TW202234072A - The electro-conductive contact pin assembly and method for manufacturing thereof - Google Patents

Abstract

The present invention provides an electrically-conductive contact pin assembly and a manufacturing method therefor, in which an electrically-conductive contact pin and a housing are manufactured at once by using a MEMS process, such that a minute gap between the electrically-conductive contact pin and the housing may be precisely managed.

Description

Conductive contact pin assembly and method of making the same

The present invention relates to a conductive contact pin assembly and a manufacturing method thereof.

A test device having a plurality of conductive contact pins between the connection terminals of the semiconductor package or wafer for testing and the connection terminals of the test circuit board side is used in a test apparatus for a semiconductor package or an integrated circuit wafer. Devices and sockets for testing. The electrical characteristics test of semiconductor components is carried out by approaching the test object (semiconductor wafer or semiconductor package) in a test device with a plurality of conductive contact pins and making the conductive contact pins and the corresponding electrode pads (or solder balls or bumps on the test object) ) contact to execute. When the conductive contact needle and the electrode pad on the detection object are in contact, the process of further approaching the detection object is performed after reaching a state where the two begin to contact.

Figure 11 shows a conductive contact pin according to the prior art. The conductive contact pin shown in FIG. 11 is a sliding type conductive contact pin that can apply a desired contact pressure and absorb shock at the contact position by providing spring members 12 between the tips 11 at both ends.

In order for the conductive contact pins to slide in the housing 13 , a gap should exist between the outer surface of the conductive contact pins and the inner surface of the housing 13 . However, since the sliding-type conductive contact pins are used in combination after the housing 13 and the conductive contact pins are separately produced, it is impossible to precisely perform gap management such as the outer surface of the conductive contact pins and the inner surface of the housing 13 being separated more than necessary. .

Therefore, since the electrical signal is lost and distorted during the transmission of the electrical signal to the housing through the tip portion 11 , the problem of reduced detection reliability occurs. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Korean Registered Patent Publication No. 10-0659944 [Patent Document 2] Korean Registered Patent Publication No. 10-0647131

[The problem to be solved by the invention]

The present invention is proposed to solve the above-mentioned problems of the prior art, and aims to provide a one-time fabrication of the conductive contact pins and the housing by using a micro electro mechanical system (MEMS) process, so that the conductive contact pins and the housing can be precisely managed A conductive contact pin combination with a fine gap between bodies and a method for manufacturing the same. [Means of Solving Problems]

In order to achieve the purpose of the present invention, the manufacturing method of the conductive contact pin assembly of the present invention includes the following steps: using a first mold made of anodized film material to make the conductive contact pin and the side wall of the housing; using a patternable material The second mold is used to make the upper surface of the housing in a way that is connected to the side wall and is spaced apart from the first surface of the conductive contact pins; the third mold of the material that can be patterned is used to match the forming the lower portion of the housing in such a manner that the side wall portion is connected to and spaced apart from the second face of the conductive contact pins; and removing the first mold, the second mold, and the third mold.

In addition, the step of fabricating the conductive contact pins and the side wall portion of the casing includes the following steps: forming a first opening pattern and a second opening pattern in a first mold made of the anodized film material; The opening pattern and the second opening pattern are filled with metal to form the conductive contact pin and the side wall of the housing.

In addition, the step of making the upper portion of the housing includes the steps of: forming a patternable material and patterning it to form a second mold having a third opening pattern; The opening pattern fills the metal to make the upper surface of the housing.

In addition, the step of making the lower portion of the housing includes the steps of: forming a patternable material and patterning it to form a third mold having a fourth opening pattern; Open pattern fill metal to make the lower portion of the housing.

On the other hand, the conductive contact pin combination of the present invention includes: a conductive contact pin having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface; and a housing, which can slide the conductive contact pins inside, and has an upper surface portion opposite to the first surface, a lower surface portion opposite to the second surface, and a side wall portion opposite to the side surface. The side surfaces of the conductive contact pins include first fine grooves, and the first fine grooves are formed of grooves that are elongated and recessed in the direction of the first surface and the second surface, and a plurality of the first fine grooves are formed in parallel.

In addition, the first fine groove is not formed in the first surface and the second surface.

In addition, a second fine groove formed in the side wall portion of the casing in the same direction as the first fine groove is included.

In addition, the second fine groove is not formed in the upper part and the lower part of the second fine groove.

In addition, the second fine groove is not formed in the upper surface portion and the lower surface portion.

On the other hand, the conductive contact pin combination of the present invention includes: a conductive contact pin having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface; and a housing, which can slide the conductive contact pins inside, and has an upper surface portion opposite to the first surface, a lower surface portion opposite to the second surface, and a side wall portion opposite to the side surface. The side surface of the side wall portion of the case includes a second fine groove formed by a groove that is elongated and recessed in the direction of the first surface and the second surface, and a plurality of second fine grooves are formed in parallel . [Effect of invention]

The present invention provides a conductive contact pin assembly and a manufacturing method thereof, which can precisely manage the fine gap between the conductive contact pin and the housing by manufacturing the conductive contact pin and the housing at one time by using a micro-electromechanical system (MEMS) process.

