TW202138955A - Heat dissipation connection structure of handheld device - Google Patents

Abstract

A heat dissipation connection structure of handheld device includes an outer frame main body and a two-phase flow heat exchange unit. The outer frame main body has a hollow receiving space at the center. The outer frame main body surrounds the hollow receiving space. The two-phase flow heat exchange unit is disposed in the hollow receiving space and connected with the outer frame main body by means of an injection molding structure member, whereby the outer frame main body and the two-phase flow heat exchange unit can be quickly and securely connected with each other.

Description

Heat dissipation combined structure of handheld device

A heat dissipation combination structure of a handheld device, in particular, refers to a heat dissipation combination structure of a handheld device that connects the outer frame of the handheld device and the two-phase flow heat exchange unit through an integrated envelope structure as a connection structure.

With the doubling of the performance and processing speed of handheld mobile devices, it also causes internal electronic components to generate a high thermal response, which is transmitted to the entire handheld device, causing the user to experience hot hands and overheating of electronic components to cause crashes or burns. Due to circumstances, it is necessary to provide a solution to the internal electronic components. Current handheld mobile devices usually use a middle frame or a housing as the base to carry various electronic components, batteries, touch screens and other units, and the middle frame or housing is usually an integrated machine processed Therefore, in order to understand the heat, the industry usually adds auxiliary heat transfer elements such as copper sheets, graphite sheets, thin heat pipes, and two-phase flow heat exchange units inside the mobile device to dissipate and dissipate the heat generated by the internal electronic components. Or guide it to the far end to conduct antipyretic heat conduction. The one-piece middle frame shell 3 is formed by a single material through machining such as milling or stamping. The single material is made of aluminum, aluminum alloy, or copper alloy. Lightweight materials will lose structural strength. Materials with better strength increase the weight. If you choose a material with better heat transfer efficiency, such as pure copper, the heat transfer efficiency can be improved, but the weight is heavier, and the strength of the pure copper soft structure is not good, so choose a single-material middle frame shell The body 4 cannot take into account both thermal conductivity and structural strength. Furthermore, please refer to Figure 6. The conventional middle frame case 4 is used to carry various electronic components 5 and heat dissipation or heat conduction elements 6. When the material of the middle frame case 4 has poor thermal conductivity, the heat dissipation or heat conduction elements must be used 5Auxiliary heat conduction. The heat dissipation or heat conduction element 6 must be attached to the middle frame housing 4 and then stacked with the electronic components 5 for heat conduction. This will increase the overall thickness and weight of the middle frame housing 4, making it impossible to achieve thinness. The effect of chemical and lightweight. In addition, since the handheld device is oriented toward thinness and weight reduction, how to choose materials that can take into account lightness and thinness and have good structural strength is the primary improvement for the industry.

Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a heat-dissipating combination structure of a handheld device used to quickly combine the outer frame body and the two-phase flow heat exchange unit by forming a connecting structure through an integrated injection method. . In order to achieve the above objective, the present invention provides a heat dissipation combined structure of a handheld device, which includes: an outer frame body and a two-phase flow heat exchange unit; The outer frame body has at least one hollow accommodating space, and the outer frame body surrounds the periphery of the hollow accommodating space; the two-phase flow heat exchange unit is arranged in the aforementioned hollow accommodating space and is formed through an injection molding structure. Connected and combined with the outer frame body. When the outer frame body and the two-phase flow heat exchange unit are not integrally formed, the injection-molded structure can be formed through an integrated injection method, and at the same time, the outer frame body and the two-phase structure can be connected by the injection-molded structure. The flow heat exchange unit is quickly integrated into one.

