TWI731763B - Lateral light emitting device package - Google Patents

Abstract

A lateral light emitting device package includes an electrical-insulated substrate, a first mounting pad, a second mounting pad, a LED chip and, a molded glue bulk and two metal wires. The electrical-insulated substrate includes a top surface, a bottom surface, a first lateral surface, and a second lateral surface. The first lateral surface and the second lateral surface are arranged opposite to each other, and the first lateral surface and the second lateral surface connect the top surface bottom surface. The first mounting pad covers the first lateral surface, and the second mounting pad covers the second lateral surface; the first mounting pad and the second mounting pad cover the top surface and a first gap is defined between the first mounting pad and the second mounting pad, and the first mounting pad and the second mounting pad cover the bottom surface and a second gap is defined between the first mounting pad and the second mounting pad. The LED chip is mounted on the first mounting pad and corresponding to the top surface. First and second electrodes of the LED chip are electrically connected to the first and the second mounting pads respectively. The molded glue bulk is disposed corresponding to the top surface, and partially covers the first and the second mounting pads, wraps the LED chip, and fills the first gap. Portions, of the first and the secoond mounting pads, corresponding to the top and bottom surfaces are respectively welded to the two metal wires; provided that a height direction extending from the top surface to the bottom surface, the two metal wires are in parallel with the height direction.

Description

Side-emitting light-emitting diode packaging structure

The present invention relates to optoelectronic components, in particular to a light emitting diode package structure capable of side-emitting light.

A light emitting diode is a solid-state semiconductor optoelectronic element used to convert electrical energy into light energy. The light-emitting diode contains a semiconductor chip. The negative pole of the chip is connected to a metal support, the positive pole of the chip is connected to a power source, and the entire chip is encapsulated by epoxy resin. The light-emitting diode chip includes a P-type semiconductor and an N-type semiconductor. When the current is applied to the chip through the bonding wire, the chip will emit light. The LED chip needs to be protected from dust, humidity, electrostatic discharge (ESD) and mechanical damage. When a current is applied, the heat generated in the P-N needs to be removed to prevent the light-emitting diode chip from overheating. The prior art continues to propose new materials and new packaging structures to conduct heat generated by the light-emitting diode chip.

Fig. 1, Fig. 2 and Fig. 3 show the light emitting diode package structure 1 in the prior art. Among them, Fig. 1 is a front view, Fig. 2 is a top view, and Fig. 3 is a bottom view. As shown in the figure, the light-emitting diode package structure 1 includes a printed circuit board 2, a light-emitting diode chip 3, a first bonding wire 4, a second bonding wire 5 and a molding compound 6. The top surface of the printed circuit board 2 is provided with a die bonding pad 2c and a wire bonding pad 2d, and the bottom surface of the printed circuit board 2 is provided with two bonding pads 2e. The light emitting diode chip 3 is disposed on the die bonding pad 2c, and the first bonding wire 4 and the second bonding wire 5 respectively connect the two electrodes of the light emitting diode chip 3 to the die bonding pad 2c. And wire bonding pad 2d. The molding compound 6, such as epoxy resin or silicon glue, covers the light-emitting diode chip 3, the first bonding wire 4 and the second bonding wire 5 by a molding method to protect the light-emitting diode chip 3.

As shown in FIG. 4, FIG. 5, and FIG. 6, the light emitting diode package structure 1 is actually welded to two metal wires 200. The metal wire 200 may be a general bare wire, or may be an exposed part of an enameled wire or a rubber-covered wire. The metal wires 200 are respectively soldered to the two bonding pads 2e, and through the connection of the first bonding wire 4, the second bonding wire 5, the die bonding pad 2c, and the bonding wire pad 2d, power is supplied to the light emitting diode chip 3, so that the light emitting diode The bulk wafer 3 emits light.

As shown in Figures 5 and 6, when viewed from the top view or bottom view, when the LED chip 3 actually emits light, only one side (the side seen from the top view) can see the LED chip 3 sufficiently. Glow. On the other side (the side seen from the bottom view), the light-emitting diode chip 3 and the molded gel 6 are both shielded by the printed circuit board 2, so that the light-emitting diode package structure 1 can only be close to 180 degrees Glow.

Based on the above technical problems, the present invention proposes a side-emitting light emitting diode package structure to solve the defects in the prior art.

