TW202205693A - Light emitting device package having glue on two sides - Google Patents

Abstract

A light emitting device package having glue on two sides comprises a metal frame, an LED chip, a transparent glue bulk. The metal frame includes a top surface and a bottom surface, and the metal frame includes a first mounting pad and second mounting pad. A light transmission gap is defined between the first mounting pad and the second mounting pad, and the light transmission gap communicates the top surface and the bottom surface and keeps the first mounting pad and the second mounting pad in a non-conducting manner. The LED chip is mounting on the first mounting pad and corresponds to the top surface. A first and a second electrodes of the LED chip are electrically connected to the first mounting pad and the second mounting pad respectively. The transparent glue bulk covers the top surface and the second surface, wraps the LED chip, and fills the light transmission gap. Outer edges of the first mounting pad and the second mounting pad are exposed from the transparent glue bulk.

Description

Light-emitting diode package structure with double-sided colloid

The present invention relates to optoelectronic components, in particular to a light emitting diode packaging structure with double-sided colloid.

A light-emitting diode is a solid-state semiconductor optoelectronic component that converts electrical energy into light energy. A light-emitting diode consists of a semiconductor wafer. The negative electrode of the chip is connected to a metal support, the positive electrode of the chip is connected to the power supply, and the whole chip is encapsulated by epoxy resin. The light-emitting diode wafer includes P-type semiconductors and N-type semiconductors. When current is applied to the wafer through the wire, the wafer glows. LED chips need to be protected from dust, moisture, electrostatic discharge (ESD) and mechanical damage. When current is applied, the heat generated in the P-N needs to be removed to prevent the LED chip from overheating. The prior art continues to propose new materials and new packaging structures to conduct the heat generated by the light emitting diode chips away.

FIG. 1 , FIG. 2 and FIG. 3 show a light emitting diode package structure 1 in the prior art. 1 is a schematic cross-sectional front view, FIG. 2 is a top view, and FIG. 3 is a bottom view. As shown in the figure, the light emitting diode package structure 1 includes a printed circuit board 2 , a light emitting diode chip 3 , a first bonding wire 4 , a second bonding wire 5 and a transparent gel 6 . The top surface of the printed circuit board 2 is provided with a die bonding pad 2c and a bonding wire pad 2d, and the bottom surface of the printed circuit board 2 is provided with two soldering pads 2e. The LED chip 3 is disposed on the die bonding pad 2c, and the first bonding wire 4 and the second bonding wire 5 respectively connect the two electrodes of the LED chip 3 to the die bonding pad 2c and the bonding wire pad 2d. A transparent colloid 6 , such as epoxy resin or silicon glue, covers the light emitting diode chip 3 , the first bonding wire 4 and the second bonding wire 5 by molding, so as to protect the light emitting diode chip 3 .

As shown in FIG. 4 , FIG. 5 and FIG. 6 , the light emitting diode package structure 1 is actually soldered to two metal wires 200 . The metal wire 200 may be a general bare wire, or may be an exposed part of an enameled wire or a plastic-covered wire. The metal wires 200 are respectively welded to the two bonding pads 2e, and through the connection of the first bonding wire 4, the second bonding wire 5, the die bonding pad 2c and the bonding wire pad 2d, power is supplied to the light-emitting diode chip 3, so that the light-emitting diode The bulk wafer 3 emits light. The metal wire 200 is usually copper wire, but other metals with high electrical conductivity are not excluded. However, due to the shading of the printed circuit board 2, the light emitting angle of the light emitting diode package structure 1 is only 180°, and the light emitting angle cannot be further improved.

In addition, in the process of soldering the LED package structure 1 to the metal wires 200 , solder paste is applied on the two metal wires 200 in advance, and then the two bonding pads 2e are placed on the two metal wires 200 . Then, the light emitting diode package structure 1 and the metal wires 200 are reflowed through a reflow oven. In the process of reflow soldering, since tin has good fluidity at high temperature, the light-emitting diode package structure 1 will shift with the flow of tin, resulting in a certain percentage of open circuit, short circuit or tilt in production. The production yield is low, requiring heavy work, resulting in waste of artificial materials, increasing product costs and reducing competitiveness.

