TW202126976A - Vapor chamber without degassing tube and method for manufacturing the same - Google Patents

Vapor chamber without degassing tube and method for manufacturing the same Download PDF

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TW202126976A
TW202126976A TW109101191A TW109101191A TW202126976A TW 202126976 A TW202126976 A TW 202126976A TW 109101191 A TW109101191 A TW 109101191A TW 109101191 A TW109101191 A TW 109101191A TW 202126976 A TW202126976 A TW 202126976A
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Taiwan
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plate
chamber
flow channel
socket
board
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TW109101191A
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Chinese (zh)
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何信威
張中彥
葉肇皓
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威銓博科技股份有限公司
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Priority to TW109101191A priority Critical patent/TW202126976A/en
Publication of TW202126976A publication Critical patent/TW202126976A/en

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Abstract

The invention provides a vapor chamber without degassing tube and method for manufacturing the same. The vapor chamber without degassing tube includes a first plate, a second plate, and a chamber. The first plate forms a ring wall, and the second plate is opposite to the first plate. The second plate is connected to the ring wall, and the chamber is formed between the first plate and the second plate. The chamber is limited to the inner edge of the ring wall, and the first plate forms a connecting seat which is connected with the second plate. The connecting seat is recessed in a channel. One end of the channel communicates with the chamber, and the other end of the channel forms an occlusion portion, thereby closing the chamber. The present invention does not need to provide a degassing tube, and the overall structure of the vapor chamber without degassing tube is quite simple, and the method for manufacturing the vapor chamber without degassing tube is easy to implement and reliable.

Description

無除氣管之均溫板及製造該均溫板的方法Temperature equalizing plate without degassing pipe and method for manufacturing the same

本發明係涉及一種均溫板;特別是指一種無除氣管之均溫板及製造該無除氣管之均溫板的方法之創新技術揭示者。The present invention relates to a uniform temperature plate; in particular, it refers to an innovative technology revealer of a uniform temperature plate without a degassing pipe and a method for manufacturing the uniform temperature plate without a degassing pipe.

均溫板是一種用於傳遞熱能的導熱構造,包括彼此相接的一基板及一蓋板,該基板與該蓋板之間形成一封閉的腔室,該腔室的內部設有工作流體,藉由該工作流體的相變化,而可快速地吸收並導引熱能。The uniform temperature plate is a heat conduction structure for transferring heat energy. It includes a base plate and a cover plate that are connected to each other. A closed chamber is formed between the base plate and the cover plate, and a working fluid is provided in the chamber. With the phase change of the working fluid, heat energy can be quickly absorbed and guided.

該基板與該蓋板對合相接後,欲對該腔室填入該工作流體時,需要利用一除氣管與該腔室連通,透過該除氣管對該腔室填入該工作液體,並抽取留存於該腔室的空氣,使該腔室形成中空狀態,而後再利用壓合、焊接等製程阻斷該腔室與該除氣管的連通,最後再切除該除氣管使該均溫板的外部整體形狀呈現平整無凸出的狀態。After the substrate and the cover plate are butted and connected, when the chamber is to be filled with the working fluid, a degassing tube is required to communicate with the chamber, and the chamber is filled with the working fluid through the degassing tube, and The air remaining in the chamber is extracted to form a hollow state, and then the communication between the chamber and the degassing pipe is blocked by pressing, welding, etc., and finally the degassing pipe is cut off to make the temperature equalizing plate The overall shape of the exterior is flat and without protrusions.

查,習知均溫板於實際應用經驗中發現仍舊存在下述問題與缺弊:習知均溫板需要額外設置該除氣管,在該腔室注水除氣完成後,在該腔室封閉狀態下切除該除氣管外凸於均溫板的周緣外部的部份,並對該除氣管施以各種保護措施,避免該除氣管日後受到外界異物的破壞,如此使得習知均溫板的整體構成複雜。It is found that the following problems and shortcomings still exist in the actual application experience of the conventional temperature equalizing plate: the conventional equalizing temperature plate needs to be additionally provided with the degassing pipe, and after the water injection and degassing of the chamber is completed, the chamber is closed. The part of the degassing pipe protruding outside the periphery of the temperature equalizing plate is cut down, and various protective measures are applied to the degassing pipe to prevent the degassing pipe from being damaged by foreign objects in the future, so that the overall structure of the conventional temperature equalizing plate complex.

