TWI824565B - Optical detection system and integrated optical detection device - Google Patents
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Abstract
一種光學檢測系統之整合式光學檢測裝置,包含一最靠近受測發光元件且將其光線轉變成平行光的第一物鏡、一位於第一物鏡下游側且將光線分成第一、二檢測光的導光單元、一位於導光單元之第一下游側以檢測第一檢測光之亮度及光譜的收光模組、一位於導光單元之第二下游側以對第二檢測光進行對焦的第二物鏡、一位於第二物鏡下游側以檢測第二檢測光之近場光學特性的影像擷取單元,以及一位於導光單元之第二下游側且位於第二物鏡上游側以衰減第二檢測光的減光單元。本發明檢測效率高,且能避免設計複雜、收光不足及更換受測元件需重新對焦等問題。An integrated optical detection device of an optical detection system, including a first objective lens that is closest to the light-emitting element under test and converts its light into parallel light, and a lens that is located on the downstream side of the first objective lens and divides the light into first and second detection lights. The light guide unit, a light collecting module located on the first downstream side of the light guide unit to detect the brightness and spectrum of the first detection light, and a third module located on the second downstream side of the light guide unit to focus the second detection light. Two objective lenses, an image capture unit located on the downstream side of the second objective lens to detect the near-field optical characteristics of the second detection light, and an image capture unit located on the second downstream side of the light guide unit and located on the upstream side of the second objective lens to attenuate the second detection light. Light dimming unit. The invention has high detection efficiency and can avoid problems such as complex design, insufficient light collection, and the need to refocus when replacing the component under test.
Description
本發明係與用以檢測電子元件之檢測系統有關,特別是關於一種用以檢測發光元件之光學檢測系統及其整合式光學檢測裝置。 The present invention relates to detection systems for detecting electronic components, and in particular to an optical detection system for detecting light-emitting components and its integrated optical detection device.
隨著雷射技術的發展,雷射二極體可以應用在讀寫資料、通訊、發光、測量距離或感測各種物體等,用途十分地廣泛。一般來說,雷射二極體係利用半導體製程製造出來,基本上雷射二極體可分為邊射型(edge emitting)與面射型(surface emitting)兩類,近來面射型雷射二極體,例如垂直式共振腔面射型雷射(vertical-cavity surface-emitting laser;簡稱VCSEL)晶片,因結構與特性符合市場需求,未來將成為成本低且應用廣泛之光電元件,市場可期。 With the development of laser technology, laser diodes can be used in reading and writing data, communicating, emitting light, measuring distances or sensing various objects, etc., and have a wide range of uses. Generally speaking, laser diode systems are manufactured using semiconductor processes. Basically, laser diodes can be divided into two types: edge emitting and surface emitting. Recently, surface emitting lasers Polar bodies, such as vertical-cavity surface-emitting laser (VCSEL) wafers, will become low-cost and widely used optoelectronic components in the future because their structure and characteristics meet market demand. The market is expected to .
為了確保雷射二極體出貨時的品質,於測試時需要點亮雷射二極體,並檢測雷射二極體的各種光電參數是否正常。其中,進行發光效能檢測時,通常係藉由一探針卡之探針點觸一受測元件之導電接點而使受測元件發光,並同時藉由光接收裝置(例如積分球)接收受測元件發出之光線,進而量測其發光效能。 In order to ensure the quality of the laser diode when it is shipped, it is necessary to light up the laser diode during testing and check whether the various photoelectric parameters of the laser diode are normal. Among them, when performing luminous efficiency testing, the probe of a probe card is usually used to touch the conductive contact of a component under test to cause the component under test to emit light, and at the same time, a light receiving device (such as an integrating sphere) is used to receive the light. Measure the light emitted by the component and then measure its luminous efficiency.
台灣專利編號I748667揭露一種光學檢測系統(10)(此處及以下括號內的標號皆引用自前述專利),包含有一光亮度檢測模組(11)、一整合式檢測模組(12),以及一遠場檢測模組(13)。光亮度檢測模組(11)係用以對受測元件進行 LIV(light-current-voltage)檢測,以測得光亮度/光功率對電流及電壓的曲線,整合式檢測模組(12)係用以對受測元件進行近場光學特性檢測及光束質量因子(beam quality factor;亦稱為M-Square(M2))檢測,遠場檢測模組(13)係用以對受測元件進行遠場光學特性檢測。其中,整合式檢測模組(12)之光學檢測裝置(50)包含有從最靠近受測元件(142)之位置往上依序設置之一第二物鏡(57)、一減光單元(56)、一導光單元(54)、一第一物鏡(53)及一影像擷取單元(51),受測元件(142)發出之光線通過第二物鏡(57)後先經由減光單元(56)衰減再由導光單元(54)導引至第一物鏡(53)對焦,進而使影像擷取單元(51)擷取到受測元件(142)的影像。 Taiwan Patent No. I748667 discloses an optical detection system (10) (the numbers in brackets here and below are quoted from the aforementioned patent), including a brightness detection module (11), an integrated detection module (12), and A far-field detection module (13). The brightness detection module (11) is used to perform LIV (light-current-voltage) detection on the component under test to measure the curves of brightness/light power versus current and voltage. The integrated detection module (12) is It is used to detect the near-field optical characteristics and beam quality factor (beam quality factor; also known as M-Square (M 2 )) of the component under test. The far-field detection module (13) is used to detect the component under test. Far-field optical property detection. Among them, the optical detection device (50) of the integrated detection module (12) includes a second objective lens (57) and a light reduction unit (56) arranged sequentially from the position closest to the component (142) under test. ), a light guide unit (54), a first objective lens (53) and an image capture unit (51). The light emitted by the component under test (142) passes through the second objective lens (57) and then passes through the light reduction unit ( 56) The attenuation is then guided by the light guide unit (54) to the first objective lens (53) for focusing, so that the image capture unit (51) captures the image of the component under test (142).
於上述專利文獻之光學檢測系統(10)中,光學檢測系統係分為三個檢測站(11、12、13),係用以在不同位置輪流地對受測元件(例如VCSEL晶片)進行發光效能檢測及其他不同的光學特性檢測。如此雖可達到檢測目的,但受測元件在檢測站之間移動及移動至每站後還需精準對位,這些過程需耗費相當時間(以下統稱換站時間)。 In the optical detection system (10) of the above-mentioned patent document, the optical detection system is divided into three detection stations (11, 12, 13), which are used to illuminate the component under test (such as a VCSEL chip) in turn at different positions. Efficiency testing and other different optical characteristics testing. Although the detection purpose can be achieved in this way, the components under test need to be accurately aligned when moving between detection stations and after moving to each station. These processes take a considerable amount of time (hereinafter collectively referred to as station changing time).
