TW202300929A - The electro-conductive contact pin - Google Patents

Abstract

The present application provides an electrically conductive contact pin having improved physical or electrical properties.

Description

Conductive contact pin

The invention relates to a conductive contact pin.

The conductive contact pin is a contact pin that is in contact with the detection object to detect the detection object, and the conductive contact pin is a contact pin that can be used in a probe card or a detection socket.

Conductive contact pins for probe cards are produced by cutting a thin metal plate with a laser beam. For example, a method of making a probe by cutting a thin metal plate made of a conductive material with a laser beam. The laser beam can cut the metal sheet along the specific contour corresponding to the conductive contact pin, and form sharp edges on the conductive contact pin through different operations. However, the laser cutting technology for fabricating conductive contact pins by cutting a thin metal plate along the contour corresponding to the final shape of the conductive contact pins has the following problems: there are limitations in improving the dimensional precision of the conductive contact pins, and there are limitations in the ability to fabricate the conductive contact pins. There are restrictions on the shape of .

On the other hand, there are spring (pogo) type sockets and rubber (rubber) type sockets in existing detection sockets.

The spring-type socket has the following structure: a coil spring is embedded in a cylinder with a circular cross-section made separately, and a contact pin is formed by combining the upper and lower parts of the coil spring, and the semiconductor package is connected by the plunger and the spring. The external terminal is electrically connected to the terminal of the detection device. The spring-type receptacle is installed by press-fitting the contact pins into the through-holes formed in the case in an interference-fit state. Therefore, it is difficult to make the length of the contact pin less than 3 mm due to the manufacturing process. Although the length of the spring-type receptacle should be shortened in order to correspond to the high-frequency region above the gigahertz (GHz) band, it is difficult to shorten the length of the contact pin due to the spring-type receptacle, so the terminal of the self-detection device will be generated There is a problem that the current path to the external terminal of the semiconductor package becomes long.

In addition, in order to improve the contact effect between the contact pin of the spring-type socket and the contact object, it has a sharp point. However, corresponding to the narrowing of the pitch of the semiconductor package, the size of the external terminal of the semiconductor package is also made small, and the pointed portion of the sharp shape produces a trace or groove pressed into the external terminal of the semiconductor package after inspection. Damage to the contact shape of the external terminals of the semiconductor package causes errors in visual inspection and reduces the reliability of the external terminals in post-soldering processes. Therefore, the existing spring-type sockets are not only unfavorable for high-frequency characteristic inspection of semiconductor packages, but also have limitations in responding to narrower pitches of semiconductor package terminals.

On the other hand, the rubber-type socket has a form in which a plurality of conductive particles are contained in an elastic support plate such as silicon, and has a structure in which contact pins are integrated with the support plate. Because this kind of rubber socket prepares the molding material with conductive particles distributed in the fluid elastic material and inserts the molding material into a specific mold, then applies a magnetic field in the thickness direction to make the conductive particles in the thickness direction. Arranged in the direction to make contact pins, so the length of the contact pins can be shortened. Therefore, the current path from the terminal of the detection device to the terminal of the semiconductor package can be shortened. Since the current path can be shortened, rubber-type sockets are more advantageous in inspecting the high-frequency characteristics of semiconductor packages.

However, if the interval between the magnetic fields is narrowed in order to correspond to the narrowing of the pitch of the external terminals of the semiconductor package, a problem arises that conductive particles are aligned irregularly and signals flow in the planar direction. In addition, since the space between the contact pins is narrowed, the rigidity of the support plate arranged between the adjacent contact pins becomes weak. Furthermore, since the contact stability can only be ensured by pressing such a rubber-type socket with excessive pressing force, the contact pins are deformed in the width direction due to the pressing force and the support plate is pressed in the width direction to deform, thereby There is a problem of damaging the support plate when used for a long time. Therefore, as a rubber-type socket, there is a limitation in responding to the trend of narrow-pitch technology.

In order to solve such problems, a method of manufacturing the conductive contact pins using micro electro mechanical system (MEMS) technology may be considered when manufacturing the conductive contact pins. The process of fabricating conductive contact pins using the MEMS process is described. First, photoresist is coated on the surface of the conductive substrate, and then the photoresist is patterned. Thereafter, the photoresist is used as a mold, the metal material is deposited in the opening by electroplating, and the photoresist and the conductive substrate are removed, so as to obtain the conductive contact pin.

But in fact, until now, the conductive contact pins fabricated by MEMS process cannot further improve their physical or electrical characteristics. [Prior art literature] [Patent Document]

[Patent Document 1] Korean Registration No. 10-0449308 Registered Patent Publication

The present invention is made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a conductive contact pin with further improved physical or electrical characteristics.

In order to achieve the object of the present invention, the conductive contact pin according to the present invention is a conductive contact pin formed by laminating a plurality of metal layers including a first metal layer and a second metal layer, the first metal layer including a first metal layer. And formed in a flat form, the second metal layer includes a second metal and is formed in a flat form, wherein the first metal layer is arranged on the upper surface and the lower surface of the conductive contact pin, and the second metal layer is arranged inside the conductive contact pin, and the first metal layer protrudes from the second metal layer at at least one end of the conductive contact pin, so that the second metal layer is at the one end Do not come into contact with contact objects.

In addition, the first metal layer and the second metal layer are alternately laminated.

In addition, the first metal is a metal having relatively higher wear resistance or strength than the second metal, and the second metal is a metal having relatively higher electrical conductivity than the first metal.

In addition, the first metal includes a metal selected from rhodium (Rh), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), Phosphorus (P) or alloys thereof, or palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys or nickel-phosphorus (NiP) alloys, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloys , and the second metal includes a metal selected from an alloy of copper (Cu), silver (Ag), gold (Au) or the like.

In addition, the one end is at least any one of both ends in the length direction of the conductive contact pin, or at least any one of both ends in the width direction of the conductive contact pin .

On the other hand, the conductive contact pin according to the present invention is a conductive contact pin formed by laminating a plurality of metal layers including a first metal layer and a second metal layer, the first metal layer including a first metal and formed in a flat plate form. , the second metal layer includes a second metal and is formed in the form of a flat plate, wherein the first metal layer is arranged on the upper surface and the lower surface of the conductive contact pin, and the second metal layer is arranged on the conductive contact Inside the needle, the first metal layer protrudes from the second metal layer to form a groove between adjacent first metal layers, and the groove is configured at at least one end of the conductive contact pin.

On the other hand, the conductive contact pin according to the present invention is a conductive contact pin formed by laminating a plurality of metal layers including a first metal layer and a second metal layer, the first metal layer including a first metal and formed in a flat plate form. , the second metal layer includes a second metal and is formed in the form of a flat plate, wherein the first metal layer is arranged on the upper surface and the lower surface of the conductive contact pin, and the second metal layer is arranged on the conductive contact Inside the pin, the first metal layer protrudes from the second metal layer to form a groove between adjacent first metal layers, and the groove is continuously arranged along the side periphery of the conductive contact pin .

In addition, a plurality of the groove portions are spaced apart from each other in a height direction of the conductive contact pins.

The present invention provides a conductive contact pin with further improved physical or electrical characteristics.

The following is merely illustrative of the principles of the invention. Therefore, even if it is not explicitly described or illustrated in this specification, those skilled in the art can realize the principle of the invention and invent various devices included in the concept and scope of the invention. In addition, all conditional terms and examples listed in this specification should be understood in principle only for the purpose of clearly understanding the concept of the invention, and should not be limited to the examples and states specifically listed above.

The above objects, features and advantages will be further clarified by the following detailed description related to the accompanying drawings, so those who have ordinary knowledge in the technical field of the invention can easily implement the technical idea of the invention.

Embodiments described in this specification will be described with reference to cross-sectional views and/or perspective views that are ideal illustrations of the present invention. In order to effectively explain the technical content, the thicknesses of the films and regions shown in these drawings are exaggerated. The shape of the illustrations may be deformed due to manufacturing techniques and/or tolerances. Thus, embodiments of the invention are not limited to the specific forms shown, but also include variations in forms resulting from manufacturing processes. The technical terms used in this specification are for describing specific examples only, and are not intended to limit the present invention. Expressions in the singular include expressions in the plural unless the context clearly dictates otherwise. In this specification, it should be understood that terms such as "comprising" or "having" are intended to designate the existence of features, numbers, steps, actions, constituent elements, parts or combinations thereof described in this specification, and do not preclude one or the existence or additional possibility of more than one other feature or number, step, action, constituent element, component or a combination thereof.