是以,針對上述習知均溫板技術所存在之問題點,如何研發出一種能夠更具理想實用性之創新技術,實有待相關業界再加以思索突破之目標及方向者;有鑑於此,發明人本於多年從事相關產品之製造開發與設計經驗,針對上述之目標,詳加設計與審慎評估後,終得一確具實用性之本發明。Therefore, in view of the problems of the above-mentioned conventional uniform temperature plate technology, how to develop an innovative technology that can be more ideal and practical is really awaiting the relevant industry to think about the goal and direction of the breakthrough; in view of this, the invention is invented With many years of experience in manufacturing, development and design of related products, human-centered people, after detailed design and careful evaluation for the above goals, finally came up with a practical invention.

本發明之主要目的,係在提供一種無除氣管之均溫板及製造該無除氣管之均溫板的方法,其所欲解決之技術問題,係針對如何研發出一種更具理想實用性之新式均溫板及製造該均溫板的方法為目標加以思索創新突破。The main purpose of the present invention is to provide a uniform temperature plate without degassing pipe and a method for manufacturing the uniform temperature plate without degassing pipe. The technical problem to be solved is how to develop a more ideal and practical The goal is to think about and make breakthroughs in the new-type uniform temperature plate and the method of manufacturing the uniform temperature plate.

基於前述目的,本發明解決問題之技術特點,主要在於該無除氣管之均溫板係包括:Based on the foregoing objectives, the technical feature of the present invention to solve the problem is mainly that the uniform temperature plate without degassing tube includes:

一第一板,該第一板於周緣形成一環牆;A first board, the first board forms a ring wall at the periphery;

一第二板,該第二板與該第一板相對,且該第二板與該環牆相接;以及A second board, the second board is opposite to the first board, and the second board is connected to the ring wall; and

一腔室,該腔室形成於該第一板與該第二板之間,且該腔室限制於該環牆的內緣,該腔室用於容設工作流體;A chamber, the chamber is formed between the first plate and the second plate, and the chamber is limited to the inner edge of the ring wall, and the chamber is used to contain a working fluid;

該第一板於該腔室的範圍向該第二板方向形成一接座,該接座與該第二板相接,該接座頂緣凹陷一流道,該流道的一端為第一端與該腔室連通,該流道的另一端形成一閉塞部,據此封閉該腔室。The first plate forms a socket in the direction of the second plate in the range of the cavity, the socket is connected with the second plate, the top edge of the socket is recessed in a flow channel, and one end of the flow channel is the first end In communication with the chamber, the other end of the flow channel forms a blocking part, thereby closing the chamber.

本發明之主要效果與優點,係能夠不需要設置除氣管,也就不需要對該除氣管施以保護措施,該無除氣管之均溫板整體構成精簡,製造該均溫板的方法容易執行且可靠度高。The main effects and advantages of the present invention are that there is no need to set up a degassing pipe, and there is no need to apply protective measures to the degassing pipe. The overall structure of the uniform temperature plate without degassing pipe is simplified, and the method of manufacturing the uniform temperature plate is easy to implement And the reliability is high.

請參閱第1圖至第9圖所示,係本發明無除氣管之均溫板及製造該無除氣管之均溫板的方法之實施例,惟此等實施例僅供說明之用,在專利申請上並不受此實施例之限制。Please refer to Figures 1 to 9, which are the embodiments of the uniform temperature plate without degassing pipe and the method for manufacturing the uniform temperature plate without degassing pipe of the present invention. However, these embodiments are for illustrative purposes only. The patent application is not limited by this embodiment.

如第1圖至第3圖所示,所述無除氣管之均溫板的較佳實施例,包括一第一板10、一第二板20及一腔室30,其中該第一板10於周緣形成一環牆12,該第二板20與該第一板10相對,且該第二板20與該環牆12相接,該腔室30形成於該第一板10與該第二板20之間,且該腔室30限制於該環牆12的內緣,該腔室30用於容設工作流體(圖中未示)。As shown in Figures 1 to 3, the preferred embodiment of the temperature equalizing plate without degassing tube includes a first plate 10, a second plate 20 and a chamber 30, wherein the first plate 10 A ring wall 12 is formed on the periphery, the second plate 20 is opposite to the first plate 10, and the second plate 20 is connected to the ring wall 12, and the cavity 30 is formed between the first plate 10 and the second plate 20, and the cavity 30 is limited to the inner edge of the ring wall 12, and the cavity 30 is used for accommodating working fluid (not shown in the figure).

