TW202215924A - Electronic device - Google Patents

Abstract

An electronic device is provided. The electronic device includes a housing, a display unit, a first support plate and a plurality of first micro springs. The display unit has a display surface. The first support plate is disposed on the back side of the display unit opposite to the display surface, and has a first surface not facing the display surface. The first micro springs extend from the first surface of the first support plate. The first micro springs are sandwiched between the housing and the first surface.

Description

electronic device

The present invention relates to an electronic device; in particular, the present invention relates to an electronic device with a buffer function.

In traditional rigid displays, the protective layer on the surface is rigid glass, which is resistant to impact but cannot be bent. With the rise of the demand for narrow-bezel display screens and foldable mobile phones, bendable flexible displays are born for narrow bezel or bendable purposes.

The protective layer of the surface layer of the flexible display is a polyimide film (PI), which can be bent but not resistant to impact. In the test of ball-dropping ability, compared with the glass protective layer of rigid display, the glass protective layer of the rigid display is broken when 24g steel balls are dropped at a critical height of 50cm. The impact resistance of the protective layer of the flexible display is too low, and its display area is not resistant to falling balls. When a 23.8g steel ball is dropped at a critical height of 2cm, it will be broken. The reason for the damage is that the local stress of the display element is too high at the moment of impact, which causes the element to be damaged. The local stress concentrates on the contact surface of the falling ball, and pulls around the contact surface of the falling ball.

In addition, the foldable mobile phone supports the display panel with two sliding parts, and uses the sliding parts to slide on the casing to solve the difference in bending length. However, the display panel is suspended in the bending area bypassing the sliding member, and has no support or anti-collision capability, and is easily damaged due to collision during transportation or assembly, resulting in a decrease in the yield of transportation or assembly.

One object of the present invention is to provide a buffer structure, which can increase the anti-collision capability of the flexible display.

One object of the present invention is to provide a flexible display with anti-collision capability.

An embodiment of the present invention relates to an electronic device. The electronic device includes a casing, a display unit, a first support plate and a plurality of first micro springs. The display unit has a display surface. The first support plate is disposed on the back side of the display unit opposite to the display surface, and has a first surface not facing the display surface. The first micro-spring extends from the first surface of the first support plate. The first micro-spring is sandwiched between the casing and the first surface.

The following will clearly illustrate the spirit of the present disclosure with drawings and detailed descriptions. Anyone with ordinary knowledge in the technical field, after understanding the embodiments of the present disclosure, can make changes and modifications by the techniques taught in the present disclosure. It does not depart from the spirit and scope of this disclosure.

The terms "comprising", "including", "having", "containing", etc. used in this document are all open-ended terms, meaning including but not limited to.

It will be understood that, although the terms “first,” “second,” “third,” etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, and/or or parts shall not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a "first element," "component," "region," "layer" or "section" discussed below could be termed a second element, component, region, layer or section without departing from the teachings herein.

Relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element, as shown in the figures. It should be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" can include "lower" and "above" depending on the particular orientation of the figures. Similarly, if the device in one of the figures was turned over, elements described as "below" or "beneath" other elements would then be oriented over the other elements “Above.” Thus, the exemplary terms “below” or “below” can encompass both an orientation of above and below.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed as having meanings consistent with their meanings in the context of the related art and the present invention, and are not to be construed as idealized or excessive Formal meaning, unless expressly defined as such herein.

1 is a schematic cross-sectional view of an electronic device 10 according to an embodiment of the present invention; FIG. 2 is a schematic cross-sectional view of the electronic device 10 depicted in an embodiment of the present invention. As shown in FIGS. 1 and 2 , the electronic device 10 includes a casing 100 , a display unit 200 , a first support plate 300 and a plurality of first micro-springs 321 . In a preferred embodiment, the electronic device 10 is a mobile display device, such as a mobile phone; specifically, the electronic device 10 is a mobile display device with a flexible display panel, such as a narrow-frame mobile phone with a flexible flexible display panel. In the embodiment of FIG. 1 and FIG. 2 , the first supporting plate 300 is a supporting steel plate for the display screen of the mobile display device.

As shown in FIGS. 1 and 2 , the casing 100 includes a casing top 110 , a casing back 130 , and a casing side 120 connecting the casing top 110 and the casing back 130 . The case top 110 has a case top surface, the case side portion 120 has a case first side surface 121 , and the case back 130 has a case back surface 131 . The display unit 200 has a display surface 211 and a backside 212 opposite to the display surface 211 . In a preferred embodiment, a display area of the mobile display device is defined on the display surface 211 .

As shown in FIG. 1 and FIG. 2 , the electronic device 10 further includes a cover layer 600 covering the top of the display surface 211 . In a preferred embodiment, the cover layer 600 is acrylic or polycarbonate (PC). The cover layer 600 has a cover layer thickness dc in the third direction D3 perpendicular to the display surface 211 ; in a preferred embodiment, the cover layer thickness dc is 50-200um.

As shown in FIGS. 1 and 2 , the display unit 200 further includes a display panel 210 and a backplane 250 ; the backplane 250 is sandwiched between the display panel 210 of the display unit 200 and the first support plate 300 . The backplane 250 has a backplane thickness db in a direction perpendicular to the display surface 211 (the third direction D3 ); the thickness of the backplane thickness db ranges from 10 to 50 um;

The display panel 210 is sandwiched between the casing 100 and the first support plate 300 , and is in contact with the cover layer 600 through the display surface 210 . One end of the display panel 210 has a bending portion 220, the bending portion 220 bypasses one end of the first support plate 300, the convex surface faces the first side surface 121 of the casing, and the concave surface faces the first surface 311 of the first support plate 300, As shown in FIG. 2 ; and the bending portion 220 is covered by the accommodating space formed by the casing top 110 , the casing side 120 , and the casing back 130 of the casing 100 . One end of the bent portion 220 of the display panel 210 is in contact with the cover layer 600 , and the other end is in contact with the back surface 131 of the case back 130 . The display panel 210 has a display panel thickness dm in a direction perpendicular to the display surface 211 (the third direction D3); the display panel thickness dm has a thickness range of 5-30um; in a preferred embodiment, the display panel thickness dm is 10um.

