KR20170036510A

KR20170036510A - Interconnect structure and probe card having the same

Info

Publication number: KR20170036510A
Application number: KR1020150135776A
Authority: KR
Inventors: 황규호; 박영근; 김광호
Original assignee: (주)엠투엔
Priority date: 2015-09-24
Filing date: 2015-09-24
Publication date: 2017-04-03
Also published as: KR101785591B1

Abstract

An interconnect structure according to an aspect of the present invention includes a first contactor having a lower tip part and a first contact part formed upwardly from the lower tip part and having an upper opened sliding groove; a second contact part which has a lower part inserted into the sliding groove, a stepped part extended upward from the second contact part, and a second contactor including an upper tip extended upwardly of the stepped part; and an elastic member inserted into the second contact part and having a lower end touching the upper surface of the first contact part. The outer surface of the first contact part is in surface contact with the inner surface of the sliding groove. So, the physical and electrical characteristics of a probe card can be improved.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an interconnect structure and a probe card including the same,

The present invention relates to an interconnect structure and a probe card including the same.

In general, the semiconductor package is finally subjected to characteristic measurement or defect inspection through various electrical tests by an inspection apparatus. In this defect inspection, a probe card, a test socket, or the like is used to electrically connect the electronic device and the inspection apparatus, and the probe card and the test socket include an interconnect structure for driving between the electronic device and the inspection apparatus.

The conventional interconnect structure includes an upper probe pin, a lower probe pin spaced apart from the upper probe pin and disposed below the upper probe pin, an elastic member positioned between the upper probe pin and the lower probe pin, And a housing surrounding the pin and spring.

This interconnect structure is made along the point of contact between the upper probe pin, the spring, the housing and the lower probe pin, through which the electrical signal is transmitted through the tilting of the spring. Also, according to this, since the movement path of the electrical signal is formed sequentially or inversely along the upper probe pin, the spring, the housing, and the lower probe pin, the movement path of the electrical signal is complicated. In addition, there is a problem that the travel path of the electrical signal is complicated, the inspection time of the semiconductor package is long, and the impedance matching section is reduced.

In addition, in the conventional interconnect structure, a housing must be provided for the transmission of electrical signals. In order to transmit electrical signals, a tilting of the spring is required. In order to induce the tilting of the spring, the overall length of the interconnect structure is required to be more than a certain length, and a spring located between the upper probe pin and the lower probe pin And the overall length of the interconnect structure is increased due to the length. Such a requirement for length limits the scratch length of the interconnect structure. In addition, the increase in length required for the interconnect structure also caused a problem of increasing the travel time of the electrical signal.

Further, according to such an interconnect structure, an electrical signal is transmitted by point contact between the upper probe pin, the spring, the housing, and the lower profile pin, so that the occurrence rate of the noise during the transmission of the electrical signal is high and the transferability is low.

In order to solve the problems of the conventional interconnect structure, Korean Patent Laid-Open Publication No. 10-2015-0053480 (entitled "Inner Bridge Type Spring Probe Pin" with an enlarged tolerance) has a first connecting leg portion formed on at least one side thereof A first probe having a first external contact formed on the other side thereof; A second probe having a second connection leg formed at least on one side and a second external contact on the other side; And a coil spring elastically supporting the first and second probes in a state in which the first and second connection legs are inserted in an interpolating manner.

However, as the thickness of the first and second connecting legs located in the coil spring becomes thinner as the fine pitch is required, the rigidity of the first and second connecting legs is reduced, and the contact force is reduced The performance of the interconnect structure is reduced. In addition, such an interconnect structure has a problem in that first and second connection leg portions which are in contact with each other when the high current is applied are broken.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an interconnect structure complementary to the physical and electrical characteristics of a probe card and a probe card including the same.

According to an aspect of the present invention, there is provided an interconnect structure comprising a lower tip portion and a first contact portion extending upward from the lower tip portion and having an upper opened sliding groove, A first contactor; A second contact portion into which a lower portion is inserted into the sliding groove, a step portion extending upward from the second contact portion, A second contactor including an upper tip extending upwardly from the stepped portion; And an elastic member which is inserted in the second contact portion and whose lower end is in contact with the upper surface of the first contact portion, wherein the outer side surface of the first contact portion and the inner side surface of the sliding groove are in surface contact.

