TW202127379A - Image processing method for light emitting device - Google Patents

Image processing method for light emitting device Download PDF

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TW202127379A
TW202127379A TW109132993A TW109132993A TW202127379A TW 202127379 A TW202127379 A TW 202127379A TW 109132993 A TW109132993 A TW 109132993A TW 109132993 A TW109132993 A TW 109132993A TW 202127379 A TW202127379 A TW 202127379A
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light
emitting
image
emitting unit
processing method
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TW109132993A
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TWI744007B (en
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吳秉穎
劉永欽
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旺矽科技股份有限公司
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Priority to US17/117,513 priority patent/US11526978B2/en
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Abstract

An image processing method includes the steps of lighting up at least a part of light emitting units of a light emitting device; capturing a plurality of detection images corresponding to a plurality of sections of the light emitting device respectively, wherein each section includes a plurality of lighted-up light emitting units, each detection image includes a plurality of light spots respectively corresponding to the light emitting units of the associated section, and every two adjacent sections have an overlap area including at least one lighted-up light emitting unit; and stitching the detection images of the adjacent sections together by taking the light spots corresponding to at least one lighted-up light emitting unit of the overlap area as alignment reference spots, so that the light emitting statuses of all the light emitting units are presented by a single image.

Description

發光物料影像處理方法Luminous material image processing method

本發明係與發光物料之檢測技術有關,特別是關於一種發光物料影像處理方法。The present invention is related to the detection technology of luminescent materials, and particularly relates to an image processing method of luminescent materials.

習知諸如微發光二極體(micro light-emitting diode;簡稱micro LED)陣列晶片、垂直式共振腔面射型雷射陣列(Vertical-Cavity Surface-Emitting Laser Array;簡稱VCSEL Array)晶片等發光元件之發光,係由相當多尺寸微小的發光單元(例如VCSEL Array晶片的出光口或各個micro LED)同時發光,該等發光單元可能呈不規則排列且其發光強度不一定相同,使得所述發光元件不一定均勻地發光,因此發光元件之檢測通常包含發光分佈檢測,亦即檢測其發光分佈是否達到可接受之均勻程度。Conventional light-emitting elements such as micro light-emitting diode (micro LED) array chips, vertical-cavity surface-emitting laser array (VCSEL Array) chips, etc. The light is emitted by a lot of light-emitting units (such as the light outlet of a VCSEL Array chip or each micro LED) at the same time. The light-emitting units may be irregularly arranged and their luminous intensity may not be the same, so that the light-emitting element It does not necessarily emit light uniformly. Therefore, the detection of the light-emitting element usually includes the detection of the luminescence distribution, that is, the detection of whether the luminescence distribution reaches an acceptable degree of uniformity.

習知發光分佈檢測係藉由相機擷取一包含有一或多個前述發光元件之待測物料發光時的影像,以拍攝出肉眼所看不出之該等發光單元的影像,亦即檢測影像上會有對應該等發光之發光單元的光點,該等光點隨著其對應之發光單元的發光強度不同而有不同的明暗程度,亦即檢測影像上會顯示出有亮有暗的光點,甚至可對應顯示出各光點的亮度值,而使用者係藉由檢視此檢測影像來判斷待測物料之發光分佈情況。The conventional luminescence distribution detection uses a camera to capture an image when the material to be tested containing one or more of the aforementioned light-emitting elements emits light, so as to capture the images of the light-emitting units that are invisible to the naked eye, that is, the detection image There will be light spots corresponding to the light-emitting units, and the light spots will have different light and dark levels according to the luminous intensity of the corresponding light-emitting units. That is, the detection image will show bright and dark light spots. , It can even display the brightness value of each light spot, and the user can judge the luminous distribution of the material to be tested by viewing the detection image.

然而,現今之待測物料面積越來越大,其尺寸可能超過一般影像擷取裝置之視野範圍(field of view;簡稱FOV),或者影像擷取鏡頭必須相當靠近待測物料方能拍攝到待測物的細微發光單元,以致影像擷取裝置所能拍攝的範圍只能涵蓋到待測物料的某一部分,如此一來,雖然仍可將待測物料分成多個區域以逐次進行檢測,但如此即無法讓使用者同時觀測到同一待測物料上的全部發光單元的發光情況,而不利於判斷該待測物料之發光分佈情況。However, nowadays, the area of the material to be tested is getting larger and larger, and its size may exceed the field of view (FOV) of the general image capture device, or the image capture lens must be quite close to the material to be tested in order to capture the material to be tested. The tiny light-emitting unit of the test object, so that the range that the image capturing device can capture can only cover a certain part of the material to be tested. In this way, although the material to be tested can still be divided into multiple areas for successive inspections, this is the case. That is, it is impossible for the user to observe the luminescence of all the light-emitting units on the same material to be tested at the same time, which is not conducive to judging the luminous distribution of the material to be tested.

有鑑於上述缺失,本發明之主要目的在於提供一種發光物料影像處理方法,可將同一發光物料上的全部發光單元的發光情況以單一影像呈現。In view of the above-mentioned shortcomings, the main purpose of the present invention is to provide an image processing method for luminescent materials, which can present the light-emitting conditions of all light-emitting units on the same luminescent material as a single image.

為達成上述目的,本發明所提供之發光物料影像處理方法係利用一影像擷取裝置擷取一發光物料之複數發光單元的影像,該影像擷取裝置之一視野範圍係小於該發光物料之發光單元的分佈範圍;該發光物料發光單元影像處理方法之步驟包含有: 點亮該發光物料之至少部分發光單元; 利用該影像擷取裝置分別擷取該發光物料之複數區塊的影像,而得到分別對應該等區塊之複數檢測影像,其中,各該區塊包含複數被點亮之該發光單元,各該檢測影像包含複數光點,該等光點係分別對應其所屬檢測影像所對應之區塊的發光單元,每二相鄰之該區塊有一重疊區域,該重疊區域包含至少一被點亮之該發光單元;以及 以該重疊區域之至少一該被點亮之該發光單元所對應的光點作為對位參考點,而將該相鄰區塊的檢測影像相互拼接成一體。In order to achieve the above object, the luminescent material image processing method provided by the present invention uses an image capturing device to capture images of a plurality of light emitting units of a luminescent material, and a field of view of the image capturing device is smaller than the luminescence of the luminescent material The distribution range of the unit; the steps of the image processing method of the light-emitting unit of the luminescent material include: Light up at least part of the light-emitting unit of the light-emitting material; The image capturing device is used to capture images of a plurality of blocks of the light-emitting material to obtain a plurality of detection images corresponding to the blocks, wherein each block contains a plurality of light-emitting units that are lit, and each The detection image includes a plurality of light spots, and the light spots are respectively corresponding to the light-emitting unit of the block corresponding to the detection image. Every two adjacent blocks has an overlapping area, and the overlapping area includes at least one lighted up area. Light-emitting unit; and Taking at least one light spot corresponding to the illuminated light-emitting unit in the overlapping area as an alignment reference point, and splicing the detected images of the adjacent blocks into a whole.

