TW202229390A - 具有酸基之(甲基)丙烯酸酯樹脂、硬化性樹脂組成物、硬化物、絕緣材料及阻焊構件 - Google Patents

具有酸基之(甲基)丙烯酸酯樹脂、硬化性樹脂組成物、硬化物、絕緣材料及阻焊構件 Download PDF

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Publication number
TW202229390A
TW202229390A TW110142163A TW110142163A TW202229390A TW 202229390 A TW202229390 A TW 202229390A TW 110142163 A TW110142163 A TW 110142163A TW 110142163 A TW110142163 A TW 110142163A TW 202229390 A TW202229390 A TW 202229390A
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TW
Taiwan
Prior art keywords
acid
group
meth
acrylate
resin
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TW110142163A
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English (en)
Chinese (zh)
Inventor
山田駿介
龜山裕史
Original Assignee
日商Ｄｉｃ股份有限公司
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Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202229390A publication Critical patent/TW202229390A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
TW110142163A 2020-11-19 2021-11-12 具有酸基之(甲基)丙烯酸酯樹脂、硬化性樹脂組成物、硬化物、絕緣材料及阻焊構件 TW202229390A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020192338 2020-11-19
JP2020-192338 2020-11-19

Publications (1)

Publication Number Publication Date
TW202229390A true TW202229390A (zh) 2022-08-01

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Family Applications (1)

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TW110142163A TW202229390A (zh) 2020-11-19 2021-11-12 具有酸基之(甲基)丙烯酸酯樹脂、硬化性樹脂組成物、硬化物、絕緣材料及阻焊構件

Country Status (3)

Country Link
JP (1) JPWO2022107508A1 (https=)
TW (1) TW202229390A (https=)
WO (1) WO2022107508A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023218876A1 (https=) * 2022-05-13 2023-11-16

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3397249B2 (ja) * 1993-03-10 2003-04-14 日本化薬株式会社 樹脂組成物及びその硬化物
JP2877659B2 (ja) * 1993-05-10 1999-03-31 日本化薬株式会社 レジストインキ組成物及びその硬化物
JP2000214584A (ja) * 1999-01-27 2000-08-04 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物とこれを用いて形成したソルダ―レジスト皮膜や樹脂絶縁層を有するプリント配線板
JP2002040647A (ja) * 2000-07-31 2002-02-06 Taiyo Ink Mfg Ltd レジストインキ組成物
JP4471149B2 (ja) * 2003-10-10 2010-06-02 日本化薬株式会社 感光性樹脂組成物及びその硬化物の製造法
JP6184087B2 (ja) * 2012-12-07 2017-08-23 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用スペーサー及び／またはカラーフィルター保護膜
KR102668938B1 (ko) * 2018-09-18 2024-05-24 닛뽄 가야쿠 가부시키가이샤 반응성 폴리카르복실산 수지 혼합물, 그것을 사용한 활성 에너지선 경화형 수지 조성물 및 그 경화물, 및 반응성 에폭시카르복실레이트 수지 혼합물

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WO2022107508A1 (ja) 2022-05-27
JPWO2022107508A1 (https=) 2022-05-27

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