The present invention provides a side-emitting light-emitting diode package structure, which includes an insulating substrate, a first patch pad, a second patch pad, a light-emitting diode chip, a molded colloid, and two metals line. The insulating substrate has a top surface, a bottom surface, a first side surface, and a second side surface. The first side surface and the second side surface are disposed opposite to each other, and the first side surface and the second side surface are connected to the top surface and the bottom surface. The first patch pad is wrapped on the first side surface; the second patch pad is wrapped on the second side surface. The first patch pad and the second patch pad jointly cover the top surface and maintain a first gap, and the first patch pad and the second patch pad jointly cover the bottom surface and maintain a second gap. LED The bulk chip is disposed on the first patch pad and corresponds to the top surface; wherein, a first electrode and a second electrode of the light-emitting diode chip are electrically connected to the first patch pad and the second patch, respectively Pad. The molding compound is arranged corresponding to the top surface, partially covers the first patch pad and the second patch pad, and covers the light-emitting diode chip and fills the first gap. The parts of the first patch pad and the second patch pad corresponding to the top surface and the bottom surface are respectively soldered to two metal wires; a height direction passing through the top surface and the bottom surface is defined, and the two metal wires are arranged parallel to the height direction.

In at least one embodiment, wherein the molded gel has a gel thickness in the height direction, and the insulating substrate has a substrate thickness in the height direction, and the gel thickness is at least twice the thickness of the substrate.

In at least one embodiment, a length direction passing through the first side surface and the second side surface and perpendicular to the height direction is defined, and a width direction perpendicular to the height direction and the length direction is defined, and a substrate length of the insulating substrate in the length direction is defined, A substrate width greater than the width of the insulating substrate in the width direction.

In at least one embodiment, the length of the substrate is at least three times the width of the substrate.

In at least one embodiment, in the width direction, a gel width of the molded gel is equal to the width of the substrate.

In at least one embodiment, in the width direction, the pad widths of the first patch pad and the second patch pad are equal to the width of the substrate.

In at least one embodiment, the side-emitting light-emitting diode package structure further includes a first bonding wire and a second bonding wire. The first bonding wire is connected to the first electrode and the first patch pad, and the first bonding wire is connected to the first electrode and the first patch pad. The two bonding wires are connected to the second electrode and the second patch pad.

In at least one embodiment, the molded gel is located between the two metal wires.

According to the present invention, the thickness of the molded plastic body is configured so that the molded plastic body obviously protrudes from the insulating substrate. When viewed from a top view or a bottom view, the molded body in the present invention is compared with the molded body in the prior art light-emitting diode package. It is large and prominent, and provides a larger light-emitting area, and has a relatively good light-emitting effect. At the same time, the present invention reduces the width of the insulating substrate in the width direction, effectively reducing the light emitted by the molded colloid from being blocked by the insulating substrate, and achieving 360-degree light emission.

1: LED package structure

2: Printed circuit board

2c: Bonding pad

2d: wire bonding pad

2e: soldering pad

3: LED chip

4: The first wire

5: The second welding wire

6: Molded colloid

100: Side-emitting light-emitting diode package structure

110: The first patch pad

120: The second patch pad

130: Insulating substrate

131: First side

132: second side

133: top surface

134: Bottom

140: LED chip

141: first electrode

142: second electrode

151: The first wire

152: The second wire

160: Molded colloid

200: Metal wire

G1: first gap

G2: second gap

Gth: Gel thickness

Sth: substrate thickness

SL: substrate length

SW: substrate width

GW: colloid width

X: length direction

Y: width direction

Z: height direction

FIG. 1 is a front view of a light emitting diode package structure in the prior art.

FIG. 2 is a top view of a light emitting diode package structure in the prior art.

Fig. 3 is a bottom view of a light emitting diode package structure in the prior art.

4 is a front view of the LED package structure welded to the metal wire in the prior art.

FIG. 5 is a top view of the LED package structure welded to the metal wire in the prior art.

FIG. 6 is a bottom view of the LED package structure welded to the metal wire in the prior art.

FIG. 7 is a schematic front cross-sectional view of a light emitting diode package structure in an embodiment of the present invention.

Fig. 8 is a top view of a light emitting diode package structure in an embodiment of the present invention.

Fig. 9 is a bottom view of a light emitting diode package structure in an embodiment of the present invention.

FIG. 10 is a bottom view of the light emitting diode package structure welded to the metal wire in the embodiment of the present invention.

FIG. 11 is a front cross-sectional schematic diagram of a light emitting diode package structure welded to a metal wire in an embodiment of the present invention.

12 is a schematic rear view cross-sectional view of the light emitting diode package structure welded to the metal wire in the embodiment of the present invention.

FIG. 13 is a front cross-sectional schematic diagram of the light emitting diode package structure welded to the metal wire in the embodiment of the present invention.

Referring to FIG. 7, FIG. 8, and FIG. 9, a side-emitting light-emitting diode package structure 100 according to an embodiment of the present invention includes an insulating substrate 130, a first patch pad 110, and a second The patch pad 120, a light-emitting diode chip 140, a first bonding wire 151, a second bonding wire 152 and a molding compound 160.

