TWI802282B - The electro-conductive contact pin assembly - Google Patents
The electro-conductive contact pin assembly Download PDFInfo
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- TWI802282B TWI802282B TW111106179A TW111106179A TWI802282B TW I802282 B TWI802282 B TW I802282B TW 111106179 A TW111106179 A TW 111106179A TW 111106179 A TW111106179 A TW 111106179A TW I802282 B TWI802282 B TW I802282B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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Abstract
本發明提供一種將藉由微機電系統製程製作的導電接觸針彼此結合以具有足夠的厚度的導電接觸針組合。The invention provides a combination of conductive contact pins made by MEMS process to have sufficient thickness.
Description
本發明是有關於一種導電接觸針組合。 The invention relates to a combination of conductive contact pins.
在用於半導體封裝或積體電路的晶圓的試驗裝置中使用在用於進行測試的半導體封裝或晶圓的連接端子與測試電路基板側的連接端子之間具有多個導電接觸針的試驗用裝置及檢測用插座。半導體元件的導電特性試驗藉由在具有多個導電接觸針的檢測裝置中接近檢測對象(半導體晶圓或半導體封裝)並使導電接觸針與檢測對象上對應的電極墊(或焊球或凸塊)接觸來執行。於導電接觸針與檢測對象上的電極墊接觸時,到達兩者開始接觸的狀態後,進行進一步接近檢測對象的處理。 A test device having a plurality of conductive contact pins between the connection terminals of the semiconductor package or wafer for testing and the connection terminals on the test circuit substrate side is used in a test device for semiconductor packages or wafers of integrated circuits Device and testing socket. The conductive characteristic test of semiconductor components is performed by approaching the detection object (semiconductor wafer or semiconductor package) in a detection device with multiple conductive contact pins and making the conductive contact pins correspond to the electrode pads (or solder balls or bumps) on the detection object. ) touch to execute. When the conductive contact needle is in contact with the electrode pad on the detection object, after reaching the state where the two start to contact, the process of further approaching the detection object is performed.
已知先前將彈簧針(pogo-pin)用作與半導體封裝接觸的導電接觸針的插座。先前的彈簧針是一種於上部接觸尖部與下部接觸尖部之間使彈簧接觸並被筒體包圍的彈性針。但此種結構的彈簧針在與300μm以下的微細節距對應方面存在限制。 It is previously known to use pogo-pins as sockets for conductive contact pins that make contact with semiconductor packages. The previous pogo pin is a spring pin with a spring in contact between the upper contact tip and the lower contact tip and surrounded by a barrel. However, pogo pins with such a structure have limitations in correspondence with a fine pitch of 300 μm or less.
為了解決此種問題點,開發使用微機電系統(Microelectro Mechanical Systems,MEMS)製程來製作導電接觸針的技術。對 使用MEMS製程製作接觸針的過程進行闡述,首先,於將光阻膜塗佈於導電基材表面後,對光阻膜進行圖案化。之後,將光阻膜用作模具,利用電鍍法於開口內使金屬材料在導電基材表面的暴露面析出,去除光阻膜與導電基材,從而得到接觸針。如上所述,將使用MEMS製程製作的接觸針稱為MEMS接觸針。此種MEMS接觸針的形狀具有與形成於光阻膜模具的開口的形狀相同的形狀。 In order to solve this problem, a technology of manufacturing conductive contact pins using a microelectromechanical system (MEMS) process has been developed. right The process of manufacturing contact pins using the MEMS process is described. First, after the photoresist film is coated on the surface of the conductive substrate, the photoresist film is patterned. Afterwards, the photoresist film is used as a mold, and the metal material is deposited on the exposed surface of the conductive substrate in the opening by electroplating, and the photoresist film and the conductive substrate are removed, thereby obtaining the contact pin. As mentioned above, the contact pins manufactured using the MEMS process are called MEMS contact pins. The shape of this MEMS contact pin has the same shape as the shape of the opening formed in the photoresist film mold.
另一方面,此種先前技術由於將光阻膜用作模具來製作MEMS接觸針,因此MEMS接觸針的厚度受到光阻膜的模具的高度的影響。但是於多步驟積層光阻的情況下,於上、下積層的光阻間產生對準誤差,且因對準誤差使接觸針的側面不垂直且出現階差。因此,由於在將接觸針的厚度變得足夠厚方面存在限制,因此與寬度相比,其剖面形狀的厚度具有薄的矩形形狀。因此,於收容接觸針的圓柱形的空間內部形成無效空間(dead space)且厚度薄,剛性相對差,因而具有容易斷裂的問題。 On the other hand, in the prior art, since the photoresist film is used as a mold to manufacture the MEMS contact pins, the thickness of the MEMS contact pins is affected by the height of the mold of the photoresist film. However, in the case of multi-step laminated photoresist, an alignment error occurs between the upper and lower layered photoresist, and the side of the contact pin is not vertical due to the alignment error, and a step difference appears. Therefore, since there is a limitation in making the thickness of the contact pin sufficiently thick, the thickness of its cross-sectional shape has a thin rectangular shape compared to the width. Therefore, a dead space is formed inside the cylindrical space for accommodating the contact pin, and the thickness is thin, and the rigidity is relatively poor, so there is a problem that it is easy to break.
[現有技術文獻] [Prior art literature]
[專利文獻] [Patent Document]
[專利文獻1]韓國註冊專利公報註冊編號第10-0659944號 [Patent Document 1] Korean Registered Patent Publication Registration No. 10-0659944
[專利文獻2]韓國註冊專利公報註冊編號第10-0647131號 [Patent Document 2] Korean Registered Patent Publication Registration No. 10-0647131
本發明是為了解決上述問題點而提出,本發明的目的在於提供將藉由MEMS製程製作的導電接觸針彼此結合以具有足夠的厚度的導電接觸針組合。 The present invention is proposed to solve the above-mentioned problems, and the purpose of the present invention is to provide a conductive contact pin assembly that combines conductive contact pins produced by MEMS process to have sufficient thickness.
