TW202239613A - 偏光板 - Google Patents

偏光板 Download PDF

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TW202239613A
TW202239613A TW111103513A TW111103513A TW202239613A TW 202239613 A TW202239613 A TW 202239613A TW 111103513 A TW111103513 A TW 111103513A TW 111103513 A TW111103513 A TW 111103513A TW 202239613 A TW202239613 A TW 202239613A
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polarizing film
aforementioned
film
polarizing plate
polarizing
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後藤圭亮
野間一範
森本浩之
矢野隆久
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日商大倉工業股份有限公司
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3033—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
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    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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    • B29C66/74—Joining plastics material to non-plastics material
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Abstract

本發明的課題在於提供一種抑制偏光薄膜之熱收縮所致之外觀不良，且耐久性優異之新穎偏光板。 本發明的解決手段為一種偏光板，其特徵係具備：由聚乙烯醇系樹脂所成之偏光薄膜；與於前述偏光薄膜之至少一面，介隔接合層而積層之具有透光性之支持基材，前述接合層係由將前述偏光薄膜與前述支持基材以化學鍵結連結之分子接合劑所成。

Description

偏光板
本發明係關於偏光板，更詳細而言係關於介隔分子接合劑來積層由聚乙烯醇系樹脂所成之偏光薄膜與具有透光性之支持基材所成之偏光板。
以往，作為使於特定方向偏光或偏波之光通過的光學構件，已知在玻璃、水晶等之透光性的支持基材上介隔黏著劑而積層有由聚乙烯醇系樹脂所成之偏光薄膜(PVA偏光薄膜)之構成的偏光板。 [先前技術文獻] [專利文獻]
[專利文獻1]WO13/154139
[發明欲解決之課題]
