TW202026807A - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes a main body and at least one heat conduction member. The main body has a top face. A periphery of the top face has a connection section. One end of the heat conduction member is correspondingly in contact and connection with the top face or the connection section. By means of the structure design of the present invention, the horizontal heat dissipation effect is greatly enhanced and the heat dissipation effect of the entire heat dissipation device is greatly enhanced.

Description

Heat sink

The present invention relates to a heat dissipation device, in particular to a heat dissipation device that can greatly improve the overall level of heat dissipation effect.

The uniform temperature plate is a common heat dissipation device that is often used in the field of heat dissipation. The materials that are often used to make the uniform temperature plate are copper, aluminum, stainless steel and other materials. These materials are prone to potential differences during manufacturing. Potential difference corrosion and other phenomena occur. In addition, if the traditional uniform temperature made of copper, aluminum, stainless steel and other materials is applied to large-scale industrial equipment, the uniform temperature plate is bulky and heavy in order to achieve sufficient strength. If it is used in a smart phone Or on tablets or handheld devices, the thickness of the uniform temperature plate is too thin and the strength is insufficient due to the need to be extremely thin. Therefore, in recent years, some companies have advanced the use of titanium for heat dissipation device manufacturing in the field of heat dissipation. . Titanium is a kind of metal material with light weight, strong structural strength, corrosion resistance and other characteristics. The current titanium has been widely used in various fields. However, due to the thermal conductivity (also known as K value) of titanium and copper, Compared with aluminum and other materials, it is slightly lower, and the heat dissipation device made of titanium has poor heat conduction in the horizontal direction. Please also refer to Figure 1A. Therefore, there is an industry that attaches at least one heat conducting element 11 (e.g. graphite sheet, heat pipe, copper sheet) to the outer peripheral lip 10 of the heat sink 1 (e.g., uniform temperature plate) made of titanium Etc.) in order to increase the heat conduction effect in the horizontal direction, and the aforementioned lip 10 means that after the two plates of the uniform temperature plate are connected, heating (such as: welding) or pressure is applied to the outer periphery of the two plates. At the position where the two phases are closed and joined, and because a working fluid 13 filled in the uniform temperature plate cannot flow to the lip 10, the lip 10 is an ineffective area without vapor-liquid circulation. The conventional improvement method only attaches the heat-conducting member 11 to the lip 10 of the uniform temperature plate and does not directly contact the working area of the uniform temperature plate with heat conduction (as shown in Figure 1B, where there is a cavity 12 , That is, the area where the working fluid 13 performs the vapor-liquid circulation), so in fact, it is impossible to increase the heat conduction effect in the horizontal direction through the arrangement of the heat conduction member 11. Of course, the overall heat dissipation effect of the heat sink 1 cannot be improved. Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the inventor of this case and the related manufacturers engaged in this industry urgently want to study and improve.

Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a structure that can greatly improve the horizontal heat conduction effect of the heat sink. In order to achieve the above objective, the present invention provides a heat dissipation device, which includes a body and at least one heat-conducting member. The body has a top surface, and one end of the heat-conducting member is in contact with the top surface. In order to achieve the above objective, the present invention provides a heat dissipating device, which includes a body and at least one heat-conducting member. The body has a top surface. The side of the top surface has a coupling part. One end of the heat-conducting member corresponds to the top surface. The surfaces or joints are in contact with each other. Among them, it should be noted that the main body of the present invention has an upper plate and a lower plate and correspondingly cover to form a chamber. The inner part of the chamber has a working fluid, and the chamber is capable of performing a vapor-liquid circulation through the working fluid. In addition, the main body further forms a lip, which is the area where the outermost peripheral edge of the main body is combined and closed. Therefore, the lip is an ineffective area without vapor-liquid circulation. Therefore, through the design of the structure of the present invention, one end of the heat conduction member is extended and connected to contact the top surface or the joint. When one side of the heat sink is in contact with a heat source, the inside of the chamber Begin the vapor-liquid circulation to form the effect of heat conduction and heat diffusion. At this time, heat is transferred to the other end of the heat-conducting part by contacting one end of the heat-conducting part arranged on the top surface or the joint part, and so on. It can improve the lack of heat transfer effect that cannot achieve the heat transfer effect when the heat conduction element is only attached to the lip of the body, and greatly increase the horizontal heat conduction and heat dissipation effect of the heat sink.