The following contents merely illustrate the principles of the invention. Therefore, even if it is not explicitly described or illustrated in this specification, those skilled in the art can realize the principle of the invention and invent various devices included in the concept and scope of the invention. In addition, all the terms of the condition part and the examples listed in this specification should be understood in principle only for the purpose of clearly understanding the concept of the invention, and are not limited to the examples and states specifically listed as described above.

The above-mentioned objects, features, and advantages will be further clarified by the following detailed description related to the accompanying drawings, so that those with ordinary knowledge in the technical field to which the invention pertains can easily implement the technical idea of the invention.

The embodiments described in this specification will be described with reference to sectional views and/or perspective views which are ideal illustrations of the present invention. In order to effectively describe the technical content, the thicknesses of films and regions shown in these drawings are exaggerated. The shape of the illustration may be deformed due to manufacturing techniques and/or tolerances. Therefore, the embodiments of the present invention are not limited to the specific shapes shown, but also include changes in the shapes generated according to the manufacturing process.

In describing various embodiments, even if the embodiments are different, the same names and the same reference numerals are given to the constituent elements that perform the same functions for convenience. In addition, for the sake of convenience, configurations and operations that have been described in other embodiments will be omitted.

The conductive contact pins according to the preferred embodiments of the present invention are fabricated by MEMS technology, and can be applied in different fields according to their uses. According to a preferred embodiment of the present invention, the conductive contact needles are configured on the detection device and used for making electrical and physical contact with the detection object to transmit electrical signals. The testing device may be a testing device used in a semiconductor manufacturing process, and may be a probe card, and may be a test socket, as an example according to the testing object. The detection device according to the preferred embodiment of the present invention is not limited to this, and includes any device that applies electricity to confirm whether the detection object is defective.

Hereinafter, preferred embodiments of the present invention will be described based on the accompanying drawings.

FIG. 1( a ), FIG. 1 ( b ), and FIG. 2 are diagrams for explaining a conductive contact pin assembly 100 according to a preferred embodiment of the present invention.

The conductive contact pin assembly 100 according to the preferred embodiment of the present invention comprises the conductive contact pins 200 and the housing 300 for accommodating the conductive contact pins 200 . The conductive contact pin 200 has a first surface 201 , a second surface 202 opposite to the first surface 201 , and a side surface 203 connecting the first surface 201 and the second surface 202 . The conductive contact pin 200 is slidable inside the housing 300 and has an upper surface portion 301 opposite to the first surface 201 , a lower surface portion 302 opposite to the second surface 202 , and a side wall portion 303 opposite to the side surface 203 .

Referring to FIG. 1( a ), FIG. 1 ( b ) and FIG. 2 , the conductive contact pin 200 according to the preferred embodiment of the present invention includes a first contact tip 210 , a second contact tip 230 , and a connection to the first contact The tip portion 210 contacts the body portion 250 of the tip portion 230 with the second. An elastic contact portion 270 is formed in at least any one of the first contact tip portion 210 and the second contact tip portion 230 .

The conductive contact pin 200 is made of the first contact tip portion 210 , the second contact tip portion 230 and the main body portion 250 by MEMS technology into an integrated type.

The main body portion 250 may be formed in a zigzag shape, and may be fabricated in a manner of elastically expanding and contracting in the longitudinal direction of the conductive contact pin 200 . The shape of the main body portion 250 may be made into any other shape that can be elastically deformed other than the sawtooth shape.

The conductive contact pins 200 and the housing 300 may be formed of conductive materials. Here, the conductive material may be selected from platinum (Pt), rhodium (Ph), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir), nickel (Ni), cobalt ( Co) or an alloy thereof, or at least one of nickel-cobalt (NiCo) alloy, palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiP) alloy.

The conductive contact pin 200 and the side wall portion 303 of the housing 300 may have a multi-layer structure in which a plurality of conductive materials are laminated. Each conductive layer formed of different materials can be selected from platinum (Pt), rhodium (Ph), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir), nickel (Ni) , cobalt (Co) or its alloy, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiP) alloy.

The first contact tip 210 is the part that is in substantial contact with the pad of the detection device or the detection object, and the second contact tip 230 is the part that is in substantial contact with the detection object or the pad of the detection device. The compressive force applied to both ends elastically compresses the main body portion 250 in the longitudinal direction, and when the compressive force applied to both ends is released, the main body portion 250 returns to its original state.

The elastic contact portion 270 is formed on at least one of the first contact tip portion 210 and the second contact tip portion 230 . The configuration in which the elastic contact portion 270 is arranged on the first contact tip portion 210 is shown in FIGS. 1( a ) and 1 ( b ).

One end of the elastic contact portion 270 is connected to the first contact tip portion 400 , and the other end of the elastic contact portion 270 is a free end. Thereby, the elastic contact portion 270 can be supported and fixed by the first contact tip portion 400 and elastically deformed.

