TWM601898U - Air-adhesive pad chip carrier - Google Patents

Abstract

An air-adhesive pad type chip carrier includes a base, a supporting plate and an adhesive film. The base has an upper surface, at least one air channel is formed on the upper surface, and an air injection chamber and at least one through hole are provided inside the base. The through hole communicates the gas injection chamber and the air passage; the carrier plate is fixed on the top surface of the seat body, the carrier plate has at least one die placement groove and at least one sticking section, and the sticking section is a through hole and forms the A partial section of the die placement groove; the glue film is fixed on the upper surface and the top surface is adhesive, the glue film is located between the carrier plate and the upper surface, when inflated in the airway, above the airway The glue film expands and is located in the sticking section, whereby the glue film adheres to the crystal bar from the top surface when it is expanded, and separates from the crystal bar when it is retracted, so as to achieve the purpose of fixing the crystal bar when appropriate.

Description

Air-adhesive pad chip carrier

This creation is a technical field of chip carrier for semiconductor integrated circuit.

The integrated circuit wafers processed by the semiconductor process technology will be cut into various shapes of dies, such as strips or granules, according to requirements, and then carried and collected by a carrier plate. After that, the tray is moved to each testing machine or other equipment for subsequent related testing for installation.

As shown in Figure 1, it is a three-dimensional view of the conventional tray. The top surface of the tray 1 is provided with a plurality of receiving troughs 11 for placing the crystal strips A in a strip shape. During transportation or moving, another upper cover is used to cover the carrier plate 1 to prevent the crystal bar A from falling out. In addition, when the crystal bar A is placed, the surface that cannot be scratched will face upwards, such as a surface with a circuit. However, in the conventional structure, the receiving groove 11 is only for the crystal bar A to be placed without any fixing mechanism, and for convenience When picking and placing, the size of the receiving trough 11 will be slightly larger. Therefore, the vibration generated during the movement will often cause the crystal bar A to flip or jump, causing the surface of the crystal bar A to be scratched and damaged. Therefore, some carrier discs use a large area of glue surface to fix multiple crystal strips, but this causes difficulty in removal, or excessive pressure during picking and placement causes damage to the surface of the crystal strip A, or residual glue residue In order to solve the problem on the surface of the crystal bar A, the author thought and designed a solution.

The main purpose of this creation is to provide an air-adhesive pad type chip carrier, which mainly uses expandable adhesive film to adhere to the part of the crystal bar, and separates from the crystal bar when it is restored, so that it can be fixed when the carrier is moved or transported The crystal bar can reduce the damage rate. In other states, the sticking state can be released to facilitate the removal of the crystal bar.

In order to achieve the above-mentioned purpose, this creation is an air-adhesive pad type chip carrier, which includes a base, a carrier plate and an adhesive film. The base has an upper surface, at least one air channel is formed on the upper surface, and the base body The part has an air injection chamber and a through hole, the through hole communicates the air injection chamber and the air passage; the carrier plate is fixed on the top of the seat body, the carrier plate has at least one die placement groove and at least one sticking section, the The sticking section is a through hole and constitutes a partial section of the die placement groove; the glue film is fixed on the upper surface and the top surface has adhesiveness. The glue film is located between the carrier board and the upper surface. In the airway, the glue film above the airway is expanded and located in the sticking section.

In the preferred embodiment of this creation, the longitudinal cross-sectional size of the pasting section gradually increases from top to bottom.

In a preferred embodiment of the present invention, a plurality of the die placement grooves are arranged at equal intervals in the transverse direction, and the bonding section is connected to the aforementioned plurality of the die placement grooves.

In a preferred embodiment of the present creation, the air passage includes several main air passages and several air passages. The number of the main air passages corresponds to the number of the sticking section and is located in the lower area. Each main air passage is provided with at least one The air flow channel also intersects each other via several air channels in other positions, so that all the air flow channels form a connected gas channel.

In the preferred embodiment of the present creation, the main air passage is wider than the air passage, and the position of the air passage is deeper than the main air passage.