The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings. Please refer to Figures 2, 3, and 4, which are the three-dimensional exploded view, the three-dimensional assembled view and the cross-sectional view of the first embodiment of the heat sink of the present invention. As shown in the figure, a heat sink 2 includes a body 20 and at least one The heat conducting member 3, the main body 20 has a top surface 200, and the side of the top surface 200 has a joining portion 201. In this embodiment, the main body 20 is illustrated by a temperature equalizing plate, but it is not cited For limitation, the main body 20 may also be a heat pipe, a hot plate or other heat dissipation devices. The aforementioned body 20 has an upper plate 20a and a lower plate 20b. The upper and lower plates 20a and 20b are correspondingly covered and jointly define a cavity 203, and the top surface 200 and the joint 201 are correspondingly arranged in the cavity respectively. The outside of 203 and the chamber 203 have a capillary structure 4 and a working fluid 5. The upper and lower plates 20a, 20b can be made of two identical or two different materials combined to form the body 20. The material of the upper and lower plates 20a, 20b can be selected to be made of any one of gold, silver, copper, aluminum, iron, stainless steel, ceramics, or commercial pure titanium or titanium alloy, and the outer side of the upper plate 20a (that is, the top surface ) Is defined as a condensation side, and the outer side (ie, the bottom surface) of the lower plate 20b is defined as a heat absorption side. In this embodiment, one end of the thermally conductive member 3 is in contact with the top surface 200, and the thermally conductive member 3 can be selected from graphite or graphene, and the thermally conductive member 3 is through bonding or gluing or diffusion. Any one of bonding or welding, sintering or laser welding is correspondingly attached to the top surface 200 by contact. It should be noted that the working fluid 5 in the chamber 203 of the present invention is a position where a vapor-liquid circulation is performed. In addition, a lip 202 is formed on the main body 20, and the lip 202 is the most extreme position of the main body 20. The part of the outer periphery is the area when the joint is closed, so the lip 202 is an ineffective area without vapor-liquid circulation. Please refer to Figure 4 together. Therefore, through the design of this structure of the present invention, when the outer side (ie, the heat-absorbing side) of the lower plate 20b of the heat sink 2 is in contact with a heat source 6, the cavity 203 Vapor-liquid circulation starts inside to form the effect of heat conduction and heat diffusion. At this time, heat is transferred to the other end of the heat-conducting part 3 by one end of the heat-conducting part 3 attached to the top surface 200 to lift the body 20 The heat conduction and heat dissipation effect in the horizontal direction, and can further dissipate heat through the other end of the heat conduction member 3 butted with a heat dissipation element (not shown in the figure). The heat dissipation element can be a heat sink or a heat dissipation fin group. In any case, in this way, it can be improved that the conventional heat-conducting member 3 is only attached to the lip 202 of the main body 20 and cannot achieve the lack of heat transfer effect, and the overall heat dissipation effect of the heat sink 2 can be greatly improved. In addition, it should be noted that there is no limit to the number and size of the heat-conducting element 3 contacting and connecting to the top surface 200 at one end. The number and size of the heat-conducting element 3 can be adjusted according to the configuration and requirements of the user. . Finally, please refer to Figure 5, which is a cross-sectional view of the second embodiment of the heat sink of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the foregoing first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that one end of the heat-conducting member 3 is in contact with the coupling portion 201, and the structure of the coupling portion 201 is a flange, which then extends outward To form the lip 202, the flanges can be arranged in either continuous or non-continuous manner. The drawing in this embodiment is presented in a manner in which the flanges are arranged in a continuous manner. The heat conduction A first side surface 30 of the member 3 and the top surface 200 of the main body 20 can be arranged flush with each other (as shown in Figure 5) or can be arranged not flush with each other (that is, the first side surface 30 can be selected to be lower or higher than The top surface 200, not shown in the figure). As mentioned above, the present invention has the following advantages over the prior art: 1. Significantly improve the horizontal heat conduction and heat dissipation effect; 2. Significantly improve the overall heat dissipation effect of the heat sink. . The present invention has been described in detail above, but what is described above is only a preferred embodiment of the present invention, and should not limit the scope of implementation of the present invention. That is, all equal changes and modifications made according to the scope of application of the present invention should still be covered by the patent of the present invention.