在本發明的一實施例中,在點亮該發光物料之至少部分發光單元後,先使該影像擷取裝置之視野範圍涵蓋該發光物料之一第一區塊(包含複數被點亮之發光單元),以拍攝該第一區塊而得到一第一檢測影像(包含複數第一光點),再使該影像擷取裝置之視野範圍涵蓋該發光物料之一第二區塊(包含複數被點亮之發光單元),以拍攝該第二區塊而得到一第二檢測影像(包含複數第二光點),且該第一區塊與該第二區塊有一重疊區域(包含至少一被點亮之發光單元),利用至少一個分別存在於該第一、第二檢測影像中對應著相同的發光單元的光點作為對位參考點,而將該第一檢測影像與該第二檢測影像相互拼接,使得該重疊區域之各該發光單元所對應之第一光點與第二光點相互重疊。根據發光物料之發光單元分佈面積大小,能以前述之方式再擷取發光物料之第三區塊(與第二區塊有一重疊區域)的第三檢測影像、第四區塊(與第三區塊有一重疊區域)的第四檢測影像等等,並以前述之方式再將第三檢測影像與第二檢測影像拼接、第四檢測影像與第三檢測影像拼接,以此類推。In an embodiment of the present invention, after lighting at least part of the light-emitting unit of the light-emitting material, the field of view of the image capturing device is first made to cover a first area of the light-emitting material (including a plurality of light-emitting Unit) to capture the first block to obtain a first detection image (including a plurality of first light points), and then make the field of view of the image capturing device cover a second block (including a plurality of light-emitting materials) Lit up the light-emitting unit) to capture the second area to obtain a second detection image (including a plurality of second light spots), and the first area and the second area have an overlapping area (including at least one covered area) Illuminated light-emitting unit), using at least one light spot corresponding to the same light-emitting unit in the first and second detection images as the alignment reference point, and the first detection image and the second detection image Mutual splicing, so that the first light spot and the second light spot corresponding to each of the light-emitting units in the overlapping area overlap each other. According to the distribution area of the light-emitting unit of the light-emitting material, the third detection image and the fourth area (and the third area) of the third block (with the second block) of the light-emitting material Block a fourth detection image with an overlapping area) and so on, and then stitch the third detection image and the second detection image, the fourth detection image and the third detection image in the aforementioned manner, and so on.

藉此,本發明之發光物料發光單元影像處理方法可將對同一發光物料分成多次擷取之影像拼接成單一影像,進而使同一發光物料上的全部發光單元的發光情況呈現於單一影像上,以利使用者觀測該發光物料之發光分佈情況。Thereby, the image processing method of the light-emitting unit of the luminescent material of the present invention can split the same light-emitting material into multiple captured images and stitch them into a single image, so that the light-emitting conditions of all the light-emitting units on the same light-emitting material are presented on a single image. To facilitate users to observe the luminous distribution of the luminous material.

有關本發明所提供之發光物料發光單元影像處理方法的詳細構造、特點、組裝或使用方式,將於後續的實施方式詳細說明中予以描述。然而,在本發明領域中具有通常知識者應能瞭解,該等詳細說明以及實施本發明所列舉的特定實施例,僅係用於說明本發明,並非用以限制本發明之專利申請範圍。The detailed structure, characteristics, assembly or use of the image processing method of the light-emitting unit of the luminescent material provided by the present invention will be described in the detailed description of the subsequent embodiments. However, those with ordinary knowledge in the field of the present invention should be able to understand that the detailed description and the specific embodiments listed for implementing the present invention are only used to illustrate the present invention, and are not intended to limit the scope of the patent application of the present invention.

申請人首先在此說明,在以下將要介紹之實施例以及圖式中,相同之參考號碼,表示相同或類似之元件或其結構特徵。需注意的是,圖式中的各元件及構造為例示方便並非依據真實比例及數量繪製,且若實施上為可能,不同實施例的特徵係可以交互應用。其次,當述及一元件設置於另一元件上時,代表前述元件係直接設置在該另一元件上,或者前述元件係間接地設置在該另一元件上,亦即,二元件之間還設置有一個或多個其他元件。而述及一元件「直接」設置於另一元件上時,代表二元件之間並無設置任何其他元件。The applicant first explains here that in the embodiments and drawings to be introduced below, the same reference numbers indicate the same or similar elements or structural features. It should be noted that the various elements and structures in the drawings are illustrative for convenience and are not drawn based on actual proportions and quantities, and if it is possible in implementation, the features of different embodiments can be applied interactively. Secondly, when it is mentioned that an element is arranged on another element, it means that the aforementioned element is directly arranged on the other element, or the aforementioned element is indirectly arranged on the other element, that is, there is still another element between the two elements. One or more other elements are provided. When it is mentioned that one element is "directly" arranged on another element, it means that no other element is arranged between the two elements.

請先參閱圖1,本發明一較佳實施例所提供之發光物料影像處理方法(如圖2所示)主要係應用於一發光物料10之發光分佈檢測,該發光物料10包含有一本體12以及正、負電極13、14,該本體12上有多個發光單元15(包含圖3及圖4所示之發光單元15a~o)。或者,電極13、14亦可皆為正電極,而負電極係位於發光物料10之背面(設有發光單元15的表面為正面)。該發光物料10可以為(但不限於)諸如具有複數出光口的VCSEL晶片或具有複數micro LED的微發光二極體陣列晶片之類的發光元件,該本體12上的發光單元15即為發光元件的最小發光單位,亦即VCSEL晶片之出光口或是各個micro LED的發光部位,其數量通常為數百或數千個,且不一定是呈規則地矩陣排列,為了簡化圖式並便於說明,本實施例係將發光物料10的發光單元15繪製成規則地矩陣排列。Please refer to FIG. 1. The luminescent material image processing method (shown in FIG. 2) provided by a preferred embodiment of the present invention is mainly applied to the luminescence distribution detection of a luminescent material 10, the luminescent material 10 includes a body 12 and The positive and negative electrodes 13, 14, and the body 12 has a plurality of light-emitting units 15 (including the light-emitting units 15a~o shown in FIG. 3 and FIG. 4). Alternatively, the electrodes 13 and 14 may both be positive electrodes, and the negative electrode is located on the back of the light-emitting material 10 (the surface provided with the light-emitting unit 15 is the front). The light-emitting material 10 can be (but is not limited to) a light-emitting element such as a VCSEL chip with a plurality of light exit ports or a micro-light-emitting diode array chip with a plurality of micro LEDs. The light-emitting unit 15 on the body 12 is the light-emitting element. The smallest light-emitting unit, that is, the light-emitting port of the VCSEL chip or the light-emitting part of each micro LED, the number is usually hundreds or thousands, and it is not necessarily arranged in a regular matrix. In order to simplify the diagram and facilitate the description, In this embodiment, the light-emitting units 15 of the light-emitting material 10 are drawn into a regular matrix arrangement.

本發明之發光物料影像處理方法係利用一影像擷取裝置(圖中未示)擷取該發光物料10之發光單元15發光時的影像,以供使用者進行後續觀測。該影像擷取裝置可為感光元件採用電荷耦合元件(charge-coupled device;簡稱CCD)或互補式金屬氧化物半導體(complementary metal-oxide-semiconductor;簡稱CMOS)之相機或攝影機,為了將肉眼無法區分之發光單元15的光線拍攝成影像,並且為了避免擷取到的光線因傳輸距離太遠而衰減或受到環境光源干擾,該影像擷取裝置需貼近發光物料10以進行拍攝,因此,如圖1所示,該影像擷取裝置可視之視野範圍20係小於該發光物料10之發光單元15的分佈範圍,亦即該視野範圍20僅可涵蓋該發光物料10之部分發光單元15,本實施例為了簡化圖式並便於說明,僅示意性地以該視野範圍20涵蓋九個發光單元15,實際上該視野範圍20通常會涵蓋更多發光單元15。The light-emitting material image processing method of the present invention uses an image capturing device (not shown in the figure) to capture an image when the light-emitting unit 15 of the light-emitting material 10 emits light for the user to observe. The image capture device can be a camera or video camera that uses a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) for the photosensitive element. In order to make it indistinguishable by the naked eye The light of the light-emitting unit 15 is shot into an image, and in order to prevent the captured light from being attenuated due to the transmission distance being too far or being interfered by the ambient light source, the image capturing device needs to be close to the light-emitting material 10 for shooting, as shown in Figure 1 As shown, the visible field of view 20 of the image capturing device is smaller than the distribution range of the light-emitting units 15 of the light-emitting material 10, that is, the field of view 20 can only cover part of the light-emitting units 15 of the light-emitting material 10. This embodiment is for To simplify the drawings and facilitate the description, the field of view range 20 only schematically covers nine light-emitting units 15. In fact, the field of view range 20 usually covers more light-emitting units 15.

