TWI749807B - Electronic device - Google Patents

Abstract

An electronic device is provided. The electronic device includes a housing, a display unit, a first support plate and a plurality of first micro springs. The display unit has a display surface. The first support plate is disposed on the back side of the display unit opposite to the display surface, and has a first surface not facing the display surface. The first micro springs extend from the first surface of the first support plate. The first micro springs are sandwiched between the housing and the first surface.

Description

Electronic device

The present invention relates to an electronic device; specifically, the present invention relates to an electronic device with a buffer function.

In traditional rigid displays, the protective layer on the surface is rigid glass, which is resistant to impact but cannot be bent. With the rise of the demand for display screens with narrow bezels and foldable mobile phones, flexible displays with bendable bends have emerged to achieve the purpose of narrow bezels or bendable.

The protective layer on the surface of the flexible display is Polyimide Film (PI), which can be bent but is not impact resistant. In the experiment of the falling ball ability, compared with the glass protective layer of the rigid display, the 24g steel ball is broken at the critical height of 50cm. The impact resistance of the protective layer of the flexible display is too low, and the display area is not resistant to falling balls. When 23.8g steel ball is dropped at the critical height of 2cm, it will be broken. The cause of the damage is that the display element is damaged by excessive local stress at the moment of impact, and the local stress is concentrated on the contact surface of the falling ball and pulls around the contact surface of the falling ball.

In addition, the foldable mobile phone uses two sliding parts to support the display panel, and uses the sliding parts to slide on the housing to solve the difference in bending length. However, the display panel is suspended in the bending area that bypasses the sliding member, and has no support or anti-collision capability, and is easily damaged by collisions during transportation or assembly, resulting in a decrease in transportation or assembly yield.

One objective of the present invention is to provide a buffer structure that can increase the anti-collision capability of the flexible display.

One objective of the present invention is to provide a flexible display with anti-collision capability.

An embodiment of the present invention relates to an electronic device. The electronic device includes a housing, a display unit, a first support plate, and a plurality of first micro springs. The display unit has a display surface. The first supporting plate is arranged on the back side of the display unit opposite to the display surface, and has a first surface not facing the display surface. The first micro spring extends from the first surface of the first support plate. The first micro spring is sandwiched between the shell and the first surface.

The following will clearly illustrate the spirit of the present disclosure with diagrams and detailed descriptions. After understanding the embodiments of the present disclosure, any person with ordinary knowledge in the technical field can change and modify the techniques taught in the present disclosure. It does not depart from the spirit and scope of this disclosure.

Regarding the "include", "include", "have", "contain", etc. used in this article, they are all open terms, which means including but not limited to.

It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and/or parts, these elements, components, regions, and/or Or part should not be restricted by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, the "first element," "component," "region," "layer," or "portion" discussed below may be referred to as a second element, component, region, layer or portion without departing from the teachings herein.

Relative terms such as "down" or "bottom" and "up" or "top" can be used herein to describe the relationship between one element and another element, as shown in the figure. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is turned over, elements described as being on the "lower" side of other elements will be oriented on the "upper" side of the other elements. Therefore, the exemplary term "lower" may include "lower" The orientation of “upper” and “upper” depends on the specific orientation of the drawing. Similarly, if the device in one drawing is turned over, then the elements described as “below” or “below” other elements will be oriented to the other elements "Above." Thus, the exemplary terms "below" or "below" can include an orientation of above and below.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meaning in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.

1 is a schematic cross-sectional view of an electronic device 10 according to an embodiment of the invention; FIG. 2 is a schematic cross-sectional view of an electronic device 10 according to an embodiment of the invention. As shown in FIGS. 1 and 2, the electronic device 10 includes a housing 100, a display unit 200, a first supporting plate 300 and a plurality of first micro springs 321. In a preferred embodiment, the electronic device 10 is a mobile display device, such as a mobile phone; specifically, the electronic device 10 is a mobile display device with a flexible display panel, such as a narrow-frame mobile phone with a flexible display panel. In the embodiment of FIG. 1 and FIG. 2, the first support plate 300 is a support steel plate for the display screen of the mobile display device.

As shown in FIGS. 1 and 2, the housing 100 includes a housing top 110, a housing back 130, and a housing side 120 connecting the housing top 110 and the housing back 130. The housing top 110 has a housing top surface, the housing side 120 has a housing first side surface 121, and the housing back 130 has a housing back 131. The display unit 200 has a display surface 211 and a back side 212 opposite to the display surface 211. In a preferred embodiment, a display area of a mobile display device is defined on the display surface 211.

As shown in FIGS. 1 and 2, the electronic device 10 further includes a cover layer 600 covering the upper part of the display surface 211. In a preferred embodiment, the cover layer 600 is acrylic or polycarbonate (PC). The cover layer 600 has a cover layer thickness dc in the third direction D3 perpendicular to the display surface 211; in a preferred embodiment, the cover layer thickness dc is 50~200um.

As shown in FIGS. 1 and 2, the display unit 200 further includes a display panel 210 and a back plate 250; wherein the back plate 250 is sandwiched between the display panel 210 of the display unit 200 and the first support plate 300. The back plate 250 has a back plate thickness db in a direction perpendicular to the display surface 211 (third direction D3); the thickness of the back plate db ranges from 10 to 50 um; in a preferred embodiment, the back plate thickness db is 33 um.

The display panel 210 is sandwiched between the housing 100 and the first support plate 300 and is in contact with the cover layer 600 with the display surface 210. One end of the display panel 210 has a bending portion 220. The bending portion 220 passes around one end of the first support plate 300 and has a convex surface facing the first side surface 121 of the housing, and a concave surface facing the first surface 311 of the first support plate 300. As shown in FIG. 2; and the bent portion 220 is covered by the housing space formed by the housing top 110, the housing side 120, and the housing back 130 of the housing 100. One end of the bent portion 220 of the display panel 210 is in contact with the cover layer 600, and the other end is in contact with the housing back 131 of the housing back 130. The display panel 210 has a display panel thickness dm in a direction perpendicular to the display surface 211 (third direction D3); the display panel thickness dm ranges from 5 to 30 um; in a preferred embodiment, the display panel thickness dm is 10 um.

