JP2008020865A - Electronic equipment having side structure protrusion of enhancing rigidity of chassis plane part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment having such a structure as to provide a satisfactory mechanical strength of the whole electronic equipment while achieving the thinning and reduction in weight of the electronic equipment and, in particular, the electronic equipment having such a structure that members for structure strengthening are made as small as possible so as not to damage merits such as the thinning and reduction in weight of the electronic equipment, nevertheless, the mechanical strength is satisfied if only the members are attached to the irreducible minimum positions and, moreover, unites functions besides the structure strengthening. <P>SOLUTION: The electronic equipment comprises a thin electronic equipment housing and a planar metal chassis 0400 which is arranged in the housing and functions as a structural member, wherein the metal chassis 0400 comprises a chassis flat plane part 0401 which has approximately the same outer shape as the principal plane of the thin electronic equipment housing and electronic components arranged on both surfaces thereof, and side structure protrusions 0402 which are arranged on the outer peripheral part of the chassis flat plane part and enhance the rigidity of the chassis flat plane part. In addition, the metal chassis has a side structure wall 0404 and angle structure protrusions 0403. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a structure for maintaining the mechanical strength of a thin electronic device.

  Conventionally, the mechanical strength of an electronic device has been ensured by making the casing function as a structural member. That is, the casing itself has mechanical strength, so that the shape of the electronic device is maintained, and the internal electronic components are protected from external forces such as pressing, impact, and twist. However, in recent years, with the reduction in thickness and weight of electronic devices, it has been required to further reduce the thickness of the housing, and the mechanical strength of the housing has to be lowered. As a result, it has become increasingly difficult to achieve the objective of ensuring the mechanical strength of electronic equipment. This tendency is particularly remarkable in portable and portable electronic devices. On the other hand, since the electronic device is easily affected by external forces such as dropping, pressing, and striking, mechanical strength such as impact resistance is an essential factor. For the purpose of solving such conflicting problems, the following inventions are known.

  Patent Document 1 is an invention for reducing the weight of the entire liquid crystal display device by providing a die cast frame that supports a liquid crystal panel, a reflector, and a lamp.

  In Patent Document 2, a plurality of grooves or steps are provided in the flat portion of the rear housing, and the interval between the grooves or steps is made narrower than before, and the control circuit board of the display device is arranged in a space formed there. Thus, the invention provides a display device structure that is strong against external force and can protect a control circuit board such as an inverter disposed between the liquid crystal display device and the back casing and components in the liquid crystal display device. .

In Patent Document 3, a casing having a substantially rectangular flat portion is formed as a metal molded product by melting, and a step substantially parallel to the molten metal flowing direction from the gate on one side to the other side at the time of molding is disclosed. Is provided, and the central part of the flat part is raised in a convex shape, so that the thickness of the casing is reduced, and it is high with respect to external force without deteriorating the formability at the time of forming a metal molded part. It is an invention that provides a portable information processing device that has durability and is lighter.
JP 2004-334299 A JP 2004-325844 A JP 2003-204174 A

  However, the above invention is a technique for increasing the mechanical strength of only the liquid crystal display portion of the liquid crystal display device, or a technique for increasing the mechanical strength of the casing. Also, the internal electronic components are fixed directly to the housing or indirectly through other electronic components. That is, all the technologies still have the same function as the structural member of the entire electronic device. Therefore, there has been a limit to reducing the thickness of the housing while maintaining the mechanical strength in order to reduce the thickness and weight of the electronic device.

  Therefore, the problem to be solved by the present invention is to provide an electronic apparatus having a structure that satisfies the mechanical strength of the entire electronic apparatus while realizing a reduction in thickness and weight of the electronic apparatus. In particular, in order not to impair the merits of making electronic devices thinner and lighter, the requirements for minimizing structural members as much as possible and mounting them in the minimum necessary position are satisfied. An object of the present invention is to provide an electronic apparatus having a structure that also serves a function other than the structure strengthening while providing the structure.

  In order to solve the above problems, among the present inventions, the invention described in claim 1 is a thin electronic device casing, and a flat metal that is disposed inside the thin electronic device casing and functions as a structural member. An electronic device comprising a chassis made of metal, wherein the metal chassis has substantially the same outer shape as the main surface of the thin electronic device casing, and a chassis plane portion on which electronic components are arranged on both sides, and a chassis plane portion Provided is an electronic device having a side structure protrusion that is disposed on the whole or a part of the outer peripheral portion of the chassis and increases the rigidity of the chassis flat portion. The invention according to claim 2 is the invention according to claim 1, wherein the metal chassis further includes a side structure wall which is disposed on all or a part of the outer peripheral portion of the chassis plane portion to increase the rigidity of the chassis plane portion. Provide electronic equipment. According to a third aspect of the present invention, in the first or second aspect, the metal chassis further includes angular structure protrusions that are disposed at all or a part of the corners of the chassis plane portion to increase the rigidity of the chassis plane portion. The electronic device described is provided. The invention according to claim 4 provides the electronic apparatus according to claim 2, wherein the side structure wall has a triple wall structure. The invention according to claim 5 provides the electronic device according to claim 4, wherein the side structure wall has a partition wall structure by passing ribs between the triple walls. The invention according to claim 6 provides the electronic device according to claim 3, wherein the corner structure protrusion has a partition wall structure with a rib. The invention according to claim 7 provides the electronic apparatus according to claim 1, wherein the side structure protrusion has a partition wall structure with a rib. The invention according to claim 8 provides the electronic apparatus according to claim 2, wherein the side structure wall also functions as a connection portion with an electronic component disposed on the main surface of the metal chassis. The invention according to claim 9 provides the electronic apparatus according to claim 1, wherein the side structure protrusion also functions as a connection portion with an electronic component disposed on the main surface of the metal chassis. According to a tenth aspect of the present invention, there is provided the electronic device according to the third aspect, wherein the angular structure protrusion functions also as a connection portion with an electronic component disposed on a metal chassis main surface. According to an eleventh aspect of the present invention, there is provided the electronic device according to the second aspect, wherein the side structure wall also functions as a connection portion with a housing that provides a thin electronic device. The invention according to claim 12 provides the electronic apparatus according to claim 1, wherein the side structure protrusion also functions as a connection portion with a housing that provides a thin electronic apparatus. The invention according to claim 13 provides the electronic device according to claim 3, wherein the angular structure protrusion also functions as a connection portion with a housing for providing a thin electronic device.