In the preferred embodiment of the present invention, it further includes a piston rod, the gas injection chamber has an inlet, and when the piston rod is inserted into the gas injection chamber through the inlet, gas injection can be performed. When the chamber is drawn out, the air extraction operation is completed, whereby the air injection or extraction operation is performed manually.

In the preferred embodiment of the present invention, it further includes an air injection valve which is installed on the side wall of the seat body and closes the inlet of the air injection chamber, and the air injection valve can be contacted with an external air supply device. Carry out gas injection or pumping operations, whereby automatic mechanical equipment can perform gas injection or pumping operations.

Based on the above, this creation is an air-adhesive cushioned chip carrier, which has the following advantages: 1. During the moving process of the carrier plate, the crystal bar can be cemented to prevent the crystal bar from scratching the surface due to vibration, which can reduce the damage rate of the crystal bar; 2. When you want to perform subsequent operations on the machine, the sticking state can be released, making it easier to take and place the crystal bar without damaging the crystal bar; 3. The carrier structure can be matched with manual or automated equipment after simple replacement, making the product more widely used; 4. The carrier plate has a simple structure, is easy to manufacture and convenient to use, and is highly competitive in the market.

The technical solutions of this creation will be clearly and completely described below in conjunction with specific embodiments and drawings. It should be noted that when a component is referred to as being "mounted on or fixed to" another component, it means that it can be directly on the other component or a central component may also be present. When an element is considered to be "connected" to another element, it means that it can be directly connected to the other element or there may be a central element at the same time. In the illustrated embodiment, the directions indicate that up, down, left, right, front and back, etc. are relative, and are used to explain that the structure and movement of different components in this case are relative. These representations are appropriate when the part is in the position shown in the figure. However, if the description of the component location changes, it is considered that these representations will also change accordingly.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art of creation. The terminology used herein is only for the purpose of describing specific embodiments, and is not intended to limit the creation. The term "and/or" as used herein includes any and all combinations of one or more related listed items.

As shown in Fig. 2 and Fig. 3, they are respectively a three-dimensional view and an exploded view of the first embodiment of the creation of the air-bonded pad type chip carrier. This creation is an air-adhesive pad type chip carrier, including a body 2, a carrier plate 3 and an adhesive film 4. In this embodiment, a piston rod 5 is further included. The piston rod 5 is inserted into the seat body 2 only when it is about to inject air.

The seat body 2 is a square body with an upper surface 21. In this embodiment, the area where the upper surface 21 is located is concave, on which the adhesive film 4 and the carrier board 3 are placed. Please refer to FIGS. 4 and 5 together. The upper surface 21 forms at least one air passage 22 in a recessed manner. The seat body 2 has an air injection chamber 23 and at least one through hole 24 inside, and the through hole 24 connects the air injection chamber 23 and the air passage 22. The gas injection chamber 23 has an inlet 231 communicating with the outside, and the piston rod 5 is inserted into the gas injection chamber 231 through the inlet 231 to achieve the purpose of filling the air passage 22 or pumping air.

In this embodiment, the air passage 22 is concave and includes a plurality of main air passages 221 and a plurality of air passages 222. Each of the main air passages 221 has at least one air passage 222, and the main air passage 221 is smaller than the air passage 222. It is wider, and the location of the air passage 222 is deeper than the main air passage 221. The other several air passages 222 are intersected and communicated with each other, so that the main air passage 221 and the air passage 222 form mutually connected air passages. The through hole 24 communicates with one of the air passages 222 in the center, and then diverges through the other air passages 222 and communicates with the main air passage 221, so as to achieve the purpose of diversion and stabilization during inflation.

The glue film 4 is a thin film with a sticky top surface that can be expanded and deformed, and can be made of silicone or other materials. The adhesive film 4 is fixed on the upper surface 21. After the air passage 22 is inflated, the adhesive film 4 in this area is expanded; after the gas is discharged, the adhesive film 4 must return to its original shape. In this implementation, the expansion area of the adhesive film 4 after inflation is mainly located in the area where the main airway 221 is located. The present creation uses the top surface of the adhesive film 4 to adhere the crystal strips.

