TWI435085B - High frequency vertical shrapnel probe card structure - Google Patents

Description

High frequency vertical type elastic probe card structure

The invention relates to the technical field of a probe card, in particular to a micro-probe high-frequency vertical type elastic probe card structure, which can be applied to a high-frequency, high-speed wafer testing device, and can be longitudinally compressed. Resilience to maintain good contact during testing.

Before the wafers in the semiconductor industry are packaged, they must be supplemented with relevant test instruments and software programs. The bare crystals are used for various functional tests of the probes, and then the good and bad products are screened out, and the good products are then processed. Packaging engineering.

As the integrated circuit process continues to evolve, the line width and spacing between circuits are shrinking, and the probe requirements used in the test are also changed from a cantilever probe with a curved tip and a lateral position to a smaller needle diameter. A vertical probe that is denser and has a narrower spacing between the probe and the probe. As shown in Figure 1, it is a perspective view of the appearance of the prior art. The conventional probe 9 is composed of a first contact member 91, a second contact member 92, and a probe body portion 90. The first contact member 91 and the second contact member 92 are external members such as a circuit board. Or the electrical contact of the wafer to be tested is detected by electrical contact, and the probe body 90 is connected to one end of the first contact member 91 and the second contact member 92, and has a plurality of elastic bodies. 901 and a plurality of plates 902 for increasing the elasticity of the longitudinally and vertically compressing the conventional probe 9. The plate 902 is for supporting the suspension of the elastic body 901. The amount of straight deformability, thus, completes a conventional probe 9.

However, the conventional probe design described above still has problems that have not been overcome conventionally. Conventional probes have elastomers and plates for supporting the force of vertical compression when conventional probes are used, but they still have the limit. The probe is too weak, and there is a risk of breaking the needle; in addition, the two ends (ie, the first contact and the second contact) are electrically connected to the external member, and when the current passes, it is too large, which may cause Conventional probes cause the elastomer to overheat due to the passage of a large current, causing the elastomer to be permanently plastically deformed; and in view of this, the inventors have proposed a high frequency vertical dome probe card structure to improve the above problems.

One of the objects of the present invention is to provide a high frequency vertical type of elastic probe card structure, which is an innovative design of a micro probe structure and can be used in a high frequency and high speed wafer test apparatus.

Another object of the present invention is to provide a high-frequency vertical type elastic probe card structure, which is capable of manufacturing a multi-layer probe or a micro-electro-mechanical system (MEMS). The Lithographie GaVanoformung Abformung (LIGA) process is used to achieve rapid generation and simplified process.

In order to achieve the above object, according to the present invention, there is provided a high frequency vertical type elastic probe card structure, wherein each of the two ends of each probe has at least one first contact member and second contact member as a compression and external member. a contact point for electrical connection, The first contact member is connected with a hollow probe, which is an integrally formed probe, and is composed of at least one probe elastic layer and a probe plate layer, and each layer is described as follows: at least one probe elastic piece The layer has at least one plate and at least one elastic body connected to each other; the probe plate layer has at least one plate, and the center of the probe plate layer is a central hole; each of the probe elastic layers is opposite to each other, the probe The plate layer is sandwiched between the two probe shrapnel layers, and the layers of the probe are generated according to the MEMS process to form a hollow probe; and a probe center column having a columnar body and a columnar shape One end of the body is located at the center of the hollow probe described herein, and the other end of the column is connected to the second contact member; thus, the hollow probe is combined with the center column of the probe to complete the probe design of the present invention.

The invention provides a high frequency vertical type elastic probe card structure, which has the following advantages:

(1) The high-frequency vertical shrapnel probe card structure utilizes the advanced process technology (such as LIGA process) to make the probe grow up, greatly eliminating the need for manual assembly after traditional machining. And cost.

(2) According to the description of the advantages, compared with the traditional processing, it is impossible to ensure that all the needles can stably contact the contact points. The advanced process technology makes the probe grow and grow, and the flatness is also better than the traditional probe. High to increase stability during testing.