According to a preferred embodiment of the present invention, the conductive contact needle (10) is arranged in the detection device and used for making electrical contact and physical contact with the detection object to transmit electric signals. The detection device may be a detection device used in a semiconductor manufacturing process, and may be a probe card as an example, and may be a detection socket. The detection device according to the preferred embodiment of the present invention is not limited thereto, and includes any device that applies electricity to confirm whether the detection object is defective.

Hereinafter, as an example of a detection device, the conductive contact pins (10) according to the preferred first to third embodiments of the present invention are conductive contact pins (10) that can be used for probe cards, and the conductive contact pins (10) according to the fourth embodiment The conductive contact pin (10) can be a conductive contact pin (10) that can be used to detect the socket. But not limited thereto, the conductive contact pins ( 10 ) according to the first to third embodiments can be used for detecting sockets, and the conductive contact pins ( 10 ) according to the fourth embodiment can be used for probe cards.

The conductive contact pins ( 10 ) according to the first to fourth embodiments can be manufactured using MEMS process. More specifically, by using a mold with an internal space and filling the internal space with a metal substance by electroplating, a conductive contact pin (10) formed by laminating a plurality of metal layers can be manufactured. The mold here can be photoresist, semiconductor wafer or anodized film.

Hereinafter, the first to fourth embodiments will be distinguished and described, but embodiments in which the configurations of the respective embodiments are combined are also included in preferred embodiments of the present invention. first embodiment

Hereinafter, the conductive contact pin ( 10 ) according to a preferred first embodiment of the present invention will be described with reference to FIG. 1( a ), FIG. 1 ( b ) to FIG. 4 . Fig. 1(a) and Fig. 1(b) are diagrams showing a probe head of a probe card having a conductive contact needle (10) according to a preferred first embodiment of the present invention, and Fig. 2 is a diagram according to the present invention A perspective view of the conductive contact pin (10) of the preferred first embodiment, FIG. 3 is a perspective view showing one end of the conductive contact pin (10) according to the preferred first embodiment of the present invention, and FIG. 4 is along the lines of FIG. 3 Sectional view of line A-A'.

First, refer to FIG. 1( a ) and FIG. 1 ( b ). The probe card is composed of a probe head and a circuit part (3). The probe head is composed of a first guide plate (1), a second guide plate (2) and a conductive contact pin (10). The electrical characteristics test of the semiconductor element is carried out by making the semiconductor wafer (W) close to the probe card formed with a plurality of conductive contact pins (10) and making each conductive contact pin (10) correspond to the corresponding pin on the semiconductor wafer (W). Electrode pad (WP) contacts are performed. After the conductive contact pin (10) reaches the position in contact with the electrode pad (WP) (Fig. 1(b)). The conductive contact pin (10) is a structure elastically deformed between the first guide plate (1) and the second guide plate (2).

As a preferred first embodiment of the present invention, the conductive contact pin (10) can be configured as a pre-deformed structure, that is, in the shape of a cobra needle, or configured so that the first guide plate (1 ), the second guide plate (2), or an additional moving plate arranged between the first guide plate (1) and the second guide plate (2) moves horizontally to deform the inline needle. Therefore, although the conductive contact pin (10) is shown as a straight needle in FIG. 2, it is not limited thereto. As shown in (a) of FIG. The structure of the conductive contact pin (10) of the folding part is also included in the structure of the preferred first embodiment of the present invention.

The first end (31) of the conductive contact pin (10) is the part in contact with the electrode pad (WP) on the semiconductor wafer (W), and the second end (32) can be the circuit part of the probe card (3) The contact part. Or, on the contrary, the first end part (31) is a part in contact with the circuit part (3) of the probe card, and the second end part (32) can be the electrode pad (WP) on the semiconductor wafer (W) parts of contact.

The conductive contact pin (10) is formed by laminating a plurality of metal layers by using a mold having an inner space and filling the inner space of the mold with a metal substance by electroplating.

The conductive contact pin (10) includes a first metal layer (11) and a second metal layer (13) and is formed by laminating multiple metal layers, wherein the first metal layer (11) includes a first metal and is formed in a flat plate form , the second metal layer (13) includes a second metal and is formed in a flat plate form. The plurality of metal layers may include additional metal layers besides the first metal layer (11) and the second metal layer (13). The plurality of metal layers may be formed of at least three layers. In other words, the plurality of metal layers may be formed of odd-numbered layers or even-numbered layers of three or more layers. However, the number of metal layers is not limited to this.

The first metal layer (11) is arranged on the upper surface and the lower surface of the conductive contact pin (10), and the second metal layer (13) is arranged inside the conductive contact needle (10).

The conductive contact pin (10) includes a first metal layer (11) and a second metal layer (13) and is formed by laminating a plurality of metal layers. Each laminated metal layer has a planar form. The lamination direction of multiple metal layers including the first metal layer (11) and the second metal layer (13) is the height direction (z direction) of the conductive contact pin. On the x-y plane, metal layers in a planar form are stacked in the height direction (z direction) to form a conductive contact pin (10). Since the conductive contact pin (10) is deformed in the width direction (x direction), the lamination direction (z direction) of multiple metal layers is perpendicular to the deformation direction of the conductive contact pin (10).

The first metal is a metal relatively higher in wear resistance or hardness than the second metal, and the second metal may be formed of a metal relatively higher in electrical conductivity than the first metal.

The first metal may preferably be formed from a metal selected from the group consisting of rhodium (Rh), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W) , phosphorus (P) or alloys thereof, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiP) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloy. The first metal layer (11) can be formed of first metals of the same material or of first metals of different materials.

The second metal may preferably be formed of a metal selected from an alloy of copper (Cu), silver (Ag), gold (Au) or the like. The second metal layer (12) can be formed by the second metal of the same material or by the second metal of different material.

However, the first metal and the second metal may be composed of other metals besides the above-mentioned metals, and are not limited to the materials exemplified above.

The first metal layer (11) and the second metal layer (13) are alternately laminated. The first metal layer (11) is arranged on the upper surface and the lower surface in the height direction (z direction) of the conductive contact pin (10), and the second metal layer (13) is arranged between the first metal layers (11). The conductive contact pins (10) are alternately laminated and arranged in the order of the first metal layer (11), the second metal layer (13) and the first metal layer (11), and the number of laminated layers can be composed of more than three layers. Referring to FIGS. 2 to 4 , the first metal layer ( 11 ) consists of five layers, and the second metal layer ( 13 ) consists of four layers, so that the conductive contact pin ( 10 ) consists of nine metal laminate layers.

Since the conductive contact pin (10) is formed by laminating a plurality of metal layers in multiple stages, the thickness of each second metal layer (13) laminated in multiple stages is thinner than that of a single material. In the case where the second metal layer (13) is formed in a bulk form by a single material instead of multi-stage lamination, when high-frequency signals are transmitted, the high-frequency signals are trapped in the second metal layer due to the skin effect. The surface of the layer ( 13 ) transfers mainly along the skin depth, so that there are parts inside the second metal ( 230 ) that do not transfer. On the contrary, according to the preferred first embodiment of the present invention, when the conductive contact pin (10) transmits a high-frequency signal, the current flowing through the second metal layer (13) is connected to the second metal layer (13) due to the skin effect. Compared with the current flowing inside the layer (13), more current flows through the surface of the second metal layer (13). At this time, due to the skin effect (skin effect) of the multiple second metal layers (13) formed with a thin thickness and each of the multiple second metal layers (13), the transmission of high-frequency signals is exerted. The effect of increasing the number of paths and minimizing the portion of the second metal layer (13) not used for signal transmission, thereby maximizing the current density in the second metal layer (13). Thereby, the electrical characteristics of the conductive contact pin (10) can be improved. Thus, by utilizing the second metal layer (13) having a relatively high electrical conductivity compared to the first metal layer (11), and the first metal layer having a relatively low electrical conductivity compared to the second metal layer (13) ( 11) A plurality of alternately laminated metal layers forms a conductive contact pin (10), which facilitates the measurement of high-frequency signals by the conductive contact pin (10) according to the present invention. Here, the frequency of the high-frequency signal may be above 0.1 GHz and below 20 GHz. But not limited to this.