According to the above-mentioned problem solving means of the present invention, since the entire space in the inner diameter of the elastic member can be used, the rigidity of the contact portion can be improved, and the effect of improving the physical and electrical characteristics of the interconnect structure have.

1 is a perspective view of an interconnect structure according to an embodiment of the present invention.
2 is a front view of an interconnect structure according to an embodiment of the invention.
3 is an exploded perspective view of an interconnect structure according to an embodiment of the present invention.
4 is a cross-sectional view taken along the line A-A 'in Fig.
5 is a perspective view of a probe card according to an embodiment of the present invention.
6 is a cross-sectional view of a probe card according to an embodiment of the present invention.
7 is a plan view of a laminate according to an embodiment of the present invention.
8 is a perspective view of a probe card according to another embodiment of the present invention.
9 is a plan view of a laminate according to another embodiment of the present invention.
10 is a view for explaining a method of manufacturing a connector according to an embodiment of the present invention.
11 is a view for explaining a method of manufacturing a laminate according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. It should be understood, however, that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the same reference numbers are used throughout the specification to refer to the same or like parts.

Throughout this specification, when a part is referred to as being "connected" to another part, it is not limited to a case where it is "directly connected" but also includes the case where it is "electrically connected" do.

Throughout this specification, when a member is " on " another member, it includes not only when the member is in contact with the other member, but also when there is another member between the two members.

Throughout this specification, when an element is referred to as "including " an element, it is understood that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise. The terms "about "," substantially ", etc. used to the extent that they are used throughout the specification are intended to be taken to mean the approximation of the manufacturing and material tolerances inherent in the stated sense, Accurate or absolute numbers are used to help prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure. The word " step (or step) "or" step "used to the extent that it is used throughout the specification does not mean" step for.

For reference, the terms related to direction and position (upper, upper, lower, lower, etc.) in the description of the embodiments of the present application are set based on the arrangement state of each structure shown in the drawings. For example, referring to Fig. 1, the 12 o'clock direction as a whole may be the upper side, the end portion facing the 12 o'clock direction as a whole, the lower side as the 6 o'clock direction as a whole, have.

The present invention relates to an interconnect structure 100 and a probe card 10 comprising the same.

1 is a perspective view of an interconnect structure according to an embodiment of the present invention, FIG. 2 is a front view of an interconnect structure according to an embodiment of the present invention, and FIG. 3 is a cross- FIG. 5 is a perspective view of a probe card according to an embodiment of the present invention, FIG. 6 is a perspective view of a probe card according to an embodiment of the present invention, FIG. 8 is a perspective view of a probe card according to another embodiment of the present invention, and FIG. 9 is a cross-sectional view of a laminated body according to another embodiment of the present invention, FIG. 7 is a plan view of a laminated body according to an embodiment of the present invention, FIG. 10 is a view for explaining a method of manufacturing a connector according to an embodiment of the present invention, and FIG. 11 is a view for explaining a method of manufacturing a laminated body according to an embodiment of the present invention.

First, an interconnection structure 100 (hereinafter referred to as 'the present interconnection structure 100') according to an embodiment of the present invention will be described.

The interconnect structure 100 electrically connects the semiconductor package and the inspection apparatus.

1 to 3, the interconnect structure 100 includes a first contactor 110, a second contactor 120, and an elastic member 130.

The interconnect structure 100 includes an elastic member 130 positioned between the first contactor 110 and the second contactor 120 and between the first and second contactors 110 and 120 to elastically support the contactor 110 .

The lower end of the first contactor 110 may be in contact with the semiconductor package and the upper end of the second contactor 120 may be in contact with the testing device, The upper end of the second contactor 120 may be in contact with the semiconductor package.

The first contactor 110 may be formed in a plate shape. That is, the cross section in the horizontal direction may be a square. The first contactor 110 includes a first contact portion 112 extending upward from the lower tip portion 111 and the lower tip portion 111 and having a sliding groove 113 opened at an upper portion thereof.

The lower tip portion 111 may be in contact with the semiconductor package or the inspection apparatus at the lower end thereof and the upper end may be connected to the first contact portion 112. For example, the lower end of the lower tip portion 111 may be formed in a V shape having a protruding central portion. However, the lower portion may be formed in various shapes to contact the semiconductor package or the inspection apparatus.