(3) The hollow probe design of the high-frequency vertical type elastic probe card structure is improved, and the previous thin probe is modified, and a probe plate layer is sandwiched between the two probe elastic layers, so that the appearance of the probe is relatively strong, Increase the change that can be withstood when pressed Shape.

(4) The probe center column design of the high-frequency vertical type elastic probe card structure, and the insertion of a probe center column in the hollow probe to disperse the problem of overheating of the current passing through the electrical contact, the probe The center column can assist the elastic current of the hollow probe to stabilize the current, and the current passed by the hollow probe is not deformed due to overheating of the temperature, which can help prolong the life of the probe.

In order to enable the review committee to have a better understanding of the creation and to enable personnel in the same technical field to implement it according to the contents and implementation of the specification, it is preferred to cooperate with the drawings and the same components. The components are denoted by reference numerals, and the contents of the present invention will be described in detail later.

Please refer to the second figure, which is a perspective view of the appearance of the present invention. The probe 1 of the present invention has a first contact 11, a second contact 12, a hollow probe 4, and a probe center post 5. The first contact member 11 and the second contact member 12 are used as a contact range for making electrical contact with an external member (for example, a circuit board, an IC chip) when vertically compressed, and the first contact member 11 is connected thereto. The hollow probes 4 are connected to each other and integrally formed. The hollow probes 4 are made by a Micro-Electro-Mechanical System (MEMS) lithography (Lithographie GaVanoformung Abformung; LIGA) technology. The multi-layer probe is integrally formed; the probe center column 5 is located at the center of the hollow probe 4, and the other end of the probe center column 5 is connected with a second contact 12 and The member is electrically contacted, and the probe center post 5 is integrally formed with the second contact member 12. In addition, the flat design of the probe 1 is arranged in parallel, and the plane of the arrangement is the side of the probe (ie, the surface of the probe having a small surface area), and the components or circuits to be tested can be in the same area by the neat parallel arrangement. A greater number of probes 1 can be placed on the board to fulfill the needs of thousands of probe test devices.

Please refer to the second and third figures, which are perspective views of the outer perspective view of the present invention and the layered structure of the hollow probe of the present invention. The hollow probe 4 is sequentially grown by the probe elastic layer 2 and the probe plate layer 3, and in the embodiment, the hollow probe 4 is composed of a two-probe elastic layer 2 and a probe. The needle plate layer 3 is composed of a plurality of elastic bodies 201 and a plurality of plates 202 connected to each other by a plurality of elastic bodies 201, and the elastic body 201 is used to increase the When the needle 1 is subjected to the force of the vertical compression, the reaction force after the pressure is buffered, and the elasticity of the probe is extended. The plate 202 is used to support the elastic body 201 to maintain the upright probe after being subjected to a stress. The probe is not excessively bent to cause distortion of the probe. Further, the probe elastic layer 2 is provided with a force limiting protrusion 203 at the curved opening of the elastic body 201 to strengthen the support of the elastic body 201 when the probe is subjected to a stress. When reaching the limit of the elastic bending, the upper and lower force limiting protrusions 203 touch each other, and the elastic body 201 stops acting to stabilize the benign contact between the probe 1 and the external member; the probe plate layer 3 is composed of A plurality of blocks 302 are formed, and the blocks 302 are not connected and have a part Space for the elastomer 201 of the probe shrapnel layer 2, and a central hole for the probe center post 5 to be stored; by MEMS process (Micro-Electro-Mechanical System, MEMS) Lithographie GaVanoformung Abformung (LIGA) technology layering, which is a probe shrapnel layer 2, a probe plate layer 3, and a probe shrapnel layer 2, The layer is grown in such a way that the hollow probe 4 of one of the designs of the present invention is completed. This embodiment is merely an example of a preferred embodiment. Any method for increasing or decreasing the number of layers is not limited thereto. The probe shrapnel layers 2 are opposite to each other. The plate layer 3 is sandwiched between the two probe shrapnel layers 2 to form a hollow probe 4.

