TW202230410A - 電極結構材料及製備電極結構材料的方法、電解電容器 - Google Patents

電極結構材料及製備電極結構材料的方法、電解電容器 Download PDF

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Publication number
TW202230410A
TW202230410A TW110106696A TW110106696A TW202230410A TW 202230410 A TW202230410 A TW 202230410A TW 110106696 A TW110106696 A TW 110106696A TW 110106696 A TW110106696 A TW 110106696A TW 202230410 A TW202230410 A TW 202230410A
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TW
Taiwan
Prior art keywords
metal
electrode structure
base material
substrate
fiber layer
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TW110106696A
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English (en)
Chinese (zh)
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TWI845820B (zh
Inventor
胡三元
肖遠龍
何鳳榮
周政
李向東
Original Assignee
大陸商東莞東陽光科研發有限公司
大陸商乳源瑤族自治縣東陽光化成箔有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/04Electrodes or formation of dielectric layers thereon
    • H01G9/042Electrodes or formation of dielectric layers thereon characterised by the material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/04Electrodes or formation of dielectric layers thereon
    • H01G9/042Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/045Electrodes or formation of dielectric layers thereon characterised by the material based on aluminium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/04Electrodes or formation of dielectric layers thereon
    • H01G9/048Electrodes or formation of dielectric layers thereon characterised by their structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/145Liquid electrolytic capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Powder Metallurgy (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW110106696A 2020-04-10 2021-02-25 電極結構材料及製備電極結構材料的方法、電解電容器 TWI845820B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010277250 2020-04-10
CN202010277250.5 2020-04-10

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TW202230410A true TW202230410A (zh) 2022-08-01
TWI845820B TWI845820B (zh) 2024-06-21

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TW110106696A TWI845820B (zh) 2020-04-10 2021-02-25 電極結構材料及製備電極結構材料的方法、電解電容器

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JP (1) JP7357656B2 (ja)
CN (1) CN113035572B (ja)
TW (1) TWI845820B (ja)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4547835B2 (ja) * 2001-06-21 2010-09-22 パナソニック株式会社 固体電解コンデンサおよびその製造方法
JP2006004984A (ja) * 2004-06-15 2006-01-05 Shinko Electric Ind Co Ltd 固体電解キャパシタ及びその製造方法
EP2009653A4 (en) * 2006-03-31 2015-08-12 Nippon Chemicon ELECTRODE MATERIAL FOR AN ELECTROLYTIC CONDENSER
JP2010232451A (ja) * 2009-03-27 2010-10-14 Hitachi Aic Inc アルミニウム電解コンデンサ用の電極
JP5509715B2 (ja) * 2009-08-05 2014-06-04 セイコーエプソン株式会社 リチウム電池用電極及びリチウム電池
GB2489493B (en) * 2011-03-31 2013-03-13 Norsk Titanium Components As Method and arrangement for building metallic objects by solid freeform fabrication
US20150201504A1 (en) * 2014-01-15 2015-07-16 Applied Nanotech, Inc. Copper particle composition
JP6528076B2 (ja) * 2014-10-09 2019-06-12 パナソニックIpマネジメント株式会社 電極箔とその製造方法および電解コンデンサ
CN109689267B (zh) * 2016-07-08 2022-02-25 挪威钛公司 用于由两个焊枪通过固体自由成形制造来构建金属物体的方法和设备
CN106702375B (zh) * 2016-12-05 2019-01-01 天津工业大学 一种激光-感应复合熔化沉积纤维增强金属基复合材料的装置
CN107354498B (zh) * 2017-07-18 2019-04-30 丰宾电子(深圳)有限公司 一种高压高容量的铝电解电容器用电极箔的制造方法
CN107732190B (zh) * 2017-09-30 2020-08-11 山西沃特海默新材料科技股份有限公司 一种利用水雾化制备铜-铝-硅合金粉末的方法及其应用
JP2019186464A (ja) * 2018-04-16 2019-10-24 株式会社ブイ・テクノロジー 配線修正装置および配線修正方法

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CN113035572A (zh) 2021-06-25
JP7357656B2 (ja) 2023-10-06
CN113035572B (zh) 2022-09-27
JP2021168384A (ja) 2021-10-21
TWI845820B (zh) 2024-06-21

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