為了達成此種本發明的目的,根據本發明的導電接觸針組合是包括第一導電接觸針及與所述第一導電接觸針結合的第二導電接觸針的導電接觸針組合,所述第一導電接觸針包括:第一上部接觸尖部;第一下部接觸尖部;以及第一彈性主體部,連接所述第一上部接觸尖部與所述第一下部接觸尖部,所述第二導電接觸針包括:第二上部接觸尖部;第二下部接觸尖部;以及第二彈性主體部,連接所述第二上部接觸尖部與所述第二下部接觸尖部,所述第一上部接觸尖部與所述第二上部接觸尖部藉由上部結合單元彼此結合,所述第一下部接觸尖部與所述第二下部接觸尖部藉由下部結合單元彼此結合,且所述第一彈性主體部與所述第二彈性主體部彼此不結合。 In order to achieve this purpose of the present invention, the conductive contact pin assembly according to the present invention is a conductive contact pin assembly comprising a first conductive contact pin and a second conductive contact pin combined with the first conductive contact pin, the first The conductive contact pin includes: a first upper contact tip; a first lower contact tip; and a first elastic main body connecting the first upper contact tip and the first lower contact tip, the first The two conductive contact pins include: a second upper contact tip; a second lower contact tip; and a second elastic main body connecting the second upper contact tip to the second lower contact tip, the first The upper contact tip and the second upper contact tip are coupled to each other by an upper coupling unit, the first lower contact tip and the second lower contact tip are coupled to each other by a lower coupling unit, and the The first elastic body part and the second elastic body part are not combined with each other.
另外,所述上部結合單元包括形成於所述第一上部接觸尖部以及所述第二上部接觸尖部中任一者的突起與供所述突起插入的孔。 In addition, the upper coupling unit includes a protrusion formed on any one of the first upper contact tip and the second upper contact tip and a hole into which the protrusion is inserted.
另外,所述下部結合單元包括形成於所述第一下部接觸尖部以及所述第二下部接觸尖部中任一者的突起與供所述突起插入的孔。 In addition, the lower coupling unit includes a protrusion formed on any one of the first lower contact tip and the second lower contact tip and a hole into which the protrusion is inserted.
另外,所述上部結合單元包括上部針,所述上部針插入 至形成於第一上部接觸尖部的第一上部孔及形成於所述第二上部接觸尖部的第二上部孔。 In addition, the upper coupling unit includes an upper needle inserted into To a first upper hole formed in the first upper contact tip and a second upper hole formed in the second upper contact tip.
另外,所述下部結合單元包括下部針,所述下部針插入至形成於第一下部接觸尖部的第一下部孔及形成於所述第二下部接觸尖部的第二下部孔。 In addition, the lower coupling unit includes a lower needle inserted into a first lower hole formed at the first lower contact tip and a second lower hole formed at the second lower contact tip.
另外,所述第一上部接觸尖部與所述第二上部接觸尖部進行鉸鏈結合。 In addition, the first upper contact tip is hingedly coupled to the second upper contact tip.
另外,所述第一下部接觸尖部與所述第二下部接觸尖部進行鉸鏈結合。 In addition, the first lower contact tip is hingedly coupled to the second lower contact tip.
另外,所述第一彈性主體部的變形方向與所述第二彈性主體部的變形方向為彼此相反方向。 In addition, the deformation direction of the first elastic body part and the deformation direction of the second elastic body part are opposite to each other.
另外,所述第一導電接觸針與所述第二導電接觸針利用在導電性、硬度、彈性中的至少任一者中具有彼此不同的物性的材料來製作。 In addition, the first conductive contact pin and the second conductive contact pin are made of materials having different physical properties from each other in at least one of conductivity, hardness, and elasticity.
另一方面,根據本發明的導電接觸針組合是包括第一導電接觸針以及與所述第一導電接觸針結合的第二導電接觸針的導電接觸針組合,所述第一導電接觸針包括:第一上部接觸尖部,具有第一上部突起;第一下部接觸尖部,具有第一下部突起;以及第一彈性主體部,連接所述第一上部接觸尖部與所述第一下部接觸尖部,所述第二導電接觸針包括:第二上部接觸尖部,具有供所述第一上部突起插入的第二上部孔;第二下部接觸尖部,具有供所述第一下部突起插入的第二下部孔;以及第二彈性主體 部,連接所述第二上部接觸尖部與所述第二下部接觸尖部。 On the other hand, the conductive contact pin combination according to the present invention is a conductive contact pin combination comprising a first conductive contact pin and a second conductive contact pin combined with the first conductive contact pin, the first conductive contact pin comprising: a first upper contact tip having a first upper protrusion; a first lower contact tip having a first lower protrusion; and a first elastic body portion connecting the first upper contact tip to the first lower contact tip The upper contact tip, the second conductive contact pin includes: a second upper contact tip with a second upper hole for inserting the first upper protrusion; a second lower contact tip with a second lower hole for the first lower the second lower hole into which the upper protrusion is inserted; and the second elastic body part, connecting the second upper contact tip with the second lower contact tip.
另一方面,根據本發明的導電接觸針組合是包括第一導電接觸針以及與所述第一導電接觸針結合的第二導電接觸針的導電接觸針組合,所述第一導電接觸針包括:第一上部接觸尖部,具有第一上部孔;第一下部接觸尖部,具有第一下部突起;以及第一彈性主體部,連接所述第一上部接觸尖部與所述第一下部接觸尖部,所述第二導電接觸針包括:第二上部接觸尖部,具有插入至所述第一上部孔的第二上部突起;第二下部接觸尖部,具有供所述第一下部突起插入的第二下部孔;以及第二彈性主體部,連接所述第二上部接觸尖部與所述第二下部接觸尖部。 On the other hand, the conductive contact pin combination according to the present invention is a conductive contact pin combination comprising a first conductive contact pin and a second conductive contact pin combined with the first conductive contact pin, the first conductive contact pin comprising: a first upper contact tip having a first upper hole; a first lower contact tip having a first lower protrusion; and a first elastic body portion connecting the first upper contact tip to the first lower contact tip The upper contact tip, the second conductive contact pin includes: a second upper contact tip with a second upper protrusion inserted into the first upper hole; a second lower contact tip with a second lower contact tip for the first lower hole a second lower hole into which the upper protrusion is inserted; and a second elastic main body connecting the second upper contact tip with the second lower contact tip.
