TW202209138A - Biometric sensing device and biometric sensing group - Google Patents
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本發明是有關於一種感測裝置,且特別是有關於一種生物特徵感測裝置以及生物特徵感測群體。The present invention relates to a sensing device, and more particularly, to a biometric sensing device and biometric sensing population.
近年來,包括有生物識別系統(例如指紋或虹膜)的生物特徵感測裝置被大量應用於可攜式電子裝置中。以屏下光學感測器為例,其為將微型光學成像裝置設置於可攜式電子裝置的屏幕下方,透過屏幕的部分透光區域擷取按壓於屏幕上方的物體的圖像。In recent years, biometric sensing devices including biometric identification systems (such as fingerprints or iris) have been widely used in portable electronic devices. Taking the under-screen optical sensor as an example, a miniature optical imaging device is arranged below the screen of the portable electronic device, and an image of an object pressed above the screen is captured through a part of the light-transmitting area of the screen.
為了能成功辨識生物特徵,生物特徵感測裝置一般會配至有光機結構層,以聚焦入射光且提高其准直性;然而,在元件之間的間距隨著科技的發展而越來越小的情況下,光學串擾(crosstalk)現象仍無可避免地產生,此將造成感測的影像解析度較差。再者,在大量的生物特徵感測裝置於母板上製成時,位於母板邊緣的生物特徵感測裝置易產生製程偏移,使得光學串擾現象更易發生於此生物特徵感測裝置中。In order to successfully identify biometrics, biometric sensing devices are generally equipped with an opto-mechanical structure layer to focus the incident light and improve its collimation; however, the spacing between the elements is becoming more and more with the development of technology. In small cases, the phenomenon of optical crosstalk (crosstalk) still inevitably occurs, which will cause the image resolution of the sensing to be poor. Furthermore, when a large number of biometric sensing devices are fabricated on a motherboard, the biometric sensing devices located at the edge of the motherboard are prone to process shifts, which makes optical crosstalk more likely to occur in the biometric sensing devices.
本發明提供一種生物特徵感測裝置,其可避免光學串擾現象的發生而具有良好的辨識性能。The present invention provides a biometric sensing device, which can avoid the occurrence of optical crosstalk and has good identification performance.
本發明的生物特徵感測裝置包括感測元件層、第一遮光層以及第二遮光層。感測元件層設置於基板上且包括用以感測光線的多個感測元件。第一遮光層設置於感測元件層上且包括多個第一孔洞,其中多個第一孔洞中的至少一者具有的孔寬為Wn ,相鄰的兩個第一孔洞之間具有第一遮光部,且第一遮光部具有的寬度為Gn。第二遮光層設置於第一遮光層上且包括多個第二孔洞,其中相鄰的兩個第二孔洞之間具有第二遮光部,且第二遮光部與第一遮光部對應。在基板的法線方向上,第一遮光部與第二遮光部之間的距離為Hn ,其中多個第二孔洞中的一者的中心軸與光線夾設的夾角為α,且0°<α<60°。當多個第二孔洞中的一者的中心軸與所對應的多個第一孔洞中的一者的中心軸重疊時,Wn、Gn、Hn 與α符合式1:2Hn *│tan(α)│ ≤ (2Gn+Wn)。當多個第二孔洞中的一者的中心軸與所對應的多個第一孔洞中的一者的中心軸不重疊時,Wn、Gn、Hn 與α符合式2:2Hn *│tan(α)│ ≤(Gn+Wn)。The biometric sensing device of the present invention includes a sensing element layer, a first light shielding layer and a second light shielding layer. The sensing element layer is disposed on the substrate and includes a plurality of sensing elements for sensing light. The first light shielding layer is disposed on the sensing element layer and includes a plurality of first holes, wherein at least one of the plurality of first holes has a hole width W n , and there is a first hole between two adjacent first holes. A light-shielding portion, and the width of the first light-shielding portion is Gn. The second light-shielding layer is disposed on the first light-shielding layer and includes a plurality of second holes, wherein a second light-shielding portion is arranged between two adjacent second holes, and the second light-shielding portion corresponds to the first light-shielding portion. In the normal direction of the substrate, the distance between the first light-shielding portion and the second light-shielding portion is H n , wherein the angle between the central axis of one of the plurality of second holes and the light is α, and is 0° <α<60°. When the central axis of one of the plurality of second holes overlaps with the central axis of one of the corresponding plurality of first holes, Wn, Gn, Hn and α conform to the formula 1: 2Hn *│tan( α)│ ≤ (2Gn+Wn). When the central axis of one of the plurality of second holes does not overlap with the central axis of one of the corresponding plurality of first holes, Wn, Gn, Hn and α conform to Equation 2: 2Hn *│tan (α)│ ≤(Gn+Wn).
本發明提供一種生物特徵感測群體,其包括的生物特徵感測裝置皆可避免光學串擾現象的發生而具有良好的辨識性能。The present invention provides a biometric sensing group, and the biometric sensing devices included in the biometric sensing device can avoid the occurrence of optical crosstalk and have good identification performance.