使用於偏光板之PVA偏光薄膜係，於經單軸延伸之聚乙烯醇系樹脂薄膜上吸附配向碘或二色性染料而成者，然而，PVA偏光薄膜由於其特性上，吸收平行於吸收軸之光，故存在因吸收之光能量所致之PVA偏光薄膜的溫度上升，在延伸方向產生收縮應力而熱收縮之課題。當PVA偏光薄膜熱收縮時，於PVA偏光薄膜產生凹凸或皺紋等外觀上之變形(或外觀不良)。在液晶顯示器等影像顯示裝置中，產生外觀不良之PVA偏光薄膜會引起影像不良或對比度降低。
另一方面，影像顯示裝置等中要求高亮度、高精細，近年來，使用光束、光度、亮度、光密度等數值大或高的光源。使用此種光源的情況下，由於PVA偏光薄膜所吸收之光能量增大，因此PVA偏光薄膜之熱收縮所致之外觀不良變得更顯著。
本發明係鑑於如此問題而完成者，其課題在於提供一種抑制PVA偏光薄膜之熱收縮所致之外觀不良，且耐久性優異之新穎偏光板。 [用以解決課題之手段]
本發明人等致力研討為了抑制偏光板中之偏光薄膜之熱收縮所致之外觀不良，結果發現藉由使用以化學鍵結將PVA偏光薄膜與支持基材接合之分子接合技術，可使PVA偏光薄膜與支持基材更牢固地密著，同時可效率良好地將於PVA偏光薄膜產生之熱散熱至支持基材，減輕PVA偏光薄膜的熱負荷，從而達至完成本發明。
根據本發明，能夠提供一種偏光板，其特徵係具備：由聚乙烯醇系樹脂所成之偏光薄膜；與於前述偏光薄膜之至少一面，介隔接合層而積層之具有透光性之支持基材，前述接合層係由將前述偏光薄膜與前述支持基材以化學鍵結連結之分子接合劑所成。
又，根據本發明，能夠提供一種偏光板之製造方法，其特徵係具有：於由聚乙烯醇系樹脂所成之偏光薄膜及/或具有透光性之支持基材的表面設置分子接合劑的步驟；介隔存在於前述偏光薄膜及/或前述支持基材之表面的分子接合劑而將該等積層的步驟；與熱壓接前述偏光薄膜與前述支持基材，藉由化學鍵結接合前述偏光薄膜與前述支持基材的步驟。 [發明之效果]
本發明之偏光板係藉由化學鍵結接合PVA偏光薄膜與支持基材，因此可減輕PVA偏光薄膜之熱負荷，並可抑制PVA偏光薄膜之熱收縮所致之外觀不良。又，本發明之偏光板係藉由化學鍵結接合PVA偏光薄膜與支持基材，因此可使支持基材與偏光薄膜牢固地密著而抑制PVA偏光薄膜熱收縮，並可抑制PVA偏光薄膜之熱收縮所致之外觀不良。
以下詳細地說明本發明。此外，本發明並不限定於以下形態，在獲得本發明之效果的範圍內可設為各種形態。
[偏光板] 於圖1表示本發明之偏光板之一例。圖1所示之偏光板1具備：由聚乙烯醇系樹脂所成之偏光薄膜2；於偏光薄膜2之至少一面，介隔接合層3而積層之支持基材4。更詳言之，係介隔由使用以化學鍵結將偏光薄膜2與支持基材4接合之分子接合技術的分子接合劑所成之接合層3而積層。分子接合技術係以一層至數層分子將構件間藉由化學鍵結接合之技術。藉由分子接合技術所接合之偏光板，相較於以往藉由分子間力之接著，熱傳導率為高，可減輕偏光薄膜之熱負荷，因此可抑制偏光薄膜之熱收縮所致之外觀不良。又，藉由分子接合技術所接合之偏光板係藉由化學鍵結而直接接合，因此相較於以往藉由分子間力之接著，密著力為高，且由於可使偏光薄膜與支持基材牢固地密著，故可抑制偏光薄膜之熱收縮，並抑制外觀不良。因此，藉由分子接合技術所接合之偏光板具有可長期地維持偏光薄膜所具有之性能的高耐久性。此外，雖並未圖示，但在偏光薄膜之另一面，亦可介隔由分子接合劑所成之接合層而具備其他支持基材。
