TW202215499A - 模擬方法、模擬設備、成膜設備、物品製造方法和非暫態性儲存媒體 - Google Patents

模擬方法、模擬設備、成膜設備、物品製造方法和非暫態性儲存媒體 Download PDF

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Publication number
TW202215499A
TW202215499A TW110126053A TW110126053A TW202215499A TW 202215499 A TW202215499 A TW 202215499A TW 110126053 A TW110126053 A TW 110126053A TW 110126053 A TW110126053 A TW 110126053A TW 202215499 A TW202215499 A TW 202215499A
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Taiwan
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TW110126053A
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English (en)
Chinese (zh)
Inventor
相原泉太郎
大口雄一郎
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日商佳能股份有限公司
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Publication of TW202215499A publication Critical patent/TW202215499A/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/28—Design optimisation, verification or simulation using fluid dynamics, e.g. using Navier-Stokes equations or computational fluid dynamics [CFD]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/25—Design optimisation, verification or simulation using particle-based methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00—Details relating to the application field
    • G06F2113/08—Fluids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00—Details relating to the application field
    • G06F2113/22—Moulding

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Algebra (AREA)
  • Computing Systems (AREA)
  • Fluid Mechanics (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Mathematical Physics (AREA)
  • Pure & Applied Mathematics (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW110126053A 2020-07-29 2021-07-15 模擬方法、模擬設備、成膜設備、物品製造方法和非暫態性儲存媒體 TW202215499A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020128506A JP2022025595A (ja) 2020-07-29 2020-07-29 シミュレーション方法、シミュレーション装置、膜形成装置、物品の製造方法及びプログラム
JP2020-128506 2020-07-29

Publications (1)

Publication Number Publication Date
TW202215499A true TW202215499A (zh) 2022-04-16

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Application Number Title Priority Date Filing Date
TW110126053A TW202215499A (zh) 2020-07-29 2021-07-15 模擬方法、模擬設備、成膜設備、物品製造方法和非暫態性儲存媒體

Country Status (5)

Country Link
US (1) US20220035969A1 (ja)
JP (1) JP2022025595A (ja)
KR (1) KR20220014828A (ja)
CN (1) CN114063394A (ja)
TW (1) TW202215499A (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8851638B2 (en) * 2010-11-11 2014-10-07 Eastman Kodak Company Multiple resolution continuous ink jet system
JP5599356B2 (ja) * 2011-03-31 2014-10-01 富士フイルム株式会社 シミュレーション方法、プログラムおよびそれを記録した記録媒体、並びに、それらを利用した液滴配置パターンの作成方法、ナノインプリント方法、パターン化基板の製造方法およびインクジェット装置。
US20200394349A1 (en) * 2019-06-11 2020-12-17 Canon Kabushiki Kaisha Simulation method, simulation apparatus, storage medium film forming method, and method of producing cured product
SG10202005345XA (en) * 2019-06-11 2021-01-28 Canon Kk Simulation method, simulation apparatus, and program

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Publication number Publication date
US20220035969A1 (en) 2022-02-03
CN114063394A (zh) 2022-02-18
KR20220014828A (ko) 2022-02-07
JP2022025595A (ja) 2022-02-10

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