為了減少換站時間,進而提升檢測效率,本發明案發明者想到將光學檢測系統之檢測站數量減少(例如由三站減少為二站)。基於檢測所需之條件,遠場檢測模組(13)與受測元件(142)之間需有一定距離(例如兩者之間需距離6公分),而光亮度檢測模組(11)及近場檢測模組(整合式檢測模組(12))則越靠近受測元件越好(例如兩者之間距離需小於1公分),因此,若要將遠場檢測模組與光亮度檢測模組整合在一起,或將遠場檢測模組與近場檢測模組整合在一 起,並滿足其不同的檢測條件,其設計複雜度很高。因此,本發明案發明者嘗試採用之方式,係將光亮度檢測模組與近場檢測模組整合在同一檢測站。 In order to reduce the station changing time and thereby improve the detection efficiency, the inventor of the present invention thought of reducing the number of detection stations of the optical detection system (for example, from three stations to two stations). Based on the conditions required for detection, there needs to be a certain distance between the far-field detection module (13) and the component under test (142) (for example, a distance of 6 cm between the two), and the brightness detection module (11) and The closer the near-field detection module (integrated detection module (12)) is to the component under test, the better (for example, the distance between the two needs to be less than 1 cm). Therefore, if you want to combine the far-field detection module with the brightness detection The modules are integrated together, or the far-field detection module and the near-field detection module are integrated into one Starting and meeting its different detection conditions, its design complexity is very high. Therefore, the inventor of the present invention attempts to integrate the brightness detection module and the near-field detection module into the same detection station.
然而,光亮度檢測模組及近場檢測模組原先皆呈縱向設置,其中近場檢測模組因近場光學特性檢測(尤其是光束質量因子(M2)檢測)之需求而設有用以改變焦距之伸縮裝置(第一、二位移單元20、30),因此近場檢測模組的最大縱向長度係較光亮度檢測模組長。若將近場檢測模組改為橫向設置而整合在光亮度檢測模組之一側,將會大幅增加整個檢測系統的橫向長度,造成設備大型化。因此,為避免上述問題,本案發明者想到之方式,係將近場檢測模組維持縱向設置,而將光亮度檢測模組整合在近場檢測模組一側。
However, both the brightness detection module and the near-field detection module were originally arranged vertically. The near-field detection module was equipped with a configuration for changing the near-field optical characteristics detection (especially the beam quality factor (M 2 ) detection). The focal length telescopic device (the first and
以前述方式整合出之光學檢測裝置,如圖1所示,若同樣是包含有從最靠近受測元件11之位置往上依序設置之一物鏡12、一減光單元13、一導光單元14、另一物鏡15,以及一影像擷取單元16,並更包含有一設於導光單元14一側之收光裝置17,以接收由導光單元14導出之受測元件11的光線而進行光亮度檢測。以光學路徑來說,上述之整合出之光學檢測裝置,其減光單元13係設置於收光裝置17之上游,而減光單元13的設置目的,係避免影像擷取單元16接收到的光量過強而無法擷取到清楚的影像,因此,如此之配置方式,會對於收光裝置17之入光量產生很大的影響,特別是由於受測元件11的光線通過第一個物鏡12時已略有衰減,再受減光單元13衰減之後,其進入收光裝置17的入光量將會不足以供收光裝置17進行檢測。
The optical detection device integrated in the above manner, as shown in Figure 1, also includes an
因此,本發明案發明者在考量到以設置結構簡單為目的的前提下,嘗試將減光單元13設置在最靠近影像擷取單元16的位置,亦即如圖2所示,從最靠近受測元件11之位置往上依序為一物鏡12、一導光單元14、另一物鏡15、
一減光單元13及一影像擷取單元16,且導光單元14一側設置一收光裝置17。詳而言之,減光單元13設置在最靠近影像擷取單元16的位置時,減光單元13之下游側只有影像擷取單元16;反之,若將減光單元13之設置位置往其上游側方向移動,減光單元13會影響到位於其下游側之光學元件的工作距離(對焦距離)。因此,若將減光單元13設置在較上游,則需進行較多元件的工作距離(對焦距離)調整,設計上較麻煩;反之,如圖2所示之減光單元13最靠近影像擷取單元16之配置有著設計簡單的優點。然而,靠近受測元件11之物鏡12會將其上游側接收到的受測元件11之光線18調整為平行光182,而靠近影像擷取單元16之物鏡15會在光線18進入影像擷取單元16之前進行對焦,亦即使原本的平行光182從物鏡15之下游側發出時聚焦成非平行光184。因此,雖然將減光單元13設置在最靠近影像擷取單元16的位置有安裝設計簡單之優點,但此配置係將減光單元13設置在非平行光184的路徑上,如此一來,在更換受測元件11之後,隨著受測元件11之發光角度不同,將會需要耗費時間重新調整對焦,對於提升檢測效率造成阻礙。
Therefore, the inventor of the present invention, taking into account the purpose of simplifying the installation structure, tried to install the
有鑑於上述缺失,本發明之主要目的在於提供一種光學檢測系統及其整合式光學檢測裝置,即便以整合式光學檢測裝置整合光亮度檢測及近場光學檢測,亦能夠同時避免設計複雜、收光不足,以及更換受測元件需重新對焦等問題,進而可產生高檢測效率。 In view of the above shortcomings, the main purpose of the present invention is to provide an optical detection system and its integrated optical detection device. Even if the integrated optical detection device integrates brightness detection and near-field optical detection, it can also avoid complex design and light collection. Inadequacy, as well as problems such as the need to refocus when replacing the component under test, can produce high detection efficiency.
有鑑於上述缺失,本發明之另一目的在於提供一種光學檢測系統及其整合式光學檢測裝置,即便以整合式光學檢測裝置整合光亮度檢測及近場光學檢測,亦能夠同時避免設備大型化之問題。 In view of the above shortcomings, another object of the present invention is to provide an optical detection system and its integrated optical detection device. Even if the integrated optical detection device integrates brightness detection and near-field optical detection, it can also avoid the need for large-scale equipment. problem.