該第一板10於該腔室30的範圍向該第二板20方向形成一接座14,該接座14與該第二板20相接,該接座14頂緣凹陷一流道16,該流道16的一端為第一端162與該腔室30連通,該流道16的另一端形成一閉塞部34,據此封閉該腔室30。The first plate 10 forms a socket 14 in the direction of the second plate 20 in the range of the cavity 30. The socket 14 is connected to the second plate 20. The top edge of the socket 14 is recessed in the flow channel 16. One end of the flow channel 16 is connected with the cavity 30 by the first end 162, and the other end of the flow channel 16 forms a blocking portion 34 to close the cavity 30 accordingly.

該腔室30的內部可視需要設有數個支柱32,各該支柱32分別與該第一板10及該第二板20相接。A number of pillars 32 may be arranged inside the chamber 30 as needed, and each pillar 32 is connected to the first plate 10 and the second plate 20 respectively.

如第4圖至第8圖所示,製造前述無除氣管之均溫板的方法,包括下列步驟:As shown in Figures 4 to 8, the method of manufacturing the aforementioned uniform temperature plate without degassing tube includes the following steps:

第一板及第二板製備:選用熱傳導率高的金屬板材成型一第一板10及一第二板20,且該第一板10形成一環牆12及一接座14,該環牆12形成於該第一板10的周緣,該接座14形成於該環牆12所圍設形成空間的範圍內,該接座14凹陷一流道16,該流道16的一端為第一端162延伸於該接座14的外緣,該流道16的另一端為第二端166;該第二板20貫穿一注孔24。Preparation of the first board and the second board: a first board 10 and a second board 20 are formed by using metal plates with high thermal conductivity, and the first board 10 forms a ring wall 12 and a socket 14, and the ring wall 12 is formed On the periphery of the first plate 10, the socket 14 is formed in the range of the space enclosed by the ring wall 12, the socket 14 is recessed in the flow channel 16, and one end of the flow channel 16 is the first end 162 extending in At the outer edge of the socket 14, the other end of the runner 16 is a second end 166; the second plate 20 penetrates an injection hole 24.

疊合:該第一板10與該第二板20對合,且該第二板20的周緣與該環牆12相靠,據使該第一板10與該第二板20之間形成一腔室30,該流道16於該第一端162與該腔室30連通,該流道16之該第二端166延伸與該注孔24連通,據使該腔室30通過該流道16及該注孔24與外界連通。Overlapping: the first board 10 and the second board 20 are aligned, and the peripheral edge of the second board 20 abuts against the ring wall 12, so that a gap is formed between the first board 10 and the second board 20 The chamber 30, the flow channel 16 communicates with the chamber 30 at the first end 162, and the second end 166 of the flow channel 16 extends to communicate with the injection hole 24, so that the chamber 30 passes through the flow channel 16 And the injection hole 24 communicates with the outside.

全周封邊:該環牆12與該第二板20氣密結合;該環牆12可選擇利用熱壓熔接或硬焊或其他類似的手段與該第二板20氣密結合,且該環牆12與該第二板20氣密結合後,該腔室30僅能通過該流道16及該注孔24與外界連通。Full-peripheral edge sealing: the ring wall 12 is airtightly combined with the second plate 20; the ring wall 12 can be airtightly combined with the second plate 20 by hot pressure welding or brazing or other similar means, and the ring After the wall 12 and the second plate 20 are airtightly combined, the cavity 30 can only communicate with the outside through the flow channel 16 and the injection hole 24.

注液除氣:通過該注孔24及該流道16對該腔室30注入工作流體(圖中未示),並通過該注孔24及該流道16除去該腔室30內部的空氣,使該腔室30形成真空狀態;注液除氣步驟可於真空環境下進行,使該腔室30內部處於真空狀態的條件下,對該腔室30注入該工作流體。以及Liquid injection and degassing: inject working fluid (not shown in the figure) into the chamber 30 through the injection hole 24 and the flow channel 16, and remove the air inside the chamber 30 through the injection hole 24 and the flow channel 16, The chamber 30 is formed into a vacuum state; the liquid injection and degassing step can be performed in a vacuum environment, and the working fluid is injected into the chamber 30 under the condition that the inside of the chamber 30 is in a vacuum state. as well as

