WO2022219851A1

WO2022219851A1 - Resin-molding device and method for producing resin molded article

Info

Publication number: WO2022219851A1
Application number: PCT/JP2021/048395
Authority: WO
Inventors: 慎竹内; 良太岡本; 侑扶石川
Original assignee: Ｔｏｗａ株式会社
Priority date: 2021-04-15
Filing date: 2021-12-24
Publication date: 2022-10-20
Also published as: KR20230128088A; CN116981554A; JP2022164095A; TW202241688A; JP7482824B2

Abstract

The resin-molding device according to the present invention is provided with a table that is at least partially translucent, an illumination unit capable of illuminating the table from below, a resin-material-supplying unit that supplies a resin material onto the table, an imaging unit capable of capturing an image of the resin material supplied onto the table, and a resin-molding unit that performs resin molding using the resin material supplied onto the table.

Description

RESIN MOLDING APPARATUS AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCTS

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

In recent years, it has been desired to reduce the thickness of semiconductor packages, and in resin supply, in-plane uniformity in the amount of resin supplied is required so that the thickness of the package can be uniform over a wide area. Therefore, for example, Patent Document 1 describes a technique of placing a release film on a table, supplying a liquid resin onto the release film, and imaging this with a camera (see FIG. 3, etc.). . Further, Patent Document 2 describes a technique of placing a release film on a moving table and then supplying granular resin onto the release film and observing it (paragraphs 0048 and 0049, FIG. 1st prize). In any of the techniques of the patent documents, the in-plane uniformity of the resin material is identified by observing the resin material laminated on the release film.

Japanese Patent No. 6218891 JP 2020-82534 A

By the way, although not explicitly stated in each of the above publications, in the conventional technology, the camera is arranged above the resin material, and the illumination is also arranged above. Therefore, the irradiation direction of illumination is inclined with respect to the imaging direction. As a result, shadows are formed on the resin material, causing brightness and darkness, which may lead to erroneous recognition of in-plane uniformity.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a resin molding apparatus and a method of manufacturing a resin molded product that can detect the occurrence of variations in thickness within a single resin molded product. and

A resin molding apparatus according to the present invention comprises a table at least partially translucent, an illumination section capable of illuminating from below the table, a resin material supply section for supplying a resin material onto the table, and the table. An imaging unit capable of imaging the resin material supplied above from above, and a resin molding unit performing resin molding using the resin material supplied onto the table are provided.

A method for manufacturing a resin molded product according to the present invention comprises the steps of: supplying a resin material onto a table at least partially translucent; and performing resin molding using the resin material supplied on the table.

According to the present invention, it is possible to detect the occurrence of variations in thickness within one resin molded product.

It is a top view which shows a resin molding apparatus typically. It is a top view of a moving table. It is a sectional view of a moving table. It is a figure explaining operation|movement of a release film supply part. It is a sectional view explaining a resin material accommodation part. FIG. 4 is a cross-sectional view schematically showing a resin material supply section; FIG. 4 is a diagram for explaining an imaging state by an imaging unit; FIG. 10 is a diagram showing an example of recesses in a state in which a resin material is supplied; It is a flowchart which shows the one part operation|movement procedure in a resin molding apparatus. FIG. 10 is a flowchart showing the procedure of analysis processing executed in step S230 of FIG. 9; FIG. It is a figure for demonstrating the area|region contained in the image data which show a recessed part. It is a figure which shows an example of analysis data. FIG. 4 is a cross-sectional view for explaining irradiation of light onto a resin material; It is the photograph of the resin material imaged with the resin molding apparatus to which this invention is applied. It is the photograph of the resin material imaged by the conventional resin molding apparatus.

　Hereinafter, one embodiment of the resin molding apparatus according to the present invention will be described in detail with reference to the drawings. In addition, each drawing may be schematically drawn by appropriately omitting or exaggerating objects for easy understanding.