As shown in FIGS. 7, 8 and 9, the insulating substrate 130 is used to provide electrical insulation. In a specific embodiment, the combination of the insulating substrate 130, the first patch pad 110, and the second patch pad 120 is a printed circuit board. That is to say, through the manufacturing process of the printed circuit board, the insulating substrate 130, the first patch pad 110 and the second patch pad 120 required by the present invention can be directly manufactured. The insulating substrate 130 does not exclude a metal substrate with an insulating treatment on the surface, or an insulating ceramic substrate. The aforementioned metal substrate or ceramic substrate can provide good heat conduction and heat dissipation effects.

As shown in FIG. 7, the insulating substrate 130 has a top surface 133, a bottom surface 134, a first side surface 131 and a second side surface 132. The first side surface 131 and the second side surface 132 are disposed oppositely, and the first side surface 131 and the second side surface 132 are connected to the top surface 133 and the bottom surface 134.

As shown in FIG. 7, FIG. 8, and FIG. 9, the first patch pad 110 and the second patch pad 120 are respectively covered on the first side surface 131 and the second side surface 132. At the same time, the first patch pad 110 and the second patch pad 120 extend to the top surface 133 and the bottom surface 134, respectively. The first patch pad 110 and the second patch pad 120 jointly cover the top surface 133 and maintain a first gap G1, and the first patch pad 110 and the second patch pad 120 jointly cover the bottom surface 134 And maintain a second gap G2.

As shown in FIG. 7, FIG. 8 and FIG. 9, there is a die bonding position on the first patch pad 110 and corresponds to the top surface 133. The light-emitting diode chip 140 is disposed at the die bonding position, that is, the light-emitting diode chip 140 is disposed on the first patch pad 110 and corresponds to the top surface 133. The light emitting diode chip 140 has a first electrode 141 and a second electrode 142, which are electrically connected to the first patch pad 110 and the second patch pad 120, respectively, so as to pass through the first bonding wire 151 and the second The bonding wire 152 electrically connects the light emitting diode chip 140 to the first patch pad 110 and the second patch pad 120.

As shown in FIGS. 7 and 8, in the embodiment of the present invention, the side-emitting light-emitting diode package structure 100 further includes a first bonding wire 151 and a second bonding wire 152, and the first bonding wire 151 is connected to The first electrode 141 and the first patch pad 110, and the second bonding wire 152 is connected to the second electrode 142 and the second patch pad 120.

As shown in FIGS. 7 and 8, the molding compound 160 is provided corresponding to the top surface 133, and partially covers the first patch pad 110 and the second patch pad 120, so that the first patch pad 110 and the second patch pad The two patch pads 120 corresponding to the parts of the first side surface 131 and the second side surface 132 are exposed. The molding compound 160 covers the light emitting diode chip 140, the first bonding wire 151, and the second bonding wire 152, and fills the first gap G1.

As shown in FIGS. 7, 8 and 9, a height direction Z passing through the top surface 133 and the bottom surface 134 is defined, the molded gel 160 has a gel thickness Gth in the height direction Z, and the insulating substrate 130 has a height direction Z The substrate thickness Sth, the gel thickness Gth is greater than the substrate thickness Sth. The gel thickness Gth is at least twice the substrate thickness Sth. A length direction X that passes through the first side surface 131 and a second side surface 132 and is perpendicular to the height direction Z is defined, and a width direction Y perpendicular to the height direction Z and the length direction X is defined. The insulating substrate 130 is a substrate in the length direction X The length SL is greater than a substrate width SW of the insulating substrate 130 in the width direction Y. The substrate length SL is at least three times the substrate width SW. In addition, in the width direction Y, a gel width GW of the molded gel 160 is equal to the substrate width SW. In the width direction Y, the pad widths of the first patch pad 110 and the second patch pad 120 are equal to the substrate width SW, that is, in the width direction Y, the first patch pad 110 and the second patch pad The pad 120 completely covers the top surface 133, and collectively covers the top surface 133 in the length direction X and maintains the first gap G1.

Referring to FIG. 10, FIG. 11 and FIG. 12, the side-emitting light-emitting diode package structure 100 further includes two metal wires 200. The metal wire 200 may be a general bare wire, or may be an exposed part of an enameled wire or a rubber-covered wire. The two metal wires 200 are arranged parallel to the height direction Z. The parts of the first patch pad 110 and the second patch pad 120 corresponding to the top surface 133 and the bottom surface 134 are respectively soldered to the two metal wires 200. The side-emitting light-emitting diode package structure 100 is laterally welded to two metal wires 200, and the metal wires 200 can contact the first patch pad 110 and the second patch pad on the edges of the top surface 133 and the bottom surface 134 120, and fully electrically connected to the first patch pad 110 and the second patch pad 120 through solder. The molding gel 160 is located between the two metal wires 200.