The elastic contact portion 270 arranged on the left side of the conductive contact pin 200 is formed by bending in a shape like the "C" shape of the English alphabet, and the elastic contact portion 270 arranged on the right side of the conductive contact pin 200 is shaped like an "inverted C" shape. The like shape is formed by bending.

One end of the elastic contact portion 270 is connected to the root portion of the first contact tip portion 400 , and the thickness of the conductive contact pin 200 is thicker as it approaches the root portion from the other end. This has the effect of preventing stress from concentrating on the roots of the conductive contact pins 200 and being damaged during deformation.

The other end of the elastic contact portion 270 constitutes a free end. In the case where the other end of the elastic contact portion 270 does not constitute a free end and is connected to a certain part of the conductive contact pin 200, the deformation amount of the elastic contact portion 270 is not large when the first contact tip portion 210 slides. On the contrary, frictional resistance can play a large role. In contrast to this, since the other end of the elastic contact portion 270 according to the preferred embodiment of the present invention constitutes a free end, the deformation of the elastic contact portion 270 is easily generated when the first contact tip 210 slides, so that the elastic contact portion 270 can be relatively reduced. The effect of frictional resistance.

The elastic contact portions 270 are disposed on both sides of the first contact tip portion 210 . The length of the width before deformation of the elastic contact portions 270 arranged on both sides of the first contact tip portion 210 is formed to be smaller than the length between the inner surfaces of the housing 500 . Thereby, the first contact tip 210 can maintain a state in which it is always in contact with the inner surface of the housing 500 .

In addition, since the elastic contact portion 270 has a curved shape, even when the first contact tip portion 210 slides along the inner surface of the housing 500, the normal force of the frictional force acting on the elastic contact portion 270 also moves along the first contact tip 210. The direction of the contact tip 210 comes into play. Therefore, even when the first contact tip 210 slides, the state of being in constant contact with the inner surface of the housing 500 can be maintained.

Since the elastic contact portion 270 is in contact with the inner surface of the housing 500 made of conductive material, a current path is formed through the first contact tip 210 , the housing 500 and the second contact tip 230 . Therefore, the main body 250 is responsible for the elastic deformation of the conductive contact pin 200 , the first contact tip 210 , the housing 500 and the second contact tip 230 are responsible for the current path of the conductive contact pin 200 , so that the current path of the conductive contact pin 200 can be formed in a shorter time. The path of the current of the conductive contact pin 200 .

Stopping ribs 310 are arranged on both ends of the casing 500 . The size of the hole formed by the blocking rib 310 is such that the conductive contact pin 200 cannot easily come out. The size of the hole formed by the blocking rib 310 is larger than the width of the first contact tip 210 and smaller than the longest distance between the two elastic contact portions 270 . When the main body portion 250 is extended to the maximum length, the stop rib 310 supports the root portion of the elastic contact portion 270 . Thereby, the gap between the housing 500 and the blocking edge 310 can be widened during the manufacturing process, and the smooth sliding movement of the first contact tip 210 can be ensured.

In addition, since the elastic contact portion 270 is always in contact with the inner surface of the case 500 , foreign matter is prevented from penetrating into the case 500 . Also, since there is a sufficient separation space between the stop rib 310 and the first contact tip 210 on the root side of the elastic contact portion 270, foreign matter generated during sliding can be easily discharged to the outside.

The conductive contact pin assembly 100 according to the preferred embodiment of the present invention utilizes a MEMS process to manufacture the conductive contact pin 200 and the housing 300 at one time. 3( a )- FIG. 3 ( c ) to FIG. 6 ( a ) - FIG. 6 ( c ), the manufacturing method of the conductive contact pin assembly 100 according to the preferred embodiment of the present invention will be described .

The manufacturing method of the conductive contact pin assembly 100 according to the preferred embodiment of the present invention includes the following steps: (i) using the first mold 10 made of anodized film material to manufacture the conductive contact pin 200 and the side wall portion 303 of the housing 300; (ii) ) Using the second mold 20 of a material that can be patterned, the upper surface portion 301 of the housing 300 is fabricated in a manner that is connected to the side wall portion 303 and separated from the first surface 201 of the conductive contact pin 200; a third mold 30 of patterned material, making the lower portion 302 of the housing 300 in a manner connected to the side wall portion 303 and spaced from the second face 202 of the conductive contact pins 200; and (iv) removing the first mold 10 , the second mold 20 and the third mold 30 .

First, (i) the step of fabricating the conductive contact pins 200 and the side wall portion 303 of the housing 300 includes the following steps: forming the first opening pattern 11 and the second opening pattern 12 in the first mold 10 made of anodized film; An opening pattern 11 and a second opening pattern 12 are filled with metal to form the conductive contact pins 200 and the side wall portion 303 of the housing 300 .