  According to the present invention, it is possible to provide an electronic apparatus having a structure that satisfies the mechanical strength of the entire electronic apparatus while realizing a reduction in thickness and weight of the electronic apparatus. In particular, a structure that satisfies the requirement to make the members for structural reinforcement as small as possible and to be installed in the minimum necessary position so as not to impair the merits of thinning and weight reduction of electronic devices. It is possible to provide an electronic device having a structure that also serves as a function other than the structural enhancement.

  Examples of the present invention will be described below. The relationship between the embodiments and the claims is as follows. Example 1 mainly relates to claim 1, claim 2, etc., Example 2 mainly relates to claim 3, etc., Example 3 mainly relates to claim 4, claim 5, claim 7, claim 7, etc. The fourth embodiment mainly relates to claims 8, 9, and 10, and the fifth embodiment mainly relates to claims 11, 12, and 13. In addition, this invention is not limited to these Examples at all, and can be implemented in various modes without departing from the gist thereof.

<Overview>
The electronic device according to the present embodiment includes a thin electronic device casing and a metal chassis disposed therein. The metal chassis has rigidity on the whole or a part of the outer peripheral portion of the planar portion of the chassis. It is characterized in that it has side structure protrusions to be raised. Moreover, the metal chassis may have a side structure wall for the same purpose. That is, the present embodiment provides a member that can be attached to a small and necessary minimum position without losing the merit of thinning and weight reduction of the electronic device by the side structure protrusion or the side structure wall in addition to this, As a result, the structure of the entire electronic device is strengthened.

<Configuration>
(Configuration overview)
FIG. 1 shows an example of an electronic apparatus (0100) of this embodiment. “Electronic device” refers to a device in which an electronic component such as a substrate is arranged inside a housing. For example, display devices, hard disks, notebook computers, UMPCs (Ultra-Mobile PCs), PDAs (Personal Digital Assistants), mobile phones, portable players, digital cameras, electronic dictionaries, electronic books, IC recorders, speakers, watches, etc. . The electronic device in this figure is an example of a portable thin liquid crystal display device.
2 and 3 are front perspective exploded views (FIG. 2) and rear perspective exploded views (FIG. 3) when the electronic device shown in FIG. 1 is disassembled to explain the configuration of the electronic device of the present embodiment. Respectively. As shown in these exploded views, the electronic device (0200, 0300) of the present invention includes a thin electronic device casing (0201, 0301) and a metal chassis (0202) disposed inside the thin electronic device casing. , 0302). Moreover, in the example of the electronic apparatus of this figure, the metal chassis is arranged with liquid crystal display units (0203, 0303), substrates (0204, 0304), battery cases (0205, 0305), etc., which are electronic components, It is fixed.

(Description of components (1) Thin electronic device casing)
The “thin electronic device casing” is a thin box that houses electronic components. “Electronic components” are not limited to electronic components such as substrates, display units, and speakers, but refer to main internal components that are necessary for the functions of electronic devices, such as battery cases and terminals. Further, the term “thin” here is a concept determined by the aspect ratio of the casing. That is, when the vertical, horizontal, and height ratios of the casings are a, b, and c, respectively, an electronic device casing having a relationship of a> c and b> c corresponds to a thin electronic device casing. . At this time, the height c corresponds to the thickness of the thin electronic device casing. The thickness size varies depending on the size of the thin electronic device casing and the type of electronic device. In general, the thickness size of a large electronic device casing increases. For example, the thickness size is 1 cm or more and 15 cm or less for a case of a large-medium electronic device such as a display device, and the thickness size is 5 mm or more and 4 cm or less for a case of a medium-sized electronic device such as a notebook computer. In the case of a casing of a small electronic device such as a mobile phone, a portable player, or a digital camera, the case where the thickness is 2 mm or more and 1.5 cm or less corresponds to the “thin” here. As a more specific example, when the vertical size of the electronic device casing is in the range of 10 cm to 20 cm and the horizontal size is in the range of 20 cm to 40 cm, the thickness size is in the range of 8 mm to 2 cm. Some can be cited as thin electronic device housings.
Note that the thin electronic device casing of the present invention does not necessarily have a function as a structural member in the electronic device. Further, there is no need to arrange electronic components such as a substrate and a display panel. This is because a metal chassis, which will be described later, has a function to replace the conventional housing.

(Description of components (2) Metal chassis)
The “metal chassis” is the most important member that functions as a structural member in the electronic device of the present embodiment, and is configured to be disposed inside the thin electronic device casing. The “structural member” is a member arranged for the purpose of preventing deformation or destruction of all or part of the electronic device due to external force. Moreover, it is a single member having a low deformability with respect to bending moment, impact, and shear force applied to the electronic device from the outside. In the electronic apparatus according to the present embodiment, there may be a plurality of structural members. In this case, the metal chassis has the lowest deformability among the structural members with respect to the external force. Therefore, the most preferable form in the electronic device of the present invention from the viewpoint of thinning and weight reduction is that a single metal chassis is arranged in a resin-made thin electronic device casing and supported by the metal chassis. The electronic parts are arranged on both sides.
The material of the metal chassis may be a metal having rigidity capable of maintaining a certain shape. Preferably, it is made of a lightweight alloy containing at least one of aluminum, titanium, and magnesium. This is because these metals all contribute to the object of the present invention, which is to reduce the weight of electronic equipment, because of their low specific gravity. The reason why metal is preferable as the material for the metal chassis is that metal has high thermal conductivity, so it can easily diffuse the heat generated inside the case, has an electromagnetic shielding effect, and can be recycled. by. However, the most important function in the metal chassis of the present invention is that the electronic device is given mechanical strength capable of resisting external force such as bending, twisting, and impact, and all or part of the electronic device due to the external force is applied. It is to prevent deformation and destruction. Therefore, the metal chassis may be other than metal as long as it is a material having the function. Examples of materials other than the metal include fiber reinforced plastic (FRP) and structural fine ceramics. The metal chassis may have irregularities such as embossing and protrusions on the chassis plane for the purpose of increasing its rigidity and the necessity of arranging other members. However, even if it has the said unevenness | corrugation, it is preferable that it is on a flat plate as a whole.