The conductive contact pin (10) has two ends in the length direction (y direction) and two ends in the width direction (x direction).

One end of the conductive contact pin (10) in the length direction (y-direction) is configured in such a way that the first metal layer (11) protrudes from the second metal layer (13) so that the second metal layer (13) is at one end not in contact with the contact object. Here, one end of the conductive contact pin (10) can be any of the two ends in the length direction of the conductive contact pin (10), that is, the first end (31) and the second end (32). By.

The configuration that the second metal layer (13) does not protrude at one end can be realized by using the second metal layer (13) selectively in the state where the plating process is completed and a plurality of metal layers are stacked. The reacted solution etches the second metal layer (13) at one end.

The first metal layer (11) protrudes from the second metal layer (13) to form a groove (20) between adjacent first metal layers (11), and the groove (20) is arranged on the conductive contact pin (10) ) at one end. The groove part (20) has its side wall formed by the first metal layer (11) and the bottom surface formed by the second metal layer (13), so as to extend long in the width direction (x direction) of the conductive contact pin (10) . In addition, since a plurality of the first metal layer (11) and the second metal layer (13) are arranged, the grooves (20) are spaced apart from each other in the height direction (z direction) of the conductive contact pin (10) There are more than one.

Since the hardness of the second metal layer (13) is lower than that of the first metal layer (11), it does not protrude from any of the first metal layer (11) and the second metal layer (13) and is arranged on the same plane In the above case, since the second metal layer (13) is worn, the durability of the conductive contact pin (10) may decrease. However, according to the preferred first embodiment of the present invention, the second metal layer (13) does not protrude from the first metal layer (11) so that the second metal layer (13) does not contact the contact object, thereby improving Abrasion resistance due to non-contact.

At the first end portion ( 31 ), the second metal layer ( 13 ) is not protruding from the first metal layer ( 11 ) and is positioned inwardly with a step difference. Thereby, the electrode pads (WP) of the semiconductor wafer (W) can be in contact with the first metal layer (11), but not in contact with the second metal layer (13). Therefore, the contact stability is improved by increasing the number of contact points with the electrode pads (WP) of the semiconductor wafer (W).

At least one end of the conductive contact pin (10) is configured in a protruding shape in the length direction of the conductive contact pin (10). During the overdrive process as shown in Figure 1(b), since the first end (31) of the conductive contact pin (10) having a convex shape can make the position of the contact surface along the contact object (WP) The surface changes and is in sliding contact with the contact object (WP), so that excessive pressure is not exerted on the contact object (WP) during overdriving. In this way, by making one end of the conductive contact pin (10) have a convex shape, the contact object (WP) is prevented from being damaged during overdriving.

On the other hand, the conductive contact pin (10) includes a slot (40) extending elongately along its length and vacated inside. Multiple metal layers constituting the conductive contact pin (10) are exposed through the slot (40). Due to the formation of the slot (40), the conductive contact pin (10) is more easily deformed, so even if the length of the conductive contact pin (10) becomes shorter, excessive contact pressure will not be caused. Therefore, the overall length can be shortened by the conductive contact pin (10), thereby facilitating high-frequency signal transmission. In addition, with the configuration of the slot (40), the transmission area of the high-frequency signal is increased, thereby facilitating the transmission of the high-frequency signal. second embodiment

Next, a second embodiment according to the present invention will be described. However, in the embodiments described below, compared with the above-mentioned first embodiment, the description will focus on the characteristic components, and the description of the same or similar components as the first embodiment will be omitted as much as possible.

Hereinafter, a conductive contact pin ( 10 ) according to a preferred second embodiment of the present invention will be described with reference to FIGS. 5 and 6 . Fig. 5 is a perspective view of a conductive contact pin (10) according to a preferred second embodiment of the present invention, and Fig. 6 is a perspective view showing one end of the conductive contact pin (10) according to a preferred second embodiment of the present invention.

There are differences from the composition of the first embodiment in which the second metal layer (13) is not in contact with the contact object only at one end in the length direction (y direction) in the following respects: the first metal layer (11) The two ends of the conductive contact pin (10) in the length direction (y direction) protrude from the second metal layer (13) and the second metal layer (13) does not contact the contact object at one end.

At the first end portion ( 31 ), the second metal layer ( 13 ) is not protruding from the first metal layer ( 11 ) and is positioned inwardly with a step difference. Thereby, the electrode pads (WP) of the semiconductor wafer (W) can be in contact with the first metal layer (11), but not in contact with the second metal layer (13). Therefore, by increasing the number of contact points with the electrode pads (WP) of the semiconductor wafer (W), contact stability is improved and wear resistance is improved.

In addition, at the second end portion (32), the second metal layer (13) does not protrude from the first metal layer (11), but is positioned inwardly with a step difference. Thereby, the circuit part (3) of the probe card can be in contact with the first metal layer (11), but not in contact with the second metal layer (13). Therefore, by increasing the number of contact points with the circuit part (3) of the probe card, contact stability is improved and wear resistance is improved. third embodiment

Next, a third embodiment according to the present invention will be explained. However, in the embodiment described below, compared with the above-mentioned second embodiment, the description will focus on the characteristic components, and the description of the same or similar components as the second embodiment will be omitted as much as possible.

Hereinafter, a conductive contact pin ( 10 ) according to a preferred third embodiment of the present invention will be described with reference to FIG. 7 , (a) of FIG. 8 , and (b) of FIG. 8 . Fig. 7 is a perspective view of a conductive contact pin (10) according to a preferred third embodiment of the present invention, (a) of Fig. 8 is a cross-sectional view along line AA' of Fig. 7, and (b) of Fig. 8 is A sectional view along line BB' in FIG. 7 .

There are differences from the second embodiment in which the second metal layer (13) is not in contact with the contact object only at both ends of the length direction (y direction) in the following respects: the first metal layer (11 ) at both ends of the conductive contact pin (10) in the width direction (x direction) are also protruding from the second metal layer (13), and the second metal layer (13) is not in contact with the contact object at one end .

The first metal layer (11) protrudes from the second metal layer (13) to form a groove (20) between adjacent first metal layers (11), and the groove (20) is along the conductive contact pin (10) The side perimeter of the side is continuously configured.

At the first end portion ( 31 ), the second metal layer ( 13 ) is not protruding from the first metal layer ( 11 ) and is positioned inwardly with a step difference. Thereby, the electrode pads (WP) of the semiconductor wafer (W) can be in contact with the first metal layer (11), but not in contact with the second metal layer (13). Therefore, by increasing the number of contact points with the electrode pads (WP) of the semiconductor wafer (W), contact stability is improved and wear resistance is improved.

In addition, at the second end portion (32), the second metal layer (13) does not protrude from the first metal layer (11), but is positioned inwardly with a step difference. Thereby, the circuit part (3) of the probe card can be in contact with the first metal layer (11), but not in contact with the second metal layer (13). Therefore, by increasing the number of contact points with the circuit part (3) of the probe card, contact stability is improved and wear resistance is improved.

In addition, at the third end ( 33 ) and the fourth end ( 34 ), the second metal layer ( 13 ) is not protruding from the first metal layer ( 11 ) and is positioned inwardly with a step difference. Thereby, the inner walls of the holes of the first guide plate (1) and the second guide plate (2) can be in contact with the first metal layer (11), but not in contact with the second metal layer (13). Therefore, the wear resistance of the conductive contact pin (10) is ensured to prolong the life.

In addition, the second metal layer (13) does not protrude from the first metal layer (11) inside the slot (40), and is positioned inwardly with a step difference. Thereby, when the high frequency signal is transmitted, the transmission area of the high frequency signal is increased, thereby facilitating the transmission of the high frequency signal.

As a modified example of the third embodiment, the following configuration may also exist: the first metal layer (11) is smaller than the second metal layer (13) only at both ends of the conductive contact pin (10) in the width direction (x direction). protrudes and the second metal layer (13) is not in contact with the contact object at one end. Fourth embodiment

Next, a fourth embodiment according to the present invention will be described.

The conductive contact pin ( 10 ) according to the fourth embodiment may be a conductive contact pin ( 10 ) that can be used to detect a socket.

