TW202131524A - Metal capacitor - Google Patents

Abstract

A metal capacitor is provided. The metal capacitor includes a first metal layer and a second metal layer, which are formed on a substrate. The first metal layer includes a first electrode sheet and a second electrode sheet, and the second metal layer includes a third electrode sheet and a fourth electrode sheet. A first horizontal capacitor is formed between the first electrode sheet and the second electrode sheet. A second horizontal capacitor is formed between the third electrode sheet and the fourth electrode sheet. At least part of the fourth electrode sheet is above the first electrode sheet, and a first vertical capacitor is formed between the first electrode sheet and the fourth electrode sheet. At least part of the third electrode sheet is above the second electrode sheet, and a second vertical capacitor is formed between the second electrode sheet and the third electrode sheet.

Description

Metal capacitor

The present invention relates to a metal capacitor, and more particularly to a metal capacitor formed by the parasitic effect of the capacitor.

In analog circuits, it often happens that the operating voltage required by the internal circuit is higher than the power supply voltage Vdd received by the system. For example, the power supply voltage Vdd received by the memory circuit is 3V, but high voltages such as 5V, 10V, 12V, etc. may be required for selecting, writing, and erasing operations. Therefore, charge pumps are often used in analog circuits to generate operating voltages when the power supply voltage (which may be provided by the battery) is lower than the operating voltage.

Please refer to Figure 1, which is a schematic diagram of the charge pump voltage doubler circuit. The charge pump voltage doubler circuit 10 includes a multi-stage charge pump 10a. As the clock signals clk and clkb with opposite phase sequence are driven in turn, the voltage generated by the charge pump 10a of the subsequent stage is also higher and higher. The number of charge pumps 10a included in the charge pump voltage doubler circuit 10 can be determined according to the values of the power supply voltage Vdd and the output voltage Vout.

In Figure 1, each charge pump 10a includes a two-stage reverse driver connected in series, a boost capacitor Cb, and a pass MOS connected in the form of a diode. Both ends of the boost capacitor Cb respectively receive a boost voltage (boost voltage) Vb and a clock driving signal (driving clock signal) clkd. In the charge pump 10a, the boost capacitor Cb needs to occupy a larger area. Therefore, if the area of the boost capacitor Cb can be reduced, the production cost of the semiconductor circuit can be reduced.

The present invention relates to a use of the capacitance parasitic effect of an idle metal layer as a metal capacitor. This kind of metal capacitors can be used with transistor capacitors to increase the capacitance value without using additional area.

According to the first aspect of the present invention, a metal capacitor is provided, including: a first metal layer and a second metal layer. The first metal layer is disposed above the substrate, and the second metal layer is disposed above the first metal layer. The first metal layer includes: a first electrode sheet and a second electrode sheet. The first planar capacitor is formed between the first electrode sheet and the second electrode sheet. The second metal layer includes: a third electrode sheet and a fourth electrode sheet. The second planar capacitor is formed between the third electrode sheet and the fourth electrode sheet. Wherein, at least a part of the fourth electrode sheet is located above the first electrode sheet, and the first longitudinal capacitor is formed between the first electrode sheet and the fourth electrode sheet. At least a part of the third electrode sheet is located above the second electrode sheet, and the second longitudinal capacitor is formed between the second electrode sheet and the third electrode sheet.

According to a second aspect of the present invention, a metal capacitor is provided, including: at least one metal layer disposed above the transistor capacitor. The at least one metal layer includes: a first electrode sheet and a second electrode sheet. Wherein, the first electrode sheet receives the first voltage, and the second electrode sheet receives the second voltage.

In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows:

In semiconductor circuits, MOS transistors are usually used as capacitors. However, when MOS transistors are used as capacitors, additional area is required. Therefore, how to reduce the area of the boost capacitor Cb in a semiconductor circuit is an important issue. For the convenience of description, this article will use MOS transistors to realize the capacitance called transistor capacitance C_MOS.

In the memory circuit, in order to be able to access the memory cell, there are usually multiple metal layers. The arrangement of these metal layers is mainly used for the related control of the memory cell circuit, but these metal layers are not used in circuits other than the main circuit of the memory cell (for example, the transistor capacitor C_MOS of the charge pump). In other words, the metal layer above the transistor capacitor C_MOS is equivalent to being idle. Therefore, the present disclosure utilizes such an idle metal layer above the transistor capacitor C_MOS to form the metal capacitor C_MET. Then, the metal capacitor C_MET and the transistor capacitor C_MOS are connected in parallel to achieve the effect of increasing the capacitance value of the boost capacitor Cb. Similarly, in other circuits that use charge pumps, if there is an idle metal layer, a similar method can also be used to increase the capacitance value of the boost capacitor Cb.

Please refer to Figure 2, which is a schematic diagram of connecting the metal capacitor C_MET and the transistor capacitor C_MOS in parallel. According to the disclosed embodiment, the boost capacitor Cb includes a metal capacitor C_MET and a transistor capacitor C_MOS.

In the transistor capacitor C_MOS, the gate of the transistor is connected to the boost voltage Vb, and the source and drain of the transistor are connected to the clock drive signal clkd. On the other hand, the two ends of the metal capacitor C_MET respectively receive the boosted voltage Vb and the clock driving signal clkd. Therefore, the metal capacitor C_MET and the transistor capacitor C_MOS are connected in parallel between the boosted voltage Vb and the clock driving signal clkd. For ease of description, this article defines the boost voltage Vb as the voltage V1, and assumes that the clock drive signal clkd is defined as the voltage V2.

After the metal capacitor C_MET and the transistor capacitor C_MOS are connected in parallel, the capacitance value of the boost capacitor Cb can be increased. According to the simulation results, when the metal capacitor C_MET is used, the capacitance value of the boost capacitor Cb can be increased by about 40%. Since the metal capacitor C_MET is implemented using an idle metal layer, it does not take up additional area. When the boost capacitor Cb uses the metal capacitor C_MET to provide part of the capacitance value, the area required by the transistor capacitor C_MOS can be relatively reduced.

Please refer to Figure 3, which is a schematic diagram of using the metal layer above the transistor capacitor to form an electrode pattern. The transistor capacitor C_MOS includes polysilicon (poly) layers 31a, 31c and a diffusion layer (diffusion) 31b. The operation of the transistor capacitor C_MOS will not be described in detail here. At least one metal layer MTL is included above the transistor capacitor C_MOS. The metal layer MTL is used as the metal capacitor C_MET. In this embodiment, it is assumed that the widths of the transistor capacitor C_MOS and the metal capacitor in the x direction and the y direction are about 20 μm. However, the width value of the metal layer MTL applied in this embodiment is related to the design parameters, and the scope of the present invention is not restricted by these values. In addition, the position of the metal capacitor C_MET is above the transistor capacitor C_MOS (the positive direction of the z-axis). Here, the layered structure of the transistor capacitor C_MOS is defined as a substrate.

In Figure 3, it is assumed that the metal layer MTL1 includes electrode pieces ELED1 and ELED2. In this article, the diagonal mesh bottom from the upper right to the lower left represents the electrode (sheet) for receiving the voltage V1, and the dot mesh bottom represents the electrode (sheet) for receiving the voltage V2. Therefore, in Figure 3, the electrode sheet ELED1 is used to receive the voltage V1, and the electrode sheet ELED2 receives the voltage V2. Since the electrode plates ELED1 and ELED2 receive different voltages, the gap between the electrode plates ELED1 and ELED2 will accumulate charges and form a capacitance parasitic effect. Therefore, a capacitance will be formed between the electrode sheets ELED1 and ELED2.