Referring to FIG. 3( a ), first, a first mold 10 made of an anodized film is prepared. A first seed layer 15 is disposed under the first mold 10 made of anodized film material. The first seed layer 15 is previously formed on the lower portion of the first mold 10 in order to perform electroplating later. The first seed layer 15 is preferably made of copper (Cu), platinum (Pt), tantalum (Ta), titanium (Ti) or an alloy material thereof, as long as it functions as a seed layer for electroplating The material is not limited to this. Preferably, the first seed layer 15 may be copper (Cu). The first seed layer 15 can be formed to a thickness of 10 nm or more and 1 μm or less by a sputtering process.

The first mold 10 made of anodized film material refers to a film formed by anodizing a metal as a base material, and pores refer to pores formed in the process of anodizing the metal to form an anodized film. For example, when the metal used as the base material is aluminum (Al) or an aluminum alloy, when the base material is anodized, an anodized film made of aluminum oxide (Al ₂ O ₃ ) is formed on the surface of the base material. The anodic oxide film formed as described above is vertically divided into a barrier layer in which pores are not formed therein and a porous layer in which pores are formed therein. In the base material in which the anodized film having the barrier layer and the porous layer is formed on the surface, if the base material is removed, only the anodized film made of aluminum oxide (Al ₂ O ₃ ) remains. The anodized film may be formed by removing the barrier layer formed during the anodization and the pores penetrating along the upper and lower sides, or by leaving the barrier layer formed during the anodization as it is and leaving the upper and lower ends of the pores A partially closed structure is formed. The anodized film has a thermal expansion coefficient of 2 ppm/°C to 3 ppm/°C. Therefore, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, even if the fabrication environment of the conductive contact pins 200 is a high temperature environment, the precise conductive contact pins 200 can be fabricated without thermal deformation.

Next, referring to FIG. 3( b ), a first opening pattern 11 and a second opening pattern 12 are formed in the first mold 10 made of anodized film material. The first opening pattern 11 and the second opening pattern 12 can be formed by removing at least a part of the first mold 10 from the anodized film material. The first opening pattern 11 and the second opening pattern 12 can be formed by etching the first mold 10 made of an anodized film material. To this end, a photoresist can be arranged on the upper surface of the first mold 10 made of anodized film material and patterned, and then the anodized film in the region opened by the patterning reacts with the etching solution to form the first opening The pattern 11 and the second opening pattern 12 .

Specifically, a photosensitive material can be disposed on the upper surface of the first mold 10 of the anodized film material before the first opening pattern 11 and the second opening pattern 12 are formed, and then an exposure process and a development process can be performed. The photosensitive material can be formed with an open area through an exposure process and a development process, and at least a part of it is patterned and removed. The first mold 10 made of anodized film material is subjected to an etching process by removing the opening area of the photosensitive material by a patterning process, thereby forming the first opening pattern 11 and the second opening pattern 12 . In addition, if the first mold 10 made of anodized film is wet-etched with an etching solution, a first opening pattern 11 and a second opening pattern 12 having vertical inner walls are formed.

Compared with the structure in which the photoresist is used as the mold, when the anodic oxide film is used as the mold to form the plating layer, the shape precision of the plating layer is improved, and the conductive contact pins 200 and 200 having precise fine structures can be produced. The side wall portion 303 of the housing 300 . In addition, a first fine groove 250 is formed in the side surface of the conductive contact pin 200 , and a second fine groove 350 is formed in the side wall portion 303 of the housing 300 along the same direction as the first fine groove 250 . The fine grooves 250 are formed of grooves that are long and concave in the direction of the first surface 201 and the second surface 202 , and a plurality of them are formed in parallel. The specific structures of the first fine trench 250 and the second fine trench 350 are as follows.

Next, referring to (c) of FIG. 3 , an electroplating process is performed using the first seed layer 15 . A plated layer is formed inside the first opening pattern 11 to form the conductive contact pins 200 , and a plated layer is formed inside the second opening pattern 12 to form the side wall portion 303 of the casing 300 . When the plating process is complete, a planarization process may be performed. The plating layer protruding to the upper surface of the first mold 10 made of anodized film is removed and planarized by chemical mechanical polishing (CMP) process.

Then (ii) the following step is performed: using the second mold 20 of a material that can be patterned, to form the upper surface portion 301 of the housing 300 in a manner of being connected to the side wall portion 303 and spaced apart from the first surface 201 of the conductive contact pins 200 . Here, the step of fabricating the upper surface portion 301 of the casing 300 includes the following steps: patterning the second seed layer 17 ; forming a patternable material and patterning it to form a third opening pattern 21 . two molds 20 ; and the third opening pattern 21 of the second mold 20 is filled with metal.

Referring to FIG. 4( a ), the second seed layer 17 is arranged on the upper portion of the first mold 10 made of an anodized film material. The second seed layer 17 is preferably made of copper (Cu), platinum (Pt), tantalum (Ta), titanium (Ti), or an alloy material thereof, as long as it functions as a seed layer for electroplating The material is not limited to this. Preferably, the second seed layer 17 may be copper (Cu). The second seed layer 17 can be formed to a thickness of 10 nm or more and 1 μm or less by a sputtering process.