為達成上述主要目的,本發明所提供之光學檢測系統之整合式光學檢測裝置係用以檢測一發光元件發出之一光線,該光線係沿一光學路徑進入 該整合式光學檢測裝置。該整合式光學檢測裝置包含有一第一物鏡、一導光單元(例如分光鏡)、一收光模組(例如積分球)、一第二物鏡、一影像擷取單元,以及一減光單元(例如ND濾鏡(neutral density filter))。第一物鏡係位於該整合式光學檢測裝置最靠近該發光元件之位置,用以接收該光線並將該光線轉變成平行光。導光單元係在該光學路徑上位於第一物鏡之一下游側,用以將該光線分成一第一檢測光及一第二檢測光,使得該光學路徑分成一第一子路徑及一第二子路徑。收光模組係在光學路徑之第一子路徑上位於導光單元之一第一下游側,第一檢測光係自導光單元沿第一子路徑進入收光模組,以供收光模組檢測第一檢測光之亮度及光譜之至少其中之一。第二物鏡係在光學路徑之第二子路徑上位於導光單元之一第二下游側,用以對第二檢測光進行對焦。影像擷取單元係在光學路徑之第二子路徑上位於第二物鏡之一下游側,用以檢測第二檢測光透過第二物鏡對焦後之近場光學特性。減光單元係在光學路徑之第二子路徑上位於導光單元之第二下游側,第二檢測光係自導光單元沿第二子路徑進入減光單元,以供減光單元衰減第二檢測光,且減光單元係位於第二物鏡之一上游側。 In order to achieve the above main purpose, the integrated optical detection device of the optical detection system provided by the present invention is used to detect light emitted by a light-emitting element, and the light enters along an optical path. The integrated optical detection device. The integrated optical detection device includes a first objective lens, a light guide unit (such as a beam splitter), a light collection module (such as an integrating sphere), a second objective lens, an image capture unit, and a light reduction unit ( For example, ND filter (neutral density filter)). The first objective lens is located at the position closest to the light-emitting element of the integrated optical detection device for receiving the light and converting the light into parallel light. The light guide unit is located on a downstream side of the first objective lens on the optical path, and is used to divide the light into a first detection light and a second detection light, so that the optical path is divided into a first sub-path and a second subpath. The light collection module is located on the first downstream side of one of the light guide units on the first sub-path of the optical path. The first detection light enters the light collection module from the light guide unit along the first sub-path for the light collection module. The group detects at least one of the brightness and spectrum of the first detection light. The second objective lens is located on a second downstream side of the light guide unit on the second sub-path of the optical path, and is used to focus the second detection light. The image capturing unit is located on a downstream side of the second objective lens on the second sub-path of the optical path, and is used to detect the near-field optical characteristics of the second detection light after it is focused through the second objective lens. The light reduction unit is located on the second downstream side of the light guide unit on the second sub-path of the optical path. The second detection light enters the light reduction unit from the light guide unit along the second sub-path for the light reduction unit to attenuate the second Light is detected, and the light reduction unit is located on the upstream side of one of the second objective lenses.
或者,以結構上的位置關係來界定,本發明所提供之光學檢測系統之整合式光學檢測裝置係用以檢測一發光元件發出之一光線,該整合式光學檢測裝置包含有一第一物鏡、一導光單元、一收光模組、一第二物鏡、一影像擷取單元,以及一減光單元。第一物鏡係設置於導光單元之一第一側,用以接收該光線並將該光線轉變成平行光後入射至導光單元,以供導光單元將該光線分成一第一檢測光及一第二檢測光。收光模組係設置於導光單元之一第二側,用以接收第一檢測光並檢測第一檢測光之亮度及光譜之至少其中之一。第二物鏡係設置於導光單元之一第三側,用以接收第二檢測光並對第二檢測光進行對焦。影像 擷取單元係設置於導光單元之第三側,且位於第二物鏡之相對於導光單元之一側(亦即影像擷取單元與導光單元分別設置於第二物鏡之二相對側),用以接收第二檢測光並檢測第二檢測光透過第二物鏡對焦後之近場光學特性。減光單元係設置於導光單元之第三側(亦即減光單元、收光模組及第一物鏡分別設置於導光單元之不同側),用以衰減第二檢測光。 Or, defined by the structural positional relationship, the integrated optical detection device of the optical detection system provided by the present invention is used to detect light emitted by a light-emitting element. The integrated optical detection device includes a first objective lens, a A light guide unit, a light collection module, a second objective lens, an image capture unit, and a light reduction unit. The first objective lens is disposed on a first side of the light guide unit to receive the light and convert the light into parallel light and then enter the light guide unit, so that the light guide unit divides the light into a first detection light and a second detection light. The light collecting module is disposed on a second side of the light guide unit and is used to receive the first detection light and detect at least one of the brightness and spectrum of the first detection light. The second objective lens is disposed on a third side of the light guide unit for receiving the second detection light and focusing the second detection light. image The capture unit is disposed on the third side of the light guide unit and is located on the side of the second objective lens opposite to the light guide unit (that is, the image capture unit and the light guide unit are disposed on two opposite sides of the second objective lens respectively) , used to receive the second detection light and detect the near-field optical characteristics after the second detection light is focused through the second objective lens. The light reduction unit is disposed on the third side of the light guide unit (that is, the light reduction unit, the light collection module and the first objective lens are respectively disposed on different sides of the light guide unit) for attenuating the second detection light.
本發明之整合式光學檢測裝置係將光學檢測條件相近的收光模組(進行光亮度檢測)及影像擷取單元(進行近場光學檢測)整合在一起,相較於將光學檢測條件不同的遠場檢測模組與光亮度檢測模組整合在一起,或將檢測條件不同的遠場檢測模組與近場檢測模組整合在一起,本發明之整合式光學檢測裝置可以降低整合後的設計複雜度。且於本發明之整合式光學檢測裝置中,收光模組係配置於光學路徑之第一子路徑,而減光單元係配置於光學路徑之第二子路徑,於此情形,減光單元在光學路徑上不是位於收光模組的上游,因此可避免受測元件的光線因為在進入收光模組之前先經過減光單元而致使收光模組之入光量不足。且於本發明之整合式光學檢測裝置中,減光單元在光學路徑上係位於第二物鏡之上游側,也就是說,減光單元係位於尚未受第二物鏡聚焦成非平行光之平行光的光學路徑上,藉此,在更換受測元件之後,即使隨著受測元件之發光角度不同,亦無需耗費時間重新調整對焦,因此可避免更換受測元件需重新對焦之問題,進而可更加提升檢測效率。 The integrated optical detection device of the present invention integrates a light collection module (for brightness detection) and an image capture unit (for near-field optical detection) with similar optical detection conditions. The far-field detection module and the brightness detection module are integrated together, or the far-field detection module and the near-field detection module with different detection conditions are integrated together. The integrated optical detection device of the present invention can reduce the design cost after integration. complexity. And in the integrated optical detection device of the present invention, the light collection module is configured in the first sub-path of the optical path, and the light reduction unit is configured in the second sub-path of the optical path. In this case, the light reduction unit is in The optical path is not located upstream of the light-collecting module, so it can be avoided that the light from the component under test passes through the light-reducing unit before entering the light-collecting module, resulting in insufficient light input to the light-collecting module. And in the integrated optical detection device of the present invention, the light reduction unit is located on the upstream side of the second objective lens on the optical path. That is to say, the light reduction unit is located on the parallel light that has not been focused by the second objective lens into non-parallel light. On the optical path, with this, after the component under test is replaced, even if the light-emitting angle of the component under test is different, there is no need to waste time to re-adjust the focus. Therefore, the problem of needing to refocus when replacing the component under test can be avoided, and thus it can be more Improve detection efficiency.