As shown in FIG. 1 and FIG. 2 , the first support plate 300 is disposed on the back side 212 of the display unit 200 opposite to the display surface 211 , and has a first surface 311 that does not face the display surface 211 . In other words, the first surface 311 may include a surface facing the first side surface 121 of the housing, as shown in FIG. 1 ; the first surface 311 may also be a surface facing the rear surface 131 of the housing, as shown in FIG. 2 . The first micro-spring 321 extends from the first surface 311 of the first support plate 300; preferably, the first micro-spring 321 and the first support plate 300 are made of the same material, and are supported from the first support by a metal process such as stamping Plate 300 is generated. The first micro-spring 321 is sandwiched between the casing 100 and the first surface 311 .

In the embodiment of FIG. 1 , the first surface 311 is the surface facing the first side surface 121 of the casing, and the first micro-spring 321 extends from the first surface 311 ; in this embodiment, the first micro-spring 321 is sandwiched between Between the first side surface 121 of the housing 100 and the first surface 311 of the first support plate 300 . In the embodiment of FIG. 2 , the first surface 311 is the surface facing the back surface 131 of the casing, and the first micro-spring 321 extends from the first surface 311 ; in this embodiment, the first micro-spring 321 is sandwiched between the casing between the back surface 131 of the housing 100 and the first surface 311 of the first support plate 300 .

Since the suspension that may be generated when the bent portion 220 bypasses the end of the first support plate 300 is likely to be damaged when the electronic device 10 is hit by a collision, thereby causing damage to the display panel 210 of the display unit 200 , the first part of FIG. The first micro-spring 321 extending from the surface 311 can provide the necessary support for the suspension created by the bent portion 220 . The first micro-spring 321 extending from the first surface 311 of FIG. 2 can provide the necessary support for the suspension created by the display panel 210 and the back 130 of the casing. In other words, the first micro-springs 321 extending from the first surface 311 can provide better support for the display panel 210 in the casing 100 and reduce damage caused by external forces.

FIG. 3 is a three-dimensional schematic diagram of the first surface 311 and the first micro-spring 321 according to an embodiment of the present invention. In the embodiment of FIG. 3 , the first surface 311 faces the back 130 of the housing 100 , specifically, the first surface 311 faces the back 131 of the back 130 of the housing 130 ; the first micro-spring 321 faces the back of the housing 100 . The first side surface 121 of the casing is curled.

4 is a schematic cross-sectional view of the first surface 311 and the first micro-spring 321 according to an embodiment of the present invention. The difference between FIG. 4 and FIG. 2 is that, in the embodiment of FIG. 2 , the first micro-spring 321 is curled toward the first side surface 121 of the shell 100 , that is, curled toward the opposite direction of the second direction D2 . In the embodiment of FIG. 4 , the first micro-spring 321 is curled toward the opposite direction of the first side surface 121 of the shell 100 , that is, curled toward the second direction D2 . The first micro-spring 321 in the embodiment in FIG. 2 has similar supporting effects to the embodiment in FIG. 4 , but the concave configuration in FIG. 2 saves space compared with the convex configuration in FIG. 4 . In another embodiment (not shown), the adjacent first micro-springs 321 can also be arranged to face the first side surface 121 of the housing 100 and the first side surface 121 of the housing 100 respectively according to design requirements. curl in the opposite direction.

5 is a schematic cross-sectional view of the first surface 311 and the first micro-spring 321 according to another embodiment of the present invention. In the embodiment of FIG. 5 , the first surface 311 faces the back 130 of the housing 100 , specifically, the first surface 311 faces the back 131 of the back 130 of the housing 130 ; the first micro-spring 321 faces the back of the housing 100 . The first side 121 of the housing extends. The difference between FIG. 5 and FIG. 2 is that the form of a micro-spring 321 is different. In detail, the first micro-spring 321 in FIG. 2 is curled after extending from the first surface 311 , and the first micro-spring 321 in FIG. The one side 311 extends obliquely after being extended.

6 is a schematic cross-sectional view of the first surface 311 and the first micro-spring 321 according to another embodiment of the present invention. The difference between FIG. 6 and FIG. 5 is that, in the embodiment of FIG. 5 , the first micro-spring 321 extends toward the first side surface 121 of the case 100 , that is, toward the opposite direction of the second direction D2 ; In an embodiment, the first micro-spring 321 extends toward the opposite direction of the first side surface 121 of the case 100 , that is, toward the second direction D2 . The first micro-spring 321 in the embodiment in FIG. 5 has similar supporting effects to the embodiment in FIG. 6 , but the inner oblique configuration in FIG. 5 saves space compared with the outer oblique configuration in FIG. 6 . In another embodiment (not shown), the adjacent first micro-springs 321 can also be arranged to face the first side surface 121 of the housing 100 and the first side surface 121 of the housing 100 respectively according to design requirements. extends in the opposite direction.

FIG. 7 is a three-dimensional schematic diagram of the first surface 311 and the first micro-spring 321 according to another embodiment of the present invention; FIG. 8 is a schematic diagram of the first surface 311 and the first micro-spring according to another embodiment of the present invention. 321 front view. As shown in FIG. 7 , the housing 100 has a first side S1 , the first side S1 extends along the first direction D1 , the first surface 311 faces the first side surface 121 of the housing 100 , and the first micro-spring 321 extends along the first side 121 of the housing 100 . Direction D1 distribution. The adjacent first micro-springs 321 in the D1 direction are respectively curled toward the case top surface 111 of the case top 110 of the case 100 and the case back surface 131 of the case back 130 of the case 100; The first micro-springs 321 are alternately curled in different directions; as shown in FIG. 7 and FIG. 8 . This configuration can save the most material.

9 is a schematic cross-sectional view of the first surface 311 and the first micro-spring 321 according to another embodiment of the present invention. The casing 100 has a first side S1 , the first side S1 extends along the first direction D1 , the first surface 311 faces the first side surface 121 of the casing 100 , and the first micro-springs 321 are distributed along the first direction D1 . As shown in FIG. 9 , the adjacent first micro-springs 321 extend toward the case top surface 111 of the case top 110 of the case 100 and the case back surface 131 of the case back 130 of the case 100 respectively; The adjacent first micro-springs 321 extend in different directions alternately. The difference between FIG. 9 and FIG. 1 lies in the different forms of the first micro-springs 321. Specifically, the first micro-springs 321 in FIG. 1 are curled after extending from the first surface 311. The first micro-springs 321 in FIG. 9 are composed of The first surface 311 extends obliquely after being extended.