該發光物料影像處理方法包含有下列步驟:The luminous material image processing method includes the following steps:

a) 如圖2中的步驟S1,點亮該發光物料10之至少部分發光單元15。a) In step S1 in Fig. 2, at least part of the light-emitting unit 15 of the light-emitting material 10 is lighted up.

如前所述,該影像擷取裝置可視之視野範圍20僅可涵蓋該發光物料10之部分發光單元15,亦即在後續步驟中該影像擷取裝置進行一次拍攝只會擷取一部分發光單元15的影像(在本實施例中為九個發光單元15),故此步驟a)可同時點亮該發光物料10之全部發光單元15,亦可僅先點亮部分發光單元15。較佳地,本實施例之步驟a)可僅先點亮圖1所示之第一部分16的發光單元15,以供該影像擷取裝置由左而右地連續拍攝而逐次擷取該第一部分16之發光單元15發光時的影像,或者亦可在每次拍攝時僅點亮當次拍攝的發光單元15。As mentioned above, the visible field of view 20 of the image capture device can only cover part of the light-emitting units 15 of the light-emitting material 10. That is, in the subsequent steps, the image capture device only captures a part of the light-emitting units 15 for one shot. (In this embodiment, there are nine light-emitting units 15), so in step a), all the light-emitting units 15 of the light-emitting material 10 can be lighted up at the same time, or only a part of the light-emitting units 15 can be lighted up first. Preferably, in step a) of this embodiment, only the light-emitting unit 15 of the first part 16 shown in FIG. 1 can be lighted first, so that the image capturing device can continuously shoot from left to right and sequentially capture the first part 16 of the image when the light-emitting unit 15 emits light, or only the light-emitting unit 15 of the current shot can be lighted up each time.

b) 如圖2中的步驟S2,利用該影像擷取裝置分別擷取該發光物料10之複數區塊(包含圖3及圖4所示之區塊161、162)的影像,而得到分別對應該等區塊之複數檢測影像(包含圖5所示之檢測影像31、32),其中,各區塊包含複數被點亮之發光單元15(在本實施例中為九個發光單元15),各檢測影像包含複數光點(在本實施例中為九個光點,例如圖5所示之光點311~319或321~329),該等光點係分別對應其所屬檢測影像所對應之區塊的發光單元15,每二相鄰之區塊有一重疊區域,該重疊區域包含至少一被點亮之發光單元15(實際為1~100個,或更多),詳述於下文。b) In step S2 in FIG. 2, the image capturing device is used to capture images of a plurality of blocks of the light-emitting material 10 (including the blocks 161 and 162 shown in FIGS. 3 and 4) to obtain respective alignments. It should wait for the multiple detection images of the blocks (including the detection images 31 and 32 shown in FIG. 5), where each block includes a plurality of light-emitting units 15 (in this embodiment, nine light-emitting units 15) that are lit, Each detection image contains a plurality of light spots (in this embodiment, there are nine light spots, such as light spots 311~319 or 321~329 shown in Figure 5), and these light spots correspond to the corresponding detection images. For the light-emitting units 15 of a block, every two adjacent blocks have an overlapping area, and the overlapping area includes at least one light-emitting unit 15 (actually 1-100 or more), which is described in detail below.

對於該影像擷取裝置每次拍攝的區塊,其發光單元發出之光線被影像擷取裝置接收時,影像擷取裝置之感光元件感測到光訊號,影像擷取裝置將光訊號進行處理而形成相對應感光狀態的檢測影像,使得肉眼無法區分之該等發光單元的光線在檢測影像上呈現出光點。本發明中所述之光點,實際上大多呈不規則形狀,然而,為了簡化圖式並便於說明,本發明之圖式中光點皆繪製成圓形。For each block captured by the image capture device, when the light emitted by the light-emitting unit is received by the image capture device, the photosensitive element of the image capture device senses the light signal, and the image capture device processes the light signal. The detection image corresponding to the photosensitive state is formed, so that the light from the light-emitting units, which cannot be distinguished by the naked eye, presents a light spot on the detection image. In fact, most of the light spots described in the present invention are in irregular shapes. However, in order to simplify the drawings and facilitate the description, the light spots in the drawings of the present invention are all drawn as circles.

更進一步而言,此步驟b)包含有下列步驟:Furthermore, this step b) includes the following steps:

b1) 如圖3所示,使該影像擷取裝置之視野範圍20涵蓋該發光物料10之第一區塊161,以拍攝該第一區塊161而得到如圖5所示之第一檢測影像31,其中,該第一區塊161包含複數被點亮之發光單元(在本實施例中為九個發光單元15a~15i),該第一檢測影像31包含分別對應該第一區塊161之發光單元15a~15i的複數第一光點311~319。b1) As shown in FIG. 3, make the field of view 20 of the image capturing device cover the first block 161 of the light-emitting material 10 to shoot the first block 161 to obtain the first detection image shown in FIG. 5 31. Wherein, the first block 161 includes a plurality of light-emitting units (in this embodiment, nine light-emitting units 15a~15i) that are lit, and the first detection image 31 includes the first block 161 respectively. The plural first light spots 311 to 319 of the light emitting units 15a to 15i.

b2) 如圖4所示,使該影像擷取裝置之視野範圍20涵蓋該發光物料10之第二區塊162,以拍攝該第二區塊162而得到如圖5所示之第二檢測影像32,其中,該第二區塊162包含複數被點亮之發光單元(在本實施例中為九個發光單元15g~15o),該第二檢測影像32包含分別對應該第二區塊162之發光單元15g~15o的複數第二光點321~329。如圖3及圖4所示,該第一區塊161及該第二區塊162皆涵蓋發光單元15g~15i,亦即該第一區塊161與該第二區塊162有一包含發光單元15g~15i之重疊區域。b2) As shown in FIG. 4, make the field of view 20 of the image capturing device cover the second block 162 of the light-emitting material 10 to shoot the second block 162 to obtain the second inspection image as shown in FIG. 5 32. Wherein, the second block 162 includes a plurality of light-emitting units (in this embodiment, nine light-emitting units 15g~15o) that are lit, and the second detection image 32 includes the second block 162 respectively. The plurality of second light spots 321-329 of the light-emitting unit 15g-15o. As shown in FIGS. 3 and 4, the first block 161 and the second block 162 both cover light-emitting units 15g-15i, that is, the first block 161 and the second block 162 include a light-emitting unit 15g ~15i overlap area.