本發明的生物特徵感測裝置包括基板、感測元件層、第一遮光層以及第二遮光層。基板具有第一區域以及第二區域,其中第二區域鄰近於基板的邊緣,且第一區域遠離基板的邊緣。感測元件層設置於基板上且包括用以感測光線的多個感測元件。第一遮光層設置於感測元件層上且包括多個第一孔洞,且相鄰的兩個第一孔洞之間具有第一遮光部。第二遮光層設置於第一遮光層上且包括多個第二孔洞,其中相鄰的兩個第二孔洞之間具有第二遮光部,且第二遮光部與第一遮光部對應。位於第一區域的多個第二孔洞中的一者的中心軸與所對應的多個第一孔洞中的一者的中心軸重疊,且位於第二區域的多個第二孔洞中的一者的中心軸與所對應的多個第一孔洞中的一者的中心軸不重疊。The biometric sensing device of the present invention includes a substrate, a sensing element layer, a first light shielding layer, and a second light shielding layer. The substrate has a first area and a second area, wherein the second area is adjacent to the edge of the substrate, and the first area is far away from the edge of the substrate. The sensing element layer is disposed on the substrate and includes a plurality of sensing elements for sensing light. The first light shielding layer is disposed on the sensing element layer and includes a plurality of first holes, and a first light shielding portion is arranged between two adjacent first holes. The second light-shielding layer is disposed on the first light-shielding layer and includes a plurality of second holes, wherein a second light-shielding portion is arranged between two adjacent second holes, and the second light-shielding portion corresponds to the first light-shielding portion. The central axis of one of the plurality of second holes in the first area overlaps with the central axis of the corresponding one of the plurality of first holes, and is located in one of the plurality of second holes in the second area The central axis does not overlap with the central axis of one of the corresponding plurality of first holes.
綜上所述,在本發明的生物特徵感測群體中,使位於遠離基板邊緣的區域中的生物特徵感測裝置的第一孔洞具有的孔寬、第一遮光部具有的寬度、第一遮光層與第二遮光層之間的距離以及第二孔洞的中心軸與通過第二孔洞的中心的光線夾設的最大角度符合關係式1;且使位於靠近基板邊緣的區域中的生物特徵感測裝置的第一孔洞具有的孔寬、第一遮光部具有的寬度、第一遮光層與第二遮光層之間的距離以及第二孔洞的中心軸與通過第二孔洞的中心的光線夾設的最大角度符合關係式2,藉此可以使本發明提供的生物特徵感測裝置皆具有良好的辨識性能。To sum up, in the biometric sensing group of the present invention, the first hole of the biometric sensing device located in the region away from the edge of the substrate has the hole width, the width of the first light shielding portion, the first light shielding The distance between the layer and the second light-shielding layer and the maximum angle sandwiched by the central axis of the second hole and the light passing through the center of the second hole conform to
本文使用的「約」、「近似」、「本質上」、或「實質上」包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,「約」可以表示在所述值的一個或多個標準偏差內,或例如±30%、±20%、±15%、±10%、±5%內。再者,本文使用的「約」、「近似」、「本質上」、或「實質上」可依量測性質、切割性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。As used herein, "about", "approximately", "substantially", or "substantially" includes the stated value and the average value within an acceptable deviation of the particular value as determined by one of ordinary skill in the art, taking into account all The measurement in question and the specific amount of error associated with the measurement (ie, the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±15%, ±10%, ±5%, for example. Furthermore, the terms "about", "approximately", "substantially", or "substantially" as used herein may depend on measurement properties, cutting properties, or other properties to select a more acceptable range or standard deviation, and may Not one standard deviation applies to all properties.
在附圖中,為了清楚起見,放大了層、膜、面板、區域等的厚度。應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件「上」或「連接到」另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為「直接在另一元件上」或「直接連接到」另一元件時,不存在中間元件。如本文所使用的,「連接」可以指物理及/或電性連接。再者,「電性連接」可為二元件間存在其它元件。In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection. Furthermore, the "electrical connection" may refer to the existence of other elements between the two elements.
此外,諸如「下」或「底部」和「上」或「頂部」的相對術語可在本文中用於描述一個元件與另一元件的關係,如圖所示。應當理解,相對術語旨在包括除了圖中所示的方位之外的裝置的不同方位。例如,如果一個附圖中的裝置翻轉,則被描述為在其它元件的「下」側的元件將被定向在其它元件的「上」側。因此,示例性術語「下」可以包括「下」和「上」的取向,取決於附圖的特定取向。類似地,如果一個附圖中的裝置翻轉,則被描述為在其它元件「下方」或「下方」的元件將被定向為在其它元件「上方」。因此,示例性術語「上面」或「下面」可以包括上方和下方的取向。Furthermore, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element, as shown in the figures. It should be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the particular orientation of the figures. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "above" or "below" can encompass both an orientation of above and below.
現將詳細地參考本發明的示範性實施方式,示範性實施方式的實例說明於所附圖式中。只要有可能,相同元件符號在圖式和描述中用來表示相同或相似部分。Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used in the drawings and description to refer to the same or like parts.