封閉:對該接座14及該第二板20與該接座14相鄰的部份施以熔焊加工,使該接座14與該第二板20結合,並阻斷該流道16及該注孔24連通的部份,使該流道16指向該第二端166的部份封閉形成如第8圖所示的一閉塞部34,據此封閉該腔室30。Sealing: fusion welding is applied to the socket 14 and the adjacent part of the second plate 20 and the socket 14, so that the socket 14 and the second plate 20 are combined, and the flow channel 16 and The communicating portion of the injection hole 24 closes the portion of the flow channel 16 pointing to the second end 166 to form a blocking portion 34 as shown in FIG. 8, thereby closing the cavity 30.

如第8圖所示,該封閉步骤可選擇利用一模頭40壓靠該第二板20,且該模頭40與該注孔24相對,使該第二板20於該注孔24周圍的部份及該接座14於該第二端166周圍的部份熔融結合形成該閉塞部34,該閉塞部34填塞該注孔24及該流道16的一部份,藉此封閉該腔室30,且該第二板20的外部由於該模頭40的壓靠而形成一凹口22。As shown in Figure 8, the sealing step can choose to use a die 40 to press against the second plate 20, and the die 40 is opposite to the injection hole 24, so that the second plate 20 is placed on the periphery of the injection hole 24. The part and the part of the socket 14 around the second end 166 are fused to form the blocking portion 34. The blocking portion 34 fills the injection hole 24 and a part of the flow channel 16, thereby closing the cavity 30, and a notch 22 is formed on the outside of the second plate 20 due to the pressing of the die 40.

該封閉步驟可選擇利用金屬超音波熔接法使該接座14與該第二板20結合,並於該接座14與該第二板20結合的同時,阻斷該流道16及該注孔24連通的部份,使該流道16指向該第二端166的部份封閉形成該閉塞部34;該封閉步驟亦可選擇利用電阻焊接法使該接座14與該第二板20結合,並於該接座14與該第二板20結合的同時,形成如第3圖所示的形成該閉塞部34阻斷該流道16,使該流道16指向該第二端166的部份封閉。In the sealing step, a metal ultrasonic welding method can be used to combine the socket 14 and the second plate 20, and at the same time the socket 14 and the second plate 20 are combined, the flow channel 16 and the injection hole are blocked. 24, the part of the flow channel 16 pointing to the second end 166 is closed to form the blocking portion 34; the sealing step can also choose to use resistance welding to connect the socket 14 and the second plate 20, At the same time when the socket 14 is combined with the second plate 20, the blocking portion 34 is formed as shown in FIG. 3 to block the flow passage 16 so that the flow passage 16 points to the second end 166 Closed.

該封閉步驟中,阻斷該流道16後,可視需要進一步利用雷射焊接法封合該凹口22,藉此使該凹口22被完全填補而消失,藉此進一步提高封閉該腔室30的可靠度。In the sealing step, after the flow channel 16 is blocked, the notch 22 may be further sealed by laser welding as needed, so that the notch 22 is completely filled and disappeared, thereby further improving the sealing of the cavity 30 The reliability.

再者,該第一板及第二板製備步驟中,數個支柱32成型於該第一板10,且各該支柱32位於形成該環牆12及該接座14的同側(如第5圖及第6圖所示),該全周封邊步驟中,各該支柱32分別與該第二板20結合;本發明亦可視需要,選擇於該第一板及第二板製備步驟中,使數個支柱(圖中未示)成型於該第二板20,且該全周封邊步驟中,各該支柱分別與該第一板10結合。Furthermore, in the steps of preparing the first board and the second board, a plurality of pillars 32 are formed on the first board 10, and each of the pillars 32 is located on the same side of the ring wall 12 and the socket 14 (such as the fifth As shown in Figures and Figure 6), in the full-circle edge sealing step, each of the pillars 32 is combined with the second plate 20; the present invention can also be selected in the steps of preparing the first plate and the second plate according to needs, A number of pillars (not shown in the figure) are formed on the second plate 20, and in the full-circle edge sealing step, each pillar is combined with the first plate 10 respectively.