The first contact portion 112 may extend upward from the lower tip portion 111 and may have a length greater than the width of the lower tip portion 111 to have a first step 114.

The above-mentioned widths may be the 4 o'clock and 10 o'clock directions of Fig. 1 or the 3 o'clock and 9 o'clock directions of Fig.

The first contact portion 112 has the first step 114 so that the first contact portion 112 can be prevented from moving in the downward direction when inserted into the hole of the housing 200 described later. A detailed description thereof will be given later.

The first contact portion 112 includes a sliding groove 113 extending in the longitudinal direction and formed in an open top shape.

The longitudinal direction described above may be the 12 o'clock direction and the 6 o'clock direction in Fig.

The second contactor 120 may be formed in a plate shape. That is, the cross section in the horizontal direction may be a square. The second contactor 120 includes a second contact portion 121 into which the lower portion is inserted into the sliding groove 113, a step portion 122 extending upward from the second contact portion 121, And an upper tip portion 123 extending upward from the upper portion.

The elastic member 130 may be inserted into the second contact portion 121 and the lower end may be in contact with the upper surface of the first contact portion 112 and the upper end may be in contact with the lower surface of the step portion 122. Accordingly, the first and second contactors 110 and 120 can be elastically supported by the elastic member 130. Illustratively, the resilient member 130 may be a coil spring.

The second contact portion 121 is inserted into the sliding groove 113 formed in the first contact portion 112 so that the outer surface of the first contact portion 112 and the inner surface of the sliding groove 113 can be in surface contact. In other words, the first contactor 110 and the second contactor have the same plane axis, and the second contact portion 121 is inserted into the sliding groove 113, and the outer surface of the first contact portion 112 and the outer surface of the sliding contact So that the inner surface of the base 113 can be in surface contact.

2, the second contact portion 121 passes through the elastic member 130, and the lower portion of the second contact portion 121 is located in the sliding groove 113 and can be slid along the sliding groove 113.

Specifically, the second contact portion 121 moves along the sliding groove 113 as the first contactor 110 or the second contactor 120 is pressed, and the outer surface of the second contact portion 121 moves along the sliding groove 113 To the inner side surface of the base plate.

The length of the sliding groove 113 is set to a length sufficient to prevent the lower end of the second contact portion 121 from contacting the bottom surface of the sliding groove 113 when the elastic member 130 is compressed . In other words, the length of the sliding groove 113 can satisfy Equation (1) below.

A: The length of the sliding groove 113

B: length of the most compressed elastic member 130

C: length of the second contact portion 121

The outer surface of the second contact portion 121 may be a surface located at 3 o'clock and 9 o'clock in Fig.

At this time, the upper end of the first contact portion 112 may be inclined inward to contact the lower end of the elastic member 130, as shown in FIG.

The elastic member 130 presses the inclined surface formed on the upper portion of the first contact portion 112 as the first contactor 110 or the second contactor 120 is pressed, 110 or the second contactor 120 can be moved in the left or right direction. The outer surface of the first contact portion 112 and the inner surface of the sliding groove 113 are in surface contact with each other so that the first contactor 110 and the second contactor 120 stably receive the electric signals .

Since the first contact portion 112 and the second contact portion 121 are in surface contact with each other, the present interconnect structure 100 can improve the resistance characteristics and the current characteristics as compared with the conventional interconnect structures.

The interconnection structure 100 is inserted into the second contact portions 121 and the sliding grooves 113 of the first contact portions 112 and is in surface contact with each other so that the length of the interconnection structure 100 can be minimized have. In addition, the stroke length can be maximized.

As described above, the interconnect structure 100 improves the stroke length while minimizing the overall length, thereby ensuring high frequency bandwidth, low inductance, and high current electrical characteristics. .

The second contact portions 121 may be formed in various shapes as shown in FIG. In addition, the sliding groove 113 into which the second contact portion 121 is inserted may be formed to correspond to the shape of the second contact portion 113.

Illustratively, the second contact portion 121 may have a rectangular cross section in the horizontal direction, as shown in Fig. 4 (a). In other words, the side surface of the second contact portion 121, that is, the surface located in the 3 o'clock direction and the 9 o'clock direction in Fig. 4, can be brought into contact with the inner surface of the sliding groove 113. [

4 (b), the second contact portions 121 may be formed in a trapezoidal shape in the horizontal direction. When the second contact portions 121 are formed in a trapezoidal shape, the contact area is wider than the rectangular shape, so that the electrical characteristics can be improved.