In this article, the capacitance formed between different electrode sheets of the same metal layer is defined as the planar capacitance Ch. The capacitance value of the planar capacitor Ch is proportional to the relative surface area between the electrode plates on both sides, and inversely proportional to the distance ratio between the electrode plates on both sides. Therefore, when the number of electrodes on the electrode sheet is larger and the interval is denser, the capacitance value of the planar capacitor Ch can be increased.

When a semiconductor circuit includes multiple metal layers, in addition to the possibility of forming a planar capacitance Ch between different electrode pieces of the same metal layer, if the electrodes (pieces) between the metal layers receive different voltages, the electrodes (pieces) will also May form capacitance parasitic effects. This article defines the capacitance formed across the metal layers as the vertical capacitance Cv.

Taking a memory circuit as an example, four metal layers may be included above the transistor capacitor. According to the concept of the present disclosure, each of the four metal layers may include two electrode plates for receiving voltages V1 and V2, respectively, and the shape of each electrode plate and the received voltage may vary depending on the location. For ease of description, only the relative position between the metal layer and the electrode sheet will be described below, and the relationship between the substrate and the metal layer will not be repeated.

Please also note that in order to facilitate the description of the positional relationship between the electrode pattern of the electrode sheet and the metal layer, this article assumes that the x-axis, y-axis, and z-axis directions correspond to the length, width, and height directions of the semiconductor circuit, respectively. Among them, different metal layers represent different positions on the z-axis. In actual application, the direction and relative position of the electrode pattern and the metal layer may vary depending on the actual application.

Please refer to FIG. 4, which is a schematic diagram of an embodiment in which electrode plates are arranged on two metal layers, and then a capacitance effect is generated according to the capacitance pattern of the electrode plates. This figure assumes that there are two metal layers MTL1 and MTL2 above the substrate, where the metal layer MTL1 is located above the substrate, and the metal layer MTL2 is located above the metal layer MTL1. Furthermore, the metal layer MTL1 includes electrode pieces ELED1 and ELED2; the metal layer MTL2 includes electrode pieces ELED3 and ELED4. Among them, the electrode pieces ELED1 and ELED3 receive the voltage V1, and the electrode pieces ELED2 and ELED4 receive the voltage V2.

It can be seen from the enlarged view in the upper right corner of this drawing that on the metal layer MTL2, because the electrode plates ELED3 and ELED4 receive the voltages V1 and V2, respectively, a planar capacitor Ch is formed between the electrode plates ELED3 and ELED4. Similarly, on the metal layer MTL1, since the electrode plates ELED1 and ELED2 receive the voltages V1 and V2, respectively, a planar capacitor Ch will also be formed between the electrode plates ELED1 and ELED2.

In addition to the planar capacitors formed in each metal layer, in this case, across the metal layers, the capacitance can also be generated by the arrangement of the positions of the electrodes. For example, in the electrode sheets ELED1, ELED2, ELED3, ELED4 in this figure, if the voltage received by the electrode of the electrode sheet on the metal layer MTL2, the voltage received by the electrode of the electrode sheet on the metal layer MTL1 at the opposite position At different times, a longitudinal capacitance Cv is formed between the two electrodes.

Taking the two metal layers MTL1 and MTL2 as an example, at least a part of the electrode sheet ELED4 is located above the electrode sheet ELED1. Since the electrode piece ELED1 and the electrode piece ELED4 receive the voltage V1 and the voltage V2, respectively, a longitudinal capacitance Cv is formed at the overlapping position between the electrode piece ELED1 and the electrode piece ELED4. Similarly, since at least a part of the electrode sheet ELED3 is located above the electrode sheet ELED2, another longitudinal capacitor Cv is formed at the overlapping position between the electrode sheet ELED2 and the electrode sheet ELED3.

In the electrode sheets ELED1, ELED2, ELED3, and ELED4 in Figure 4, the boundaries of some of the electrodes are marked with thicker lines, and the boundaries of the other part of the electrodes are marked with thinner lines. The electrodes marked with thicker lines will form a longitudinal capacitance Cv between the electrodes at positions corresponding to the z-axis direction (upper/lower). On the other hand, the electrodes marked with thinner lines do not form a longitudinal capacitance Cv between the electrodes at positions corresponding to the z-axis direction (upper/lower). Further details on the location of the electrodes and whether longitudinal capacitance is generated will be described in more detail below with a more detailed example.

In Figure 4, the electrode sheets ELED1 and ELED3 have similar electrode patterns, and the electrode sheets ELED2 and ELED4 have similar electrode patterns. That is, in the metal layers MTL1, MTL2, the electrode patterns of the electrode plates (ELED1, ELED3) that are also used to receive the voltage V1 are similar to each other; and, in the metal layers MTL1, MTL2, the electrode plates (ELED1, ELED3) that are also used to receive the voltage V2 ( The electrode patterns of ELED2, ELED4) are similar to each other.

As shown in Fig. 4, a plurality of planar capacitors Ch and vertical capacitors Cv are formed on the electrode sheets ELED1, ELED2, ELED3, and ELED4. Regarding how the planar capacitor Ch and the longitudinal capacitor Cv are formed between the electrode sheets ELED1, ELED2, ELED3, and ELED4, and the connection relationship between the planar capacitor Ch and the longitudinal capacitor Cv, we will see Figures 5A, 5B, 5C, and 5D. illustrate.

Please refer to Figures 5A, 5B, 5C, and 5D, which are schematic diagrams showing that the electrode plates on the two metal layers form mutual capacitance with each other. Regarding the description in Figure 4, the relationship between the relative positions of the electrode sheets ELED1, ELED2, ELED3, and ELED4 and the formed planar capacitance Ch and the vertical capacitance Cv can be organized as shown in Figure 5A.

On the metal layer MTL1, due to the different voltages received by the electrode plates ELED1 and ELED2, a planar capacitor Ch1 is formed between the electrode plates ELED1 and ELED2; and, on the metal layer MTL2, due to the different voltages received by the electrode plates ELED3 and ELED4, A planar capacitor Ch2 is formed between the electrode sheets ELED3 and ELED4. Between the metal layers MTL1 and MTL2, a vertical capacitor Cv1 is formed between the electrode pieces ELED1 and ELED4; and a vertical capacitor Cv2 is formed between the electrode pieces ELED2 and ELED3.

Observing the relationship between the planar capacitors Ch1 and C2 and the longitudinal capacitors Cv1 and Cv2 in Fig. 5A from the side (x-z plane), it can be organized as shown in Fig. 5B. In addition, since the electrode pieces ELED1 and ELED3 also receive the voltage V1, the electrode pieces ELED1 and ELED3 in Figure 5B have the same voltage. Accordingly, Figure 5B can be simplified to Figure 5C. In the same way, since the electrode plates ELED2 and ELED4 also receive the voltage V2, the electrode plates ELED2 and ELED4 in Figure 5C have the same voltage. Accordingly, Figure 5C can be further simplified into Figure 5D.

According to the description of Figures 5A, 5B, 5C, and 5D, it can be known that by designing the electrode patterns of the electrode sheets ELED1, ELED2, ELED3, and ELED4 on the metal layers MTL1, MTL2, multiple capacitors (including vertical capacitors) can be generated. The effect of parallel connection of Cv and planar capacitor Ch). That is to say, this kind of design of the existing unused metal layer to use the capacitive parasitic effect formed between the electrode patterns can indeed be used as the metal capacitor C_MET to achieve the boost capacitor as shown in Figure 2. The effect of the capacitance value of Cb.