<1. Configuration of Resin Molding Apparatus>
FIG. 1 is a schematic plan view of a resin molding apparatus 100 according to this embodiment. The resin molding apparatus 100 is configured to perform resin sealing on a substrate W to which electronic elements such as a semiconductor chip, a resistor element, and a capacitor element are connected, thereby manufacturing a resin molded product. In this resin molding apparatus 100, the component mounting surface of the substrate W on which electronic components are mounted is resin-sealed.

Examples of the substrate W used here include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, ceramic substrates, and the like. The substrate W may be a carrier used for FOWLP (Fan Out Wafer Level Packaging) and FOPLP (Fan Out Panel Level Packaging). Wiring may already be provided on the substrate W, or wiring may not be provided.

As shown in FIG. 1, the resin molding apparatus 100 includes a substrate supply/storage module A (hereinafter also simply referred to as "module A") and two resin molding modules B (hereinafter also simply referred to as "module B"). ), a resin material supply module C (hereinafter also simply referred to as “module C”), and a first controller 14 . For example, a PLC (Programmable Logic Controller), a PC (Personal Computer), or the like can be used as the first control unit. The first control unit 14 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), etc., and is configured to control each of modules A to C according to information processing. ing. Each module A to C will be described in detail below. Each of the modules is detachable and replaceable with other modules. Moreover, in the resin molding apparatus 100, each of the modules A to C can be increased or decreased.

<1-1. Module A>
Module A is a module for supplying pre-sealed substrates W and storing sealed substrates W, and includes a substrate supply section 1, a substrate storage section 2, a substrate placement section 3, and a substrate transfer mechanism 4. ,have. The substrate supply section 1 is configured to supply the pre-sealing substrate W onto the substrate mounting section 3 . The substrate storage part 2 is configured to store a sealed substrate W (resin molded product). The substrate mounting part 3 is configured to move in the arrow Y direction between a position corresponding to the substrate supply part 1 and a position corresponding to the substrate storage part 2 . The substrate transport mechanism 4 is configured to move in the directions of the arrows X and Y across the module A and the module B. is held and transported to module B. Alternatively, the sealed substrate W manufactured in the module B is placed on the substrate placement part 3 of the module A. As shown in FIG.

<1-2. Module B>
Each module B is a module for molding a resin material, and has a compression molding section 5 for manufacturing a sealed substrate W (resin molded product) by compression molding. In this compression molding, for example, a black granular resin material P is used. The compression molding unit 5 has an upper mold 52 , a lower mold 51 facing the upper mold 52 , and a mold clamping mechanism 53 . The upper mold 52 is configured to hold the substrate W on its lower surface. On the other hand, the lower mold 51 has a bottom member and side members for forming a concave cavity 51C. That is, the bottom member constitutes the bottom surface of the cavity 51C, and the side member constitutes the side surface of the cavity 51C. A resin material P prepared in the module C is placed in the cavity 51C, as will be described later. The mold clamping mechanism 53 is configured to clamp the upper mold 52 and the lower mold 51 on which the resin material P is arranged.

<1-3. Module C>
Module C is a module for supplying a resin material. As shown in FIG. 1, the module C includes a moving table 6, a resin material container 7, a resin material supply unit 8, a release film supply unit 9, an imaging unit 300, a resin material transport mechanism 90, have. Furthermore, this module C is provided with an HDD (Hard Disc Drive) 200 and a second controller 150 . This second controller 150 corresponds to the controller of the present invention. Each configuration will be described in detail below.

<1-3-1. Moving table>
2 is a plan view of the moving table, and FIG. 3 is a sectional view of FIG. As shown in FIG. 1, the moving table 6 is configured to move in the direction of the arrow X and the direction of the arrow Y in the module C. As shown in FIG. As shown in FIGS. 2 and 3, a concave portion 61 is formed in the upper surface of the moving table 6, and a light guide plate 62 is arranged in this concave portion 61. As shown in FIGS. Further, an LED module 63 as an illumination unit is arranged on the side end face of the light guide plate 62 . , the upper surface of the light guide plate 62 emits light. As the light guide plate 62, a known plate made of acrylic resin or the like can be appropriately used, and a reflective film or a diffusion film can be provided as necessary.