4 (c), the second contact portion 121 may be formed such that a cross section thereof is formed in a trapezoidal shape in the horizontal direction, and at least a part of the second contact portion 121 protrudes outside the sliding groove 113. The second contact portion 121 may further include a step portion 1121 that protrudes outward from an edge protruding outward from the sliding groove 113 and contacts the rear surface of the first contact portion 112 .

The horizontal direction may be a direction perpendicular to the longitudinal direction of the interconnect structure 100.

At this time, the second contact portion 121 contacts the inner surface of the sliding groove 113 and the rear surface of the first contact portion 112, thereby maximizing the contact area.

The first and second contactors 110 and 120 are planar and the first and second contactors 110 and 120 are easily planarized by an etching process and a patterning process for the substrate . In other words, since the interconnect structure 100 can be manufactured through a simple process, it is possible to secure a competitive price of the process cost as compared with the conventional interconnect structure.

The above-described front surface can be the 8 o'clock direction of Fig. 1, and the rear surface can be the 2 o'clock direction of Fig.

The first and second contactors 110 and 120 are manufactured through MEMS (Micro Electro Mechanical Systems) process on the planar member. The first contactor 110 and the second contactor 110 are formed on the lower tip 111 of the first contactor 110, 2 upper tip portion 123 of the contactor 120 may be formed to have a fine pitch.

Hereinafter, a probe card 10 according to an embodiment of the present invention will be described with reference to FIGS. 5 to 7. FIG.

The probe card 10 according to an embodiment of the present invention includes a plurality of interconnection structures 100 and a plurality of insertion holes 211, 221, 231, and 241 into which the plurality of interconnection structures 100 are inserted And a housing (200).

In addition, the interconnect structure 100 may be located in the form of an M * N matrix.

Illustratively, the interconnect structure 100 may be positioned in a 3 * 3 form, as shown in FIG. 5, but it is not so limited and may be modified into various forms depending on the type of semiconductor package.

The housing 200 may be formed by stacking a plurality of stacked bodies 210, 220, 230, and 240.

In other words, the housing 200 may include a first laminate 210, a second laminate 220, a third laminate 230, and a fourth laminate 240.

The first layered body 210 may include a plurality of first holes 211 into which the lower tip portion 111 of the first contactor 110 is inserted. The first contactor 110 can be guided to move up and down by inserting the lower tip 111 of the first contactor 110 into the first hole 211. 7A, the first hole 211 may be formed in a rectangular shape corresponding to the lower tip portion 111 of the first contactor 110. As shown in FIG.

The second stack body 220 may include a plurality of second holes 221 into which the first contact portions 112 of the first contactor 110 are inserted. 7B, the second hole may have a rectangular shape corresponding to the first contact portion 112, and may have a rectangular shape larger than the first hole 211 .

When the first contactor 110 is inserted into the first and second holes 211 and 221, the lower surface of the first contact portion 112 is brought into contact with the upper surface of the first layered body 210, The movement of the first contactor 110 in the downward direction can be blocked and fixed.

The third layered body 230 may include a plurality of third holes 231 into which the elastic member 130 is inserted. 7 (c), the third hole 231 may be formed in a circular shape corresponding to the elastic member 130, and may be formed to have a size sufficient to smoothly move the elastic member 130 As shown in Fig.

The fourth stack 240 may include a plurality of fourth holes into which the upper tips 123 of the second contactor 120 are inserted. 7 (d), the fourth hole 240 may be formed in a rectangular shape corresponding to the upper tip portion 123 of the second contactor 120. As shown in FIG.

In this case, when the second contactor 120 is inserted into the third hole 231 and the fourth hole 241, the upper surface of the step 122 of the second contactor 120 is connected to the fourth stack 240, so that movement of the second contactor 120 in the upward direction can be blocked and fixed.

Hereinafter, a probe card 10 according to another embodiment of the present invention will be described with reference to FIGS. 8 and 9. FIG.

