TW202122810A - Light emitting element detecting method and equipment - Google Patents
Light emitting element detecting method and equipment Download PDFInfo
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本發明係與發光元件(例如雷射晶片(laser chip))之檢測技術有關,特別是關於一種用以檢測發光元件之出光口是否會發光或閃爍(flash)之發光元件檢測方法及設備。The present invention is related to the detection technology of light-emitting elements (such as laser chips), and particularly relates to a light-emitting element detection method and equipment for detecting whether the light-emitting port of the light-emitting element emits light or flashes.
習知雷射晶片之測試,是在晶圓製成而具有大量相連之晶片後,藉由一點測機之一探針卡的探針或其他探針裝置(例如邊緣感測器(edge sensor))之探針點觸晶片而使晶片發光,並同時接收晶片發出之光線進而檢測出其光學特性。雷射晶片之發光,特別是指垂直式共振腔面射型雷射陣列(Vertical-Cavity Surface-Emitting Laser Array;簡稱VCSEL)晶片之發光,係由分布於其一表面之多個不規則排列之出光口同時發光。Conventional laser chip testing is done after the wafer is made with a large number of connected chips, using one of the probe card probes or other probe devices (such as edge sensors) of the one-point measuring machine ) The probe touches the chip to make the chip emit light, and at the same time, it receives the light emitted by the chip to detect its optical characteristics. The light emission of the laser chip, especially the vertical-cavity surface-emitting laser array (Vertical-Cavity Surface-Emitting Laser Array; referred to as VCSEL) chip, is caused by a plurality of irregular arrangements distributed on one surface of the laser chip. The light outlets glow at the same time.
然而,當一VCSEL晶片通電而發光時,其某一或某些出光口可能不會發光,或者即使有發光卻會發生閃爍現象,亦即該出光口並非都是恆亮狀態,而是有時會發光有時卻不發光。當一VCSEL晶片中有不發光或閃爍等問題之出光口超過一定數量或比例時,需判定此晶片為不良品,因此,如何準確地檢測發光元件之出光口是否有不發光或閃爍等問題,係VCSEL晶片之重要檢測項目。However, when a VCSEL chip is energized and emits light, one or some of its light outlets may not emit light, or even if there is light, it will flicker. That is, the light outlets are not always in a constant light state, but sometimes It will shine and sometimes it will not shine. When a VCSEL chip has problems such as non-lighting or flickering, the light output port exceeds a certain number or proportion, it is necessary to determine that the chip is a defective product. Therefore, how to accurately detect whether the light-emitting port of the light-emitting element has non-lighting or flickering problems, It is an important inspection item for VCSEL chips.
本發明之主要目的在於提供一種發光元件檢測方法及設備,係能準確地檢測出發光元件之出光口是否有不發光或閃爍等問題。The main purpose of the present invention is to provide a light-emitting element detection method and equipment, which can accurately detect whether the light-emitting port of the light-emitting element does not emit light or flickers.
為達成上述目的,本發明所提供之發光元件檢測方法,其步驟包含有: a) 產生一第一控制訊號而開啟一影像擷取裝置之快門,該影像擷取裝置係朝向一發光元件之至少一出光口擷取影像; b) 產生一脈衝訊號而點亮該發光元件; c) 產生一第二控制訊號而關閉該影像擷取裝置之快門並得到一檢測影像;以及 d) 藉由該檢測影像判斷該發光元件之出光口的發光情況。In order to achieve the above-mentioned object, the light-emitting element detection method provided by the present invention includes the following steps: a) Generate a first control signal to open the shutter of an image capture device that captures images toward at least one light-emitting port of a light-emitting element; b) Generate a pulse signal to light up the light-emitting element; c) generating a second control signal to close the shutter of the image capturing device and obtain a detection image; and d) Judging the light-emitting condition of the light-emitting port of the light-emitting element based on the detected image.