The supporting board 3 is fixed on the top of the base 2 for the purpose of supporting the crystal bar. In this embodiment, the supporting board 3 is fixed in the recessed area of the upper surface 21 of the base body 2, and the adhesive film 4 is fixedly enclosed between the supporting board 3 and the lower surface 21. The carrier board 3 is a board body with at least one die placement groove 31 and at least one sticking section 32 thereon. The die placement groove 31 is a groove that is laterally distributed and does not penetrate, and the sticking section 32 is a through hole and constitutes a partial section of the die placement groove 31. In this embodiment, the sticking section 32 is located in the middle section of the die placement groove 31. In addition, the pasting section 32 may only constitute a partial section of the die placement groove 31, but it is not limited to this. In this example, a long pasting section 32 is connected to the aforementioned multiple lateral distributions. The die placement grooves 31 all constitute a partial section thereof, which is more convenient in operation and use. In addition, the longitudinal section of the sticking section 32 is gradually increasing from top to bottom (as shown in FIG. 4), and the assembled position is above the main runner 221.

Figure 6 shows a cross-sectional view of the actual operation of this creation. The die A will be placed in the die holding groove 31 of the supporting board 3. To fix the position of crystal bar A, insert the piston rod 5 into the gas injection chamber 23, the internal gas is squeezed into the gas flow channel 222 through the through hole 24, and then the gas is made to flow through the other connected gas flow channels 222 Inject into each of the main air passages 221, so that the adhesive film 4 above the main air passage 221 is expanded and located in the sticking section 32, whereby the top surface of the glue film 4 is stuck to the middle partial section of the bottom surface of the crystal strip A , To achieve the purpose of cementing the crystal bar A. Afterwards, if the sticking state is to be released, the piston rod 5 is drawn out, and the gas is also drawn out to restore the glue film 4 to its original shape, so that the crystal bar A can be easily taken out from the die placing groove 31.

In the above embodiment, the inflation or pumping action is mainly completed manually. However, in the actual production process, an automated machine is sometimes used to move the air-bonded wafer carrier. Therefore, please refer to Figure 7, Figure 8, and Figure 9, which are the drawings of the second embodiment of the creation. Three-dimensional view, exploded view and cross-sectional view. In the second embodiment, the carrier plate 3 and the adhesive film 4 are the same as the above embodiment. The seat body 2 is also provided with an air passage 22, an air injection chamber 23, and a through hole 24. The improvement of this creation is to add an air injection valve 6. The gas injection valve 6 is installed on the side wall of the seat body 2 to close the inlet 31 of the gas injection chamber 3. The gas injection valve 6 can be a gas nozzle or a one-way gas valve or an inflation valve commonly used in the market at present, and is not limited thereto. In this embodiment, the gas injection valve 6 is provided with a ball 61 which is pressed by a spring 62 to close the gas injection port 63 of the gas injection valve 6. After this creation, the air-adhesive cushion-type wafer carrier is used in an automated machine. The ejector pin of an external inflation device can be inserted into the gas injection port 63 to push the sphere 61 out to facilitate the inflation or exhaust action. 4 The expansion action is the same as the above embodiment.

Figures 10 and 11 show the exploded view and the combined three-dimensional view of the created air-bonded chip carrier and other accessories. Related accessories include an upper cover 7, a left clip 8 and a right clip 9. When the air-adhesive cushion type chip carrier of the present invention is to be transported or moved, the piston rod 5 can be inserted into the seat body 2 so that the crystal bar A is fixed, and then the upper cover 7 is covered on the seat body 2, left and right The right is inserted and clamped by the left clamping piece 8 and the right clamping piece 9 respectively, so as to ensure that the seat body 2 and the upper cover 7 will not loosen, and the transportation process can be more secure.

In summary, the air-adhesive cushioned chip carrier of the present invention utilizes the adhesive film 4, which has a sticky top surface and can be expanded and deformed, to limit the expansion of the adhesive section 32 of the carrier plate 3 to adhere the wafer A, and release the sticking state when the adhesive film 4 is restored to its original state, so that the crystal bar A is only fixed during the moving process, avoiding scratches of the crystal bar A and reducing the damage rate, thereby increasing profit, and the carrier plate can It is suitable for manual or automated production operations to meet the needs of manufacturers and meet the requirements for patent applications.

