TWM607068U - Sideway-emission light-emitting diode package structure - Google Patents

Abstract

A light-emitting diode package structure capable of side-emitting light includes an insulating substrate, a first patch pad, a second patch pad, a light-emitting diode chip, and a molded colloid. The insulating substrate has a top surface, a bottom surface, a first side surface, and a second side surface. The first side surface and the second side surface are disposed opposite to each other, and the surfaces are connected to the top surface and the bottom surface. The first patch pad is wrapped on the first side surface, and the second patch pad is wrapped on the second side surface; the first patch pad and the second patch pad together cover the top surface and maintain the first gap, The first patch pad and the second patch pad jointly cover the bottom surface and maintain a second gap. The light emitting diode chip is arranged on the first patch pad and corresponds to the top surface. The first electrode and the second electrode of the light emitting diode chip are respectively electrically connected to the first patch pad and the second patch pad. The molding compound is arranged corresponding to the top surface, partially covers the first patch pad and the second patch pad, and covers the light emitting diode chip and fills the first gap. Define the height direction passing through the top surface and the bottom surface, the molded gel has a gel thickness in the height direction, and the insulating substrate has a substrate thickness in the height direction, and the gel thickness is greater than the substrate thickness.

Description

Side-emitting light-emitting diode packaging structure

The present invention relates to optoelectronic components, in particular to a light emitting diode package structure capable of side-emitting light.

A light emitting diode is a solid-state semiconductor optoelectronic element used to convert electrical energy into light energy. The light-emitting diode contains a semiconductor chip. The negative pole of the chip is connected to a metal bracket, the positive pole of the chip is connected to a power source, and the entire chip is encapsulated by epoxy resin. The light emitting diode chip includes P-type semiconductor and N-type semiconductor. When current is applied to the chip through the bonding wire, the chip will emit light. The LED chip needs to be protected from dust, humidity, electrostatic discharge (ESD) and mechanical damage. When current is applied, the heat generated in the P-N needs to be removed to prevent the light-emitting diode chip from overheating. The prior art continues to propose new materials and new packaging structures to conduct heat generated by the light-emitting diode chip.

Fig. 1, Fig. 2 and Fig. 3 show the light emitting diode package structure 1 in the prior art. Among them, Fig. 1 is a front view, Fig. 2 is a top view, and Fig. 3 is a bottom view. As shown in the figure, the light-emitting diode package structure 1 includes a printed circuit board 2, a light-emitting diode chip 3, a first bonding wire 4, a second bonding wire 5 and a molded glue 6. The top surface of the printed circuit board 2 is provided with a die bonding pad 2c and a wire bonding pad 2d, and the bottom surface of the printed circuit board 2 is provided with two bonding pads 2e. The LED chip 3 is disposed on the die bonding pad 2c, and the first bonding wire 4 and the second bonding wire 5 connect the two electrodes of the LED chip 3 to the bonding pad 2c and the bonding wire pad 2d, respectively. The molding compound 6, such as epoxy resin or silicon glue, covers the light-emitting diode chip 3, the first bonding wire 4 and the second bonding wire 5 by a molding method to protect the light-emitting diode chip 3.

As shown in FIG. 4, FIG. 5, and FIG. 6, the light emitting diode package structure 1 is actually welded to two metal wires 200. The metal wire 200 may be a general bare wire, or an exposed part of an enameled wire or a rubber covered wire. The metal wires 200 are respectively soldered to the two bonding pads 2e. Through the connection of the first bonding wire 4, the second bonding wire 5, the die bonding pad 2c, and the bonding wire pad 2d, power is supplied to the light emitting diode chip 3, so that the light emitting diode The bulk wafer 3 emits light.

As shown in Figures 5 and 6, when viewed from a top view or a bottom view, when the LED chip 3 actually emits light, only one side (the side seen in the top view) can see the LED chip 3 sufficiently Glow. On the other side (the side seen from the bottom view), the light-emitting diode chip 3 and the molded glue 6 are both blocked by the printed circuit board 2, so that the light-emitting diode package structure 1 can only be close to 180 degrees Glow.

Based on the above technical problems, the present invention proposes a side-emitting light emitting diode package structure to solve the defects in the prior art.

The present invention proposes a side-emitting light-emitting diode package structure, which includes an insulating substrate, a first patch pad, a second patch pad, a light-emitting diode chip, and a molded colloid. The insulating substrate has a top surface, a bottom surface, a first side surface, and a second side surface. The first side surface and the second side surface are disposed oppositely, and the first side surface and the second side surface are connected to the top surface and the bottom surface. The first patch pad is wrapped on the first side surface; the second patch pad is wrapped on the second side surface; the first patch pad and the second patch pad together cover the top surface and maintain the first gap, The first patch pad and the second patch pad jointly cover the bottom surface and maintain a second gap. The light emitting diode chip is arranged on the first patch pad and corresponds to the top surface; wherein the light emitting diode chip is electrically connected to the first patch pad and the second patch pad. The molding compound is set corresponding to the top surface, partially covers the first patch pad and the second patch pad, and covers the light-emitting diode chip and fills the first gap; defines a height passing through the top surface and the bottom surface In the direction, the molded gel has a gel thickness in the height direction, and the insulating substrate has a substrate thickness in the height direction, and the gel thickness is greater than the thickness of the substrate.