利用類同於前述步驟b1)與b2)之方式,由左而右地再繼續擷取發光物料10之一位於第二區塊162右側且與第二區塊162有一重疊區域之第三區塊的第三檢測影像(圖中未示),以此類推,即可連續拍攝完該發光物料10之第一部分16的發光單元15,並取得多個檢測影像。Using a method similar to the aforementioned steps b1) and b2), continue to extract from left to right one of the luminous materials 10 is located on the right side of the second block 162 and has an overlapping area with the second block 162 of the third block The third detection image (not shown in the figure), and so on, can continuously shoot the light-emitting unit 15 of the first part 16 of the light-emitting material 10, and obtain multiple detection images.

c) 如圖2中的步驟S3,利用重疊區域之同一發光單元15所對應的光點對位,而將相鄰區塊的檢測影像相互拼接成一體。c) Step S3 in Fig. 2, using the light spots corresponding to the same light-emitting unit 15 in the overlapping area to align, and splicing the detected images of adjacent blocks into one body.

詳而言之,將前述之第一檢測影像31與第二檢測影像32相互拼接時,係利用第一檢測影像31與第二檢測影像32中有分別出現的、且對應著重疊區域中相同的發光單元15的若干光點(例如第一光點317、318、319以及第二光點321、322、323都是對應著發光單元15g~15i),作為第一檢測影像31與第二檢測影像32拼接時的對位參考點,如此即可將第一檢測影像31與第二檢測影像32拼接成一個影像,使得第一、二區塊161、162之重疊區域的發光單元15g~15i所對應之光點相互重疊,亦即如圖5所示,第一檢測影像31之第一光點317、318、319分別與第二檢測影像32之第二光點321、322、323相互重疊。以相同之方式再將拍攝該發光物料10之第一部分16所取得之其他相鄰區塊的檢測影像連續向右拼接,例如將前述之第三檢測影像拼接於第二檢測影像32右側,以此類推,即可將該發光物料10之第一部分16的發光單元15影像拼接在一起。In detail, when the aforementioned first detection image 31 and second detection image 32 are spliced with each other, the first detection image 31 and the second detection image 32 are used to respectively appear and correspond to the same in the overlapping area. Several light spots of the light-emitting unit 15 (for example, the first light points 317, 318, 319 and the second light points 321, 322, and 323 correspond to the light-emitting units 15g~15i) as the first detection image 31 and the second detection image 32 is the alignment reference point when splicing, so that the first detection image 31 and the second detection image 32 can be spliced into one image, so that the light-emitting units 15g~15i in the overlapping area of the first and second blocks 161 and 162 correspond to The light spots overlap each other, that is, as shown in FIG. 5, the first light spots 317, 318, and 319 of the first detection image 31 overlap with the second light spots 321, 322, and 323 of the second detection image 32, respectively. In the same way, the inspection images of other adjacent blocks obtained by shooting the first part 16 of the luminescent material 10 are continuously spliced to the right, for example, the aforementioned third inspection image is spliced on the right side of the second inspection image 32, thereby By analogy, the images of the light-emitting units 15 of the first part 16 of the light-emitting material 10 can be spliced together.

以前述之步驟a)、b)完成第一部分16之影像擷取之後,可接著再點亮該發光物料10之一第二部分17的發光單元15(如圖1所示),並以類同於前述步驟b1)與b2)之方式由右到左地再繼續擷取第二部分17之多個區塊的檢測影像,以此類推,進而得到該發光物料10之全部發光單元15的影像,並利用前述之步驟c)將全部檢測影像拼接成單一且可顯示出整個發光物料10所有發光單元15的影像。需加以說明的是,在進行第二部分17多個區塊影像擷取時,除了左右相鄰的檢測影像有發光單元15所對應的光點重疊的部分可以作為左右相鄰影像拼接時的對位參考點外,第二部分17某一區塊所擷取的檢測影像與其第一部分16上下對應區塊所擷取的檢測影像亦可能有光點重疊的部分可以作為上下相鄰影像拼接時的對位參考點,換言之,本發明所稱「相鄰區塊」可以為左右相鄰或上下相鄰的區塊。After the image capturing of the first part 16 is completed by the aforementioned steps a) and b), the light-emitting unit 15 of the second part 17 (as shown in FIG. 1), which is one of the light-emitting materials 10, can be lighted up, and similar In the aforementioned steps b1) and b2), continue to capture the detection images of the multiple blocks of the second part 17 from right to left, and so on, to obtain the images of all the light-emitting units 15 of the light-emitting material 10. And use the aforementioned step c) to splice all the detected images into a single image that can display all the light-emitting units 15 of the entire light-emitting material 10. It should be noted that when capturing images of multiple blocks in the second part 17, except for the left and right adjacent detection images where the light spots corresponding to the light-emitting unit 15 overlap, it can be used as a pair of left and right adjacent images when splicing. In addition to the reference point, the detection image captured by a certain block of the second part 17 and the detection image captured by the corresponding blocks in the upper and lower parts of the first part 16 may also have overlapping parts of light spots, which can be used as the upper and lower adjacent images when stitching. Alignment reference points, in other words, the "adjacent blocks" referred to in the present invention may be blocks adjacent to the left and right or adjacent to the top and bottom.

更進一步而言,在前述之過程中,該影像擷取裝置取得各該檢測影像之後,係將檢測影像傳輸至一儲存裝置(圖中未示)進行儲存,然後,可利用影像處理軟體對各該檢測影像進行後處理,進而取得並記錄各該檢測影像之光點的特徵,例如位置、亮度、尺寸等等,在進行檢測影像拼接時即可藉由光點之至少一項前述特徵,確認哪些對應著相同的發光單元15的光點有分別出現在相鄰區塊的擷取影像中,如此,即可判斷出應相互重疊之光點並進行影像拼接,詳述於下文。Furthermore, in the aforementioned process, after the image capturing device obtains each of the detected images, the detected images are transferred to a storage device (not shown in the figure) for storage, and then the image processing software can be used to analyze each of the detected images. The detection image is post-processed to obtain and record the characteristics of the light spot of each detection image, such as position, brightness, size, etc., when the detection image is spliced, at least one of the aforementioned characteristics of the light spot can be used to confirm Which light points corresponding to the same light-emitting unit 15 appear in the captured images of adjacent blocks, respectively, so that the light points that should overlap each other can be determined and image splicing is performed, which are described in detail below.

在點亮發光物料10並擷取影像之前,可先掃描出整個發光物料10之全部發光單元15的位置,記錄各個發光單元15的座標,而在進行檢測影像拼接時,可根據事先掃描而得之發光單元位置,與拍攝時視野範圍20相對於發光物料10之位置以及檢測影像之光點相對於視野範圍20之位置相互比對,藉以判斷出各該光點所對應之發光單元15的位置(座標),如此,即可確認哪些對應著相同的發光單元15的光點有分別出現在相鄰區塊的擷取影像中,並以這些光點作為影像拼接時的對位參考點來進行影像拼接。Before illuminating the light-emitting material 10 and capturing images, scan the positions of all the light-emitting units 15 of the entire light-emitting material 10 and record the coordinates of each light-emitting unit 15. When splicing the detected images, it can be obtained by scanning in advance. The position of the light-emitting unit is compared with the position of the field of view 20 relative to the light-emitting material 10 during shooting and the position of the light spot of the detected image relative to the field of view 20 to determine the position of the light-emitting unit 15 corresponding to each light spot (Coordinates), in this way, it can be confirmed which light points corresponding to the same light-emitting unit 15 appear in the captured images of adjacent blocks respectively, and these light points are used as the alignment reference points for image stitching. Image stitching.