Due to the drawing angle, each electrode sheet ELED1, ELED2, ELED3, ELED4 drawn in Figure 4 contains a small number of electrodes. In one of the following embodiments, it is assumed that the metal layers MTL1 and MTL2 drawn on the xy plane are completely drawn in the area of about 20 μm*20 μm. 38 rows of electrodes can be arranged in the direction parallel to the x-axis. The area values of the embodiments and the number of electrode rows that can be formed are related to design parameters, and the scope of the present invention is not limited to these numerical constraints. As mentioned earlier, when the distance between the electrodes is closer, the capacitance value can be increased. Therefore, by arranging multiple columns of electrodes in a high-density manner, the capacitance values of the planar capacitors Ch1 and Ch2 can be increased.

Here, the electrode patterns of the electrode sheet ELED1 are described in FIGS. 6 and 7; and the electrode patterns of the electrode sheet ELED2 are described in FIGS. 8 and 9. Next, the electrode pattern in which the electrode pieces ELED1 and ELED2 on the metal layer MTL1 are combined together will be described with reference to FIG. 10.

Please refer to Figure 6, which is a schematic diagram of the electrode sheet ELED1. The electrode sheet ELED1 includes a common electrode cmn11 and electrode groups GP11a and GP11b. Among them, the common electrode cmn11 is connected to the electrode groups GP11a and GP11b at the same time.

Please refer to Figure 7, which is a schematic diagram of the electrode pattern included in the electrode sheet ELED1. In the figure, the left side is the electrode group GP11a, the right side is the electrode group GP11b, and the bottom is the common electrode cmn11.

The electrode group GP11a includes a main electrode M11a parallel to the y-axis and connected to the common electrode cmn11, and a plurality of branch electrodes br11a parallel to the x-axis. Among them, the respective branch electrodes br11a are equal in length to each other, and the branch electrodes br11a are all connected to the main electrode M11a with their left end points. The right end of the branch electrode br11a faces the positive direction of the x-axis. The electrode group GP11b includes a main electrode M11b parallel to the y-axis and connected to the common electrode cmn11, and a plurality of branch electrodes br11b parallel to the x-axis. Among them, the respective branch electrodes br11b are equal in length to each other, and the branch electrodes br11b are all connected to the main electrode M11b with their right end points. The left end of the branch electrode br11b faces the negative direction of the x-axis. Accordingly, the electrode groups GP11a and GP11b have a flat comb shape. Among them, the comb teeth of the electrode group GP11a face the positive direction of the x-axis, and the comb teeth of the electrode group GP11b face the negative direction of the x-axis.

The common electrode cmn11 is parallel to the x-axis, and the two ends of the common electrode cmn11 are respectively connected to the bottoms of the main electrodes M11a and M11b. The length of the common electrode cmn11 is longer than the branch electrode br11a of the electrode group GP11a, and the length of the common electrode cmn11 is also longer than the branch electrode br11b of the electrode group GP11b.

Please refer to Figures 6 and 7 at the same time. On the electrode sheet ELED1, the number of columns in which the branch electrodes br11a and the branch electrodes br11b are located are not the same, and the branch electrodes br11a and the branch electrodes br11b are arranged in a finger-like cross. When the metal layer MTL1 includes a total of 38 columns of electrodes, the electrode group GP11a includes a total of 9 branch electrodes br11a, and the electrode group GP11b includes 9 branch electrodes br11b. The common electrode cmn11 is located in the first column (y=1). The branch electrodes br11a start from the third column and are arranged at intervals of four columns (y=3, 7, …35). The branch electrodes br11b start from the fifth column and are arranged at intervals of four columns (y=5, 9, …37).

Please refer to Figure 8, which is a schematic diagram of the electrode sheet ELED2. The electrode sheet ELED2 includes a common electrode cmn12 and a bent electrode bnd12. The common electrode cmn12 is parallel to the x-axis, and the bent electrode bnd12 has a zigzag shape.

Please refer to Figure 9, which is a schematic diagram of the electrode pattern included in the electrode sheet ELED2. The upper part of the figure is the common electrode cmn12, and the lower part is the bent electrode bnd12.

The common electrode cmn12 is parallel to the x-axis, and the length of the common electrode cmn12 is slightly longer than the length of the bent electrode bnd12 on the x-axis. The bent electrode bnd12 includes a plurality of long electrodes eledL12 and a plurality of short electrodes eledS12a and eledS12b. The long electrodes eledL12 are equal in length to each other and parallel to the x-axis, and the left end points of the long electrodes eledL12 are aligned with each other, and the right end points are also aligned with each other. In Figure 9, the long electrode eledL12 is located in an even-numbered column (y=even).

Please refer to Figures 8 and 9 at the same time. The short electrodes eledS12a and eledS12b of the bent electrode bnd12 are parallel to the y-axis. Each short electrode eledS12a, eledS12b has an upper end point and a lower end point. The short electrode eledS12a is connected to the left end of the long electrode eledL12 by the upper and lower end points; the short electrode eledS12b is connected to the right end of the long electrode eledL12 by the upper and lower end points. In addition, the positions of the short electrodes eledS12a and eledS12b on the left and right sides connected to the same long electrode eledL12 in the y-axis direction are not consistent.

For example, the right end of the long electrode eledL12 in the second and fourth columns is connected to both ends of the short electrode eledS12b on the right; the left end of the long electrode eledL12 in the fourth and sixth columns is connected to Both ends of the short electrode eledS12a on the left; the right end of the long electrode eledL12 in the 6th and 8th columns are connected to both ends of the short electrode eledS12b on the right; the long electrode in the 8th and 10th columns The left end of eledL12 is respectively connected to the two ends of the short electrode eledS12 on the left. The connection relationship between the remaining long electrode eledL12 and the short electrodes eledS12a and eledS12b is similar and will not be described in detail.

That is, the positions of the short electrode eledS12a on the left side and the short electrode eledS12b on the right side on the y-axis are staggered. In addition, the left short electrode eledS12a, which is connected to the long electrode eledL12 in the 36th column, has its upper end connected to the common electrode cmn12.

Please refer to Fig. 10, which is a schematic diagram of the metal layer MTL1 composed of the electrode sheet ELED1 in Fig. 6 and the electrode sheet ELED2 in Fig. 8. The electrode piece ELED1 shown in FIG. 6 and the electrode piece ELED2 shown in FIG. 8 together constitute the metal layer MTL1 shown in FIG. 10. Please refer to Figures 6, 8, and 10 at the same time, where the electrode positions of the electrode sheets ELED1 and ELED2 on the metal layer MTL1 can be sorted as shown in Table 1. Table 1 Metal layer MTL1 Electrode name Electrode direction The number of columns corresponding to the electrode Electrode sheet ELED1 (Figures 6 and 7) Electrode group GP11a Main electrode M11a Parallel y axis NA Branch electrode br11a Parallel x axis 3, 7, 11, 15, 19, 23, 27, 31, 35 Electrode group GP11b Main electrode M11b Parallel y axis NA Branch electrode br11b Parallel x axis 5, 9, 13, 17, 21, 25, 29, 33, 37 Common electrode cmn11 Parallel x axis 1 Electrode sheet ELED2 (pictures 8 and 9) Common electrode cmn12 Parallel x axis 38 Bending electrode bnd12 Long electrode eledL12 Parallel x axis 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32, 34, 36 Short electrode eledS12a, eledS12b Parallel y axis NA

It can be seen from Table 1 that the branch electrodes br11a and brllb of the electrode sheet ELED1 receiving the voltage V1 are mostly located on odd-numbered columns, while the long electrode eledL12 of the electrode sheet ELED2 receiving the voltage V2 is mostly located on the even-numbered columns. Accordingly, on the metal layer MTL1, a planar capacitor Ch1 can be formed between the electrodes of each column.

Next, the electrode patterns of the electrode sheet ELED3 will be described in FIGS. 11 and 12; and the electrode patterns of the electrode sheet ELED4 will be described in FIGS. 13 and 14. Next, the electrode pattern in which the electrode pieces ELED3 and ELED4 on the metal layer MTL2 are combined together will be described with reference to FIG. 15.