As shown in FIGS. 1 and 2, the first support plate 300 is disposed on the back side 212 of the display unit 200 opposite to the display surface 211, and has a first surface 311 that does not face the display surface 211. In other words, the first surface 311 may include a surface facing the first side surface 121 of the housing, as shown in FIG. 1; the first surface 311 may also be a surface facing the back 131 of the housing, as shown in FIG. 2. The first microspring 321 extends from the first surface 311 of the first support plate 300; preferably, the first microspring 321 and the first support plate 300 are made of the same material, for example, from the first support by a metal process such as stamping The board 300 is generated. The first microspring 321 is sandwiched between the housing 100 and the first surface 311.

In the embodiment of FIG. 1, the first surface 311 is a surface facing the first side surface 121 of the housing and extends from the first surface 311 to form the first microspring 321; in this embodiment, the first microspring 321 is sandwiched between Between the first side surface 121 of the housing 100 and the first surface 311 of the first support plate 300. In the embodiment of FIG. 2, the first surface 311 is a surface facing the back surface 131 of the housing and extends from the first surface 311 to form the first microspring 321; in this embodiment, the first microspring 321 is sandwiched between the housing Between the back surface 131 of the housing 100 and the first surface 311 of the first support plate 300.

Since the hanging portion 220 that may be generated when bypassing the end of the first support plate 300 is likely to be damaged when the electronic device 10 is hit by a collision, and thereby cause damage to the display panel 210 of the display unit 200, the first part of FIG. 2 The first microspring 321 extending from the surface 311 can provide necessary support for the suspension generated by the bending portion 220. The first microspring 321 extending from the first surface 311 in FIG. 2 can provide the necessary support for the suspension generated by the display panel 210 and the housing back 130. In other words, by extending the first microspring 321 from the first surface 311, the display panel 210 can be better supported in the housing 100, and the damage caused by the external force can be reduced.

FIG. 3 is a three-dimensional schematic diagram of the first surface 311 and the first microspring 321 according to an embodiment of the present invention. In the embodiment of FIG. 3, the first surface 311 faces the casing back 130 of the casing 100, specifically, the first surface 311 faces the casing back 131 of the casing back 130; the first microspring 321 faces the casing 100 The first side surface 121 of the casing is curled.

4 is a schematic cross-sectional view of the first surface 311 and the first microspring 321 according to an embodiment of the present invention. The difference between FIG. 4 and FIG. 2 is that in the embodiment of FIG. 2, the first microspring 321 curls toward the first side surface 121 of the housing 100, that is, curls toward the opposite direction of the second direction D2. In the embodiment of FIG. 4, the first microspring 321 is curled in the opposite direction of the first side surface 121 of the housing 100, that is, it is curled in the second direction D2. The embodiment of FIG. 2 has a similar supporting effect as the first microspring 321 in the embodiment of FIG. 4, but the concave configuration in FIG. 2 is space-saving compared with the convex configuration in FIG. In another embodiment (not shown in the figure), the adjacent first micro springs 321 can also be arranged to face the first side 121 of the housing 100 and the first side 121 of the housing 100 according to design requirements. Curl in the opposite direction.

5 is a schematic cross-sectional view of the first surface 311 and the first microspring 321 according to another embodiment of the present invention. In the embodiment of FIG. 5, the first surface 311 faces the casing back 130 of the casing 100, specifically, the first surface 311 faces the casing back 131 of the casing back 130; the first microspring 321 faces the casing 100 The first side surface 121 of the housing extends. The difference between FIG. 5 and FIG. 2 is that the form of a microspring 321 is different. In detail, the first microspring 321 of FIG. One surface 311 extends obliquely after being extended.

6 is a schematic cross-sectional view of the first surface 311 and the first microspring 321 according to another embodiment of the present invention. The difference between FIG. 6 and FIG. 5 is that, in the embodiment of FIG. 5, the first microspring 321 extends toward the first side surface 121 of the housing 100, that is, extends in the opposite direction to the second direction D2; In an embodiment, the first microspring 321 extends toward the opposite direction of the first side surface 121 of the housing 100, that is, extends toward the second direction D2. The supporting effect of the first microspring 321 in the embodiment of FIG. 5 is similar to that of the embodiment of FIG. In another embodiment (not shown in the figure), the adjacent first micro springs 321 can also be arranged to face the first side 121 of the housing 100 and the first side 121 of the housing 100 according to design requirements. Extend in the opposite direction.

FIG. 7 is a three-dimensional schematic diagram of the first surface 311 and the first micro spring 321 according to another embodiment of the present invention; FIG. 8 is the first surface 311 and the first micro spring according to another embodiment of the present invention 321 front view. As shown in FIG. 7, the housing 100 has a first side S1, the first side S1 extends along a first direction D1, the first surface 311 faces the first side surface 121 of the housing 100, and the first microspring 321 extends along the first side Distribution in direction D1. The first micro springs 321 that are adjacent in the D1 direction are respectively curled toward the top surface 111 of the top 110 of the casing 100 and the back 131 of the casing back 130 of the casing 100; that is, adjacent to each other. The first micro springs 321 are crimped in different directions alternately; as shown in FIGS. 7 and 8. This configuration method can save material the most.

9 is a schematic cross-sectional view of the first surface 311 and the first microspring 321 according to another embodiment of the present invention. The housing 100 has a first side S1, the first side S1 extends along a first direction D1, the first surface 311 faces the first side surface 121 of the housing 100, and the first microsprings 321 are distributed along the first direction D1. As shown in FIG. 9, the adjacent first micro springs 321 respectively extend toward the top surface 111 of the housing top 110 of the housing 100 and the housing back 131 of the housing back 130 of the housing 100; The adjacent first micro springs 321 alternately extend in different directions. The difference between FIG. 9 and FIG. 1 is that the form of the first microspring 321 is different. In detail, the first microspring 321 of FIG. The first surface 311 extends obliquely after being extended.