另一方面,根據本發明的導電接觸針組合是結合有多個導電接觸針形成的導電接觸針組合,所述導電接觸針包括:上部接觸尖部,具有上部孔;下部接觸尖部,具有下部孔;以及彈性主體部,連接所述上部接觸尖部與所述下部接觸尖部,積層多個導電接觸針,將上部針插入至多個所述上部孔並將下部針插入至多個所述下部孔。 On the other hand, the conductive contact pin assembly according to the present invention is a conductive contact pin assembly formed by combining a plurality of conductive contact pins, and the conductive contact pin includes: an upper contact tip with an upper hole; a lower contact tip with a lower holes; and an elastic main body connecting the upper contact tip and the lower contact tip, stacking a plurality of conductive contact pins, inserting the upper pins into the plurality of upper holes and inserting the lower pins into the plurality of lower holes .
本發明提供一種將藉由MEMS製程製作的導電接觸針彼此結合以具有足夠的厚度的導電接觸針組合。 The invention provides a combination of conductive contact pins made by MEMS process to have sufficient thickness.
10:導電接觸針組合 10: Conductive contact pin combination
100:第一導電接觸針/導電接觸針 100: first conductive contact pin/conductive contact pin
110:第一上部接觸尖部/上部接觸尖部 110: first upper contact tip/upper contact tip
111:第一上部主體/上部主體 111: first upper body/upper body
113:第一上部突出尖/上部突出尖 113: the first upper protruding tip/upper protruding tip
120:第一下部接觸尖部/下部接觸尖部 120: first lower contact tip/lower contact tip
121:第一下部主體/下部主體 121: First lower body/lower body
123:第一下部突出尖/下部突出尖 123: the first lower protruding tip/lower protruding tip
130:第一彈性主體部/彈性主體部 130: first elastic body part/elastic body part
135、235:葉片 135, 235: blade
200:第二導電接觸針/導電接觸針 200: second conductive contact pin/conductive contact pin
210:第二上部接觸尖部 210: second upper contact tip
211:第二上部主體 211: second upper body
213:第二上部突出尖 213: second upper protruding tip
220:第二下部接觸尖部 220: second lower contact tip
221:第二下部主體 221: second lower body
223:第二下部突出尖 223: second lower protruding tip
230:第二彈性主體部 230: second elastic body part
300:上部結合單元 300: upper binding unit
311:第一上部突起/突起 311: First upper protrusion/protrusion
312:第二上部孔/孔 312: Second upper hole/hole
321:第一上部孔 321: First upper hole
322:第二上部突起 322: second upper protrusion
331:上部孔 331: upper hole
350:上部針 350: upper needle
400:下部結合單元 400: Lower combination unit
411:第一下部突起/突起 411: First lower protrusion/protrusion
412:第二下部孔/孔 412: Second lower hole/hole
421:第一下部突起 421: first lower protrusion
422:第二下部孔 422: second lower hole
431:下部孔 431: Bottom hole
450:下部針 450: lower needle
圖1的(a)、圖1的(b)是示出根據本發明的較佳第一實施 例的第一導電接觸針與第二導電接觸針的圖。 (a) of Fig. 1, (b) of Fig. 1 are to show the preferred first implementation according to the present invention The diagram of the first conductive contact pin and the second conductive contact pin of the example.
圖2是示出根據本發明的較佳第一實施例的將第一導電接觸針與第二導電接觸針結合的圖。 FIG. 2 is a diagram illustrating combining a first conductive contact pin with a second conductive contact pin according to a preferred first embodiment of the present invention.
圖3的(a)、圖3的(b)是示出根據本發明的較佳第二實施例的第一導電接觸針與第二導電接觸針的圖。 Fig. 3(a) and Fig. 3(b) are diagrams showing a first conductive contact pin and a second conductive contact pin according to a preferred second embodiment of the present invention.
圖4是示出根據本發明的較佳第二實施例的將第一導電接觸針與第二導電接觸針結合的圖。 FIG. 4 is a diagram illustrating combining a first conductive contact pin with a second conductive contact pin according to a preferred second embodiment of the present invention.
圖5是示出根據本發明的較佳第三實施例的導電接觸針的圖。 FIG. 5 is a diagram showing a conductive contact pin according to a preferred third embodiment of the present invention.
圖6是示出根據本發明的較佳第三實施例的將導電接觸針結合的圖。 FIG. 6 is a diagram illustrating coupling of conductive contact pins according to a preferred third embodiment of the present invention.
以下的內容僅例示發明的原理。因此即便未在本說明書中明確地進行說明或圖示,相應領域的技術人員亦可實現發明的原理並發明包含於發明的概念與範圍內的各種裝置。另外,本說明書所列舉的所有條件部用語及實施例在原則上應理解為僅是作為明確地用於理解發明的概念的目的,並不限制於如上所述特別列舉的實施例及狀態。 The following is merely illustrative of the principles of the invention. Therefore, even if it is not explicitly described or illustrated in this specification, those skilled in the art can realize the principle of the invention and invent various devices included in the concept and scope of the invention. In addition, all conditional terms and examples listed in this specification should be understood in principle only for the purpose of clearly understanding the concept of the invention, and should not be limited to the examples and states specifically listed above.