[偏光薄膜] 偏光薄膜係在波長380~780nm之任一的波長下具有吸收二色性者，並由聚乙烯醇系樹脂薄膜所成。作為在波長380~780nm之任一的波長下具有吸收二色性之偏光薄膜，可列舉吸附配向有碘及/或二色性染料之聚乙烯醇系樹脂薄膜(H型偏光薄膜)或將聚乙烯醇樹脂進行脫水而在聚合物中形成光吸收伸乙烯嵌段區段之聚乙烯醇系樹脂薄膜(K型偏光薄膜)等。
由吸附配向有碘及/或二色性染料之聚乙烯醇系樹脂所成之H型偏光薄膜，例如，可由以下方法來製造，該方法包含：將聚乙烯醇系樹脂薄膜單軸延伸的步驟；用碘及/或二色系染料染色並吸附聚乙烯醇系樹脂薄膜的步驟；將吸附有碘及/或二色性染料之聚乙烯醇系樹脂薄膜以硼酸水溶液等之交聯液進行交聯處理的步驟；以及將聚乙烯醇系樹脂薄膜進行水洗處理的步驟。
作為聚乙烯醇系樹脂，可使用聚乙酸乙烯酯系樹脂經皂化者。聚乙酸乙烯酯系樹脂，除了作為乙酸乙烯酯之均聚物的聚乙酸乙烯酯以外，還可列舉乙酸乙烯酯與可共聚合之其他單體的共聚物等。作為可與乙酸乙烯酯共聚合之其他單體，例如可列舉不飽和羧酸類、烯烴類、乙烯基醚類、不飽和磺酸類及具有銨基之(甲基)丙烯醯胺類等。
聚乙烯醇系樹脂之皂化度通常為85~100mol%，較佳為98mol%以上。聚乙烯醇系樹脂可經改質，例如，亦可使用經醛類改質之聚乙烯醇縮甲醛或聚乙烯縮醛等。聚乙烯醇系樹脂的平均聚合度通常為1000~10000，較佳為1500~5000。聚乙烯醇系樹脂的平均聚合度可依據JIS K 6726而求出。
將此種聚乙烯醇系樹脂製膜而成者，可使用作為偏光薄膜的原材薄膜。將聚乙烯醇系樹脂製膜之方法並未特別限定，可採用公知的方法。聚乙烯醇系原材薄膜的厚度並未特別限制，較佳例如使用10~200μm者。
聚乙烯醇系樹脂薄膜的單軸延伸可於使用碘及/或二色性染料之染色之前，與染色同時，或染色之後進行。於染色之後進行單軸延伸的情況下，該單軸延伸可於交聯處理之前或交聯處理中進行。又，亦可在該等複數階段進行單軸延伸。單軸延伸時，可在周速不同之輥間於單軸進行延伸，亦可使用熱輥於單軸進行延伸。並且，單軸延伸可為在大氣中進行延伸之乾式延伸，也可為使用溶劑或水使聚乙烯醇系樹脂薄膜膨潤的狀態下進行延伸之濕式延伸。延伸倍率通常為3~8倍。
作為使用碘及/或二色性染料將聚乙烯醇系樹脂薄膜染色的方法，例如可採用將該薄膜浸漬於包含碘及/或二色性染料之水溶液的方法。此外，聚乙烯醇系樹脂薄膜較佳在染色處理之前經施加對水的浸漬處理。
作為染色後的交聯處理，例如可列舉將經染色之聚乙烯醇系樹脂薄膜浸漬於含硼酸之水溶液的方法。交聯處理能以1次進行，亦可分成複數次來進行。
作為交聯後的水洗處理，例如藉由以下來進行：將染色後經交聯之聚乙烯醇系樹脂薄膜浸漬於水中；噴霧水作為噴淋；或併用浸漬與噴霧。此外，水洗處理後，可藉由公知的方法乾燥聚乙烯醇系樹脂薄膜。
由將聚乙烯醇樹脂進行脫水而在聚合物中形成光吸收伸乙烯嵌段區段之聚乙烯醇系樹脂所成之K型偏光薄膜，例如，可由以下方法來製造，該方法包含：將聚乙烯醇系樹脂薄膜單軸延伸的步驟；將聚乙烯醇系樹脂薄膜進行脫水處理的步驟；將經脫水處理之聚乙烯醇系樹脂薄膜以硼酸水溶液等之交聯液進行交聯處理的步驟；以及將聚乙烯醇系樹脂薄膜進行水洗處理的步驟。此外，作為原材薄膜係如同上述。
聚乙烯醇系樹脂薄膜的單軸延伸係可於各種階段來進行。單軸延伸係可於例如脫水處理之前，與脫水處理同時，與脫水處理後之硼酸交聯同時或其前後來進行。又，亦可在該等複數階段進行單軸延伸。關於單軸延伸之方法係如同上述。
