TW202114813A - Grinding method for plate-like workpiece decreases the thickness difference of the rectangular workpiece - Google Patents

Grinding method for plate-like workpiece decreases the thickness difference of the rectangular workpiece Download PDF

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Publication number
TW202114813A
TW202114813A TW109131328A TW109131328A TW202114813A TW 202114813 A TW202114813 A TW 202114813A TW 109131328 A TW109131328 A TW 109131328A TW 109131328 A TW109131328 A TW 109131328A TW 202114813 A TW202114813 A TW 202114813A
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Taiwan
Prior art keywords
grinding
workpiece
plate
shaped workpiece
rectangular workpiece
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TW109131328A
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Chinese (zh)
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山中聰
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日商迪思科股份有限公司
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Publication of TW202114813A publication Critical patent/TW202114813A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/02—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a reciprocatingly-moved work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The purpose of the invention is to decrease the thickness difference generated by a square plate-like workpiece after grinding. The solution is that in a retreating step implemented after a grinding step, the grinding stone is moved away from the rectangular workpiece by relatively moving the grinding stone and the rectangular workpiece in a horizontal direction. In another word, the grinding stone and the rectangular workpiece rotating in contact with each other are kept in contact with each other to relatively move in the horizontal direction in the retreating step. Therefore, even if there is a thickness deviation (thickness difference) existing on the ground rectangular workpiece immediately after the grinding step, the thicker portion of the rectangular workpiece can still be scraped off with the grinding stone by horizontally moving the grinding grindstone and the rectangular workpiece in the retreating step. Accordingly, the thickness difference of the rectangular workpiece can be decreased.

Description

板狀工件之磨削方法Grinding method of plate-shaped workpiece

本發明是有關於一種板狀工件之磨削方法。The invention relates to a method for grinding plate-shaped workpieces.

在專利文獻1及2所揭示的技術中，是以磨削磨石來磨削四角形的方形板狀工件。 先前技術文獻 專利文獻In the techniques disclosed in Patent Documents 1 and 2, a square plate-shaped workpiece having a square shape is ground with a grinding grindstone. Prior art literature Patent literature

專利文獻1：日本特開2016-150421號公報 專利文獻2：日本特開2015-205358號公報Patent Document 1: Japanese Patent Application Publication No. 2016-150421 Patent Document 2: Japanese Patent Application Publication No. 2015-205358

發明欲解決之課題The problem to be solved by the invention

磨削磨石是在基台配置成環狀，且對已保持在旋轉的工作夾台之方形板狀工件的上表面進行磨削。此時，磨削磨石是接觸於旋轉的方形板狀工件之自中心到外周的區域。因此，在磨削中，磨削磨石中的接觸於方形板狀工件的部分的長度(磨削距離)會變長、或變短。亦即，在例如磨削方形板狀工件的對角線的周邊部分時，磨削距離會變長。另一方面，在磨削連結板狀工件中的相向的邊的中心之線的周邊部分時，磨削距離會變短。The grinding grindstone is arranged in a ring shape on the base and grinds the upper surface of a square plate-shaped workpiece that has been held on a rotating work chuck. At this time, the grinding grindstone is in contact with the area from the center to the outer periphery of the rotating square plate-shaped workpiece. Therefore, in grinding, the length (grinding distance) of the portion of the grinding grindstone that contacts the square plate-shaped workpiece becomes longer or shorter. That is, for example, when grinding the peripheral portion of the diagonal of a square plate-shaped workpiece, the grinding distance becomes longer. On the other hand, when grinding the peripheral part of the line connecting the centers of the opposing sides in the plate-shaped workpiece, the grinding distance becomes shorter.

在磨削距離變短時，因為會使施加於磨削磨石的負荷變得較小，所以磨削力會變得較高，而變得易於進行磨削。因此，變得容易將方形板狀工件中的被磨削部分形成為事先設定之預定的厚度。相對於此，在磨削距離變長時，因為施加於磨削磨石的負荷變得較大，所以磨削力變得較低，而變得難以進行磨削。因此，易於讓方形板狀工件中的被磨削部分變得比預定的厚度更厚。When the grinding distance becomes shorter, since the load applied to the grinding stone becomes smaller, the grinding force becomes higher and the grinding becomes easier. Therefore, it becomes easy to form the ground portion of the square plate-shaped workpiece to a predetermined thickness set in advance. On the other hand, when the grinding distance becomes longer, the load applied to the grinding stone becomes larger, so the grinding force becomes lower, and it becomes difficult to grind. Therefore, it is easy to make the ground portion of the square plate-shaped workpiece thicker than a predetermined thickness.