所述的目的、特徵及優點藉由與附圖相關的下文的詳細說明而進一步變明瞭,因此在發明所屬的技術領域內的具有通常知識者可容易地實施發明的技術思想。 The above objects, features, and advantages will be further clarified by the following detailed description related to the accompanying drawings, so those skilled in the technical field to which the invention belongs can easily implement the technical idea of the invention.
將參考作為本發明的理想例示圖的剖面圖及/或立體圖來 說明本說明書中記述的實施例。為了有效地說明技術內容,對該些附圖所示的膜及區域的厚度等進行誇張表現。例示圖的形態可因製造技術及/或公差等變形。另外,附圖所示的導電接觸針的個數僅例示性地在附圖中表示一部分。因此,本發明的實施例並不限於所示的特定形態,亦包括根據製造製程生成的形態的變化。 Reference will be made to cross-sectional views and/or perspective views which are ideal illustrations of the present invention. Examples described in this specification will be described. In order to effectively explain the technical content, the thicknesses of the films and regions shown in these drawings are exaggerated. The shape of the illustrations may be deformed due to manufacturing techniques and/or tolerances. In addition, the numbers of the conductive contact pins shown in the drawings are only partially shown in the drawings. Thus, embodiments of the invention are not limited to the specific forms shown, but also include variations in forms resulting from manufacturing processes.
在對各種實施例進行說明時,即使實施例不同,為了方便起見亦對執行相同功能的構成要素賦予相同的名稱及相同的參考編號。另外,為了方便起見,將省略已經在其他實施例中說明的構成及操作。 When various embodiments are described, even if the embodiments are different, components performing the same functions are given the same names and the same reference numerals for convenience. In addition, for the sake of convenience, configurations and operations already described in other embodiments will be omitted.
根據本發明的較佳實施例的導電接觸針組合配備於檢測裝置並用於與檢測對象進行電接觸、物理接觸以傳遞電訊號。檢測裝置可為用於半導體製造製程的檢測裝置,且作為一例根據檢測對象可為探針卡,且可為測試插座。根據本發明的較佳實施例的檢測裝置並不限定於此,包括任何施加電以確認檢測對象是否不良的裝置。 The conductive contact pin assembly according to the preferred embodiment of the present invention is equipped with the detection device and is used to make electrical contact and physical contact with the detection object to transmit electrical signals. The detection device may be a detection device used in a semiconductor manufacturing process, and as an example, may be a probe card and a test socket according to a detection object. The detection device according to the preferred embodiment of the present invention is not limited thereto, and includes any device that applies electricity to confirm whether the detection object is defective.
根據本發明的較佳實施例的導電接觸針組合中,多個導電接觸針以彼此積層狀態結合構成。根據本發明的較佳實施例的導電接觸針可藉由MEMS技術來製作。 In the combination of conductive contact pins according to a preferred embodiment of the present invention, a plurality of conductive contact pins are combined in a laminated state. The conductive contact pins according to the preferred embodiment of the present invention can be fabricated by MEMS technology.
根據本發明的較佳實施例的導電接觸針組合中,具有彼此相同的形狀的導電接觸針可藉由結合單元結合來構成,且具有彼此不同的形狀的導電接觸針可藉由結合單元結合來構成。 In the combination of conductive contact pins according to a preferred embodiment of the present invention, conductive contact pins having the same shape as each other can be combined by combining units, and conductive contact pins having different shapes can be combined by combining units. constitute.
根據本發明的較佳實施例的導電接觸針組合包括第一導 電接觸針及與所述第一導電接觸針結合的第二導電接觸針,所述第一導電接觸針包括:第一上部接觸尖部;第一下部接觸尖部;以及第一彈性主體部,連接所述第一上部接觸尖部與所述第一下部接觸尖部,所述第二導電接觸針包括:第二上部接觸尖部;第二下部接觸尖部;以及第二彈性主體部,連接所述第二上部接觸尖部與所述第二下部接觸尖部,所述第一上部接觸尖部與所述第二上部接觸尖部藉由上部結合單元彼此結合,所述第一下部接觸尖部與所述第二下部接觸尖部藉由下部結合單元彼此結合,且可採用所述第一彈性主體部與所述第二彈性主體部彼此不結合的構成。 The conductive contact pin assembly according to the preferred embodiment of the present invention includes a first lead An electrical contact pin and a second conductive contact pin combined with the first conductive contact pin, the first conductive contact pin includes: a first upper contact tip; a first lower contact tip; and a first elastic body , connecting the first upper contact tip and the first lower contact tip, the second conductive contact pin includes: a second upper contact tip; a second lower contact tip; and a second elastic body , connecting the second upper contact tip and the second lower contact tip, the first upper contact tip and the second upper contact tip are combined with each other by an upper coupling unit, the first lower contact tip The bottom contact tip and the second lower contact tip are combined with each other by the lower coupling unit, and the first elastic main body and the second elastic main body are not combined with each other.
此處,上部結合單元包括形成於所述第一上部接觸尖部以及所述第二上部接觸尖部中任一者的突起與供所述突起插入的孔。及/或所述下部結合單元包括形成於所述第一下部接觸尖部以及所述第二下部接觸尖部中任一者的突起與供所述突起插入的孔。 Here, the upper coupling unit includes a protrusion formed on any one of the first upper contact tip and the second upper contact tip and a hole into which the protrusion is inserted. And/or the lower coupling unit includes a protrusion formed on any one of the first lower contact tip and the second lower contact tip and a hole into which the protrusion is inserted.
又,所述上部結合單元包括上部針,所述上部針插入至形成於第一上部接觸尖部的第一上部孔及形成於所述第二上部接觸尖部的第二上部孔。所述下部結合單元包括下部針,所述下部針插入至形成於第一下部接觸尖部的第一下部孔及形成於所述第二下部接觸尖部的第二下部孔。 Also, the upper coupling unit includes an upper needle inserted into a first upper hole formed at the first upper contact tip and a second upper hole formed at the second upper contact tip. The lower coupling unit includes a lower needle inserted into a first lower hole formed at the first lower contact tip and a second lower hole formed at the second lower contact tip.