Since the metal chassis is disposed inside the thin electronic device casing, it cannot normally be visually recognized after the electronic device is assembled. However, a part thereof may be exposed from a hole provided in the housing or a joint portion of the front and rear housings.
With this metal chassis, it is possible to further reduce the mechanical strength of the housing, which is at least required for conventional electronic devices, while ensuring the mechanical strength of the entire electronic device. That is, since the thickness of the thin electronic device casing can be further reduced, the electronic device can be further reduced in thickness and weight.

  FIG. 4 is an overall perspective view showing an example of a metal chassis, which is the same as that shown in FIGS. 2 and 3 (0202, 0302), and shows a surface appearing on the right side of these drawings as an upper surface. As shown in this figure, the metal chassis (0400) has a “side structure” arranged on the “chassis plane part” (0401) indicated by the hatched area and on the whole or a part of the outer peripheral part (0401a) of the chassis plane part. Protrusions "(0402). Further, as shown in the figure, in addition to this, a “side structure wall” (0404) and a “corner structure projection” (0403) may be provided. Hereinafter, each component will be described.

(Explanation of components (3) Chassis plane part)
The chassis flat portion is a main region of the metal chassis, and is flat and has substantially the same outer shape as the main surface of the thin electronic device casing.
Here, the meaning of “substantially the same outer shape” will be described with reference to FIG. 5A is a front view of a thin electronic device casing of a portable thin liquid crystal display device, and FIG. 5B is a metal chassis (0500) disposed in the thin electronic device casing of FIG. The hatched area in (a) shows the position when the metal chassis in (b) is placed in the thin electronic device casing. This metal chassis is a representative example having substantially the same outer shape as the main surface of the thin electronic device casing.
In this way, the chassis flat portion has substantially the same outer shape as the main surface of the thin electronic device casing, and the shape required for the metal chassis to hold the shape of the entire electronic device and function as a structural member, That is, when an external force is applied to the electronic device from various directions, the outer shape can prevent the deformation and destruction of the place where the strongest stress is received on the thin electronic device casing. That is, the metal chassis can impart mechanical strength to the entire electronic device because the chassis flat portion has substantially the same outer shape as the main surface of the thin electronic device casing. Therefore, “substantially the same outer shape” may be the same outer shape as long as the above-described function of the metal chassis can be exhibited, and does not need to be the same outer shape. Also in the example of FIG. 5, the chassis flat portion (0501) in the broken line frame of the metal chassis (0500) shown in (b) is substantially rectangular, and the main surface of the thin electronic device casing is rectangular. Are not completely similar. Thus, even if the shape of the flat portion of the chassis of the metal chassis is different from the shape of the thin electronic device casing, the relationship between the two is the “substantially the same outer shape” in the present embodiment.
In addition, the chassis plane portion has electronic components arranged on both sides thereof. FIGS. 2 and 3 show examples in which the liquid crystal display unit (0203, 0303), the substrate (0204, 0304), and the battery case (0205, 0305), which are electronic components, are arranged on both sides. The electronic components in the example can include a wide range as described above, and the example in the figure is an example.

  In addition, the size of the chassis flat portion of the metal chassis varies depending on the mechanical strength of the thin electronic device casing. For example, if the mechanical strength of the casing itself against external forces such as bending and impact becomes relatively small due to thinning of the thin electronic apparatus casing, the size of the chassis flat portion is reduced to that of the thin electronic apparatus casing. Relative to body size. That is, in FIG. 5A, the portion where the thin electronic device casing projects from the metal chassis, that is, the value of the width W outside the hatched area decreases. The reason for the decrease will be described with reference to FIG. FIG. 6 shows an enlarged cross-sectional view of the broken-line circle in FIG. W indicates the width (length) from the end (0604) of the metal chassis (0603) to the end 0606 of the thin electronic device casing (0601), as in FIG. 5 (a). Further, in the thin electronic device casing (0601), when an external force V from the normal direction is applied to the dot region (0602) in FIG. 6 corresponding to the region outside the hatched region in FIG. Maximum stress is applied to the end (0604) of the chassis (0603) and the thin electronic device casing (0605) on the end. In this case, the bending moment generated in the thin electronic device casing becomes the maximum value W × V when the external force V acts on the end (0606) of the thin electronic device casing. In order to prevent deformation and destruction of the thin electronic device casing from the external force V, it is necessary to reduce the bending moment W × V. To that end, the value of the width W may be reduced. Therefore, when the mechanical strength of the thin electronic device casing is small, the value of the width W decreases.

(Explanation of components (4-1) Side structure protrusion: Outline / Definition of terms)
The “side structure protrusions” are arranged on the whole or a part of the outer peripheral portion of the chassis planar portion so as to increase the rigidity of the chassis planar portion. Since the chassis plane portion of the present embodiment is flat like the chassis plane portion that occupies the main area in the metal chassis, it lacks mechanical strength to resist the external force of bending and twisting. There's a problem. Therefore, the mechanical strength is enhanced by providing a side structure protrusion on the whole or a part of the outer peripheral portion, and the problem is solved.
The side structure protrusions are distinguished from the side structure walls described later, depending on the size and arrangement location on the side of the outer periphery. That is, the side structure protrusion has a short length on the side of the outer peripheral portion as indicated by 0402 in FIG. Further, the side structure protrusion (0402) surrounded by a broken-line circle (0402a) at the center of the left side in FIG.
7 is a cross-sectional view of the side structure protrusion (0402) surrounded by a broken line circle (0402a) in FIG. 4, and is perpendicular to the line X1-X1 ′ (line in contact with the upper surface of the side structure protrusion) in FIG. It is sectional drawing seen from the arrow Y direction (strictly slightly upper direction) in general, when it cut | disconnects in FIG. 8 is an enlarged view of a region surrounded by a broken-line circle in FIG. 4, and FIG. 9 is an enlarged cross-sectional view of a region surrounded by a broken-line circle in FIG.
On the other hand, as shown by 0404 in FIG. 4, the side structure wall occupies a longer length on the side of the outer peripheral portion than the side structure protrusion. On the other hand, as will be described later, the side structure protrusion and the side structure wall are limited by the thickness of the metal chassis, and as a result, the side structure protrusion is generally higher than the length of the side structure wall. Becomes a relatively high shape (so-called “protruding shape”). An example of the dimension occupied on the side of the outer peripheral part is that the vertical size of the electronic device casing is within the range of 10 cm to 20 cm, the horizontal size is within the range of 20 cm to 40 cm, and the thickness size is within the range of 8 mm to 2 cm. Speaking of an example of a thin electronic device casing, there is a case where the side structure protrusion is 3 cm or less and the side structure wall is more than 3 cm (may occupy the entire outer periphery). . In addition, the arrangement location also reflects the above dimensions, and even if the side structure projection is arranged over the entire outer peripheral portion, a plurality of projections are intermittently arranged. Arranging in “general” in the outer peripheral portion is intended to indicate such a case. On the other hand, as for a side structure wall, one wall may be arrange | positioned at the whole outer peripheral part. Arranging “all” on the outer peripheral portion is intended to indicate such a case.