The probe card 10 according to another embodiment of the present invention may be inserted at an angle with the interconnect structure 100 inclined. In addition, the first, second, and fourth holes 211, 221, and 241 may be formed so that the interconnect structure 100 can be inserted at an angle with an inclination.

Illustratively, as shown in FIG. 9, the first, second, and fourth holes 211, 221, and 241 may be formed in a diagonal direction with an angle of 45 degrees. In detail, the housing 200 can be formed in a rectangular parallelepiped shape, and the first, second, and fourth holes 211, 221, and 241, which are perforated in a vertically rectangular shape, And may be formed at an angle of 45 degrees about the central axis to be inserted. In other words, the inner surfaces of the first, second, and fourth holes 211, 221, and 241 and the outer surface of the housing 200 may not be parallel but may be formed at a predetermined angle.

Accordingly, the probe card 10 according to another embodiment of the present invention can use the interconnect structure 100 having a greater thickness and width as compared with the probe card 10 according to the embodiment, The characteristics can be further improved.

Hereinafter, a method of manufacturing an interconnect structure according to an embodiment of the present invention will be described with reference to FIG.

The interconnect structure 100 includes a first contactor 110 and a second contactor 120. Also, the first and second contactors 110 and 120 may be formed through the MEMS process as described above. Accordingly, the first and second contactors 110 and 120 can be realized to have various fine shapes through an electroplating process using a semiconductor fine patterning process as opposed to a conventional interconnect structure, have.

The method of forming the interconnect structure 100 may include forming contactors 110 and 120.

Referring to FIG. 10 (a), the step of forming the contactors 110 and 120 may include the step of preparing the substrate 81. The substrate 81 may be a silicon wafer.

10 (b), the step of forming the contactors 110 and 120 may include the step of forming the seed layer 82. As shown in FIG. 10 (b), the seed layer 82 may be formed on the substrate 81.

As a result, a metal layer 84 described later can be effectively deposited. If the seed layer 84 is not deposited then the metal layer 84 is difficult to deposit on the substrate 81 and the metal layer 84 is deposited on the substrate 81 , At least a part of the metal layer 84 can be separated from the substrate 81. [ Therefore, it is preferable that a step of forming the seed layer 82 on the substrate 81 is performed.

For example, the seed layer 82 may be gold or copper, and the seed layer 340 may be formed by a physical vacuum deposition method used in a general semiconductor manufacturing process such as evaporation or sputtering .

10C, the step of forming the contactors 110 and 120 may include forming a patterned photoresist layer (not shown) corresponding to the shape of the contactors 110 and 120 on the substrate 81 83). &Lt; / RTI > Patterning corresponding to the shapes of the contactors 110 and 120 may mean that the front surface shape of the contactors 110 and 120 shown in FIG. 3 is patterned, for example.

Exemplarily, an entire photoresist layer 83 is deposited on the substrate 81, and then an exposure and development process is performed using a mask having a pattern corresponding to the shape of the contactors 110 and 120 The patterned photoresist layer 83 corresponding to the shape of the contactors 110 and 120 can be formed.

10 (d), the step of forming the contactors 110 and 120 may include the step of forming the metal layer 84 based on the patterned photoresist layer 83 . The metal layer 84 may be made of a material including at least one of Ni and Ni alloys, Au, Cu, and Rho. The metal layer 84 may also be formed by one or more of a plating process, a chemical vapor deposition process (CVD), and a physical vapor deposition process (PVD).

10 (e), the step of forming the contactors 110 and 120 may include the step of polishing the metal layer 84.

The step of polishing the metal layer 84 may polish the metal layer 84 so that the metal layer 84 corresponds to the height of the photoresist layer 83. The metal layer 84 may be polished using a chemical mechanical polishing (CMP) process. According to the chemical mechanical polishing, the thickness of the metal layer 84 can be adjusted. Accordingly, the thickness of the metal layer 84 can have a precise value.

The predetermined thickness of the metal layer 84 may refer to the thickness values of the contactors 110 and 120.

10 (f), the step of forming the contactors 110 and 120 may include the step of removing the photoresist layer 83 and the substrate 81. Thus, only the metal layer 84 can be left, and the remaining metal layer 84 can be the contactors 110 and 120.