FIG. 10 is a schematic cross-sectional view of the electronic device 10 and the first microspring 321 and the second microspring 322 according to another embodiment of the present invention. As shown in FIG. 10, the electronic device 10 further includes a plurality of second micro springs 322, and the second micro springs 322 extend from the second surface 312 of the first support plate 300. In the embodiment of FIG. 2, the first surface 311 of the first support plate 300 is opposite to the display surface 211, and the second surface 312 faces the first side surface 121 of the housing 100; the first micro spring 321 is sandwiched between the first side Between one surface 311 and the housing back 130 of the housing 100; and the second micro spring 322 is sandwiched between the second surface 312 and the first side surface 121 of the housing 100. In the embodiment of FIG. 10, the electronic device 10 is preferably a mobile display device with a flexible display panel, and the first support plate 300 is preferably a support steel plate for the display screen of the mobile display device.

In the embodiment of FIG. 10, the first microspring 321 and the second microspring 322 respectively extend from different surfaces (first surface 311 and second surface 312) of the same support plate (first support plate 300), so the first The first microspring 321, the second microspring 322 and the extended first support plate 300 are made of the same material. In a preferred embodiment, the first microspring 321 and the second microspring 322 in FIG. 10 are steel microsprings extending from a steel plate.

FIG. 11 is a schematic cross-sectional view of the electronic device 10 and the first microspring 321 and the second microspring 322 according to another embodiment of the present invention. The difference between the embodiment shown in FIG. 11 and the embodiment in FIG. 10 is that a metal plate 260 is added between the first support plate 300 and the display unit 200 in FIG. 11. In the embodiment of FIG. 3, the electronic device 10 is preferably a foldable mobile display device, the metal plate 260 is preferably a support steel plate of the display screen of the mobile display device, and the first support plate 300 is preferably a sliding of the foldable mobile display device Pieces. The metal plate 260 is harder than the hardness of the first support plate 300. In the direction (D3) perpendicular to the first surface 311, the thickness of the first support plate 300 is thicker than the thickness of the metal plate 260, so a longer length microspring can be manufactured. The first microspring 321 and the second microspring 322 in FIG. 11 are microsprings extending from the sliding member, such as polycarbonate (PC) microsprings.

12 is a schematic cross-sectional view of the electronic device 10 and the first microspring 321 and the third microspring 422 according to another embodiment of the present invention. As shown in FIG. 12, the electronic device 10 further includes a second supporting plate 400 and a plurality of third micro springs 422. The second supporting plate 400 is sandwiched between the display unit 200 and the first supporting plate 300, and the third micro spring 422 extends from the third surface 412 of the second supporting plate 400. In the embodiment of FIG. 12, the first surface 311 of the first support plate 300 is opposite to the display surface 211, and the third surface 311 of the first support plate 300 faces the first side surface 121 of the housing 100; The spring 321 is sandwiched between the first surface 311 of the first support plate 300 and the housing back 131 of the housing back 130 of the housing 100; the third micro spring 422 is sandwiched between the third surface of the first support plate 300 and Between the first side surfaces 121 of the housing 100.

The difference between FIG. 12 and FIG. 11 is that in FIG. 12, a second support plate 400 is added between the first support plate 300 and the display unit 200. In the embodiment of FIG. 12, the first micro springs 321 extending from the first surface 311 of the first support plate 300 and the third micro springs 321 extending from the third surface 412 of the second support plate 400 respectively The spring 422 provides the necessary support between the display panel 210 of the display unit 200 and the housing 100. Therefore, the first microspring 321 in FIG. 12 is a microspring extending from the first supporting plate 300, and the second microspring 322 is a microspring extending from the sliding member of the second supporting plate 400. The two can be made of different materials.

In the embodiment of FIG. 12, the electronic device 10 is a foldable mobile display device, the first support plate 300 is preferably a support steel plate for the display screen of the foldable mobile display device, and the second support plate 400 is preferably a foldable mobile display device The sliding parts. The hardness of the second support plate 400 is smaller than the hardness of the first support plate 300. Therefore, the hardness of the first microspring 321 extending from the first supporting plate 300 is slightly greater than that of the second microspring 322 extending from the second supporting plate 400; The micro spring 321 is more wear-resistant than the second micro spring 322. In the direction (D3) perpendicular to the first surface 311, the thickness of the second support plate 400 is greater than the thickness of the first support plate 300.

FIG. 13 is a three-dimensional schematic diagram of the third surface 412 and the third microspring 422 according to another embodiment of the present invention. The housing 100 has a first side S1, the first side S1 extends along the first direction D1, and the third micro springs 422 are distributed along the first direction D1. The adjacent third micro springs 422 are respectively curled toward the top 110 of the housing 100 and the back 130 of the housing 100, as shown in FIG. 13; that is, the adjacent third micro springs 422 alternately move toward Curl in different directions.

FIG. 14 is a schematic cross-sectional view of the third surface 412 and the third microspring 422 according to another embodiment of the present invention. The housing 100 has a first side S1, the first side S1 extends along the first direction D1, and the third micro springs 422 are distributed along the first direction D1. The adjacent third micro springs 422 respectively extend toward the top 110 of the housing 100 and the housing back 130 of the housing 100, as shown in FIG. 14; that is, the adjacent third micro springs 422 alternately move toward Extend in different directions. The difference between FIG. 14 and FIG. 12 is that the form of the third microspring 422 is different. In detail, the third microspring 422 of FIG. The third surface 412 extends obliquely after being extended.

FIG. 15 is a schematic top view of the housing 100 and the first microspring 321 according to another embodiment of the present invention. The housing 100 has a first side S1 and a second side S2 perpendicular to each other. The first side S1 extends along the first direction D1, and the second side S2 extends along the second direction D2. The third direction D3 is a direction perpendicular to the plane formed by the first direction D1 and the second direction D2, that is, a direction perpendicular to the back surface 131 of the casing. The first microsprings 321 are distributed in a matrix along the first direction D1 and the second direction D2, as shown in FIG. 15.