Please refer to Figure 11, which is a schematic diagram of the electrode sheet ELED3. The electrode sheet ELED3 includes a common electrode cmn21 and electrode groups GP21a and GP21b. Among them, the common electrode cmn21 is connected to the electrode groups GP21a and GP21b at the same time.

Please refer to Figure 12, which is a schematic diagram of the electrode pattern included in the electrode sheet ELED3. In the figure, the left side is the electrode group GP21a, the right side is the electrode group GP21b, and the bottom is the common electrode cmn21.

The electrode group GP21a includes a main electrode M21a parallel to the y-axis and connected to the common electrode cmn21, and a plurality of branch electrodes br21a parallel to the x-axis. Among them, the respective branch electrodes br21a are equal in length to each other, and the branch electrodes br21a are all connected to the main electrode M21a with their left end points. The right end of the branch electrode br21a faces the positive direction of the x-axis. The electrode group GP21b includes a main electrode M21b parallel to the y-axis and connected to the common electrode cmn21, and a plurality of branch electrodes br21b parallel to the x-axis. Among them, the respective branch electrodes br21b are equal in length to each other, and the branch electrodes br21b are all connected to the main electrode M21b with their right end points. The left end of the branch electrode br21b faces the negative direction of the x-axis. Accordingly, the electrode groups GP21a and GP21b have a flat comb shape. Among them, the comb teeth of the electrode group GP21a face the positive direction of the x-axis, and the comb teeth of the electrode group GP21b face the negative direction of the x-axis.

The common electrode cmn21 is parallel to the x-axis, and both ends of the common electrode cmn21 are respectively connected to the bottoms of the main electrodes M21a and M21b. The length of the common electrode cmn21 is longer than the branch electrode br21a of the electrode group GP21a and longer than the branch electrode br21b of the electrode group GP21b.

Please refer to Figures 11 and 12 at the same time. On the electrode sheet ELED3, the number of columns in which the branch electrodes br21a and the branch electrodes br21b are located are not the same, and the branch electrodes br21a and the branch electrodes br21b are arranged in a finger-like cross. When the metal layer MTL2 includes a total of 38 columns of electrodes, the electrode group GP21a includes a total of 8 branch electrodes br21a, and the electrode group GP21b includes 9 branch electrodes br21b. The common electrode cmn21 is located in the first column (y=1). The branch electrodes br21a are arranged at intervals of four rows starting from the sixth row (y=6, 10, ... 34). The branch electrodes br21b start from the fourth column and are arranged at intervals of four columns (y=4, 8, …36).

Please refer to Figure 13, which is a schematic diagram of the electrode sheet ELED4. The electrode sheet ELED4 includes a common electrode cmn22 and a bent electrode bnd22. The common electrode cmn22 is parallel to the x-axis, and the bent electrode bnd22 has a zigzag shape.

Please refer to Figure 14, which is a schematic diagram of the electrode pattern included in the electrode sheet ELED4. The upper part of the figure is the common electrode cmn22, and the lower part is the bent electrode bnd22.

The common electrode cmn22 is parallel to the x-axis, and the length of the common electrode cmn22 is slightly longer than the length of the bent electrode bnd22 on the x-axis. The bent electrode bnd22 includes a plurality of long electrodes eledL22 and a plurality of short electrodes eledS22a and eledS22b. The long electrodes eledL22 are equal in length to each other and parallel to the x-axis, and the left end points of the long electrodes eledL22 are aligned with each other, and the right end points are also aligned with each other. In Figure 13, the long electrode eledL22 is located in the second column, the 38th column, and the odd column between 2~38 (y=3, 5,… 37).

Please refer to Figures 13 and 14 at the same time. The short electrodes eledS22a and eledS22b are parallel to the y axis. The short electrodes eledS22a and eledS22b of the bent electrode bnd22 are parallel to the y axis. Each short electrode eledS22a, eledS22b has an upper end point and a lower end point. The short electrode eledS22a is connected to the left end of the long electrode eledL22 by the upper and lower end points; the short electrode eledS22b is connected to the right end of the long electrode eledL22 by the upper and lower end points. In addition, the positions of the short electrodes eledS22a and eledS22b on the left and right sides connected to the same long electrode eledL22 in the y-axis direction are not the same.

For example, the right end of the long electrode eledL22 in the second and third columns is connected to the two ends of the short electrode eledS22b in the right; the left end of the long electrode eledL22 in the third and fifth columns is connected to Both ends of the short electrode eledS22a located on the left; the right end of the long electrode eledL22 located in the 5th and 7th columns are connected to both ends of the short electrode eledS22b located on the right; the long electrode in the 7th and 9th columns The left end of eledL22 is respectively connected to the two ends of the short electrode eledS22 on the left. The connection relationship between the remaining long electrode eledL22 and the short electrodes eledS22a and eledS22b is similar and will not be described in detail.

That is, the positions of the short electrode eledS22a on the left side and the short electrode eledS22b on the right side on the y-axis are staggered. In addition, the right short electrode eledS22b, which is connected to the long electrode eledL12 in the 37th column, has its upper end connected to the common electrode cmn22.

Please refer to FIG. 15, which is a schematic diagram of the metal layer MTL1 composed of the electrode sheet ELED3 in FIG. 11 and the electrode sheet ELED4 in FIG. The electrode piece ELED3 shown in FIG. 11 and the electrode piece ELED4 shown in FIG. 13 together constitute the metal layer MTL2 shown in FIG. 15. Please refer to Figures 11, 13, and 15, where the electrode positions of the electrode sheets ELED3 and ELED4 on the metal layer MTL2 can be sorted as shown in Table 2 Table 2 Metal layer MTL2 Electrode name Electrode direction The number of columns corresponding to the electrode Electrode sheet ELED3 (Picture 11, 12) Electrode group GP21a Main electrode M21a Parallel y axis NA Branch electrode br21a Parallel x axis 6, 10, 14, 18, 22, 26, 30, 34 Electrode group GP21b Main electrode M21b Parallel y axis NA Branch electrode br21b Parallel x axis 4, 8, 12, 16, 20, 24, 28, 32, 36 Common electrode cmn21 Parallel x axis 1 Electrode sheet ELED4 (Pictures 13, 14) Common electrode cmn22 Parallel x axis 38 Bending electrode bnd22 Long electrode eledL22 Parallel x axis 2, 3, 5, 7, 9, 11, 13, 15, 17, 19, 21, 23, 25, 27, 29, 31, 33, 35, 37 Short electrode eledS22a, eledS22b Parallel y axis NA

It can be seen from Table 2 that the branch electrodes br21a and br2lb of the electrode sheet ELED3 receiving the voltage V2 are mostly located on even-numbered columns, while the long electrode eledL22 of the electrode sheet ELED4 receiving the voltage V2 is mostly located on the odd-numbered columns. Accordingly, on the metal layer MTL2, a planar capacitor Ch2 can be formed between the electrodes of each column.

In addition, through the design of the electrode pattern, in addition to the planar capacitors Ch1 and Ch2 formed by the metal layers MTL1 and MTL2 on their respective planes, vertical capacitors Cv1 and Cv1 can be further formed between the metal layer MTL2 and the metal layer MTL1. Cv2.