圖1為一實施例的生物特徵感測群體的俯視示意圖。請參照圖1,本實施例的生物特徵感測群體10包括有基板SB以及多個生物特徵感測裝置100、200,其中基板SB具有第一區域CA以及第二區域PA,第一區域CA遠離於基板SB之邊緣,且第二區域PA鄰近於基板SB之邊緣。在本實施例中,第二區域PA環繞第一區域CA,但本發明不以此為限。生物特徵感測裝置100與生物特徵感測裝置200例如各自位於基板SB的第一區域CA以及第二區域PA中,以下將參照圖2A與圖2B介紹生物特徵感測裝置100與生物特徵感測裝置200包括的構件及其具有的特定參數關係。FIG. 1 is a schematic top view of a biometric sensing population according to an embodiment. Referring to FIG. 1 , the
圖2A為依據圖1的剖線A1-A1’的一實施例的生物特徵感測裝置的剖面示意圖。請先參照圖2A,本實施例的生物特徵感測裝置100包括感測元件層SE、第一遮光層BL1以及第二遮光層BL2。FIG. 2A is a schematic cross-sectional view of a biometric sensing device according to an embodiment of the section line A1-A1' of FIG. 1 . Referring first to FIG. 2A , the
感測元件層SE例如設置於基板SB上且包括用以感測光線L的多個感測元件SU。在一些實施例中,基板SB可為可撓性基板或剛性基板,本發明不以此為限。本實施例的感測元件層SE除了包括多個感測元件SU之外,還可包括主動元件(未繪示)、掃描線(未繪示)以及讀取線(未繪示)等走線,但本發明不以此為限。在一些例示性實施例中,主動元件、掃描線以及讀取線亦例如設置於基板SB上,其中掃描線與主動元件的源極電性連接,且讀取線與主動元件的汲極電性連接,以讀取感測元件SU感測到的訊號。在一些例示性實施例中,感測元件SU可包括第一電極(未繪示)、感光層(未繪示)以及第二電極(未繪示)。第一電極、感光層以及第二電極例如以此順序依序堆疊於基板SB上。第一電極與第二電極可例如包括透光的導電材料或不透光的導電材料,其視生物特徵感測裝置100的用途而定。在本實施例中,生物特徵感測裝置100可作為屏下指紋感測器來使用,因此,來自外界的光(例如經指紋反射的光)會穿過第二電極而入射至感光層,基於此,第二電極是使用透光的導電材料製作。感光層則具有將光能轉換為電能的特性,以實現光學感測的功能。在一些實施例中,感光層的材料可包括富矽材料,其可為富矽氧化物、富矽氮化物、富矽氮氧化物、富矽碳化物、富矽碳氧化物、氫化富矽氧化物、氫化富矽氮化物、氫化富矽碳化物、具高功函數元素參雜材料,例如:矽鍺化合物或其他合適的有機材料,或上述材料的組合。另外,在一些實施例中,感測元件層SE可更包括覆蓋多個感測元件SU的絕緣層(未繪示),此絕緣層可為單層結構或多層結構,且可包括有機材料或無機材料,本發明不以此為限。The sensing element layer SE is, for example, disposed on the substrate SB and includes a plurality of sensing elements SU for sensing the light L. In some embodiments, the substrate SB may be a flexible substrate or a rigid substrate, but the invention is not limited thereto. In addition to a plurality of sensing elements SU, the sensing element layer SE of this embodiment may also include active elements (not shown), scan lines (not shown), and read lines (not shown) and other traces , but the present invention is not limited to this. In some exemplary embodiments, the active element, the scan line and the readout line are also disposed on the substrate SB, for example, wherein the scan line is electrically connected to the source of the active element, and the readout line is electrically connected to the drain of the active element connected to read the signal sensed by the sensing element SU. In some exemplary embodiments, the sensing element SU may include a first electrode (not shown), a photosensitive layer (not shown) and a second electrode (not shown). The first electrode, the photosensitive layer and the second electrode are sequentially stacked on the substrate SB, for example, in this order. The first electrode and the second electrode may include, for example, a light-transmitting conductive material or an opaque conductive material, which depends on the application of the
第一遮光層BL1例如設置於感測元件層SE上且包括多個第一孔洞OP1,從另一個角度來看,第一遮光層BL1包括有位於相鄰的兩個第一孔洞OP1之間的多個第一遮光部BM1。在本實施例中,第一遮光層BL1具有的多個第一孔洞OP1可用以定義出光通過區域,其中第一遮光部BM1具有寬度Gn,多個第一孔洞OP1中的至少一者具有孔寬Wn,且多個第一孔洞OP1中的至少一者具有中心軸OP1_C。在一些實施例中,第一遮光層BL1的材料包括遮光及/或反射材料,其可為金屬、合金、前述材料的氮化物、前述材料的氧化物、前述材料的氮氧化物、或是其它合適的遮光及/或反射材料。舉例而言,第一遮光層BL1的材料可為鉬、氧化鉬或其堆疊層。基於此,未設置有第一遮光層BL1的區域即可定義出光通過區域。在本實施例中,第一孔洞OP1與感測元件層SE中的感測元件SU對應地設置,以使感測元件SU可將穿過第一孔洞OP1的外界的光線L轉換為對應的電訊號。另外,在一些實施例中,設置有第一遮光部BM1的區域可用於遮蔽感測元件SU的主動元件。詳細地說,第一遮光部BM1可例如位於主動元件的上方且至少遮蔽主動元件的半導體層,藉此以避免來自外界的光照射至半導體層,從而避免主動元件產生漏電的情況。For example, the first light shielding layer BL1 is disposed on the sensing element layer SE and includes a plurality of first holes OP1. From another perspective, the first light shielding layer BL1 includes a plurality of first holes OP1 located between two adjacent first holes OP1. A plurality of first light shielding parts BM1. In this embodiment, a plurality of first holes OP1 of the first light shielding layer BL1 can be used to define a light passing area, wherein the first light shielding portion BM1 has a width Gn, and at least one of the plurality of first holes OP1 has a hole width Wn, and at least one of the plurality of first holes OP1 has a central axis OP1_C. In some embodiments, the material of the first light-shielding layer BL1 includes light-shielding and/or reflective materials, which may be metals, alloys, nitrides of the aforementioned materials, oxides of the aforementioned materials, oxynitrides of the aforementioned materials, or other materials. Suitable shading and/or reflective materials. For example, the material of the first light shielding layer BL1 may be molybdenum, molybdenum oxide or a stack thereof. Based on this, the light passing region can be defined in the region where the first light shielding layer BL1 is not provided. In this embodiment, the first holes OP1 are disposed correspondingly to the sensing elements SU in the sensing element layer SE, so that the sensing elements SU can convert the light L from the outside that passes through the first holes OP1 into corresponding electrical signals No. In addition, in some embodiments, the region provided with the first light shielding portion BM1 may be used to shield the active element of the sensing element SU. In detail, the first light shielding portion BM1 may be located above the active element and at least shield the semiconductor layer of the active element, thereby preventing light from the outside from irradiating the semiconductor layer, thereby avoiding the leakage of the active element.