A suction port (not shown) is formed around the light guide plate 62 on the upper surface of the moving table 6, and is configured to hold a release film 73 described below by suction.

<1-3-2. Release film supply unit>
FIG. 4 is a side view for explaining the operation of the release film supplying section. As shown in FIG. 4( a ), a release film supply unit 9 for placing a release film 73 on the upper surface of the moving table 6 is provided at one end of the moving table 6 . The release film supply unit 9 includes a roll 91 on which the release film 73 is wound, a delivery unit 92 that feeds the release film 73 from the roll 91 and arranges it on the moving table 6, and the release film 73. and a cutting portion 93 for cutting.

As shown in FIG. 4( b ), the feeding unit 92 is configured to hold the end of the release film 73 wound on the roll 91 and feed the release film 73 by separating from the roll 91 . ing. At this time, the extractor 92 moves above the moving table 6 from one end to the other end. Thereby, the release film 73 is placed on the moving table 6 . The release film 73 on the moving table 6 is sucked by the above suction port and held on the moving table 6 . In addition, as shown in FIG. 4C, the release film 73 is cut by a cutting section 93 at the end on the roll 91 side. As a result, the sheet-shaped release film 73 is arranged on the moving table 6 .

<1-3-3. Resin Material Storage Unit>
Next, the resin material containing portion 7 will be described. As shown in FIG. 5A, the resin material container 7 has a frame member 72 and a moving mechanism (not shown) for moving the member. The frame-shaped member 72 is formed in a rectangular shape and placed on the moving table 6 on which the release film 73 is placed by the moving mechanism. As a result, recesses 71 into which the resin material is supplied are formed. That is, the release film 73 constitutes the bottom surface of the recess 71 , and the frame member 72 constitutes the side surface of the recess 71 . The recess 71 has a space corresponding to the size of the cavity 51C of the lower mold 51 of the module B. As shown in FIG.

<1-3-4. Resin Material Supply Unit>
Next, the resin material supply section 8 will be described. FIG. 6 is a cross-sectional view schematically showing a resin material supply section. The resin material supply unit 8 is configured to supply a preset weight of the resin material P to the concave portion 71 of the frame-shaped member 72. a portion 16; The storage unit 11 temporarily stores the granular resin material P and supplies the resin material P to the transport path 12 . The resin material supplied to the conveying path 12 is discharged from the ejection port 121 at the end and supplied to the concave portion 71 of the frame-shaped member 72 . At this time, the transport path 12 is vibrated by the vibrating portion 13, thereby transporting the resin material P to the ejection port side.

The weighing unit 16 is configured to measure the weight of the resin material P in the resin material supply unit 8. The first control unit 14 controls the vibrating unit 13 based on the weighing result of the weighing unit 16 so that the amount of the resin material P supplied to the resin material storage unit 7 becomes a target value.

The resin material P dropped from the discharge port 121 of the resin material supply unit 8 is evenly spread over the concave portion 71 by the relative movement of the moving table 6 with respect to the discharge port of the resin material supply unit 8 .

<1-3-5. Imaging unit>
FIG. 7 is a diagram for explaining an imaging state by the imaging unit. As shown in FIG. 7, the imaging unit 300 is configured to capture an image of the resin material P supplied to the concave portion 71 of the frame member 72 from above and generate image data. The image pickup unit 300 picks up an image of the resin material P in the recess 71 with the moving table 6 positioned below the image pickup unit 300, for example. The imaging unit 300 is configured by a camera module including an image sensor such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. At the time of this photographing, the resin material P is irradiated with light from below through the release film 73 by the light guide plate 62 described above.

The HDD 200 described above is configured to store image data generated by the imaging section 300 . Note that the HDD 200 may be replaced with another storage medium such as a solid state drive.