Please refer to Figures 6, 7, 13, and 14 and Tables 1 and 2 at the same time. As shown in Table 1, in Figures 6 and 7, the branch electrode br11a of the electrode sheet ELED1 is located in the third, seventh, 11, 15, 19, 23, 27, 31, and 35 columns, and the branch electrode Br11b is located in the fifth column. , 9, 13, 17, 21, 25, 29, 33, 37 columns. As shown in Table 2, in Figures 13 and 14, the long electrode eledL22 of the bent electrode bnd22 of the electrode sheet ELED4 is located in the second column and all the odd columns in the third to 37th columns. Since the metal layer MTL2 is located above the metal layer MTL1, based on the foregoing description, the position of the long electrode eledL22 of the electrode sheet ELED4 is mostly above the position of the branch electrode br11a of the electrode sheet ELED1. In addition, the electrode sheet ELED1 is used to receive the voltage V1, and the electrode sheet receiving ELED4 is used to receive the voltage V2. From this, it can be seen that if the metal layer MTL2 in Figure 15 is placed directly above the metal layer MTL1 in Figure 10, between the upper and lower electrodes of all odd-numbered columns in columns 3 to 37, a longitudinal direction will be formed. Capacitance Cv1.

Please refer to Figures 8, 9, 11, 12 and Tables 1 and 2 at the same time. As shown in Table 1, in Figures 8 and 9, the long electrodes of the bent electrodes of the electrode sheet ELED2 are located in even-numbered columns (y = 2, 4, 6, 8, 10, 12, 14, 16, 18, 20 , 22, 24, 26, 28, 30, 32, 34, 36). As shown in Table 2, in Figures 11 and 12, the branch electrodes br21a of the electrode sheet ELED3 are located in columns 6, 10, 14, 18, 22, 26, 30, and 34, and the branch electrodes br21b are located in columns 4 and 8. , 12, 16, 20, 24, 28, 32, 36 columns. Since the metal layer MTL2 is located above the metal layer MTL1, based on the foregoing description, it can be known that the positions of the branch electrodes br21a and br21b of the electrode sheet ELED3 are above the position of the long electrode eledL12 of the electrode sheet ELED2. In addition, the electrode sheet ELED2 is used to receive the voltage V2, and the electrode sheet ELED3 is used to receive the voltage V1. Based on this, it can be seen that if the metal layer MTL2 in Figure 15 is placed directly above the metal layer MTL1 in Figure 10, between the upper and lower electrodes of all even-numbered columns in the 4th to 36th columns, a longitudinal direction will be formed. Capacitance Cv2.

The relationship between the metal layer and the electrode sheet described above can be further applied to more metal layers. Figure 16 assumes an example containing four metal layers. In practical applications, the number of metal layers is determined by the number of layers in the semiconductor process itself.

Please refer to FIG. 16, which is a schematic diagram of forming electrode sheets with interlaced electrode patterns on a plurality of metal layers. For ease of description, the electrode positions in the electrode patterns on the respective metal layers mMTL1, mMTL2, mMTL3, and mMTL4 are arranged in the table according to the number of columns. 3. table 3 Received voltage Number of columns 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Metal layer mMTL1 Electrode sheet mELED1 V1 X X X X X X X Electrode sheet mELED2 V2 X X X X X X X Metal layer mMTL2 Electrode sheet mELED3 V1 X X X X X X Electrode sheet mELED4 V2 X X X X X X X X Metal layer mMTL3 Electrode sheet mELED5 V1 X X X X X X X Electrode sheet mELED6 V2 X X X X X X X Metal layer mMTL4 Electrode sheet mELED7 V1 X X X X X X Electrode sheet mELED8 V2 X X X X X X X X

As mentioned above, the electrode plates belonging to different metal layers will form a vertical capacitance, and the electrode plates belonging to the same metal layer will form a planar capacitor. Therefore, when using the electrode pattern design in Figure 16, a planar capacitor Ch is formed between the electrode plates mELED1 and mELED2 of the metal layer mMTL1; a planar capacitor Ch is formed between the electrode plates mELED3 and mELED4 of the metal layer mMTL2; A planar capacitor Ch is formed between the electrode plates mELED5 and mELED6 of the layer mMTL3; and a planar capacitor Ch is formed between the electrode plates mELED7 and mELED8 of the metal layer mMTL4. In addition, a longitudinal capacitance Cv will be formed between the metal layers mMTL1 and mMTL2; a longitudinal capacitance Cv will be formed between the metal layers mMTL2 and mMTL3; and a longitudinal capacitance Cv will be formed between the metal layers mMTL3 and mMTL4.

In the foregoing embodiment, it is assumed that the electrode pieces receiving the voltage V1 all have a similar appearance, and it is assumed that the electrode pieces receiving the voltage V2 all have a similar appearance. That is, the electrode piece ELED1 on the metal layer MTL1 for receiving the voltage V1 and the electrode piece ELED3 on the metal layer MTL2 for receiving the voltage V1 are both composed of an electrode group and a common electrode located in the first column. And, the electrode piece ELED2 on the metal layer MTL1 for receiving the voltage V2 and the electrode piece ELED4 on the metal layer MTL2 for receiving the voltage V2 are both composed of a common electrode and a bent electrode. However, in actual application, it is not necessary to limit that the electrode plates receiving the same voltage should have a similar appearance. For example, in the example shown in FIG. 17, the electrode pieces in the odd-numbered metal layer and the even-numbered metal layer are used to receive the same voltage with different electrode patterns.

Please refer to FIG. 17, which is a schematic diagram of another embodiment in which electrode plates are arranged on two metal layers, and then a capacitance effect is generated according to the capacitance pattern of the electrode plates. For ease of description, the number of columns where the electrodes of the electrode sheets oELED1, oELED2, oELED3, and oELED4 on the respective metal layers oMTL1, oMTL2, oMTL3, and oMTL4 are located are presented in a table. Table 4 Number of columns 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Metal layer oMTL1 Electrode sheet oELED1(V1) X X X X X X X Electrode sheet oELED2(V2) X X X X X X X Metal layer oMTL2 Electrode sheet oELED3(V1) X X X X X X X Electrode sheet oELED4(V2) X X X X X X X

Compared with Figure 4, although the appearance of the electrode patterns of oELED3 and oELED4 on the metal layer MTL2 in Figure 17 is slightly different from the relative position between the electrodes, the design of the electrode pattern of Figure 17 is adopted. In this way, the relationship between the voltages V1 and V2 received by the electrode sheets oELED1, oELED2, oELED3, and oELED4 remains unchanged. That is, on the metal layer oMTL1, the electrode sheet oELED1 still receives the voltage V1, and the electrode sheet oELED2 receives the voltage V2; and, on the metal layer oMTL2, the electrode sheet oELE4 still receives the voltage V2, and the electrode sheet oELED3 receives the voltage. V1. Therefore, the relationship between the formation of the vertical capacitance Cv between the electrode plates of different metal layers and the formation of the planar capacitance Ch between the electrode plates of the same metal layer is still similar to the foregoing description.

In Figure 17, the electrode sheets oELED1 and oELED4 have similar electrode patterns, and the electrode sheets oELED2 and oELED3 have similar electrode patterns. That is, the electrode pattern of the electrode piece (oELED1) receiving the voltage V1 in the metal layer oMTL1 is similar to the electrode pattern of the electrode piece (oELED4) receiving the voltage V2 in the metal layer oMTL2; and, the voltage V2 is received in the metal layer oMTL1 The electrode pattern of the electrode sheet (oELED2) is similar to the electrode pattern of the electrode sheet (oELED3) receiving the voltage V1 in the metal layer oMTL2.

Furthermore, the present disclosure can further change the electrode pattern, for example, further divide it into a plurality of sections in the x-axis direction, and change the number of bent electrodes and electrode groups according to the number of sections. As the number of bent electrodes and electrode groups is different, the arrangement of their relative positions may also change differently. In the following description of dividing the electrode sheet into multiple segments, only a single metal layer is taken as an example. In actual application, the electrode pads on other metal layers must be modified accordingly. How to design the electrode pattern of the multilayer metal layer will not be detailed here.