如此,本發明之整合式光學檢測裝置係以設計複雜度低之方式將光亮度檢測與近場光學檢測整合在一起,使得原先需分成二檢測站進行的光學特性檢測可在同一檢測站進行,藉以提升檢測效率。其中,減光單元在光學路徑上非設置於收光模組之上游側,因此進入收光模組的光線不會先經過減光單元, 藉此,收光模組所接收之第一檢測光未受減光單元衰減而可避免收光不足之問題,且減光單元係設置於第二物鏡之上游側,因此減光單元所接收之第二檢測光為未受第二物鏡聚焦之平行光,亦即,減光單元係設置於第二檢測光之平行段的路徑上,因此可避免更換受測元件需重新對焦之問題,進而可更加提升檢測效率。 In this way, the integrated optical detection device of the present invention integrates brightness detection and near-field optical detection in a low-complexity manner, so that the optical characteristic detection that originally needs to be divided into two detection stations can be performed at the same detection station. To improve detection efficiency. Among them, the light reduction unit is not disposed upstream of the light collection module on the optical path, so the light entering the light collection module will not pass through the light reduction unit first. In this way, the first detection light received by the light-collecting module is not attenuated by the light-reduction unit, thereby avoiding the problem of insufficient light collection. Moreover, the light-reduction unit is disposed upstream of the second objective lens, so the light-reduction unit receives The second detection light is parallel light that is not focused by the second objective lens. That is, the light reduction unit is disposed on the path of the parallel section of the second detection light. Therefore, it can avoid the problem of refocusing when replacing the component under test, and thus can Further improve detection efficiency.
為達成上述另一目的,前述本發明所提供之光學檢測系統之整合式光學檢測裝置中,光線係沿著一光學軸地自發光元件發射出來,第一物鏡、導光單元、減光單元、第二物鏡及影像擷取單元係沿著光學軸配置。換言之,第一物鏡、導光單元、減光單元、第二物鏡及影像擷取單元係以平行於發光元件發出光線之方向的方式縱向配置,且收光模組係以垂直於發光元件發出光線之方向的方式橫向配置於導光單元之一側。藉此,需要較大工作長度之近場光學檢測的相關構件係縱向設置,而光亮度檢測相關之收光模組係以橫向配置之方式整合在縱向設置之構件一側,故本發明之整合式光學檢測裝置可以避免整個光學檢測系統的橫向長度過長,而造成設備大型化。 In order to achieve the other purpose mentioned above, in the integrated optical detection device of the optical detection system provided by the present invention, light is emitted from the self-luminous element along an optical axis, and the first objective lens, light guide unit, light reduction unit, The second objective lens and the image capturing unit are arranged along the optical axis. In other words, the first objective lens, the light guide unit, the light reduction unit, the second objective lens and the image capture unit are longitudinally arranged parallel to the direction in which the light-emitting element emits light, and the light-collecting module is arranged perpendicular to the direction in which the light-emitting element emits light. The light guide unit is arranged transversely on one side of the light guide unit. In this way, the relevant components of near-field optical detection that require a large working length are arranged vertically, and the light collection module related to brightness detection is integrated in a transverse arrangement on one side of the vertically arranged components. Therefore, the integration of the present invention The type optical detection device can avoid the lateral length of the entire optical detection system being too long, which will cause the equipment to become larger.
此外,本發明更提供一種光學檢測系統,包含有一用以承載一發光元件之承載裝置、一用以電性接觸發光元件而使發光元件發出一光線之給電裝置、一如前所述之用以檢測發光元件發出之光線的亮度及光譜之至少其中之一以及近場光學特性之整合式光學檢測裝置,以及一用以檢測發光元件之遠場光學特性之遠場檢測裝置。 In addition, the present invention further provides an optical detection system, which includes a carrying device for carrying a light-emitting element, a power supply device for electrically contacting the light-emitting element to cause the light-emitting element to emit light, and a power supply device as described above. An integrated optical detection device that detects at least one of the brightness and spectrum of the light emitted by the light-emitting element and the near-field optical characteristics, and a far-field detection device used to detect the far-field optical characteristics of the light-emitting element.
較佳地,在前述之光學檢測系統及其整合式光學檢測裝置中,收光模組係設置在導光單元之一反射光路上,減光單元係設置在導光單元之一透射光路上,光線係沿著一光學軸地自發光元件發射出來,透射光路係平行於光學 軸,於此情形,收光模組與減光單元係分別設置在不同光學子路徑上,可以避免減光單元影響收光模組而使其入光量不足的問題,同時使收光模組在整合式光學檢測裝置中以橫向進行配置,而搭配影像擷取單元(進行近場光學檢測)之減光單元在整合式光學檢測裝置中與其他組件以縱向進行配置,有助於避免設備大型化之功效。 Preferably, in the aforementioned optical detection system and its integrated optical detection device, the light collection module is arranged on one of the reflection light paths of the light guide unit, and the light reduction unit is arranged on one of the transmission light paths of the light guide unit. The light is emitted from the luminous element along an optical axis, and the transmitted light path is parallel to the optical axis. axis, in this case, the light-collecting module and the light-reducing unit are respectively arranged on different optical sub-paths, which can avoid the problem that the light-reducing unit affects the light-collecting module and causes insufficient light input, and at the same time, the light-collecting module can be The integrated optical detection device is configured horizontally, and the light reduction unit equipped with the image capture unit (for near-field optical detection) is configured vertically with other components in the integrated optical detection device, which helps to avoid equipment enlargement. The effect.
較佳地,在前述之光學檢測系統及其整合式光學檢測裝置中,減光單元為一吸收式減光單元,用以供第二檢測光通過減光單元。相較於反射式減光單元,吸收式減光單元較不需為了避免影響收光模組而考量擺放角度之問題,因此較容易配置於本發明之結構而可避免設計複雜,且有助於達成前述之縱向配置方式進而避免設備大型化。 Preferably, in the aforementioned optical detection system and its integrated optical detection device, the light reduction unit is an absorption type light reduction unit for allowing the second detection light to pass through the light reduction unit. Compared with the reflective light reduction unit, the absorptive light reduction unit does not need to consider the placement angle in order to avoid affecting the light collection module. Therefore, it is easier to configure in the structure of the present invention, avoids complicated design, and helps In order to achieve the aforementioned vertical configuration method and avoid equipment enlargement.
較佳地,在前述之光學檢測系統及其整合式光學檢測裝置中,減光單元包含有減光倍率不同之複數減光組件,該等減光組件係相互堆疊配置,如此係利於配置出所需之減光效果,並可讓使用者方便裝設及更換減光組件,進而提升檢測效率。 Preferably, in the aforementioned optical detection system and its integrated optical detection device, the light reduction unit includes a plurality of light reduction components with different light reduction magnifications, and these light reduction components are stacked on top of each other, which facilitates the configuration of the light reduction components. It provides the required light reduction effect and allows users to easily install and replace light reduction components, thus improving detection efficiency.
較佳地,在前述之光學檢測系統及其整合式光學檢測裝置中,減光單元包含有一本體及至少一減光組件,減光組件包含有一減光件,本體具有一開口,減光組件係能抽換地插設於本體之開口。換言之,減光組件係採用抽取方式,可讓使用者方便裝設及更換減光組件,進而提升檢測效率。 Preferably, in the aforementioned optical detection system and its integrated optical detection device, the light reduction unit includes a body and at least one light reduction component. The light reduction component includes a light reduction component. The body has an opening. The light reduction component is Removably inserted into the opening of the body. In other words, the light-reduction component is removable, allowing users to easily install and replace the light-reduction component, thus improving detection efficiency.
