TW202203349A - Air-adhesive pad chip carrier which contains an adhesive film whereby die bar can be adhered to or separated from when the carrier plate is moved or transported - Google Patents

Abstract

An air-adhesive pad chip carrier includes a base body, a carrier plate, and an adhesive film. The base body has an upper surface on which at least an airway is formed. There are an air injection chamber and at least one through hole inside the base body, and the through hole communicates with the air injection chamber and the airway. The carrier plate is fixed on the top surface of the base body, the carrier plate has at least one die placing groove and at least one sticking section, the sticking section is a through hole and constitutes a partial section of the die placing groove. The adhesive film is fixed on the upper surface and has adhesiveness on the top surface. The adhesive film is located between the carrier plate and the upper surface. When the air is fed into the airway, the adhesive film above the airway is expanded and located in the sticking section, whereby the adhesive film adheres to the die bar from the top surface when it expands and is separated from the die bar when it retracts, so as to fix the die bar appropriately.

Description

Air Cushion Wafer Carrier

The present invention relates to the technical field of a wafer carrier of a semiconductor integrated circuit.

The integrated circuit wafers processed by the semiconductor process technology will be cut into various shapes of chips according to the requirements, such as strips or granules, and then collected by the carrier. Afterwards, it is moved from the carrier plate to each test machine or other equipment for subsequent related inspections and installation operations.

As shown in FIG. 1 , it is a perspective view of a conventional carrier disk. The top surface of the carrier tray 1 has a plurality of receiving grooves 11 for placing the crystal strips A in the shape of strips. During transportation or moving, an upper cover will be used to cover the carrier tray 1 to prevent the crystal strip A from falling out. In addition, when the crystal bar A is placed, the surface that cannot be scratched will face upward, such as the surface with lines. However, in the conventional structure, the receiving trough 11 is only for placing the crystal bar A, without any fixing mechanism, and for convenience When picking and placing, the size of the receiving chute 11 will be slightly larger, so the vibration generated during the moving process often causes the crystal bar A to flip or jump, causing the surface of the crystal bar A to be scratched and then damaged. Therefore, some carriers use a large-area glue surface to fix multiple crystal strips, but this makes it difficult to remove, or the surface of the crystal strip A is damaged due to excessive pressure during picking and placement, or there is residual glue residue. In order to solve the problem of the surface of the crystal bar A, the present inventor has considered and designed a solution.

The main purpose of the present invention is to provide an air-adhesive wafer carrier, which mainly uses an expandable adhesive film to adhere a part of the crystal strip and separates it from the crystal strip when it is restored to its original state, so that it can be fixed when the carrier is moved or transported. The crystal strip can reduce the damage rate. In other states, the sticking state can be released, which is convenient for removing the crystal strip.

In order to achieve the above-mentioned purpose, the present invention is an air-adhesive pad type wafer carrier, comprising a seat body, a carrier plate and an adhesive film, the seat body has an upper surface, at least one air channel is formed on the upper surface, and the seat body is The part has a gas injection chamber and a through hole, the through hole communicates with the gas injection chamber and the air channel; the carrier board is fixed on the top of the base, the carrier board has at least one die placement groove and at least one sticking section, the The sticking section is a through hole and constitutes a partial section of the die placement groove; the adhesive film is fixed on the upper surface and has adhesiveness on the top surface, the adhesive film is located between the carrier board and the upper surface, and when inflated in In the airway, the adhesive film above the airway is expanded and located in the sticking section.

In a preferred embodiment of the present invention, the longitudinal cross-sectional dimension of the sticking section increases from top to bottom.

In a preferred embodiment of the present invention, a plurality of the die placement grooves are arranged at equal intervals in the lateral direction, and the sticking section communicates with the aforementioned plurality of the die placement grooves.

In a preferred embodiment of the present invention, the air passage includes several main air passages and several air passages, the number of the main air passages corresponds to the number of the sticking sections and is located in the lower area, and each main air passage is provided with at least one The air passages intersect with each other through a plurality of the air passages at other positions, so that all the air passages form a communicating gas passage.

In a preferred embodiment of the present invention, the main air passage is wider than the air passage, and the location of the air passage is deeper than the main air passage.