Please refer to FIG. 18, which is a schematic diagram of an embodiment in which the electrode sheet on the metal layer s2MTL1 includes two sections. The metal layer s2MTL1 includes electrode sheets s2ELED1 and s2ELED2. Hereinafter, the electrode patterns of the electrode sheet s2ELED1 will be described in Figs. 19 and 20, and the electrode patterns of the electrode sheet s2ELED2 will be described in Figs. 21 and 22.

Please refer to Fig. 19, which is a schematic diagram of the electrode sheet s2ELED1 in Fig. 18. The electrode sheet s2ELED1 includes electrode groups s2GP11a, s2GP11b, s2GP11c, and a common electrode s2cmn11. The common electrode s2cmn11 is connected to the electrode groups s2GP11a, s2GP11b, and s2GP11c at the same time.

Please refer to Fig. 20, which is a schematic diagram of the electrode pattern included in the electrode sheet s2ELED1 of Fig. 18. The electrode group s2GP11a includes a main electrode s2M11a and a branch electrode s2br11a; the electrode group s2GP11b includes a main electrode s2M11b and a branch electrode s2br11b; and the electrode group s2GP11c includes a main electrode s2M11c and branch electrodes s2br11c1, s2br11c2. The main electrodes s2M11a, s2M11b, and s2M11c are all parallel to the y-axis direction, and the branch electrodes s2br11a, s2br11b, s2br11c1, and s2br11c2 are all parallel to the x-axis.

The electrode groups s2GP11a and s2GP11b have a flat comb shape. Its composition is similar to that of the electrode groups GP11a and GP11b in Figure 7, so it will not be described in detail. On the other hand, the electrode group s2GP11c has a fishbone shape. Since the electrode group s2GP11c includes branch electrodes s2br11c1 and s2br11c2 on both sides of the main electrode s2M11c, the number of branch electrodes s2br11c1 and s2br11c2 included in the electrode group s2GP11c is larger than the number of branch electrodes s2br11a included in the electrode group s2GP11a, which is also greater than the electrode group. The s2GP11b includes a large number of branch electrodes s2br11b. In addition, the common electrode s2cmn11 is parallel to the x-axis direction. The two ends of the common electrode s2cmn11 are respectively connected to the main electrodes s2M11a and s2M11b, and the middle of the common electrode s2cmn11 is connected to the main electrode s2M11c.

Please refer to Fig. 21, which is a schematic diagram of the electrode sheet s2ELED2 in Fig. 18. The electrode sheet s2ELED2 includes a common electrode s2cmn12 and bent electrodes s2bnd12a and s2bnd12b.

Please refer to Fig. 22, which is a schematic diagram of the electrode pattern included in the electrode sheet s2ELED2 of Fig. 18. The common electrode s2cmn12 is parallel to the x-axis direction, and the bent electrodes s2bnd12a and s2bnd12b have similar shapes and are symmetrical (mirror images) to each other. Therefore, the number of the long electrodes s2bnd12aL of the bent electrode s2bnd12a is equal to the number of the long electrodes s2bnd12bL of the bent electrode s2bnd12b. In addition, the number of short electrodes s2bnd12aSa of the bent electrode s2bnd12a is equal to the number of short electrodes s2bnd12bSb of the bent electrode s2bnd12b; and the number of short electrodes s2bnd12aSb of the bent electrode s2bnd12a is equal to the number of short electrodes s2bnd12bSa of the bent electrode s2bnd12b.

After combining the electrode sheet s2ELED1 of FIG. 19 and the electrode sheet s2ELED2 of FIG. 21, the metal layer s2MTL1 shown in FIG. 18 can be obtained. The main electrode s2M11c divides the metal layer s2MTL into two sections. The electrode patterns of the electrode sheet s2ELED1 in the section x=1 and the section x=2 are mirror images of each other, and the electrode patterns of the electrode sheet s2ELED2 in the section x=1 and the section x=2 are also mirror images of each other.

Please refer to FIG. 23, which is a schematic diagram of another embodiment in which the electrode sheet on the metal layer s2MTL1' includes two sections. The metal layer s2MTL1' includes electrode sheets s2ELED1' and s2ELED2'. Hereinafter, the electrode patterns of the electrode sheet s2ELED1' will be described in Figs. 24 and 25, and the electrode patterns of the electrode sheet s2ELED2' will be described in Figs. 26 and 27.

Please refer to Fig. 24, which is a schematic diagram of the electrode sheet s2ELED1' of Fig. 23. The electrode sheet s2ELED1' includes electrode groups s2GP11a', s2GP11b', s2GP11c', and a common electrode s2cmn11'.

Please refer to Fig. 25, which is a schematic diagram of the electrode pattern included in the electrode sheet s2ELED1' of Fig. 23. The electrode group s2GP11a’ includes a main electrode s2M11a’ and a branch electrode s2br11a’; the electrode group s2GP11b’ includes a main electrode s2M11b’ and a branch electrode s2br11b’; and the electrode group s2GP11c’ includes a main electrode s2M11c’ and branch electrodes s2br11c1’, s2br11c2’. The main electrodes s2M11a', s2M11b', and s2M11c' are all parallel to the y-axis direction, while the branch electrodes s2br11a', s2br11b', s2br11c1', and s2br11c2' are all parallel to the x-axis.

The electrode groups s2GP11'a and s2GP11b' have a flat comb shape. Its composition is similar to that of the electrode groups GP21a and GP21b in Fig. 11, so it will not be described in detail. On the other hand, the electrode group s2GP11c' has a fishbone shape. Since the electrode group s2GP11c' includes branch electrodes s2br11c1' and s2br11c2' on both sides of the main electrode s2M11c', the number of branch electrodes s2br11c1' and s2br11c2' included in the electrode group s2GP11c' is greater than the number of branch electrodes s2br11a included in the electrode group s2GP11a' The number of ′′ is larger than that of the branch electrode s2br11b′ included in the electrode group s2GP11b′. In addition, the common electrode s2cmn11' is parallel to the x-axis direction. The two ends of the common electrode s2cmn11' are respectively connected to the main electrodes s2M11a' and s2M11b', and the middle of the common electrode s2cmn11' is connected to the main electrode s2M11c'.

Please refer to Fig. 26, which is a schematic diagram of the electrode sheet s2ELED2' of Fig. 23. The electrode sheet s2ELED2' includes a common electrode s2cmn12' and bent electrodes s2bnd12a' and s2bnd12b'.

Please refer to Fig. 27, which is a schematic diagram of the electrode pattern included in the electrode sheet ELED2 of Fig. 23. The common electrode s2cmn12' is parallel to the x-axis, and the bent electrodes s2bnd12a' and s2bnd12b' have the same shape and are arranged parallel to each other. Therefore, the number of long electrodes s2bnd12aL' of the bent electrode s2bnd12a' is equal to the number of long electrodes s2bnd12bL' of the bent electrode s2bnd12b'. In addition, the number of short electrodes s2bnd12aSa' of the bent electrode s2bnd12a' is equal to the number of short electrodes s2bnd12bSa' of the bent electrode s2bnd12b'; and the number of short electrodes s2bnd12aSb' of the bent electrode s2bnd12a' is equal to the number of short electrodes s2bnd12b'. The number of electrodes s2bnd12bSb'.

After combining the electrode sheet s2ELED1' of FIG. 24 and the electrode sheet s2ELED2' of FIG. 26, the metal layer s2MTL1' shown in FIG. 23 can be obtained. The main electrode s2M11c' divides the metal layer s2MTL1' into two sections. The electrode pattern of the electrode sheet s2ELED1' in the section x=1 and the section x=2 is the same, and the electrode pattern of the electrode sheet s2ELED2' in the section x=1 and the section x=2 is also the same.