其次,各該光點之亮度的取得方式,可利用影像處理軟體對檢測影像之每一個像素(pixel)進行後處理,而測得檢測影像之每一個像素的相對光強度,然後對各光點所佔之像素的相對光強度計算出其平均值,而得到各該光點之相對光強度,亦即各該光點之亮度,其可代表各該發光單元15之光強度。舉例而言,圖6所示之光點311佔了檢測影像31中的九個像素33,計算該九個像素33之相對光強度的平均值,即可求得該光點311之相對光強度,而該光點311之相對光強度即可代表該光點311所對應之發光單元15a的光強度。為了簡化圖式,本發明之圖式中僅以假想線示意性地繪製出該檢測影像31之其中九個像素33,以便說明。值得一提的是,本發明中所述之相對光強度係由影像處理軟體計算出之可代表發光強度的數值,利用一標準光源之影像所測得之相對光強度對照該標準光源實際之發光強度物理量(單位例如為燭光),即可藉由此對照數據將測得之光點的相對光強度換算成其對應之發光單元的實際光強度。Secondly, the method of obtaining the brightness of each light spot can be post-processed on each pixel (pixel) of the detected image using image processing software, and the relative light intensity of each pixel of the detected image is measured, and then the relative light intensity of each pixel of the detected image is measured. The relative light intensity of the occupied pixels is calculated as the average value, and the relative light intensity of each light spot, that is, the brightness of each light spot, is obtained, which can represent the light intensity of each light emitting unit 15. For example, the light spot 311 shown in FIG. 6 occupies nine pixels 33 in the detection image 31, and the relative light intensity of the nine pixels 33 is calculated to obtain the relative light intensity of the light spot 311 , And the relative light intensity of the light spot 311 can represent the light intensity of the light-emitting unit 15a corresponding to the light spot 311. In order to simplify the drawing, only nine pixels 33 of the detection image 31 are schematically drawn in the drawing of the present invention with imaginary lines for the sake of explanation. It is worth mentioning that the relative light intensity mentioned in the present invention is a value calculated by image processing software that can represent the luminous intensity. The relative light intensity measured by the image of a standard light source is compared with the actual luminous intensity of the standard light source. Intensity physical quantity (for example, the unit is candlelight), which can be used to convert the relative light intensity of the measured light point into the actual light intensity of the corresponding light-emitting unit through the comparison data.

為了簡化圖式,本發明係將光點繪製成相同大小,然而,同一發光物料10或發光元件之各個發光單元15的發光面積或光束直徑(beam diameter)不一定相同,因此其檢測影像實際上會有大小不同的光點。換言之,各該光點之尺寸係代表其對應之發光單元15的發光面積或光束直徑,其取得方式係計算各該光點所佔之像素數量(對應像素面積)。由於發光單元15之發光面積或光束直徑越大,其對應之光點就會越大,而其所佔之像素則越多,因此藉由計算各該光點所佔之像素數量即可求得其對應之發光單元15的發光面積或光束直徑。In order to simplify the diagram, the present invention draws the light spots into the same size. However, the light-emitting area or beam diameter of each light-emitting unit 15 of the same light-emitting material 10 or light-emitting element is not necessarily the same, so the detected image is actually There will be light spots of different sizes. In other words, the size of each light spot represents the light-emitting area or beam diameter of its corresponding light-emitting unit 15, and the method of obtaining it is to calculate the number of pixels (corresponding pixel area) occupied by each light spot. Since the larger the light-emitting area or beam diameter of the light-emitting unit 15, the larger the corresponding light spot, and the more pixels it occupies, it can be obtained by calculating the number of pixels occupied by each light spot It corresponds to the light-emitting area or beam diameter of the light-emitting unit 15.

在將每兩相鄰區塊之檢測影像相互拼接時,係根據前述光點之位置、亮度、尺寸等物理或光學特徵,在可能的重疊區域中(例如前一幀影像的右側部位與後一幀影像的左側部位中)匹配出特徵相對應之光點,這些光點即為分別存在二個影像中、對應著相同的發光單元15而可作為影像拼接時的對位參考點。舉例而言,若檢測影像31中光點317、318、319之亮度(或相對光強度,以下亦同)分別為95、90、85三個數值,表示這三個光點317、318、319彼此之間有亮度數值差5的亮度相對關係,而檢測影像32中光點321、322、323之亮度分別為100、95、90三個數值,表示這三個光點321、322、323彼此之間同樣有亮度數值差5的亮度相對關係,由此,可得知檢測影像31之光點317、318、319的亮度相對關係與檢測影像32之光點321、322、323的亮度相對關係相互匹配(亦即相同或在一合理的誤差範圍內(例如3%內)相類似),藉此可判斷檢測影像31之光點317、318、319分別與檢測影像32之光點321、322、323應該是對應相同的發光單元,即發光單元15g、15h、15i,因為相同的發光單元在相鄰檢測影像中所對應的光點,應該具有相同或極度類似的亮度相對關係。換言之,藉由比對多個光點之間的亮度相對關係(例如光點與光點之間的亮度值的差值關係)是否相互匹配,可以確認光點317、318、319與光點321、322、323應為相同的發光單元15g、15h、15i所對應的光點,並且分別出現在檢測影像31與檢測影像32中,如此一來,即可利用光點317、318、319與光點321、322、323當作對位參考點,將檢測影像31之光點317、318、319分別與檢測影像32之光點321、322、323位置重疊,而將檢測影像31與檢測影像32拼接成一幅包含有第一、二區塊161、162所有發光單元15的影像。同樣地,藉由比對多個光點之間的尺寸相對關係(例如光點與光點之間的尺寸的差值關係)是否相同或相類似,可以確認哪些光點應為相同的發光單元15所產生,並且分別出現在相鄰的影像中,而可利用這些光點當作對位參考點來拼接影像。When splicing the detected images of every two adjacent blocks with each other, based on the physical or optical characteristics of the aforementioned light spot's position, brightness, size, etc., in the possible overlap area (for example, the right part of the previous frame of image and the next In the left part of the frame image, the light spots corresponding to the features are matched. These light spots exist in the two images and correspond to the same light-emitting unit 15 and can be used as alignment reference points for image splicing. For example, if the brightness (or relative light intensity, the same below) of the light spots 317, 318, 319 in the detected image 31 are respectively 95, 90, and 85, it means that these three light spots 317, 318, 319 There is a brightness relative relationship with a brightness value difference of 5, and the brightness of the light spots 321, 322, and 323 in the detected image 32 are 100, 95, and 90 respectively, which means that the three light spots 321, 322, and 323 are mutually exclusive. There is also a brightness relative relationship with a brightness value difference of 5, from which we can know the relative brightness of the light points 317, 318, 319 of the detected image 31 and the relative brightness of the light points 321, 322, 323 of the detected image 32 Mutual matching (that is, the same or similar within a reasonable error range (for example, within 3%)), it can be determined that the light spots 317, 318, and 319 of the detection image 31 are respectively the light spots 321, 322 of the detection image 32 , 323 should correspond to the same light-emitting unit, that is, light-emitting units 15g, 15h, 15i, because the light spots corresponding to the same light-emitting unit in adjacent detection images should have the same or extremely similar brightness relative relationship. In other words, by comparing the relative brightness relationship between the multiple light spots (for example, the difference relationship between the brightness value between the light spot and the light spot), it can be confirmed that the light spots 317, 318, 319 and the light spots 321, 321, 322 and 323 should be the light spots corresponding to the same light-emitting unit 15g, 15h, 15i, and appear in the detection image 31 and the detection image 32 respectively. In this way, the light spots 317, 318, 319 and the light spots can be used 321, 322, and 323 are used as alignment reference points. The light points 317, 318, and 319 of the detection image 31 are overlapped with the light points 321, 322, and 323 of the detection image 32 respectively, and the detection image 31 and the detection image 32 are spliced into one The frame contains the images of all the light-emitting units 15 in the first and second blocks 161 and 162. Similarly, by comparing the relative size relationship between multiple light spots (for example, the size difference relationship between light spots and light spots) is the same or similar, it is possible to confirm which light spots should be the same light-emitting unit 15 Generated and appear in adjacent images respectively, and these light points can be used as alignment reference points to stitch images.