The second control unit 150 includes a CPU, RAM, ROM, etc., and is configured to control the imaging unit 300 and the like according to information processing. Various controls by the first control unit 14 and the second control unit 150 will be described later in detail.

<1-3-6. Resin Material Conveying Mechanism>
As shown in FIG. 1, the resin material transport mechanism 90 is configured to move in the arrow X direction and the arrow Y direction in the modules C and B. As shown in FIG. As shown in FIG. 5B, the resin material transport mechanism 90 separates the frame member 72 containing the resin material P and the release film 73 from the moving table 6 . Then, it is configured to convey this to the lower mold 51 of the module B and supply the resin material P to the cavity 51C of the lower mold 51 .

<2. Suppression of Variation in Thickness of Resin Molded Products>
Next, a method for suppressing the thickness of the resin molded product in the module C configured as described above will be described.

In recent years, semiconductor packages (an example of resin molded products) have become thinner, and products with a thickness of 0.38 mm or 0.43 mm, for example, are in demand in the market. On the other hand, depending on the quality of the molding process, variations in thickness may occur within one resin molded product. In a resin molded article having a small thickness, a slight variation in thickness has a large effect on the quality of the resin molded article. The variation in thickness within a single resin molded product is not the variation in thickness when comparing the thickness of a plurality of resin molded products, but the variation in thickness within the surface of a single resin molded product. It refers to variations in thickness at multiple locations within a molded product.

For example, when the resin material P is not evenly supplied to the concave portion 71 of the frame-shaped member 72, such a problem becomes conspicuous. That is, if resin molding is performed in a state where the resin material P is insufficient in some regions of the recess 71, the thickness of the completed resin molded product varies from region to region.

FIG. 8 is a diagram showing an example of the recess 71 in a state in which the resin material P is supplied. As shown in FIG. 8, the recess 71 includes a region T30 and a region T40. Although the resin material P is sufficiently supplied in the region T30, the resin material P is insufficient in the region T40. In the region where the resin material P is insufficient, the bottom surface of the recess 71 is exposed. The color of the bottom surface of the recess 71 is closer to white than the resin material P. As shown in FIG.

In this resin molding apparatus 100, the imaging section 300 images the resin material P supplied to the frame-shaped member 72 before performing resin molding. The second control section 150 analyzes the image data generated by the imaging section 300 and controls the resin material supply section 8 based on the analysis results. In the resin molding apparatus 100, the resin material supply section 8 is controlled based on the analysis result of the supply state of the resin material P in the recess 71, so the supply state of the resin material P in the recess 71 is improved. As a result, according to the resin molding apparatus 100, it is possible to prevent a situation in which resin molded products having variations in thickness within one resin molded product are manufactured. The operation of the resin molding apparatus 100 will be described in detail below.

<3. Example of operation of resin molding apparatus>
FIG. 9 is a flow chart showing part of the operation procedure in the resin molding apparatus 100. As shown in FIG. The processing shown in this flow chart is executed in a state where the concave portion 71 of the frame-shaped member 72 is positioned below the discharge port 121 of the resin material supply section 8 . The processing shown in the left flowchart is executed by the first control unit 14 and the processing shown in the right flowchart is executed by the second control unit 150 .

Referring to the left side of FIG. 9, the first control unit 14 controls the resin material supply unit 8 to discharge the resin material P toward the recess 71 (step S100). The first control unit 14 determines whether or not the ejection of the resin material P is completed (step S110). When it is determined that the ejection of the resin material P has not been completed (NO in step S110), the first control unit 14 continues to perform necessary processes while the resin material P is being ejected. For example, the first controller 14 moves the moving table 6 so that the resin material P is evenly supplied to the concave portion 71 .

On the other hand, when it is determined that the ejection of the resin material P has been completed (YES in step S110), the first control unit 14 sends a signal (imaging instruction signal) instructing imaging by the imaging unit 300 to the second control unit 150. Send (S120).