Please refer to FIG. 28, which is a schematic diagram of an embodiment in which the electrode sheet on the metal layer s4MTL1 includes four sections. The metal layer s4MTL1 includes electrode sheets s4ELED1 and s4ELED2. The electrode sheet s4ELED1 includes 4 electrode groups and a common electrode, and the electrode sheet s4ELED2 includes a common electrode and 4 bent electrodes. Among them, the electrode patterns of section x=1 and section x=2 are mirror images of each other; the electrode patterns of section x=3 and section x=4 are mirror images of each other. In addition, the electrode patterns of the two sections on the left (x=1 and x=2) and the electrode patterns of the two sections on the right (x=3 and x=4) are mirror images of each other.

Please refer to FIG. 29, which is a schematic diagram of another embodiment in which the electrode sheet on the metal layer s4MTL1' includes four sections. The metal layer s4MTL1' includes electrode pieces s4ELED1' and s4ELED2'. The electrode sheet s4ELED1' includes 4 electrode groups and a common electrode, and the electrode sheet s4ELED2' includes a common electrode and 4 bent electrodes. Among them, the electrode patterns of each section x=1, 2, 3, and 4 are all the same.

According to the foregoing description, the relationship between the number of sections (X) included in the electrode sheet and the number of electrode groups, common electrodes, and bent electrodes can be summarized as shown in Table 5. table 5 Number of sections (X) Electrode sheet ELED1 Electrode sheet ELED2 Electrode group Common electrode Common electrode Bend electrode X=1 (Pictures 6-15) 2 Left: Flat comb type Right: Flat comb type 1 1 1 X=2 (Pictures 18-27) 3 Left: Flat comb type Right: Flat comb type Middle: Fishbone type 1 1 2 X=4 (pictures 28 and 29) 5 Left: Flat comb type Right: Flat comb type Middle: Fishbone type*2 1 1 4

When the number of sections increases, the number of electrode groups included in the electrode sheet and the number of bent electrodes also increase. Assuming that it is divided into X sections, the electrode sheet ELED1 includes (X+1) electrode groups, and the electrode sheet ELED2 includes X bent electrodes. In addition, the number of common electrodes included in the electrode sheets ELED1 and ELED2 does not vary with the number of segments, and always includes one common electrode. As mentioned above, when the number of sections included in the electrode pads on the metal layer MTL1 changes, the electrode pads on other metal layers also need to be modified accordingly. The modification of this part is an application change and will not be detailed here.

In summary, the present disclosure provides a method for designing the electrode pattern of the idle metal layer, so that the electrode pads on the metal layer form a parasitic capacitance effect. This method of changing the electrode patterns of the electrode pieces ELED1 and ELED2 on the metal layer MTL1 and the electrode pieces ELED3 and ELED4 on the metal layer MTL2 can provide a metal capacitor C_MET in parallel with the transistor capacitor C_MOS. Since the idle metal layer is used and the characteristics of the parasitic capacitance between the metal layers are directly used, the method disclosed in the present disclosure can effectively increase the capacitance value of the boost capacitor Cb without occupying an additional circuit.

In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

10: Charge pump voltage doubler circuit Vdd: power supply voltage Vout: output voltage Clk, Clkb: clock signal Clkd: clock drive signal 10a: charge pump Vb: boost voltage Cb: Boost capacitor V1, V2: voltage C_MOS: Transistor capacitance 31a, 31c: polysilicon layer 31b: Diffusion layer C_MET: Metal capacitor ELED1, ELED2, ELED3, ELED4, mELED1, mELED2, mELED3, mELED4, mELED5, mELED6, mELED7, mELED8, oELED1, oELED2, oELED3, oELED4, s2ELED1, s2ELED2', ELED2', ELED1's4 ': electrode sheet MTL,MTL1,MTL2,mMTL1,mMTL2,mMTL3,mMTL4, oMTL1,oMTL2,s2MTL1,s2MTL1’,s4MTL1,s4MTL1’:Metal layer Ch, Ch1, Ch2: Planar capacitance Cv1, Cv2: longitudinal capacitance cmn11, cmn12, cmn21, cmn22, s2cmn11, s2cmn12, s2cmn11’,s2cmn12’: common electrode GP11a,GP11b,GP21a,GP21b,s2GP11a,s2GP11b, s2GP11c,s2GP11a’,s2GP11b’,s2GP11c’: Electrode group M11a,M11b,M21a,M21b,s2M11a,s2M11c,s2M11b, s2M11a’,s2M11c’,s2M11b’: main electrode br11a,br11b,b21a,b21b,s2br11a,s2br11c1,s2br11c2,s2br11b, s2br11a’,s2br11c1’,s2br11c2’,s2br11b’: branch electrode bnd12,bnd22,s2bnd12a,s2bnd12b,s2bnd12a’,s2bnd12b’: bending electrode eledL12,eledL22,s2bnd12aL,s2bnd12bL,s2bnd12aL’,s2bnd12bL’: long electrode eledS12a,eledS12b,eledS22a,eledS22b,s2bnd12aSa,s2bnd12aSb,sbnd12bSa,s2bnd12bSb,s2bnd12aSa’,s2bnd12aSb’,sbnd12bSa’,s2bnd12bSb’: Short electrodes

Figure 1 is a schematic diagram of a charge pump voltage doubler circuit. Figure 2 is a schematic diagram of connecting the metal capacitor C_MET and the transistor capacitor C_MOS in parallel. Figure 3 is a schematic diagram of using the metal layer above the transistor capacitor to form an electrode pattern. FIG. 4 is a schematic diagram of an embodiment in which electrode plates are arranged on two metal layers, and then a capacitance effect is generated according to the capacitance pattern of the electrode plates. Figures 5A, 5B, 5C, and 5D are schematic diagrams showing that the electrode plates on the two metal layers form mutual capacitance with each other. Figure 6 is a schematic diagram of the electrode sheet ELED1. Figure 7 is a schematic diagram of the electrode pattern included in the electrode sheet ELED1. Figure 8 is a schematic diagram of the electrode sheet ELED2. Figure 9 is a schematic diagram of the electrode pattern included in the electrode sheet ELED2. Fig. 10 is a schematic diagram of the metal layer MTL1 composed of the electrode sheet ELED1 of Fig. 6 and the electrode sheet ELED2 of Fig. 8. Figure 11 is a schematic diagram of the electrode sheet ELED3. Figure 12 is a schematic diagram of the electrode pattern included in the electrode sheet ELED3. Figure 13 is a schematic diagram of the electrode sheet ELED4. Figure 14 is a schematic diagram of the electrode pattern included in the electrode sheet ELED4. FIG. 15 is a schematic diagram of the metal layer MTL2 composed of the electrode sheet ELED3 of FIG. 11 and the electrode sheet ELED4 of FIG. 13. FIG. 16 is a schematic diagram of forming electrode sheets with interlaced electrode patterns on a plurality of metal layers. FIG. 17 is a schematic diagram of another embodiment in which electrode plates are arranged on two metal layers, and the capacitance effect is generated according to the capacitance pattern of the electrode plates. FIG. 18 is a schematic diagram of an embodiment in which the electrode sheet on the metal layer s2MTL1 includes two sections. Fig. 19 is a schematic diagram of the electrode sheet s2ELED1 of Fig. 18. Fig. 20 is a schematic diagram of the electrode pattern included in the electrode sheet s2ELED1 of Fig. 18. Fig. 21 is a schematic diagram of the electrode sheet s2ELED2 of Fig. 18. Fig. 22 is a schematic diagram of the electrode pattern included in the electrode sheet s2ELED2 of Fig. 18. FIG. 23 is a schematic diagram of another embodiment in which the electrode sheet on the metal layer s2MTL1' includes two sections. Fig. 24 is a schematic diagram of the electrode sheet s2ELED1' of Fig. 23. Fig. 25 is a schematic diagram of the electrode pattern included in the electrode sheet s2ELED1' of Fig. 23. Fig. 26 is a schematic diagram of the electrode sheet s2ELED2' of Fig. 23. Fig. 27 is a schematic diagram of the electrode pattern included in the electrode sheet s2ELED2' of Fig. 23. FIG. 28 is a schematic diagram of an embodiment in which the electrode sheet on the metal layer s4MTL1 includes four sections. Fig. 29 is a schematic diagram of another embodiment in which the electrode sheet on the metal layer s4MTL1' includes four sections.

