TW202126976A - Vapor chamber without degassing tube and method for manufacturing the same - Google Patents
Vapor chamber without degassing tube and method for manufacturing the same Download PDFInfo
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本發明係涉及一種均溫板;特別是指一種無除氣管之均溫板及製造該無除氣管之均溫板的方法之創新技術揭示者。The present invention relates to a uniform temperature plate; in particular, it refers to an innovative technology revealer of a uniform temperature plate without a degassing pipe and a method for manufacturing the uniform temperature plate without a degassing pipe.
均溫板是一種用於傳遞熱能的導熱構造,包括彼此相接的一基板及一蓋板,該基板與該蓋板之間形成一封閉的腔室,該腔室的內部設有工作流體,藉由該工作流體的相變化,而可快速地吸收並導引熱能。The uniform temperature plate is a heat conduction structure for transferring heat energy. It includes a base plate and a cover plate that are connected to each other. A closed chamber is formed between the base plate and the cover plate, and a working fluid is provided in the chamber. With the phase change of the working fluid, heat energy can be quickly absorbed and guided.
該基板與該蓋板對合相接後,欲對該腔室填入該工作流體時,需要利用一除氣管與該腔室連通,透過該除氣管對該腔室填入該工作液體,並抽取留存於該腔室的空氣,使該腔室形成中空狀態,而後再利用壓合、焊接等製程阻斷該腔室與該除氣管的連通,最後再切除該除氣管使該均溫板的外部整體形狀呈現平整無凸出的狀態。After the substrate and the cover plate are butted and connected, when the chamber is to be filled with the working fluid, a degassing tube is required to communicate with the chamber, and the chamber is filled with the working fluid through the degassing tube, and The air remaining in the chamber is extracted to form a hollow state, and then the communication between the chamber and the degassing pipe is blocked by pressing, welding, etc., and finally the degassing pipe is cut off to make the temperature equalizing plate The overall shape of the exterior is flat and without protrusions.
查,習知均溫板於實際應用經驗中發現仍舊存在下述問題與缺弊:習知均溫板需要額外設置該除氣管,在該腔室注水除氣完成後,在該腔室封閉狀態下切除該除氣管外凸於均溫板的周緣外部的部份,並對該除氣管施以各種保護措施,避免該除氣管日後受到外界異物的破壞,如此使得習知均溫板的整體構成複雜。It is found that the following problems and shortcomings still exist in the actual application experience of the conventional temperature equalizing plate: the conventional equalizing temperature plate needs to be additionally provided with the degassing pipe, and after the water injection and degassing of the chamber is completed, the chamber is closed. The part of the degassing pipe protruding outside the periphery of the temperature equalizing plate is cut down, and various protective measures are applied to the degassing pipe to prevent the degassing pipe from being damaged by foreign objects in the future, so that the overall structure of the conventional temperature equalizing plate complex.
是以,針對上述習知均溫板技術所存在之問題點,如何研發出一種能夠更具理想實用性之創新技術,實有待相關業界再加以思索突破之目標及方向者;有鑑於此,發明人本於多年從事相關產品之製造開發與設計經驗,針對上述之目標,詳加設計與審慎評估後,終得一確具實用性之本發明。Therefore, in view of the problems of the above-mentioned conventional uniform temperature plate technology, how to develop an innovative technology that can be more ideal and practical is really awaiting the relevant industry to think about the goal and direction of the breakthrough; in view of this, the invention is invented With many years of experience in manufacturing, development and design of related products, human-centered people, after detailed design and careful evaluation for the above goals, finally came up with a practical invention.
本發明之主要目的,係在提供一種無除氣管之均溫板及製造該無除氣管之均溫板的方法,其所欲解決之技術問題,係針對如何研發出一種更具理想實用性之新式均溫板及製造該均溫板的方法為目標加以思索創新突破。The main purpose of the present invention is to provide a uniform temperature plate without degassing pipe and a method for manufacturing the uniform temperature plate without degassing pipe. The technical problem to be solved is how to develop a more ideal and practical The goal is to think about and make breakthroughs in the new-type uniform temperature plate and the method of manufacturing the uniform temperature plate.
