JP7487326B2 - 変性フェノキシ樹脂、その製造方法、樹脂組成物、硬化物、電気・電子回路用積層板 - Google Patents

変性フェノキシ樹脂、その製造方法、樹脂組成物、硬化物、電気・電子回路用積層板 Download PDF

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JP7487326B2
JP7487326B2 JP2022553799A JP2022553799A JP7487326B2 JP 7487326 B2 JP7487326 B2 JP 7487326B2 JP 2022553799 A JP2022553799 A JP 2022553799A JP 2022553799 A JP2022553799 A JP 2022553799A JP 7487326 B2 JP7487326 B2 JP 7487326B2
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group
carbon atoms
resin
phenoxy resin
resin composition
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JPWO2022070921A1 (https=
Inventor
圭太 秋葉
洋 佐藤
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Nippon Steel Chemical and Materials Co Ltd
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Nippon Steel Chemical and Materials Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
JP2022553799A 2020-09-30 2021-09-15 変性フェノキシ樹脂、その製造方法、樹脂組成物、硬化物、電気・電子回路用積層板 Active JP7487326B2 (ja)

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JP2020165557 2020-09-30
JP2020165557 2020-09-30
PCT/JP2021/033919 WO2022070921A1 (ja) 2020-09-30 2021-09-15 変性フェノキシ樹脂、その製造方法、樹脂組成物、硬化物、電気・電子回路用積層板

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JPWO2022070921A1 JPWO2022070921A1 (https=) 2022-04-07
JP7487326B2 true JP7487326B2 (ja) 2024-05-20

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JP2022553799A Active JP7487326B2 (ja) 2020-09-30 2021-09-15 変性フェノキシ樹脂、その製造方法、樹脂組成物、硬化物、電気・電子回路用積層板

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JP (1) JP7487326B2 (https=)
TW (1) TW202214736A (https=)
WO (1) WO2022070921A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7744150B2 (ja) * 2021-03-26 2025-09-25 日鉄ケミカル＆マテリアル株式会社 フェノキシ樹脂、その樹脂組成物、その硬化物及びその製造方法。
TWI824889B (zh) * 2022-12-18 2023-12-01 台光電子材料股份有限公司 樹脂組合物及其製品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007277333A (ja) 2006-04-04 2007-10-25 Dainippon Ink & Chem Inc 樹脂組成物、フェノキシ樹脂、塗料組成物、接着剤組成物、接着フィルム、プリプレグ、多層プリント配線基板及び樹脂付銅箔
JP2016089165A (ja) 2014-10-29 2016-05-23 三菱化学株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
WO2021187180A1 (ja) 2020-03-19 2021-09-23 日鉄ケミカル＆マテリアル株式会社 フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びフェノキシ樹脂の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3660802A1 (en) * 2018-11-27 2020-06-03 Koninklijke Philips N.V. Predicting critical alarms

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007277333A (ja) 2006-04-04 2007-10-25 Dainippon Ink & Chem Inc 樹脂組成物、フェノキシ樹脂、塗料組成物、接着剤組成物、接着フィルム、プリプレグ、多層プリント配線基板及び樹脂付銅箔
JP2016089165A (ja) 2014-10-29 2016-05-23 三菱化学株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
WO2021187180A1 (ja) 2020-03-19 2021-09-23 日鉄ケミカル＆マテリアル株式会社 フェノキシ樹脂、樹脂組成物、硬化物、電気・電子回路用積層板、及びフェノキシ樹脂の製造方法

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TW202214736A (zh) 2022-04-16
WO2022070921A1 (ja) 2022-04-07
JPWO2022070921A1 (https=) 2022-04-07

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