Fig. 9a is a plan view showing a conductive contact pin (10) according to a preferred fourth embodiment of the present invention, and Fig. 9b is a perspective view showing a conductive contact pin (10) according to a preferred fourth embodiment of the present invention.

The conductive contact pin (10) includes a pin part (100), a fixing part (200) and a connecting part (300).

The needle part (100) includes a first contact part (110) arranged at the upper part, a second contact part (120) arranged at the lower part, and a contact part arranged between the first contact part (110) and the second contact part (120). elastic portion (130).

In the previous spring-type sockets, the cylinder body and the conductive contact pins were assembled and configured separately, but the conductive contact pins (10) according to the preferred fourth embodiment of the present invention have structural differences in the following aspects: using plating The manufacturing process manufactures the first contact part (110), the second contact part (120) and the elastic part (130) at one time, so as to be configured in one body.

The fixing part (200) functions to fix the conductive contact pin (10) to the support plate, and after the conductive contact pin (10) is arranged on the support plate, the conductive contact pin (10) remains fixed to the support plate.

The connecting part (300) is arranged between the pin part (100) and the fixing part (200) based on the width direction (x direction) of the conductive contact pin (10), so as to connect the pin part (100) and the fixing part (200) .

The needle part (100), the fixing part (200) and the connecting part (300) are arranged in one body. The needle part (100), the fixing part (200) and the connecting part (300) are fabricated at one time by a plating process. Since the conductive contact pin (10) is formed by filling the internal space with a metal substance by electroplating using a mold with an internal space, the pin part (100), the fixing part (200) and the connecting part (300) are made into a connected one body type.

The conductive contact pin (10) can be elastically deformed in the length direction (y direction) and at the same time elastically deformed in the width direction (x direction). The conductive contact pin (10) is elastically deformable in the longitudinal direction (y direction) by the constitution of the elastic part (130), and elastically deformable in the width direction (x direction) by the constitution of the connection part (300) .

In the height direction (z direction) of the conductive contact pin (10), a plurality of metal laminated layers are arranged. The plurality of metal layers include a first metal layer (11) and a second metal layer (13), wherein the first metal layer (11) contains a first metal and is formed in a flat form, and the second metal layer (13) Contains a second metal and is formed in a flat plate.

The first metal layer (11) is arranged on the lower surface and the upper surface in the height direction (z direction) of the conductive contact pin (10), and the second metal layer (13) is arranged between the first metal layers (11). For example, the conductive contact pins (10) are alternately stacked in the order of the first metal layer (11), the second metal layer (13), and the first metal layer (11), and the number of stacked layers can be formed by more than three layers.

The first metal layer ( 11 ) is formed to protrude on the surface side compared to the second metal layer ( 13 ). The second metal layer (13) disposed between the first metal layers (11) does not protrude beyond the first metal layer (11) on the surface side. This can be achieved by selectively etching only the second metal layer (13) after the plating process is completed. Since the hardness of the second metal layer (13) is lower than that of the first metal layer (11), when the first metal layer (11) and the second metal layer (13) are arranged on the same plane, the second metal layer The layer (13) is subject to wear, so the durability of the conductive contact pins (10) may decrease. Therefore, the second metal layer (13) does not come into contact with external objects due to the constitution that the second metal layer (13) does not protrude from the first metal layer (11), and the wear resistance due to non-contact can be improved.

The structure that the second metal layer (13) does not protrude more than the first metal layer (11) can be arranged on the whole of the conductive contact pin (10), or only selectively arranged between the second metal layer (13) and the external object. The site of contact.

In the case where the second metal layer (13) does not protrude more than the first metal layer (11), it is only selectively arranged on the part where the second metal layer (13) is substantially in contact with an external object, it is preferably configurable On the first contact part (110), the second contact part (120), and/or the fixing part (200).

The surface of the first contact portion (110) in contact with the external terminal of the semiconductor package, more specifically the inner surface of the first side contact portion (115) in the width direction (x direction) and/or the first lower contact On the upper surface of the portion (111), the second metal layer (13) is positioned so as to form a step inward without protruding from the first metal layer (11). Thereby, the external terminals of the semiconductor package may be in contact with the first metal layer (11), but may not be in contact with the second metal layer (13). Therefore, by increasing the number of contact points between the external terminal of the semiconductor package and the first contact part (110), the contact stability is improved.

On the other hand, the detection device includes a circuit substrate, and the second contact portion (110) is electrically connected to a terminal of the circuit substrate. At this time, the second metal layer (13) does not protrude from the first metal layer (11) on the lower surface of the second contact portion (110), and is positioned inwardly with a step difference. Thereby, the contact stability is improved by increasing the number of contact points.

On the other hand, the fixing part (200) is fixedly arranged on the support plate, and on the side of the fixing part (200) opposite to the support plate, the second metal layer (13) does not protrude more than the first metal layer (11) and is inward. stepwise positioning. In this way, contact-induced wear can be minimized.

The first contact part (110) is located at the upper part of the conductive contact pin (10) in the longitudinal direction (y direction), and the second contact part (120) is located at the lower part of the conductive contact pin (10) in the longitudinal direction (y direction).

The first contact portion (110) includes a first lower contact portion (111) and a first side contact portion (115).

The first lower contact part (111) contacts the lower part of the contact object. Therefore, the first lower contact portion (111) can resist the downward displacement of the contact object. Here, the contact object includes an external terminal of the detection object. When the detection object is a semiconductor package, the contact object may be a spherical external terminal disposed on the semiconductor package.

The first side contact part (115) is in contact with the side of the contact object. Therefore, the first side contact portion (115) can resist lateral displacement of the contact object. More specifically, the first side contact portion (115) is disposed outside the first lower contact portion (111) and contacts the side of the external terminal. The contact stability with the external terminal is improved by the configuration of the first lower contact portion (111) contacting the lower portion of the external terminal and the first side contact portion (115) contacting the side portion of the external terminal.

The first lower contact part (111) includes a 1-1 lower contact part (111a) and a 1-2 lower contact part (111b). The 1-1 lower contact part (111a) and the 1-2 lower contact part (111b) are separated and symmetrical in the width direction (x direction) based on the central axis of the needle part (100) in the length direction (y direction) ground configuration.

The 1-1 lower contact part (111a) includes a first lower support part (113a) which is in contact with a part of the lower part of the external terminal of the semiconductor package and extends to the left side in the width direction (x direction) and The upper side of the longitudinal direction (y direction) is extended, and the first-second lower contact part (111b) includes a second lower support part (113b), and the second lower support part (113b) is connected to the lower part of the external terminal of the semiconductor package Contact and extend to the right side in the width direction (x direction) and the upper side in the length direction (y direction).

There is a first neck (112a) at the lower part of the first lower support part (113a). One end of the first neck (112a) is connected to the upper elastic part (131), and the other end is connected to the first lower supporting part (113a). There is a second neck (112b) at the lower part of the second lower supporting part (113b). One end of the second neck (112a) is connected to the upper elastic part (131), and the other end is connected to the second lower supporting part (113b).

If the external terminals of the semiconductor package are in contact with the 1-1 lower contact part (111a) and the 1-2 lower contact part (111b), the first lower support part (113a) and the second lower support part (113b) can be The lower portions of the external terminals are elastically deformed in directions away from each other and supported. In addition, even if the external terminals of the semiconductor package are not installed in the correct position but are installed eccentrically to either side, the first lower support part (113a) or the second lower support part (113b) can be aligned with the lower part of the external terminals of the semiconductor package. touch. In this way, since the first lower contact portion (111) is formed by the 1-1 lower contact portion (111a) and the 1-2 lower contact portion (111b) which are spaced apart from each other, the connection with the external terminal of the semiconductor package is further improved. contact stability.

In addition, there is a partition space between the 1-1 lower contact portion (111a) and the 1-2 lower contact portion (111b). More specifically, there is a separation space between the first neck portion (112a) of the first lower contact portion (111a) and the second neck portion (112b) of the second lower contact portion (111b). The foreign matter falling off from the external terminal of the semiconductor package is guided by the first lower support part (113a) of the first lower contact part (111a) and the second lower support part (113b) of the second lower contact part (111b) and falls into the It is arranged in the separation space between the first neck (112a) and the second neck (112b). Thereby, by minimizing foreign matter remaining on the first lower support part (113a) of the first lower contact part (111a) and the second lower support part (113b) of the second lower contact part (111b) , thus improving the contact stability. In addition, the inflow of foreign matter into the upper elastic part (131) can be minimized.