In a preferred embodiment of the present invention, a piston rod is further included, and the gas injection chamber has an inlet. When the piston rod is inserted into the gas injection chamber through the inlet, gas injection operation can be performed. When the chamber is drawn out, the pumping operation is completed, so that the gas injection or pumping operation is performed manually.

In a preferred embodiment of the present invention, a gas injection valve is further included, the gas injection valve is installed on the side wall of the seat body and closes the inlet of the gas injection chamber, and the gas injection valve can be contacted with external gas supply equipment to Carry out gas injection or extraction operation, whereby the gas injection or extraction operation can be performed by automatic mechanical equipment.

To sum up the above, the present invention is an air-adhesive pad type wafer carrier, which has the following advantages: 1. During the moving process of the carrier plate, the crystal strip can be fixed to prevent the crystal strip from scratching the surface due to vibration, which can reduce the damage rate of the crystal strip; 2. When the subsequent operation is to be performed on the machine, the sticking state can be released, which makes it easier to take and place the wafer without damaging the wafer; 3. The carrier plate structure can be matched with manual or automated equipment after simple replacement, so that the product can be used more widely; 4. The carrier plate has a simple structure, is easy to manufacture and is convenient to use, and is highly competitive in the market.

The technical solutions of the present invention will be clearly and completely described below with reference to specific embodiments and accompanying drawings. It should be noted that when an element is referred to as being "mounted or fixed to" another element, it means that it can be directly on the other element or an intervening element may also be present. When an element is referred to as being "connected" to another element, it means that it can be directly connected to the other element or intervening elements may also be present. In the illustrated embodiment, the directions indicated up, down, left, right, front and back, etc. are relative, and are used to explain that the structures and movements of the various components in this case are relative. These representations are appropriate when the components are in the positions shown in the figures. However, if the description of the positions of elements changes, it is believed that these representations will change accordingly.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing specific embodiments only and is not intended to limit the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in FIG. 2 and FIG. 3 , they are a perspective view and an exploded view of the first embodiment of the air-adhesive pad wafer carrier according to the present invention, respectively. The present invention is an air-adhesion pad type wafer carrier, which includes a base 2 , a carrier plate 3 and an adhesive film 4 . In this embodiment, a piston rod 5 is further included. The piston rod 5 is inserted into the seat body 2 only when the air is to be injected.

The base body 2 is a square body with an upper surface 21 . In this embodiment, the area where the upper surface 21 is located is concave, on which the adhesive film 4 and the carrier board 3 are arranged. Please refer to FIG. 4 and FIG. 5 together, the upper surface 21 forms at least one air passage 22 in a concave manner. The seat body 2 has an air injection chamber 23 and at least one through hole 24 , and the through hole 24 communicates with the air injection chamber 23 and the air passage 22 . The air injection chamber 23 has an inlet 231 which communicates with the outside world, and the piston rod 5 is inserted into the air injection chamber 231 through the inlet 231 to achieve the purpose of inflating the air passage 22 or pumping air.

In this embodiment, the air passage 22 is concave, and includes several main air passages 221 and several air passages 222. Each main air passage 221 has at least one air passage 222 in it. The main air passage 221 is larger than the air passage 222. The air passage 222 is located deeper than the main air passage 221 . The other several air passages 222 are connected to each other, so that the main air passage 221 and the air passage 222 form gas passages that communicate with each other. The through hole 24 communicates with one of the air passages 222 located in the center, and then divides the flow through the other air passages 222 and communicates with the main air passage 221 , so as to achieve the purpose of diverting and stabilizing the flow during inflation.

The adhesive film 4 is a sticky film on the top surface that can expand and deform, and can be made of silicone or other materials. The adhesive film 4 is fixed on the upper surface 21 . After the air passage 22 is inflated, the adhesive film 4 in this area expands; after the gas is discharged, the adhesive film 4 returns to its original state. In the present embodiment, the expansion area of the adhesive film 4 is mainly in the area where the main air channel 221 is located after inflation. In the present invention, the top surface of the adhesive film 4 is used to adhere the crystal strips.