以下,參照圖式對本發明的較佳實施例進行詳細說明。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
圖1的(a)、圖1的(b)及圖2是用於說明根據本發明
的較佳第一實施例的導電接觸針組合10的圖,圖1的(a)、圖1的(b)是示出在結合前的第一導電接觸針100、第二導電接觸針200的圖,圖2是示出第一導電接觸針100、第二導電接觸針200呈結合的狀態的圖。
(a) of Fig. 1, (b) of Fig. 1 and Fig. 2 are for explaining according to the present invention
The diagram of the conductive
根據本發明的較佳第一實施例的導電接觸針組合10包括第一導電接觸針100及與第一導電接觸針100結合的第二導電接觸針200。
The conductive
第一導電接觸針100與第二導電接觸針200可由導電材料形成。此處,導電材料可自鉑(Pt)、銠(Rh)、鈀(Pd)、銅(Cu)、銀(Ag)、金(Au)、銥(Ir)或其等的合金、或者鎳-鈷(NiCo)合金、鈀-鈷(PdCo)合金、鈀-鎳(PdNi)合金或鎳-磷(NiP)合金中選擇至少一種。第一導電接觸針100與第二導電接觸針200可具有多個導電材料積層的多層結構。由彼此不同材質形成的各導電層可自鉑(Pt)、銠(Rh)、鈀(Pd)、銅(Cu)、銀(Ag)、金(Au)、銥(Ir)或其等的合金、或者鈀-鈷(PdCo)合金、鈀-鎳(PdNi)合金或鎳-磷(NiP)合金中選擇。
The first
第一導電接觸針100包括第一上部接觸尖部110、第一下部接觸尖部120以及連接第一上部接觸尖部110與第一下部接觸尖部120的第一彈性主體部130,第二導電接觸針200包括第二上部接觸尖部210、第二下部接觸尖部220以及連接第二上部接觸尖部210與第二下部接觸尖部220的第二彈性主體部230。
The first
第一上部接觸尖部110與第二上部接觸尖部210藉由上
部結合單元300彼此結合,第一下部接觸尖部120與第二下部接觸尖部220藉由下部結合單元400彼此結合,且第一彈性主體部130與第二彈性主體部230彼此不結合。
The first
此處,上部結合單元300包括形成於第一上部接觸尖部110及第二上部接觸尖部210中任一者的突起311與供所述突起311插入的孔312。另外,下部結合單元400包括形成於第一下部接觸尖部120及第二下部接觸尖部220中任一者的突起411與供所述突起411插入的孔412。
Here, the
參照圖1的(a)、圖1的(b),圖1的(a)是示出第一導電接觸針100的圖,圖1的(b)是示出第二導電接觸針200的圖。
Referring to (a) of FIG. 1 and (b) of FIG. 1, (a) of FIG. 1 is a diagram showing a first
第一導電接觸針100包括具有第一上部突起311的第一上部接觸尖部110與具有第一下部突起411的第一下部接觸尖部120。
The first
第一上部接觸尖部110包括第一上部主體111與第一上部突出尖113。第一上部主體111在平面上形成為大致四邊形。第一上部突起311配備於第一上部主體111的表面上。較佳為第一上部突起311在第一上部主體111的下表面突出形成。第一上部突起311的剖面形狀可具有圓形,但不限定於此,可配備為多邊形。第一上部突出尖113在第一上部主體111的端部側突出形成且具有尖銳的形狀。
The first
第一下部接觸尖部120包括第一下部主體121與第一下
部突出尖123。第一下部主體121在平面上形成為大致四邊形。第一下部突起411配備於第一下部主體121的表面上。較佳為第一下部突起411在第一下部主體121的下表面突出形成。第一下部突起411的剖面形狀可具有圓形,但不限定於此,可配備為多邊形。第一下部突起411與第一上部突起311配備於第一導電接觸針100的下表面且其等的突出方向為彼此相同方向。
The first
第一下部突出尖123在第一下部主體121的端部側突出形成且具有尖銳的形狀。
The first lower protruding
由於第一上部突出尖113與第一下部突出尖123可作為與接觸對象進行實質性接觸的部位發揮作用,因此第一上部突出尖113與第一下部突出尖123可由硬度相對高的材質形成。作為一實施例,第一上部突出尖113與第一下部突出尖123可由鉑(Pt)或銠(Rh)形成。反之,第一導電接觸針100的主體可選擇與第一上部突出尖113相比導電性相對高的材質或彈性高的材質的金屬中的至少一種來形成。
Since the first upper protruding
第一彈性主體部130連接第一上部接觸尖部110與第一下部接觸尖部120。第一彈性主體部130包括多個葉片135而構成。各葉片135的一端部連接至第一上部主體111,而另一端部連接至第一下部主體121。各葉片135彼此隔開且配備有多個,以使第一上部主體111與第一下部主體121進行彈性變形,以彼此接近地移動或彼此遠離地移動。各葉片135具有如字母表「C」字形狀般以兩個端部為基準向一側彎曲的弓形狀。參照圖1的(a),
各葉片135具有以兩個端部為基準向左側彎曲的形狀。
The first
第二導電接觸針200包括:第二上部接觸尖部210,具有供第一上部突起311插入的第二上部孔312;以及第二下部接觸尖部220,具有供第一下部突起411插入的第二下部孔412。
The second
第二上部接觸尖部210包括第二上部主體211與第二上部突出尖213。第二上部主體211在平面上形成為大致四邊形。第二上部孔312配備於第二上部主體211的內側。較佳為第二上部孔312在第二上部主體211的內側貫通第二上部主體211而形成。第二上部突出尖213在第二上部主體211的端部側突出形成且具有尖銳的形狀。
The second
第二下部接觸尖部220包括第二下部主體221與第二下部突出尖223。第二下部主體221在平面上形成為大致四邊形。第二下部孔412配備於第二下部主體221的內側。較佳為第二下部孔412在第二下部主體221的內側貫通第二下部主體221而形成。
The second
第二彈性主體部230連接第二上部接觸尖部210與第二下部接觸尖部220。第二彈性主體部230包括多個葉片235而構成。各葉片235的一端部連接至第二上部主體211,而另一端部連接至第二下部主體221。各葉片235彼此隔開且配備有多個,以使第二上部主體211與第二下部主體221進行彈性變形,以彼此接近地移動或彼此遠離地移動。各葉片235具有如字母表「C」字反形狀般以兩個端部為基準向一側彎曲的弓形狀。參照圖1的(b),各葉片235具有以兩個端部為基準向右側彎曲的形狀。
The second
圖2是示出上文說明的第一導電接觸針100與第二導電接觸針200呈結合的狀態的圖。參照圖2,第一導電接觸針100位於前面且第二導電接觸針200位於第一導電接觸針100的後面並進行結合。