藉由上述結構組成型態與技術特徵,本發明所述無除氣管之均溫板不需要額外設置除氣管,於該腔室30的範圍內形成該流道16配合該注孔24,即可提供作為空氣流出形成真空及該工作流體注入的路徑,待該注液除氣步驟完成後,再利用熔焊加工手段,使該接座14與該第二板20結合的同時,阻斷該流道16及該注孔24連通的部份形成該閉塞部34,使該流道16指向該第二端166的部份封閉,即可封閉該腔室30,本發明既不需要設置除氣管,也就不需要對該除氣管施以保護措施,本發明之無除氣管之均溫板的整體構成精簡,該無除氣管之均溫板的製造方法容易執行且可靠度高。With the above-mentioned structural composition and technical features, the temperature equalizing plate without degassing pipe of the present invention does not need to be additionally provided with a degassing pipe, and the flow channel 16 is formed in the range of the chamber 30 to cooperate with the injection hole 24, and it is enough Provide a path for air to flow out to form a vacuum and to inject the working fluid. After the liquid injection and degassing step is completed, welding processing methods are used to combine the socket 14 with the second plate 20 while blocking the flow The communicating part of the passage 16 and the injection hole 24 forms the blocking portion 34, so that the part of the flow passage 16 pointing to the second end 166 is closed, and the chamber 30 can be closed. The present invention does not require a degassing pipe. There is no need to apply protective measures to the degassing pipe, the overall structure of the temperature equalizing plate without degassing pipe of the present invention is simplified, and the manufacturing method of the temperature equalizing plate without degassing pipe is easy to implement and has high reliability.

復如第1圖至第3圖所示,本例中,該第二板20於外部形成一凹口22,該凹口22於指向該第一板10的一端形成封閉,且該凹口22指向該第一板10的方向與該流道16指向該閉塞部34的延伸方向形成相交,該閉塞部34形成於該凹口22與該流道16之間,據此封閉該腔室30;該接座14可選擇與該環牆12一體相連。As shown in Figures 1 to 3, in this example, the second plate 20 is formed with a notch 22 on the outside, and the notch 22 is closed at the end pointing to the first plate 10, and the notch 22 The direction pointing to the first plate 10 intersects with the extending direction of the flow channel 16 pointing to the blocking portion 34. The blocking portion 34 is formed between the recess 22 and the flow channel 16, thereby closing the cavity 30; The socket 14 can optionally be integrally connected with the ring wall 12.

如第9圖所示,另一實施例主要不同於較佳實施例之構成在於,該接座14形成於該腔室30的內部,且該接座14與該環牆12分離。As shown in FIG. 9, another embodiment is mainly different from the preferred embodiment in that the socket 14 is formed inside the cavity 30 and the socket 14 is separated from the ring wall 12.

10:第一板 12:環牆 14:接座 16:流道 162:第一端 166:第二端 20:第二板 22:凹口 24:注孔 30:腔室 32:支柱 34:閉塞部 40:模頭 2:流道與腔室連通部份放大表示於第2圖 6:流道的第一端的部份放大表示於第6圖10: The first board 12: Ring wall 14: Socket 16: runner 162: first end 166: second end 20: second board 22: Notch 24: Note hole 30: Chamber 32: Pillar 34: Occlusion 40: Die head 2: The connecting part of the flow channel and the chamber is enlarged and shown in Figure 2 6: The enlarged part of the first end of the runner is shown in Figure 6

第1圖係本發明無除氣管之均溫板的較佳實施例的立體圖。 第2圖係第1圖之流道與腔室連通部份的部份放大圖。 第3圖係本發明無除氣管之均溫板的較佳實施例於流道部份的部份剖視圖。 第4圖係本發明製造無除氣管之均溫板的方法的流程圖。 第5圖係本發明製造無除氣管之均溫板的方法的第一板與第二板之立體分解圖。 第6圖係第5圖之流道的第一端的部份放大圖。 第7圖係本發明製造無除氣管之均溫板的方法的第一板與第二板疊合狀態之立體圖。 第8圖係本發明製造無除氣管之均溫板的方法的封閉步驟之操作狀態的部份剖視圖。 第9圖係本發明無除氣管之均溫板的另一實施例的俯視圖。Figure 1 is a perspective view of a preferred embodiment of the uniform temperature plate without degassing pipes of the present invention. Figure 2 is a partial enlarged view of the connecting portion between the flow channel and the chamber in Figure 1. Fig. 3 is a partial cross-sectional view of the flow channel part of the preferred embodiment of the temperature equalizing plate without degassing pipe of the present invention. Fig. 4 is a flow chart of the method of manufacturing the uniform temperature plate without degassing pipe according to the present invention. Fig. 5 is a perspective exploded view of the first plate and the second plate of the method for manufacturing the uniform temperature plate without degassing pipes according to the present invention. Figure 6 is a partial enlarged view of the first end of the runner in Figure 5. Fig. 7 is a perspective view of the superimposed state of the first plate and the second plate in the method of manufacturing the uniform temperature plate without degassing pipes according to the present invention. Fig. 8 is a partial cross-sectional view of the operation state of the closing step of the method of manufacturing the uniform temperature plate without degassing pipe according to the present invention. Figure 9 is a top view of another embodiment of the temperature equalizing plate without degassing pipes according to the present invention.