On the other hand, the angular structure protrusions described later have the same size range as the side structure protrusions, but both are distinguished by the arrangement location. That is, the side structure protrusions are disposed at positions that do not include corners, whereas the corner structure protrusions are disposed at positions that include corners.
However, the position where the side structure protrusion is disposed may be the whole or a part of the outer peripheral portion of the chassis flat portion, and the specific position is not limited. As a result, the number of side structure protrusions provided on the outer peripheral portion of the chassis flat portion is not limited.

  These side structure protrusions are provided on both sides of the metal chassis, in other words, directly disposed on each outer peripheral part of both sides of the metal chassis (hereinafter, such a thing is referred to as “both side structure protrusions”). 5), or provided only on one side as shown in FIG. 5 (b), in other words, directly disposed only on the outer periphery of one side of the metal chassis. (Hereinafter, such a thing is referred to as “one-side structure protrusion”). Moreover, when it is provided only on one side, it may be provided on any of the upper and lower surfaces. However, when the side structure protrusion is a one-side side structure protrusion, it is preferable to dispose it over the entire outer peripheral portion. This is to provide mechanical strength that can sufficiently resist external forces of bending and twisting. Similarly, when the side structure protrusions are both side structure protrusions and are disposed on a part of the outer peripheral portion, it is preferable that the one side structure protrusions be disposed at a location where the both side structure protrusions are not disposed.

(Explanation of components (4-2) Side structure protrusion: concrete shape)
The specific shape of the side structure protrusion is sufficient if the outer peripheral portion of the side structure protrusion is formed so as to be convex with respect to the chassis plane. As long as the purpose is satisfied, the specific shape and dimensions thereof are not limited as long as they are within the above-mentioned dimensions. 4 are all examples suitable as side structure protrusions. For example, the side structure protrusion (0902) shown in FIG. 9 is a one side structure protrusion having a L-shaped cross section, and the protrusion also protrudes from the lower surface of the chassis plane (0901). And although a part of lower surface is depressed, the thing of such a shape may be sufficient. Further, in addition to the shape shown in this figure, for example, an L-shaped one-side structure projection (1002) formed convexly only on one side with respect to the chassis plane (1001) as shown in the sectional view of FIG. In addition, a modified L-shaped one-side structure projection (1102) in which one side is formed in a convex shape and the corresponding other side is formed in a concave shape as shown in the sectional view of FIG. Further, in the case of both side structure protrusions, there may be mentioned one (1202) that is convexly formed in the same shape on both sides with respect to the chassis plane (1201) as shown in FIG. In order to increase the mechanical strength, the side structure protrusion may have a partition wall structure having double or more walls and ribs between the walls. For example, the side structure protrusion (0402) surrounded by a broken-line circle (0402b) above the right side in FIG. 4 is an example of a side structure protrusion having a double wall and a partition wall structure with ribs between the walls. Details of this structure will be described later in Example 3.

(Description of component (4-3) Side structure protrusion: Height)
The height of the side structure protrusion is determined according to the thickness of the electronic device. Since the thickness of the metal chassis does not exceed the thickness of the electronic device casing in principle, as shown in FIG. 12, the thickness size of the electronic device is set to H, and the thickness of the chassis flat portion of the metal chassis is set. When the height size of C and the side wall portion is h (h = h1 + h2), the relationship is H ≧ C + h. For example, as shown in FIG. 13, the vertical size A is in the range of 10 cm to 20 cm, the horizontal size B is in the range of 20 cm to 40 cm, and the thickness C is in the range of 0.35 mm to 0.65 mm. When the chassis flat portion is disposed inside the portable thin liquid crystal display device shown in FIG. 1, if the thickness of the portable thin liquid crystal display device is 16 mm, the height size of the side wall of the metal chassis is It suffices to be within a range of 3 mm to 15.35 mm from the chassis plane.

(Description of components (5) Side structure wall)
The “side structure wall” is disposed on all or a part of the outer peripheral portion of the chassis plane portion, and the purpose of increasing the rigidity of the chassis plane portion is the same as that of the side structure protrusion. The distinction from the side structure protrusions depends on the size and the arrangement location on the side of the outer peripheral portion as described above. That is, the side structure wall occupies a longer length on the side of the outer peripheral portion than the side structure protrusion, and may be disposed on the entire outer peripheral portion (thus, it may include corners). As a result of occupying a certain length on the outer peripheral portion in this way, a wall having a certain area on the side surface (having a so-called “wall” in a flat manner) is a side structure wall.
For example, all shown by 0404 in FIG. 4 are examples of the side structure wall, and it is shown that the length occupied on the outer peripheral portion is longer than the side structure protrusion 0402. In the actual electronic device manufacturing stage, where the side structure protrusions are provided and where the side structure walls are provided is determined by those skilled in the art in light of the dimensions of the housing, the required structural strength, the required degree of weight reduction, etc. It is an appropriate design matter. However, in general, the side structure wall is suitable when the structural strength is more important, and the side structure protrusion is suitable when the weight reduction is more important. Further, the side structure wall 0402 shown in the upper part of FIG. 4 is also for protecting the battery case (indicated by 0205 in FIG. 2), but for protecting the electronic component having a certain size as described above. It can be said that a side structure wall is suitable as the structural reinforcing member. In addition, the side structure wall, like the side structure projection, may have double or more walls in order to increase mechanical strength, and in that case, it has a partition wall structure by passing ribs between the walls. It may be. The side structure wall (0404) surrounded by a broken line ellipse (0404a) in the center of the right side in FIG. 4 is an example of a side structure wall having a partition wall structure having triple walls and ribs between the walls.