In the step of removing the photoresist layer 83 and the substrate 81, a plurality of contactors 110 and 120 formed on the substrate 81 and a plurality of contactors 110 and 120 are formed in a bridge shape As shown in FIG. In this case, the step of removing the photoresist layer 83 and the substrate 81 may separately separate the plurality of contactors 110, 120 connected to each other in the form of a bridge.

Hereinafter, with reference to FIG. 11, a method of manufacturing a laminate according to an embodiment of the present invention will be described.

The laminate manufacturing method may include a step of preparing the substrate 91 as shown in Fig. 11 (a).

11 (b), a plurality of holes of a shape corresponding to the plurality of interconnect structures 100 are formed on the substrate to form a photoresist layer 92 patterned with a plurality of holes .

In addition, the laminate manufacturing method may include the step of forming the hole 95 based on the photoresist layer 92, as shown in Fig. 11 (c).

Also, the laminate manufacturing method may include the step of forming the insulating thin film 93 as shown in Fig. 11 (d).

In the step of forming the insulating thin film 93, the insulating thin film 93 may be formed using thermal oxidation and LPCVD process, and further, the thermally oxidizing and spin coating processes may be performed. Illustratively, the insulating thin film 93 may be a silicon oxide film or a nitride film.

It will be understood by those of ordinary skill in the art that the foregoing description of the embodiments is for illustrative purposes and that those skilled in the art can easily modify the invention without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

10: Probe card
100: probe pin
110: first contactor 111: lower tip
112: first contact portion 113: sliding groove
114: First step
120: second contactor 121: second contact portion
1121:
122: step 123: upper tip
130: elastic member
200: Housing
210: first laminate 211: first hole
220: second laminate 221: second hole
230: third laminate 231: third hole
240: fourth laminate 241: fourth hole

Claims

In the interconnect structure,
A first contactor having a lower tip portion and a first contact portion formed upwardly from the lower tip portion and having a sliding groove opened at an upper portion thereof;
A second contact portion into which a lower portion is inserted into the sliding groove, a step portion extending upward from the second contact portion, A second contactor including an upper tip extending upwardly from the stepped portion; And
And an elastic member inserted into the second contact portion, the lower end of the elastic member contacting the upper surface of the first contact portion,
Wherein an outer surface of the first contact portion and an inner surface of the sliding groove are in surface contact with each other.

The method according to claim 1,
Wherein an upper end of the first contact portion is in contact with a lower end of the elastic member and is formed to be inclined inward.

The method according to claim 1,
The second contact portion is formed in a trapezoidal shape in the horizontal direction,
And the sliding groove is formed in a shape corresponding to the second contact portion.

The method according to claim 1,
Wherein the second contact portion is inserted such that at least a part of the second contact portion protrudes out of the sliding groove,
Further comprising a step portion protruding outwardly from an edge portion protruding outward from the sliding groove of the second contact portion and contacting a side surface of the first contact portion.

The method according to claim 1,
Wherein the length of the sliding groove is greater than or equal to a value obtained by subtracting the length of the elastic member that is compressed at the maximum length from the length of the second contact portion.

The method according to claim 1,
Wherein the first contactor and the second contactor are formed in the shape of a plate and the planar axes are positioned coincident with each other.

In the probe card,
A plurality of interconnect structures according to any one of claims 1 to 6; And
And a housing having a plurality of insertion holes into which the plurality of interconnecting structures are inserted.

8. The method of claim 7,
The housing
A first laminate having a plurality of first holes into which a lower tip portion of the interconnect structure is inserted;
A second laminate having a plurality of second holes into which the first contacts of the interconnect structure are inserted;
A third laminate having a plurality of third holes into which the elastic members of the interconnect structure are inserted; And
And a fourth stack having a plurality of fourth holes into which an upper tip portion of the interconnect structure is inserted.

9. The method of claim 8,
Wherein the first contactor and the second contactor of the interconnect structure are formed in a plate shape,
Wherein the first hole is formed in a rectangular shape corresponding to the lower tip portion,
The second hole is formed in a rectangular shape corresponding to the first contact portion,
The third hole is formed in a circular shape corresponding to the elastic member,
And the fourth hole is formed in a rectangular shape corresponding to the upper tip portion.

10. The method of claim 9,
And the first, second, and fourth holes are formed to be inclined so as to have a predetermined angle about a center axis into which the interconnect structure is inserted.