理論上,同一發光單元15在不同幀影像中所計算出來的亮度值理應相同,但實際上,以上述內容為例,同一發光單元15所對應的光點在不同幀影像中所計算出來的亮度值可能會產生一定程度的偏移量(代表著某一幀影像中所有發光單元15所對應的光點的亮度值全部偏移一特定數值),使得相互拼接之二檢測影像上對應同一發光單元15的光點有不同的亮度值而無法對應銜接,在此情況下,可將至少其中一該檢測影像之全部光點的亮度值補償校正(一起調高或調低一個前述的偏移量)回來,以使得不同檢測影像拼接成單一影像時,全部的光點之間都有相同的亮度基準值。因此,本發明中將該等檢測影像相互拼接之步驟,可更包含一調整至少部分檢測影像之光點的亮度值的步驟,使得拼接的影像中,相互重疊之光點的亮度值一致。以前述之例子而言,在將檢測影像31中亮度值分別為95、90、85之光點317、318、319分別與檢測影像32中亮度值分別為100、95、90之光點321、322、323相互重疊時,可先將檢測影像32中全部光點321~329之亮度值皆減少5,使得光點321、322、323之亮度分別調整成95、90、85而與光點317、318、319之亮度值相同,如此一來,可以避免拼接後第二區塊162中所有發光單元15的亮度數值與第一區塊161中所有發光單元15的亮度數值之間存在有一量測的偏移量。Theoretically, the brightness values calculated by the same light-emitting unit 15 in different frames of images should be the same, but in fact, taking the above content as an example, the brightness of the light points corresponding to the same light-emitting unit 15 in different frames of images should be the same. The value may have a certain degree of offset (representing that the brightness values of the light spots corresponding to all the light-emitting units 15 in a certain frame of image are all offset by a specific value), so that the two mutually stitched detection images correspond to the same light-emitting unit 15 light spots have different brightness values and cannot be connected accordingly. In this case, at least one of the light spots of the detected image can be compensated for the brightness value of all the light spots (to increase or decrease one of the aforementioned offsets together) Back, so that when different detected images are spliced into a single image, all the light spots have the same brightness reference value. Therefore, the step of splicing the detected images with each other in the present invention may further include a step of adjusting the brightness value of at least part of the light points of the detected image, so that the brightness values of the overlapping light points in the spliced image are consistent. In the foregoing example, the light points 317, 318, and 319 with brightness values of 95, 90, and 85 in the detection image 31 are respectively compared with the light points 321, 318, and 319 with brightness values of 100, 95, and 90 in the detection image 32, respectively. When 322 and 323 overlap each other, the brightness values of all light spots 321~329 in the detection image 32 can be reduced by 5, so that the brightness of light spots 321, 322, and 323 are adjusted to 95, 90, and 85, respectively, and that of light spot 317 , 318, and 319 have the same brightness values. In this way, it can be avoided that there is a measurement between the brightness values of all the light-emitting units 15 in the second block 162 and the brightness values of all the light-emitting units 15 in the first block 161 after splicing. The offset.

在前述例子中,調整光點亮度值之方式,係根據相互重疊之二光點的亮度值之差值進行調整,然而,亦可根據相互重疊之二光點的亮度值之比值進行調整。更明確地說,可在重疊區域內選擇一發光單元15作為一參考發光單元,例如以發光單元15g作為參考發光單元,並取得該參考發光單元15g所對應之第一光點317及第二光點321的亮度值之比值或差值,再根據所述比值或差值調整全部第二光點321~329之亮度值。In the foregoing example, the method of adjusting the brightness value of the light spots is based on the difference between the brightness values of the two overlapping light spots. However, it can also be adjusted based on the ratio of the brightness values of the two overlapping light spots. More specifically, a light-emitting unit 15 can be selected as a reference light-emitting unit in the overlapping area, for example, the light-emitting unit 15g can be used as a reference light-emitting unit, and the first light spot 317 and the second light corresponding to the reference light-emitting unit 15g can be obtained. The ratio or difference of the brightness values of the points 321, and then adjust the brightness values of all the second light points 321 to 329 according to the ratio or the difference.

在前述例子中,係以光點與光點之間的亮度值的差值關係作為特徵,而非以光點亮度值作為特徵,來判斷哪些對應相同發光單元15的光點分別存在二個影像中,以便以這些重複出現的光點作為影像拼接時的對位參考點,如此方式,可以避免直接以光點亮度值作為特徵時,萬一在相鄰二幀影像中亮度存在有量測偏移量時,無法判斷出到底是哪些對應著相同的發光單元15的光點分別存在二個影像中的問題(因為同樣的發光單元所對應的光點在不同幀影像中,亮度數值不同)。然而,本發明並不以光點與光點之間的亮度值的差值關係作為判斷特徵為限,例如,在二幀影像中亮度不存在量測偏移量或量測偏移量不顯著時,可以直接利用光點亮度值作為判斷特徵;其次,除了單獨以光點之位置、亮度或尺寸作為判斷特徵之外,亦可同時以光點之位置、亮度或尺寸其中二項或三項來作為判斷特徵。In the foregoing example, the difference between the brightness value of the light spot and the light spot is used as a feature, rather than the brightness value of the light spot as a feature, to determine which light spots corresponding to the same light-emitting unit 15 have two images respectively. In order to use these repetitive light spots as the alignment reference point for image stitching, this way can avoid the direct use of the light spot brightness value as a feature, in case there is a measurement deviation in the brightness of the adjacent two frames of images. When shifting the amount, it is impossible to determine which light points corresponding to the same light-emitting unit 15 have problems in the two images respectively (because the light points corresponding to the same light-emitting unit have different brightness values in different frames of images). However, the present invention is not limited to the determination feature of the difference between the brightness value of the light spot and the light spot. For example, there is no measurement offset or the measurement offset is not significant in the two-frame image. When, you can directly use the brightness value of the light spot as the judgment feature; secondly, in addition to the location, brightness or size of the light spot alone as the judgment feature, you can also use two or three of the location, brightness or size of the light spot at the same time As a judgment feature.