較佳地,在前述之光學檢測系統及其整合式光學檢測裝置中,減光單元之減光組件具有至少一磁性件,減光組件之磁性件係設置於減光件之外周圍,係用以與減光單元之另一減光組件相互磁吸固定,如此係便於將減光組件 相互對位並穩定地相接,亦可讓使用者方便裝設及更換減光組件,進而提升檢測效率。 Preferably, in the aforementioned optical detection system and its integrated optical detection device, the light reduction component of the light reduction unit has at least one magnetic component, and the magnetic component of the light reduction component is arranged outside and around the light reduction component. The light-reducing component of the light-reducing unit is magnetically fixed to each other, so that the light-reducing component can be easily Aligning each other and connecting stably also allows users to easily install and replace light reduction components, thereby improving detection efficiency.
有關本發明所提供之光學檢測系統及其整合式光學檢測裝置的詳細構造、特點、組裝或使用方式,將於後續的實施方式詳細說明中予以描述。然而,在本發明領域中具有通常知識者應能瞭解,該等詳細說明以及實施本發明所列舉的特定實施例,僅係用於說明本發明,並非用以限制本發明之專利申請範圍。 The detailed structure, characteristics, assembly or usage of the optical detection system and its integrated optical detection device provided by the present invention will be described in the subsequent detailed description of the implementation. However, those with ordinary knowledge in the field of the present invention should understand that these detailed descriptions and specific examples for implementing the present invention are only used to illustrate the present invention and are not intended to limit the scope of the patent application of the present invention.
11:受測元件 11: Component under test
12:物鏡 12:Objective lens
13:減光單元 13: Light reduction unit
14:導光單元 14:Light guide unit
15:物鏡 15:Objective lens
16:影像擷取單元 16:Image capture unit
17:收光裝置 17: Light collecting device
18:光線 18:Light
182:平行光 182: Parallel light
184:非平行光 184:Non-parallel light
20:光學檢測系統 20: Optical detection system
22:承載裝置 22: Carrying device
222:承載面 222: Bearing surface
24:給電裝置 24:Power supply device
26:整合式光學檢測裝置 26: Integrated optical detection device
28:遠場檢測裝置 28:Far field detection device
29:掃描裝置 29: Scanning device
30:發光元件 30:Light-emitting components
32:光線 32:Light
322:平行光 322: Parallel light
324:第一檢測光 324: First detection light
326:第二檢測光 326: Second detection light
328:非平行光 328:Non-parallel light
34:光學軸 34: Optical axis
36:光學路徑 36: Optical path
361:第一子路徑 361: First sub-path
362:第二子路徑 362: Second sub-path
41:第一物鏡 41:First objective lens
411:上游側 411: upstream side
412:下游側 412: Downstream side
43:導光單元 43:Light guide unit
431:第一側(上游側) 431: First side (upstream side)
432:第二側(第一下游側) 432: Second side (first downstream side)
433:第三側(第二下游側) 433: Third side (second downstream side)
434:導光元件(分光鏡) 434: Light guide element (beam splitter)
435:反射光路 435: Reflected light path
436:透射光路 436: Transmitted light path
45:減光單元 45: Light reduction unit
451:本體 451:Ontology
452A,452B:減光組件 452A, 452B: light reduction component
453:抽換盤 453:Swap tray
454:減光件 454: Light reduction parts
455:磁性件 455:Magnetic parts
456:穿孔 456:Perforation
457:凹槽 457: Groove
458:開口 458:Open your mouth
459:磁性件 459:Magnetic parts
47:第二物鏡 47:Second objective lens
471:上游側 471: upstream side
472:下游側 472: Downstream side
473:基座 473:Pedestal
474:外套筒 474: Outer sleeve
475:內套筒 475:Inner sleeve
49:影像擷取單元 49:Image capture unit
51:收光模組 51: Light collecting module
512:收光件 512: Light receiving parts
514,515:光感測件 514,515: Light sensing components
53:線性位移單元 53:Linear displacement unit
532:滑台 532:Slide
534:馬達 534: Motor
536:滑移座 536:Sliding seat
54:固定座 54: Fixed seat
55:安裝座 55:Mounting seat
552:基部 552:Base
554:延伸部 554:Extension
57:連接板 57:Connection board
60:待測物料 60: Material to be tested
圖1為本發明之發明人為解決先前技術之問題所提供之一種技術手段的示意圖。 Figure 1 is a schematic diagram of a technical means provided by the inventor of the present invention to solve the problems of the prior art.
圖2為本發明之發明人為解決先前技術及圖1之技術手段的問題所提供之另一種技術手段的示意圖。 FIG. 2 is a schematic diagram of another technical means provided by the inventor of the present invention to solve the problems of the prior art and the technical means of FIG. 1 .
圖3為本發明一較佳實施例所提供之光學檢測系統的示意圖。 Figure 3 is a schematic diagram of an optical detection system provided by a preferred embodiment of the present invention.
圖4為該光學檢測系統之一整合式光學檢測裝置的示意圖。 Figure 4 is a schematic diagram of an integrated optical detection device of the optical detection system.
圖5為該整合式光學檢測裝置的立體組合圖。 Figure 5 is a perspective assembly view of the integrated optical detection device.
圖6為該整合式光學檢測裝置的立體分解圖。 Figure 6 is an exploded perspective view of the integrated optical detection device.
圖7為該整合式光學檢測裝置的局部立體分解圖。 Figure 7 is a partial perspective exploded view of the integrated optical detection device.
圖8為該整合式光學檢測裝置之一減光單元的立體分解圖。 Figure 8 is an exploded perspective view of a light reduction unit of the integrated optical detection device.
圖9係類同於圖3,惟更顯示出一掃描裝置。 Figure 9 is similar to Figure 3, but further shows a scanning device.
申請人首先在此說明,在以下將要介紹之實施例以及圖式中,相同之參考號碼,表示相同或類似之元件或其結構特徵。需注意的是,圖式中的各元件及構造為例示方便並非依據真實比例及數量繪製,且若實施上為可能,不同實施例的特徵係可以交互應用。其次,當述及一元件設置於另一元件上時,代表前述元件係直接設置在該另一元件上,或者前述元件係間接地設置在該另一元件上,亦即,二元件之間還設置有一個或多個其他元件。而述及一元件「直接」設置於另一元件上時,代表二元件之間並無設置任何其他元件。 The applicant would like to first explain that in the embodiments and drawings to be introduced below, the same reference numbers represent the same or similar elements or structural features thereof. It should be noted that the components and structures in the drawings are for convenience of illustration and are not drawn based on actual proportions and quantities, and if possible in implementation, features of different embodiments can be applied interchangeably. Secondly, when it is said that one element is arranged on another element, it means that the aforementioned element is directly arranged on the other element, or the aforementioned element is indirectly arranged on the other element, that is, there is another element between the two elements. Set with one or more other elements. When it is stated that one component is "directly" mounted on another component, it means that no other components are placed between the two components.