In at least one embodiment, the thickness of the colloid is at least twice the thickness of the substrate.

In at least one embodiment, the length direction passing through the first side surface and the second side surface and perpendicular to the height direction is defined, and the width direction perpendicular to the height direction and the length direction is defined. The length of the insulating substrate in the length direction is greater than that of the insulating substrate The width of the substrate in the width direction.

In at least one embodiment, the length of the substrate is at least three times the width of the substrate.

In at least one embodiment, in the width direction, a glue width of the molded glue is equal to the width of the substrate.

In at least one embodiment, in the width direction, the pad widths of the first patch pad and the second patch pad are equal to the width of the substrate.

In at least one embodiment, the side-emitting light-emitting diode package structure further includes a first bonding wire and a second bonding wire, the first bonding wire is connected to the light-emitting diode chip and the first patch pad, and The two bonding wires are connected to the light-emitting diode chip and the second patch pad.

In at least one embodiment, the side-emitting light-emitting diode package structure further includes two metal wires, which are arranged parallel to the height direction. The first patch pad and the second patch pad correspond to parts of the top surface and the bottom surface. , Welded to two metal wires respectively.

In at least one embodiment, the molded gel is located between the two metal wires.

Through the thickness configuration of the molded gel, the molded gel clearly protrudes from the insulating substrate. Observed from a top view or a bottom view, the molded gel of the present invention is compared with the molded gel of the prior art light-emitting diode package. Large and prominent, while providing a larger light-emitting area, there is a relatively good light-emitting effect. At the same time, the present invention reduces the width of the insulating substrate in the width direction, effectively reducing the light emitted by the molded colloid from being blocked by the insulating substrate, and achieving 360-degree light emission.

Referring to FIG. 7, FIG. 8, and FIG. 9, a side-emitting light-emitting diode package structure 100 proposed by the new embodiment includes an insulating substrate 130, a first patch pad 110, and a second patch bonding The disk 120, the light emitting diode chip 140, the first bonding wire 151, the second bonding wire 152 and the molded gel 160.

As shown in FIGS. 7, 8, and 9, the insulating substrate 130 is used to provide electrical insulation. In a specific embodiment, the combination of the insulating substrate 130, the first patch pad 110, and the second patch pad 120 is a printed circuit board. That is to say, through the manufacturing process of the printed circuit board, the insulating substrate 130, the first patch pad 110 and the second patch pad 120 required by the present invention can be directly manufactured. The insulating substrate 130 excludes metal substrates whose surfaces have been insulated or insulated ceramic substrates. The aforementioned metal substrates or ceramic substrates can provide good heat conduction and heat dissipation effects.

As shown in FIG. 7, the insulating substrate 130 has a top surface 133, a bottom surface 134, a first side surface 131 and a second side surface 132. The first side surface 131 and the second side surface 132 are disposed oppositely, and the first side surface 131 and the second side surface 132 are connected to the top surface 133 and the bottom surface 134.

As shown in FIGS. 7, 8, and 9, the first patch pad 110 and the second patch pad 120 are respectively covered on the first side surface 131 and the second side surface 132. At the same time, the first patch pad 110 and the second patch pad 120 extend to the top surface 133 and the bottom surface 134 respectively. The first patch pad 110 and the second patch pad 120 jointly cover the top surface 133 and maintain the first gap G1, and the first patch pad 110 and the second patch pad 120 jointly cover the bottom surface 134 and Maintain the second gap G2.

As shown in FIG. 7, FIG. 8 and FIG. 9, there is a die bonding position on the first patch pad 110 and corresponds to the top surface 133. The light emitting diode chip 140 is disposed at the die bonding position, that is, the light emitting diode chip 140 is disposed on the first patch pad 110 and corresponds to the top surface 133. The light emitting diode chip 140 has a first electrode 141 and a second electrode 142, which are electrically connected to the first patch pad 110 and the second patch pad 120, respectively, so as to pass through the first bonding wire 151 and the second bonding wire 152 electrically connects the light emitting diode chip 140 to the first patch pad 110 and the second patch pad 120.