The first side contact portions (115) are arranged as a pair outside the first lower contact portion (111) and arranged to be contactable with the side portions of the external terminals of the semiconductor package. The first side contact portion (115) is formed to protrude further than the protruding length of the first lower contact portion (111) to the upper side of the first lower contact portion (111). The lower portion of the spherical external terminal is in contact with the first lower contact portion (111), and the side portion thereof is in contact with the first side contact portion (115). By making the spherical external terminal contact at the first lower contact portion (111) and the pair of first side contact portions (115), the contact stability is improved compared with the existing point contact method.

The pair of first side contact parts (115) can be elastically deformed into a form in which the distance between them becomes farther or narrower. For example, if the first lower contact portion (111) is pressed after the first lower contact portion (111) is in contact with the spherical external terminal, it can be elastically deformed to separate the pair of first side contact portions (115). A form in which the distance is narrowed. Or when the width of the external terminal of the semiconductor package is larger than the separation distance between the pair of first side contact parts (115), it can be elastically deformed to the separation distance between the pair of first side contact parts (115). distant form.

The first side contact portion (115) is configured with a protruding tip (116) for improving contact stability. The protruding tip (116) protrudes inward in the width direction (x direction) and can be arranged in plurality. At least two protruding points (116) can be configured. If the downward pressure is applied by overdrive when the first lower contact portion (111) is in contact with the external terminal of the semiconductor package, the first side The contact portion (115) is displaced toward the external terminal of the semiconductor package. At this time, the protruding tip ( 116 ) is in contact with the side surface of the external terminal of the semiconductor package and may improve contact stability.

When the external terminal of the semiconductor package is in contact with the first contact part (110), it may not be in contact with the first lower contact part (111) due to the size and position error of the external terminal of the semiconductor package, but at least it can contact the first contact part (111). Side contacts (115). Since it is configured to be in contact with the external terminals of the semiconductor package only by the first side contact portion (115), it is possible to ensure that the external terminals of the semiconductor package are in contact with the semiconductor package even when the downward force of pressing the semiconductor package is small. Contact stability between the first contact parts (110). In the case of the previous rubber-type socket in which conductive microballs are disposed inside the rubber material, ie, silicon rubber, the semiconductor package should be pressed with sufficient pressure to achieve the connection between the microballs. Therefore, depending on the number of conductive contact pins, a descending force of several tons to several tens of tons is required. In contrast, in the case of the conductive contact pin (10) according to the preferred fourth embodiment of the present invention, by configuring the first side contact portion (115) that can contact the side surface of the external terminal of the semiconductor package, even The contact stability between the external terminal of the semiconductor package and the first contact part (110) can also be ensured with a relatively small descending force.

The elastic part (130) includes an upper elastic part (131) and a lower elastic part (132). A boundary portion (114) is disposed between the upper elastic portion (131) and the lower elastic portion (132). The upper elastic part (131) is connected with the first contact part (110), and the lower elastic part (1232) is connected with the second contact part (120). Elastic coefficients of the upper elastic part (131) and the lower elastic part (132) may be formed differently from each other.

An upper elastic part (131) is disposed between the first lower contact part (111) and the boundary part (114). The upper elastic part (131) is formed by alternately connecting a plurality of upper straight parts (135a) and a plurality of upper curved parts (137a). The upper straight portion (135a) connects left and right adjacent upper curved portions (137a), and the upper curved portion (137a) connects upper and lower adjacent upper straight portions (135a). The upper straight part (135a) is arranged at the central part of the upper elastic part (131), and the upper curved part (137a) is arranged at the outer part of the upper elastic part (131). The upper straight portion (135a) is arranged parallel to the width direction (x direction), so that the upper curved portion (137a) is more easily deformed by contact pressure. Thereby, the upper elastic part (131) has an appropriate contact pressure.

The lower part of the upper elastic part (131) is connected with the boundary part (114). More specifically, the upper curved portion (137a) of the upper elastic portion (131) is connected to the boundary portion (114).

The upper part of the upper elastic part (131) is connected with the first lower contact part (111). More specifically, since the first lower contact part (111) includes the 1-1 lower contact part (111a) and the 1-2 lower contact part (111b) which are symmetrically arranged apart from each other, the upper elastic part (131 ) is connected to the 1-1 lower contact portion (111a) and the 1-2 lower contact portion (111b).

By including the constitution that the first lower contact portion (111) is connected to the upper elastic portion (131), elastic deformation is performed when the external terminal contacts the first lower contact portion (111), and an appropriate contact pressure can be provided .

The first side contact portion (115) may be formed extending from the connecting portion (300) or extending from the boundary portion (114).

The boundary part (114) is arranged between the upper elastic part (131) and the lower elastic part (132) in the longitudinal direction (y direction), and is arranged between a pair of connecting parts (300) in the width direction (x direction) . One side of the boundary part (114) is connected to the connection part (300) on one side thereof, and the other side of the boundary part (114) is connected to the connection part (300) on the other side thereof.

The boundary part (114) is connected to the upper elastic part (131) at its upper part, and connected to the lower elastic part (132) at its lower part, and is arranged to extend in the width direction (x direction). In other words, the boundary part (114) is arranged in a plate shape extending in the width direction (x direction), the upper elastic part (131) is connected to the upper part of the boundary part (114), and the lower part is connected to the lower part of the boundary part (114). The elastic part (132) is connected to the connecting parts (300) on both sides of the boundary part (114). In addition, the first side contact portion (115) is connected to the boundary portion (114) and formed to extend upward.

The boundary part (114) performs a role of dividing a contact area where an external terminal of the semiconductor package contacts and an elastic area where the lower elastic part (132) elastically deforms into separate spaces. With the composition of the boundary part (114) located on the upper part of the lower elastic part (132) and the connection part (300) located on both sides of the lower elastic part (132), the contact area and the lower part of the external terminal of the semiconductor package are connected. The elastic region of the elastic portion (132) is distinguished by elastic deformation. Thereby, foreign matter generated upon contact in the contact region is blocked from flowing into the elastic region side.

The lower elastic part (132) is arranged between the boundary part (114) and the second contact part (120) in the longitudinal direction (y direction) to perform elastic deformation. The uppermost end of the lower elastic part (132) is connected to the boundary part (114), and the lowermost end of the lower elastic part (132) is connected to the second contact part (120).

The lower elastic part (132) is formed by connecting alternately a plurality of straight parts (135b) and a plurality of curved parts (137b). The straight line portion (135b) connects left and right adjacent curved portions (137b), and the curved portion (137b) connects upper and lower adjacent straight line portions (135b). The curved portion (137b) is arranged in an arc shape.

A straight line portion (135b) is arranged at a central portion of the lower elastic portion (132), and a curved portion (137b) is arranged at an outer portion of the lower elastic portion (132). The straight portion ( 135 b ) is arranged parallel to the width direction (x direction), so that the bent portion ( 137 b ) is more easily deformed by contact pressure. Thereby, the lower elastic part (132) has an appropriate contact pressure.

The lower elastic part (132) connected with the boundary part (114) is the bent part (137b) of the lower elastic part (132), and the lower elastic part (132) connected with the second contact part (120) may be the lower elastic part ( 132) straight portion (135b). One end of the straight part (135b) at the lowermost end of the lower elastic part (132) is formed as a free end, and the other end is connected to the bent part (137b), so that the second contact part (120) is performing a scrubbing (scrub) function. Simultaneous action.

There are flat parts (138b) at the upper and lower parts of the bent part (137b). The planar portion (138b) is formed in a flat planar form, and the upper and lower adjacent planar portions (138b) are in surface contact with each other when the lower elastic portion (132) is deformed. The lower elastic part (132) is compressed during detection, and the upper and lower adjacent planar parts (138b) are in surface contact with each other. In this way, the electrical signal transmission can be rapidly and stably realized through the bending portion (137b) disposed on the outer portion of the lower elastic portion (132).