10 is a schematic cross-sectional view of the electronic device 10 and the first micro-spring 321 and the second micro-spring 322 according to another embodiment of the present invention. As shown in FIG. 10 , the electronic device 10 further includes a plurality of second micro-springs 322 , and the second micro-springs 322 extend from the second surface 312 of the first support plate 300 . In the embodiment of FIG. 2 , the first surface 311 of the first support plate 300 is opposite to the display surface 211 , and the second surface 312 faces the first side surface 121 of the housing 100 ; the first micro-spring 321 is sandwiched between the Between one surface 311 and the back 130 of the housing 100 ; and the second micro-spring 322 is sandwiched between the second surface 312 and the first side surface 121 of the housing 100 . In the embodiment of FIG. 10 , the electronic device 10 is preferably a mobile display device with a flexible display panel, and the first supporting plate 300 is preferably a supporting steel plate for a display screen of the mobile display device.

In the embodiment of FIG. 10 , the first micro-spring 321 and the second micro-spring 322 are respectively extended from different surfaces (the first surface 311 and the second surface 312 ) of the same support plate (the first support plate 300 ), so the first A micro-spring 321, a second micro-spring 322 and the extended first support plate 300 are made of the same material. In a preferred embodiment, the first micro-spring 321 and the second micro-spring 322 in FIG. 10 are steel micro-springs extending from steel plates.

11 is a schematic cross-sectional view of the electronic device 10 and the first micro-spring 321 and the second micro-spring 322 according to another embodiment of the present invention. The difference between the embodiment shown in FIG. 11 and the embodiment shown in FIG. 10 is that a metal plate 260 is added between the first support plate 300 and the display unit 200 in FIG. 11 . In the embodiment of FIG. 3 , the electronic device 10 is preferably a foldable mobile display device, the metal plate 260 is preferably a supporting steel plate for the display screen of the mobile display device, and the first supporting plate 300 is preferably a sliding plate of the foldable mobile display device. pieces. The hardness of the metal plate 260 is harder than that of the first support plate 300 . In the direction ( D3 ) perpendicular to the first surface 311 , the thickness of the first support plate 300 is thicker than that of the metal plate 260 , so a micro-spring with a longer length can be fabricated. The first micro-spring 321 and the second micro-spring 322 in FIG. 11 are micro-springs extending from the slider, such as polycarbonate (PC) micro-springs.

12 is a schematic cross-sectional view of the electronic device 10 and the first micro-spring 321 and the third micro-spring 422 according to another embodiment of the present invention. As shown in FIG. 12 , the electronic device 10 further includes a second support plate 400 and a plurality of third micro-springs 422 . The second support plate 400 is sandwiched between the display unit 200 and the first support plate 300 , and the third micro-springs 422 extend from the third surface 412 of the second support plate 400 . In the embodiment of FIG. 12 , the first surface 311 of the first support plate 300 is opposite to the display surface 211 , and the third surface 311 of the first support plate 300 faces the first side surface 121 of the casing 100 ; The spring 321 is sandwiched between the first surface 311 of the first support plate 300 and the back surface 131 of the housing back 130 of the housing 100 ; the third micro-spring 422 is sandwiched between the third surface of the first support plate 300 and the back surface 131 of the housing back 130 of the housing 100 . Between the first side faces 121 of the casing 100 .

The difference between FIG. 12 and FIG. 11 is that, in FIG. 12 , a second support plate 400 is added between the first support plate 300 and the display unit 200 . In the embodiment of FIG. 12 , the first micro-springs 321 extending from the first surface 311 of the first supporting plate 300 and the third micro-springs extending from the third surface 412 of the second supporting plate 400 are used respectively. The spring 422 provides the required support between the display panel 210 of the display unit 200 and the casing 100 . Therefore, the first micro-spring 321 in FIG. 12 is a micro-spring extending from the first supporting plate 300, and the second micro-spring 322 is a micro-spring extending from the sliding member of the second supporting plate 400, and the two can be made of different materials.

In the embodiment of FIG. 12 , the electronic device 10 is a foldable mobile display device, the first support plate 300 is preferably a supporting steel plate for the display screen of the foldable mobile display device, and the second support plate 400 is preferably a foldable mobile display device. of the slider. The hardness of the second support plate 400 is smaller than that of the first support plate 300 . Therefore, the hardness of the first micro-spring 321 extending from the first supporting plate 300 is slightly greater than that of the second micro-spring 322 extending from the second supporting plate 400; The micro-spring 321 is more wear-resistant than the second micro-spring 322 . In the direction ( D3 ) perpendicular to the first surface 311 , the thickness of the second support plate 400 is larger than that of the first support plate 300 .

FIG. 13 is a three-dimensional schematic diagram of the third surface 412 and the third micro-spring 422 according to another embodiment of the present invention. The casing 100 has a first side S1, the first side S1 extends along the first direction D1, and the third micro-springs 422 are distributed along the first direction D1. The adjacent third micro-springs 422 are respectively curled toward the housing top 110 of the housing 100 and the housing back 130 of the housing 100, as shown in FIG. 13; that is, the adjacent third micro-springs 422 are staggered toward Curl in different directions.

14 is a schematic cross-sectional view of the third surface 412 and the third micro-spring 422 according to another embodiment of the present invention. The casing 100 has a first side S1, the first side S1 extends along the first direction D1, and the third micro-springs 422 are distributed along the first direction D1. The adjacent third micro-springs 422 extend toward the housing top 110 of the housing 100 and the housing back 130 of the housing 100 respectively, as shown in FIG. 14 ; that is, the adjacent third micro-springs 422 are staggered toward Extend in different directions. The difference between FIG. 14 and FIG. 12 lies in the different forms of the third micro-springs 422. In detail, the third micro-springs 422 in FIG. 14 are curled after extending from the third surface 412. The third micro-springs 422 in FIG. 12 are formed by The third surface 412 extends obliquely after being extended.

FIG. 15 is a schematic top view of the casing 100 and the first micro-spring 321 according to another embodiment of the present invention. The casing 100 has a first side S1 and a second side S2 that are perpendicular to each other, the first side S1 extends along the first direction D1, and the second side S2 extends along the second direction D2. The third direction D3 is a direction perpendicular to the plane formed by the first direction D1 and the second direction D2, that is, a direction perpendicular to the back surface 131 of the casing. The first micro-springs 321 are distributed in a matrix along the first direction D1 and the second direction D2, as shown in FIG. 15 .