Based on the above technical problems, the present invention proposes a light-emitting diode packaging structure with double-sided colloids to solve the defects in the prior art.

The present invention provides a light-emitting diode packaging structure with double-sided colloid, comprising a metal bracket, a light-emitting diode chip and a transparent colloid. The metal bracket has a top surface and a bottom surface, the metal bracket includes a first patch pad and a second patch pad, and a transparent gap is maintained between the first patch pad and the second patch pad, The light-transmitting gap communicates with the top surface and the bottom surface, and prevents the first patch pad and the second patch pad from contacting each other. The light-emitting diode chip is arranged on the first patch pad and corresponds to the top surface; wherein, a first electrode and a second electrode of the light-emitting diode chip are electrically connected to the first patch pad and the second electrode respectively. Two SMD pads. The transparent colloid covers the top surface and the bottom surface, wraps the light-emitting diode chip and fills the light-transmitting gap, and the outer edges of the first patch pad and the second patch pad are respectively exposed to the transparent colloid.

In at least one embodiment, the LED package structure with double-sided glue further includes a first bonding wire and a second bonding wire, the first bonding wire is connected to the first electrode and the first chip pad, and The second bonding wire is connected to the second electrode and the second chip pad.

In at least one embodiment, the transparent colloid has an upper molding colloid and a lower molding colloid, which are respectively combined with the top surface and the bottom surface.

In at least one embodiment, the upper molding colloid and the lower molding colloid are connected to each other through the light-transmitting gap, and the upper molding colloid covers the light-emitting diode chip, the first bonding wire and the second bonding wire.

In at least one embodiment, the light-emitting diode package structure with double-sided glue further includes two metal wires, the first patch pad and the second patch pad corresponding to the bottom surface and exposed to the transparent glue are welded respectively. to two metal wires.

In at least one embodiment, the lower molding compound is located between the two metal wires.

In the present invention, the position of the two metal wires is limited by the transparent colloid. That is, even if the solder paste melts during reflow soldering and the two metal lines are displaced, the two metal lines only become clamped to the transparent colloid at most, but still maintain the contact between the first and second patch pads. Contact, maintain a good welding effect, improve the yield of products in the production process, improve labor efficiency, save labor costs, and increase competitiveness.

Referring to FIG. 7 , FIG. 8 , and FIG. 9 , a light-emitting diode package structure 100 with double-sided colloid provided by an embodiment of the present invention includes a metal support 110 , a light-emitting diode chip 120 , a first The bonding wire 131 , a second bonding wire 132 and a transparent gel 140 .

As shown in FIG. 7 , FIG. 8 and FIG. 9 , the metal bracket 110 is made of metal and has good electrical conductivity and thermal conductivity. The metal bracket 110 has a top surface 113 and a bottom surface 114 . The metal bracket 110 has a light-transmitting gap G, and the light-transmitting gap G communicates with the top surface 113 and the bottom surface 114 . Specifically, the metal bracket 110 includes a first SMD pad 111 and a second SMD pad 112 , a light-transmitting gap G is maintained between the first SMD pad 111 and the second SMD pad 112 , and the light-transmitting gap is G communicates with the top surface 113 and the bottom surface 114 , and prevents the first pad 111 and the second pad 112 from contacting each other.

As shown in FIG. 7 , FIG. 8 and FIG. 9 , there is a die bonding position on the first chip pad 111 , which corresponds to the top surface 113 . The light-emitting diode chip 120 is disposed at the die-bonding position, that is, the light-emitting diode chip 120 is disposed on the first chip pad 111 and corresponds to the top surface 113 of the metal bracket 110 . The light emitting diode wafer 120 has a first electrode 121 and a second electrode 122 . As shown in FIG. 7 , FIG. 8 and FIG. 9 , the first bonding wire 131 is connected to the first electrode 121 and the first chip pad 111 , and the second bonding wire 132 is connected to the second electrode 122 and the second chip pad 112 , so that the light-emitting diode chip 120 is electrically connected to the first pad 111 and the second pad 112 through the first bonding wire 131 and the second bonding wire 132 .