Please refer to the fourth figure, which is a schematic diagram of the hollow probe and the probe central column of the present invention. To combine the probe 1 of the present invention, it consists of the construction of two parts (i.e., the hollow probe 4 and the probe center column 5), the grouping of which is illustrated in this paragraph. In the figure, the hollow probe 4 is composed of probes of the respective layers of the third figure. The probe body 40 of the hollow probe 4 also has a first contact member 11, an elastic body 401, a plate 402, and a force limiting protrusion. The object 403 and the columnar housing space 404. The plurality of elastic bodies 401, the plurality of plates 402, and the plurality of force limiting protrusions 403 of the hollow probe 4 are an assembly of the probes of the respective layers, and the components are all from the probe of the third figure. The elastic body 201 of the elastic layer 2, the plate 202, and the force limiting protrusion 203 come and have the same effect, and therefore will not be further described herein. The probe center post 5 is provided with a second contact member 12 for electrically contacting the external member. The probe body portion 50 of the probe center post 5 has a columnar body 501. The probe center column 5 can be inserted, placed or assembled into the integrally formed hollow probe 4, thus operating To complete the design of the high frequency vertical dome probe card structure of the present invention, the combined completion diagram is presented in its fifth diagram.

Please refer to the fifth figure, which is a schematic diagram of the stereoscopic naked eye of the probe of the present invention. The probe 1 of the fifth figure is the finished probe product after the hollow probe 4 of the fourth figure is assembled with the probe center column 5. The probe center column 5 is provided with a columnar body 501, and one end of the columnar body 501 is placed in the center of the hollow probe 4, that is, in the position of the columnar body accommodating space 404. The probe center column 5 The first contact member 11 is connected to the inside of the hollow probe, and the other end of the column 501 is connected to the second contact member 12. The probe center column 5 is designed to have a stable current effect. . When the probe 1 is compressed by the vertical direction of the external force, the first contact 11 and the second contact 12 are in contact with the external member, and conduct current through the probe 1, which has the elastic body 401 Can withstand greater compression force, and when the pressure is too large, the force limiting protrusion 403 will limit the degree of bending of the elastic body 401, in addition, there is a plate 402 to support the stability of the elastic body 401 and the integral probe 1 Sex, designed to stabilize the stability of the overall probe during operation, making assembly simple, effectively stabilizing current, robust probe structure, and extending probe life.

Please refer to the sixth figure, which is a schematic diagram of the present invention for use on a probe card. The probe card 6 has a circuit board 61, a fixing unit 63, and a plurality of probes 1 of the present invention. The probes of the probe card 6 are all the probes 1 of the present invention, and are presented only in different degrees of perspective. The left and right sides are sequentially an elastic right-bend probe, a probe center-column naked-view probe, Elastomer left-bend probe, full-naked probe. The circuit board 61 is combined with the fixing unit 63 and the signal contact metal pad 62. The fixing unit 63 is formed with a plurality of accommodating spaces 631 under the circuit board 61, and the accommodating space 631 is provided for the plurality of probes 1 Mounted therein by the fixing unit 63 to fix the position of the probe 1 in the probe card 6, while also restricting the plurality of probes 1 from being pressed only in the vertical direction and unable to move in the lateral or other directions. When the probe 1 is fixed, the second contact 12 is electrically connected to the signal metal pad 62 on the circuit board 61 to electrically connect the plurality of probes 1 and the circuit of the circuit board 61. When the test is performed, the probe card 6 is moved on the test machine so that the probe 1 of the probe card 6 is close to the component 7 to be tested (for example, a test device such as a chip or a circuit board), and the probe 1 should be The first contact member 11 makes direct electrical signal contact with the object to be tested 71 (for example, a solder ball) on the device under test 7 to screen out the quality of the device to be tested 7. The circuit board 61 and the fixing unit 63 can be combined by a screwing device or other auxiliary fixing device, whereby the present invention can be applied to the use of a probe card product. The probe 1 of the present invention can be used in many products, and the description of one of the examples is currently only used, but does not limit the scope of application of the present invention.