在一些實施例中,本實施例的生物特徵感測裝置100可更包括設置於感測元件層SE與第一遮光層BL1之間的第一絕緣層IL1。第一絕緣層IL1可例如為無機層或有機層。在第一絕緣層IL1為無機層的情況下,其包括的材料可為氧化矽、氮化矽、氮氧化矽、或上述至少二種材料的堆疊層。在第一絕緣層IL1為有機層的情況下,其包括的材料可為聚亞醯胺、聚酯、苯並環丁烯、聚甲基丙烯酸甲酯、聚乙烯苯酚、聚乙烯醇、聚四氟乙烯、六甲基二矽氧烷或上述至少二種材料的堆疊層。或者,第一絕緣層IL1可包括具有濾光功效的有機材料。舉例而言,第一絕緣層IL1可為紅外線截止(IR-cut)濾光層,以避免顯示出來的影像受到紅外光影響而有失真或是色散之情形發生,但本發明不以此為限。在一些實施例中,第一絕緣層IL1可為單層結構或多層結構,本發明不以此為限。In some embodiments, the
第二遮光層BL2例如設置於第一遮光層BL1上且包括多個第二孔洞OP2,從另一個角度來看,第二遮光層BL2包括有位於相鄰的兩個第二孔洞OP2之間的多個第二遮光部BM2。第二遮光層BL2具有的多個第二孔洞OP2亦可例如用以定義出光通過區域,其中第二遮光部BM2具有寬度Gn+1,多個第二孔洞OP2中的至少一者具有孔寬Wn+1,且多個第二孔洞OP2中的至少一者具有中心軸OP2_C。在一些實施例中,在基板SB的法線方向n上,第二遮光層BL2具有的第二孔洞OP2對應於第一遮光層BL1具有的第一孔洞OP1。舉例而言,本實施例的第二孔洞OP2具有的中心軸OP2_C與第一孔洞OP1具有的中心軸OP1_C重疊,即,第二孔洞OP2的中心軸OP2_C與第一孔洞OP1的中心軸OP1_C之間不具有偏移距離,但本發明不以此為限。在另一些實施例中,第二孔洞OP2的中心軸OP2_C與第一孔洞OP1的中心軸OP1_C之間可具有偏移距離。從另一個角度來看,在基板SB的法線方向n上,第二遮光部BM2會與第一遮光部BM1對應且部份重疊,但本發明不限於此。For example, the second light shielding layer BL2 is disposed on the first light shielding layer BL1 and includes a plurality of second holes OP2. From another perspective, the second light shielding layer BL2 includes a plurality of second holes OP2 located between two adjacent second holes A plurality of second light shielding parts BM2. The plurality of second holes OP2 in the second light shielding layer BL2 can also be used for example to define a light passing area, wherein the second light shielding portion BM2 has a width Gn+1, and at least one of the plurality of second holes OP2 has a hole width Wn +1, and at least one of the plurality of second holes OP2 has a central axis OP2_C. In some embodiments, in the normal direction n of the substrate SB, the second hole OP2 of the second light shielding layer BL2 corresponds to the first hole OP1 of the first light shielding layer BL1 . For example, the central axis OP2_C of the second hole OP2 in this embodiment overlaps the central axis OP1_C of the first hole OP1, that is, between the central axis OP2_C of the second hole OP2 and the central axis OP1_C of the first hole OP1 There is no offset distance, but the present invention is not limited thereto. In other embodiments, there may be an offset distance between the central axis OP2_C of the second hole OP2 and the central axis OP1_C of the first hole OP1 . From another perspective, in the normal direction n of the substrate SB, the second light shielding portion BM2 corresponds to and partially overlaps with the first light shielding portion BM1, but the present invention is not limited thereto.