As shown in FIG. 7 , FIG. 8 and FIG. 9 , the transparent colloid 140 covers the top surface 113 and the bottom surface 114 , and covers the light emitting diode chip 120 , the first bonding wire 131 , the second bonding wire 132 , and fills the light transmission Gap G. Meanwhile, the outer edges of the first patch pad 111 and the second patch pad 112 are respectively exposed to the transparent glue 140 , that is, opposite sides of the metal bracket 110 are exposed to the transparent glue 140 .

As shown in FIG. 7 , the transparent colloid 140 can be divided into an upper molding colloid 141 and a lower molding colloid 142 , which are respectively combined with the top surface 113 and the bottom surface 114 , and are filled in the light-transmitting gap G and connected to each other through the light-transmitting gap G. In a specific embodiment, the bottom surface 114 can be bonded to the bottom surface 114 through the lower molding compound 142 to bond the first SMD pad 111 and the second SMD pad 112 to form the metal bracket 110 , and then the light-emitting diode chip can be formed. 120 is attached and the bonding wires 131 and 132 are bonded, and the upper molding compound 141 is disposed on the top surface 113 to cover the LED chip 120 , the first bonding wires 131 and the second bonding wires 132 .

Referring to FIG. 10 , FIG. 11 and FIG. 12 , the light emitting diode package structure 100 with double-sided glue is used for soldering on the two metal wires 200 . The metal wire 200 may be a general bare wire, or may be an exposed part of an enameled wire or a plastic-covered wire. The parts of the first patch pad 111 and the second patch pad 112 corresponding to the bottom surface 114 and exposed to the transparent gel 140 are respectively welded to the two metal wires 200 through the first bonding wire 131, the second bonding wire 132, the second bonding wire 132, the The connection of a patch pad 111 and a second patch pad 112 provides power to the light-emitting diode chip 120, so that the light-emitting diode chip 120 emits light. The metal wire 200 is usually copper wire, but other metals with high electrical conductivity are not excluded. A plurality of LED packaging structures 100 with double-sided colloids are sequentially welded to the two metal wires 200 to form a light string capable of emitting light in multiple directions.

As shown in FIG. 7 to FIG. 12 , when a voltage difference is applied to the first electrode 121 and the second electrode 122 by supplying power through the two metal wires 200 , the light-emitting diode chip 120 emits light. At this time, the transparent colloid 140 can be used as a light guide, so that the light radiates toward the top surface 113 . At the same time, the transparent colloid 140 also guides the light to pass through the light-transmitting gap G, pass through the lower molding colloid 142, and diverge downward. Therefore, the LED package structure 100 with double-sided colloids according to the embodiment of the present invention can achieve 360° light emission, and at the same time, the metal bracket 110 made of metal facilitates heat conduction to assist the LED chip 120 to dissipate heat. In addition, the surface of the metal bracket 110 can also be provided with a reflective layer through electroplating or the like to enhance the upward or downward strength, so as to prevent the surface of the metal bracket 110 from absorbing light and reducing the brightness. The transparent colloid 140 can also be doped with reflective, fluorescent or pigment particles that can change the luminous state.

As shown in FIG. 10 , as viewed from the front cross-sectional schematic diagram of the light-emitting diode package structure 100 with double-sided glue, the outer edges of the first chip pad 111 and the second chip pad 112 respectively protrude from the lower mold The glue 142, and the junction of the lower molding glue 142 and the patch pads 111, 112 forms an L-shaped cross-sectional structure, and the two metal wires 200 are located in this L-shaped cross-sectional structure, and are respectively welded to the first SMD pad 111 and the second On the patch pad 112 , the lower molding compound 142 is located between the two metal lines 200 , and the lower molding compound 142 can be used to limit the position of the two metal lines 200 . That is, even if the solder paste is melted during reflow soldering and the two metal lines 200 are displaced, the two metal lines 200 only become clamped to the lower molding compound 142 at most, but still maintain the contact with the first chip pad 111 and the second metal line 200 . The contact between the two patch pads 112 maintains a good welding effect, improves the yield rate of products in the production process, improves labor efficiency, saves labor costs, and increases competitiveness.