請先參閱圖3,本發明一較佳實施例所提供之光學檢測系統20包含有一承載裝置22、一給電裝置24、一整合式光學檢測裝置26,以及一遠場檢測裝置28。承載裝置22可為(但不限於)可沿XYZ三軸移動且可繞Z軸旋轉之工作台(chuck),係用以承載一發光元件30(例如VCSEL晶片),並帶動發光元件30沿著一移動軸(Y軸)地依序水平或是橫向移動至整合式光學檢測裝置26及遠場檢測裝置28(其設置順序不限於如圖3所示)下方進行檢測。給電裝置24可為(但不限於)諸如包含有點觸探針之探針卡之類的測試信號(電源)供應介面,係用以電性接觸發光元件30而使發光元件30發出一光線32(圖4中以虛線表示光線32之光發散角範圍),使得整合式光學檢測裝置26及遠場檢測裝置28在發光元件30位於其下方時對光線32進行不同的光學特性檢測,詳述於下文。本實施例中所指的光線32為不可視光線,其波長例如為800nm~940nm。
Please refer to FIG. 3 first. An
請參閱圖4至圖6,圖4係示意性地顯示整合式光學檢測裝置26之主要元件的配置,以及發光元件30及其光線32與整合式光學檢測裝置26之對應關係,圖5及圖6係具體地顯示整合式光學檢測裝置26的外觀結構。
Please refer to FIGS. 4 to 6 . FIG. 4 schematically shows the configuration of the main components of the integrated
如圖4所示,光線32係沿著一光學軸34地自發光元件30發射出來,發光元件30之光學軸34通常可以是至少實質垂直於承載裝置22之一用以承載發光元件30的承載面222(如圖3所示)及/或發光元件30之承載基板(圖未示)的一延伸平面,本實施例中發光元件30之光學軸34係沿Z軸延伸,亦即垂直於發光元件30及/或承載裝置22之移動軸(Y軸)。
As shown in FIG. 4 , the light 32 is emitted from the light-emitting
如圖4至圖6所示,本實施例之整合式光學檢測裝置26主要包含有沿著光學軸34依序配置(在本發明中亦稱此配置方式為縱向配置)之一第一物鏡41、一導光單元43、一減光單元45、一第二物鏡47及一影像擷取單元49,以及一以垂直於光學軸34之方向配置(在本發明中亦稱此配置方式為橫向配置)於導光單元43一側之收光模組51,藉以使光線32沿一光學路徑36(如圖4所示)進入整合式光學檢測裝置26之各個構件,此部分將詳述於下文。在此需先說明的是,圖4中以中心線繪製之線段皆屬於光學路徑36,其中沿Z軸延伸的部分係與光學軸34共線。
As shown in FIGS. 4 to 6 , the integrated
以結構上的位置關係而言,導光單元43具有一朝向發光元件30之第一側431、一垂直於第一側431之第二側432,以及一與第一側431朝向相反方向且平行於第一側431之第三側433。第一物鏡41係設置於導光單元43之第一側431。第一物鏡41係設置於導光單元43與發光元件30之間。收光模組51係設置於導光單元43之第二側432。減光單元45、第二物鏡47及影像擷取單元49以依序遠離導光單元43之方式,設置於導光單元43之第三側433,亦即,減光單元45係位於導光單元43與第二物鏡47之間,第二物鏡47係位於減光單元45與影像擷取單元49之間。
In terms of structural positional relationship, the
由前述之結構可得知,第一物鏡41係位於整合式光學檢測裝置26最靠近發光元件30之位置,第一物鏡41內設有一個或多個光學鏡片(圖中未示),用以接收光線32並將光線32轉變成平行光322後入射至導光單元43。換言之,第一物鏡41在光學路徑36上能定義出一上游側411及一下游側412,上游側411直接接收發光元件30發出之非呈平行光的光線32,下游側412則發出平行光322而供導光單元43之第一側431接收。
It can be known from the foregoing structure that the first
導光單元43係在光學路徑36上位於第一物鏡41之下游側412,用以接收第一物鏡41發出之平行光322,導光單元43內部設有導光元件434,用以將平行光322分成一第一檢測光324及一第二檢測光326,使得光學路徑36分成一第一子路徑361及一第二子路徑362。換言之,導光單元43在光學路徑36上能定義出一上游側(亦即第一側431)、一第一下游側(亦即第二側432)及一第二下游側(亦即第三側433),第一下游側432係位於第一子路徑361,第二下游側433係位於第二子路徑362。
The
在本實施例中,導光單元43內部之導光元件434為一分光鏡(beam splitter;簡稱BS),係能定義出一反射光路435及一透射光路436,用以將入射至分光鏡434之平行光322一部分沿反射光路435反射出去(即第一檢測光324),且同時另一部分沿透射光路436透射出去(即第二檢測光326)。如圖4所示,反射光路435係與第一子路徑361共線,且反射光路435係垂直於光學軸34,透射光路436係與第二子路徑362共線,且透射光路436係平行於光學軸34,在圖4中,透射光路436及第二子路徑362係與光學軸34重疊。
In this embodiment, the
收光模組51係在光學路徑36之第一子路徑361上位於導光單元43之第一下游側(亦即第二側432),亦即本實施例之收光模組51係設置在導光單
元43之反射光路435上,由導光單元43反射出去之第一檢測光324係沿第一子路徑361進入收光模組51。在本實施例中,收光模組51包含有一收光件512(例如積分球),以及設於收光件512上的二光感測件514、515。光感測件514可為一光電二極體(photodiode),用以將第一檢測光324轉換為電訊號,進而進行亮度檢測,例如LIV檢測。光感測件515可為一準直器(collimator),用以接設一光譜儀,進而檢測第一檢測光324之光譜。
The
減光單元45係在光學路徑36之第二子路徑362上位於導光單元43之第二下游側(亦即第三側433),亦即本實施例之減光單元45係設置在導光單元43之透射光路436上,由導光單元43透射出去之第二檢測光326係沿第二子路徑362進入減光單元45,減光單元45係用以選擇性地提供減光效果以衰減第二檢測光326,此部分將詳述於下文。於本實施例中,減光單元45係直接緊鄰於該導光單元43之第三側433。減光單元45係配置在非位於收光模組51之上游側。減光單元45(配置在第二子路徑362)與收光模組51(配置在第一子路徑361)係配置在不同之光學子路徑上。
The
第二物鏡47係在光學路徑36之第二子路徑362上位於導光單元43之第二下游側(亦即第三側433),用以接收通過減光單元45之第二檢測光326並對第二檢測光326進行對焦,此部分將詳述於下文。換言之,第二物鏡47在光學路徑36之第二子路徑362上能定義出一上游側471及一下游側472,減光單元45位於第二物鏡47之上游側471,第二檢測光326在第二物鏡47之上游側471仍維持為平行光,第二物鏡47將第二檢測光326聚焦而轉變成非平行光328,因此第二檢測光326在第二物鏡47之下游側472為非平行光328。也就是,減光單元45位於平行光322之光學路徑上。
The second
影像擷取單元49係在光學路徑36之第二子路徑362上位於第二物鏡47之下游側472,影像擷取單元49可為感光元件採用電荷耦合元件(charge-coupled device;簡稱CCD)或互補式金屬氧化物半導體(complementary metal-oxide-semiconductor;簡稱CMOS)之相機,用以檢測第二檢測光326透過第二物鏡47對焦後之近場光學特性。更明確地說,影像擷取單元49係依序透過第二物鏡47、減光單元45、導光單元43及第一物鏡41而擷取設置於第一物鏡41下方之發光元件30發出光線32時的影像,藉以進行其近場光學特性之檢測。
The
如圖5及圖6所示,本實施例之整合式光學檢測裝置26更包含有一線性位移單元53、一固定座54、一安裝座55,以及一連接板57。