為達成上述目的,本發明所提供之發光元件檢測設備包含有一用以朝向一發光元件之至少一出光口擷取影像之影像擷取裝置、一用以與該發光元件電性連接之探針模組,以及一與該影像擷取裝置及該探針模組電性連接之控制模組,該控制模組週期性地傳送一第一控制訊號至該影像擷取裝置而開啟其快門以及傳送一第二控制訊號至該影像擷取裝置而關閉其快門,並週期性地傳送一脈衝訊號至該探針模組進而點亮該發光元件,且傳送該脈衝訊號的時間點是在傳送該第一控制訊號的時間點與傳送該第二控制訊號的時間點之間。In order to achieve the above-mentioned object, the light-emitting element detection equipment provided by the present invention includes an image capturing device for capturing images toward at least one light-emitting port of a light-emitting element, and a probe mold electrically connected to the light-emitting element Group, and a control module electrically connected to the image capture device and the probe module, the control module periodically sends a first control signal to the image capture device to open its shutter and send a The second control signal is sent to the image capturing device to close its shutter, and periodically sends a pulse signal to the probe module to light up the light-emitting element, and the time point of sending the pulse signal is when the first Between the time point of the control signal and the time point of transmitting the second control signal.
藉此,本發明可確保該影像擷取裝置擷取到發光元件被點亮時的影像,藉以準確地判斷出該發光元件之出光口的發光情況。例如,當該檢測影像顯示某一出光口未發光或其光強度不在一預定之標準光強度範圍內或與一預定之標準光強度的誤差大於一預定區間時,可將該出光口記錄為有問題的出光口。本發明亦可藉由重複步驟a)、b)及c)複數次而得到複數檢測影像,並對該等檢測影像進行比對,當某一出光口在部分檢測影像中呈現正常的發光情況但在其他檢測影像中卻被判斷為有問題的出光口時,則可判斷該出光口有閃爍之問題。In this way, the present invention can ensure that the image capturing device captures the image when the light-emitting element is lit, so as to accurately determine the light-emitting condition of the light-emitting port of the light-emitting element. For example, when the detected image shows that a light outlet is not emitting light or its light intensity is not within a predetermined standard light intensity range or the error with a predetermined standard light intensity is greater than a predetermined interval, the light exit port can be recorded as having light. The light outlet of the problem. The present invention can also obtain a plurality of detection images by repeating steps a), b) and c) multiple times, and compare the detection images. When a certain light outlet shows normal light emission in part of the detection images, but When the light outlet is judged to be problematic in other detected images, it can be judged that the light outlet has a flickering problem.
有關本發明所提供之發光元件檢測方法及設備的詳細構造、特點、組裝或使用方式,將於後續的實施方式詳細說明中予以描述。然而,在本發明領域中具有通常知識者應能瞭解,該等詳細說明以及實施本發明所列舉的特定實施例,僅係用於說明本發明,並非用以限制本發明之專利申請範圍。The detailed structure, characteristics, assembly or use of the light-emitting element detection method and equipment provided by the present invention will be described in the detailed description of the subsequent embodiments. However, those with ordinary knowledge in the field of the present invention should be able to understand that the detailed description and the specific embodiments listed for implementing the present invention are only used to illustrate the present invention, and are not intended to limit the scope of the patent application of the present invention.