Next, referring to FIG. 4( b ), the second seed layer 17 is patterned. The patterned second seed layer 17 is formed on the upper surface of the first face 201 of the conductive contact pins 200 and the upper surface of the first mold 10 between the sidewall portions 303 of the housing 300 and the conductive contact pins 200 . The second seed layer 17 is not formed on the upper surface of the side wall portion 303 of the case 300 .

Next, referring to FIG. 4( c ), a patternable material is formed on the upper surface of the first mold 10 . Here, the material that can be patterned is used as the material that can perform the exposure process and the development process, preferably a photoresist material. After the patternable material is formed on the upper surface of the first mold 10 , the patternable material is exposed and developed to form the third opening pattern 21 . Thereby, the second mold 20 having the third opening pattern 21 is formed. Inside the third opening pattern 21 , the second seed layer 17 and the upper surface of the sidewall portion 303 of the casing 300 are exposed and disposed.

Next, referring to FIG. 5( a ), electroplating is performed using the first seed layer 15 , the second seed layer 17 , and the already-formed plated layer, thereby fabricating a connection with the existing sidewall portion 303 and with the conductive contact pin 200 The upper surface 301 of the housing 300 separated by the first surface 201 . The upper surface 301 of the housing 300 is separated from the first surface 201 of the conductive contact pins 200 by the thickness of the second seed layer 17 . Since the thickness of the second seed layer 17 is 10 nm or more and 1 μm or less, the upper surface 301 of the housing 300 is separated from the first surface 201 of the conductive contact pins 200 by a distance of 10 nm or more and 1 μm or less.

Next, (iii) the following step is performed: using the third mold 30 of a material that can be patterned, to form the lower portion of the housing 300 in a manner of being connected to the side wall portion 303 and spaced apart from the second surface 202 of the conductive contact pin 200 302. Here, the step of fabricating the lower portion 302 of the housing 300 includes the following steps: patterning the first seed layer 17 ; forming a patternable material and patterning it to form a first seed layer having the fourth opening pattern 31 three molds 30 ; and filling the fourth opening pattern 31 of the third mold 30 with metal.

Referring to (b) of FIG. 5 , the device fabricated in step (a) of FIG. 5 is turned upside down by 180°. Next, referring to FIG. 5( c ), the first seed layer 15 is patterned. The patterned first seed layer 15 is formed on the upper surface of the second surface 202 of the conductive contact pins 200 (based on the drawing), and the first mold between the sidewall portions 303 of the housing 300 and the conductive contact pins 200 10's top surface (based on the picture). The first seed layer 15 is not formed on the upper surface (based on the drawing) of the side wall portion 303 of the case 300 .

Next, referring to FIG. 6( a ), a patternable material is formed on the upper surface (based on the drawing) of the first mold 10 . Here, the material that can be patterned is used as the material that can perform the exposure process and the development process, preferably a photoresist material. After the patternable material is formed on the upper surface of the first mold 10 , the patternable material is exposed and developed to form the fourth opening pattern 31 . Thereby, the third mold 30 having the fourth opening pattern 31 is formed. Inside the fourth opening pattern 31 , the first seed layer 15 and the upper surface (based on the figure) of the sidewall portion 303 of the casing 300 are exposed and disposed.

Next, referring to FIG. 6( b ), electroplating is performed using the first seed layer 15 , the second seed layer 17 , and the already formed plating layer, so as to be connected to the existing sidewall portion 303 and to the conductive contact pin 200 The lower surface portion 302 of the casing 300 is formed so that the second surface 202 is separated. The lower portion 302 of the housing 300 is spaced from the second face 202 of the conductive contact pins 200 by the thickness of the first seed layer 15 . Since the thickness of the first seed layer 17 is formed to be 10 nm or more and 1 μm or less, the lower portion 302 of the housing 300 is separated from the second surface 202 of the conductive contact pins 200 by a distance of 10 nm or more and 1 μm or less.

Then (iv) a step of removing the first mold 10 , the second mold 20 and the third mold 30 is performed. In the case where the first mold 10 is formed of an anodized film material, the first mold 10 is removed using an etching solution that only selectively reacts with the anodized film. In the case where the second mold 20 and the third mold 30 are formed of a photoresist material, the second mold 20 and the third mold 30 are removed using an etching solution that only selectively reacts with the photoresist. Thereby, the conductive contact pin assembly 100 as shown in FIG. 6c is fabricated.

In this way, since the method for manufacturing the conductive contact pin assembly 100 according to the preferred embodiment of the present invention manufactures the conductive contact pins 200 and the housing 300 at one time, it is solved that the housing 300 and the conductive contact pins 200 should be separately manufactured after they are separately manufactured. Combining the tediousness of the prior art.