With reference to the right side of FIG. 9, the second control unit 150 determines whether or not an imaging instruction signal has been received from the first control unit 14 (step S200). If it is determined that the imaging instruction signal has not been received (NO in step S200), second control unit 150 waits until the imaging instruction signal is received.

On the other hand, when it is determined that the imaging instruction signal has been received (YES in step S200), second control unit 150 causes imaging unit 300 to image resin material P in concave portion 71 from above and generate image data. is controlled (step S210). The second control unit 150 controls the imaging unit 300 to store the image data generated by the imaging unit 300 in the HDD 200 (step S220). The second control unit 150 executes image data analysis processing (step S230).

FIG. 10 is a flowchart showing the procedure of analysis processing executed in step S230 of FIG. Referring to FIG. 10, second control unit 150 reads image data stored in HDD 200 (step S300). The second control unit 150 applies gradation processing and binarization processing to the read image data (step S310).

In gradation processing, each pixel of image data is classified into 256 levels [0 (dark)-255 (bright)]. For example, white pixels are assigned "255" and black pixels are assigned "0". In the binarization process, each pixel of image data is classified as "white" or "black". For example, pixels whose values assigned by the gradation process are equal to or greater than the threshold X1 (eg, 200) are classified as "white", and pixels whose values assigned by the gradation process are less than the threshold X1 are classified as "black". be.

FIG. 11 is a diagram for explaining the area included in the image data showing the recess 71. FIG. As shown in FIG. 11, the image data includes regions T1-T18.

　Referring to FIG. 10 again, the second control unit 150 calculates numerical data corresponding to each of the regions T1 to T18 included in the image data (step S320). In this embodiment, this numerical data is the number of pixels classified as "white" in each region. That is, in step S320, the number of pixels classified as "white" in each of regions T1-T18 is calculated. A large number of pixels classified as “white” means that the resin material P is not evenly supplied and that the surface of the concave portion 71 is exposed over a large area.

The second control unit 150 compares each numerical data calculated in step S320 with a threshold value X2 (eg, 10), and determines whether or not a problem occurs in each of the regions T1 to T18 (step S330 ). For example, the second control unit 150 determines that an area in which the numerical data exceeds the threshold value X2 is "defective (NG)", and an area in which the numerical data is equal to or less than the threshold value X2 is determined to be "good (OK)". judge. That is, in step S320, it is determined whether or not there is a shortage of the resin material P in each region of the concave portion 71 corresponding to each of the regions T1 to T18 (whether or not the number of "white" pixels is greater than the threshold value X2). or) is determined. The second control unit 150 generates analysis data based on the comparison result in step S330 (step S340).

FIG. 12 is a diagram showing an example of analysis data. As shown in FIG. 12, the analysis data D1 includes the OK/NG judgment result in each area of the image data and the number of pixels classified as "white" in each area of the image data.

　Referring to the right side of FIG. 9 again, when the image analysis is completed in step S230, the second control unit 150 transmits the analysis data D1 to the first control unit 14 (step S240).

　Referring to the left side of FIG. 9 again, the first control unit 14 determines whether or not the analysis data D1 has been received from the second control unit 150 (step S130). If it is determined that analysis data D1 has not been received (NO in step S130), first control unit 14 waits until analysis data D1 is received.

On the other hand, when it is determined that the analysis data D1 has been received (YES in step S130), the first control unit 14 determines whether or not there is any problem with the state of the resin material P in the recess 71 based on the analysis data D1. (step S140). For example, the first control unit 14 determines that there is a problem with the state of the resin material P of the recess 71 (NG) when any of the regions T1-T18 is determined to be "NG", and the region T1-T18 is determined to be "NG", it is determined that there is no problem with the state of the resin material P in the concave portion 71 (OK).

When it is determined that there is no problem with the state of the resin material P in the concave portion 71 (OK in step S140), the first control unit 14 controls each configuration so as to proceed to the step of resin molding (step S150). . That is, the first control unit 14 maintains the operation state of the resin material supply unit 8 without changing the operation state of the resin material supply unit 8 even when the resin material supply unit 8 is controlled next time.