值得一提的是,為了使得各該檢測影像及其拼接而成之單一影像可清楚地顯示出每個發光單元15對應之光點,前述將檢測影像進行後處理而取得之各該光點的相對光強度需在一相對光強度範圍內,然而,若受測之發光物料10的發光單元15發光強度很大,可能造成檢測影像過度曝光,而使得測得之光點的相對光強度有一大部分都超出該相對光強度範圍,在此情況下,該影像擷取裝置分別擷取該發光物料10之各區塊的影像時,可透過一濾光元件(例如濾鏡;圖中未示)(亦即濾光元件係依情況選擇性地設置)過濾該發光物料10之發光單元15發出之光線,以使測得之各該光點的相對光強度皆落在該相對光強度範圍內或只要皆不飽和即可,或者一預定數量比例(例如90%)以上之光點的相對光強度落在該相對光強度範圍內。It is worth mentioning that, in order to make each detection image and the single image stitched together can clearly show the light point corresponding to each light-emitting unit 15, the detection image is post-processed to obtain the light point of each light The relative light intensity needs to be within a range of relative light intensity. However, if the light-emitting unit 15 of the light-emitting material 10 to be tested has a high luminous intensity, it may cause the detection image to be overexposed, and the relative light intensity of the measured light spot will be large. Some of them are beyond the relative light intensity range. In this case, when the image capturing device captures images of each area of the luminescent material 10, it can pass through a filter element (such as a filter; not shown in the figure) (That is, the filter element is selectively set according to the situation) to filter the light emitted by the light-emitting unit 15 of the light-emitting material 10, so that the measured relative light intensity of each light spot falls within the relative light intensity range or As long as they are all unsaturated, or the relative light intensity of a predetermined number of light points (for example, 90%) or more falls within the relative light intensity range.

綜上所陳,本發明之發光物料影像處理方法可將對同一發光物料分成多次擷取之影像拼接成單一影像,進而使同一發光物料上的全部發光單元的發光情況呈現於單一影像上,以利使用者觀測該發光物料之發光分佈情況。In summary, the luminous material image processing method of the present invention can split the same luminous material into multiple captured images and stitch them into a single image, so that the luminous conditions of all light-emitting units on the same luminous material are presented on a single image. To facilitate users to observe the luminous distribution of the luminous material.

最後,必須再次說明,本發明於前揭實施例中所揭露的構成元件,僅為舉例說明,並非用來限制本案之範圍,其他等效元件的替代或變化,亦應為本案之申請專利範圍所涵蓋。Finally, it must be explained again that the constituent elements disclosed in the previously disclosed embodiments of the present invention are only examples and are not intended to limit the scope of the case. Alternatives or changes to other equivalent elements should also be the scope of the patent application for this case. Covered.

10:發光物料 12:本體 13:正電極 14:負電極 15,15a~15o:發光單元 16:第一部分 161:第一區塊 162:第二區塊 17:第二部分 20:視野範圍 31:第一檢測影像 311~319:第一光點 32:第二檢測影像 321~322:第二光點 33:像素 S1~S3:步驟10: Luminous materials 12: body 13: Positive electrode 14: Negative electrode 15,15a~15o: light-emitting unit 16: first part 161: first block 162: second block 17: Part Two 20: Field of view 31: The first detection image 311~319: The first point of light 32: Second detection image 321~322: second light spot 33: pixels S1~S3: steps

圖1為本發明一較佳實施例所提供之發光物料發光單元影像處理方法中一發光物料之示意圖。 圖2為本發明該較佳實施例所提供之發光物料發光單元影像處理方法之流程圖。 圖3及圖4為該發光物料之局部放大圖,係顯示本發明該較佳實施例所提供之發光物料發光單元影像處理方法的一部分步驟。 圖5為本發明該較佳實施例所提供之發光物料發光單元影像處理方法的另一部分步驟的示意圖。 圖6為圖5之A部分的放大圖。FIG. 1 is a schematic diagram of a luminescent material in an image processing method of a luminescent material light-emitting unit provided by a preferred embodiment of the present invention. 2 is a flowchart of an image processing method for a light-emitting unit of a light-emitting material provided by the preferred embodiment of the present invention. 3 and 4 are partial enlarged views of the luminescent material, showing part of the steps of the image processing method of the luminescent material light-emitting unit provided by the preferred embodiment of the present invention. 5 is a schematic diagram of another part of the steps of the image processing method of the light-emitting unit of the luminescent material provided by the preferred embodiment of the present invention. Fig. 6 is an enlarged view of part A of Fig. 5.

S1~S3:步驟S1~S3: steps

Claims (15)