作為將聚乙烯醇系樹脂薄膜進行脫水的方法，例如藉由以下來進行：將聚乙烯醇系樹脂薄膜暴露於pH為3以上之酸，接著，加熱經暴露之薄膜。具體來說，可將聚乙烯醇系樹脂薄膜在去離子水中浸漬約1秒至約5分鐘，接著，在pH為3以上之酸中浸漬所期望之時間。又，亦可將聚乙烯醇系樹脂薄膜以不同方法暴露於脫水觸媒中。例如，亦可將薄膜於水性脫水觸媒中以充分的滯留時間進行浸泡(dipping)或浸漬，而使觸媒擴散至薄膜中。
作為脫水處理所使用之酸，可使用pH3以上，且在熱或其他適當處理條件的存在下，可進行去除來自線狀聚合物之羥基化部分的氫原子及氧原子而殘留共軛伸乙烯單元的任何酸。具體來說，可列舉鹽酸、氫溴酸、氫碘酸、磷酸及硫酸等。又，該等酸可為經水或甲醇等醇所稀釋者。
可在將聚乙烯醇系樹脂薄膜暴露於脫水觸媒之後，加熱聚乙烯醇系樹脂薄膜及吸附觸媒，藉此，配向薄膜之一部分轉換成作為所期望之脫水生成物的聚伸乙烯(polyvinylene)。可藉由傳導加熱、對流加熱、放射線加熱或該等之組合來加熱薄膜。例如，可使薄膜及觸媒，在約88℃~約205℃之溫度範圍下，通過加熱烘箱約數秒至約10分鐘。其他方法中，可將薄膜及觸媒暴露於微波放射線加熱、雷射加熱或放射紅外加熱。
脫水處理步驟中，聚乙烯醇系樹脂薄膜中之乙烯醇系聚合物的一部分轉換為聚(伸乙烯-共-乙烯醇)之嵌段共聚物之偏光分子。脫水處理的效果是由聚乙烯醇嵌段形成共軛聚伸乙烯嵌段。藉由將PVA基質配向於一方向，共軛聚伸乙烯嵌段之躍遷矩也被配向，材料成為明顯的二色性。
作為脫水處理後的交聯處理，例如可列舉將經脫水處理之聚乙烯醇系樹脂薄膜浸漬於含硼酸之水溶液的方法。具體來說，可使經脫水處理之聚乙烯醇系樹脂薄膜在溫度85~95℃下與濃度10~20%之硼酸水溶液接觸。
作為交聯後的水洗處理，例如藉由以下來進行：將脫水處理後經交聯之聚乙烯醇系樹脂薄膜浸漬於水中；噴霧水作為噴淋；或併用浸漬與噴霧。此外，水洗處理後，可藉由公知的方法乾燥聚乙烯醇系樹脂薄膜。
偏光薄膜的厚度並未特別限制，較佳為50μm以下，更佳為30μm以下，再更佳為25μm以下。偏光薄膜的厚度通常為1μm以上，較佳為3μm以上。
[接合層] 接合層係由使用將偏光薄膜與支持基材以化學鍵結接合之分子接合技術的分子接合劑所成。分子接合技術係以一層至數層分子將構件間藉由化學鍵結接合之技術，例如，將被黏物表面轉換為1種類之官能基表面，藉由該官能基的鍵結進行接合。
分子接合劑較佳包含具有將偏光薄膜與支持基材以化學鍵結接合之官能基的三嗪衍生物。由包含三嗪衍生物之分子接合劑所成之接合層較佳為包含三嗪衍生物作為主成分。此處「主成分」意指構成接合層的成分內，構成比率為50重量%以上，較佳為60重量%以上，更佳為80重量%以上，再更佳為90重量%以上，特佳為95重量%以上。
三嗪衍生物較佳為含有兩個以上OH基及/或OH生成基與1個三嗪環之化合物。含有兩個以上OH基及/或OH生成基與1個三嗪環之三嗪衍生物係，藉由支持基材表面之OH基及/或偏光薄膜表面之OH基與三嗪衍生物之OH基或OH生成基脫水縮合而形成經化學鍵結之接合層。作為三嗪衍生物，可使用以往已知的化合物。OH基或OH生成基較佳為烷氧基矽烷基。
在不阻礙本發明之效果的範圍中，分子接合劑可含有三嗪衍生物以外的成分。作為三嗪衍生物以外的成分，可列舉交聯劑、微粒子、紫外線吸收劑、消泡劑、增黏劑、分散劑、界面活性劑、觸媒、潤滑劑、抗靜電劑等。