FIG. 2 is a diagram illustrating a state in which the first
第一上部突起311插入至第二上部孔312以構成上部結合單元300,且第一下部突起411插入至第二下部孔412以構成下部結合單元400。
The first
第一導電接觸針100的第一上部接觸尖部110與第二導電接觸針200的第二上部接觸尖部210藉由上部結合單元300進行結合,第一導電接觸針100的第一下部接觸尖部120與第二導電接觸針200的第二下部接觸尖部220藉由下部結合單元400進行結合。但此處第一彈性主體部130與第二彈性主體部230彼此不結合。
The first
藉由第一導電接觸針100與第二導電接觸針200藉由上部結合單元300及下部結合單元400進行結合的構成,可提供具有足夠的厚度的導電接觸針組合10,且在收容導電接觸針組合的圓柱形空間內部可不形成無效空間。
With the combination of the first
由於第一導電接觸針100的第一彈性主體部130具有向左側彎曲的形狀的葉片135,且第二導電接觸針200的第二彈性主體部230具有向右側彎曲的形狀的葉片235,因此第一彈性主體部130的變形方向與第二彈性主體部230的變形方向為彼此相反方向。藉此可確保導電接觸針組合10的結構上的穩定性。
Since the first
藉由上部結合單元300進行結合的第一上部接觸尖部110與第二上部接觸尖部210將第一上部突起311作為鉸鏈軸發揮作用並進行鉸鏈結合,藉由下部結合單元400進行結合的第一下部接觸尖部120與第二下部接觸尖部220可將第一下部突起411作為鉸鏈軸發揮作用並進行鉸鏈結合。於此情況,第一上部突起311及第二上部孔312的剖面形成為圓形並容許彼此間的相對旋轉,且第一下部突起411及第二下部孔412的剖面亦形成為圓形並容許彼此間的相對旋轉。
The first
藉由於導電接觸針組合10的上部、下部中容許以第一上部突起311及第一下部突起411為基準的第一導電接觸針100與第二導電接觸針200的相對旋轉,可更容易去除形成於接觸對象表面的氧化膜。更具體而言,由於第一上部接觸尖部110及第二上部接觸尖部210與位於上部側的接觸對象接觸,在下降的同時可以第一上部突起311為基準進行旋轉,因此第一上部突出尖113與第二上部突出尖213更有效地刮掉接觸對象的表面,從而容易去除接觸對象的氧化膜。另外,由於第一下部接觸尖部120及第二下部接觸尖部220與位於下部側的接觸對象接觸,在下降的同時可以第一下部突起411為基準進行旋轉,因此第一下部突出尖123與第二下部突出尖223更有效地刮掉接觸對象的表面,從而容易去除接觸對象的氧化膜。
By allowing the relative rotation of the first
第一導電接觸針100與第二導電接觸針200可利用在導電性、硬度、彈性中的至少任一者中具有彼此不同的物性的材料
來製作。例如,第一導電接觸針100可為由電導率優異的材料製作的接觸針,且第二導電接觸針200可為由硬度或彈性優異的材料製作的接觸針。製作成單體的導電接觸針在製作導電性、硬度、彈性全部優異的接觸針方面存在限制。其原因在於導電性優異的材質的硬度或彈性低。因此,與製作成單體使用的導電接觸針相比,製作導電性、硬度、彈性優異的接觸針是可能的。
The first
接著,對根據本發明的第二實施例進行闡述。但,以下說明的實施例與所述第一實施例相比而以特徵性的構成要素為中心進行說明,且省略對與第一實施例相同或相似的構成要素的說明。 Next, a second embodiment according to the present invention will be explained. However, in the embodiments described below, compared with the above-mentioned first embodiment, the description will focus on the characteristic components, and the description of the same or similar components as the first embodiment will be omitted.
圖3的(a)、圖3的(b)及圖4是用於說明根據本發明的較佳第二實施例的導電接觸針組合10的圖,圖3的(a)、圖3的(b)是示出在結合前的第一導電接觸針100、第二導電接觸針200的圖,圖4是示出第一導電接觸針100、第二導電接觸針200呈結合的狀態的圖。
(a) of FIG. 3, (b) of FIG. b) is a view showing the first
根據本發明的第二實施例的導電接觸針組合10中,上部結合單元300及下部結合單元400的構成與根據第一實施例的導電接觸針組合10存在差異。
In the conductive
第一導電接觸針100包括具有第一上部孔321的第一上部接觸尖部110與具有第一下部突起421的第一下部接觸尖部120,第二導電接觸針200包括:第二上部接觸尖部210,具有插入至第一上部孔321的第二上部突起322;以及第二下部接觸尖部
220,具有供第一下部突起421插入的第二下部孔422。
The first
將第二上部突起322插入至第一上部孔321構成上部結合單元300,並將第一下部突起421插入至第二下部孔422構成下部結合單元400。
Inserting the second
第一導電接觸針100的第一上部接觸尖部110與第二導電接觸針200的第二上部接觸尖部210藉由上部結合單元300進行結合,第一導電接觸針100的第一下部接觸尖部120與第二導電接觸針200的第二下部接觸尖部220藉由下部結合單元400進行結合。但此處第一彈性主體部130與第二彈性主體部230彼此不結合。
The first
接著,對根據本發明的第三實施例進行闡述。但,以下說明的實施例與所述第一實施例相比而以特徵性的構成要素為中心進行說明,且省略對與第一實施例相同或相似的構成要素的說明。 Next, a third embodiment according to the present invention will be explained. However, in the embodiments described below, compared with the above-mentioned first embodiment, the description will focus on the characteristic components, and the description of the same or similar components as the first embodiment will be omitted.