10:第一板10: The first board

12:環牆12: Ring wall

14:接座14: Socket

16:流道16: runner

162:第一端162: first end

20:第二板20: second board

22:凹口22: Notch

32:支柱32: Pillar

34:閉塞部34: Occlusion

2:流道與腔室連通部份放大表示於第2圖2: The connecting part of the flow channel and the chamber is enlarged and shown in Figure 2

Claims (10)

一種無除氣管之均溫板,包括: 一第一板,該第一板於周緣形成一環牆; 一第二板,該第二板與該第一板相對,且該第二板與該環牆相接;以及 一腔室,該腔室形成於該第一板與該第二板之間,且該腔室限制於該環牆的內緣,該腔室用於容設工作流體; 該第一板於該腔室的範圍向該第二板方向形成一接座,該接座與該第二板相接,該接座頂緣凹陷一流道,該流道的一端為第一端與該腔室連通,該流道的另一端形成一閉塞部,據此封閉該腔室。A uniform temperature plate without degassing pipe, including: A first board, the first board forms a ring wall at the periphery; A second board, the second board is opposite to the first board, and the second board is connected to the ring wall; and A chamber, the chamber is formed between the first plate and the second plate, and the chamber is limited to the inner edge of the ring wall, and the chamber is used to contain a working fluid; The first plate forms a socket in the direction of the second plate in the range of the cavity, the socket is connected with the second plate, the top edge of the socket is recessed in a flow channel, and one end of the flow channel is the first end In communication with the chamber, the other end of the flow channel forms a blocking part, thereby closing the chamber. 如申請專利範圍第1項所述之無除氣管之均溫板,其中該第二板於外部形成一凹口,該凹口於指向該第一板的一端形成封閉,且該凹口指向該第一板的方向與該流道指向該閉塞部的延伸方向形成相交,該閉塞部形成於該凹口與該流道之間。As described in item 1 of the scope of patent application, the temperature equalization plate without degassing tube, wherein the second plate forms a notch on the outside, and the notch is closed at the end pointing to the first plate, and the notch points to the The direction of the first plate intersects with the extending direction of the flow channel pointing to the blocking portion, and the blocking portion is formed between the recess and the flow channel. 如申請專利範圍第1項所述之無除氣管之均溫板,其中該接座與該環牆一體相連。The temperature equalizing plate without degassing pipe as described in item 1 of the scope of patent application, wherein the socket is integrally connected with the ring wall. 如申請專利範圍第1項至第3項中任一項所述之無除氣管之均溫板,其中該腔室的內部設有數個支柱,各該支柱分別與該第一板及該第二板相接。For example, the uniform temperature plate without degassing tube described in any one of items 1 to 3 of the scope of patent application, wherein a plurality of pillars are arranged inside the chamber, and each pillar is connected to the first plate and the second plate respectively. The boards meet. 一種製造如申請專利範圍第1項所述之無除氣管之均溫板的方法,包括下列步驟: 第一板及第二板製備:選用熱傳導率高的金屬板材成型一第一板及一第二板,且該第一板形成一環牆及一接座,該環牆形成於該第一板的周緣,該接座形成於該環牆所圍設形成空間的範圍內,該接座凹陷一流道,該流道的一端為第一端延伸於該接座的外緣,該流道的另一端為第二端;該第二板貫穿一注孔; 疊合:該第一板與該第二板對合,且該第二板的周緣與該環牆相靠,據使該第一板與該第二板之間形成一腔室,該流道於該第一端與該腔室連通,該流道之該第二端延伸與該注孔連通,據使該腔室通過該流道及該注孔與外界連通; 全周封邊:該環牆與該第二板氣密結合; 注液除氣:通過該注孔及該流道對該腔室注入工作流體,並通過該注孔及該流道除去該腔室內部的空氣,使該腔室形成真空狀態;以及 封閉:對該接座及該第二板與該接座相鄰的部份施以熔焊加工,使該接座與該第二板結合,並形成一閉塞部阻斷該流道,使該流道指向該第二端的部份封閉,據此封閉該腔室。A method for manufacturing a uniform temperature plate without degassing pipe as described in item 1 of the scope of patent application, including the following steps: Preparation of the first board and the second board: a first board and a second board are formed from metal plates with high thermal conductivity, and the first board forms a ring wall and a socket, and the ring wall is formed on the first board The peripheral edge, the socket is formed in the range of the space enclosed by the ring wall, the socket is recessed in a flow channel, one end of the flow channel is a first end extending from the outer edge of the socket, and the other end of the flow channel