基於前述目的,本發明解決問題之技術特點,主要在於該無除氣管之均溫板係包括:Based on the foregoing objectives, the technical feature of the present invention to solve the problem is mainly that the uniform temperature plate without degassing tube includes:
一第一板,該第一板於周緣形成一環牆;A first board, the first board forms a ring wall at the periphery;
一第二板,該第二板與該第一板相對,且該第二板與該環牆相接;以及A second board, the second board is opposite to the first board, and the second board is connected to the ring wall; and
一腔室,該腔室形成於該第一板與該第二板之間,且該腔室限制於該環牆的內緣,該腔室用於容設工作流體;A chamber, the chamber is formed between the first plate and the second plate, and the chamber is limited to the inner edge of the ring wall, and the chamber is used to contain a working fluid;
該第一板於該腔室的範圍向該第二板方向形成一接座,該接座與該第二板相接,該接座頂緣凹陷一流道,該流道的一端為第一端與該腔室連通,該流道的另一端形成一閉塞部,據此封閉該腔室。The first plate forms a socket in the direction of the second plate in the range of the cavity, the socket is connected with the second plate, the top edge of the socket is recessed in a flow channel, and one end of the flow channel is the first end In communication with the chamber, the other end of the flow channel forms a blocking part, thereby closing the chamber.
本發明之主要效果與優點,係能夠不需要設置除氣管,也就不需要對該除氣管施以保護措施,該無除氣管之均溫板整體構成精簡,製造該均溫板的方法容易執行且可靠度高。The main effects and advantages of the present invention are that there is no need to set up a degassing pipe, and there is no need to apply protective measures to the degassing pipe. The overall structure of the uniform temperature plate without degassing pipe is simplified, and the method of manufacturing the uniform temperature plate is easy to implement And the reliability is high.
請參閱第1圖至第9圖所示,係本發明無除氣管之均溫板及製造該無除氣管之均溫板的方法之實施例,惟此等實施例僅供說明之用,在專利申請上並不受此實施例之限制。Please refer to Figures 1 to 9, which are the embodiments of the uniform temperature plate without degassing pipe and the method for manufacturing the uniform temperature plate without degassing pipe of the present invention. However, these embodiments are for illustrative purposes only. The patent application is not limited by this embodiment.
如第1圖至第3圖所示,所述無除氣管之均溫板的較佳實施例,包括一第一板10、一第二板20及一腔室30,其中該第一板10於周緣形成一環牆12,該第二板20與該第一板10相對,且該第二板20與該環牆12相接,該腔室30形成於該第一板10與該第二板20之間,且該腔室30限制於該環牆12的內緣,該腔室30用於容設工作流體(圖中未示)。As shown in Figures 1 to 3, the preferred embodiment of the temperature equalizing plate without degassing tube includes a
該第一板10於該腔室30的範圍向該第二板20方向形成一接座14,該接座14與該第二板20相接,該接座14頂緣凹陷一流道16,該流道16的一端為第一端162與該腔室30連通,該流道16的另一端形成一閉塞部34,據此封閉該腔室30。The
該腔室30的內部可視需要設有數個支柱32,各該支柱32分別與該第一板10及該第二板20相接。A number of
如第4圖至第8圖所示,製造前述無除氣管之均溫板的方法,包括下列步驟:As shown in Figures 4 to 8, the method of manufacturing the aforementioned uniform temperature plate without degassing tube includes the following steps:
第一板及第二板製備:選用熱傳導率高的金屬板材成型一第一板10及一第二板20,且該第一板10形成一環牆12及一接座14,該環牆12形成於該第一板10的周緣,該接座14形成於該環牆12所圍設形成空間的範圍內,該接座14凹陷一流道16,該流道16的一端為第一端162延伸於該接座14的外緣,該流道16的另一端為第二端166;該第二板20貫穿一注孔24。Preparation of the first board and the second board: a
疊合:該第一板10與該第二板20對合,且該第二板20的周緣與該環牆12相靠,據使該第一板10與該第二板20之間形成一腔室30,該流道16於該第一端162與該腔室30連通,該流道16之該第二端166延伸與該注孔24連通,據使該腔室30通過該流道16及該注孔24與外界連通。Overlapping: the
全周封邊:該環牆12與該第二板20氣密結合;該環牆12可選擇利用熱壓熔接或硬焊或其他類似的手段與該第二板20氣密結合,且該環牆12與該第二板20氣密結合後,該腔室30僅能通過該流道16及該注孔24與外界連通。Full-peripheral edge sealing: the
注液除氣:通過該注孔24及該流道16對該腔室30注入工作流體(圖中未示),並通過該注孔24及該流道16除去該腔室30內部的空氣,使該腔室30形成真空狀態;注液除氣步驟可於真空環境下進行,使該腔室30內部處於真空狀態的條件下,對該腔室30注入該工作流體。以及Liquid injection and degassing: inject working fluid (not shown in the figure) into the
封閉:對該接座14及該第二板20與該接座14相鄰的部份施以熔焊加工,使該接座14與該第二板20結合,並阻斷該流道16及該注孔24連通的部份,使該流道16指向該第二端166的部份封閉形成如第8圖所示的一閉塞部34,據此封閉該腔室30。Sealing: fusion welding is applied to the
如第8圖所示,該封閉步骤可選擇利用一模頭40壓靠該第二板20,且該模頭40與該注孔24相對,使該第二板20於該注孔24周圍的部份及該接座14於該第二端166周圍的部份熔融結合形成該閉塞部34,該閉塞部34填塞該注孔24及該流道16的一部份,藉此封閉該腔室30,且該第二板20的外部由於該模頭40的壓靠而形成一凹口22。As shown in Figure 8, the sealing step can choose to use a
該封閉步驟可選擇利用金屬超音波熔接法使該接座14與該第二板20結合,並於該接座14與該第二板20結合的同時,阻斷該流道16及該注孔24連通的部份,使該流道16指向該第二端166的部份封閉形成該閉塞部34;該封閉步驟亦可選擇利用電阻焊接法使該接座14與該第二板20結合,並於該接座14與該第二板20結合的同時,形成如第3圖所示的形成該閉塞部34阻斷該流道16,使該流道16指向該第二端166的部份封閉。In the sealing step, a metal ultrasonic welding method can be used to combine the
該封閉步驟中,阻斷該流道16後,可視需要進一步利用雷射焊接法封合該凹口22,藉此使該凹口22被完全填補而消失,藉此進一步提高封閉該腔室30的可靠度。In the sealing step, after the
再者,該第一板及第二板製備步驟中,數個支柱32成型於該第一板10,且各該支柱32位於形成該環牆12及該接座14的同側(如第5圖及第6圖所示),該全周封邊步驟中,各該支柱32分別與該第二板20結合;本發明亦可視需要,選擇於該第一板及第二板製備步驟中,使數個支柱(圖中未示)成型於該第二板20,且該全周封邊步驟中,各該支柱分別與該第一板10結合。Furthermore, in the steps of preparing the first board and the second board, a plurality of
藉由上述結構組成型態與技術特徵,本發明所述無除氣管之均溫板不需要額外設置除氣管,於該腔室30的範圍內形成該流道16配合該注孔24,即可提供作為空氣流出形成真空及該工作流體注入的路徑,待該注液除氣步驟完成後,再利用熔焊加工手段,使該接座14與該第二板20結合的同時,阻斷該流道16及該注孔24連通的部份形成該閉塞部34,使該流道16指向該第二端166的部份封閉,即可封閉該腔室30,本發明既不需要設置除氣管,也就不需要對該除氣管施以保護措施,本發明之無除氣管之均溫板的整體構成精簡,該無除氣管之均溫板的製造方法容易執行且可靠度高。With the above-mentioned structural composition and technical features, the temperature equalizing plate without degassing pipe of the present invention does not need to be additionally provided with a degassing pipe, and the
復如第1圖至第3圖所示,本例中,該第二板20於外部形成一凹口22,該凹口22於指向該第一板10的一端形成封閉,且該凹口22指向該第一板10的方向與該流道16指向該閉塞部34的延伸方向形成相交,該閉塞部34形成於該凹口22與該流道16之間,據此封閉該腔室30;該接座14可選擇與該環牆12一體相連。As shown in Figures 1 to 3, in this example, the
