TW202205400A - 雷射加工裝置及雷射加工方法 - Google Patents

雷射加工裝置及雷射加工方法 Download PDF

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Publication number
TW202205400A
TW202205400A TW110111575A TW110111575A TW202205400A TW 202205400 A TW202205400 A TW 202205400A TW 110111575 A TW110111575 A TW 110111575A TW 110111575 A TW110111575 A TW 110111575A TW 202205400 A TW202205400 A TW 202205400A
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TW
Taiwan
Prior art keywords
region
processing
light
area
laser
Prior art date
Application number
TW110111575A
Other languages
English (en)
Chinese (zh)
Inventor
坂本剛志
佐野育
杉浦銀治
Original Assignee
日商濱松赫德尼古斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商濱松赫德尼古斯股份有限公司 filed Critical 日商濱松赫德尼古斯股份有限公司
Publication of TW202205400A publication Critical patent/TW202205400A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
TW110111575A 2020-07-15 2021-03-30 雷射加工裝置及雷射加工方法 TW202205400A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020-121652 2020-07-15
JP2020121652 2020-07-15
JP2020-217750 2020-12-25
JP2020217750 2020-12-25

Publications (1)

Publication Number Publication Date
TW202205400A true TW202205400A (zh) 2022-02-01

Family

ID=79554706

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110111575A TW202205400A (zh) 2020-07-15 2021-03-30 雷射加工裝置及雷射加工方法
TW110111576A TW202205401A (zh) 2020-07-15 2021-03-30 雷射加工裝置及雷射加工方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW110111576A TW202205401A (zh) 2020-07-15 2021-03-30 雷射加工裝置及雷射加工方法

Country Status (5)

Country Link
JP (2) JPWO2022014106A1 (ja)
KR (2) KR20230038461A (ja)
CN (2) CN116113517A (ja)
TW (2) TW202205400A (ja)
WO (2) WO2022014107A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5775265B2 (ja) * 2009-08-03 2015-09-09 浜松ホトニクス株式会社 レーザ加工方法及び半導体装置の製造方法
JP5456510B2 (ja) 2010-02-23 2014-04-02 株式会社ディスコ レーザ加工装置
EP2599580A4 (en) * 2010-07-26 2016-12-28 Hamamatsu Photonics Kk LASER PROCESSING PROCESS
JP2013089714A (ja) * 2011-10-17 2013-05-13 Disco Abrasive Syst Ltd チップ形成方法
JP5995563B2 (ja) * 2012-07-11 2016-09-21 株式会社ディスコ 光デバイスの加工方法
JP7285067B2 (ja) * 2018-10-30 2023-06-01 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
KR102248637B1 (ko) 2018-12-07 2021-05-06 임유택 관리기용 폭 조정장치

Also Published As

Publication number Publication date
KR20230038461A (ko) 2023-03-20
CN116075388A (zh) 2023-05-05
TW202205401A (zh) 2022-02-01
KR20230038462A (ko) 2023-03-20
WO2022014107A1 (ja) 2022-01-20
JPWO2022014106A1 (ja) 2022-01-20
WO2022014106A1 (ja) 2022-01-20
JPWO2022014107A1 (ja) 2022-01-20
CN116113517A (zh) 2023-05-12

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