接合層的厚度並未特別限制，例如較佳為5μm以下0.001μm以上，更佳為1μm以下0.001μm以上，再更佳為0.1μm以下0.005μm以上，特佳為0.05μm以下0.01μm以上。接合層的厚度係，從效率良好地將於偏光薄膜產生之熱散熱至外部並抑制偏光薄膜之溫度上升的觀點而言，較薄為佳，但若被黏物表面之表面性較差，存在於偏光薄膜及/或支持基材之表面的三嗪衍生物之OH基或由OH生成基生成之OH基會變得難以與另一側的表面接觸，故考慮此等並適宜設計即可。
此外，雖然在支持基材表面之OH基與偏光薄膜表面之OH基亦可發生脫水縮合，但因兩者具有之表面粗糙度的影響，各自表面的接觸面積小，因此密著力極低。接合層的厚度若為0.05μm以下0.01μm以上，則可填補支持基材和偏光薄膜具有之表面粗糙度，因此接觸面積變大，有利於接合強度。
[支持基材] 支持基材係，支持易破裂且單體之操作困難的偏光薄膜使其操作變得容易的同時，保護偏光薄膜者，並且係由對可見光具有透光性之材料所成。此外，此處所謂透光性係指全光線透過率為80%以上，較佳為85%以上，更佳為90%以上，光線透過率可依據JIS K 0115，並使用分光光度計(日本分光公司製，紫外可見近紅外分光光度計「V-570」)而測定。
作為對可見光具有透光性之材料，例如可列舉有機系材料、無機系材料、有機無機混成系材料。作為有機系材料，例如可列舉三乙醯基纖維素、二乙醯基纖維素、聚酯樹脂、聚醯亞胺樹脂、聚醯胺、聚乙烯、聚丙烯等聚烯烴樹脂，環烯烴聚合物、環烯烴共聚物等環烯烴樹脂，聚醚碸、聚碸、聚氯乙烯、丙烯酸樹脂、聚碳酸酯樹脂、胺基甲酸酯樹脂等。作為無機系材料，例如可列舉矽酸鹽玻璃、硼矽酸鹽玻璃、鈦矽酸鹽玻璃、氟化鋯等氟化物玻璃、熔融石英、水晶、藍寶石、YAG結晶、螢石、氧化鎂、尖晶石(MgO･Al 2O 3)等。作為有機無機混成系材料，可列舉由具有(甲基)丙烯醯基等有機性官能基的倍半矽氧烷衍生物所成之樹脂等。
從效率良好地將於偏光薄膜產生之熱散熱至外部並抑制偏光薄膜之熱收縮的觀點而言，積層於偏光薄膜之至少一面的支持基材，較佳為熱傳導率比偏光薄膜更高。熱傳導率，例如較佳為0.7W/mK以上，更佳為1W/mK以上，再更佳為5W/mK以上。作為此種材料，例如可列舉藍寶石(熱傳導率：40W/mK)或水晶(熱傳導率：8W/mK)。
支持基材的厚度並未特別限定，只要能使偏光薄膜之操作變得容易並可保護偏光薄膜則可適宜設計，例如為10~3000μm，較佳為20~1500μm，更佳為30~1000μm。
在支持基材的表面，視需要可形成各種機能層。作為機能層，例如可列舉導電層、抗靜電層、防眩(non-glare)層、光觸媒層等防污層、抗反射層、硬塗層、紫外線遮蔽層、熱線遮蔽層、電磁波遮蔽層、氣體阻隔層等。
[偏光板之製造方法] 接著，針對偏光板之製造方法進行說明。偏光板之製造方法具有：於由聚乙烯醇系樹脂所成之偏光薄膜及/或具有透光性之支持基材的表面設置分子接合劑的步驟；介隔存在於偏光薄膜及/或支持基材之表面的分子接合劑而將該等積層的步驟；與熱壓接偏光薄膜與支持基材，藉由化學鍵結接合偏光薄膜與支持基材的步驟。
＜步驟1：準備＞ 首先，準備上述偏光薄膜及支持基材。偏光薄膜及支持基材可為長條狀、片狀之任一者。偏光薄膜及支持基材可視需要將表面清淨化，例如可列舉使用乙醇或丙酮等洗淨劑的洗淨處理等。偏光薄膜及支持基材可視需要對表面進行活性化處理，例如可列舉紫外線照射處理、電暈放電處理、電漿處理等。
