin material P is not densely laminated to form a void (a thin portion that cannot be formed to a predetermined thickness), and can be captured by the imaging unit 300. this part. Fig. 14 is an example of a photographed image, and the white portion is a portion through which light passes (the thickness of the resin material P is approximately 1.0 mm). That is, it is considered that the resin material P is not densely laminated and voids are generated inside the white portion.

On the other hand, for example, when light is irradiated obliquely from above the mobile platform 6 and an image is taken by the imaging unit 300 , an image as shown in FIG. 15 is obtained. Both FIG. 14 and FIG. 15 are images of the same resin material P. As shown in FIG. In Fig. 15, it can be seen that the central part of the resin material (dotted line part) is densely laminated, but in Fig. 14, it can be seen that a white part is formed in this part and a gap is formed inside. For example, even in the thinly overlapped portion of the granular resin material P, when light is irradiated obliquely from above, the resin material P is seen to be densely laminated due to the shadow of the resin material P. Therefore, if imaging is performed by irradiation from above, even if the resin material P is not densely laminated, it may be misidentified as densely laminated. On the other hand, by illuminating light from below the moving table 6 as in the present embodiment, it is possible to accurately detect a portion where the resin material P is not densely stacked, and to prevent misidentification.

In addition, there is an advantage that when such light is irradiated from the lower side of the resin material P, not only inspection with a camera but also visual inspection becomes easy.

＜5. Variations＞ An embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the summary thereof. For example, the following changes can be made. In addition, the gist of the following modified examples can be appropriately combined.

(1) The configuration of the moving table 6 is not particularly limited, and as long as light can be irradiated from below the resin material P, various configurations are possible. For example, in the above-mentioned embodiment, the light guide plate 62 is used to irradiate light, but as long as a light-transmitting material is arranged on the moving table 6 and a light source (illumination unit) is arranged on the lower side, it is also possible to irradiate the resin material from below. P is irradiated with light. The type of light source at this time is not particularly limited, and for example, organic EL (Electro-Luminescence, electroluminescence), inorganic EL, etc. can be used other than LED. Also, the arrangement range of the light-transmitting material on the moving table 6 can be appropriately changed according to the size of the concave portion 71 of the frame-shaped member 72 or the imaging range.

Also, the wavelength of light from the light source may be changed according to the type of resin material used. That is, the type of resin material absorbs light correspondingly, so the wavelength of light can also be selected according to the type of resin material, so that the light can fully pass through the loose parts of the resin material.

(2) In the above-mentioned embodiment, the granular resin material P is used, but the present invention can also be applied to a liquid resin such as a paste. Even with such a resin material, light passes through parts that are not tightly laminated, so that part can be identified.

(3) The resin molded part of the present invention corresponds to the die set B shown in the above embodiment, but the structure of the die set B is an example and various forms can be made. That is, the configuration is not particularly limited as long as resin molding can be performed using the resin material supplied to the moving table 6 .

(4) In the above-described embodiment, imaging is performed by the imaging unit 300 after the discharge of the resin material P is completed. However, the timing at which imaging is performed by the imaging unit 300 is not limited to this. For example, it is also possible to dispose the imaging unit 300 near the discharge port of the resin material supply unit 8, and during the supply of the resin material P by the resin material supply unit 8, the imaging unit 300 may always perform imaging to obtain a moving image of the concave portion 71. . At this time, the second control unit 150 may also determine in real time whether the state of the resin material P in the concave portion 71 is problematic based on the video data being captured, and change the control content of the resin material supply unit 8 in real time.

(5) In the above-mentioned embodiment, the screen analysis is performed by grayscale processing and binarization processing. However, the technique used for screen analysis is not limited to this. For example, the area where the resin material P in the concave portion 71 is insufficient may be detected based on the result of the unevenness measurement of the 3D image of the concave portion 71, or may be detected using pattern matching, statistical methods, or AI (Artificial Intelligence). A region where the resin material P in the recess 71 is insufficient.

(6) In the above-mentioned embodiment, if the state of the resin material P of the concave portion 71 is judged to be problematic (NG in step S140 of FIG. 9 ), the first control unit 14 will reduce the supply until no occurrence The amount of the resin material P in the area where the resin material P is insufficient is increased, and the amount of the resin material P supplied to the area where the resin material P is insufficient is increased. However, the content of the control performed by the first control unit 14 from the next time is not limited to this. For example, the first control unit 14 may refer to the analysis data D1, and the smaller the number of pixels classified as "white", the smaller the amount of resin material P supplied is, and the amount of the resin material P to be supplied may be reduced for the region classified as "white". The amount of the resin material P to be supplied is greatly increased in a region where the number of pixels is larger.

(7) In the above embodiment, the control of the resin molding apparatus 100 is performed by the first control unit 14 and the second control unit 150 . However, the control performed by the first control unit 14 and the second control unit 150 can also be configured by a common control unit, and can also be realized by, for example, one computer, or can be realized by three or more computers. .