As shown in FIGS. 7 and 8, in the embodiment of the present invention, the side-emitting light-emitting diode package structure 100 further includes a first bonding wire 151 and a second bonding wire 152, and the first bonding wire 151 is connected to the first The electrode 141 and the first patch pad 110, and the second bonding wire 152 is connected to the second electrode 142 and the second patch pad 120.

As shown in FIGS. 7 and 8, the molding compound 160 is provided corresponding to the top surface 133, and partially covers the first patch pad 110 and the second patch pad 120, so that the first patch pad 110 and the second patch pad The two patch pads 120 corresponding to the first side surface 131 and the second side surface 132 are exposed. The molding compound 160 covers the light emitting diode chip 140, the first bonding wire 151, and the second bonding wire 152, and fills the first gap G1.

As shown in FIGS. 7, 8 and 9, a height direction Z passing through the top surface 133 and the bottom surface 134 is defined, the molded gel 160 has a gel thickness Gth in the height direction Z, and the insulating substrate 130 has a height direction Z The substrate thickness Sth, the gel thickness Gth is greater than the substrate thickness Sth. The gel thickness Gth is at least twice the substrate thickness Sth. Define the length direction X passing through the first side surface 131 and the second side surface 132 and perpendicular to the height direction Z, and define the width direction Y perpendicular to the height direction Z and the length direction X, the substrate length SL of the insulating substrate 130 in the length direction X, It is greater than the substrate width SW of the insulating substrate 130 in the width direction Y. The substrate length SL is at least three times the substrate width SW. In addition, in the width direction Y, a gel width GW of the molded gel 160 is equal to the substrate width SW. In the width direction Y, the pad widths of the first patch pad 110 and the second patch pad 120 are equal to the substrate width SW, that is, in the width direction Y, the first patch pad 110 and the second patch pad The pad 120 completely covers the top surface 133, and collectively covers the top surface 133 in the length direction X and maintains the first gap G1.

Referring to FIG. 10, FIG. 11 and FIG. 12, the side-emitting light-emitting diode package structure 100 further includes two metal wires 200. The metal wire 200 may be a general bare wire, or an exposed part of an enameled wire or a rubber covered wire. The two metal wires 200 are arranged parallel to the height direction Z. The parts of the first patch pad 110 and the second patch pad 120 corresponding to the top surface 133 and the bottom surface 134 are respectively soldered to the two metal wires 200. The side-emitting light-emitting diode package structure 100 is laterally welded to two metal wires 200, and the metal wires 200 can contact the first patch pad 110 and the second patch pad on the edges of the top surface 133 and the bottom surface 134 120, and fully electrically connected to the first patch pad 110 and the second patch pad 120 through solder. The molding gel 160 is located between the two metal wires 200.

Through the connection of the first bonding wire 151, the second bonding wire 152, the first patch pad 110 and the second patch pad 120, the metal wire 200 provides power to the light emitting diode chip 140, so that the light emitting diode chip 140 shines. The metal wire 200 is usually a copper wire, but other metals with high conductivity are not excluded. Through a plurality of side-emitting light-emitting diode package structures 100 sequentially welded to the two metal wires 200, a light string capable of emitting light in multiple directions can be formed.

As shown in FIG. 11 and FIG. 12, when power is supplied through the two metal wires 200 and a voltage difference is applied to the first electrode 141 and the second electrode 142, the light emitting diode chip 140 emits light. At this time, whether the side-emitting light-emitting diode package structure 100 is viewed from a top view or a bottom view, the light-emitting diode chip 140 emits light toward the side direction (light emitting toward the height direction Z). At the same time, the molded colloid 160 also protrudes toward the side (protruding toward the height direction Z), which can make the molded colloid 160 have a light guide effect without being shielded in the length direction X or the width direction Y, but in the length direction X and the width direction. The direction Y has a good light-emitting effect. The molded gel 160 protruding toward the height direction Z can also reduce the degree of light shielding by the insulating substrate 130, so that the side-emitting light-emitting diode package structure 100 emits approximately 360 degrees. The molded colloid 160 can also be doped with particles that can change the light-emitting state, such as reflective, fluorescent, or pigment.

Referring to FIG. 13, in a specific configuration, a plurality of side-emitting light-emitting diode package structures 100 can be welded on the two metal wires 200, and the molded colloids 160 can protrude in opposite directions from each other to achieve completeness. 360-degree glow.

Through the thickness configuration of the molded gel 160 of the present invention, the molded gel 160 clearly protrudes from the insulating substrate 130. When viewed from a top view or a bottom view, the molded gel 160 of the present invention is compared with the prior art light emitting diode package The molded colloid 160 is large and prominent, and provides a larger light-emitting area and has a relatively good light-emitting effect. At the same time, the present invention reduces the width of the insulating substrate 130 in the width direction Y, effectively reducing the light emitted by the molded colloid 160 from being blocked by the insulating substrate 130, and achieving approximately 360-degree light emission.