1: heat sink 10: On the lips 11: Heat conduction parts 12: Chamber 13: working fluid 2: heat sink 20: body 20a: upper board 20b: lower board 200: top surface 201: Joint 202: lip 203: Chamber 3: Heat conduction parts 30: First side 4: Capillary structure 5: Working fluid 6: Heat source

Fig. 1A is a three-dimensional assembly view of a conventional heat sink; Fig. 1B is a cross-sectional view of a conventional heat sink; Fig. 2 is a three-dimensional exploded view of the first embodiment of the heat sink of the present invention; Fig. 3 is The three-dimensional assembly diagram of the first embodiment of the heat sink of the present invention; Fig. 4 is a cross-sectional view of the first embodiment of the heat sink of the present invention; Fig. 5 is a cross-sectional view of the second embodiment of the heat sink of the present invention.

2: heat sink

20: body

20a: upper board

20b: lower board

200: top surface

201: Joint

202: lip

3: Heat conduction parts

Claims (15)

A heat dissipating device includes: a body having a top surface; and at least one heat conducting member, one end of which is correspondingly connected to the top surface. The heat dissipation device according to claim 1, wherein the body has an upper plate and a lower plate, and the upper and lower plates are correspondingly covered and jointly define a cavity, and the top surface is formed correspondingly outside the cavity . The heat dissipation device according to claim 2, wherein the upper and lower plates are made of the same or different materials. The heat dissipation device according to claim 2, wherein the material of the upper and lower plates is made of gold, silver, copper, aluminum, iron, stainless steel, ceramics, or commercial pure titanium or titanium alloy. The heat dissipation device according to claim 2, wherein the upper plate is defined as a condensation side, and the lower plate is defined as a heat absorption side. The heat dissipation device according to claim 1, wherein the heat conducting member is any one of graphite, graphene, heat pipe, or copper sheet. The heat dissipating device according to claim 1, wherein the thermally conductive member is attached to the top surface in a corresponding contact manner by any of bonding, bonding, diffusion bonding, welding, sintering, or laser welding. A heat dissipation device includes: a body having a top surface, and a side of the top surface has a coupling part; and at least one heat conducting member, one end of which is corresponding to the top surface or the coupling part in contact and coupling. The heat dissipating device according to claim 8, wherein the body has an upper plate and a lower plate, and the upper and lower plates correspondingly cover and jointly define a cavity, and the top surface and the joint part are correspondingly arranged in the The outside of the chamber. The heat dissipation device according to claim 9, wherein the upper and lower plates are made of the same or different materials. The heat dissipation device according to claim 9, wherein the upper and lower plates are made of gold, silver, copper, aluminum, iron, stainless steel, ceramics, or commercial pure titanium or titanium alloy. The heat dissipation device according to claim 9, wherein the upper plate is defined as a condensation side, and the lower plate is defined as a heat absorption side. The heat dissipation device according to claim 8, wherein the heat conducting member is any one of graphite, graphene, heat pipe, or copper sheet. The heat dissipation device according to claim 8, wherein the heat conducting member has a first side surface, and the first side surface is flush with the top surface. The heat dissipating device according to claim 8, wherein the thermally conductive member is attached to the bonding portion or the top surface in a corresponding contact manner by any of bonding, gluing, diffusion bonding, welding, sintering, or laser welding.

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