如此，因為在磨削中因應於磨削距離的長短而在磨削力產生變化，所以會因應於所述的變化，而導致在已磨削之方形板狀工件的厚度產生差異。In this way, because the grinding force changes in accordance with the length of the grinding distance during grinding, the thickness of the square plate-shaped workpiece that has been ground varies in response to the change.

從而，本發明之目的在於：在磨削板狀工件(例如，四角形的板狀工件)時，讓在磨削後之方形板狀工件產生的厚度差變小。 用以解決課題之手段Therefore, the object of the present invention is to reduce the thickness difference of the square plate-shaped workpiece after grinding when a plate-shaped workpiece (for example, a quadrangular plate-shaped workpiece) is ground. Means to solve the problem

本發明的板狀工件之磨削方法(本磨削方法)是使用了磨削裝置的板狀工件之磨削方法，前述磨削裝置具備：工作夾台，藉由保持面保持多角形的板狀工件，並以該保持面的中心為軸而旋轉；磨削機構，以環狀的磨削磨石對已保持在該工作夾台的板狀工件進行磨削；磨削進給機構，使該磨削機構在垂直於該保持面的方向上移動；及水平移動機構，使該磨削機構與該工作夾台在平行於該保持面的水平方向上相對地移動，前述板狀工件之磨削方法包含以下步驟： 磨削步驟，使用該水平移動機構來將該工作夾台的該軸定位到該磨削磨石的下表面所通過之水平方向的位置，並使用該磨削進給機構來將該磨削機構朝接近於該工作夾台的方向磨削進給，並藉由該磨削磨石將已保持在旋轉之該工作夾台的該保持面的板狀工件磨削到成為事先設定的厚度為止；及 退離步驟，在該磨削步驟之後，停止由該磨削進給機構所進行之磨削進給，並使用該水平移動機構來使該磨削機構與該工作夾台在水平方向上相對地移動成讓該磨削磨石從該工作夾台的該軸前往該工作夾台的外周，藉此使該磨削磨石離開該板狀工件。 發明效果The method of grinding a plate-shaped workpiece of the present invention (this grinding method) is a method of grinding a plate-shaped workpiece using a grinding device. The grinding device includes: a work chuck, and a holding surface holds a polygonal plate The grinding mechanism uses a ring-shaped grinding stone to grind the plate-shaped workpiece that has been held on the work clamp table; the grinding feed mechanism makes it rotate with the center of the holding surface as the axis; The grinding mechanism moves in a direction perpendicular to the holding surface; and a horizontal moving mechanism that makes the grinding mechanism and the work clamp move relatively in a horizontal direction parallel to the holding surface. The grinding of the aforementioned plate-shaped workpiece The cutting method includes the following steps: In the grinding step, the horizontal movement mechanism is used to position the shaft of the work chuck to a position in the horizontal direction through which the lower surface of the grinding stone passes, and the grinding feed mechanism is used to perform the grinding mechanism Grinding and feeding in a direction close to the work chuck, and use the grinding stone to grind the plate-shaped workpiece that has been held on the holding surface of the rotating work chuck until it reaches the preset thickness; and Retreat step, after the grinding step, stop the grinding feed performed by the grinding feed mechanism, and use the horizontal movement mechanism to make the grinding mechanism and the work chuck face in the horizontal direction Move so that the grinding grindstone is moved from the shaft of the work chuck to the outer periphery of the work chuck, thereby causing the grinding grindstone to leave the plate-shaped workpiece. Invention effect

在本磨削方法中，是在磨削步驟之後所實施的退離步驟中，藉由使磨削磨石與板狀工件在水平方向上相對地移動，而使磨削磨石從板狀工件離開。亦即，在退離步驟中使一邊彼此相接觸一邊旋轉的磨削磨石與板狀工件，以維持彼此相接觸的狀態在水平方向上相對地移動。In this grinding method, in the retreat step performed after the grinding step, the grinding grindstone and the plate-shaped workpiece are moved relative to each other in the horizontal direction, so that the grinding grindstone is moved from the plate-shaped workpiece. go away. That is, in the retreat step, the grinding grindstone and the plate-shaped workpiece rotating while being in contact with each other move relatively in the horizontal direction while maintaining contact with each other.