請先參閱圖1,本發明一較佳實施例所提供之發光元件檢測設備10及發光元件檢測方法(如圖2所示)係用以對一發光元件20進行發光檢測,特別適用於檢測諸如VCSEL晶片此類的發光元件,實際上,VCSEL晶片是在晶圓片上尚未切割之狀態下進行檢測,為了簡化圖式並便於說明,圖1中僅示意性地繪製出一發光元件20,以表示一VCSEL晶片,如圖3所示,該發光元件20(VCSEL晶片)具有複數出光口22。Please refer to FIG. 1. The light-emitting
如圖1所示,該發光元件檢測設備10包含有一影像擷取裝置11、一與該影像擷取裝置11耦接之光學調整模組12、一與該光學調整模組12耦接之物鏡13、一探針模組14、一與該影像擷取裝置11及該探針模組14電性連接之控制模組15,以及一與該影像擷取裝置11電性連接之儲存裝置16。As shown in FIG. 1, the light-emitting
該影像擷取裝置11可為感光元件採用電荷耦合元件(charge-coupled device;簡稱CCD)或互補式金屬氧化物半導體(complementary metal-oxide-semiconductor;簡稱CMOS)之相機或攝影機,該影像擷取裝置11係透過該光學調整模組12及該物鏡13而朝向該發光元件20之出光口22擷取影像。The image capturing
在本實施例中,該光學調整模組12包含有一用以導引光線之光學通道122(optical tunnel;簡稱OT),以及一用以過濾光線之濾光單元124,該光學通道122之二端分別與該影像擷取裝置11及該濾光單元124耦接,並且該濾光單元124與該物鏡13耦接。該濾光單元124可設有複數濾光效果不同之濾光元件(圖中未示),以及一藉由接收控制訊號而將適當之濾光元件轉動至檢測光路上之轉盤(圖中未示)。此部分係與本發明之技術特徵較無關聯,容申請人在此不詳加敘述。In this embodiment, the
該探針模組14包含有複數探針,在本實施例中,該探針模組14係以一正電極探針141及一負電極探針142分別點觸該發光元件20之正、負極導電接點(圖中未示)而與該發光元件20電性連接。或者,本發明亦適用於正面具有一導電接點且背面為平面電極之發光元件,則該探針模組係以一探針點觸該發光元件正面的導電接點。該控制模組15可為一電源量測單元(source measurement unit;簡稱SMU),係用以精確地輸出該發光元件20發光所需之電源,並透過該探針模組14傳送至該發光元件20,進而驅動該發光元件20發光。The
請參閱各圖式,本發明之發光元件檢測方法包含有下列步驟:Please refer to the drawings. The light-emitting element detection method of the present invention includes the following steps:
a) 產生一第一控制訊號31(如圖4所示)而開啟該影像擷取裝置11之快門,如圖2所示之步驟S1。a) A first control signal 31 (as shown in FIG. 4) is generated to open the shutter of the
b) 產生一脈衝訊號32(如圖4所示)而點亮該發光元件20,如圖2所示之步驟S2。b) Generate a pulse signal 32 (as shown in FIG. 4) to light up the light-emitting
c) 產生一第二控制訊號33(如圖4所示)而關閉該影像擷取裝置11之快門並得到一檢測影像34,如圖2所示之步驟S3。c) Generate a second control signal 33 (as shown in FIG. 4) to close the shutter of the
d) 藉由該檢測影像34判斷該發光元件20之出光口22的發光情況,如圖2所示之步驟S4、S5。d) Judging the light-emitting condition of the light-emitting
在本實施例中,該控制模組15係週期性地產生出構成圖4上半部之方波的第一、二控制訊號31、33並傳送至該影像擷取裝置11,該影像擷取裝置11接收到該控制模組15在一第一時間點T1傳送之第一控制訊號31即開啟其快門,使得感光元件開始感光,該影像擷取裝置11接收到該控制模組15在一第二時間點T2傳送之第二控制訊號33則關閉其快門,使得感光元件不再感光,該影像擷取裝置11將其感光元件所感測到的光訊號進行處理而形成相對應感光狀態的檢測影像34(如圖5所示),並將檢測影像34傳輸至儲存裝置16進行儲存。In this embodiment, the
此外,該控制模組15亦週期性地產生出構成圖4下半部之方波的脈衝訊號32並傳送至該探針模組14,且傳送脈衝訊號32的第三時間點T3(每一脈衝訊號32時間非常短暫因此僅以一時間點表示)是在傳送第一控制訊號31的第一時間點T1與傳送第二控制訊號33的第二時間點T2之間,該發光元件20接收到脈衝訊號32即通電而於各該出光口22發出光線。換言之,該發光元件20發光的時間點係在影像擷取裝置11之快門開啟期間,如此可確保影像擷取裝置11擷取到的檢測影像34會呈現出該發光元件20之出光口22的發光情況,以供後續步驟d)進行判斷處理。In addition, the