As shown in FIGS. 5 and 6 , the integrated
線性位移單元53可採用習用之電動滑台組合,主要包含有一滑台532、一設於滑台532一端之馬達534(例如步進馬達),以及一能受馬達534驅動而沿一調整軸(Z軸)移動地設於滑台532正面之滑移座536。影像擷取單元49係固定於固定座54內,且固定座54係固定於線性位移單元53之滑移座536。安裝座55包含有一基部552,以及一自基部552延伸而出之延伸部554,安裝座55之基部552及連接板57係固定於線性位移單元53之滑台532背面,第二物鏡47係固定於安裝座55之延伸部554。
The
詳而言之,第二物鏡47在外觀上包含有一固定於安裝座55之延伸部554的基座473、一固定於基座473頂部之外套筒474,以及一設置於外套筒474內且能相對於外套筒474移動之內套筒475,內套筒475之上端係固定於影像擷取單元49之下端。基座473內設有一個或多個光學鏡片(圖中未示),外套筒474及內套筒475係與基座473相互連通,影像擷取單元49係透過內套筒475及外套筒474而與基座473內之光學鏡片相對。
In detail, the second
如圖7及圖8所示,本實施例之減光單元45包含有一本體451及二減光組件452A、452B,各減光組件452A、452B包含有一抽換盤453、一減光件454及複數磁性件455。各抽換盤453具有一底部具有擋緣的穿孔456,減光件454係以抵靠於擋緣之方式設於穿孔456內,且減光組件452A、452B之減光件454的減光倍率可為相同或不同。本實施例之減光件454為ND濾鏡(neutral density filter),係用以供第二檢測光326通過並同時衰減第二檢測光326,亦即,本實施例之減光單元45不是反射式減光單元,而是吸收式減光單元,較不需為了避免影響收光模組51而考量擺放角度之問題。減光組件452A之抽換盤453底面設有二凹槽457,減光組件452B之抽換盤453的頂、底面分別設有二凹槽457(圖中僅顯示頂面之凹槽457),各減光組件452A、452B之磁性件455係分別設於凹槽457內,使得減光組件452A、452B具有磁吸功能。磁性件455係設置於減光件454之外周圍。
As shown in Figures 7 and 8, the
如圖7所示,本體451設置於第二物鏡47與導光單元43之間。本體451之頂面緊靠於第二物鏡47,本體451之底面緊靠於導光單元43。減光單元45之本體451具有一開口458,減光組件452A、452B係能抽換地插設於本體451之開口458,使得減光組件452A、452B相互堆疊配置。如圖8所示,減光單元45之本體451內部設有二凹槽457,以及分別設於凹槽457內的二磁性件459,使得本體451也具有磁吸功能。如此一來,減光組件452B底部之磁性件455能與本體451之磁性件459相互吸附,減光組件452B頂部之磁性件455能與減光組件452A底部之磁性件455相互吸附,如此係方便將減光組件452A、452B對位並穩定地設置於本體451內。
As shown in FIG. 7 , the
藉此,本實施例之減光單元45能供使用者抽換減光組件452A、452B(減光組件452A、452B中可分別裝設一個或多個不同或相同減光倍率的減光件454)而產生所需之減光效果,以避免影像擷取單元49擷取影像時因過度曝光而無法擷取到清楚的影像。或者,本實施例之減光單元45亦可暫時不裝設減光組件452A、452B,以於影像擷取單元49對發光元件30進行Z軸對焦及確認其X、Y軸位置時不產生減光效果。本實施例之減光單元45採用之複數減光組件452A、452B堆疊配置之方式,係利於配置出所需之減光效果,並可讓使用者方便裝設及更換減光組件452A、452B,進而提升檢測效率。而且,本實施例之減光單元45採用之抽取式減光組件452A、452B以及其磁吸功能,皆可讓使用者方便裝設及更換減光組件452A、452B,進而提升檢測效率。
Thereby, the
請參閱圖5及圖6,本實施例之整合式光學檢測裝置26的連接板57實際上會固定於另一線性位移單元的滑移座(圖中未示),所述另一線性位移單元能帶動圖5所示之整體結構一起沿Z軸移動,以於每次檢測發光元件30時使影像擷取單元49對焦於發光元件30,此部分為粗對焦,而進一步之精細對焦係由線性位移單元53帶動影像擷取單元49及第二物鏡47之內套筒475沿Z軸地相對於第二物鏡47之外套筒474、減光單元45、導光單元43及第一物鏡41移動,以進行對焦之微調。
Please refer to Figures 5 and 6. The connecting
前述之對焦過程可直接以發光元件30之光線32為光源進行對焦,或者,整合式光學檢測裝置26可再另外設置其他光源(圖中未示)。對焦完成後,影像擷取單元49擷取發光元件30發光時的影像,藉以進行發光元件30之近場光學檢測。此外,在發光元件30發光並進行檢測時,線性位移單元53亦能帶動影像擷取單元49沿Z軸地小範圍移動而掃瞄並連續擷取發光元件30之影像,藉以進行
發光元件30之M2光學檢測(亦即光束質量因子檢測),舉例而言,線性位移單元53之滑移座536可自滑台532之中間位置開始帶動影像擷取單元49先向下移動掃描,然後再向上移動掃描。
The aforementioned focusing process can directly use the light 32 of the light-emitting
請參閱圖3,發光元件30受整合式光學檢測裝置26檢測完畢後,發光元件30再沿Y軸移動至遠場檢測裝置28下方,以進行遠場光學特性之檢測。值得一提的是,在發光元件30為非高斯光源之情況下,才會有檢測遠場光學特性之需求,換言之,本發明之整合式光學檢測裝置26不限於檢測非高斯光源,且不限於與遠場檢測裝置28共同構成光學檢測系統。
Please refer to FIG. 3 . After the light-emitting
由前述內容可得知,本發明之整合式光學檢測裝置26係將收光模組51所進行之亮度及光譜檢測與影像擷取單元49所進行之近場光學檢測整合在一起,且可(但不限於)將M2光學檢測亦整合在一起,使得發光元件30沿Y軸移動至整合式光學檢測裝置26下方後,不需再沿Y軸移動,即可先後進行亮度及/或光譜檢測、近場光學檢測及/或M2光學檢測(順序不限),因此可節省空間並減少發光元件30移動之距離及時間,進而提升檢測效率。而且,相較於將光學檢測條件不同的遠場光學檢測與光亮度檢測整合在一起,或將檢測條件不同的遠場光學檢測與近場光學檢測整合在一起,本發明將光學檢測條件相近的光亮度檢測及近場光學檢測整合在一起,可以使整合式光學檢測裝置26的設計複雜度較低。此外,於本發明之整合式光學檢測裝置26中,收光模組51係配置於光學路徑36之第一子路徑361,而減光單元45係配置於光學路徑36之第二子路徑362,換言之,發光元件30受收光模組51檢測之光線(即第一檢測光324)在進入收光模組51之前並未先經過減光單元45,因此可避免收光件512接收到的光線不足之問題。再者,於本發明之整合式光學檢測裝置26中,減光單元45係在光學路徑36上
位於第二物鏡47之上游側471,亦即,減光單元45係位於平行光322之光學路徑上,藉此,在更換受測之發光元件30後,即使發光元件30之發光角度不同,也不需要耗費時間重新調整對焦,因此可避免更換受測元件需重新對焦之問題,進而可更加提升檢測效率。
It can be known from the foregoing that the integrated
另一方面,於本實施例之整合式光學檢測裝置26中,第一物鏡41、導光單元43、減光單元45、第二物鏡47及影像擷取單元49係沿發光元件30之光學軸34呈縱向配置,只有收光模組51是橫向配置。換言之,本實施例係將需要較大工作長度的近場光學檢測相關構件縱向設置,而將較不佔空間之收光模組51橫向設置以進行整合,故本實施例之整合式光學檢測裝置26可以避免整個光學檢測系統20的橫向長度太長而造成設備大型化。於此方面,本實施例所採用之導光單元43可供收光模組51設置在導光單元43之反射光路435上,而減光單元45、第二物鏡47及影像擷取單元49則設置在導光單元43之透射光路436上,如此亦有助於達成前述之縱向及橫向配置方式及避免設備大型化之功效。此外,本實施例所採用之減光單元45為吸收式減光單元,係較反射式減光單元更容易配置於本發明之結構而可避免設計複雜,且有助於達成前述之縱向配置方式進而避免設備大型化。