(8) In the above embodiment, the resin molding device 100 includes the HDD 200 . However, resin molding device 100 does not necessarily include HDD 200 . HDD200 can also exist on a cloud server. At this time, the second control unit 150 accesses the cloud server through a communication unit not shown.

1: Substrate supply part 2: Substrate storage part 3: Substrate loading part 4: Substrate transfer mechanism 5: Compression molding department 6: Mobile platform (workbench) 7: Resin Material Storage Department 8: Resin material supply department 9: Release film supply part 11: storage department 12: Transport path 13: Vibration Department 16: Metrology department 14: First Control Division 51: Lower mold 51C: chamber 52: upper mold 53: Mold fastening mechanism 61: Concave 62:Light guide plate 63: LED module (lighting department) 71: Concave 72: frame member 73: Release film 90: Resin material transfer mechanism 91: Roller 92: Roll out department 93: Cutting Department 100: Resin molding device 121: spit out 150:Second control department 200: HDD (hard disk drive) 300: Camera Department A: Substrate supply and storage module B: Resin molding module C: Resin material supply module P: resin material T1-T18,T30,T40: area W: Encapsulation completed substrate

Fig. 1 is a plan view schematically showing a resin molding apparatus. Fig. 2 is a plan view of the mobile station. Fig. 3 is a sectional view of the mobile station. Fig. 4 is a diagram illustrating the operation of the release film supply unit. Fig. 5 is a cross-sectional view illustrating a resin material container. Fig. 6 is a cross-sectional view schematically showing a resin material supply unit. Fig. 7 is a diagram for explaining an imaging state obtained by an imaging unit. Fig. 8 is a diagram showing an example of a concave portion in a state where a resin material is supplied. Fig. 9 is a flowchart showing a part of the operation program in the resin molding device. Fig. 10 is a flowchart showing the procedure of the analysis process executed in step S230 of Fig. 9 . Fig. 11 is a diagram for explaining the regions included in the image data representing the concave portion. Fig. 12 is a diagram showing an example of analysis data. Fig. 13 is a cross-sectional view illustrating light irradiation on a resin material. Fig. 14 is a photograph of a resin material obtained by imaging in a resin molding apparatus to which the present invention is applied. Fig. 15 is a photograph of a resin material obtained by imaging in a conventional resin molding apparatus.

Domestic deposit information (please note in order of depositor, date, and number) none

Overseas storage information (please note in order of storage country, organization, date, and number) none

1: Substrate supply part

2: Substrate storage part

3: Substrate loading part

4: Substrate transfer mechanism

5: Compression molding department

6: Mobile platform (workbench)

7: Resin Material Storage Department

8: Resin material supply department

14: First Control Division

51: Lower mold

52: upper mold

53: Mold fastening mechanism

53C: chamber

71: Concave

90: Resin material transfer mechanism

100: Resin molding device

150:Second control department

200: HDD (hard disk drive)

300: Camera Department

A: Substrate supply and storage module

B: Resin molding module

C: Resin material supply module

P: resin material

T: area

W: Encapsulation completed substrate

Claims (9)

A resin molding device comprising: a workbench, at least a portion of which is light-transmissive; The lighting part can be illuminated from the bottom of the aforementioned workbench; a resin material supply unit that supplies the resin material onto the aforementioned workbench; an imaging unit capable of imaging the resin material supplied on the stage from above; and, The resin molding part executes resin molding using the aforementioned resin material supplied to the aforementioned stage. The resin molding apparatus according to claim 1, wherein a light-transmitting light guide plate is provided on the moving table; The illuminating unit is configured to irradiate light from a side end surface of the light guide plate. The resin molding device according to claim 1, further comprising a release film supply unit for supplying the release film onto the moving table; This resin molding device is configured to supply the resin material onto the release film placed on the moving table. The resin molding device according to claim 2, further comprising a release film supply unit for supplying the release film onto the moving table; This resin molding device is configured to supply the resin material onto the release film placed on the moving table. The resin molding apparatus according to any one of claims 1 to 4, further comprising a control unit configured to analyze image data generated by imaging by the imaging unit, and control the resin material supply unit based on the analysis result. The resin molding device according to Claim 5, wherein the control unit is configured to analyze the image data by performing grayscale processing and binarization processing on the image data. A method of manufacturing a resin molded product, comprising: a step of supplying a resin material onto at least a part of the table having light transmission; A step of taking an image of the supplied resin material from above under illumination from below the workbench; and, The step of resin molding is carried out using the aforementioned resin material that has been supplied to the aforementioned stage. The method of manufacturing a resin molded article according to claim 7, further comprising: a step of arranging a release film on the moving table before the step of supplying the resin material; The aforementioned resin material is supplied onto the aforementioned release film. The method of manufacturing a resin molded article according to claim 7 or 8, further comprising: analyzing image data generated by the imaging, and controlling supply of the resin material based on the analysis result.

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