一種發光物料影像處理方法,係利用一影像擷取裝置擷取一發光物料之複數發光單元的影像,該影像擷取裝置之一視野範圍係小於該發光物料之發光單元的分佈範圍;該發光物料影像處理方法之步驟包含有: 點亮該發光物料之至少部分發光單元; 利用該影像擷取裝置分別擷取該發光物料之複數區塊的影像,而得到分別對應該等區塊之複數檢測影像,其中,各該區塊包含複數被點亮之該發光單元,各該檢測影像包含複數光點,該等光點係分別對應其所屬檢測影像所對應之區塊的發光單元,每二相鄰之該區塊有一重疊區域,該重疊區域包含至少一被點亮之該發光單元;以及 以該重疊區域之至少一該被點亮之該發光單元所對應的光點作為對位參考點,而將該相鄰區塊的檢測影像相互拼接成一體。An image processing method for light-emitting materials uses an image capture device to capture images of a plurality of light-emitting units of a light-emitting material, and a field of view of the image capture device is smaller than the distribution range of the light-emitting units of the light-emitting material; the light-emitting material The steps of the image processing method include: Light up at least part of the light-emitting unit of the light-emitting material; The image capturing device is used to capture images of a plurality of blocks of the light-emitting material to obtain a plurality of detection images corresponding to the blocks, wherein each block contains a plurality of light-emitting units that are lit, and each The detection image includes a plurality of light spots, and the light spots are respectively corresponding to the light-emitting unit of the block corresponding to the detection image. Every two adjacent blocks has an overlapping area, and the overlapping area includes at least one lighted up area. Light-emitting unit; and Taking at least one light spot corresponding to the illuminated light-emitting unit in the overlapping area as an alignment reference point, and splicing the detected images of the adjacent blocks into a whole. 如請求項1所述之發光物料影像處理方法,其中所述將該等檢測影像相互拼接之步驟,係根據該等光點之位置、亮度及尺寸三者至少其中之一,判斷出至少一個分別存在於該相鄰區塊的檢測影像中對應著該重疊區域中相同的發光單元的光點,作為該對位參考點。The luminous material image processing method according to claim 1, wherein the step of stitching the detected images with each other is based on at least one of the position, brightness, and size of the light spots to determine at least one The light spots corresponding to the same light-emitting unit in the overlapping area in the detection image existing in the adjacent block are used as the alignment reference point. 如請求項2所述之發光物料影像處理方法,其中所述將該等檢測影像相互拼接之步驟,係根據該等光點之亮度相對關係,判斷出複數個分別存在於該相鄰區塊的檢測影像中分別對應著該重疊區域中相同的發光單元的光點,作為該對位參考點。The luminous material image processing method according to claim 2, wherein the step of splicing the detected images with each other is based on the relative brightness of the light points to determine that a plurality of light spots respectively exist in the adjacent block The light spots corresponding to the same light-emitting unit in the overlapping area respectively in the detected images are used as the alignment reference points. 如請求項3所述之發光物料影像處理方法,其中該等光點之亮度相對關係為該等光點之亮度值的差值關係。The luminous material image processing method according to claim 3, wherein the relative relationship of the brightness of the light points is the difference relationship of the brightness values of the light points. 如請求項4所述之發光物料影像處理方法,其中所述將該等檢測影像相互拼接之步驟,更包含一調整至少部分檢測影像之光點的亮度值的步驟,使得該相鄰區塊的檢測影像中對應相同的發光單元之對位參考點的亮度值之差值小於一預定數值。The luminous material image processing method according to claim 4, wherein the step of stitching the detected images with each other further includes a step of adjusting the brightness value of the light points of at least part of the detected images, so that the adjacent blocks are The difference between the brightness values of the alignment reference points corresponding to the same light-emitting unit in the detected image is less than a predetermined value. 如請求項5所述之發光物料影像處理方法,其中調整光點亮度值之方式,係於該重疊區域內選擇一該發光單元作為一參考發光單元,並取得該參考發光單元於該相鄰區塊的檢測影像中所對應之二個光點的亮度值之比值或差值,再根據所述比值或差值調整其對應之至少一該檢測影像中的所有光點之亮度值。The light-emitting material image processing method according to claim 5, wherein the method of adjusting the brightness value of the light spot is to select a light-emitting unit in the overlapping area as a reference light-emitting unit, and obtain the reference light-emitting unit in the adjacent area The ratio or difference of the brightness values of the two corresponding light points in the detected image of the block is adjusted according to the ratio or difference to adjust the corresponding at least one brightness value of all light points in the detected image. 如請求項2所述之發光物料影像處理方法,其中所述將該等檢測影像相互拼接之步驟,係根據該等光點之亮度值,判斷出複數個分別存在於該相鄰區塊的檢測影像中分別對應著該重疊區域中相同的發光單元的光點,作為該對位參考點。The luminescent material image processing method according to claim 2, wherein the step of stitching the detected images with each other is to determine that a plurality of detections exist in the adjacent block according to the brightness values of the light spots The images respectively correspond to the light spots of the same light-emitting unit in the overlapping area as the alignment reference point. 如請求項1所述之發光物料影像處理方法,其中所述利用該影像擷取裝置分別擷取該發光物料之該複數區塊的影像之步驟中,更包含一過濾該發光物料之發光單元發出之光線的步驟。The light-emitting material image processing method according to claim 1, wherein the step of capturing images of the plurality of blocks of the light-emitting material by the image capturing device further includes a light-emitting unit that filters the light-emitting material and emits The steps of the light. 一種發光物料影像處理方法,係利用一影像擷取裝置擷取一發光物料之複數發光單元的影像,該影像擷取裝置之一視野範圍係小於該發光物料之發光單元的分佈範圍;該發光物料影像處理方法之步驟包含有: 點亮該發光物料之至少部分發光單元; 使該影像擷取裝置之視野範圍涵蓋該發光物料之一第一區塊,以拍攝該第一區塊而得到一第一檢測影像,其中,該第一區塊包含複數被點亮之該發光單元,該第一檢測影像包含分別對應該第一區塊之發光單元的複數第一光點; 使該影像擷取裝置之視野範圍涵蓋該發光物料之一第二區塊,以拍攝該第二區塊而得到一第二檢測影像,其中,該第二區塊包含複數被點亮之該發光單元,該第二檢測影像包含分別對應該第二區塊之發光單元的複數第二光點,該第一區塊與該第二區塊有一重疊區域,該重疊區域包含至少一被點亮之該發光單元;以及 根據該等第一、二光點之位置、亮度及尺寸三者至少其中之一,判斷出至少一個分別存在於該第一、第二檢測影像中對應著相同的發光單元的光點作為對位參考點,而將該第一、第二檢測影像拼接成一體。An image processing method for light-emitting materials uses an image capture device to capture images of a plurality of light-emitting units of a light-emitting material, and a field of view of the image capture device is smaller than the distribution range of the light-emitting units of the light-emitting material; the light-emitting material The steps of the image processing method include: Light up at least part of the light-emitting unit of the light-emitting material; Make the field of view of the image capturing device cover a first block of the light-emitting material to capture the first block to obtain a first detection image, wherein the first block includes a plurality of light-emitting lights Unit, the first detection image includes a plurality of first light spots respectively corresponding to the light-emitting units of the first block; Make the field of view of the image capturing device cover a second block of the light-emitting material to shoot the second block to obtain a second detection image, wherein the second block includes a plurality of lighted up lights Unit, the second detection image includes a plurality of second light spots respectively corresponding to the light-emitting units of the second block, the first block and the second block have an overlapping area, and the overlapping area includes at least one lit The light-emitting unit; and According to at least one of the position, brightness, and size of the first and second light spots, it is determined that at least one light spot corresponding to the same light-emitting unit exists in the first and second detection images as the alignment Reference point, and stitch the first and second detected images into a whole. 如請求項9所述之發光物料影像處理方法,其中所述將該第一檢測影像與該第二檢測影像相互拼接之步驟,係根據該等第一光點及第二光點之亮度相對關係,判斷出複數個分別存在於該第一、第二檢測影像中分別對應著相同的發光單元的光點,作為該對位參考點。The luminescent material image processing method according to claim 9, wherein the step of stitching the first detection image and the second detection image is based on the relative brightness of the first light points and the second light points , It is determined that a plurality of light spots respectively corresponding to the same light-emitting unit existing in the first and second detected images are used as the alignment reference points. 如請求項10所述之發光物料影像處理方法,其中該等第一光點及第二光點之亮度相對關係為該等第一光點及第二光點之亮度值的差值關係。The luminous material image processing method according to claim 10, wherein the relative relationship of the brightness of the first light point and the second light point is the difference relationship between the brightness values of the first light point and the second light point. 如請求項11所述之發光物料影像處理方法,其中所述將該第一檢測影像與該第二檢測影像相互拼接之步驟,更包含一調整該等第二光點的亮度值的步驟,使得該第一、第二檢測影像中對應相同的發光單元之對位參考點的亮度值之差值小於一預定數值。The luminous material image processing method according to claim 11, wherein the step of stitching the first detection image and the second detection image with each other further includes a step of adjusting the brightness values of the second light points, so that The difference between the brightness values of the alignment reference points corresponding to the same light-emitting unit in the first and second detected images is less than a predetermined value. 如請求項12所述之發光物料影像處理方法,其中調整該等第二光點的亮度值之方式,係於該重疊區域內選擇一該發光單元為一參考發光單元,並取得該參考發光單元於該第一、第二檢測影像中所對應之第一光點及第二光點的亮度值之比值或差值,再根據所述比值或差值調整該等第二光點之亮度值。The light-emitting material image processing method according to claim 12, wherein the method of adjusting the brightness values of the second light points is to select a light-emitting unit in the overlapping area as a reference light-emitting unit, and obtain the reference light-emitting unit The ratio or difference between the brightness values of the first light spot and the second light spot corresponding to the first and second detection images is adjusted according to the ratio or the difference. 如請求項9所述之發光物料影像處理方法,其中所述將該第一檢測影像與該第二檢測影像相互拼接之步驟,係根據該等第一光點及第二光點之亮度值,判斷出複數個分別存在於該第一、第二檢測影像中分別對應著相同的發光單元的光點,作為該對位參考點。The luminous material image processing method according to claim 9, wherein the step of stitching the first detection image and the second detection image is based on the brightness values of the first light points and the second light points, It is determined that a plurality of light spots respectively corresponding to the same light-emitting unit existing in the first and second detection images are used as the alignment reference points. 如請求項9所述之發光物料影像處理方法,其中各所述拍攝該第一區塊之步驟及拍攝該第二區塊步驟中,更包含一過濾該發光物料之發光單元發出之光線的步驟。The light-emitting material image processing method according to claim 9, wherein each of the steps of photographing the first block and the step of photographing the second block further includes a step of filtering the light emitted by the light-emitting unit of the light-emitting material .
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