The present invention does not limit the probe 1 to be in contact with the object to be tested 71 of the device under test 7 by the first contact member 11, in other words, the probe 1 can be reversely mounted, with the second contact member 12 and The object to be tested 71 of the element to be tested 7 is in contact with each other. In addition, the probe 1 of the present invention can also be mounted between two circuit boards for electrical and signal transmission. In addition, the contact tip (this embodiment means the first contact 11) is also in the shape of a double pointed shape. For example, but the shape of the contact tip is not limited to this. It is required to design a different shape as long as the shape can conform to a good contact state when the probe is electrically connected to the external member, so that the signal transmission can be stabilized; and the number of the first contact member 11 and the second contact member 12 is There is also no limit to one, and the number of tips can be determined according to the shape of the probe of the stacked layer.

It is to be noted that the above-described embodiments are merely illustrative of the principles of the invention and its advantages, and are not intended to limit the scope of the invention. Modifications and variations of the embodiments of the invention may be made without departing from the spirit and scope of the invention. Covered by the scope of patents. Therefore, the scope of protection of the present invention should be as described in the appended claims.

1‧‧‧ probe

11‧‧‧First contact

6‧‧‧ Probe Card

61‧‧‧ boards

12‧‧‧Second contact

2‧‧‧Probe shrapnel

20, 40, 50‧‧‧ probe body

201, 401‧‧‧ Elastomers

202, 402‧‧‧ plates

203, 403‧‧‧ force limiting protrusions

3‧‧‧Probe plate layer

302‧‧‧ plates

4‧‧‧ hollow probe

404‧‧‧ columnar housing space

5‧‧‧ probe center column

501‧‧‧ columnar body

62‧‧‧ Signal metal pad

63‧‧‧Fixed unit

631‧‧‧ accommodating space

7‧‧‧Device under test

71‧‧‧Test object

9‧‧‧Learning probe

90‧‧‧ Probe body

91‧‧‧First contact

901‧‧‧ Elastomer

902‧‧‧ plates

92‧‧‧Second contact

The first figure is a perspective view of the appearance of the prior art; the second figure is a perspective view of the appearance of the present invention; the third figure is a perspective view of the layered structure of the hollow probe of the present invention; and the fourth figure is the hollow view of the present invention. The schematic diagram of the needle and the probe center column; the fifth figure is a schematic diagram of the stereoscopic naked eye of the probe of the present invention; and the sixth figure is a schematic diagram of the invention used on the probe card.

1‧‧‧ probe

11‧‧‧First contact

12‧‧‧Second contact

4‧‧‧ hollow probe

401‧‧‧ Elastomers

402‧‧‧ plates

403‧‧‧force limiting protrusions

404‧‧‧ columnar housing space

5‧‧‧ probe center column

501‧‧‧ columnar body

Claims (6)

A high-frequency vertical type elastic probe card structure, wherein each of the two ends of the probe has at least one first contact member and a second contact member as contact points for electrically connecting with the external member during compression, The first contact member is connected with a hollow probe, which is an integrally formed probe, which is composed of at least one probe elastic layer and a probe plate layer: the at least one probe elastic layer has At least one plate and at least one elastic body are connected to each other; the probe plate layer has at least one plate with a central hole in the middle; the probe elastic layers are opposite to each other, and the probe plate layer is sandwiched Between the two probe shrapnel layers to form a hollow probe; a probe center column, the probe center column has a columnar body, one end of the column body is located at the center of the hollow probe, the column body The other end is connected to the second contact. The high frequency vertical shrapnel probe card structure according to claim 1, wherein the probes are microlithography deep etched by Micro-Electro-Mechanical System (MEMS) (Lithographie GaVanoformung Abformung) Multilayer probe made by LIGA technology. The high frequency vertical type elastic probe card structure according to claim 1, wherein the elastic system of the probe elastic layer has at least one force limiting protrusion. The high frequency vertical type elastic probe card structure according to claim 1, wherein the probe center column is placed in the integrally formed hollow probe. The high frequency vertical type elastic probe card structure according to claim 1, wherein the first contact piece is integrally formed with the hollow probe. The high frequency vertical type elastic probe card structure according to claim 1, wherein the second contact piece is integrally formed with the probe center column.