又，準備溶解有上述分子接合劑的溶液或分散液。分子接合劑可經溶劑稀釋，作為溶劑，可列舉水、醇(例如，甲醇、乙醇、異丙醇、乙二醇、丙二醇、賽珞蘇、卡必醇)、酮(例如，丙酮、甲基乙基酮、環己酮)、芳香族烴(例如，苯、甲苯、二甲苯)、脂肪族烴(例如，己烷、辛烷、癸烷、十二烷、十八烷)、酯(例如，乙酸乙酯、丙酸甲酯、鄰苯二甲酸甲酯)、醚(例如，四氫呋喃、乙基丁醚、苯甲醚)等，亦可為該等之混合物。三嗪衍生物的含量，可考量塗佈作業等而適宜設定即可，例如為0.0001~10wt%，較佳為0.001~3wt%，更佳為0.01~2wt%。
＜步驟2：塗佈＞ 於偏光薄膜及/或支持基材之表面設置分子接合劑。具體來說，係藉由將溶解有上述分子接合劑的溶液塗佈於偏光薄膜及/或支持基材之表面而達成。然後，視需要進行乾燥，藉由使溶劑揮發，分子接合劑殘留於偏光薄膜及/或支持基材之表面。塗佈方法並未特別限制，可採用公知的方法，例如可列舉線棒塗佈法、浸漬法、噴霧法、旋轉塗佈法、輥塗佈法、凹板塗佈法、氣刀塗佈法、簾式塗佈法、斜板式塗佈法、擠塗法、模塗佈法等。乾燥方法並未特別限定，可採用公知的方法。
＜步驟3：積層＞ 於偏光薄膜及/或支持基材之表面設置分子接合劑之後，介隔存在於偏光薄膜及/或支持基材之表面的分子接合劑而將該等積層。具體來說，係藉由將經塗佈溶解有分子接合劑的溶液之偏光薄膜及/或支持基材之面以對向的方式積層而達成。
＜步驟4：熱壓接＞ 接著，熱壓接偏光薄膜與支持基材，將偏光薄膜與支持基材以化學鍵結一體地接合。具體來說，係藉由使偏光薄膜朝向支持基材並在施加按壓力的狀態下加熱；使支持基材朝向偏光薄膜側並在施加按壓力的狀態下加熱；或從偏光薄膜及支持基材分別施加按壓力的狀態下加熱而達成。
按壓力為，使存在於偏光薄膜及/或支持基材之表面的三嗪衍生物之OH基或由OH生成基生成之OH基成為與另一側的表面接觸的按壓力。按壓力，例如較佳為0.01~50MPa，更佳為0.1~20MPa，再更佳為0.5~10MPa，特佳為0.5~5MPa。作用時間，例如為0.1~200分鐘。據此，即使在偏光薄膜或支持基材之表面具有微小凹凸，偏光薄膜或支持基材也會相應的變形，存在於該等表面的三嗪衍生物之OH基到達另一側之表面而鍵結。亦即，藉由三嗪衍生物之化學鍵結(反應)，偏光薄膜與支持基材牢固地鍵結。加熱溫度為可促進三嗪衍生物之化學反應的溫度。加熱溫度，例如為30~300℃，較佳為50~250℃，更佳為70~200℃，再更佳為80~150℃。 [實施例]
以下，藉由實施例對本發明進一步詳細說明。此外，本發明並不限定於以下實施例。
(實施例1) 首先，準備積層有表面保護薄膜之厚度25μm的碘系偏光薄膜，將偏光薄膜之與積層有表面保護薄膜的面為相反側之面以乙醇洗淨並乾燥之後，對該表面施加電暈放電處理。又，準備厚度0.7mm之水晶基材，將水晶基材在丙酮中進行超音波洗淨(10分鐘)，於乾燥之後，對該表面施加電暈放電處理。接著，藉由旋轉塗佈法將包含0.1重量%三嗪衍生物的乙醇溶液(產品名：MB1015水溶液，股份有限公司iou化學研究所製)塗佈於偏光薄膜的電暈放電處理面(塗佈量：2ml，自旋旋轉數：3000rpm) 之後，於常溫乾燥，而在偏光薄膜之表面設置三嗪衍生物。同樣地，藉由旋轉塗佈法將包含0.1重量%三嗪衍生物的乙醇溶液(產品名：MB1015水溶液，股份有限公司iou化學研究所製)之乙醇溶液塗佈於水晶基材之電暈放電處理面(塗佈量：2ml，自旋旋轉數：3000rpm)之後，投入熱風乾燥爐於80℃下乾燥10分鐘，而在水晶基材之表面設置三嗪衍生物。接著，將偏光薄膜及水晶基材之各設置有三嗪衍生物的表面重合，以熱壓機進行熱壓接(壓力：5MPa，溫度：120℃，時間：20分鐘)而製作偏光板(表面保護薄膜/碘系偏光薄膜/接合層/水晶基材)。