詳而言之,該發光元件20接收到脈衝訊號32而通電時,其出光口22分別發出之光線係通過物鏡13、濾光單元124之濾光元件及光學通道122而被影像擷取裝置11接收,該影像擷取裝置11將肉眼無法區分之該等出光口22之光線呈現在該檢測影像34上,如圖5所示,該檢測影像34會呈現出分別對應該等出光口22之複數光點342。本發明中所述之光點,實際上大多呈不規則形狀,然而,為了簡化圖式並便於說明,本發明之圖式中光點皆繪製成圓形。In detail, when the
該步驟d)判斷發光情況之方式,可先藉由該檢測影像34測得該發光元件20之出光口22的光強度,再藉以判斷其發光情況。詳而言之,可利用影像處理軟體對該檢測影像34之每一個像素(pixel)進行後處理,而測得該檢測影像34之每一個像素的相對光強度,然後對各光點342所佔之像素的相對光強度計算出其平均值,而得到各該光點342之相對光強度,其可代表各該出光口22之光強度。舉例而言,圖6中的光點342A佔了該檢測影像34中的九個像素344,計算該九個像素344之相對光強度的平均值,即可求得該光點342A之相對光強度,而該光點342A之相對光強度即可代表該光點342A所對應之出光口22A(如圖3所示)的發光強度。為了簡化圖式,本發明之圖式中僅以假想線示意性地繪製出該檢測影像34之其中九個像素344,以便說明。In step d), the method of judging the light-emitting condition can firstly measure the light intensity of the light-emitting
值得一提的是,本發明中所述之相對光強度係由影像處理軟體計算出之可代表發光強度的數值,利用一標準光源之影像所測得之相對光強度對照該標準光源實際之發光強度物理量(單位例如為瓦特(W)),即可藉由此對照數據將測得之光點342的相對光強度換算成其對應之出光口22的實際光強度(單位例如為瓦特/球面度/平方公分(W/Sr/cm2
))。It is worth mentioning that the relative light intensity mentioned in the present invention is a value calculated by image processing software that can represent the luminous intensity. The relative light intensity measured by the image of a standard light source is compared with the actual luminous intensity of the standard light source. Intensity physical quantity (for example, watt (W)), which can be used to convert the measured relative light intensity of the
更進一步而言,在該步驟d)中可由前述過程測得之光強度判斷各該出光口22的光強度是否在一預定之標準光強度範圍內,或是判斷各該出光口22的光強度與一預定之標準光強度的誤差是否大於一預定區間,若某一出光口22之光強度在連續測試下,光強度不在設定之標準光強度範圍內或是與該標準光強度的亮度誤差大於該預定區間,則可記錄為有問題的出光口22。當該發光元件20之所有出光口22中不在標準光強度範圍內或與該標準光強度的誤差大於該預定區間之出光口22的數量超過一參考值,亦即有問題的出光口22數量超過該參考值,則可判定該發光元件20不符合規格,或將該發光元件20歸類為某一可供使用之等級。Furthermore, in the step d), it can be judged whether the light intensity of each
本發明之發光元件檢測方法更可重複前述之步驟a)、b)及c)複數次,而得到複數檢測影像34,由前述該控制模組15週期性地傳送出第一、二控制訊號31、33及脈衝訊號32即可達成,並且,以前述之方式判斷各該檢測影像34中該發光元件20之各出光口22的發光情況,如此不但可提升檢測的準確性,更可藉由將該等檢測影像34互相比對而判斷各該出光口22是否發生閃爍現象,亦即,當某一出光口22在部分檢測影像34中呈現正常的發光情況但在其他檢測影像34中卻有光強度不足或未發光等問題,則可判斷該出光口22有閃爍現象。為了準確地檢測出光口22是否有未發光、光強度不足或閃爍等問題,前述重複步驟a)、b)及c)係以十次以上為較佳之次數,藉以得到十張以上的檢測影像34以進行比對。此外,如圖4所示,該發光元件20每次受該脈衝訊號32點亮係發光一發光時間T4,每二該發光時間T4係間隔一冷卻時間T5,該冷卻時間T5之較佳設定為該發光時間T4的一百倍以上(圖4僅示意性繪製,而未按照此比例),使得因發光而升溫之發光元件20先有足夠的時間降溫後再進行下一次發光,避免熱的影響,藉以提升檢測之準確性。The light-emitting element detection method of the present invention can further repeat the aforementioned steps a), b) and c) multiple times to obtain a plurality of