在一些實施例中,第二孔洞OP2具有的孔寬Wn+1可大於第一孔洞OP1具有的孔寬Wn,且第二遮光部BM2具有的寬度Gn+1可小於第一遮光部BM1具有的寬度Gn,本發明不以此為限。另外,在基板SB的法線方向n上,第一遮光層BL1與第二遮光層BL2之間具有距離Hn ,值得說明的是,此處的距離Hn 為第一遮光層BL1的頂表面BM1_T與第二遮光層BL2的頂表面BM2_T之間的距離,但本發明不以此為限,其亦可為第一遮光層BL1的底表面與第二遮光層BL2的底表面之間的距離。In some embodiments, the width Wn+1 of the second hole OP2 may be larger than the width Wn of the first hole OP1 , and the width Gn+1 of the second light-shielding portion BM2 may be smaller than that of the first light-shielding portion BM1 The width Gn is not limited in the present invention. In addition, in the normal direction n of the substrate SB, there is a distance Hn between the first light shielding layer BL1 and the second light shielding layer BL2. It is worth noting that the distance Hn here is the top surface of the first light shielding layer BL1. The distance between BM1_T and the top surface BM2_T of the second light shielding layer BL2, but the invention is not limited to this, and it can also be the distance between the bottom surface of the first light shielding layer BL1 and the bottom surface of the second light shielding layer BL2 .
在一些實施例中,第二孔洞OP2具有的中心軸OP2_C與通過第二孔洞OP2的中心的光線L夾設有最大夾角α。詳細地說,此處所提到的最大夾角α為通過第二孔洞OP2的中心的光線L不穿過非與第二孔洞OP2對應的第一孔洞OP1的臨界角度。在本實施例中,最大夾角α為通過第二孔洞OP2的中心的光線L照射至第一遮光部BM1的頂表面BM1_T的邊緣的路徑與第二孔洞OP2的中心軸OP2_C所夾的最大角度。在本實施例中,0°<α<60°,但本發明不限於此。另外,在本實施例中,第一孔洞OP1具有的孔寬Wn、第一遮光部BM1具有的寬度Gn、第一遮光層BL1與第二遮光層BL2之間的距離Hn
以及第二孔洞OP2的中心軸OP2_C與通過第二孔洞OP2的中心的光線L夾設的最大夾度α符合下列式1。
2Hn
*│tan(α)│ ≤ (2Gn+Wn)……式1In some embodiments, the central axis OP2_C of the second hole OP2 and the light L passing through the center of the second hole OP2 form a maximum angle α. In detail, the maximum included angle α mentioned here is the critical angle at which the light L passing through the center of the second hole OP2 does not pass through the first hole OP1 not corresponding to the second hole OP2 . In this embodiment, the maximum angle α is the maximum angle between the path of the light L passing through the center of the second hole OP2 irradiated to the edge of the top surface BM1_T of the first light shielding portion BM1 and the central axis OP2_C of the second hole OP2 . In this embodiment, 0°<α<60°, but the present invention is not limited to this. In addition, in this embodiment, the first hole OP1 has a hole width Wn, the first light shielding portion BM1 has a width Gn, a distance Hn between the first light shielding layer BL1 and the second light shielding layer BL2, and the second hole OP2 The maximum clamping degree α between the central axis OP2_C and the light L passing through the center of the second hole OP2 conforms to the following
當本實施例的生物特徵感測裝置100包括的參數具有上述的關係(Wn、Gn、Hn
與α符合上述關係式1)時,可避免產生光學串擾現象導致影像的解析度下降,藉此使本實施例的生物特徵感測裝置具有良好的辨識性能。When the parameters included in the
另外,在一些實施例中,在基板SB的法線方向n上,第一遮光層BL1的頂表面BM1_T與感測元件層SE的頂表面SE_T之間具有距離Dn ,且第二遮光層BL2的頂表面BM2_T與感測元件層SE的頂表面SE_T之間具有距離Dn+1 ,且Dn 、Dn+1 與Hn 符合下列式3。舉例而言,距離Dn 為第一遮光部BM1的頂表面BM1_T與感測元件層SE的頂表面SE_T之間的距離,且距離Dn+1 為第二遮光部BM2的頂表面ML2_T與感測元件層SE的頂表面SE_T之間的距離。 0 < Hn ≤ (Dn+1 -Dn ) ……式3。In addition, in some embodiments, in the normal direction n of the substrate SB, there is a distance D n between the top surface BM1_T of the first light shielding layer BL1 and the top surface SE_T of the sensing element layer SE, and the second light shielding layer BL2 There is a distance Dn+1 between the top surface BM2_T of the sensor element layer SE and the top surface SE_T of the sensing element layer SE, and Dn , Dn+1 and Hn conform to the following Equation 3. For example, the distance Dn is the distance between the top surface BM1_T of the first light shielding portion BM1 and the top surface SE_T of the sensing element layer SE, and the distance Dn+1 is the distance between the top surface ML2_T of the second light shielding portion BM2 and the sensing element layer SE. The distance between the top surfaces SE_T of the element layer SE is measured. 0 < H n ≤ (D n+1 −D n ) …… Equation 3.