FIG. 16 is a schematic diagram showing the distribution of the first microspring 311 according to another embodiment of the present invention. The housing 100 has a first side S1, and the first side S1 extends along a first direction D1. The first surface 311 faces the casing back 130 of the casing 100; specifically, the first surface 311 faces the casing back 131 of the casing back 130. In the direction perpendicular to the first surface 311 (third direction D3), each first microspring 321 has a first microspring extension length Lb; in the first direction D1, the closer to the housing side 120 of the housing 100 The first microspring 321 corresponds to the longer the extension length Lb of the first microspring, as shown in FIG. 16. In other words, in the first direction D1, the bottom surface of the extension length Lb of the first microspring is connected roughly showing an inverted smile curve distribution; this arrangement has a better cushioning effect.

17 is a schematic cross-sectional view of the first microspring 141 of the housing, the second microspring 142 of the housing, and the third microspring 143 of the housing according to an embodiment of the present invention; The illustrated three-dimensional schematic view of the first microspring 141 of the housing, the second microspring 142 of the housing, and the third microspring 143 of the housing are shown. As shown in FIGS. 17 and 18, the electronic device 10 further includes a plurality of housing first microsprings 141 extending from the housing top surface 111 of the housing 100. As shown in FIGS. 18 and 19, the electronic device 10 further includes a plurality of housing second micro springs 142, which extend from the housing side 120 of the housing 100; in detail, the housing second micro springs 142 are formed by The first side surface 121 of the casing side portion 120 (and other side surfaces of the casing, such as the second side surface 122 of the casing, the third side surface 123 and the fourth side surface 124 of the casing) extend out. The second microspring 142 of the housing is sandwiched between the side 120 of the housing and the display unit 200. The first microspring 141 of the housing is sandwiched between the top surface 111 of the housing and the display unit 200. As shown in FIGS. 17 and 18, the electronic device 10 further includes a plurality of shell third micro springs 143 extending from the shell back 131 of the shell 100; the shell third micro springs 143 are sandwiched on the back of the shell 131 and the display unit 200.

The housing 100 has a first side S1, the first side S1 extends along the first direction D1, and the second microsprings 142 of the housing are distributed along the first direction D1. The second micro springs 142 of adjacent housings are respectively curled toward the top 110 of the housing 100 and the back 130 of the housing 100; that is, the second micro springs 142 of adjacent housings alternately move in different directions Curl, as shown in Figure 17 and Figure 18.

19 is a schematic cross-sectional view of the first microspring 141 of the housing, the second microspring 142 of the housing, and the third microspring 143 of the housing according to another embodiment of the present invention. The difference between FIG. 19 and FIG. 17 is that in the embodiment of FIG. 17, the third microspring 143 of the housing is curled toward the first side surface 121 of the housing 100, that is, it is curled in the opposite direction of the second direction D2. In the embodiment of FIG. 19, the third microspring 143 of the housing is curled in the opposite direction of the first side surface 121 of the housing 100, that is, it is curled in the second direction D2. The housing third microspring 143 of FIG. 19 and FIG. 17 have similar supporting force, but the concave configuration of FIG. 17 is space-saving compared with the convex configuration of FIG. 19. In another embodiment (not shown in the figure), according to design requirements, the third micro springs 143 of the adjacent housings can also be arranged to face the first side 121 of the housing 100 and the first side of the housing 100 respectively. The side surface 121 is curled in the opposite direction.

The difference between FIG. 17 and FIG. 2 is that in the embodiment of FIG. 2, the first microspring 321 extending from the first surface 311 of the first support plate 300 is used as a gap between the display unit 200 and the housing back 130 The support; in the embodiment of FIG. 17, the third microspring 143 extending from the housing back 131 of the housing back 130 is used as the support between the display unit 200 and the housing back 130. In another embodiment (not shown), the first microspring 321 of FIG. 2 and the housing third microspring 143 of FIG. 17 can be alternately matched according to design requirements to serve as a support between the display unit 200 and the housing back 130 .

It should be noted that, in FIG. 17, the first microspring 321 of FIG. 2 is replaced by the housing third microspring 143 as the support between the display unit 200 and the housing back 130. In another embodiment (not shown), the housing third microspring 143 of FIG. 17 can also replace the first microspring 321 of FIGS. 3-6 and 10-12 as the display unit 200 and the housing back 130 Support. In another embodiment (not shown), the first microspring 321 of FIGS. 3-6 and 10-12 and the third microspring 143 of the housing of FIG. 17 can be alternately combined according to design requirements to serve as the display unit 200 The support between the shell and the back 130. I won't repeat them here.

20 is a schematic cross-sectional view of the first microspring 141 of the housing, the second microspring 142 of the housing, and the third microspring 143 of the housing according to another embodiment of the present invention. The housing 100 has a first side S1, the first side S1 extends along the first direction D1, and the second microsprings 142 of the housing are distributed along the first direction D1. The second microsprings 142 of adjacent housings respectively extend toward the top 110 of the housing 100 and the back 130 of the housing 100; that is, the second microsprings 142 of adjacent housings alternately move in different directions Extend, as shown in Figure 20. The difference between FIG. 20 and FIG. 17 is that the form of the second microspring 142 of the housing is different. In detail, the second microspring 142 of the housing in FIG. , The housing second microspring 142 of FIG. 20 extends from the housing back 131 of the housing back 130 and then extends obliquely.

21 is a schematic cross-sectional view of the first microspring 141 of the housing, the second microspring 142 of the housing, and the third microspring 143 of the housing according to another embodiment of the present invention. The difference between FIG. 21 and FIG. 20 is that, in the embodiment of FIG. 20, the housing third microspring 143 extends toward the housing first side surface 121 of the housing 100, that is, extends in the opposite direction of the second direction D2. In the embodiment of FIG. 21, the third microspring 143 of the housing extends in a direction opposite to the first side surface 121 of the housing 100, that is, it extends in the second direction D2. In another embodiment (not shown in the figure), according to design requirements, the third micro springs 143 of the adjacent housings can also be arranged to face the first side 121 of the housing 100 and the first side of the housing 100 respectively. The side surface 121 extends in the opposite direction. The embodiment of FIG. 20 has a similar supporting effect as the third microspring 143 of the housing in the embodiment of FIG. 21, but the oblique arrangement in FIG. 21 saves space.