(實施例2) 首先，準備積層有表面保護薄膜之厚度25μm的碘系偏光薄膜，將偏光薄膜之與積層有表面保護薄膜的面為相反側之面以乙醇洗淨並乾燥之後，對該表面施加電暈放電處理。又，準備厚度0.7mm之藍寶石基材，將藍寶石基材在丙酮中進行超音波洗淨(10分鐘)，於乾燥之後，對該表面施加電暈放電處理。接著，藉由旋轉塗佈法將包含0.1重量%三嗪衍生物的乙醇溶液(產品名：MB1015水溶液，股份有限公司iou化學研究所製) 塗佈於偏光薄膜的電暈放電處理面(塗佈量：2ml，自旋旋轉數：3000rpm)之後，於常溫乾燥，而在偏光薄膜之表面設置三嗪衍生物。同樣地，藉由旋轉塗佈法將包含0.1重量%三嗪衍生物的乙醇溶液(產品名：MB1015水溶液，股份有限公司iou化學研究所製)之乙醇溶液塗佈於藍寶石基材之電暈放電處理面(塗佈量：2ml，自旋旋轉數：3000rpm)之後，投入熱風乾燥爐於80℃下乾燥10分鐘，而在藍寶石基材之表面設置三嗪衍生物。接著，將偏光薄膜及藍寶石基材之各設置有三嗪衍生物的表面重合，以熱壓機進行熱壓接(壓力：5MPa，溫度：120℃，時間：20分鐘) 而製作偏光板(表面保護薄膜/碘系偏光薄膜/接合層/藍寶石基材)。
(比較例1) 首先，準備積層有表面保護薄膜之厚度25μm的碘系偏光薄膜，將偏光薄膜之與積層有表面保護薄膜的面為相反側之面以乙醇洗淨並乾燥之後，對該表面施加電暈放電處理。又，準備厚度0.7mm之水晶基材，將水晶基材在丙酮中進行超音波洗淨(10分鐘)，於乾燥之後，對該表面施加電暈放電處理。接著，將黏著劑層(厚度：15μm，NCF-211S，Lintec股份有限公司製)貼合於偏光薄膜之電暈放電處理面，在黏著劑層之與偏光薄膜為相反面貼合水晶基材並以手墨輥(hand roller)按壓，而製作偏光板(表面保護薄膜/碘系偏光薄膜/黏著劑層/水晶基材)。
(比較例2) 首先，準備積層有表面保護薄膜之厚度25μm的碘系偏光薄膜，將偏光薄膜之與積層有表面保護薄膜的面為相反側之面以乙醇洗淨並乾燥之後，對該表面施加電暈放電處理。又，準備厚度0.7mm之水晶基材，將水晶基材在丙酮中進行超音波洗淨(10分鐘)，於乾燥之後，對該表面施加電暈放電處理。接著，藉由旋轉塗佈法將丙烯酸酯系紫外線硬化型接著劑(產品名：LOCTITEAA3105，固體成分量：100%，Henkel Japan股份有限公司製)塗佈於偏光薄膜之電暈放電處理面(塗佈量：2ml，自旋旋轉數3000rpm)，而設置塗佈層。接著，介隔塗佈層將偏光薄膜與水晶基板重合並以手墨輥按壓之後，藉由紫外線照射裝置以表面中之累積光量成為1000mJ/cm 2的方式自水晶基板側照射紫外線，使紫外線硬化型接著劑硬化，而製作偏光板(表面保護薄膜/碘系偏光薄膜/紫外線硬化型接著劑層/水晶基材)。