FIG. 16 is a schematic diagram illustrating the distribution of the first micro-springs 311 according to another embodiment of the present invention. The casing 100 has a first side S1, and the first side S1 extends along the first direction D1. The first surface 311 faces the case back 130 of the case 100 ; specifically, the first surface 311 faces the case back 131 of the case back 130 . In the direction perpendicular to the first surface 311 (the third direction D3 ), each of the first micro-springs 321 has a first micro-spring extension length Lb; in the first direction D1 , it is closer to the casing side 120 of the casing 100 The first micro-spring 321 corresponding to the first micro-spring extension length Lb is longer, as shown in FIG. 16 . In other words, in the first direction D1, the line connecting the bottom surfaces of the extended length Lb of the first micro-spring roughly presents the distribution of the inverted smile curve; this arrangement has a better buffering effect.

17 is a schematic cross-sectional view of the first micro-spring 141 of the housing, the second micro-spring 142 of the housing, and the third micro-spring 143 of the housing according to an embodiment of the present invention; FIG. 18 is a drawing according to an embodiment of the present invention The three-dimensional schematic diagram of the first micro-spring 141 of the housing, the second micro-spring 142 of the housing, and the third micro-spring 143 of the housing shown. As shown in FIG. 17 and FIG. 18 , the electronic device 10 further includes a plurality of housing first micro-springs 141 extending from the housing top surface 111 of the housing 100 . As shown in FIG. 18 and FIG. 19 , the electronic device 10 further includes a plurality of housing second micro-springs 142 extending from the housing side portion 120 of the housing 100 ; in detail, the housing second micro-springs 142 are formed by The first side surface 121 of the case (and other side surfaces of the case, such as the second side surface 122 of the case, the third side surface 123 of the case, and the fourth side surface 124 of the case) of the case side portion 120 extend out. The second micro spring 142 of the casing is sandwiched between the side portion 120 of the casing and the display unit 200 . The first micro-spring 141 of the casing is sandwiched between the top surface 111 of the casing and the display unit 200 . As shown in FIG. 17 and FIG. 18 , the electronic device 10 further includes a plurality of third micro-springs 143 of the housing, extending from the back 131 of the housing 100 ; the third micro-springs 143 of the housing are sandwiched on the back of the housing 131 and the display unit 200.

The casing 100 has a first side S1, the first side S1 extends along the first direction D1, and the second micro-springs 142 of the casing are distributed along the first direction D1. The second micro-springs 142 of the adjacent casings are respectively curled toward the top 110 of the casing 100 and the back 130 of the casing 100; that is, the second micro-springs 142 of the adjacent casings are staggered in different directions Curl, as shown in Figures 17 and 18.

19 is a schematic cross-sectional view of the first micro-spring 141 of the housing, the second micro-spring 142 of the housing, and the third micro-spring 143 of the housing according to another embodiment of the present invention. The difference between FIG. 19 and FIG. 17 is that, in the embodiment of FIG. 17 , the third micro-spring 143 of the housing is curled toward the first side surface 121 of the housing 100 , that is, curled toward the opposite direction of the second direction D2 . In the embodiment of FIG. 19 , the third micro-spring 143 of the housing is curled toward the opposite direction of the first side surface 121 of the housing 100 , that is, curled toward the second direction D2 . The third micro-springs 143 of the housing shown in FIGS. 19 and 17 have similar supporting force, but the concave configuration in FIG. 17 is more space-saving than the convex configuration in FIG. 19 . In another embodiment (not shown in the figure), the third micro-springs 143 of adjacent housings can also be arranged to face the first side surface 121 of the housing 100 and the first side of the housing 100 respectively according to design requirements. The opposite direction of the side surface 121 is curled.

The difference between FIG. 17 and FIG. 2 is that in the embodiment of FIG. 2 , the first micro-spring 321 extending from the first surface 311 of the first support plate 300 is used as the space between the display unit 200 and the back 130 of the casing In the embodiment of FIG. 17 , the third micro-spring 143 extending from the back 131 of the back 130 of the case is used as the support between the display unit 200 and the back 130 of the case. In another embodiment (not shown), the first micro-spring 321 of FIG. 2 and the third micro-spring 143 of the housing of FIG. 17 can be alternately matched according to design requirements as the support between the display unit 200 and the back 130 of the housing. .

It must be noted that, in FIG. 17 , the first micro-spring 321 of FIG. 2 is replaced by the third micro-spring 143 of the housing as the support between the display unit 200 and the back 130 of the housing. In another embodiment (not shown), the third micro-spring 143 of the housing in FIG. 17 can also replace the first micro-spring 321 in FIGS. 3-6 and 10-12 as the space between the display unit 200 and the back 130 of the housing. support. In another embodiment (not shown), according to design requirements, the first micro-spring 321 of FIGS. 3-6 and FIGS. 10-12 and the third micro-spring 143 of the housing of FIG. 17 can be alternately matched to serve as the display unit 200 Support with the back 130 of the housing. It will not be repeated here.

20 is a schematic cross-sectional view of the first micro-spring 141 of the housing, the second micro-spring 142 of the housing, and the third micro-spring 143 of the housing according to another embodiment of the present invention. The casing 100 has a first side S1, the first side S1 extends along the first direction D1, and the second micro-springs 142 of the casing are distributed along the first direction D1. The second micro-springs 142 of adjacent housings extend toward the housing top 110 of the housing 100 and the housing back 130 of the housing 100 respectively; that is, the second micro-springs 142 of adjacent housings are staggered in different directions extension, as shown in Figure 20. The difference between FIG. 20 and FIG. 17 is that the form of the second micro-spring 142 of the housing is different. In detail, the second micro-spring 142 of the housing of FIG. 17 is curled after extending from the back of the housing 131 of the back of the housing 130 20 , the second micro-spring 142 of the housing is extended obliquely from the back surface 131 of the housing back 130 .

21 is a schematic cross-sectional view of the first micro-spring 141 of the housing, the second micro-spring 142 of the housing, and the third micro-spring 143 of the housing according to another embodiment of the present invention. The difference between FIG. 21 and FIG. 20 is that, in the embodiment of FIG. 20 , the third micro-spring 143 of the case extends toward the first side surface 121 of the case 100 , that is, toward the opposite direction of the second direction D2 . In the embodiment of FIG. 21 , the third micro-spring 143 of the housing extends toward the opposite direction of the first side surface 121 of the housing 100 , that is, extends toward the second direction D2 . In another embodiment (not shown in the figure), the third micro-springs 143 of adjacent housings can also be arranged to face the first side surface 121 of the housing 100 and the first side of the housing 100 respectively according to design requirements. The opposite direction of the side surface 121 extends. The third micro-spring 143 of the housing in the embodiment of FIG. 20 and the embodiment of FIG. 21 have similar supporting effects, but the inwardly inclined configuration in FIG. 21 saves space.