In addition, since the gap between the conductive contact pin 200 and the housing 300 is determined by the thicknesses of the anodized film and the first seed layer 15 and the second seed layer 17 existing therebetween during the manufacturing process, the conductive contact pin can be The gap between 200 and case 300 becomes fine. Thus, by minimizing large movements of the conductive contact pins 200 within the housing 300, the prior art problems of large movements of the conductive contact pins 200 within the housing 300 are solved.

In particular, the distance between the conductive contact pin 200 and the side wall portion 303 of the case 300 is determined by the width of the anodized film material, because the anodized film material located therebetween exists before the conductive contact pin 200 and the side wall portion 303 of the case 300 are manufactured and The space between the conductive contact pin 200 and the side wall portion 303 of the housing 300 can be made finer because it is not configured to fill the space separately. In this way, the first contact tip 210 and the second contact tip 230 can perform a vertical glide that substantially satisfies the design contact position with the contact object.

In addition, in the process of manufacturing the conductive contact pin 200 and the side wall portion 303 of the case 300 , there is an anodized film material between the conductive contact pin 200 and the side wall portion 303 of the case 300 , so the side surface of the conductive contact pin 200 is A first fine groove 250 is formed in the direction of the first surface 201 and the second surface 202 , and a second fine groove 350 is formed on the side wall portion 303 of the casing 300 along the same direction as the first fine groove 250 .

Hereinafter, the configurations of the first fine trench 250 and the second fine trench 350 will be described in detail with reference to FIGS. 7 to 10 .

The conductive contact pin 200 according to a preferred embodiment of the present invention includes a plurality of first micro-grooves 250 formed on at least one side of the conductive contact pin 200 . In more detail, the first fine trenches 250 are formed on the side surfaces 203 of the conductive contact pins 200 . The first fine grooves 250 are formed to extend long in the thickness direction of the conductive contact pins 200 in the side surfaces 203 of the conductive contact pins 200 . Here, the thickness direction of the conductive contact pins 200 means the direction in which the plating layer grows when electroplating is performed.

The depth of the first fine trench 250 has a range of not less than 20 nm and not more than 3 μm, and the width thereof also has a range of not less than 20 nm and not more than 3 μm. Here, since the first fine grooves 250 originate from pores formed when the first mold 10 made of anodized film material is produced, the width and depth of the first fine grooves 250 are equal to those of the first mold 10 made of anodized film material. The value below the diameter range of the pores. On the other hand, in the process of forming the first opening pattern 11 in the first mold 10 made of anodized film material, a part of the pores of the first mold 10 made of anodized film material are broken with each other by the etching solution, and at least part of the pores may be broken. The first fine trenches 250 are formed with a depth in a larger range than the diameter range of the pores formed when the anodization is performed.

Since the first mold 10 made of anodized film includes a large number of pores, and at least a part of the first mold 10 made of anodized film is etched to form the first opening pattern 11, plating is formed inside the first opening pattern 11 by electroplating Therefore, the side surfaces of the conductive contact pins 200 have first fine grooves 250 formed when they are in contact with the pores of the first mold 10 made of anodized film.

In this way, the conductive contact pin 200 has a first surface 201, a second surface 202 opposite to the first surface 201, a side surface 203 connecting the first surface 201 and the second surface 202, and the side surface 203 of the conductive contact pin 200 includes a Grooves that are long recessed in the direction of the first surface 201 and the second surface 202 are formed, and a plurality of first fine grooves 250 are formed in parallel. The first micro-trench 250 is integrally formed across the side surface 203 of the conductive contact pin 200 as a whole, but is not formed in the first side 201 and the second side 202 other than the side surface 203 .

The first micro-grooves 250 as described above have the effect of increasing the surface area for the side surfaces of the conductive contact pins 200 . In other words, even if the conductive contact pin 200 according to the preferred embodiment of the present invention has the same shape and size as the previous conductive contact pin 200 , the surface area of the side surface 203 of the conductive contact pin 200 can be made larger.

In addition, due to the configuration of the first fine grooves 250 formed on the side surfaces 203 of the conductive contact pins 200 , the elastic recovery capability of the conductive contact pins 200 when deformed can be improved.

In addition, since the heat generated in the conductive contact pins 200 can be quickly released by the configuration of the first fine grooves 250 formed in the side surfaces 203 of the conductive contact pins 200, the temperature rise of the conductive contact pins 200 can be suppressed.

In addition, by having the first fine grooves 250 on the side surfaces 203 of both end portions in contact with the contact object, there is an effect of reducing the contact resistance of the conductive contact pins 200 when the contact object is in contact.

On the other hand, at least one end portion of the first fine trench 250 may be disposed at a distance of 10 nm or more and 500 nm or less from the adjacent first surface 201 or second surface 202 . The first mold 10 made of the anodized film may include a barrier layer and a pore layer formed during the manufacturing process of the anodized film. In this case, the thickness of the barrier layer can be formed to a thickness of 10 nm or more and 500 nm or less. According to the configuration of disposing the first mold 10 made of anodized film material so that the barrier layer is located on the upper part of the air hole layer, and disposing the patterned photoresist on the upper surface of the barrier layer and etching to form the opening 210, as shown in the figure As shown in Fig. 9, due to the existence of the barrier layer, the first fine trench 250 can be formed with a distance of 10 nm or more and 500 nm or less from the upper surface.