C_MOS: Transistor capacitance

31a, 31c: polysilicon layer

31b: Diffusion layer

C_MET: Metal capacitor

ELED1, ELED2: electrode sheet

MTL: Metal layer

Claims (10)

A metal capacitor, including: A first metal layer, disposed on a substrate, includes: A first electrode sheet; and A second electrode sheet, in which a first planar capacitor is formed between the first electrode sheet and the second electrode sheet; and A second metal layer, disposed above the first metal layer, includes: A third electrode sheet; and A fourth electrode sheet, wherein a second planar capacitor is formed between the third electrode sheet and the fourth electrode sheet, wherein, At least a part of the fourth electrode sheet is located above the first electrode sheet, and a first longitudinal capacitor is formed between the first electrode sheet and the fourth electrode sheet, and At least a part of the third electrode sheet is located above the second electrode sheet, and a second longitudinal capacitor is formed between the second electrode sheet and the third electrode sheet. The metal capacitor according to claim 1, wherein the first electrode sheet includes: A first common electrode, parallel to a first direction; A first electrode group, including: A first main electrode, parallel to a second direction, which is connected to the first common electrode; and, A plurality of first branch electrodes are parallel to the first direction, wherein each of the first branch electrodes includes a first end and a second end, and the first end of each first branch electrode and the first main The electrodes are connected; and A second electrode group, including: A second main electrode, parallel to the second direction, which is connected to the first common electrode; and, A plurality of second branch electrodes are parallel to the first direction, wherein each of the second branch electrodes includes a first end and a second end, and the second end of each second branch electrode and the second main The electrodes are connected, The second ends of the first branch electrodes face the second main electrode, and the first ends of the second branch electrodes face the first main electrode. The metal capacitor according to claim 2, wherein the second electrode sheet includes: A second common electrode, parallel to the first direction; A first bending electrode, including: A plurality of long electrodes parallel to the first direction and juxtaposed along the second direction, wherein each of the long electrodes has a first end and a second end; and A plurality of short electrodes parallel to the second direction, wherein a first short electrode of the short electrodes is connected to the second common electrode, The positions of the short electrodes of the first bent electrode of a first part in the first direction are aligned with each other, and the short electrodes of the first bent electrode of a second part are in the first direction. The positions in the direction are aligned with each other, and the positions of the short electrodes of the first bending electrode in the second direction are staggered with each other, The short electrodes of the first bent electrode of the first part are connected to the first ends of the long electrodes of the first bent electrode, and the first bent electrode of the second part The short electrodes of the electrode are connected to the second ends of the long electrodes of the first bent electrode. The metal capacitor according to claim 3, wherein the third electrode sheet includes: A third common electrode, parallel to the first direction; A third electrode group, including: A third main electrode, parallel to the second direction, which is connected to the third common electrode; and, A plurality of third branch electrodes are parallel to the first direction, wherein each of the third branch electrodes includes a first end and a second end, and the first end of each third branch electrode and the third main The electrodes are connected; and A fourth electrode group, including: A fourth main electrode, parallel to the second direction, which is connected to the third common electrode; and, A plurality of fourth branch electrodes are parallel to the first direction, wherein each of the fourth branch electrodes includes a first end and a second end, and the second end of each fourth branch electrode and the fourth main The electrodes are connected, The second ends of the third branch electrodes face the fourth main electrode, and the first ends of the fourth branch electrodes face the third main electrode. The metal capacitor according to claim 4, wherein the fourth electrode sheet includes: A fourth common electrode, parallel to the first direction; and A third bending electrode, including: A plurality of long electrodes parallel to the first direction and juxtaposed along the second direction, wherein each of the long electrodes has a first end and a second end; and A plurality of short electrodes parallel to the second direction, wherein a first short electrode of the short electrodes of the third bent electrode is connected to the fourth common electrode, The positions of the short electrodes of the third bent electrode of a first part in the first direction are aligned with each other, and the short electrodes of the third bent electrode of a second part are in the first direction. The positions in the direction are aligned with each other, and the positions of the short electrodes of the third bending electrode in the second direction are staggered with each other, The short electrodes of the third bent electrode of the first part are connected to the first ends of the long electrodes of the third bent electrode, and the third bent electrode of the second part The short electrodes of the electrode are connected to the second ends of the long electrodes of the third bent electrode. The metal capacitor according to claim 1, wherein: The first electrode sheet and the third electrode sheet receive a first voltage; and The second electrode sheet and the fourth electrode sheet receive a second voltage, The first planar capacitor, the second planar capacitor, the first longitudinal capacitor and the second longitudinal capacitor are connected in parallel with each other. A metal capacitor, including: At least one metal layer, which is disposed above a transistor capacitor, includes: A first electrode sheet, which receives a first voltage; and A second electrode sheet receives a second voltage. The metal capacitor according to claim 7, wherein the at least one metal layer includes: A first metal layer; and A second metal layer, Wherein, a first planar capacitor is formed between the first electrode plate of the first metal layer and the second electrode plate of the first metal layer, and a second planar capacitor is formed on the first electrode plate of the second metal layer. Between an electrode sheet and the second electrode sheet of the second metal layer, wherein At least a part of the second electrode piece of the second metal layer is located above the position of the first electrode piece of the first metal layer, and a first vertical capacitor is formed on the first electrode piece of the first metal layer Between an electrode sheet and the second electrode sheet of the second metal layer, and, At least a part of the first electrode piece of the second metal layer is located above the position of the second electrode piece of the first metal layer, and a second vertical capacitor is formed on the first metal layer of the first metal layer. Between the two electrode sheets and the first electrode sheet of the second metal layer, The first planar capacitor, the second planar capacitor, the first longitudinal capacitor and the second longitudinal capacitor are connected in parallel with each other. The metal capacitor according to claim 8, wherein The first electrode sheet of the first metal layer has a first electrode pattern, the second electrode sheet of the first metal layer has a second electrode pattern, and the first electrode sheet of the second metal layer has a first electrode pattern. A three-electrode pattern, and the second electrode sheet of the second metal layer has a fourth electrode pattern, wherein The plurality of electrodes included in the first electrode pattern and the plurality of electrodes included in the second electrode pattern are arranged alternately, and the plurality of electrodes included in the third electrode pattern are arranged with the plurality of electrodes included in the fourth electrode pattern. The electrodes are arranged alternately, The first electrode pattern is similar to the third electrode pattern, and the second electrode pattern is similar to the fourth electrode pattern. The metal capacitor according to claim 8, wherein The first electrode sheet of the first metal layer has a first electrode pattern, the second electrode sheet of the first metal layer has a second electrode pattern, and the first electrode sheet of the second metal layer has a first electrode pattern. A three-electrode pattern, and the second electrode sheet of the second metal layer has a fourth electrode pattern, wherein The plurality of electrodes included in the first electrode pattern and the plurality of electrodes included in the second electrode pattern are arranged alternately, and the plurality of electrodes included in the third electrode pattern are arranged with the plurality of electrodes included in the fourth electrode pattern. The electrodes are arranged alternately, The first electrode pattern is similar to the fourth electrode pattern, and the second electrode pattern is similar to the third electrode pattern.

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