圖5及圖6是用於說明根據本發明的較佳第三實施例的導電接觸針組合10的圖,圖5是示出在結合前的第一導電接觸針100、第二導電接觸針200的圖,圖6是示出第一導電接觸針100、第二導電接觸針200呈結合的狀態的圖。
5 and 6 are diagrams for illustrating a conductive
根據本發明的第三實施例的導電接觸針組合10中,上部結合單元300及下部結合單元400的構成與根據第一實施例的導電接觸針組合10存在差異。
In the conductive
導電接觸針100包括具有上部孔331的上部接觸尖部110
與具有下部孔431的下部接觸尖部120。
The
上部接觸尖部110包括上部主體111與上部突出尖113。上部主體111在平面上形成為大致四邊形。上部孔331在上部主體111的內側貫通上部主體111而形成。上部孔331的剖面形狀可具有圓形但不限定於此,且可配備為多邊形。上部突出尖113在上部主體111的端部側突出形成且具有尖銳的形狀。
The
下部接觸尖部120包括下部主體121與下部突出尖123。下部主體121在平面上形成為大致四邊形。下部孔431在下部主體121的內側貫通下部主體121而形成。下部孔431的剖面形狀可具有圓形但不限定於此,且可配備為多邊形。下部突出尖123在下部主體121的端部側突出形成且具有尖銳的形狀。
The
彈性主體部130連接上部接觸尖部110與下部接觸尖部120。彈性主體部130包括多個葉片135而構成。各葉片135的一端部連接至上部主體111,而另一端部連接至下部主體121。各葉片135彼此隔開且配備有多個,以使上部主體111與下部主體121進行彈性變形,以彼此接近地移動或彼此遠離地移動。各葉片135具有如字母表「C」字形狀般以兩個端部為基準向一側彎曲的弓形狀。參照圖5,各葉片135具有以兩個端部為基準向左側彎曲的形狀。另一方面與此不同,各葉片235可具有如字母表「C」字反形狀般以兩個端部為基準向一側彎曲的弓形狀。
The
參照圖6,積層多個導電接觸針100,將上部針350插入至多個上部孔331,並將下部針450插入至多個下部孔431。將上
部針350插入至上部孔331構成上部結合單元300,將下部針450插入至下部孔431構成下部結合單元400。第一導電接觸針100的第一上部接觸尖部110與第二導電接觸針200的第二上部接觸尖部210藉由上部結合單元300進行結合,第一導電接觸針100的第一下部接觸尖部120與第二導電接觸針200的第二下部接觸尖部220藉由下部結合單元400進行結合。但此處第一彈性主體部130與第二彈性主體部230彼此不結合。
Referring to FIG. 6 , a plurality of conductive contact pins 100 are stacked,
另一方面,雖於圖中未示出,但於上部針350與下部針450的兩端部可更包括緊固的防脫離部件。防脫離部件可配備於上部針350與下部針450各自的兩端,並將多個導電接觸針100結合為一體型。
On the other hand, although it is not shown in the figure, the two ends of the
由於在根據第三實施例的導電接觸針100的表面上不形成突起且僅形成上部孔331及下部孔431,因此導電接觸針100的製造製程可為簡化的。
Since no protrusion is formed and only the
另外,由於在積層多個導電接觸針100的狀態下插入上部針350與下部針450並一次性結合多個導電接觸針100,因此具有以下優點:即便單個製作的導電接觸針100的厚度薄,亦可自由地調整及改變導電接觸針組合10的整體厚度。
In addition, since the
另外,由於即便多個導電接觸針100中的任一者損壞,亦可抽出上部針350與下部針450後,僅替換損壞的導電接觸針100來構成導電接觸針組合10,因此具有容易維護的優點。
In addition, even if any one of the plurality of conductive contact pins 100 is damaged, the
另外,於多個導電接觸針100中的任一者由電導率優異
的材料製作,其他任一者由彈性優異的材料製作後,可將其等結合構成導電接觸針組合10。如此,可將具有導電性、硬度、彈性等彼此分別不同的物性的多個導電接觸針100進行結合,因此可具有與以單一物性製作使用的導電接觸針相比更有效地發揮的導電性、硬度、彈性等物性。
In addition, any one of the plurality of conductive contact pins 100 is excellent in electrical conductivity
After any one of them is made of materials with excellent elasticity, they can be combined to form the conductive
上文說明的導電接觸針100、200可使用陽極氧化膜材質的模具並藉由MEMS製程來製作。更具體而言,可藉由於形成陽極氧化膜的上表面光阻後,對其進行曝光及顯影以準備具有開口部的陽極氧化膜材質的模具,並利用配備於陽極氧化膜材質的模具下部的晶種層來進行電鍍,從而製作導電接觸針100。此處,陽極氧化膜材質的模具意指對作為母材的金屬進行陽極氧化形成的膜,氣孔意指於對金屬進行陽極氧化形成陽極氧化膜的過程中形成的孔洞。例如,於作為母材的金屬為鋁(Al)或鋁合金的情況,若對母材進行陽極氧化,則於母材的表面形成鋁氧化物(Al2O3)材質的陽極氧化膜。如上所述形成的陽極氧化膜在垂直方向上區分為在內部未形成氣孔(pore)的阻擋層,與在內部形成有氣孔的多孔層。在具有阻擋層與多孔層的陽極氧化膜形成於表面的母材中,若移除母材,則僅保留鋁氧化物(Al2O3)材質的陽極氧化膜。陽極氧化膜可由移除在進行陽極氧化時形成的阻擋層且氣孔沿上、下貫通的結構形成,或者由在進行陽極氧化時形成的阻擋層照原樣保留並將氣孔的上、下中的一端部密閉的結構形成。陽極氧化膜具有2ppm/℃至3ppm/℃的熱膨脹係數。因此,於在高溫
的環境下暴露出的情況,由溫度引起的熱變形少。因此,於導電接觸針100的製作環境即使為高溫環境,亦可製作精密的導電接觸針100而無熱變形。
The conductive contact pins 100 , 200 described above can be manufactured by using an anodic oxide film mold and using a MEMS process. More specifically, after forming a photoresist on the upper surface of the anodized film, exposing and developing it to prepare an anodized film material mold with openings, and using the crystal provided at the lower part of the anodized film material mold The seed layer is electroplated to make the
如上所述,儘管對本發明的較佳實施例進行區分說明,但相應技術領域的普通技術人員可在不脫離下述申請專利範圍所記載的本發明的思想及領域的範圍內對實施例實施各種修改或變形。 As mentioned above, although the preferred embodiments of the present invention are described differently, those of ordinary skill in the corresponding technical field can implement various embodiments within the scope of the ideas and fields of the present invention described in the scope of the following claims. modification or deformation.