On the other hand, if it is determined that there is a problem with the state of the resin material P in the concave portion 71 (NG in step S140), the first control unit 14 executes the processing when it is determined to be NG (step S160). That is, the first control unit 14 changes the contents of control when the resin material supply unit 8 is controlled next time, stores the changed contents, and stops the resin molding apparatus 100 . For example, when the resin material supply unit 8 is controlled next time, the first control unit 14 eliminates the shortage of the resin material P in the region (T1-T18) determined to have the shortage of the resin material P. The resin material supply unit 8 is controlled as follows. More specifically, the first control unit 14 reduces the amount of the resin material P to be supplied to the region where the shortage of the resin material P has not occurred, and supplies the region where the shortage of the resin material P has occurred. The amount of resin material P is increased. As a result, the resin material P is evenly supplied to the concave portion 71 .

<4. Features>
According to the resin molding apparatus 100 according to this embodiment, the following effects can be obtained.

In the module C, light is applied to the resin material P from below the moving table 6 as described above, and the image is captured by the imaging unit 300 from above. For this reason, for example, as shown in FIG. 13 , light from the light guide plate 62 is transmitted at locations where the resin material P is not densely laminated and voids are generated (thin locations where a predetermined thickness cannot be formed). This can be imaged by the imaging unit 300 . FIG. 14 is an example of the imaged image, and white portions are portions through which light is transmitted (the thickness of the resin material P is approximately 1.0 mm). That is, it is considered that the resin material P is not densely laminated in this white portion and that voids are formed inside.

On the other hand, for example, when light is obliquely emitted from above the moving table 6 and an image is captured by the imaging unit 300, an image as shown in FIG. 15 is obtained. 14 and 15 are images of the same resin material P. FIG. In FIG. 15, the central portion (dotted line) of the resin material appears to be densely laminated, but in FIG. 14, a white portion is generated at this portion, and it can be seen that a gap is formed inside. . For example, even in a portion where the granular resin material P is thinly overlapped, the shadow of the resin material P makes it appear as if the resin material P is densely laminated when light is irradiated obliquely from above. Therefore, if an image is captured with illumination from above, even if the resin material P is not densely laminated, this may be erroneously recognized and may be recognized as being densely laminated. On the other hand, if light is irradiated from below the moving table 6 as in the present embodiment, it is possible to accurately detect a portion where the resin material P is not densely laminated, thereby preventing erroneous recognition. can.

It should be noted that irradiating light from the lower side of the resin material P in this way has the advantage that it is easy to see even with the naked eye, regardless of inspection with a camera.

<5. Variation>
Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the invention. For example, the following changes are possible. Also, the gist of the following modified examples can be combined as appropriate.

(1) The configuration of the moving table 6 is not particularly limited, and various modes are possible as long as the resin material P can be irradiated with light from below. For example, in the above-described embodiment, the light guide plate 62 is used to irradiate light. The resin material P can be irradiated with light from below. In this case, the type of light source is not particularly limited, and for example, organic EL, inorganic EL, etc. can be used in addition to LED. Further, the arrangement range of the light-transmitting material on the moving table 6 can be appropriately changed according to the size of the concave portion 71 of the frame-shaped member 72 or the imaging range.

Also, the wavelength of the light from the light source may be changed according to the type of resin material used. That is, since light may be absorbed depending on the type of resin material, the wavelength of light can be selected according to the type of resin material so that the light can sufficiently pass through areas where the resin material is not dense. .

(2) In the above embodiment, the granular resin material P is used, but the present invention can also be applied to liquid resin such as paste. Even with such a resin material, light can pass through areas where the layers are not densely laminated, so these areas can be identified.

(3) The resin molded portion of the present invention corresponds to the module B shown in the above embodiment, but the configuration of the module B is an example, and various modes are possible. That is, the configuration is not particularly limited as long as resin molding is performed using the resin material supplied on the moving table 6 .