<Effect>
According to the present embodiment, it is possible to provide an electronic apparatus having a structure that satisfies the mechanical strength of the entire electronic apparatus while realizing a reduction in thickness and weight of the electronic apparatus. In particular, a structure that satisfies the requirement to make the members for structural reinforcement as small as possible and to be installed in the minimum necessary position so as not to impair the merits of thinning and weight reduction of electronic devices. It becomes possible to provide.

<Overview>
The electronic apparatus of this embodiment is basically the same as that of the first embodiment. However, the metal chassis is further characterized in that it has angular structure protrusions that are arranged at all or part of the corners of the chassis plane portion to increase the rigidity of the chassis plane portion.

<Configuration>
(Configuration overview)
An example of the electronic apparatus of the present embodiment is also as shown in FIGS. 1 to 4 and is basically the same as that of the first embodiment. However, the metal chassis (0401) of the electronic device shown in FIG. 4 further has a “corner structure protrusion” (0403) as an essential component in this embodiment. The corner structure protrusions are arranged at all or part of the corners of the chassis plane portion (0401) to increase the rigidity of the chassis plane portion.

  FIG. 14 is an overall perspective view showing an example of the same metal chassis (1400) as shown in FIG. FIG. 15 is a cross-sectional view generally viewed from the arrow Y direction (slightly above) when cut in the vertical direction along line X2-X2 ′ (line in contact with the upper surface of the corner structure protrusion) in FIG. 16 is an enlarged perspective view of a region surrounded by a broken-line circle (1403a) in FIG. 14, and FIG. 17 is an enlarged cross-sectional view of a region surrounded by a broken-line circle (1503a) in FIG. Further, FIG. 18 is a cross-sectional view generally viewed from the direction of arrow Y ′ (slightly above) when cut in the vertical direction along line X3-X3 ′ (line in contact with the upper surface of the angular structure protrusion) in FIG. 14 is an enlarged perspective view of a region surrounded by a broken-line circle (1403a) in FIG. 14 viewed from the direction of arrow Y ′ (slightly above), and FIG. 20 is a view of the region surrounded by a broken-line circle (1803a) in FIG. It is an expanded sectional view. As shown in these drawings, the metal chassis has “square structure protrusions” (1403, 1503, 1603, 1703, etc.) in addition to the chassis flat portion (1401, 1501, etc.) and the side structure protrusions (1402, 1502, etc.). 1803, 1903, 2003) (unlike Example 1, the angular structure protrusion is an essential component). Further, as shown in these drawings, in addition to these, a “side structure wall” (1404, 1504, etc.) may be provided. The rest of the configuration is the same as that of the electronic apparatus of the first embodiment.

(Explanation of component (1-1) Angular structure protrusion: Overview)
The “corner structure protrusions” are arranged at all or a part of the corners of the chassis plane portion to increase the rigidity of the chassis plane portion. The purpose of providing the corner structure protrusions at all or part of the corners is the same as that of the side structure protrusions and the side structure walls of the first embodiment. The difference between the side structure protrusion and the side structure wall is as described in the first embodiment.
Like the side structure protrusions, the corner structure protrusions are provided only on one side even if they are provided on both sides of the metal chassis (hereinafter referred to as “bilateral corner structure protrusions”). (Hereinafter, such a member is referred to as “one-sided corner structure protrusion”), and in that case, it may be provided on either of the upper and lower surfaces. When the corner structure protrusion is a one-sided corner structure protrusion, it is preferable that the corner structure protrusion is disposed at the entire corner. When the corner structure protrusion is a double-sided corner structure protrusion and is disposed at a part of the corner, the both-side corner structure protrusion is Similar to the side structure protrusion, the one-side corner structure protrusion is preferably disposed at a place where the protrusion is not disposed.

(Description of component (1-2) Angular structure protrusion: shape and height)
As described in the first embodiment, the corner structure protrusion is the same as the side structure protrusion in terms of shape (so-called protrusion shape) and size (shorter than the side structure wall), but at least one corner is provided at the arrangement position. It is different in including.
Further, the specific shape of the corner structure protrusion is the same as that of the side structure protrusion, and it is sufficient that the outer periphery of the corner structure protrusion is formed to be convex with respect to the chassis plane. As long as it meets the purpose of strengthening rigidity while maintaining weight reduction, its specific shape and dimensions are not limited. Therefore, the cross section of the angular structure protrusion (1703) shown in FIG. 17 may be shaped like a side of the E character, and a part of the protrusion may be recessed. Other side structure protrusions may have the same shape as shown in FIGS. Furthermore, you may have a partition wall structure with the rib similar to a side structure protrusion. The example described with reference to FIGS. 14 to 20 is an example of such a structure (this will also be described in detail later in Example 3). Further, the height of the corner structure protrusion is the same as that described in the first embodiment for the side structure protrusion.

<Effect>
According to the present embodiment, it is possible to provide an electronic apparatus having a structure that satisfies the mechanical strength of the entire electronic apparatus while realizing a reduction in thickness and weight of the electronic apparatus. In particular, a structure that satisfies the requirement to make the members for structural reinforcement as small as possible and to be installed in the minimum necessary position so as not to impair the merits of thinning and weight reduction of electronic devices. It becomes possible to provide.

<Overview>
The electronic device of the present embodiment is basically the same as the electronic device of Embodiment 1 or 2, but the side structure wall has a triple wall structure, and the side structure wall, the side structure protrusion, or the angular structure protrusion is a rib. It is characterized by having a partition wall structure.