FIG. 22 is a schematic diagram illustrating the distribution of the third micro-springs 143 of the housing according to another embodiment of the present invention. The casing 100 has a first side S1, and the first side S1 extends along the first direction D1. In the direction perpendicular to the back surface 131 of the casing (the third direction D3), each third micro-spring 143 of the casing has an extension length Ls of the third micro-spring of the casing; in the first direction D1, the closer to the casing of the casing 100 The third micro-spring 143 of the housing of the body side portion 120 corresponds to the longer extension length Ls of the third micro-spring of the housing, as shown in FIG. 22 . In other words, in the first direction D1, the line connecting the top surface of the extended length Ls of the third micro-spring of the housing roughly presents a distribution of a smile curve; this configuration has a better buffering effect.

23 is a schematic cross-sectional view of the first micro-spring 321 and the buffer unit 500 according to an embodiment of the present invention; FIG. 24 is a cross-sectional schematic view of the first micro-spring 321 and the buffer unit 500 according to another embodiment of the present invention . As shown in FIGS. 23 and 24 , the electronic device 10 further includes a plurality of buffer materials 510 sandwiched between the first support plate 300 and the casing 100 . The damping coefficient of the buffer material 510 is larger than that of the first micro-spring 321 . The buffer materials 510 are respectively arranged with the first micro-springs 321 which are closer to each other to form the buffer unit 500 .

The difference between FIGS. 23 to 24 and FIGS. 1 to 2 is that, in FIGS. 23 to 24 , the buffer material 510 and the micro-spring are arranged in combination to form the buffer unit 500 . In the embodiments of FIGS. 1 to 2 , the first micro-springs 321 extending from the first surface 311 of the first support plate 300 provide the required support between the display panel 210 of the display unit 200 and the casing 100 and buffer. In the embodiments of FIGS. 23 to 24 , the buffer unit 500 formed by the first micro-spring 321 extending from the first surface 311 of the first support plate 300 and the buffer material 510 is used to provide the display of the display unit 200 Support and buffering are required between the panel 210 and the casing 100 . In addition, as shown in FIG. 24 , the buffer material 510 is preferably disposed on the concave side of the first micro-spring 321 which is closer. With this arrangement, when pressed by an external force, the first micro-spring 321 is less likely to interfere with the buffer material 510 when it is bent, so the distance between the buffer material 510 and the first micro-spring 321 can be shortened and the matching between the two can be improved. Effect.

It should be noted that, the buffer material 510 of FIGS. 23 to 24 can also be configured with the first micro-spring 321 , the second micro-spring 322 and the third micro-spring 422 of FIGS. 3 to 14 to form the buffer unit 500 respectively. , will not be repeated here.

25 illustrates the first micro-spring 141 and the buffer unit 500 of the housing, the second micro-spring 142 and the buffer unit 500 of the housing, and the third micro-spring 143 and the buffer unit 500 of the housing according to another embodiment of the present invention Schematic cross section. As shown in FIG. 26 , the electronic device 10 further includes a plurality of buffer materials 510 sandwiched between the casing 110 and the display unit 200 . The damping coefficient of the buffer material 510 is larger than the damping coefficient of the first micro-spring 141 of the casing; The springs 143 are arranged to form a plurality of buffer units 500 .

The difference between FIG. 25 and FIG. 17 is that in FIG. 25 , a buffer material 510 is added, which is arranged with each micro-spring (the first micro-spring 141 of the housing, the second micro-spring 142 of the housing, and the third micro-spring 143 of the housing) to form a buffer unit 500. In detail, in the embodiment of FIG. 17 , the first micro-springs 141 of the casing extending from the top surface 111 of the casing top 110 and the first side surface 121 of the casing from the side parts 120 of the casing are respectively used. (and other sides of the casing, such as the second side 122 of the casing, the third side 123 of the casing, the fourth side 124 of the casing), the second micro-spring 142 of the casing, and the casing from the back 130 of the casing The third micro springs 143 of the casing extending out from the back surface 131 provide necessary support and buffering between the display panel 210 of the display unit 200 and the casing 100 . In the embodiment of FIG. 25 , by means of the first micro-springs 141 of the housing extending from the top surface 111 of the housing top 110 , the first side surface 121 of the housing from the side 120 of the housing (and other housings) The side surfaces of the housing, such as the second side surface 122 of the housing, the third side surface 123 of the housing, the fourth side surface 124 of the housing, the second micro spring 142 of the housing, and the back surface 131 of the housing back 130 extending from the housing back 130. The third micro-springs 143 from the casing, each of which forms the buffer unit 500 together with the buffer material 510 , provides the required support and buffer between the display panel 210 of the display unit 200 and the casing 100 .

It should be noted that the buffer material 510 of FIG. 25 can also be configured with the first micro-spring 141 of the housing, the second micro-spring 142 of the housing, and the third micro-spring 143 of the housing of FIGS. 18-22 , respectively, to form a composition. The buffer unit 500 is not repeated here.

26 is a schematic cross-sectional view of a buffer unit 500 according to an embodiment of the present invention; FIG. 27 is a schematic cross-sectional view of a buffer unit 500 according to another embodiment of the present invention; A schematic cross-sectional view of the buffer unit 500 shown; FIG. 29 is a cross-sectional schematic view of the buffer unit 500 according to another embodiment of the present invention. It is worth noting that FIGS. 26 and 28 take the buffer unit 500 composed of the buffer material 510 and the first micro-spring 321 as an example, and FIGS. 27 and 29 take the buffer unit 500 composed of the buffer material 510 and the second micro-spring 142 of the housing as an example. The unit 500 is taken as an example, but not limited thereto; the first micro-spring 321 , the second micro-spring 322 , and the third micro-spring 422 in FIGS. 1 to 14 can be respectively combined with the buffer material 510 to form the one shown in FIGS. 26 and 28 . The buffer unit 500 ; the first micro-spring 141 of the housing, the second micro-spring 142 of the housing, and the third micro-spring 143 of the housing of FIGS. 17 to 22 can be combined with the buffer material 510 to form the buffer unit as shown in FIGS. 27 and 29 respectively. 500.