100:第一導電接觸針/導電接觸針 100: first conductive contact pin/conductive contact pin
110:第一上部接觸尖部/上部接觸尖部 110: first upper contact tip/upper contact tip
111:第一上部主體/上部主體 111: first upper body/upper body
113:第一上部突出尖/上部突出尖 113: the first upper protruding tip/upper protruding tip
120:第一下部接觸尖部/下部接觸尖部 120: first lower contact tip/lower contact tip
121:第一下部主體/下部主體 121: First lower body/lower body
123:第一下部突出尖/下部突出尖 123: the first lower protruding tip/lower protruding tip
130:第一彈性主體部/彈性主體部 130: first elastic body part/elastic body part
135、235:葉片 135, 235: blade
200:第二導電接觸針/導電接觸針 200: second conductive contact pin/conductive contact pin
210:第二上部接觸尖部 210: second upper contact tip
211:第二上部主體 211: second upper body
213:第二上部突出尖 213: second upper protruding tip
220:第二下部接觸尖部 220: second lower contact tip
221:第二下部主體 221: second lower body
223:第二下部突出尖 223: second lower protruding tip
230:第二彈性主體部 230: second elastic body part
311:第一上部突起/突起 311: First upper protrusion/protrusion
312:第二上部孔/孔 312: Second upper hole/hole
411:第一下部突起/突起 411: First lower protrusion/protrusion
412:第二下部孔/孔 412: Second lower hole/hole
Claims (12)
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100781395B1 (en) * | 2006-09-01 | 2007-12-03 | (주)넴스프로브 | Assembly for probe beam |
JP4884753B2 (en) * | 2005-11-22 | 2012-02-29 | 日本発條株式会社 | Conductive contact unit and conductive contact |
TW201221962A (en) * | 2010-11-22 | 2012-06-01 | Pleader Yamaichi Co Ltd | Structure of high frequency vertical elastic piece probe card |
TWI435085B (en) * | 2012-02-06 | 2014-04-21 | Pleader Yamaichi Co Ltd | High frequency vertical shrapnel probe card structure |
KR101799309B1 (en) * | 2016-07-25 | 2017-12-20 | (주) 루켄테크놀러지스 | Probe pin and device testing apparatus having the same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060023250A (en) * | 2004-09-09 | 2006-03-14 | 주식회사 세디콘 | Probe block of lcd inspection system |
KR100623920B1 (en) * | 2005-07-07 | 2006-09-19 | 전자부품연구원 | A probe card with replaceable of hybrid type probe and a manufacturing method thereof |
KR100647131B1 (en) | 2005-07-12 | 2006-11-23 | 리노공업주식회사 | probe and manufacturing method thereof |
KR100659944B1 (en) | 2005-12-23 | 2006-12-21 | 리노공업주식회사 | A plunger and a probe employing that |
KR101328461B1 (en) | 2013-06-20 | 2013-11-12 | 주식회사 신명전자 | Alignment apparatus for surface mounted device |
KR102018784B1 (en) * | 2013-08-13 | 2019-09-05 | (주)위드멤스 | Method for testing electrode circuit pin and electrode circuit testing pin using the same |
US10908182B2 (en) | 2016-06-28 | 2021-02-02 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus and contact |
KR101860519B1 (en) | 2017-05-02 | 2018-05-24 | 주식회사 마이크로이즈 | Electrically conductive probe device and method for manufacturing the same |
-
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-
2022
- 2022-02-21 WO PCT/KR2022/002513 patent/WO2022177388A1/en active Application Filing
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4884753B2 (en) * | 2005-11-22 | 2012-02-29 | 日本発條株式会社 | Conductive contact unit and conductive contact |
KR100781395B1 (en) * | 2006-09-01 | 2007-12-03 | (주)넴스프로브 | Assembly for probe beam |
TW201221962A (en) * | 2010-11-22 | 2012-06-01 | Pleader Yamaichi Co Ltd | Structure of high frequency vertical elastic piece probe card |
TWI435085B (en) * | 2012-02-06 | 2014-04-21 | Pleader Yamaichi Co Ltd | High frequency vertical shrapnel probe card structure |
KR101799309B1 (en) * | 2016-07-25 | 2017-12-20 | (주) 루켄테크놀러지스 | Probe pin and device testing apparatus having the same |
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