在一些實施例中,本實施例的生物特徵感測裝置100可更包括設置於第一遮光層BL1與第二遮光層BL2之間的第二絕緣層IL2。第二絕緣層IL2包括的材料及其結構與上述的第一絕緣層IL1類似,本實施例不再予以贅述。In some embodiments, the
在一些實施例中,本實施例的生物特徵感測裝置100可更包括第三遮光層BL3以及多個微透鏡ML。第三遮光層BL3與多個微透鏡ML例如設置第二遮光層BL2上,其中第三遮光層BL3包括有多個第三孔洞OP3,從另一個角度來看,第三遮光層BL3包括有位於相鄰的兩個第三孔洞OP3之間的多個第三遮光部BM3。第三遮光層BL3亦用以定義出光通過區域,且多個微透鏡ML設置於此光通過區域中。在一些實施例中,多個微透鏡ML對應於多個第二孔洞OP2。舉例而言,在部分的實施例中,多個微透鏡ML具有的中心軸ML_C與第二遮光層BL2具有的第二孔洞OP2的中心軸OP2_C重疊,但本發明不以此為限,在另一些實施例中,多個微透鏡ML具有的中心軸ML_C可不與第二遮光層BL2具有的第二孔洞OP2的中心軸OP2_C重疊。多個第一孔洞OP1、第二孔洞OP2與第三孔洞OP3可例如用於更進一步提升光准直的效果,以降低散射光或折射光所導致的漏光及混光的問題。在一些實施例中,多個微透鏡ML可為對稱雙凸透鏡、非對稱雙凸透鏡、平凸透鏡或凹凸透鏡,本發明不以此為限。另外,多個微透鏡ML的每一者或多者會與一個感測元件SU對應地設置,但本發明不以此為限。相對於微透鏡ML,第三遮光部BM3的頂表面BM3_T可具有平緩的表面,但本發明不以此為限。In some embodiments, the
在一些實施例中,本實施例的生物特徵感測裝置100可更包括設置於第二遮光層BL2與多個微透鏡ML之間的第三絕緣層IL3。第三絕緣層IL3包括的材料及其結構與上述的第一絕緣層IL1類似,本實施例不再予以贅述。In some embodiments, the
在一些實施例中,本實施例的生物特徵感測裝置100可更包括與基板SB重疊的蓋板(未繪示)。蓋板例如設置於多個微透鏡ML的上方,且包括顯示面板、觸控面板以及保護板中的至少一者,其中顯示面板可以是自發光形式或非自發光形式。在本實施例的生物特徵感測裝置100被使用時,使用者的指紋是接觸蓋板。In some embodiments, the
基於上述,當本實施例的生物特徵感測裝置100包括的參數至少具有上述的關係時,可避免產生光學串擾現象導致影像的解析度下降,藉此使本實施例的生物特徵感測裝置具有良好的辨識性能。Based on the above, when the parameters included in the
圖2B為依據圖1的剖線A2-A2’的另一實施例的生物特徵感測裝置的剖面示意圖。在此必須說明的是,圖2B繪示的實施例沿用圖2A的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例描述與效果,下述實施例不再重複贅述,而圖2B繪示的實施例中至少一部份未省略的描述可參閱後續內容。FIG. 2B is a schematic cross-sectional view of a biometric sensing device according to another embodiment of the section line A2-A2' of FIG. 1 . It must be noted here that the embodiment shown in FIG. 2B uses the element numbers and part of the content of the embodiment in FIG. 2A , wherein the same or similar reference numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. . For the description of the omitted part, reference may be made to the descriptions and effects of the foregoing embodiments, and repeated descriptions of the following embodiments will not be repeated, and at least a part of the descriptions not omitted in the embodiment shown in FIG.
請參照圖2B,本實施例的生物特徵感測裝置200與前述實施例的生物特徵感測裝置100的主要差異在於:本實施例的第二遮光層BL2的多個第二孔洞OP2中的一者的中心軸OP2_C與所對應的多個第一孔洞OP1中的一者的中心軸OP1_C不重疊。此是因當包括多個生物特徵感測群體100、200的生物特徵感測群體形成時,位於鄰近於基板SB的邊緣的第二區域PA中的生物特徵感測裝置200易發生製程偏移的現象,使得生物特徵感測群體200中的第二遮光層BL2的第二孔洞OP2的中心軸OP2_C與第一孔洞OP1的中心軸OP1_C之間具有偏移距離Sn。Referring to FIG. 2B , the main difference between the
為了避免因上述的製程偏移導致生物特徵感測群體200更易出現光學串擾的現象,本實施例使第一孔洞OP1具有的孔寬Wn、第一遮光部BM1具有的寬度Gn、第一遮光層BL1與第二遮光層BL2之間的距離Hn
以及第二孔洞OP2的中心軸OP2_C與通過第二孔洞OP2的中心的光線L夾設的最大夾度α符合下列式2。
2Hn
*│tan(α)│ ≤(Gn+Wn)……式2In order to avoid the phenomenon that the
當本實施例的生物特徵感測裝置200包括的參數至少具有上述的關係(Wn、Gn、Hn
與α符合上述關係式2)時,可避免產生光學串擾現象導致影像的解析度下降,藉此使本實施例的生物特徵感測裝置具有良好的辨識性能。When the parameters included in the
圖3A至圖3D為依照圖2A的生物特徵感測裝置用於感測指紋時所拍攝的影像圖,其中圖3A是於解析度為0.4線對的情況下拍攝的影像,圖3B是於解析度為0.6線對的情況下拍攝的影像,圖3C是於解析度為0.8線對的情況下拍攝的影像,且圖3D是使用者使用圖2A的生物特徵感測裝置時所拍攝的指紋影像。圖4A至圖4D為依照圖2B的生物特徵感測裝置用於感測指紋時所拍攝的影像圖,其中圖4A是於解析度為0.4線對的情況下拍攝的影像,圖4B是於解析度為0.6線對的情況下拍攝的影像,圖4C是於解析度為0.8線對的情況下拍攝的影像,且圖4D是使用者使用圖2B的生物特徵感測裝置時所拍攝的指紋影像。3A to 3D are image diagrams taken when the biometric sensing device according to FIG. 2A is used for sensing fingerprints, wherein FIG. 3A is an image taken with a resolution of 0.4 line pair, and FIG. 3B is an image taken in the analysis Fig. 3C is an image taken with a resolution of 0.6 line pair, Fig. 3C is an image taken with a resolution of 0.8 line pair, and Fig. 3D is a fingerprint image taken by a user using the biometric sensing device of Fig. 2A . 4A to 4D are image diagrams taken when the biometric sensing device according to FIG. 2B is used for sensing fingerprints, wherein FIG. 4A is an image taken under the condition that the resolution is 0.4 line pair, and FIG. 4B is an image taken during the analysis Figure 4C is an image taken with a resolution of 0.6 line pair, Figure 4C is an image taken with a resolution of 0.8 line pair, and Figure 4D is a fingerprint image taken by a user using the biometric sensing device of Figure 2B .