Two straight parts ( 135b ) are connected at each bent part ( 137b ), and the two straight parts ( 135b ) are positioned within a range not exceeding the distance in the longitudinal direction (y direction) of each bent part ( 137b ). One straight part (135b) is connected at the position bent from the upper part of each curved part (137b) to the lower part, and another straight part is connected at the position bent from the lower part of each curved part (137b) to the upper part. (135b), the separation distance in the length direction (y direction) of two straight parts (135b) connected to one bending part (137b) does not exceed the separation distance in the length direction (y direction) of one bending part (137b) . Thereby, since more curved portions ( 137 b ) and straight portions ( 135 b ) can be arranged within the same length range of the lower elastic portion ( 132 ), sufficient elastic force can be provided to the lower elastic portion ( 132 ). Therefore, the length of the lower elastic part (132) can be shortened.

On the other hand, the separation distance between the upper and lower adjacent curved portions (137b) is formed to be shorter than the separation distance between the upper and lower adjacent straight portions (135b). In this way, when the lower elastic part (132) is compressed, the upper and lower adjacent curved parts (137b) first contact and form a current path through the curved part (137b). If an additional overdrive is applied, the upper and lower , The lower spaced linear portion (135b) causes additional deformation of the lower elastic portion (132).

The second contact portion (120) is electrically connected to a terminal of the circuit substrate. Since the second contact part (120) is configured by being connected to the elastic part (130) at the lower part of the elastic part (130), the second contact part (120) is elastically connected to the terminal of the circuit board.

The second contact part (120) has the same width as the lower elastic part (132), and includes a surplus space part (125) inside. The free space part (125) is formed as an empty space surrounded by the second contact part (120) and the straight part (135) of the lower elastic part (132). With the configuration of the extra space part (125), the second contact part (120) can be formed with the same width as the lower elastic part (132). The second contact part (120) has elastic force due to the configuration of the spare space part (125) arranged inside the second contact part (120).

The fixing part (200) is arranged on the outermost side of the conductive contact pin (10) in the width direction (x direction) and plays a role of fixing the conductive contact pin (10) to the support plate. After the conductive contact pin (10) is arranged on the supporting board, the fixing part (200) remains fixed on the supporting board.

The fixing part (200) includes a protrusion (210) protruding outward in the width direction (x direction). The protrusion (210) is arranged on the wall surface of the fixing part (200). The protrusion (210) includes an upper fixing protrusion (211) and a lower fixing protrusion (213). The fixing part (200) is fixedly arranged on the support plate through the configuration of the upper fixing protrusion (211) and the lower fixing protrusion (213).

Position the support plate between the upper fixing protrusion (211) and the lower fixing protrusion (213). The upper fixing protrusion (211) and the lower fixing protrusion (211) are configured as step-shaped stop edges, so that the support plate is clamped on the upper fixing protrusion (211) after the fixing part (200) is inserted into the hole formed on the support plate Fix the protrusion (213) with the lower part, so that the fixing part (200) will not be detached from the upper side and the lower side.

The fixing part (200) and the connecting part (300) are spaced apart and arranged parallel to each other, and the lower end part of the fixing part (200) and the lower end part of the connecting part (300) are connected by the bending part (400). The outer surface of the bent portion (400) has a structure inclined inward in the width direction (x direction). Thereby, it becomes easier to insert the conductive contact pin (10) into the through hole (31) formed in the support plate. When the conductive contact pin (10) is to be inserted into the through-hole (31) arranged on the support plate, the bent portion (400) with an inclined outer surface contacts the hole arranged on the support plate, and at the same time, it moves in the width direction (x direction) to compress the bent portion (400) inside so that it can be naturally inserted into the through hole (31) disposed on the support plate. In addition, after the insertion, the conductive contact pin (10) is in close contact with the inner wall of the through hole (31) arranged on the support plate by the elastic restoring force, and is fixed by the upper fixing protrusion (211) and the lower fixing protrusion (213). The part (200) is naturally fixed on the support plate. In addition, after being fixedly installed, the fixing part (200) is also in close contact with the inner wall surface of the through hole (31) by elastic restoring force, thereby preventing the conductive contact pin (10) from detaching from the support plate.

The fixing part (200) includes an extension protrusion (220). The extending protrusion (220) is a part of the fixing part (200) extending and protruding toward the upper side of the supporting board when the conductive contact pin (10) is arranged on the supporting board. The extending protrusion ( 220 ) may be disposed on an upper portion of the fixing portion ( 200 ) than the fixing protrusion ( 211 ) disposed on the upper portion of the fixing portion ( 200 ). The extension protrusion (220) supports the side surface of the first side contact part (115) when the first side contact part (115) is deformed outward in the width direction (x direction), so as to prevent the first side contact part (115) from Excessive deformation.

At least a part of the elastic part (130) protrudes outward in a downward direction of a lower end part of the fixing part (200). That is, at least a part of the elastic part (130) protrudes downward from the fixed part (200) and is exposed. In addition, at least a part of the first contact portion (110) protrudes outward in an upward direction from an upper end portion of the fixing portion (200). That is, at least a part of the first contact portion (110) protrudes upward from the fixed portion (200) and is exposed. Thereby, the interference with the fixing part (200) is minimized when the contact object contacting the conductive contact pin (10) above and below the conductive contact pin (10), thereby improving the performance of the conductive contact pin (10). ) The contact stability between objects in contact in the length direction (y direction).

The connecting part (300) is arranged between the needle part (100) and the fixing part (200) in the width direction (x direction) to connect the needle part (100) and the fixing part (200). The connection part (300) is configured to extend in the same length direction (y direction) as the length direction (y direction) of the fixing part (200).

The connecting part (300) is connected with at least a part of the needle part (100) and connected with the lower end part of the fixing part (200). Preferably, one end of the connection part (300) is connected to the boundary part (114), and the other end is connected to the lower end of the fixed part (200), and the connection part (300) and the fixed part (200) have "U "(alphabet U pattern) the bending part (400) connection of character pattern. That is, the fixing part (200) and the connecting part (300) are spaced apart and arranged parallel to each other, and the lower end of the fixing part (200) and the lower end of the connecting part (300) are connected by the bending part (400). The connecting part (300) is spaced apart from the fixing part (200) inside the width direction (x direction) of the fixing part (200), and the bending part (400) in the shape of "U" (alphabet U) The combination of the fixing part (200) and the connecting part (300) not only elastically allows the displacement of the needle part (100) in the width direction (x direction), but also elastically allows the needle part (100) to move in the length direction ( displacement in the y direction).

At a position on the lower side in the longitudinal direction (y direction) than the boundary portion (114), the lower end of the fixing portion (200) and the lower end of the connecting portion (300) are connected by a bending portion (400), so that the boundary The part ( 114 ) is relatively displaceable in the width direction (x direction) with respect to the fixed part ( 200 ). The boundary portion (114) can be relatively displaced in the width direction (x direction) relative to the fixed portion (200) when the boundary portion (114) is in contact with the external terminal of the semiconductor package at a position above the boundary portion (114) At the same time make contact with the external terminals. Thereby, even if the external terminals approach at shifted positions, contact stability can be improved.

Since the deformation of the conductive contact pin (10) in the width direction (x direction) is elastically allowed, installation and replacement of the conductive contact pin (10) on the support plate becomes easy.

To describe more specifically, the connecting part (300) can move relative to the fixing part (200), so that the separation space between the fixing part (200) and the connecting part (300) changes. The inner width of the hole formed in the support plate is formed to be smaller than the width and length of the conductive contact pin (10) before insertion. When the conductive contact pin (10) is to be inserted into the through hole (31) arranged on the support plate, the lower end of the conductive contact pin (10) can be compressed in the width direction (x direction) so that the conductive contact pin ( 10) The width and length are reduced so that it can be easily inserted into the through-hole ( 31 ) arranged on the support plate. In addition, after the insertion, the fixed part (200) can be in close contact with the inner wall of the through hole (31) disposed on the support plate due to the elastic restoring force between the fixed part (200) and the connecting part (300). In this way, by virtue of the elastic combination structure between the fixing part (200) and the connecting part (300), it becomes easy to arrange the conductive contact pin (10) on the support plate.