In one embodiment, the buffer material 510 is a block-shaped structure formed by optically clear adhesive; in another embodiment, the buffer material 510 is a porous unit, as shown in FIGS. 26 to 29 . Wherein, the porous unit can be, for example, polyethylene terephthalate (PET), rubber or foamed cotton. The damping coefficient of the buffer material 510 is preferably 10~100N*S/m, and the Young's modulus of the material is preferably 0.01Gpa~200Gpa.

In one embodiment, the cross section of the porous unit is a combination of repeated hexagons, as shown in FIGS. 26-27 . In a preferred embodiment, the hexagon is a regular hexagon. In another embodiment, the cross section of the porous unit is a combination of a plurality of repeating triangles, as shown in FIGS. 28-29 . In a preferred embodiment, the triangle is an equilateral triangle.

As shown in FIGS. 26 and 28 , each buffer unit 500 has a buffer unit thickness H in a direction perpendicular to the plane from which the first microspring 321 included therein extends; the buffer unit thickness H is preferably 0.1-1 mm.

As shown in FIG. 26 and FIG. 28 , each buffer unit 500 has a buffer unit width P in a direction parallel to the plane from which the included first micro-spring 321 extends; the width range of the buffer unit width P is preferably 1 mm ~6mm.

As shown in FIG. 26 and FIG. 28 , each porous unit 510 has a porous unit width W in a direction parallel to the plane from which the first micro-spring 321 is extended; The width range is preferably 500~5000um.

It should be noted that, FIGS. 26 and 28 take the first micro-spring 321 of FIG. 2 as an example, but not limited thereto; the first micro-spring 321 , the second micro-spring 322 , the Please refer to FIG. 26 and FIG. 28 for descriptions of the buffer unit thickness H, the buffer unit width P, and the porous unit width W of the third micro-spring 422 .

As shown in FIG. 27 and FIG. 29 , each buffer unit 500 has a buffer unit thickness H in a direction perpendicular to the plane from which the second micro-spring 142 of the included housing extends; the buffer unit thickness H is preferably 0.1~ 1mm.

As shown in FIG. 27 and FIG. 29 , each buffer unit 500 has a buffer unit width P in a direction parallel to the plane extending from the second micro-springs 142 of the four housings included respectively; the buffer unit width is preferably 1mm ~6mm.

As shown in FIG. 27 and FIG. 29 , each porous unit 510 has a width of the porous unit in the direction parallel to the plane extending from the second micro-spring 142 of the matched housing; The best is 500~5000um.

It should be noted that FIGS. 27 and 29 take the second micro-spring 142 of the housing in FIG. 17 as an example, but not limited to this; Please refer to FIG. 27 and FIG. 29 for descriptions of the thickness H of the buffer unit, the width P of the buffer unit, and the width of the porous unit of the spring 142 and the third micro-spring 143 of the housing.

30 is a schematic cross-sectional view of the electronic device 10 before being folded according to an embodiment of the present invention; FIG. 31 is a schematic cross-sectional view of the electronic device 10 after being folded according to an embodiment of the present invention. In other words, FIG. 30 is a flat state of the electronic device 10 , and FIG. 30 is a folded state of the electronic device 10 . The difference between FIG. 30 and FIG. 11 is that FIG. 11 only shows a schematic cross-sectional view of a side portion of the electronic device 10 and does not include the buffer material 510 ; FIG. 30 shows a schematic cross-sectional view of the entire electronic device 10 .

As shown in FIG. 30 and FIG. 31 , the electronic device 10 further includes a sliding member 700 sandwiched between the display unit 200 and the back surface 130 of the casing 100 . The electronic device 10 further includes a groove 135 for accommodating the buffer unit 500 . The slider 700 of FIGS. 30 and 31 also has a first surface 711 of the slider facing the back surface 131 of the housing back 130 and a first micro-spring 712 of the slider extending from the first surface 711 of the slider. The difference between the sliding member 700 and the first support plate 300 in this embodiment is that the display panel 210 of the display unit 200 does not bypass one end of the sliding member 700 but has a bent portion 220 , so it is not necessary for the sliding member 700 to face the casing The second surface 712 of the sliding member on the fourth side surface 124 of the body extends out of the second micro-spring of the sliding member.

In detail, when the electronic device 10 is folded from the flat state to the folded state, the first support plate 300 and the sliding member 700 slide toward the direction of the first side surface 121 and the fourth side surface 124 of the case, respectively. It drives the buffer unit 500 to slide in the groove 135 . On the contrary, when the electronic device 10 is from the folded state to the flattened state to the folded state, the first support plate 300 and the sliding member 700 slide toward the opposite direction of the first side 121 of the casing and the fourth side 124 of the casing, respectively, and are also driven accordingly. The buffer unit 500 slides in the groove 135 .

The present invention has been described by the above-mentioned related embodiments, however, the above-mentioned embodiments are only examples of implementing the present invention. It must be pointed out that the disclosed embodiments do not limit the scope of the present invention. On the contrary, modifications and equivalent arrangements within the spirit and scope of the claims are intended to be included within the scope of the present invention.

10: Electronics 100: Shell 110: Top of the shell 111: Shell top surface 120: Shell side 121: The first side of the shell 122: The second side of the shell 123: The third side of the shell 124: The fourth side of the shell 130: Shell back 131: Back of the shell 135: Groove 141: Shell first micro spring 142: Shell second micro spring 143: Shell third micro spring 200: Display unit 210: Display panel 211: Display surface 212: back side 220: Bending part 230: foldable part 250: Backplane 260: sheet metal 300: The first support plate 311: The first side 312: Second Side 321: First Micro Spring 322: Second Micro Spring 400: Second support plate 412: The third side 422: Third Micro Spring 500: Buffer unit 510: Buffer material 600: Overlay 700: Slider 711: Slider first side 712: Slider second side 721: Slider 1st Micro Spring S1: First side S2: Second side D1: first direction D2: Second direction D3: third direction Ls: the extension length of the third micro spring of the shell Lb: extension length of the first microspring H: Buffer unit unit thickness P: Buffer unit width W: porosity element width d1: Thickness of the first support plate d2: Thickness of the second support plate dc: overlay thickness dm: Display panel thickness db: thickness of back plate