<Configuration>
(Definition of features and terms of composition)
An example of the electronic device of the present embodiment is also as shown in FIGS. 1 to 4 and is basically the same as the electronic device of the first or second embodiment. However, the side structure wall of the electronic apparatus of the present embodiment has a triple wall structure, and the side structure wall, the side structure protrusion, or the corner structure protrusion has a partition wall structure with ribs.
“It has a partition wall structure with ribs” means that it has two or more walls parallel to the outer periphery (the side structure wall is a triple wall), and ribs are perpendicular to each other between these walls. This means that it has a structure in which the structure protrusion or the structure wall is partitioned into several rectangular sections. The reason for this structure is to further increase the mechanical strength. “Double or more walls” means that wall portions such as side structure protrusions are formed in double or more at the outer peripheral portion of one surface. Further, the “rib” refers to a member that is attached at a right angle to the wall surface in order to further reinforce the side structure protrusions of the multiple wall structure. The height of the rib is preferably the same as the walls on both sides from the viewpoint of strength alone, but may be slightly lower than this from the viewpoint of weight reduction. The rib spacing (number) is also an appropriate design matter in light of both strength and weight reduction.

(Description of component (1) Side structure wall)
A specific example of the side structure wall of this embodiment is shown in FIG. This figure is an enlarged view of a side structure wall (0404) surrounded by a broken line circle (0404a) at the center of the right side shown in FIG. The side structure wall (2104) of this example has a triple wall (2104a), and ribs (2104b) are provided between the walls to partition the wall into 24 sections. 22 is a cross-sectional perspective view generally viewed from the direction of arrow Y when cut in the vertical direction along line X4-X4 ′ (line in contact with the upper surface of the side structure wall) in FIG. In addition, although the side structure wall of these examples showed the case where each wall is the same shape, this is not essential, for example, as shown in sectional drawing of FIG. 23, the side (2302a) is not the same shape. It may be a structural wall (2304) (FIG. 23 shows a case of a double wall, but the same applies to a case of a triple wall or more).

(Description of component (2) Side structure protrusion)
A specific example of the side structure protrusion of this embodiment is shown in FIG. This figure is an enlarged view of the side structure protrusion (0402) surrounded by a broken line circle (0402b) above the right side shown in FIG. The side structure protrusion (2402) of the present example has a triple wall (2402a), and a rib (2402b) is provided between them to partition it into three sections. 25 is a cross-sectional perspective view generally viewed from the direction of arrow Y when cut in the vertical direction along line X5-X5 ′ (line in contact with the upper surface of the side structure wall) in FIG. It should be noted that each wall may not have the same shape as in the case of the side structure protrusion.

(Description of component (3) Square structure protrusion)
A specific example of the angular structure protrusion of the present embodiment is shown in FIG. This figure is an enlarged view of the angular structure protrusion (1403) surrounded by a broken-line circle (1403b) in the lower right corner shown in FIG. As shown in this figure, the angular structure protrusion (2603) of this example has a triple wall (2603a) on the right side (2601a) of the outer peripheral portion, and ribs (2603b) are provided between the four walls to form four sections. The structure is divided into two. FIG. 27 is a cross-sectional perspective view generally viewed from the direction of arrow Y when cut in the vertical direction along line X6-X6 ′ (line in contact with the upper surface of the side structure wall) in FIG. It should be noted that each wall may not have the same shape as in the case of the side structure protrusion.

<Effect>
According to the present embodiment, it is possible to provide an electronic apparatus having a structure that satisfies the mechanical strength of the entire electronic apparatus while realizing a reduction in thickness and weight of the electronic apparatus. In particular, a structure that satisfies the requirement to make the members for structural reinforcement as small as possible and to be installed in the minimum necessary position so as not to impair the merits of thinning and weight reduction of electronic devices. It becomes possible to provide.

<Overview>
The electronic device of this embodiment is basically the same as the electronic device of the first or second embodiment. However, the side structure wall, the side structure protrusion, or the corner structure protrusion of the electronic device of this example is characterized in that it also functions as a connection portion with an electronic component disposed on the main surface of the metal chassis.

<Configuration>
(Definition of features and terms of composition)
An example of the electronic device of the present embodiment is also as shown in FIGS. 1 to 4 and is basically the same as the electronic device of the first or second embodiment. However, the side structure wall, the side structure protrusion, or the corner structure protrusion of the electronic device of this example is configured to function as a connection portion with an electronic component disposed on the main surface of the metal chassis.
“Metal chassis main surface” refers to the surface of the metal chassis on which electronic components are arranged. Since the metal chassis of the present embodiment is configured to arrange electronic components on both sides, it is synonymous with “both sides of the metal chassis” in this example.
The “connection part” referred to in the present embodiment includes a wide part for fixing the electronic component to the main surface of the metal chassis by a wall or a protrusion, and it does not matter whether or not it is electronically connected to the electronic component. The “electronic component” is the same as that described in the first embodiment.
FIG. 28 shows an example of a side structure wall, a side structure protrusion, or a corner structure protrusion configured to function also as a connection portion with an electronic component arranged on the metal chassis main surface. It is shown using an example similar to the electronic equipment. In this example, a side structure protrusion (2802), a corner structure protrusion (2803), or a side structure wall (2804) is arranged on the outer peripheral part or corner on the chassis flat portion (2801) of the metal chassis (2800). The board (2805) and the battery case (2806) (which stores the battery (2807) inside) as electronic components are connected and fixed to the side structure walls and the like on the chassis plane.

(Description of component (1) Side structure wall)
FIG. 29 is a diagram illustrating an example of a state in which the side structure wall also functions as a connection portion with the battery case disposed on the main surface of the metal chassis, and the side structure wall and the battery case portion in FIG. It is an enlarged one. As shown in the figure, the battery case (2906) of the present embodiment is fixed on the chassis flat portion so as to be fitted to the side structure wall (2904). FIG. 30 shows a state where the battery case (3006) is separated from the side structure wall (3004) and the chassis flat portion (3001).

(Description of component (2) Side structure protrusion)
FIG. 31 is a diagram showing an example of a state in which the side structure protrusion functions also as a connection portion with a substrate disposed on the main surface of the metal chassis, and is a side structure protrusion surrounded by a broken line oval in FIG. (2802) and a part of the substrate (2805) connected thereto. However, this figure shows the state seen from the opposite direction (arrow A direction of FIG. 28) to FIG. As shown in this figure, the substrate (3105) of the present embodiment is fixed on the chassis flat portion (3101) so that the outer side is in contact with the side structure protrusion (3102). FIG. 32 shows a state in which the substrate (3205) is separated from the side structure protrusion (3202) and the chassis flat portion (3201). As shown in this figure, the two overhanging portions (3205a) of the substrate (3205) are fixed in contact with the positions connected by the broken lines of the side structure protrusions (3202).