In addition, the work of pulling out the conductive contact pins (10) already installed on the support plate is also simplified. Since the conductive contact pin (10) is elastically deformable in the width direction (x direction), the fixing part (200) is compressed in the width direction (x direction) to be easily drawn out from the support plate.

Corresponding to the technical trend of narrowing the pitch of the external terminals, the size of the external terminals is also reduced. Therefore, it is more difficult to correspondingly align the external terminals made in micro-unit sizes with the conductive contact pins (10). But according to the preferred fourth embodiment of the present invention, since the displacement of the needle portion (100) in the width direction (x direction) is elastically allowed, it can be more stably contacted with the external terminal. Since the connection part (300) can be relatively displaced in the width direction (x direction) relative to the fixing part (200), and the needle part (100) and the connection part (300) are integrally formed, the needle part (100) can be Elastically tilt left and right within a specific angle range. Although the external terminals are in contact with the first contact portion (110) at staggered positions (due to manufacturing process or transfer errors, etc.), the first contact portion (110) can be tilted and make contact. This enables stable connection even with external terminals with positional errors.

The boundary part (114) is configured to be elastically movable in the width direction (x direction) on the basis of the fixed part (200), and is connected to the first side contact part (115) of the boundary part (114) to The elastic movement in the direction (x direction) is arranged, and the bending part (400) connecting the fixed part (200) and the connection part (300) is arranged in a width direction (x direction) in an elastic movement, The fixed part (200) is disposed so as to be elastically movable in the width direction (x direction) with the bent part (400) as a reference. Thereby, by minimizing the pressure exerted by the conductive contact pins (10) on the support plate, damage to the support plate can be prevented even if the through-holes (31) formed in the support plate (30) realize a narrow pitch.

The fixing part (200), the connecting part (300) and the boundary part (114) are formed by a flat plate-shaped plate, and at least a part of the first contact part (110), the elastic part (130) and the second contact part (120) are bent Folded sheet-like panels are formed. In this way, the conductive contact pins ( 10 ) are integrally arranged as one main body by connecting plate-like plates having substantially the same width as a whole.

The conductive contact pin (10) is produced by electroplating and laminating a plurality of metal layers, and by making the width (t) of the plate-shaped plates constituting the conductive contact pin (10) substantially the same, the conductive contact pin (10) The overall plating deviation is minimized. Thereby, the electrical characteristics or physical characteristics of the conductive contact pins (10) can be made uniform.

The conductive contact pin (10) according to the preferred fourth embodiment of the present invention is a structure in which plate-like plates are integrally connected as a whole.

The conductive contact pin (10) is configured as one body, including: a pair of fixing parts (200), formed in the shape of a plate extending in the length direction (y direction); a pair of connecting parts (300), in the The lower end of each fixing part (200) is formed in the form of a plate-shaped plate connected by a connecting part and extending in the longitudinal direction (y direction); the boundary part (114) is connected with each connecting part (300) and is formed in the width direction (x-direction) formed in the form of a plate-shaped plate; the upper elastic part (131), connected with the boundary part (114) or the connecting part (300) and formed in a plate-shaped form; the first contact part (110), with The upper elastic part (131) is connected and formed in a plate shape; the lower elastic part (132) is connected with the boundary part (114) or the connection part (300) and formed in a plate shape; and the second contact part (120 ), connected with the lower elastic part (132) and formed in a plate shape.

More specifically, a pair of fixing parts ( 200 ) are formed to extend in the longitudinal direction (y direction) in a plate shape. In addition, each connecting portion (300) connected to the lower end portion of each fixing portion (200) is formed to extend in the longitudinal direction (y direction) in a plate shape. In addition, the boundary portion ( 114 ) connecting the connection portions ( 300 ) is formed in a plate shape extending from the upper end portion of each connection portion ( 300 ) in the width direction (x direction). In addition, a half-closed space in the shape of "П" with a bottom opening is formed by a pair of connecting parts (300) and the boundary part (114). In addition, in the semi-closed space formed by the pair of connection parts (300) and the boundary part (114), the lower elastic part (132) is connected to the pair of connection parts (300) and the boundary part in the form of a bent plate. At least any one of (114) is connected and integrally formed. The lower elastic part (132) is formed at the same time as the curved part (137) and the straight part (135) are formed in a plate shape. In addition, the upper elastic part (131) is integrally formed with the boundary part (114) or the connecting part (300) in a plate shape. The first contact part (110) is integrally formed with the upper elastic part (131) in the form of a plate, and the second contact part (120) is integrally formed with the lower elastic part (132) in the form of a plate.

As mentioned above, the conductive contact pin ( 10 ) integrally connects the plate-shaped plates and configures them as a body.

The conductive contact pin (10) has an overall length dimension (L) in the length direction (y direction), has an overall height dimension (H) in the height direction (z direction) perpendicular to the length direction (y direction), and has an overall height dimension (H) in the vertical direction (y direction). It has an overall width dimension (W) in the width direction (x direction) of the length direction (y direction).

The plate-shaped plate forming the conductive contact pin (10) has a width. Here, the width means the distance between one side of the plate-like plate and the other side opposite to one side. The plate-shaped plate forming the conductive contact pin (10) has a minimum width at which it is the smallest and a maximum width at which it is the largest.

The substantial width (t) of the plate-like plate may be an average value of the widths based on the overall plate-like plate, or an intermediate value of the widths based on the overall plate-like plate, or may be an ) constitutes at least a part of the mean or median value of the plate-like plate width as the reference, or at least one of the fixed part (200), the connecting part (300), the boundary part (114) and the elastic part (130) The average value or median value based on the plate-shaped plate, or the value of the width when the width of the plate-shaped plate continues at the same width of 10 μm or more.

In order to effectively correspond to the high-frequency characteristic detection of the semiconductor package, the overall length (L) of the conductive contact pin (10) should be short. Therefore, the length of the elastic part (130) should also be shortened. However, if the length of the elastic portion (130) is shortened, there will be a problem that the contact pressure will increase. In order to keep the contact pressure from increasing while shortening the length of the elastic portion (130), the substantial width (t) of the plate-shaped plate constituting the elastic portion (130) should be reduced. However, if the substantial width (t) of the plate-shaped plate constituting the elastic portion (130) is reduced, the elastic portion (130) is easily damaged. In order to shorten the length of the elastic part (130) while keeping the contact pressure from increasing and to prevent damage to the elastic part (130), the overall height dimension (H) of the plate-shaped plate constituting the elastic part (130) should be formed big.

The conductive contact pin (10) according to the preferred fourth embodiment of the present invention is formed in such a way that both the substantial width (t) of the plate-shaped plate is thinned and the overall height dimension (H) of the plate-shaped plate is also large. That is, the overall height dimension (H) is formed larger than the substantial width (t) of the plate-like plate. Preferably, the substantial width (t) of the plate-shaped plate constituting the conductive contact pin (10) is arranged within the range of 5 μm to 15 μm, and the overall height dimension (H) is within the range of 70 μm to 200 μm configuration, and the substantial width (t) and overall height dimension (H) of the plate-shaped panel are configured within the range of 1:5 to 1:30. For example, the substantial width (t) of the plate-like plate is formed to be substantially 10 μm, and the overall height dimension (H) is formed to be 100 μm, so that the substantial width (t) and the overall height dimension (H) of the plate-like plate can be formed at a ratio of 1:10 .

Thereby, the length of the elastic portion (130) can be shortened while preventing damage to the elastic portion (130), and proper contact pressure can be provided even if the length of the elastic portion (130) is shortened. Furthermore, since the overall height dimension (H) can be increased compared with the substantial width (t) of the plate-shaped plate constituting the elastic portion (130), the effect on the moment acting in the front and rear directions of the elastic portion (130) The resistance becomes larger, so the contact stability is improved.

Since the length of the elastic part ( 130 ) can be shortened, the overall height (H) and overall length (L) of the conductive contact pin ( 10 ) are configured within a range of 1:3 to 1:9. Preferably, the overall length dimension (L) of the conductive contact pin (10) can be configured within a range of 300 μm to 1000 μm, more preferably 450 μm to 600 μm. In this way, the overall length dimension (L) of the conductive contact pin (10) can be shortened to easily correspond to high-frequency characteristics, and as the elastic recovery time of the elastic part (130) is shortened, the test time can also be shortened. Effect.