Through the connection of the first bonding wire 151, the second bonding wire 152, the first patch pad 110, and the second patch pad 120, the metal wire 200 provides power to the light-emitting diode chip 140, so that the light-emitting diode chip 140 shines. The metal wire 200 is usually a copper wire, but other metals with high conductivity are not excluded. Through a plurality of side-emitting light-emitting diode package structures 100 that are sequentially welded to the two metal wires 200, a light string capable of emitting light in multiple directions can be formed.

As shown in FIGS. 11 and 12, when power is supplied through the two metal wires 200 and a voltage difference is applied to the first electrode 141 and the second electrode 142, the light emitting diode chip 140 emits light. At this time, no matter from the top view or the bottom view, the side-emitting light-emitting diode package structure is observed 100. The light emitting diode chip 140 emits light toward the side (light emitting toward the height direction Z). At the same time, the molded colloid 160 also protrudes laterally (protruding toward the height direction Z), which can make the molded colloid 160 have a light guide effect without being shielded in the length direction X or the width direction Y, but in the length direction X and the width direction. The direction Y has a good light-emitting effect. The molded gel 160 protruding toward the height direction Z can also reduce the degree of light shielding by the insulating substrate 130, so that the side-emitting light-emitting diode package structure 100 emits approximately 360 degrees. The molded colloid 160 can also be doped with particles that can change the light-emitting state, such as reflective, fluorescent, or pigment.

Referring to FIG. 13, in a specific configuration, a plurality of side-emitting light-emitting diode package structures 100 can be welded on the two metal wires 200, and the molded colloids 160 can protrude in opposite directions from each other to achieve a complete 360-degree luminescence.

According to the present invention, through the thickness configuration of the molded plastic 160, the molded plastic 160 clearly protrudes from the insulating substrate 130. When viewed from a top view or a bottom view, the molded plastic 160 of the present invention is compared with the prior art light-emitting diode package. The molded colloid 160 is large and prominent, and provides a larger light-emitting area, and has a relatively good light-emitting effect. At the same time, the present invention reduces the width of the insulating substrate 130 in the width direction Y, effectively reducing the light emitted by the molded colloid 160 from being blocked by the insulating substrate 130, and achieving approximately 360-degree light emission.

100: Side-emitting light-emitting diode package structure

110: The first patch pad

120: The second patch pad

130: Insulating substrate

140: LED chip

151: The first wire

152: The second wire

160: Molded colloid

200: Metal wire

X: length direction

Y: width direction

Z: height direction

Claims (8)

A light emitting diode package structure capable of side-emitting light, comprising: an insulating substrate having a top surface, a bottom surface, a first side surface and a second side surface, the first side surface and the second side surface are arranged oppositely, and the The first side surface and the second side surface are connected to the top surface and the bottom surface; a first patch pad covering the first side surface; a second patch pad covering the second side surface; the first A patch pad and the second patch pad jointly wrap the top surface and maintain a first gap, and the first patch pad and the second patch pad jointly wrap the bottom surface and maintain a first gap. Two gaps; a light-emitting diode chip disposed on the first patch pad and corresponding to the top surface; wherein, a first electrode and a second electrode of the light-emitting diode chip are electrically connected to The first patch pad and the second patch pad; a molded plastic body corresponding to the top surface, partially covering the first patch pad and the second patch pad, and package Cover the light-emitting diode chip and fill the first gap; and two metal wires, the first patch pad and the second patch pad corresponding to the top surface and the bottom surface, respectively soldered to the two Metal wire; defines a height direction passing through the top surface and the bottom surface, and the two metal wires are arranged parallel to the height direction. The side-emitting light-emitting diode package structure according to claim 1, wherein it is defined that the molded gel has a gel thickness in the height direction, and the insulating substrate has a substrate thickness in the height direction, and the gel thickness At least twice the thickness of the substrate. The side-emitting light-emitting diode package structure according to claim 2, wherein a length passing through the first side surface and the second side surface and perpendicular to the height direction is defined Direction, and defines a width direction perpendicular to the height direction and the length direction. A substrate length of the insulating substrate in the length direction is greater than a substrate width of the insulating substrate in the width direction. The light emitting diode package structure capable of side-emitting light according to claim 3, wherein the length of the substrate is at least three times the width of the substrate. The light emitting diode package structure capable of side-emitting light according to claim 3, wherein, in the width direction, a gel width of the molded gel is equal to the width of the substrate. The side-emitting light-emitting diode package structure according to claim 3, wherein, in the width direction, the pad width of the first patch pad and the second patch pad is equal to the width of the substrate. The side-emitting light-emitting diode package structure according to claim 3, further comprising a first bonding wire and a second bonding wire, the first bonding wire is connected to the first electrode and the first patch bonding And the second bonding wire is connected to the second electrode and the second patch pad. The side-emitting light-emitting diode package structure according to claim 1, wherein the molded gel is located between the two metal wires.

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