Is the second end; the second plate penetrates an injection hole; Overlapping: The first plate is aligned with the second plate, and the peripheral edge of the second plate abuts against the ring wall, so that a cavity is formed between the first plate and the second plate, and the flow channel Communicating with the chamber at the first end, the second end of the flow channel extends and communicates with the injection hole, so that the chamber communicates with the outside through the flow channel and the injection hole; Full-circle edge sealing: the ring wall is airtightly combined with the second plate; Liquid injection and degassing: inject working fluid into the chamber through the injection hole and the flow channel, and remove the air inside the chamber through the injection hole and the flow channel, so that the chamber is formed into a vacuum state; and Sealing: fusion welding is applied to the socket and the adjacent part of the second plate to the socket to combine the socket with the second plate and form a blocking part to block the flow path, so that the The part of the flow channel pointing to the second end is closed, thereby closing the chamber. 如申請專利範圍第5項所述之製造無除氣管之均溫板的方法,其中該封閉步驟係利用金屬超音波熔接法使該接座與該第二板結合,並阻斷該流道形成該閉塞部。The method for manufacturing a uniform temperature plate without a degassing pipe as described in item 5 of the scope of patent application, wherein the sealing step is to use a metal ultrasonic welding method to combine the socket and the second plate and block the formation of the flow channel The occlusion. 如申請專利範圍第5項所述之製造無除氣管之均溫板的方法,其中該封閉步驟係利用電阻焊接法使該接座與該第二板結合,並阻斷該流道形成該閉塞部。The method for manufacturing a uniform temperature plate without a degassing tube as described in item 5 of the scope of patent application, wherein the sealing step is to use resistance welding to connect the socket and the second plate, and block the flow path to form the occlusion Department. 如申請專利範圍第5項至第7項中任一項所述之製造無除氣管之均溫板的方法,其中該封閉步驟阻斷該流道後,進一步利用雷射焊接法封合該第二板的外部形成的一凹口。For example, the method for manufacturing a uniform temperature plate without a degassing tube as described in any one of the scope of the patent application item 5 to 7, wherein after the sealing step blocks the flow channel, the second laser welding method is further used to seal A recess formed on the outside of the board. 如申請專利範圍第5項至第7項中任一項所述之製造無除氣管之均溫板的方法,其中該第一板及第二板製備步驟中,數個支柱成型於該第一板,且各該支柱位於形成該環牆及該接座的同側,該全周封邊步驟中,各該支柱分別與該第二板結合。As described in any one of items 5 to 7 of the scope of patent application, the method for manufacturing a uniform temperature plate without degassing pipe, wherein in the steps of preparing the first plate and the second plate, a plurality of pillars are formed on the first plate Each of the pillars is located on the same side where the ring wall and the socket are formed. In the all-around edge sealing step, each of the pillars is respectively combined with the second board. 如申請專利範圍第5項至第7項中任一項所述之製造無除氣管之均溫板的方法,其中該第一板及第二板製備步驟中,數個支柱成型於該第二板,且該全周封邊步驟中,各該支柱分別與該第一板結合。As described in any one of items 5 to 7 of the scope of the patent application, the method for manufacturing a uniform temperature plate without a degassing tube, wherein in the steps of preparing the first plate and the second plate, a plurality of pillars are formed on the second plate In the full-circle edge sealing step, each of the pillars is respectively combined with the first plate.
TW109101191A 2020-01-14 2020-01-14 Vapor chamber without degassing tube and method for manufacturing the same TW202126976A (en)

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