The carrying plate 3 is fixed on the top of the base 2 for carrying the crystal strips. In this embodiment, the carrier board 3 is fixed in the area where the upper surface 21 of the base body 2 is recessed, and the adhesive film 4 is fixed and sealed between the carrier board 3 and the lower surface 21 . The carrier board 3 is a board body having at least one die placement groove 31 and at least one sticking section 32 thereon. The die placement groove 31 is a groove that is distributed laterally and does not penetrate through, and the sticking section 32 is a through hole and constitutes a partial section of the die placement groove 31 . In this embodiment, the sticking section 32 is located in the middle section of the die placement groove 31 . In addition, the sticking section 32 may only constitute a partial section of a die placement groove 31 , but it is not limited to this. In this example, a long sticking section 32 is connected to the aforesaid plurality of lateral distributions. The die placement grooves 31 are all formed into partial sections thereof, which are convenient in operation and use. In addition, the longitudinal section of the sticking section 32 is gradually increasing from top to bottom (as shown in FIG. 4 ), and the assembled position is above the main flow channel 221 .

As shown in FIG. 6 , it is a cross-sectional view of the actual operation of the present invention. The crystal bar A is placed in the die receiving groove 31 of the carrier plate 3 . When the position of the crystal strip A is to be fixed, the piston rod 5 is inserted into the gas injection chamber 23, and the internal gas is squeezed through the through hole 24 into the gas flow channel 222, and then the gas is injected into the gas flow channel 222 through the other connected gas channels 222. Inject into each of the main air passages 221, so that the adhesive film 4 above the main air passage 221 is expanded and located in the sticking section 32, whereby the top surface of the adhesive film 4 is stuck to the middle partial section of the bottom surface of the wafer A , to achieve the purpose of cementing the crystal bar A. Afterwards, if the sticking state is to be released, the piston rod 5 is pulled out, and the film 4 can be restored to its original state by pulling out the gas, so that the crystal bar A can be easily taken out from the die placement groove 31 .

In the above-mentioned embodiments, the action of inflating or pumping air is mainly completed manually. However, in the actual production process, an automatic machine is sometimes used to move the air-adhesive wafer carrier. Therefore, please refer to FIG. 7, FIG. 8 and FIG. 9, which are diagrams of the second embodiment of the present invention. 3D, exploded and sectional views. In the second embodiment, the carrier plate 3 and the adhesive film 4 are the same as the above-mentioned embodiment, and the seat body 2 is also provided with an air passage 22, an air injection chamber 23 and a through hole 24. The improvement of the present invention is to add an air injection valve. 6. The gas injection valve 6 is installed on the side wall of the seat body 2 to close the inlet 31 of the gas injection chamber 3 . The gas injection valve 6 can be selected from a gas nozzle, a one-way gas valve or an inflation valve, etc., which are common in the market, and is not limited thereto. In this embodiment, a ball 61 is provided inside the gas injection valve 6 and is pressed by a spring 62 to close the gas injection port 63 of the gas injection valve 6 . Afterwards, the air-adhesive pad type wafer carrier of the present invention is used in an automated machine, and the ejector pin of an external inflatable device can be used to insert into the air injection port 63 to push open the sphere 61 to facilitate the action of inflating or exhausting. 4. The expansion action mode is the same as the above-mentioned embodiment.

FIG. 10 and FIG. 11 are the exploded view and the combined perspective view of the air-adhesive pad wafer carrier and other accessories of the present invention. Relevant accessories include an upper cover 7 , a left clip 8 and a right clip 9 . When the air-adhesive wafer carrier of the present invention is to be transported or moved, the piston rod 5 can be inserted into the base body 2, so that the wafer A is glued, and then the upper cover 7 is covered on the base body 2, and the left, The left clips 8 and the right clips 9 are inserted and clamped on the right, so that the seat body 2 and the upper cover 7 will not be loosened, which can make the transportation process more secure.