請參照圖3A至圖3D,其示出了生物特徵感測裝置100具有良好的影像解析度,此是因生物特徵感測裝置100具有的參數符合上述的關係式1,藉此可避免光學串擾現象的產生。類似地,請參照圖4A至圖4D,其示出了生物特徵感測裝置200亦具有良好的影像解析度,此是因生物特徵感測裝置200具有的參數符合上述的關係式2,藉此可避免光學串擾現象的產生。Please refer to FIG. 3A to FIG. 3D , which show that the
綜上所述,在本發明的生物特徵感測群體中,使位於遠離基板邊緣的區域中的生物特徵感測裝置的第一孔洞具有的孔寬、第一遮光部具有的寬度、第一遮光層與第二遮光層之間的距離以及第二孔洞的中心軸與通過第二孔洞的中心的光線夾設的最大夾度符合關係式1;且使位於靠近基板邊緣的區域中的生物特徵感測裝置的第一孔洞具有的孔寬、第一遮光部具有的寬度、第一遮光層與第二遮光層之間的距離以及第二孔洞的中心軸與通過第二孔洞的中心的光線夾設的最大夾度符合關係式2,藉此可以使本發明提供的生物特徵感測裝置皆具有良好的辨識性能。To sum up, in the biometric sensing group of the present invention, the first hole of the biometric sensing device located in the region away from the edge of the substrate has the hole width, the width of the first light shielding portion, the first light shielding The distance between the layer and the second light-shielding layer and the maximum clamping degree between the central axis of the second hole and the light passing through the center of the second hole conform to
10:生物特徵感測群體 100、200:生物特徵感測裝置 A1-A1’、A2-A2’:剖線 BL1:第一遮光層 BL2:第二遮光層 BL3:第三遮光層 BM1:第一遮光部 BM1_T:第一遮光部的頂表面 BM2:第二遮光部 BM2_T:第二遮光部的頂表面 BM3:第三遮光部 BM3_T:第三遮光部的頂表面 CA:第一區域 Dn :第一遮光層的頂表面與感測元件層的頂表面之間的距離 Dn+1 :第二遮光層的頂表面與感測元件層的頂表面之間的距離 Gn:第一遮光部的寬度 Gn+1:第二遮光部的寬度 Hn :第一遮光層與第二遮光層之間的距離 IL1:第一絕緣層 IL2:第二絕緣層 IL3:第三絕緣層 L:光線 ML:微透鏡 ML_C:微透鏡的中心軸 n:法線方向 OP1:第一孔洞 OP1_C:第一孔洞的中心軸 OP2:第二孔洞 OP2_C:第二孔洞的中心軸 OP3:第三孔洞 PA:第二區域 SB:基板 SE:感測元件層 SE_T:感測元件層的頂表面 Sn:偏移距離 SU:感測元件 Wn:第一孔洞的孔寬 Wn+1:第二孔洞的孔寬 α:最大夾角10: Biometric sensing groups 100, 200: Biometric sensing devices A1-A1', A2-A2': Section line BL1: First light shielding layer BL2: Second light shielding layer BL3: Third light shielding layer BM1: First Light shielding portion BM1_T: top surface BM2 of the first light shielding portion: second light shielding portion BM2_T: top surface of the second light shielding portion BM3: third light shielding portion BM3_T: top surface CA of the third light shielding portion: first area Dn : th The distance Dn+1 between the top surface of a light shielding layer and the top surface of the sensing element layer: the distance between the top surface of the second light shielding layer and the top surface of the sensing element layer Gn: the width of the first light shielding portion Gn+1: Width of the second light shielding portion Hn : Distance between the first light shielding layer and the second light shielding layer IL1: First insulating layer IL2: Second insulating layer IL3: Third insulating layer L: Light rays ML: Micro Lens ML_C: central axis n of microlens: normal direction OP1: first hole OP1_C: central axis of first hole OP2: second hole OP2_C: central axis of second hole OP3: third hole PA: second area SB : Substrate SE: Sensing element layer SE_T: Top surface of sensing element layer Sn: Offset distance SU: Sensing element Wn: Hole width of the first hole Wn+1: Hole width of the second hole α: Maximum included angle