綜上所陳,本發明係藉由提供第一、二控制訊號31、33以控制影像擷取裝置11之快門開啟及關閉,並在提供第一、二控制訊號31、33的時間點之間更提供脈衝訊號32以點亮受測之發光元件20,如此可確保該影像擷取裝置11擷取到受測之發光元件20被點亮時的影像,藉以準確地判斷出該發光元件20之出光口22的發光情況,進而檢測出有不發光、閃爍等問題的出光口22,並藉以判定該發光元件20是否符合規格,或將該發光元件20歸類為某一可供使用之等級。In summary, the present invention controls the opening and closing of the shutter of the
最後,必須再次說明,本發明於前揭實施例中所揭露的構成元件,僅為舉例說明,並非用來限制本案之範圍,其他等效元件的替代或變化,亦應為本案之申請專利範圍所涵蓋。Finally, it must be explained again that the constituent elements disclosed in the previously disclosed embodiments of the present invention are only examples and are not intended to limit the scope of the case. Alternatives or changes to other equivalent elements should also be the scope of the patent application for this case. Covered.
10:發光元件檢測設備
11:影像擷取裝置
12:光學調整模組
122:光學通道
124:濾光單元
13:物鏡
14:探針模組
141:正電極探針
142:負電極探針
15:控制模組
16:儲存裝置
20:發光元件
22,22A:出光口
31:第一控制訊號
32:脈衝訊號
33:第二控制訊號
34:檢測影像
342,342A:光點
344:像素
S1~S5:步驟
T1:第一時間點
T2:第二時間點
T3:第三時間點
T4:發光時間
T5:冷卻時間10: Light-emitting element testing equipment
11: Image capture device
12: Optical adjustment module
122: optical channel
124: filter unit
13: Objective
14: Probe module
141: Positive electrode probe
142: Negative electrode probe
15: Control module
16: storage device
20: Light-emitting
圖1為本發明一較佳實施例所提供之發光元件檢測設備及一發光元件的示意圖。 圖2為本發明該較佳實施例所提供之發光元件檢測方法的流程圖。 圖3為該發光元件之示意圖。 圖4為本發明該較佳實施例中使用之訊號的波形示意圖。 圖5為本發明該較佳實施例所提供之發光元件檢測方法中一檢測影像之示意圖。 圖6為圖5之A部分的放大圖。FIG. 1 is a schematic diagram of a light-emitting element detection device and a light-emitting element provided by a preferred embodiment of the present invention. FIG. 2 is a flowchart of the light-emitting element detection method provided by the preferred embodiment of the present invention. Fig. 3 is a schematic diagram of the light-emitting element. 4 is a schematic diagram of the waveform of the signal used in the preferred embodiment of the present invention. FIG. 5 is a schematic diagram of a detection image in the light-emitting element detection method provided by the preferred embodiment of the present invention. Fig. 6 is an enlarged view of part A of Fig. 5.
S1~S5:步驟S1~S5: steps
Claims (11)
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