如第9圖所示,另一實施例主要不同於較佳實施例之構成在於,該接座14形成於該腔室30的內部,且該接座14與該環牆12分離。As shown in FIG. 9, another embodiment is mainly different from the preferred embodiment in that the
10:第一板 12:環牆 14:接座 16:流道 162:第一端 166:第二端 20:第二板 22:凹口 24:注孔 30:腔室 32:支柱 34:閉塞部 40:模頭 2:流道與腔室連通部份放大表示於第2圖 6:流道的第一端的部份放大表示於第6圖10: The first board 12: Ring wall 14: Socket 16: runner 162: first end 166: second end 20: second board 22: Notch 24: Note hole 30: Chamber 32: Pillar 34: Occlusion 40: Die head 2: The connecting part of the flow channel and the chamber is enlarged and shown in Figure 2 6: The enlarged part of the first end of the runner is shown in Figure 6
第1圖係本發明無除氣管之均溫板的較佳實施例的立體圖。 第2圖係第1圖之流道與腔室連通部份的部份放大圖。 第3圖係本發明無除氣管之均溫板的較佳實施例於流道部份的部份剖視圖。 第4圖係本發明製造無除氣管之均溫板的方法的流程圖。 第5圖係本發明製造無除氣管之均溫板的方法的第一板與第二板之立體分解圖。 第6圖係第5圖之流道的第一端的部份放大圖。 第7圖係本發明製造無除氣管之均溫板的方法的第一板與第二板疊合狀態之立體圖。 第8圖係本發明製造無除氣管之均溫板的方法的封閉步驟之操作狀態的部份剖視圖。 第9圖係本發明無除氣管之均溫板的另一實施例的俯視圖。Figure 1 is a perspective view of a preferred embodiment of the uniform temperature plate without degassing pipes of the present invention. Figure 2 is a partial enlarged view of the connecting portion between the flow channel and the chamber in Figure 1. Fig. 3 is a partial cross-sectional view of the flow channel part of the preferred embodiment of the temperature equalizing plate without degassing pipe of the present invention. Fig. 4 is a flow chart of the method of manufacturing the uniform temperature plate without degassing pipe according to the present invention. Fig. 5 is a perspective exploded view of the first plate and the second plate of the method for manufacturing the uniform temperature plate without degassing pipes according to the present invention. Figure 6 is a partial enlarged view of the first end of the runner in Figure 5. Fig. 7 is a perspective view of the superimposed state of the first plate and the second plate in the method of manufacturing the uniform temperature plate without degassing pipes according to the present invention. Fig. 8 is a partial cross-sectional view of the operation state of the closing step of the method of manufacturing the uniform temperature plate without degassing pipe according to the present invention. Figure 9 is a top view of another embodiment of the temperature equalizing plate without degassing pipes according to the present invention.
10:第一板10: The first board
12:環牆12: Ring wall
14:接座14: Socket
16:流道16: runner
162:第一端162: first end
20:第二板20: second board
22:凹口22: Notch
32:支柱32: Pillar
34:閉塞部34: Occlusion
2:流道與腔室連通部份放大表示於第2圖2: The connecting part of the flow channel and the chamber is enlarged and shown in Figure 2
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