TW202214736A - 改質苯氧基樹脂、其製造方法、樹脂組成物、硬化物、電氣電子電路用積層板 - Google Patents

改質苯氧基樹脂、其製造方法、樹脂組成物、硬化物、電氣電子電路用積層板 Download PDF

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Publication number
TW202214736A
TW202214736A TW110135180A TW110135180A TW202214736A TW 202214736 A TW202214736 A TW 202214736A TW 110135180 A TW110135180 A TW 110135180A TW 110135180 A TW110135180 A TW 110135180A TW 202214736 A TW202214736 A TW 202214736A
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TW
Taiwan
Prior art keywords
resin
group
phenoxy resin
resin composition
modified phenoxy
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Application number
TW110135180A
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English (en)
Chinese (zh)
Inventor
秋葉圭太
佐藤洋
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日商日鐵化學材料股份有限公司
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Publication of TW202214736A publication Critical patent/TW202214736A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48Polymers modified by chemical after-treatment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
TW110135180A 2020-09-30 2021-09-22 改質苯氧基樹脂、其製造方法、樹脂組成物、硬化物、電氣電子電路用積層板 TW202214736A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020165557 2020-09-30
JP2020-165557 2020-09-30

Publications (1)

Publication Number Publication Date
TW202214736A true TW202214736A (zh) 2022-04-16

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Family Applications (1)

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TW110135180A TW202214736A (zh) 2020-09-30 2021-09-22 改質苯氧基樹脂、其製造方法、樹脂組成物、硬化物、電氣電子電路用積層板

Country Status (3)

Country Link
JP (1) JP7487326B2 (https=)
TW (1) TW202214736A (https=)
WO (1) WO2022070921A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI824889B (zh) * 2022-12-18 2023-12-01 台光電子材料股份有限公司 樹脂組合物及其製品

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7744150B2 (ja) * 2021-03-26 2025-09-25 日鉄ケミカル&マテリアル株式会社 フェノキシ樹脂、その樹脂組成物、その硬化物及びその製造方法。

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5326188B2 (ja) * 2006-04-04 2013-10-30 Dic株式会社 樹脂組成物、フェノキシ樹脂、塗料組成物、接着剤組成物、接着フィルム、プリプレグ、多層プリント配線基板及び樹脂付銅箔
JP6672699B2 (ja) 2014-10-29 2020-03-25 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
EP3660802A1 (en) * 2018-11-27 2020-06-03 Koninklijke Philips N.V. Predicting critical alarms
TW202142585A (zh) * 2020-03-19 2021-11-16 日商日鐵化學材料股份有限公司 苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及苯氧基樹脂的製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI824889B (zh) * 2022-12-18 2023-12-01 台光電子材料股份有限公司 樹脂組合物及其製品

Also Published As

Publication number Publication date
JP7487326B2 (ja) 2024-05-20
WO2022070921A1 (ja) 2022-04-07
JPWO2022070921A1 (https=) 2022-04-07

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