FIG. 22 is a schematic diagram showing the distribution of the third microspring 143 of the housing according to another embodiment of the present invention. The housing 100 has a first side S1, and the first side S1 extends along a first direction D1. In the direction perpendicular to the housing back 131 (third direction D3), each housing third microspring 143 has the housing third microspring extension length Ls; in the first direction D1, the closer the housing 100 is The housing third microspring 143 of the body side portion 120 corresponds to the longer the extension length Ls of the housing third microspring, as shown in FIG. 22. In other words, in the first direction D1, the connection line on the top surface of the extension length Ls of the third microspring of the casing approximately presents a smile curve distribution; this configuration has a better cushioning effect.

FIG. 23 is a schematic cross-sectional view of the first microspring 321 and the buffer unit 500 according to an embodiment of the present invention; FIG. 24 is a schematic cross-sectional view of the first microspring 321 and the buffer unit 500 according to another embodiment of the present invention . As shown in FIGS. 23 and 24, the electronic device 10 further includes a plurality of buffer materials 510 sandwiched between the first support plate 300 and the housing 100. The damping coefficient of the buffer material 510 is larger than the damping coefficient of the first microspring 321. The buffer material 510 is matched with the relatively close first microspring 321 to form the buffer unit 500.

The difference between FIGS. 23 to 24 and FIGS. 1 to 2 is that in FIGS. 23 to 24, the cushioning material 510 and the micro spring are matched and arranged to form the cushioning unit 500. In the embodiment of FIGS. 1 to 2, the first microspring 321 extending from the first surface 311 of the first support plate 300 provides the necessary support between the display panel 210 of the display unit 200 and the housing 100 and buffer. In the embodiment of FIGS. 23-24, the buffer unit 500 composed of the first microspring 321 extending from the first surface 311 of the first support plate 300 and the buffer material 510 together provides the display of the display unit 200 Support and cushioning are required between the panel 210 and the housing 100. In addition, as shown in FIG. 24, the buffer material 510 is preferably arranged on the concave side of the first microspring 321 that is closer. With this arrangement, when pressed by an external force, the first microspring 321 is less likely to interfere with the buffer material 510 when it is bent. Therefore, the distance between the buffer material 510 and the first microspring 321 can be shortened and the matching between the two can be improved. Effect.

It should be noted that the buffer material 510 of FIGS. 23-24 can also be combined with the first microspring 321, the second microspring 322, and the third microspring 422 of FIGS. 3-14 to form the buffer unit 500. , I won’t repeat it here.

FIG. 25 shows a housing first microspring 141 and a buffer unit 500, a housing second microspring 142 and a buffer unit 500, and a housing third microspring 143 and a buffer unit 500 according to another embodiment of the present invention. Schematic cross-section. As shown in FIG. 26, the electronic device 10 further includes a plurality of buffer materials 510 sandwiched between the casing 110 and the display unit 200. The damping coefficient of the buffer material 510 is larger than the damping coefficient of the first microspring 141 of the housing; The springs 143 are arranged in combination to form a plurality of buffer units 500.

The difference between FIG. 25 and FIG. 17 is that the buffer material 510 is added in FIG. 25, which is matched with the micro springs (the first micro spring 141 of the housing, the second micro spring 142 of the housing, and the third micro spring 143 of the housing) to form a buffer. Unit 500. In detail, in the embodiment of FIG. 17, the housing first microspring 141 respectively extending from the housing top surface 111 of the housing top 110 and the housing first side surface 121 of the housing side 120 (And other housing sides, such as housing second side 122, housing third side 123, housing fourth side 124) the housing second microspring 142 extending from the housing back 130 The third microspring 143 of the casing extending from the back 131 provides necessary support and cushioning between the display panel 210 of the display unit 200 and the casing 100. In the embodiment of FIG. 25, the housing first microspring 141 extending from the housing top surface 111 of the housing top 110, the housing first side surface 121 of the housing side 120 (and other housings The side surfaces of the body, such as the second side surface 122 of the housing, the third side surface 123 of the housing, and the fourth side surface 124 of the housing) extend from the second microspring 142 of the housing, and extend from the back 131 of the housing back 130. The third micro springs 143 of the casing and the buffer unit 500 formed together with the buffer material 510 respectively provide the required support and buffer between the display panel 210 of the display unit 200 and the casing 100.

It should be noted that the buffer material 510 of FIG. 25 can also be combined with the housing first microspring 141, the housing second microspring 142, and the housing third microspring 143 of FIGS. 18-22 to form The buffer unit 500 will not be repeated here.

26 is a schematic cross-sectional view of a buffer unit 500 drawn according to an embodiment of the present invention; FIG. 27 is a schematic cross-sectional view of a buffer unit 500 drawn according to another embodiment of the present invention; A schematic cross-sectional view of the buffer unit 500 is shown; FIG. 29 is a schematic cross-sectional view of the buffer unit 500 according to another embodiment of the present invention. It is worth noting that Figures 26 and 28 take the buffer unit 500 composed of the buffer material 510 and the first microspring 321 as an example, and Figures 27 and 29 take the buffer unit 500 composed of the buffer material 510 and the second microspring 142 of the housing as an example. The unit 500 is taken as an example, but not limited to this; the first microspring 321, the second microspring 322, and the third microspring 422 of FIGS. 1 to 14 can be combined with the buffer material 510 to form as shown in FIGS. 26 and 28, respectively. Buffer unit 500; the housing first microspring 141, housing second microspring 142, and housing third microspring 143 of FIGS. 17-22 can be combined with the buffer material 510 to form the buffer unit as shown in FIGS. 27 and 29. 500.

In one embodiment, the buffer material 510 is a block structure formed by optically transparent glue; in another embodiment, the buffer material 510 is a porous unit, as shown in FIGS. 26-29. Among them, the porous unit may be, for example, polyethylene terephthalate (PET), rubber, or foamed cotton. The damping coefficient of the buffer material 510 is preferably 10-100 N*S/m, and the Young's modulus of the material is preferably 0.01 Gpa to 200 Gpa.