The roughness range of the side surface 203 of the conductive contact pin 200 is different from the roughness range of the first surface 201 and the second surface 202 . According to the configuration in which a large number of first fine trenches 250 with widths and depths of tens of nanometers are formed, the roughness range of the side surface 203 of the conductive contact pin 200 is higher than that of the first surface 201 and the second surface 202 of the conductive contact pin 200 The roughness range is wide.

In the conductive contact pin 200 , a plurality of stacked layers are formed in the thickness direction of the conductive contact pin 200 , and the same layer can be formed of the same metal material. Referring to FIG. 8 , the conductive contact pins 200 may be configured in the form of a total of three laminated layers of metal materials. The first layer 291 and the third layer 293 are excellent in hardness properties and provide excellent mechanical elasticity to the conductive contact pins 200, and the second layer 292 provides electrical properties with excellent electrical conductivity. The first layer 291 and the third layer 293 may be formed of nickel (Ni) or nickel (Ni) alloy material, and the second layer 292 may be formed of copper (Cu) or copper (Cu) alloy material. Thereby, it is possible to provide a contact pin having excellent mechanical properties and also excellent electrical properties.

10 , the side wall portion 303 of the casing 300 according to a preferred embodiment of the present invention includes a second micro groove 350 formed in the side wall portion 303 of the casing 300 along the same direction as the first micro groove 250 . In more detail, the second fine grooves 350 are formed on the side surfaces of the side wall portion 303 . The second fine groove 350 is formed to extend long in the thickness direction of the side wall portion 303 in the side surface of the side wall portion 303 of the case 300 . Here, the thickness direction of the side wall portion 303 means the direction in which the plating layer grows when electroplating is performed.

The depth of the second fine trench 350 has a range of not less than 20 nm and not more than 3 μm, and the width thereof also has a range of not less than 20 nm and not more than 3 μm. Here, since the second fine grooves 350 originate from pores formed when the first mold 10 made of anodized film material is produced, the width and depth of the second fine grooves 350 are equal to those of the first mold 10 made of anodized film material. The value below the diameter range of the pores. On the other hand, during the process of forming the second opening pattern 12 in the first mold 10 made of anodized film material, a part of the pores of the first mold 10 made of anodized film material are broken from each other by the etching solution, and at least part of the pores may be broken. The second fine trench 350 is formed to have a depth in a larger range than the diameter range of the pores formed when the anodization is performed.

Since the first mold 10 made of anodized film material includes a large number of pores, and at least a part of the first mold 10 made of such anodized film material is etched to form the second opening pattern 12, plating is formed inside the second opening pattern 11 by electroplating Therefore, the side surface of the side wall portion 303 has a second fine groove 350 formed when the side surface of the side wall portion 303 is in contact with the pores of the first mold 10 made of anodized film. The second fine grooves 350 are formed of grooves that are long recessed in the direction of the second surface 202 from the first surface 201 in the side surface of the side wall portion 303 of the case 300 , and a plurality of them are formed in parallel.

The second fine groove 350 is formed on the side surface 203 of the side wall portion 350 but not in the upper surface portion 301 and the lower surface portion 3022 other than the side wall portion 303 . In addition, the second fine groove 350 is not formed even in the upper portion of the second fine groove 350 in the side surface of the side wall portion 350 . That is, with reference to the side surface of the side wall portion 350 , the second fine grooves 350 are spaced apart by a certain distance in the upper portion and spaced apart by a certain distance in the lower portion. The distance by which the second fine trenches 350 are separated in the upper portion of the side surface of the sidewall portion 350 is the distance by the thickness of the second seed layer 17 , and the distance by which the second fine trenches 350 are separated in the lower portion of the side surface of the sidewall portion 350 is the distance of the thickness of the first seed layer 15 .

The second fine grooves 350 as described above have the effect of increasing the surface area of the side wall portion 303 of the case 300 . In other words, even if the side wall portion 303 of the casing 300 according to the preferred embodiment of the present invention has the same shape and size as the previous casing, the surface area of the side wall portion 303 of the casing 300 can be made larger.

In addition, by the configuration of the second fine grooves 350 formed in the side wall portion 303 of the case 300, heat generated in the side wall portion 303 of the case 300 can be quickly released, so that the temperature rise of the case 300 can be suppressed .

On the other hand, in the foregoing description, only a separate structure in which the conductive contact pins 200 and the housing 300 are separated from each other is illustrated for description, but at least a part of the conductive contact pins 200 may be integrated with the housing 300 . In this case, the first contact tip 210 or the second contact tip 230 of the conductive contact pin 200 can be integrated with the housing 300 , and more preferably, the second contact tip 230 without the elastic contact portion 270 can be integrated with the housing 300 . The body 300 constitutes an integral type.