The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings. Please refer to Figures 1 and 2, which are a three-dimensional exploded and assembled view of the first embodiment of the heat dissipation combination structure of a handheld device of the present invention. As shown in the figure, the heat dissipation combination structure of the handheld device includes: an outer frame body 1 , One two-phase flow heat exchange unit 2; The outer frame body 1 has at least one hollow accommodating space 11. In this embodiment, a hollow accommodating space 11 is selected at the center of the outer frame body 1, and the outer frame body 1 surrounds the hollow accommodating space 11 Peripheral The two-phase flow heat exchange unit 2 is arranged in the aforementioned hollow accommodating space 11, and is connected and combined with the outer frame body 1 through an injection molding structure 3, and the two-phase flow heat exchange unit 2 has at least one airtight cavity The airtight chamber 21 has at least one capillary structure 211 and is filled with a working fluid 212. The two-phase flow heat exchange unit 2 is a flat heat pipe or a temperature equalizing plate. In this embodiment, the temperature is equalized. The board is an illustrative embodiment but is not meant to be limiting. The injection molding structural part 3 is a structural part formed by integral over-injection molding. The outer frame body 1 and the two-phase flow heat exchange unit 2 are placed together in an injection molding mold (not shown in the figure) for integral injection After molding, the injection molding structure 3 is formed to connect the outer frame body 1 and the two-phase flow heat exchange unit 2 at the same time. The injection molding structure 3 is either plastic or metal. The outer frame body 1 and the two-phase flow heat exchange unit 2 can be made of the same or different materials, and the outer frame body 1 and the two-phase flow heat exchange unit 2 are made of copper, aluminum, stainless steel, ceramic, copper alloy, Any of aluminum alloy, commercial pure titanium, and titanium alloy. Please refer to Figures 3 and 4, which are a three-dimensional exploded and combined cross-sectional view of the second embodiment of the heat dissipation combination structure of the handheld device of the present invention. Without repeating the details, the difference between this embodiment and the aforementioned first embodiment is that the outer frame body 1 has a groove 12 on the inner edge, and the two-phase flow heat exchange unit 2 is a uniform temperature plate. The outer edge of the flow heat exchange unit 2 has a lip 22. One end of the injection molding structure 3 is embedded in the groove 12 and the other end covers the lip 22, thereby connecting the injection molding structure 3 through the lip 22. The outer frame body 1 and the two-phase flow heat exchange unit 2 serve as fixed users. Please refer to Figures 5 and 6, which are the three-dimensional exploded and combined diagrams of the third embodiment of the heat dissipation combination structure of the handheld device of the present invention. It will not be repeated, but the difference between this embodiment and the aforementioned second embodiment is that the two-phase flow heat exchange unit 2 of this embodiment is composed of a first uniform temperature plate 2c and a second uniform temperature plate 2d. The first and second uniform temperature plates 2c, 2d are respectively made of stainless steel and copper materials, which can be separately connected to the first and second uniform temperature plates 2c, 2d through the injection molding structure 3 into a whole, or The first and second uniform temperature plates 2c, 2d and the outer frame body 1 are simultaneously connected to the outer frame body 1 and the two-phase flow heat exchange unit 2 (the first uniform temperature plate 2c and the second The temperature equalizing plate 2d) is used for fixing. The main purpose of this case is to manufacture the outer frame body 1 as a handheld device to enhance the structural strength and the two-phase flow heat exchange unit 2 as a load bearing and thermal conduction of electronic components separately, and then form the injection molding through an integrated injection molding method. The structural member 3 connects the outer frame body 1 and the two-phase flow heat exchange unit 2 into one body, so that the outer frame body 1 and the two-phase flow heat exchange unit 2 can be assembled and fixed quickly and easily. In addition to heat insulation by the structural parts, it can also greatly improve the lack of a single material characteristic and the difficulty of processing in the frame of the conventional one-piece handheld device, and each of them is independently installed and manufactured. The outer frame body 1 of this case is combined with a two-phase flow heat exchange unit 2 for a combination, which can directly pass through the two-phase flow heat exchange unit 2 with a two-phase flow heat exchange effect and provide the work of carrying electronic components and heat conduction at the same time, without increasing heat The transfer element and thickness have been raised before, eliminating the need for heat dissipation and heat transfer elements, greatly reducing the overall weight and thickness, and achieving the purpose of lightening and thinning.

1: Outer frame body 11: Hollow accommodating space 12: Groove 2: Two-phase flow heat exchange unit c: The first uniform temperature plate 2 d: The second uniform temperature plate 2 21: Airtight chamber 211: Capillary structure 212: working fluid 22: Lips 4: Middle frame shell 5: Electronic components 6: Heat dissipation or heat conduction components

Figure 1 is a perspective exploded view of the first embodiment of the heat dissipation combination structure of the handheld device of the present invention; Figure 2 is a three-dimensional assembly diagram of the first embodiment of the heat dissipation combined structure of the handheld device of the present invention; Figure 3 is a perspective exploded view of the second embodiment of the heat dissipation combination structure of the handheld device of the present invention; Figure 4 is a combined cross-sectional view of the second embodiment of the heat dissipation combination structure of the handheld device of the present invention; Figure 5 is a perspective exploded view of the third embodiment of the heat dissipation combination structure of the handheld device of the present invention; Fig. 6 is a three-dimensional assembly diagram of the third embodiment of the heat dissipation combination structure of the handheld device of the present invention; Figure 7 is a schematic cross-sectional view of the conventional technology.

1: Outer frame body

11: Hollow accommodating space

2: Two-phase flow heat exchange unit

21: Airtight chamber

211: Capillary structure

212: working fluid

3: Injection molding structural parts

Claims (9)

A heat dissipation combined structure of a handheld device includes: An outer frame body with a hollow accommodating space, and the outer frame system surrounds the periphery of the hollow accommodating space; A two-phase flow heat exchange unit is arranged in the aforementioned hollow accommodating space, and is connected and combined with the outer frame body through an injection molding structure. The heat-dissipating combination structure of a handheld device according to claim 1, wherein the injection molding structure is a structure that is molded through an integrated injection molding, and the outer frame body and the two-phase flow heat exchange unit are placed together in one One-piece injection molding is performed in the injection molding mold, and then the injection molding structure is molded to simultaneously connect the outer frame body and the two-phase flow heat exchange unit. The heat-dissipating combination structure for a handheld device according to claim 1, wherein the injection molding structure is any one of plastic or metal. The hand-held device heat dissipation combination structure according to claim 1, wherein the two-phase flow heat exchange unit is a flat heat pipe or a uniform temperature plate. The heat-dissipating combination structure of the handheld device according to claim 1, wherein the outer frame body and the two-phase flow heat exchange unit may be the same or different materials. The heat dissipation combination structure of the handheld device according to claim 1, wherein the outer frame body and the two-phase flow heat exchange unit are made of copper, aluminum, stainless steel, ceramics, copper alloys, aluminum alloys, commercial pure titanium, Titanium alloy any. The heat dissipation combination structure of the handheld device according to claim 1, wherein the two-phase flow heat exchange unit has at least one airtight chamber, and the airtight chamber has a capillary structure and is filled with a working fluid. The heat-dissipating combination structure of a handheld device according to claim 1, wherein the two-phase flow heat exchange unit is composed of at least a first uniform temperature plate and a second uniform temperature plate, and is formed through the injection molding structure Connect as one. The heat dissipation combined structure of the handheld device according to claim 1, wherein the first and second uniform temperature plates are made of stainless steel and copper, respectively.

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