In one embodiment, the cross section of the porous unit is a combination of repeated hexagons, as shown in FIGS. 26-27. In a preferred embodiment, the hexagon is a regular hexagon. In another embodiment, the cross section of the porous unit is a combination of repeated triangles, as shown in FIGS. 28-29. In a preferred embodiment, the triangle is an equilateral triangle.

As shown in FIGS. 26 and 28, each buffer unit 500 has a buffer unit thickness H in a direction perpendicular to the plane from which the included first microspring 321 extends; the buffer unit thickness H is preferably 0.1 to 1 mm.

As shown in FIGS. 26 and 28, each buffer unit 500 has a buffer unit width P in a direction parallel to the plane from which the included first microspring 321 extends; the width range of the buffer unit width P is preferably 1 mm ~6mm.

As shown in FIGS. 26 and 28, each porous unit 510 has a porous unit width W in a direction parallel to the plane from which the matched first microspring 321 extends; The width range is preferably 500~5000um.

It should be noted that FIGS. 26 and 28 take the first microspring 321 of FIG. 2 as an example, but not limited to this; the first microspring 321, the second microspring 322, and Please refer to FIG. 26 and FIG. 28 for the description of the buffer unit thickness H, the buffer unit width P, and the porous unit width W of the third microspring 422.

As shown in FIGS. 27 and 29, each buffer unit 500 has a buffer unit thickness H in a direction perpendicular to the plane from which the second microspring 142 of the housing included therein extends; the buffer unit thickness H is preferably 0.1~ 1mm.

As shown in FIGS. 27 and 29, each buffer unit 500 has a buffer unit width P in a direction parallel to the plane from which the second microsprings 142 of the 4 housings respectively include; the buffer unit width is preferably 1 mm ~6mm.

As shown in FIGS. 27 and 29, each porous unit 510 has a porous unit width in a direction parallel to the plane from which the second microspring 142 of the matched casing extends; Preferably, it is 500~5000um.

It should be noted that FIGS. 27 and 29 take the housing second microspring 142 of FIG. 17 as an example, but not limited to this; the housing first microspring 141 and the housing second microspring 141 of FIGS. 17-21 Please refer to FIG. 27 and FIG. 29 for descriptions of the spring 142, the buffer unit thickness H, the buffer unit width P, and the porosity unit width of the third microspring 143 of the housing.

30 is a schematic cross-sectional view of the electronic device 10 according to an embodiment of the invention before being folded; FIG. 31 is a schematic cross-sectional view of the electronic device 10 according to an embodiment of the invention after being folded. In other words, FIG. 30 is the flat state of the electronic device 10, and FIG. 30 is the folded state of the electronic device 10. The difference between FIG. 30 and FIG. 11 is that FIG. 11 only shows a schematic cross-sectional view of one side of the electronic device 10 and does not include the buffer material 510; FIG. 30 shows a schematic cross-sectional view of the entire electronic device 10.

As shown in FIG. 30 and FIG. 31, the electronic device 10 further includes a sliding member 700 sandwiched between the display unit 200 and the housing back 130 of the housing 100. The electronic device 10 further includes a groove 135 for accommodating the buffer unit 500. The sliding element 700 of FIGS. 30 and 31 also has a sliding element first surface 711 facing the housing back surface 131 of the housing back 130 and a sliding element first microspring 712 extending from the sliding element first surface 711. The difference between the sliding member 700 and the first support plate 300 in this embodiment is that the display panel 210 of the display unit 200 does not go around one end of the sliding member 700 but has a bent portion 220, so there is no need for the sliding member 700 to face the shell. The second surface 712 of the sliding member of the fourth side surface 124 of the body extends to form a second microspring of the sliding member.

In detail, when the electronic device 10 is folded from the flat state to the folded state, the first support plate 300 and the sliding member 700 slide in the directions of the first side surface 121 and the fourth side surface 124 of the housing, respectively. This drives the buffer unit 500 to slide in the groove 135. Conversely, when the electronic device 10 is from the folded state to the flat to the folded state, the first support plate 300 and the sliding member 700 slide in the opposite direction of the first side surface 121 of the housing and the fourth side surface 124 of the housing, respectively, and drive accordingly The buffer unit 500 slides in the groove 135.

The present invention has been described by the above-mentioned related embodiments, but the above-mentioned embodiments are only examples for implementing the present invention. It must be pointed out that the disclosed embodiments do not limit the scope of the present invention. On the contrary, modifications and equivalent arrangements included in the spirit and scope of the patent application are all included in the scope of the present invention.