1: LED package structure 2: printed circuit board 2c: Bonding pad 2d: wire bonding pad 2e: soldering pad 3: LED chip 4: The first wire 5: The second wire 6: Molded colloid 100: Side-emitting light-emitting diode package structure 110: The first patch pad 120: The second patch pad 130: insulating substrate 131: First side 132: second side 133: top surface 134: Bottom 140: LED chip 141: first electrode 142: second electrode 151: The first wire 152: The second wire 160: Molded colloid 200: Metal wire G1: first gap G2: second gap Gth: Gel thickness Sth: substrate thickness SL: substrate length SW: substrate width GW: Gel width X: length direction Y: width direction Z: height direction

Fig. 1 is a front view of a light emitting diode package structure in the prior art. FIG. 2 is a top view of a light emitting diode package structure in the prior art. Fig. 3 is a bottom view of a light emitting diode package structure in the prior art. FIG. 4 is a front view of a light emitting diode package structure welded to a metal wire in the prior art. FIG. 5 is a top view of the LED package structure welded to the metal wire in the prior art. FIG. 6 is a bottom view of a light emitting diode package structure welded to a metal wire in the prior art. Fig. 7 is a schematic front cross-sectional view of a light emitting diode package structure in an embodiment of the present invention. Fig. 8 is a top view of a light emitting diode package structure in an embodiment of the present invention. Fig. 9 is a bottom view of the light emitting diode package structure in the embodiment of the present invention. FIG. 10 is a bottom view of the light emitting diode package structure welded to the metal wire in the embodiment of the present invention. FIG. 11 is a front cross-sectional schematic diagram of the light emitting diode package structure welded to the metal wire in the embodiment of the present invention. FIG. 12 is a schematic rear view cross-sectional view of the light emitting diode package structure welded to the metal wire in the embodiment of the present invention. FIG. 13 is a front cross-sectional schematic diagram of the light emitting diode package structure welded to the metal wire in the embodiment of the present invention.

100: Side-emitting light-emitting diode package structure

110: The first patch pad

120: The second patch pad

130: insulating substrate

140: LED chip

151: The first wire

152: The second wire

160: Molded colloid

200: Metal wire

X: length direction

Y: width direction

Z: height direction

Claims (9)

A side-emitting light-emitting diode package structure, including: An insulating substrate has a top surface, a bottom surface, a first side surface, and a second side surface. The first side surface and the second side surface are disposed opposite to each other, and the first side surface and the second side surface are connected to the top surface and the second side surface. Underside A first patch pad covering the first side surface; A second patch pad covering the second side surface; the first patch pad and the second patch pad jointly covering the top surface and maintaining a first gap, the first patch soldering The disk and the second patch pad jointly cover the bottom surface and maintain a second gap; A light-emitting diode chip is disposed on the first patch pad and corresponds to the top surface; wherein, the light-emitting diode chip is electrically connected to the first patch pad and the second patch bond Plate; and A molded plastic body corresponding to the top surface, partially covering the first patch pad and the second patch pad, and covering the light-emitting diode chip and filling the first gap; the definition passes In a height direction of the top surface and the bottom surface, the molded gel has a gel thickness in the height direction, and the insulating substrate has a substrate thickness in the height direction, and the gel thickness is greater than the thickness of the substrate. The side-emitting light-emitting diode package structure according to claim 1, wherein the thickness of the gel is at least twice the thickness of the substrate. The side-emitting light-emitting diode package structure according to claim 1, wherein a length direction passing through the first side surface and the second side surface and perpendicular to the height direction is defined, and a length direction perpendicular to the height direction and A width direction of the length direction, a substrate length of the insulating substrate in the length direction is greater than a substrate width of the insulating substrate in the width direction. The light emitting diode package structure capable of side-emitting light according to claim 3, wherein the length of the substrate is at least three times the width of the substrate. The side-emitting light-emitting diode package structure according to claim 3, wherein, in the width direction, a gel width of the molded gel is equal to the width of the substrate. The side-emitting light-emitting diode package structure according to claim 3, wherein, in the width direction, the pad width of the first patch pad and the second patch pad is equal to the width of the substrate. The side-emitting light-emitting diode package structure according to claim 3, further comprising a first bonding wire and a second bonding wire, and the first bonding wire is connected to the light-emitting diode chip and the first sticker A chip pad, and the second bonding wire is connected to the light-emitting diode chip and the second patch pad. The side-emitting light-emitting diode package structure according to claim 3, further comprising two metal wires, which are arranged parallel to the height direction, and the first patch pad and the second patch pad correspond to the top surface And the part of the bottom surface is respectively welded to the two metal wires. The side-emitting light-emitting diode package structure according to claim 8, wherein the molded gel is located between the two metal wires.

Images