The accompanying drawings of the present invention are described as follows: FIG. 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention; 2 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention; 3 is a three-dimensional schematic diagram of a first surface and a first micro-spring according to an embodiment of the present invention; 4 is a schematic cross-sectional view of the first surface and the first micro-spring according to an embodiment of the present invention; 5 is a schematic cross-sectional view of the first micro-spring on the first surface according to another embodiment of the present invention; 6 is a schematic cross-sectional view of the first micro-spring on the first surface according to another embodiment of the present invention; 7 is a three-dimensional schematic diagram of the first surface and the first micro-spring according to another embodiment of the present invention; 8 is a schematic front view of the first surface and the first micro-spring according to another embodiment of the present invention; 9 is a schematic cross-sectional view of the first surface and the first micro-spring according to another embodiment of the present invention; 10 is a schematic cross-sectional view of an electronic device and a first micro-spring and a second micro-spring according to another embodiment of the present invention; 11 is a schematic cross-sectional view of an electronic device and a first micro-spring and a second micro-spring according to another embodiment of the present invention; 12 is a schematic cross-sectional view of an electronic device and a first micro-spring and a third micro-spring according to another embodiment of the present invention; 13 is a three-dimensional schematic diagram of a third surface and a third micro-spring according to another embodiment of the present invention; 14 is a schematic cross-sectional view of the third surface and the third micro-spring according to another embodiment of the present invention; 15 is a schematic top view of a housing and a first micro-spring according to another embodiment of the present invention; 16 is a schematic diagram illustrating the distribution of the first micro-springs according to another embodiment of the present invention; 17 is a schematic cross-sectional view of the first micro-spring of the housing, the second micro-spring of the housing, and the third micro-spring of the housing according to an embodiment of the present invention; 18 is a three-dimensional schematic diagram of the first micro-spring of the housing, the second micro-spring of the housing, and the third micro-spring of the housing according to an embodiment of the present invention; 19 is a schematic cross-sectional view of the first micro-spring of the housing, the second micro-spring of the housing, and the third micro-spring of the housing according to another embodiment of the present invention; 20 is a schematic cross-sectional view of the first micro-spring of the housing, the second micro-spring of the housing, and the third micro-spring of the housing according to another embodiment of the present invention; 21 is a schematic cross-sectional view of the first micro-spring of the housing, the second micro-spring of the housing, and the third micro-spring of the housing according to another embodiment of the present invention; 22 is a schematic diagram illustrating the distribution of the third micro-springs in the housing according to another embodiment of the present invention; 23 is a schematic cross-sectional view of the first micro-spring and the buffer unit according to an embodiment of the present invention; 24 is a schematic cross-sectional view of the first micro-spring and the buffer unit according to another embodiment of the present invention; 25 is a schematic cross-sectional view of the first micro-spring and the buffer unit and the second micro-spring and the buffer unit according to another embodiment of the present invention; 26 is a schematic cross-sectional view of a buffer unit according to an embodiment of the present invention; 27 is a schematic cross-sectional view of a buffer unit according to another embodiment of the present invention; 28 is a schematic cross-sectional view of a buffer unit according to another embodiment of the present invention; 29 is a schematic cross-sectional view of a buffer unit according to another embodiment of the present invention; 30 is a schematic cross-sectional view of an electronic device before being folded according to an embodiment of the present invention; and 31 is a schematic cross-sectional view of an electronic device after being folded according to an embodiment of the present invention.

10: Electronics

100: Shell

110: Top of the shell

111: Shell top surface

120: Shell side

121: The first side of the shell

130: Shell back

131: Back of the shell

200: Display unit

210: Display panel

211: Display surface

212: back side

220: Bending part

250: Backplane

300: The first support plate

311: The first side

321: First Micro Spring

600: Overlay

D1: first direction

D2: Second direction

D3: third direction

dc: overlay thickness

dm: Display panel thickness

db: thickness of back plate

Claims (38)