1: LED package structure 2: Printed circuit board 3: LED chip 4: The first wire 5: The second wire 6: Transparent colloid 2c: die pad 2d: Wire Pad 2e: Solder pad 100: Light-emitting diode packaging structure with double-sided colloid 110: Metal bracket 111: The first patch pad 112: The second patch pad 113: Top surface 114: Underside 120: LED chip 121: The first electrode 122: Second electrode 131: The first wire 132: Second wire 140: Transparent colloid 141: upper molding colloid 142: Lower molding colloid G: light transmission gap 200: metal wire

FIG. 1 is a schematic cross-sectional front view of a light emitting diode package structure in the prior art. FIG. 2 is a top view of a light emitting diode package structure in the prior art. FIG. 3 is a bottom view of a light emitting diode package structure in the prior art. FIG. 4 is a schematic front cross-sectional view of a light emitting diode package structure welded to a metal wire in the prior art. FIG. 5 is a top view of the light emitting diode package structure welded to the metal wire in the prior art. FIG. 6 is a bottom view of the light emitting diode package structure welded to the metal wire in the prior art. FIG. 7 is a schematic cross-sectional front view of a light emitting diode packaging structure in an embodiment of the present invention. FIG. 8 is a top view of a light emitting diode package structure according to an embodiment of the present invention. FIG. 9 is a bottom view of a light emitting diode package structure according to an embodiment of the present invention. 10 is a schematic cross-sectional front view of the light emitting diode package structure welded to the metal wire according to the embodiment of the present invention. FIG. 11 is a top view of the light emitting diode package structure welded to the metal wire according to the embodiment of the present invention. FIG. 12 is a bottom view of the light emitting diode package structure welded to the metal wire according to the embodiment of the present invention.

100: Light-emitting diode packaging structure with double-sided colloid

110: Metal bracket

111: The first patch pad

112: The second patch pad

113: Top surface

114: Underside

120: LED chip

121: The first electrode

122: Second electrode

131: The first wire

132: Second wire

140: Transparent colloid

141: upper molding colloid

142: Lower molding colloid

G: light transmission gap

200: metal wire

Claims (6)

A light-emitting diode packaging structure with double-sided colloid, comprising: A metal bracket has a top surface and a bottom surface, the metal bracket includes a first patch pad and a second patch pad, the first patch pad and the second patch pad are held between a light-transmitting gap, the light-transmitting gap is connected to the top surface and the bottom surface, and the first patch pad and the second patch pad are not in contact with each other; A light-emitting diode chip, disposed on the first patch pad and corresponding to the top surface; wherein a first electrode and a second electrode of the light-emitting diode chip are respectively electrically connected to the first a patch pad and the second patch pad; and A transparent colloid covers the top surface and the bottom surface, covers the light-emitting diode chip and fills the light-transmitting gap, and the outer edges of the first patch pad and the second patch pad are exposed respectively in the transparent colloid. The light-emitting diode package structure with double-sided glue as claimed in claim 1, further comprising a first bonding wire and a second bonding wire, the first bonding wire is connected to the first electrode and the first patch pad, and the second bonding wire is connected to the second electrode and the second patch pad. The light emitting diode package structure with double-sided colloid according to claim 2, wherein the transparent colloid has an upper molding colloid and a lower molding colloid, which are respectively combined with the top surface and the bottom surface. The light emitting diode package structure with double-sided colloid as claimed in claim 3, wherein the upper molding colloid and the lower molding colloid are connected to each other through the light-transmitting gap, and the upper molding colloid covers the light-emitting diode A diode chip, the first bonding wire and the second bonding wire. The light-emitting diode package structure with double-sided glue as claimed in claim 4, further comprising two metal wires, the first patch pad and the second patch pad corresponding to the bottom surface and exposed to the transparent glue part, respectively soldered to the two metal wires. The light emitting diode package structure with double-sided colloid according to claim 5, wherein the lower molding colloid is located between the two metal wires.

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