On the other hand, in the integrated
更進一步而言,請參閱圖9,受測之發光元件30(例如VCSEL晶片)可能屬於一待測物料60(例如具有多數個VCSEL晶片的晶圓),待測物料60之發光元件30數量不限,意即待測物料60上可能設有多個發光元件30(為簡化圖式,圖9僅顯示一發光元件30),在此情況下,本發明之光學檢測系統20可更包含有一掃描裝置29,用以掃描出待測物料60上各發光元件30之位置座標。或者,掃描裝置29亦可替換為一視覺對位裝置,用以供人工肉眼對位。可想而知,在有
掃描裝置29或視覺對位裝置之情況下,光學檢測系統20之橫向空間更為受限,而前述本實施例之配置方式即可避免橫向空間不足之問題。
Furthermore, please refer to FIG. 9 . The light-emitting
最後,必須再次說明,本發明於前揭實施例中所揭露的構成元件,僅為舉例說明,並非用來限制本案之範圍,其他等效元件的替代或變化,亦應為本案之申請專利範圍所涵蓋。 Finally, it must be stated again that the constituent elements disclosed in the foregoing embodiments of the present invention are only examples and are not used to limit the scope of this case. Substitutions or changes of other equivalent elements should also be within the scope of the patent application of this case. covered.
然而,收光模組51之收光件512上的二光感測件514、515並不被限制需同時存在。例如,收光件512上只設置有光感測件514或光感測件515其中之一亦可。也就是說,收光模組51係檢測第一檢測光324之亮度及光譜之其中之一亦可。
However, the two
26:整合式光學檢測裝置 26: Integrated optical detection device
30:發光元件 30:Light-emitting components
32:光線 32:Light
322:平行光 322: Parallel light
324:第一檢測光 324: First detection light
326:第二檢測光 326: Second detection light
328:非平行光 328:Non-parallel light
34:光學軸 34: Optical axis
36:光學路徑 36: Optical path
361:第一子路徑 361: First sub-path
362:第二子路徑 362: Second sub-path
41:第一物鏡 41:First objective lens
411:上游側 411: upstream side
412:下游側 412: Downstream side
43:導光單元 43:Light guide unit
431:第一側(上游側) 431: First side (upstream side)
432:第二側(第一下游側) 432: Second side (first downstream side)
433:第三側(第二下游側) 433: Third side (second downstream side)
434:導光元件(分光鏡) 434: Light guide element (beam splitter)
435:反射光路 435: Reflected light path
436:透射光路 436: Transmitted light path
45:減光單元 45: Light reduction unit
47:第二物鏡 47:Second objective lens
471:上游側 471: upstream side
472:下游側 472: Downstream side
49:影像擷取單元 49:Image capture unit
51:收光模組 51: Light collecting module
512:收光件 512: Light receiving parts
514,515:光感測件 514,515: Light sensing components
Claims (10)
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Citations (5)
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CN1499185A (en) * | 2002-10-31 | 2004-05-26 | ��ʽ������Э���������� | Optical characteristic measurer and optical displacement gage |
TW202045896A (en) * | 2019-05-31 | 2020-12-16 | 致茂電子股份有限公司 | Device for measuring optolectronic units |
CN112993739A (en) * | 2019-12-13 | 2021-06-18 | 旺矽科技股份有限公司 | Light emitting element detection method and apparatus |
TW202126992A (en) * | 2019-12-13 | 2021-07-16 | 旺矽科技股份有限公司 | Optical inspection system |
TW202214996A (en) * | 2020-09-21 | 2022-04-16 | 法商法格爾微科技公司 | Device and method for measuring interfaces of an optical element |
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CN1499185A (en) * | 2002-10-31 | 2004-05-26 | ��ʽ������Э���������� | Optical characteristic measurer and optical displacement gage |
TW202045896A (en) * | 2019-05-31 | 2020-12-16 | 致茂電子股份有限公司 | Device for measuring optolectronic units |
CN112993739A (en) * | 2019-12-13 | 2021-06-18 | 旺矽科技股份有限公司 | Light emitting element detection method and apparatus |
TW202126992A (en) * | 2019-12-13 | 2021-07-16 | 旺矽科技股份有限公司 | Optical inspection system |
TWI748667B (en) * | 2019-12-13 | 2021-12-01 | 旺矽科技股份有限公司 | Optical inspection system |
TW202214996A (en) * | 2020-09-21 | 2022-04-16 | 法商法格爾微科技公司 | Device and method for measuring interfaces of an optical element |
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