The above are only preferred embodiments of the creation, and are not used to limit the scope of the embodiments of the creation. That is to say, all equal changes and modifications made in accordance with the scope of patent application for this creation are covered by the scope of patents of this creation.

A: Crystal bar 1: carrier 11: material trough 2: seat body 21: upper surface 22: Airway 221: Main Airway 222: Airflow Channel 23: gas injection chamber 231: Entrance 24: Through hole 3: Carrier board 31: Die placement slot 32: Paste section 4: Film 5: Piston rod 6: Gas injection valve 61: Spring 62: Sphere 63: gas injection port 7: Upper cover 8: Left clip 9: Right clip

Figure 1 is a perspective view of a conventional chip carrier.

Figure 2 is a three-dimensional view of the first implementation of creating an air-adhesive pad type chip carrier.

FIG. 3 is an exploded view of the first embodiment of the creation of the air-bonded pad type chip carrier.

Fig. 4 is a cross-sectional view of the AA plane of Fig. 2.

Figure 5 is a cross-sectional view of the BB plane of Figure 2;

FIG. 6 is a schematic diagram of the internal structure of the first embodiment of the created air-adhesive cushion type chip carrier after inflation.

FIG. 7 is a perspective view of a second embodiment of the creation of an air-adhesive pad type chip carrier.

FIG. 8 is an exploded view of the second embodiment of the creation of the air-bonded pad type chip carrier.

FIG. 9 is a cross-sectional view of a second embodiment of the creation of an air-bonded pad type chip carrier.

Figure 10 is an exploded view of the creation of the air-bonded wafer carrier and its accessories.

Figure 11 is a three-dimensional view of the created air-bonded chip carrier after assembly.

2: seat body

231: Entrance

3: Carrier board

31: Die placement slot

32: Paste section

5: Piston rod

Claims (7)

An air-adhesive pad type chip carrier, including: A base body having an upper surface, at least one air passage is formed on the upper surface, the seat body has an air injection chamber and at least one through hole inside the base body, and the through hole communicates the air injection chamber and the air passage; A carrier board, fixed on the top of the base, with at least one die placement groove and at least one sticking section, the sticking section is a through hole and constituting a partial section of the die placement groove; A glue film is fixed on the upper surface and the top surface has adhesiveness. The glue film is fixed between the carrier plate and the upper surface. When inflated in the airway, the glue film above the airway is expanded and positioned The pasted section. The air-adhesive pad type chip carrier according to claim 1, wherein the longitudinal cross-sectional size of the adhesive section gradually increases from top to bottom. The air-bonded pad type wafer carrier according to claim 1, wherein a plurality of the die placing grooves are arranged at equal intervals in a horizontal direction, and the adhesive section is connected to the plurality of the die placing grooves. The air-adhesive cushion-type chip carrier according to claim 3, wherein the air passage includes a plurality of main air passages and a plurality of air passages, and the number of the main air passages corresponds to the number of the adhesive section and is located in the lower area, and each of the main air passages At least one of the air channels is provided in the air channel, and several air channels in other positions intersect each other, so that all the air channels form a connected gas channel. For the air-adhesive cushion type chip carrier described in claim 4, the main air passage is wider than the air passage, and the position of the air passage is deeper than the main air passage. The gas-adhesive pad type wafer carrier according to claim 1, further comprising a piston rod, the gas injection chamber is provided with an inlet, and when the piston rod is inserted into the gas injection chamber through the inlet, gas injection can be performed, and when The piston rod is drawn out from the air chamber to complete the air extraction operation. The gas-adhesive pad type wafer carrier according to claim 1, further comprising a gas injection valve installed on the side wall of the seat body and closing the inlet of the gas injection chamber, and the gas injection valve can be connected to the outside Contact with gas supply equipment for gas injection or pumping operations.

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