To sum up the above, the air-adhesive pad chip carrier of the present invention uses the adhesive film 4 whose top surface is viscous and can expand and deform to limit its expansion in the adhesive section 32 of the carrier plate 3 to adhere to the wafer. A, and the sticking state is released when the adhesive film 4 is restored to its original state, so that the crystal strip A is only fixed during the moving process, which prevents the crystal strip A from being scratched and reduces the damage rate, thereby increasing the profit, and the carrier plate can It is suitable for manual or automated production operations, meets the needs of manufacturers, and meets the requirements for patent application.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the embodiments of the present invention. That is, all equivalent changes and modifications made according to the scope of the patent application of the present invention are all covered by the patent scope of the present invention.

A: Crystalline 1: Loading disk 11: Bearing chute 2: seat body 21: Upper surface 22: Airway 221: main airway 222: Air flow channel 23: Air injection chamber 231: Entrance 24: Through hole 3: Carrier plate 31: Die placement slot 32: Paste Section 4: film 5: Piston rod 6: Air injection valve 61: Spring 62: Sphere 63: Air injection port 7: upper cover 8: Left clip 9: Right clip

FIG. 1 is a perspective view of a conventional wafer carrier.

FIG. 2 is a perspective view of a first implementation of the air-adhesive pad type wafer carrier of the present invention.

3 is an exploded view of the first embodiment of the air-adhesive wafer carrier of the present invention.

FIG. 4 is a cross-sectional view taken along the line AA of FIG. 2 .

FIG. 5 is a cross-sectional view taken along the line BB of FIG. 2 .

FIG. 6 is a schematic diagram of the internal structure of the first embodiment of the air-adhesive-cushion-type wafer carrier after being inflated according to the present invention.

FIG. 7 is a perspective view of the second embodiment of the air-adhesive pad wafer carrier of the present invention.

FIG. 8 is an exploded view of the second embodiment of the air-adhesive wafer carrier of the present invention.

FIG. 9 is a cross-sectional view of a second embodiment of the air-adhesive wafer carrier of the present invention.

FIG. 10 is an exploded view of the air-adhesive pad type wafer carrier and its accessories according to the present invention.

FIG. 11 is a perspective view of the air-adhesive pad type wafer carrier after assembly of the present invention.

2: seat body

231: Entrance

3: Carrier plate

31: Die placement slot

32: Paste Section

5: Piston rod

Claims (7)

An air-adhesive pad type wafer carrier, comprising: A seat has an upper surface, at least one air channel is formed on the upper surface, the seat body has an air injection chamber and at least one through hole inside, and the through hole communicates with the air injection chamber and the air channel; a carrier board, fixed on the top of the base, having at least one die placement groove and at least one sticking section, the sticking section is a through hole and constitutes a partial section of the die placing groove; An adhesive film is fixed on the upper surface and has adhesiveness on the top surface. The adhesive film is fixed between the carrier board and the upper surface. When inflated in the airway, the adhesive film above the airway expands and is located in the airway. the paste section. The air-adhesive pad type wafer carrier as claimed in claim 1, wherein the longitudinal cross-sectional dimension of the adhesive section increases gradually from top to bottom. The air-adhesive-pad-type chip carrier according to claim 1, wherein a plurality of the die placement grooves are arranged at equal intervals in the lateral direction, and the sticking section communicates with the aforementioned plurality of the die placement grooves. The air-adhesive pad type wafer carrier as claimed in claim 3, wherein the air passages include a plurality of main air passages and a plurality of air passages, and the number of the main air passages corresponds to the number of the sticking sections and is located in a lower area, and each main air passage is located in a lower area. At least one of the air passages is arranged in the air passage, and several air passages at other positions intersect with each other, so that all the air passages form a communicating gas passage. As claimed in claim 4, the main air passage is wider than the air passage, and the position of the air passage is deeper than the main air passage. The gas-bonded wafer carrier as claimed in claim 1, further comprising a piston rod, the gas injection chamber is provided with an inlet, when the piston rod is inserted into the gas injection chamber through the inlet, gas injection can be performed, and when When the piston rod is drawn out from the air chamber, the pumping operation is completed. The gas-bonded wafer carrier of claim 1, further comprising a gas injection valve, the gas injection valve is installed on the side wall of the seat body and closes the inlet of the gas injection chamber, and the gas injection valve can be connected to the outside Contact with gas supply equipment for gas injection or extraction.

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