10: Electronic device

100: shell

110: Top of the shell

111: The top surface of the shell

120: shell side

121: The first side of the shell

122: The second side of the shell

123: The third side of the shell

124: The fourth side of the shell

130: shell back

131: Back of the shell

135: Groove

141: The first micro spring of the shell

142: The second micro spring of the shell

143: The third micro spring of the shell

200: display unit

210: display panel

211: display surface

212: Backside

220: bending part

230: Foldable part

250: backplane

260: metal plate

300: The first support plate

311: first side

312: second side

321: The first micro spring

322: The second micro spring

400: second support plate

412: The Third Side

422: The third micro spring

500: buffer unit

510: buffer material

600: Overlay

700: Slider

711: First side of sliding part

712: The second side of the sliding part

721: Slider first micro spring

S1: First side

S2: second side

D1: First direction

D2: second direction

D3: Third party

Ls: the extension length of the third micro spring of the shell

Lb: Extension length of the first micro spring

H: Thickness of buffer unit

P: Buffer unit width

W: Porosity unit width

d1: Thickness of the first support plate

d2: thickness of the second support plate

dc: cover layer thickness

dm: display panel thickness

db: backplane thickness

The drawings of the present invention are described as follows: FIG. 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention; 2 is a schematic cross-sectional view of an electronic device according to another embodiment of the invention; FIG. 3 is a three-dimensional schematic diagram of the first surface and the first microspring according to an embodiment of the present invention; 4 is a schematic cross-sectional view of the first surface and the first microspring according to an embodiment of the present invention; 5 is a schematic cross-sectional view of a first microspring on the first side according to another embodiment of the present invention; 6 is a schematic cross-sectional view of a first microspring on the first side according to another embodiment of the present invention; FIG. 7 is a three-dimensional schematic diagram of the first surface and the first microspring according to another embodiment of the present invention; FIG. 8 is a schematic front view of the first surface and the first microspring according to another embodiment of the present invention; 9 is a schematic cross-sectional view of the first surface and the first microspring according to another embodiment of the present invention; 10 is a schematic cross-sectional view of an electronic device and a first microspring and a second microspring according to another embodiment of the present invention; 11 is a schematic cross-sectional view of an electronic device and a first microspring and a second microspring according to another embodiment of the present invention; 12 is a schematic cross-sectional view of an electronic device and a first microspring and a third microspring according to another embodiment of the present invention; FIG. 13 is a three-dimensional schematic diagram of the third surface and the third micro spring according to another embodiment of the present invention; 14 is a schematic cross-sectional view of the third surface and the third microspring according to another embodiment of the present invention; 15 is a schematic top view of a housing and a first microspring according to another embodiment of the present invention; FIG. 16 is a schematic diagram showing the distribution of first microsprings according to another embodiment of the present invention; FIG. 17 is a schematic cross-sectional view of the first microspring of the housing, the second microspring of the housing, and the third microspring of the housing according to an embodiment of the present invention; 18 is a three-dimensional schematic diagram of a first microspring of the housing, a second microspring of the housing, and a third microspring of the housing according to an embodiment of the present invention; 19 is a schematic cross-sectional view of the first microspring of the housing, the second microspring of the housing, and the third microspring of the housing according to another embodiment of the present invention; 20 is a schematic cross-sectional view of the first microspring of the housing, the second microspring of the housing, and the third microspring of the housing according to another embodiment of the present invention; 21 is a schematic cross-sectional view of the first microspring of the housing, the second microspring of the housing, and the third microspring of the housing according to another embodiment of the present invention; 22 is a schematic diagram showing the distribution of the third microsprings of the housing according to another embodiment of the present invention; FIG. 23 is a schematic cross-sectional view of a first microspring and a buffer unit according to an embodiment of the present invention; 24 is a schematic cross-sectional view of a first microspring and a buffer unit according to another embodiment of the present invention; 25 is a schematic cross-sectional view of a first microspring and a buffer unit, and a second microspring and a buffer unit according to another embodiment of the present invention; FIG. 26 is a schematic cross-sectional view of a buffer unit according to an embodiment of the present invention; 27 is a schematic cross-sectional view of a buffer unit according to another embodiment of the present invention; 28 is a schematic cross-sectional view of a buffer unit according to another embodiment of the present invention; 29 is a schematic cross-sectional view of a buffer unit according to another embodiment of the present invention; 30 is a schematic cross-sectional view of the electronic device before folding according to an embodiment of the present invention; and FIG. 31 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention after being folded.

10: Electronic device

100: shell

110: Top of the shell

111: The top surface of the shell

120: shell side

121: The first side of the shell

130: shell back

131: Back of the shell

200: display unit

210: display panel

211: display surface

212: Backside

220: bending part

250: backplane

300: The first support plate

311: first side

321: The first micro spring

600: Overlay

D1: First direction

D2: second direction

D3: Third party

dc: Covering layer thickness

dm: display panel thickness

db: backplane thickness

Claims (37)