針對實施例1及2、比較例1及2中所得之偏光板，進行以下所示之評估。將評估結果示於表1。此外，以下評估中，使用表面保護薄膜經剝離之偏光板。 (耐久性評估) 朝實施例及比較例中所得之偏光板(23mm×20mm)送風，以一定速度之風吹向偏光板的狀態下，使用雷射照射機從偏光板之偏光薄膜側照射雷射光(波長：455nm)2分鐘，使用熱成像儀從偏光薄膜側，測定偏光薄膜面內之最高溫之部位的溫度作為偏光薄膜的表面溫度。以下述基準用目測評估雷射照射後之偏光板中之偏光薄膜的外觀以及使用背光時之偏光板的投影像。 此外，偏光板係以偏光薄膜吸收雷射之偏光的方式來配置(雷射之偏光與偏光薄膜之吸收軸為平行)。 ○：外觀、投影像無變化 △：在外觀上看到稍微的變化(凹凸、皺紋等)，在投影像中看到稍微的變化(變形、不均) ×：在外觀上看到變化(凹凸、皺紋等)，在投影像中看到變化(變形、不均) ××：在外觀上看到明顯的變化(凹凸、皺紋等)，在投影像中看到變化(變形、不均)
Figure 02_image001
如表1所示，藉由使用將偏光薄膜與水晶基材以化學鍵結接合之分子接合技術的分子接合劑進行接合而成之實施例1的偏光板，相較於比較例1及比較例2的偏光板，顯示雷射照射後之偏光薄膜的表面溫度較低的結果，且顯示雷射照射後之偏光薄膜的外觀和投影像優異之結果。又，如表1所示，藉由使用將偏光薄膜與藍寶石基材以化學鍵結接合之分子接合技術的分子接合劑進行接合而成之實施例2的偏光板，顯示偏光薄膜的表面溫度更低的結果，且顯示雷射照射後之偏光薄膜的外觀和投影像更優異之結果。
如上所述，藉由分子接合技術所接合之偏光板由於可減輕PVA偏光薄膜之熱負荷、使支持基材與偏光薄膜牢固地密著，因此可抑制PVA偏光薄膜之熱收縮所致之外觀不良，具有可長期地維持PVA偏光薄膜所具有之性能的高耐久性。因此，藉由分子接合技術所接合之偏光板在使用光束、光度、亮度、光密度等數值大或高的光源的用途等中特別有用。
1:偏光板 2:偏光薄膜 3:接合層 4:支持基材
[圖1]為表示本發明之偏光板之一例的剖面圖。
1:偏光板
2:偏光薄膜
3:接合層
4:支持基材

Claims (8)

  1. 一種偏光板，其特徵係具備： 由聚乙烯醇系樹脂所成之偏光薄膜；與 於前述偏光薄膜之至少一面，介隔接合層而積層之具有透光性之支持基材， 前述接合層係由將前述偏光薄膜與前述支持基材以化學鍵結連結之分子接合劑所成。
  2. 如請求項1之偏光板，其中，前述分子接合劑含有三嗪衍生物。
  3. 如請求項2之偏光板，其中，前述三嗪衍生物為含有兩個以上OH基及/或OH生成基與1個三嗪環之化合物。
  4. 如請求項3之偏光板，其中，前述支持基材表面的OH基及/或前述偏光薄膜表面的OH基與前述三嗪衍生物的OH基或OH生成基係藉由脫水縮合而化學鍵結。
  5. 如請求項1~4中任一項之偏光板，其中，前述接合層的膜厚為5μm以下0.001μm以上。
  6. 如請求項1~5中任一項之偏光板，其中，前述支持基材係由選自有機系材料、無機系材料、有機無機混成系材料之1種以上所成。
  7. 如請求項1~6中任一項之偏光板，其中，前述支持基材的熱傳導率為1W/mK以上。
  8. 一種偏光板之製造方法，其係如請求項1~7中任一項之偏光板之製造方法，特徵係具有： 於前述偏光薄膜及/或前述支持基材之表面設置前述分子接合劑的步驟； 介隔存在於前述偏光薄膜及/或前述支持基材之表面的前述分子接合劑而將該等積層的步驟；與 熱壓接前述偏光薄膜與前述支持基材，藉由化學鍵結接合前述偏光薄膜與前述支持基材的步驟。
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