An electronic device comprising: a shell; a display unit with a display surface; a first support plate disposed on a back side of the display unit opposite to the display surface and having a first surface not facing the display surface; and A plurality of first micro-springs extend from the first surface of the first support plate; wherein The first micro-springs are sandwiched between the first surface and the casing. The electronic device of claim 1, further comprising: A plurality of second micro-springs extend from a second surface of the first support plate; wherein The first surface is opposite to the display surface, and the second surface faces a first side surface of a housing of the housing; The first micro-springs are sandwiched between the first surface and a shell back of the shell; and The second micro-springs are sandwiched between the second surface and the first side surface of the casing. The electronic device of claim 1, further comprising: a second support plate sandwiched between the display unit and the first support plate; and A plurality of third micro-springs extend from a third surface of the second support plate; wherein The first surface is opposite to the display surface, and the third surface faces a first side surface of a housing of the housing; the first micro-springs are sandwiched between the first surface and a shell back of the shell; the third micro-springs are sandwiched between the third surface and the first side surface of the casing; The hardness of the second support plate is less than the hardness of the first support plate; and In the direction perpendicular to the first surface, the thickness of the second support plate is larger than that of the first support plate. The electronic device as claimed in claim 2 or 3, wherein: The casing has a first side and a second side perpendicular to each other, the first side extends along a first direction, and the second side extends along a second direction; and The first micro-springs are distributed in a matrix along the first direction and the second direction. The electronic device of claim 1, wherein: The first surface faces the back of one of the housings, and the first micro-springs are curled towards the first side of one of the housings. The electronic device of claim 1, wherein: The first surface faces the back of one of the housings, and the first micro-springs extend towards the first side of one of the housings. The electronic device of claim 1, wherein: the casing has a first edge extending along a first direction; the first surface faces a first side surface of a shell of the shell; The first micro-springs are distributed along the first direction; and The adjacent first micro-springs are respectively curled toward the top of one of the housings and the back of one of the housings. The electronic device of claim 1, wherein: the casing has a first edge extending along a first direction; the first surface faces a first side surface of a shell of the shell; The first micro-springs are distributed along the first direction; and The adjacent first micro-springs extend toward the top of one of the housings and the back of one of the housings respectively. The electronic device of claim 1, wherein: the casing has a first edge extending along a first direction; the first face faces a back of a casing of the casing; each first microspring has a first microspring extension; and In the first direction, the closer the first micro-spring is to one side of the casing, the longer the corresponding extension length of the first micro-spring is. The electronic device of claim 2, wherein: the casing has a first edge extending along a first direction; The second micro-springs are distributed along the first direction; and The adjacent second micro-springs are respectively curled toward the top of one of the housings and the back of one of the housings. The electronic device of claim 2, wherein: the casing has a first edge extending along a first direction; The second micro-springs are distributed along the first direction; and The adjacent second micro-springs extend toward the top of one of the housings and the back of one of the housings, respectively. The electronic device of claim 3, wherein: the casing has a first edge extending along a first direction; The third micro-springs are distributed along the first direction; and The adjacent third micro-springs are respectively curled toward the top of one of the casings and the bottom of one of the casings. The electronic device of claim 3, wherein: the casing has a first edge extending along a first direction; The third micro-springs are distributed along the first direction; and The adjacent third micro-springs extend toward the top and bottom of one of the casings and the bottom of one of the casings, respectively. The electronic device of claim 1, further comprising: A plurality of shell first micro springs extend from the top surface of one of the shells; wherein The first micro-springs of the housing are sandwiched between the top surface of the body and the display unit. The electronic device of claim 1, further comprising: a plurality of second micro-springs of the casing, extending from the side of one of the casings; wherein The second micro-springs of the casing are sandwiched between the side of the casing and the display unit. The electronic device of claim 15, wherein: the casing has a first edge extending along a first direction; The housing second micro-springs are distributed along the first direction; and The second micro-springs of the adjacent casings are respectively curled toward the top of one of the casings and the back of one of the casings. The electronic device of claim 15, wherein: the casing has a first edge extending along a first direction; The housing second micro-springs are distributed along the first direction; and The second micro-springs of the adjacent casings extend toward the top of one of the casings and the back of one of the casings respectively. The electronic device of claim 1, further comprising: A plurality of shell third micro-springs extend from the back of one of the shells; wherein: The third micro-springs of the casing are sandwiched between the back of the casing and the display unit. The electronic device of claim 18, further comprising: the casing has a first edge extending along a first direction; each housing third micro-spring has a housing third micro-spring extension length; and In the first direction, the closer the housing third micro-spring is to one of the housing side portions of the housing, the longer the corresponding extension length of the housing third micro-spring is. The electronic device of claim 1, further comprising: A plurality of buffer materials are sandwiched between the first support plate and the shell; wherein The damping coefficients of the buffer materials are larger than the damping coefficients of the first micro-springs; and The buffer materials are respectively arranged with the first micro-springs that are closer to each other to form a plurality of buffer units. The electronic device of claim 2, further comprising: A plurality of buffer materials are sandwiched between the first support plate and the shell; wherein The damping coefficients of the buffer materials are larger than the damping coefficients of the first micro-springs; and The buffer materials are respectively arranged with the first micro-springs that are closer to each other to form a plurality of buffer units. The electronic device of claim 3, further comprising: A plurality of buffer materials are sandwiched between the first support plate and the shell; wherein The damping coefficients of the buffer materials are larger than the damping coefficients of the first micro-springs; and The buffer materials are respectively arranged with the first micro-springs that are closer to each other to form a plurality of buffer units. The electronic device of claim 2, further comprising: A plurality of buffer materials are sandwiched between the first support plate and the shell; wherein The damping coefficients of the buffer materials are larger than the damping coefficients of the second micro-springs; and The buffer materials are respectively arranged in combination with the second micro-springs that are closer to form a plurality of buffer units. The electronic device of claim 3, further comprising: A plurality of buffer materials are sandwiched between the second support plate and the shell; wherein The damping coefficients of the buffer materials are larger than the damping coefficients of the third microsprings; and The buffer materials are respectively arranged with the third micro-springs closer to each other to form a plurality of buffer units. The electronic device of claim 14, further comprising: A plurality of buffer materials are sandwiched between the casing and the display unit; wherein The damping coefficient of the buffer material is larger than the damping coefficient of the first micro-springs of the housing; and The buffer materials are respectively arranged in combination with the first micro-springs of the housing which are closer to form a plurality of buffer units. The electronic device of claim 15, further comprising: A plurality of buffer materials are sandwiched between the casing and the display unit; wherein The damping coefficient of the buffer material is larger than the damping coefficient of the second micro-springs of the housing; and The buffer materials are respectively arranged in combination with the second micro-springs of the housing which are closer to form a plurality of buffer units. The electronic device of claim 18, further comprising: A plurality of buffer materials are sandwiched between the casing and the display unit; wherein The damping coefficient of the buffer material is larger than the damping coefficient of the third micro-springs of the casing; and The buffering materials are respectively arranged in combination with the third micro-springs of the housing which are closer to form a plurality of buffering units. The electronic device of claims 20-27, wherein: The buffer materials are a plurality of optically transparent adhesives. The electronic device of claims 20-27, wherein: The buffer materials are a plurality of porous units; and The cross section of the porous units is a combination of a plurality of repeating triangles or a plurality of repeating hexagons. The electronic device of claims 20-27, wherein: The damping coefficient of these buffer materials is 10~100N*S/m. The electronic device of claims 20-27, wherein: The Young's modulus of these buffer materials is 0.01Gpa~200Gpa. The electronic device of claim 20, wherein: Each of the buffer units has a thickness of the buffer unit in a direction perpendicular to the plane extended from the included first micro-springs, and the thickness of the buffer unit is 0.1-1 mm. The electronic device of claims 25-27, wherein: Each of the buffer units has a buffer in a direction perpendicular to the planes where the first micro-springs of the casing, the second micro-springs of the casing, and the third micro-springs of the casing are extended respectively. Unit thickness, the buffer unit thickness is 0.1~1mm. The electronic device of claim 20, wherein: Each of the buffer units has a width of the buffer unit in a direction parallel to the plane from which the included first micro-springs extend, and the width of the buffer unit is 1 mm˜6 mm. The electronic device of claims 25-27, wherein: Each of the buffer units has a buffer in a direction parallel to a plane extending from the first micro-springs of the casing, the second micro-springs of the casing, and the third micro-springs of the casing respectively included Unit width, the buffer unit width is 1mm~6mm. The electronic device of claim 29, wherein: Each of the porous units has a width of the porous unit in a direction parallel to the planes extending from the matched first micro-springs, and the width of the porous units is 500-5000um. The electronic device of claim 29, wherein: Each of the porous units has a direction parallel to the planes extending from the corresponding first shell micro-springs, the second shell micro-springs, and the shell third micro-springs respectively. The width of the porous unit, the width of the porous unit is 500~5000um. The electronic device of claim 29, wherein: The porous units are polyethylene terephthalate (PET), rubber or foamed cotton.

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