(4) In the above embodiment, the imaging unit 300 performs imaging after the ejection of the resin material P is completed. However, the imaging timing by the imaging unit 300 is not limited to this. For example, the imaging unit 300 may be arranged near the ejection port of the resin material supply unit 8 and constantly capture a moving image of the concave portion 71 while the resin material P is being supplied by the resin material supply unit 8 . In this case, the second control unit 150 determines in real time whether or not there is a problem with the state of the resin material P in the concave portion 71 based on the moving image data being captured, and determines the control contents of the resin material supply unit 8. can be changed in real time.

(5) In the above embodiments, image analysis was performed through gradation processing and binarization processing. However, the technique used for image analysis is not limited to this. For example, based on the results of unevenness measurement based on a 3D image of the recess 71, a region in which the resin material P is insufficient in the recess 71 may be detected, pattern matching, a statistical method, AI (Artificial Intelligence), or the like. may be used to detect a region in which the resin material P is insufficient in the concave portion 71 .

(6) In the above embodiment, when it is determined that there is a problem with the state of the resin material P in the concave portion 71 (NG in step S140 of FIG. 9), the first control unit 14 controls the shortage of the resin material P from the next time. The amount of the resin material P to be supplied to the area where the shortage of the resin material P has occurred is decreased, and the amount of the resin material P to be supplied to the area where the shortage of the resin material P has occurred is increased. However, the content of control by the first control unit 14 from the next time is not limited to this. For example, the first control unit 14 refers to the analysis data D1 to increase the amount of the resin material P to be supplied to an area with fewer pixels classified as "white", The amount of resin material P supplied to a region with more pixels may be increased.

(7) In the above embodiment, the resin molding apparatus 100 is controlled by the first controller 14 and the second controller 150 . However, the control performed by the first control unit 14 and the second control unit 150 may be configured by a common control unit, or may be realized by, for example, one computer, or by three or more controllers. It may be implemented by a computer.

(8) In the above embodiment, the resin molding apparatus 100 includes the HDD 200 . However, resin molding apparatus 100 does not necessarily need to include HDD 200 . The HDD 200 may exist on a cloud server, for example. In this case, the second control unit 150 accesses the cloud server via a communication unit (not shown).

6 Moving table: (table)
63: LED module (illumination part)
73: release film 9: release film supply unit 100: resin molding device 150: second control unit (control unit)
300: imaging unit

Claims

a table at least partially translucent;
a lighting unit capable of lighting from below the table;
a resin material supply unit that supplies a resin material onto the table;
an imaging unit capable of imaging the resin material supplied onto the table from above;
a resin molding unit that performs resin molding using the resin material supplied on the table;
A resin molding device.
The table is provided with a light guide plate having translucency,
2. The resin molding apparatus according to claim 1, wherein said illumination unit is configured to irradiate light from a side end face of said light guide plate.
Further comprising a release film supply unit for supplying a release film onto the table,
3. The resin molding apparatus according to claim 1, wherein said resin material is supplied onto said release film arranged on said table.
4. The resin material supply unit according to any one of claims 1 to 3, further comprising a control unit configured to analyze image data generated by imaging by said imaging unit and control said resin material supply unit based on the analysis result. Resin molding apparatus as described.
5. The resin molding apparatus according to claim 4, wherein the control unit is configured to analyze the image data by applying gradation processing and binarization processing to the image data.
supplying a resin material onto a table at least partially translucent;
a step of capturing an image of the supplied resin material from above while the table is illuminated from below;
a step of performing resin molding using the resin material supplied on the table;
A method for manufacturing a resin molded product.
Prior to the step of supplying the resin material, further comprising the step of placing a release film on the table,
7. The method of manufacturing a resin molded product according to claim 6, wherein the resin material is supplied onto the release film.
The method of manufacturing a resin molded product according to claim 5 or 6, further comprising the step of analyzing image data generated by said imaging, and controlling supply of said resin material based on the analysis result.