In addition, since the substantial width (t) of the plate-shaped plate constituting the conductive contact pin (10) is formed smaller than the height (H), the bending resistance in the front and rear directions is improved.

The elastic part (130) is not only configured to be elastically deformed by pressure, but also configured to contact each other to form a current path by the bent parts (137a, 137b). Therefore, it is preferable that the plurality of curved portions ( 137 a , 137 b ) adjacent up and down are in overall contact with each other by a pressing force.

The overall height dimension (H) and overall width dimension (W) of the conductive contact pin (10) are configured within a range of 1:1 to 1:5. Preferably, the overall height dimension (H) of the conductive contact pin (10) can be configured within the range of more than 70 μm and less than 200 μm, and the overall width dimension (W) of the conductive contact pin (10) is more than 100 μm and 500 μm It is arranged within the following range, more preferably, the overall width dimension (W) of the conductive contact pin ( 10 ) can be arranged within the range of not less than 150 μm and not more than 400 μm. In this way, by shortening the overall width dimension (W) of the conductive contact pins (10), narrow pitches can be achieved.

On the other hand, the overall height dimension (H) and the overall width dimension (W) of the conductive contact pins (10) may be formed with substantially the same length. Therefore, there is no need to join a plurality of separately fabricated conductive contact pins (10) in the height direction (z direction) so that the overall height dimension (H) has substantially the same length as the overall width dimension (W). In addition, since the overall height dimension (H) and the overall width dimension (W) of the conductive contact pin (10) can be formed at substantially the same length, the resistance to moment acting in the front and rear directions of the conductive contact pin (10) becomes larger, thereby improving contact stability. Furthermore, according to the configuration in which the overall height dimension (H) of the conductive contact pin (10) is 70 μm or more and the overall height dimension (H) and the overall width dimension (W) are arranged within the range of 1:1 to 1:5, the conductive The overall durability and deformation stability of the contact pin (10) are improved, and the contact stability with the external terminal is improved. In addition, since the overall height dimension (H) of the conductive contact pin (10) is formed to be greater than 70 μm, the current carrying capacity (Current Carrying Capacity) can be improved.

For the conductive contact pins (10) previously fabricated using a photoresist mold, the overall width dimension (W) is small compared to the overall height dimension (H). For example, since the overall height dimension (H) of the previous conductive contact pin (10) is less than 50 μm and the overall height dimension (H) and overall width dimension (W) are constituted in the range of 1:2 to 1:10, the borrowing The resistance to the moment of deformation of the conductive contact pin (10) in the forward and backward direction due to the contact pressure is weak. Previously, in order to prevent problems caused by excessive deformation of the elastic part on the front and back of the conductive contact pin (10), it should be considered to form an additional shell on the front and back of the conductive contact pin (10), but according to the preferred method of the present invention The fourth embodiment does not require an additional housing configuration.

As mentioned above, although the description is made with reference to the preferred embodiments of the present invention, those of ordinary skill in the corresponding technical field can implement various modifications to the present invention within the scope of the ideas and fields of the present invention described in the scope of the following claims or out of shape.

1: The first guide plate 2: The second guide plate 3: Circuit department 10: Conductive contact pin 11: The first metal layer 13: Second metal layer 20: Groove 31: first end/through hole 32: second end 33: the third end 34: The fourth end 40: slot 100: Needle 110: first contact part 111: first lower contact part 111a: 1st-1 lower contact part/first lower contact part 111b: 1st-2nd lower contact part/second lower contact part 112a: First neck 112b: Second neck 113a: First lower support part 113b: Second lower support part 114: Boundary 115: first side contact portion 116: protruding tip 120: second contact part 125: Spare Space Department 130: elastic part 131: upper elastic part 132: lower elastic part 135a: upper straight part 135b: Straight line part 137a: Upper bend/bend 137b: bending part 138b: plane part 200: fixed part 210:Protrusion 211: upper fixing protrusion 213: lower fixing protrusion 220: extended protrusion 300: connection part 400: bending part A-A', B-B': line H: height/overall height dimension L: length/overall length dimension t:substantial width/width W: semiconductor wafer/wafer/overall width dimension WP: electrode pad/contact object x, y, z: direction

Fig. 1(a) and Fig. 1(b) are diagrams showing a probe head of a probe card having conductive contact pins according to a preferred first embodiment of the present invention, and Fig. 1(a) is a diagram showing A front view of a state where a detection object is in contact with a conductive contact pin, and FIG. 1( b ) is a front view showing an over driving process. Fig. 2 is a perspective view of a conductive contact pin according to a preferred first embodiment of the present invention. 3 is a perspective view showing one end portion of a conductive contact pin according to a preferred first embodiment of the present invention. Fig. 4 is a sectional view taken along line AA' of Fig. 3 . Fig. 5 is a perspective view of a conductive contact pin according to a preferred second embodiment of the present invention. 6 is a perspective view showing one end of a conductive contact pin according to a preferred second embodiment of the present invention. Fig. 7 is a perspective view of a conductive contact pin according to a preferred third embodiment of the present invention. (a) of Fig. 8 and (b) of Fig. 8 are cross-sectional views of Fig. 7, (a) of Fig. 8 is a cross-sectional view along AA' line of Fig. 7, and (b) of Fig. 8 is a cross-sectional view along the line of Fig. 7. Sectional view of line BB'. Fig. 9a is a plan view showing a conductive contact pin according to a preferred fourth embodiment of the present invention. Fig. 9b is a perspective view showing a conductive contact pin according to a preferred fourth embodiment of the present invention.

10: Conductive contact pin

11: The first metal layer

13: Second metal layer

20: Groove

31: first end/through hole

32: second end

33: the third end

34: The fourth end

40: slot

x, y, z: direction

Claims (8)

A conductive contact pin is a conductive contact pin formed by laminating a plurality of metal layers including a first metal layer and a second metal layer, the first metal layer includes a first metal and is formed in a flat plate, and the second metal layer The layer comprises a second metal and is formed in a flat plate, wherein disposing the first metal layer on the upper surface and the lower surface of the conductive contact pin, the second metal layer is disposed inside the conductive contact pin, and The first metal layer protrudes from the second metal layer at at least one end of the conductive contact pin such that the second metal layer does not come into contact with a contact object at the one end. The conductive contact pin as claimed in claim 1, wherein The first metal layer and the second metal layer are alternately laminated. The conductive contact pin as claimed in claim 1, wherein The first metal is a metal having relatively higher wear resistance or strength than the second metal, and the second metal is a metal having relatively higher electrical conductivity than the first metal. The conductive contact pin as claimed in claim 1, wherein The first metal includes a metal selected from the group consisting of rhodium (Rh), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus ( P) or alloys thereof, or alloys of palladium-cobalt (PdCo), palladium-nickel (PdNi) or nickel-phosphorus (NiP), nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW), The second metal includes a metal selected from an alloy of copper (Cu), silver (Ag), gold (Au) or the like. The conductive contact pin as claimed in claim 1, wherein The one end is at least any one of the two ends in the length direction of the conductive contact pin, or It is at least any one of both ends in the width direction of the conductive contact pin. A conductive contact pin is a conductive contact pin formed by laminating a plurality of metal layers including a first metal layer and a second metal layer, the first metal layer includes a first metal and is formed in a flat plate, and the second metal layer The layer comprises a second metal and is formed in a flat plate, wherein disposing the first metal layer on the upper surface and the lower surface of the conductive contact pin, the second metal layer is disposed inside the conductive contact pin, and The first metal layer protrudes from the second metal layer to form a groove between adjacent first metal layers, and the groove is disposed on at least one end of the conductive contact pin. A conductive contact pin is a conductive contact pin formed by laminating a plurality of metal layers including a first metal layer and a second metal layer, the first metal layer includes a first metal and is formed in a flat plate, and the second metal layer The layer comprises a second metal and is formed in a flat plate, wherein disposing the first metal layer on the upper surface and the lower surface of the conductive contact pin, the second metal layer is disposed inside the conductive contact pin, and The first metal layer protrudes from the second metal layer to form grooves between adjacent first metal layers, and the grooves are continuously arranged along the side peripheral edges of the conductive contact pins. The conductive contact pin as claimed in claim 6 or claim 7, wherein A plurality of the groove portions are spaced from each other in a height direction of the conductive contact pins.

Images