(Description of component (3) Square structure protrusion)
FIG. 33 is a diagram showing an example of a state in which the corner structure protrusions also function as a connection portion with the substrate disposed on the main surface of the metal chassis, and is a corner surrounded by a broken line circle (2803a) in FIG. The structural protrusion (2803) and a part of the substrate (2805) connected thereto are enlarged. However, this figure also shows a state viewed from a direction almost opposite to FIG. 28 (in the direction of arrow A in FIG. 28). As shown in the figure, the substrate (3305) of the present example is fixed on the chassis flat portion (3301) so that the outer side is in contact with the corner structure protrusion (3303). FIG. 34 shows a state in which the substrate (3405) is separated from the corner structure protrusion (3403) and the chassis flat portion (3401). As shown in this figure, by aligning the two holes (3405b) of the projecting portion (3405a) of the substrate (3405) with the holes provided at the positions connected by the broken lines on the chassis plane (3401), The projecting portion of is fixed so as to be in contact with the angular structure protrusion (3403).

<Effect>
According to the present embodiment, the side structural wall, the side structural projection, and the angular structural projection, which are members for strengthening the structure, can also be used as a connection part with an electronic component, thereby reducing the number of components and the weight of the electronic component. This makes it possible to contribute to reducing the size and weight of the device and reducing the manufacturing cost.

<Overview>
The electronic device of this embodiment is basically the same as the electronic device of the first or second embodiment. However, the side structure wall, the side structure protrusion, or the corner structure protrusion of the electronic device of this example is characterized in that it also functions as a connection portion with the thin electronic device housing.

<Configuration>
(Configuration features)
An example of the electronic device of the present embodiment is also as shown in FIGS. 1 to 4 and is basically the same as the electronic device of the first or second embodiment. However, the side structure wall, the side structure protrusion, or the corner structure protrusion of the electronic device of this example is configured to function also as a connection portion with the thin electronic device casing.
The “connection part” referred to in the present embodiment broadly includes a part for fixing the thin electronic device casing and the metal chassis by walls or protrusions.
FIG. 35 shows an example of a side structure wall, a side structure protrusion, or a corner structure protrusion that is also configured to function as a connection portion with a thin electronic device housing, similar to the electronic device shown in FIGS. It is shown using the example of. In this example, the side structure protrusion (3502), the corner structure protrusion (3503), or the side structure wall (3504) is arranged on the outer peripheral portion or corner of the chassis flat portion (3501) of the metal chassis (3500). A thin electronic device housing (3505) is connected to and fixed to the metal chassis by side structure protrusions, corner structure protrusions, or side structure walls under the chassis flat portion. Note that the thin electronic device casing of this example is a part of what is arranged on the right side among those indicated by 0201 in FIG.
FIG. 36 shows the thin electronic device casing and the chassis plane portion of FIG. 35 separately. For example, a concave portion (3605a) facing the inside of the thin electronic device casing (3605) is surrounded by a broken line circle (3602a) on the lower right side of the lower side of the chassis flat portion (3601) of the metal chassis (3600) connected by a broken line. It is fixed in contact with the side structure protrusion (3602).

(Description of component (1) Side structure wall)
FIG. 37 is a diagram illustrating an example of a state in which the side structure wall also functions as a connection portion with the thin electronic device housing. FIG. 37 illustrates a side structure wall surrounded by a broken line ellipse (3504a) in FIG. 3504) and a part of the thin electronic device casing (3505) connected thereto. However, this figure shows the state seen from the substantially right direction (arrow A direction of FIG. 35) of FIG. As shown in this figure, the thin electronic device casing (3705) of the present example is fixed to the metal chassis (3700) so as to be in contact with the side structure wall (3704) in the vicinity of the outer side. FIG. 38 shows a state where the thin electronic device housing (3805) and the metal chassis (3800) are separated. As shown in this figure, the notch portion (3805b) of the wall (3805a) provided in the vicinity of the outer side of the thin electronic device housing (3805) is provided at a position connected by the broken line of the side structure wall (3804). By aligning with the protruding portion (3804a), the wall portion of the thin electronic device casing is fixed in contact with the side structure wall.

(Explanation of component (2) Side structure protrusion, corner structure protrusion)
FIG. 39 is a diagram illustrating an example of a state in which the side structure protrusion or the corner structure protrusion also functions as a connection portion with the thin electronic device casing, and is surrounded by a broken-line ellipse (3502a) in FIG. The side structure protrusion (3502), the corner structure protrusion (3503), and a part of the thin electronic device casing (3505) connected thereto are enlarged. As shown in this figure, the thin electronic device casing (3905) of the present example is attached to the metal chassis (3900) so as to contact the side structure protrusion (3902) and the corner structure protrusion (3903) in the vicinity of the outer side. It is fixed. FIG. 40 shows a state where the thin electronic device housing (4005) and the metal chassis (4000) are separated. As shown in this figure, the notch (4005b) of the wall (4005a) provided in the vicinity of the outer side of the thin electronic device casing (4005) is provided at the position connected by the broken line of the side structure protrusion (4002). Align with the protruding portion (4002a) and align the cylindrical protrusion (4005c) provided outside the notched portion with the notched portion (4002b) provided at the position where the side structure protrusion is connected by the broken line. Thus, the wall portion of the thin electronic device casing is fixed in contact with the side structure protrusion. In addition, the hole (4005e) of the cylindrical protrusion (4005d) of the wall (4005a) provided near the outer edge of the thin electronic device casing (4005) is connected to the position where the square structure protrusion (4003) is broken by a broken line. By aligning with the hole (4003b) of the provided overhang portion (4003a), the wall portion of the thin electronic device casing is fixed in contact with the corner structure protrusion.

<Effect>
According to the present embodiment, the side structural wall, the side structural protrusion, and the angular structural protrusion, which are members for structural reinforcement, can be used as a connection portion with the thin electronic device casing, thereby reducing the number of parts and the weight of the parts. It is possible to reduce the size and weight of the electronic device and to reduce the manufacturing cost.