As mentioned above, although the description is made with reference to the preferred embodiments of the present invention, those of ordinary skill in the corresponding technical field can implement various modifications to the present invention without departing from the spirit and scope of the present invention described in the following claims. or deformed.

10: The first mold 11: Tip/First Opening Pattern 12: Spring Part/Second Opening Pattern 13, 300: shell 15: First seed layer 17: Second seed layer 20: Second mold 21: The third opening pattern 30: Third mold 31: Fourth opening pattern 100: Conductive contact pin combination 200: Conductive Contact Pin 201: The first side 202: Second Side 203: Side 210: First contact tip/opening 230: Second Contact Tip 250: main body/first fine groove 270: Elastic contact part 291: first floor 292: Second Floor 293: The third floor 301: upper face 302: Lower face 303: Sidewall 310: stop edge 350: Second Micro Groove

FIG. 1( a ) is a plan view of a conductive contact pin assembly according to a preferred embodiment of the present invention. (b) of FIG. 1 is a horizontal cross-sectional view of a conductive contact pin assembly according to a preferred embodiment of the present invention. 2 is a vertical cross-sectional view of a conductive contact pin assembly according to a preferred embodiment of the present invention. FIGS. 3(a)-3(c) to 6(a)-6(c) are diagrams illustrating a method of manufacturing a conductive contact pin assembly according to a preferred embodiment of the present invention. 7 is an end perspective view of a conductive contact pin according to a preferred embodiment of the present invention. FIG. 8 is a photograph taken of the end of the conductive contact pin according to the preferred embodiment of the present invention. FIG. 9 is a view showing a side surface of a conductive contact pin according to a preferred embodiment of the present invention. 10 is a view showing a side surface of a side wall portion of a case according to a preferred embodiment of the present invention. FIG. 11 is a diagram illustrating a combination of conductive contact pins according to the prior art.

100: Conductive contact pin combination

200: Conductive Contact Pin

201: The first side

202: Second Side

203: Side

300: Shell

301: upper face

302: Lower face

303: Sidewall

Claims (10)

A manufacturing method of a conductive contact pin assembly, comprising the following steps: Use the first mold made of anodized film to make the conductive contact pin and the side wall of the housing; Using a second mold of a material that can be patterned, the upper surface of the housing is fabricated in a manner that is connected to the side wall and is spaced apart from the first surface of the conductive contact pins; Using a third mold of a material capable of being patterned, forming the lower portion of the housing in a manner connected to the side wall portion and spaced apart from the second face of the conductive contact pins; and The first mold, the second mold, and the third mold are removed. The method for manufacturing a conductive contact pin combination as claimed in claim 1, wherein The step of fabricating the conductive contact pins and the side wall portion of the housing includes the following steps: forming a first opening pattern and a second opening pattern on the first mold made of the anodized film material; and The first opening pattern and the second opening pattern are filled with metal to form the conductive contact pin and the side wall portion of the housing. The method for manufacturing a conductive contact pin combination as claimed in claim 1, wherein The step of making the upper portion of the housing includes the following steps: forming a patternable material and patterning it to form the second mold having a third pattern of openings; and The upper surface portion of the housing is fabricated by filling the third opening pattern of the second mold with metal. The method for manufacturing a conductive contact pin combination as claimed in claim 1, wherein The step of making the lower part of the housing includes the steps of: forming a patternable material and patterning it to form the third mold having a fourth pattern of openings; and The lower portion of the housing is fabricated by filling the fourth opening pattern of the third mold with metal. A conductive contact pin assembly comprising: a conductive contact pin, having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface; and a housing, capable of sliding the conductive contact pins inside, and having an upper surface portion opposite to the first surface, a lower surface portion opposite to the second surface, and a side wall portion opposite to the side surface, A first fine groove is included in the side surface of the conductive contact pin, and the first fine groove is formed by grooves that are long and concave in the direction of the first surface and the second surface and are juxtaposed There are multiple. The conductive contact pin combination as claimed in claim 5, wherein The first fine groove is not formed in the first surface and the second surface. The conductive contact pin combination as claimed in claim 5, comprising: The second fine groove is formed in the side wall portion of the casing along the same direction as the first fine groove. The conductive contact pin combination of claim 7, wherein No second fine trenches are formed in the upper and lower portions of the second fine trenches. The conductive contact pin combination of claim 7, wherein The second fine groove is not formed in the upper surface portion and the lower surface portion. A conductive contact pin assembly comprising: a conductive contact pin, having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface; and a housing, capable of sliding the conductive contact pins inside, and having an upper surface portion opposite to the first surface, a lower surface portion opposite to the second surface, and a side wall portion opposite to the side surface, A second fine groove is included in the side surface of the side wall portion of the casing, and the second fine groove is formed by a groove that is elongated and concave from the direction in which the first faces the second face and A plurality of them are formed in parallel.

Images