圖1為一實施例的生物特徵感測群體的俯視示意圖。 圖2A為依據圖1的剖線A1-A1’的一實施例的生物特徵感測裝置的剖面示意圖。 圖2B為依據圖1的剖線A2-A2’的另一實施例的生物特徵感測裝置的剖面示意圖。 圖3A至圖3D為依照圖2A的生物特徵感測裝置用於感測指紋時所拍攝的影像圖,其中圖3A是於解析度為0.4線對(linepair/mm)的情況下拍攝的影像,圖3B是於解析度為0.6線對的情況下拍攝的影像,圖3C是於解析度為0.8線對的情況下拍攝的影像,且圖3D是使用者使用圖2A的生物特徵感測裝置時所拍攝的指紋影像。 圖4A至圖4D為依照圖2B的生物特徵感測裝置用於感測指紋時所拍攝的影像圖,其中圖4A是於解析度為0.4線對的情況下拍攝的影像,圖4B是於解析度為0.6線對的情況下拍攝的影像,圖4C是於解析度為0.8線對的情況下拍攝的影像,且圖4D是使用者使用圖2B的生物特徵感測裝置時所拍攝的指紋影像。FIG. 1 is a schematic top view of a biometric sensing population according to an embodiment. FIG. 2A is a schematic cross-sectional view of a biometric sensing device according to an embodiment of the section line A1-A1' of FIG. 1 . FIG. 2B is a schematic cross-sectional view of a biometric sensing device according to another embodiment of the section line A2-A2' of FIG. 1 . 3A to 3D are image diagrams taken when the biometric sensing device according to FIG. 2A is used for sensing fingerprints, wherein FIG. 3A is an image taken under the condition that the resolution is 0.4 line pair/mm, FIG. 3B is an image taken with a resolution of 0.6 line pair, FIG. 3C is an image taken with a resolution of 0.8 line pair, and FIG. 3D is when a user uses the biometric sensing device of FIG. 2A Photographed fingerprint images. 4A to 4D are image diagrams taken when the biometric sensing device according to FIG. 2B is used for sensing fingerprints, wherein FIG. 4A is an image taken under the condition that the resolution is 0.4 line pair, and FIG. 4B is an image taken during the analysis Figure 4C is an image taken with a resolution of 0.6 line pair, Figure 4C is an image taken with a resolution of 0.8 line pair, and Figure 4D is a fingerprint image taken by a user using the biometric sensing device of Figure 2B .
100:生物特徵感測裝置100: Biometric Sensing Device
A1-A1’:剖線A1-A1': section line
BL1:第一遮光層BL1: The first light shielding layer
BL2:第二遮光層BL2: The second light shielding layer
BL3:第三遮光層BL3: The third shading layer
BM1:第一遮光部BM1: The first light shielding part
BM1_T:第一遮光部的頂表面BM1_T: the top surface of the first light shielding part
BM2:第二遮光部BM2: Second shading part
BM2_T:第二遮光部的頂表面BM2_T: Top surface of the second light shield
BM3:第三遮光部BM3: Third shade
BM3_T:第三遮光部的頂表面BM3_T: Top surface of the third light-shielding portion
Dn :第一遮光層的頂表面與感測元件層的頂表面之間的距離D n : the distance between the top surface of the first light shielding layer and the top surface of the sensing element layer
Dn+1 :第二遮光層的頂表面與感測元件層的頂表面之間的距離D n+1 : the distance between the top surface of the second light shielding layer and the top surface of the sensing element layer
Gn:第一遮光部的寬度Gn: Width of the first light shielding portion
Gn+1:第二遮光部的寬度Gn+1: The width of the second light shielding portion
Hn :第一遮光層與第二遮光層之間的距離H n : the distance between the first light shielding layer and the second light shielding layer
IL1:第一絕緣層IL1: first insulating layer
IL2:第二絕緣層IL2: Second insulating layer
IL3:第三絕緣層IL3: The third insulating layer
L:光線L: light
ML:微透鏡ML: Micro lens
ML_C:微透鏡的中心軸ML_C: the central axis of the microlens
n:法線方向n: normal direction
OP1:第一孔洞OP1: The first hole
OP1_C:第一孔洞的中心軸OP1_C: The central axis of the first hole
OP2:第二孔洞OP2: Second hole
OP2_C:第二孔洞的中心軸OP2_C: The central axis of the second hole
OP3:第三孔洞OP3: The third hole
SB:基板SB: Substrate
SE:感測元件層SE: Sensing element layer
SE_T:感測元件層的頂表面SE_T: The top surface of the sensing element layer
SU:感測元件SU: Sensing element
Wn:第一孔洞的孔寬Wn: hole width of the first hole
Wn+1:第二孔洞的孔寬Wn+1: hole width of the second hole
α:最大夾角α: Maximum included angle
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