FIG. 6 is a diagram illustrating an example of an electronic apparatus according to the first embodiment. 1 is a front perspective exploded view of a portable thin liquid crystal display device which is an example of an electronic apparatus of Embodiment 1. FIG. 1 is a rear perspective exploded view of a portable thin liquid crystal display device which is an example of an electronic apparatus of Embodiment 1. FIG. FIG. 7 is an overall perspective view illustrating an example of a metal chassis of the electronic device according to the first embodiment. The figure for demonstrating the meaning of "substantially the same external shape" in the electronic device of Example 1. The figure for demonstrating the bending moment in the electronic device of Example 1. Sectional drawing of an example of the metal chassis of the electronic device of Example 1. The enlarged view of an example of the side structure protrusion in the metal chassis of the electronic device of Example 1. The expanded sectional view of an example of the side structure projection in the metal chassis of the electronic equipment of Example 1 The figure explaining the L-shaped one side wall part convexly formed only on one side with respect to the chassis plane The figure explaining the deformation | transformation L-shaped one side wall part by which one side was formed in convex with respect to the chassis plane, and the other side corresponding was formed in concave. The figure explaining the both-sides side wall currently formed in the convex to both sides with respect to a chassis plane The figure explaining the size of the chassis plane part in the metal chassis of the electronic device of Example 1. FIG. 7 is an overall perspective view illustrating an example of a metal chassis of the electronic device according to the second embodiment. Sectional drawing of an example of the metal chassis of the electronic device of Example 2. The enlarged view of an example of the corner | angular structure protrusion in the metal chassis of the electronic device of Example 2. The expanded sectional view of an example of the corner structure projection in the metal chassis of the electronic equipment of Example 2 Sectional drawing of an example of the metal chassis of the electronic device of Example 2. The enlarged view of an example of the corner | angular structure protrusion in the metal chassis of the electronic device of Example 2. The expanded sectional view of an example of the corner structure projection in the metal chassis of the electronic equipment of Example 2 The figure which shows the specific example of the side structure wall in the metal chassis of the electronic device of Example 3. Sectional drawing of an example of the side structure wall in the metal chassis of the electronic device of Example 3 The figure explaining the case where each wall of the side structure wall has a different shape on both sides The figure which shows the specific example of the side structure protrusion in the metal chassis of the electronic device of Example 3. Sectional drawing of an example of the side structure protrusion in the metal chassis of the electronic device of Example 3 The figure which shows the specific example of the corner | angular structure protrusion in the metal chassis of the electronic device of Example 3. Sectional drawing of an example of the corner | angular structure protrusion in the metal chassis of the electronic device of Example 3. The figure which shows an example of the side structure wall in the metal chassis of the electronic device of Example 4, a side structure protrusion, or a corner | angular structure protrusion. The figure which shows an example of the state of the side structure wall and electronic component in the metal chassis of the electronic device of Example 4. The figure which shows an example of the state of the side structure wall and electronic component in the metal chassis of the electronic device of Example 4. The figure which shows an example of the side structure protrusion in the metal chassis of the electronic device of Example 4, and the state of an electronic component The figure which shows an example of the side structure protrusion in the metal chassis of the electronic device of Example 4, and the state of an electronic component The figure which shows an example of the state of the square structure protrusion and electronic component in the metal chassis of the electronic device of Example 4. The figure which shows an example of the state of the square structure protrusion and electronic component in the metal chassis of the electronic device of Example 4. The figure which shows an example of the side structure wall in the metal chassis of the electronic device of Example 5, a side structure protrusion, or a corner | angular structure protrusion. The figure which shows an example of the side structure wall in the metal chassis of the electronic device of Example 5, a side structure protrusion, or a corner | angular structure protrusion. The figure which shows an example of the state of the side structure wall in the metal chassis of the electronic device of Example 5, and a thin electronic device housing | casing. The figure which shows an example of the state of the side structure wall in the metal chassis of the electronic device of Example 5, and a thin electronic device housing | casing. The figure which shows an example of the state of the side structure protrusion or corner | angular structure protrusion in a metal chassis of the electronic device of Example 5, and a thin electronic device housing | casing. The figure which shows an example of the state of the side structure protrusion or corner | angular structure protrusion in a metal chassis of the electronic device of Example 5, and a thin electronic device housing | casing.

Explanation of symbols

0100 Electronic device 0201 Thin electronic device housing 0202 Metal chassis 0203 Liquid crystal display unit 0204 Substrate 0205 Battery case 0400 Metal chassis 0401 Chassis plane part 0401a Peripheral part of chassis plane part 0402 Side structure protrusion 0403 Square structure protrusion 0404 Side structure wall

Claims (13)

An electronic device comprising a thin electronic device housing and a flat metal chassis that functions as a structural member disposed inside the thin electronic device housing,
The metal chassis has substantially the same outer shape as the main surface of the thin electronic device casing, and a chassis plane portion on which electronic components are arranged on both surfaces;
An electronic device having a side structure protrusion which is arranged on the whole or a part of the outer peripheral portion of the chassis flat portion and increases the rigidity of the chassis flat portion.   2. The electronic device according to claim 1, wherein the metal chassis further includes a side structure wall that is disposed on all or a part of an outer peripheral portion of the chassis plane portion to increase rigidity of the chassis plane portion.   The electronic device according to claim 1, wherein the metal chassis further includes corner structure protrusions that are arranged at all or part of corners of the chassis plane portion to increase the rigidity of the chassis plane portion.   The electronic apparatus according to claim 2, wherein the side structure wall has a triple wall structure.   The electronic device according to claim 4, wherein the side structure wall has a partition wall structure by passing a rib between triple walls.   The electronic device according to claim 3, wherein the corner structure protrusion has a partition wall structure with a rib.   The electronic device according to claim 1, wherein the side structure protrusion has a partition wall structure with a rib.   The electronic device according to claim 2, wherein the side structure wall also functions as a connection portion with an electronic component disposed on a metal chassis main surface.   The electronic device according to claim 1, wherein the side structure protrusion also functions as a connection portion with an electronic component disposed on a metal chassis main surface.   The electronic device according to claim 3, wherein the corner structure protrusion also functions as a connection portion with an electronic component disposed on a metal chassis main surface.   The electronic device according to claim 2, wherein the side structure wall also functions as a connection portion with a thin electronic device casing.   The electronic device according to claim 1, wherein the side structure protrusion also functions as a connection portion with a thin electronic device housing.   The electronic device according to claim 3, wherein the corner structure protrusion also functions as a connection portion with a thin electronic device housing.

Images