An electronic device, comprising: a housing, wherein the housing has a first side and a second side perpendicular to each other, the first side extends in a first direction, and the second side extends in a second direction; a display The unit has a display surface; a first support plate disposed on a back side of the display unit opposite to the display surface and has a first surface that does not face the display surface; and a plurality of first micro springs The first surface of the first support plate extends; wherein the first microsprings are sandwiched between the first surface and the housing, and the first microsprings are along the first direction and the second The directions are distributed in a matrix. The electronic device according to claim 1, further comprising: a plurality of second micro springs extending from a second surface of the first support plate; wherein the first surface is opposite to the display surface, and the second Face to the first side of a shell of the shell; the first micro springs are sandwiched between the first surface and the back of the shell; and the second micro springs are sandwiched on the first side Between the two sides and the first side surface of the shell. The electronic device according to claim 1, further comprising: a second support plate sandwiched between the display unit and the first support plate; and a plurality of third micro springs formed by one of the second support plates The third surface extends; wherein the first surface is opposite to the display surface, and the third surface faces the first side surface of a shell of the casing; the first micro springs are sandwiched between the first surface and the Between the back of a shell of the shell; the third micro springs are sandwiched between the third surface and the first side surface of the shell; the hardness of the second support plate is smaller than that of the first support plate ; And in the direction perpendicular to the first surface, the thickness of the second support plate is greater than the thickness of the first support plate. The electronic device according to claim 1, wherein: the first surface faces the back of a housing of the housing, and the first micro springs are curled toward the first side of the housing of the housing. The electronic device according to claim 1, wherein: the first surface faces a back of a housing of the housing, and the first micro springs extend toward a first side of a housing of the housing. The electronic device according to claim 1, wherein: the first surface faces a first side surface of a casing of the casing; and the adjacent first micro springs respectively face a top of a casing of the casing and the One of the shells is curled on the back of the shell. The electronic device according to claim 1, wherein: the first surface faces a first side surface of a casing of the casing; and the adjacent first micro springs respectively face a top of a casing of the casing and the One of the shells extends on the back of the shell. The electronic device according to claim 1, wherein: the first surface faces the back of a housing of the housing; each first microspring has a first microspring extension length; and in the first direction, the closer The first microspring on the side of one of the casings corresponds to the longer the extension length of the first microspring. The electronic device according to claim 2, wherein: the second microsprings are distributed along the first direction; and the adjacent second microsprings respectively face the top of one of the housings and the housing The back of a shell is curled. The electronic device according to claim 2, wherein: the second microsprings are distributed along the first direction; and the adjacent second microsprings respectively face the top of one of the housings and the housing The back of a shell extends. The electronic device according to claim 3, wherein: the third micro springs are distributed along the first direction; and the adjacent third micro springs face toward the top of one of the housings and the housing The bottom of a shell is curled. The electronic device according to claim 3, wherein: the third micro springs are distributed along the first direction; and the adjacent third micro springs respectively face one of the top and bottom of the housing and the housing One of the shells extends from the bottom. The electronic device according to claim 1, further comprising: a plurality of housing first microsprings extending from a top surface of a housing of the housing; wherein the housing first microsprings are sandwiched in the body Between the top surface and the display unit. The electronic device according to claim 1, further comprising: a plurality of housing second microsprings extending from a housing side of the housing; wherein the housing second microsprings are sandwiched in the housing Between the side of the body and the display unit. The electronic device according to claim 14, wherein: the second microsprings of the housings are distributed along the first direction; and the second microsprings of the adjacent housings face the top of one of the housings and The back of one of the shells is curled. The electronic device according to claim 14, wherein: The second microsprings of the shells are distributed along the first direction; and the second microsprings of the adjacent shells respectively extend toward the top of the shell and the back of the shell. The electronic device according to claim 1, further comprising: a plurality of housing third micro springs extending from the back of one of the housings; wherein: the housing third micro springs are sandwiched between the housing Between the back of the body and the display unit. The electronic device according to claim 17, further comprising: each housing third microspring has an extension length of the housing third microspring; and in the first direction, the closer to a housing side of the housing The third micro-spring of the housing, the longer the extension length of the corresponding third micro-spring of the housing is. The electronic device according to claim 1, further comprising: a plurality of buffer materials sandwiched between the first support plate and the housing; wherein the damping coefficient of the buffer materials is higher than the damping coefficient of the first microsprings It is large; and Wu, the buffer materials are matched with the first micro springs closer to each other to form a plurality of buffer units. The electronic device according to claim 2, further comprising: a plurality of buffer materials sandwiched between the first support plate and the housing; wherein the damping coefficient of the buffer materials is higher than the damping coefficient of the first microsprings Is large; and the cushioning materials are respectively matched with the relatively close first micro springs to form a plurality of cushioning units. The electronic device according to claim 3, further comprising: a plurality of buffer materials sandwiched between the first support plate and the housing; wherein the damping coefficient of the buffer materials is higher than the damping coefficient of the first micro springs Are large; and the cushioning materials are respectively arranged with the relatively close first micro springs to form a plurality of cushioning units. The electronic device according to claim 2, further comprising: a plurality of buffer materials sandwiched between the first support plate and the housing; wherein the damping coefficient of the buffer materials is higher than the damping coefficient of the second micro springs Are large; and the buffer materials are respectively arranged with the closer second micro springs to form a plurality of buffer units. The electronic device according to claim 3, further comprising: a plurality of buffer materials sandwiched between the second support plate and the housing; wherein the damping coefficient of the buffer materials is higher than the damping coefficient of the third micro springs Is large; and the cushioning materials are respectively matched with the relatively close third micro springs to form a plurality of cushioning units. The electronic device according to claim 13, further comprising: a plurality of buffer materials sandwiched between the casing and the display unit; wherein the damping coefficient of the buffer material is greater than the damping coefficient of the first microsprings of the casings Large; and the cushioning materials are matched with the first microsprings of the housings closer to each other to form a plurality of cushioning units. The electronic device according to claim 14, further comprising: a plurality of buffer materials sandwiched between the casing and the display unit; wherein the damping coefficient of the buffer material is greater than the damping coefficient of the second microsprings of the casings Large; and the cushioning materials are matched with the second microsprings of the housings closer to each other to form a plurality of cushioning units. The electronic device according to claim 17, further comprising: a plurality of buffer materials sandwiched between the casing and the display unit; wherein the damping coefficient of the buffer material is greater than the damping coefficient of the third micro springs of the casings Large; and the cushioning materials are matched with the third micro springs of the housings closer to each other to form a plurality of cushioning units. The electronic device according to claim 19-26, wherein: the buffer materials are a plurality of optical transparent glues. The electronic device according to claim 19-26, wherein: the buffer materials are a plurality of porous units; and the cross section of the porous units is a combination of repeated triangles or repeated hexagons. The electronic device according to claim 19-26, wherein: the damping coefficient of the buffer materials is 10-100 N*S/m. The electronic device according to claim 19-26, wherein: the Young's modulus of the material of the buffer materials is 0.01Gpa~200Gpa. The electronic device according to claim 19, wherein: each of the buffer units has a thickness of a buffer unit in a direction perpendicular to the plane from which the included first micro springs extend, and the thickness of the buffer unit is 0.1 ~1mm. The electronic device according to claim 24-26, wherein: each of the buffer units includes the first microsprings of the housings, the second microsprings of the housings, and the thirds of the housings. The direction perpendicular to the plane from which the micro springs extend has a thickness of a buffer unit, and the thickness of the buffer unit is 0.1 to 1 mm. The electronic device according to claim 19, wherein: each of the buffer units has a buffer unit width in a direction parallel to the plane from which the included first micro springs extend, and the buffer unit width is 1 mm ~6mm. The electronic device according to claim 24-26, wherein: Each of the buffer units has a buffer in a direction parallel to the plane from which the first micro springs of the housings, the second micro springs of the housings, and the third micro springs of the housings respectively include. Unit width, the buffer unit width is 1mm~6mm. The electronic device according to claim 28, wherein: each of the porous units has a porous unit width in a direction parallel to the plane from which the matched first microsprings extend, and the porous units The width of the sex unit is 500~5000um. The electronic device according to claim 28, wherein: each of the porous units is matched with the first microsprings of the housings, the second microsprings of the housings, and the third microsprings of the housings. The direction parallel to the plane from which the spring extends has a porous unit width, and the porous unit width is 500-5000um. The electronic device according to claim 28, wherein: the porous units are polyethylene terephthalate (PET), rubber or foamed cotton.

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