從而，在本磨削方法中，即使是在磨削步驟之後馬上在磨削後的板狀工件上存在有厚度的偏差(厚度差)的情況下，仍然可以藉由在退離步驟中的磨削磨石與板狀工件的水平移動，而以磨削磨石來刮除板狀工件的較厚的部分。藉此，可以讓板狀工件的厚度差變小。Therefore, in this grinding method, even if there is a thickness deviation (thickness difference) on the plate-shaped workpiece after grinding immediately after the grinding step, it is still possible to use the grinding in the retreating step. The horizontal movement of the grinding stone and the plate-shaped workpiece, and the grinding stone is used to scrape off the thicker part of the plate-shaped workpiece. Thereby, the thickness difference of the plate-shaped workpiece can be reduced.

用以實施發明之形態The form used to implement the invention

如圖1所示，本實施形態之磨削裝置11是用於磨削作為多角形的板狀工件之矩形工件W的裝置，並具備有長方體形的基台12、朝上方延伸的支柱13，控制磨削裝置11的各構件的控制機構70。As shown in FIG. 1, the grinding device 11 of this embodiment is a device for grinding a rectangular workpiece W, which is a polygonal plate-shaped workpiece, and includes a rectangular parallelepiped base 12 and a pillar 13 extending upward. A control mechanism 70 that controls each member of the grinding device 11.

在基台12的上表面側設置有開口部12a。並且，在開口部12a內配置有保持機構15。保持機構15包含有工作夾台18及支撐構件16，前述工作夾台18具備有吸附矩形工件W的保持面19，前述支撐構件16是支撐工作夾台18。An opening 12a is provided on the upper surface side of the base 12. In addition, a holding mechanism 15 is arranged in the opening 12a. The holding mechanism 15 includes a work chuck table 18 and a support member 16. The work chuck table 18 is provided with a holding surface 19 for sucking the rectangular workpiece W, and the support member 16 supports the work chuck table 18.

工作夾台18的保持面19是連通於吸引源(未圖示)，且隔著保護膠帶來吸引保持矩形工件W。亦即，保持機構15是藉由保持面19來保持矩形工件W。 再者，保持面19具有以中心為頂點之平緩傾斜的圓錐形，且矩形工件W也沿著保持面19被保持成圓錐狀(參照圖2)。The holding surface 19 of the work chuck table 18 communicates with a suction source (not shown), and sucks and holds the rectangular workpiece W through a protective tape. That is, the holding mechanism 15 holds the rectangular workpiece W by the holding surface 19. Furthermore, the holding surface 19 has a gently inclined conical shape with the center as the apex, and the rectangular workpiece W is also held in a conical shape along the holding surface 19 (refer to FIG. 2).

又，如圖1所示，工作夾台18是藉由配置於支撐構件16內的旋轉機構M，而在已藉由保持面19保持有矩形工件W的狀態下，以通過保持面19的中心之在Z軸方向上延伸的中心軸18b(參照圖3)為軸且可旋轉。從而，矩形工件W是被保持面19所保持且以中心為軸而旋轉。Moreover, as shown in FIG. 1, the work chuck table 18 is configured to pass through the center of the holding surface 19 in a state where the rectangular workpiece W is held by the holding surface 19 by the rotating mechanism M disposed in the supporting member 16. The central axis 18b (refer to FIG. 3) extending in the Z-axis direction is a shaft and is rotatable. Therefore, the rectangular workpiece W is held by the holding surface 19 and rotates around the center.

在工作夾台18的周圍連結有在Y軸方向上伸縮的蛇腹罩蓋J。並且，於保持機構15的下方配設有Y軸方向移動機構40。A bellows cover J that expands and contracts in the Y-axis direction is connected around the work clamp table 18. In addition, a Y-axis direction moving mechanism 40 is arranged below the holding mechanism 15.

Y軸方向移動機構40是水平移動機構之一例。Y軸方向移動機構40使保持機構15與磨削機構30在平行於保持面19的水平方向上相對地移動。Y軸方向移動機構40具備有平行於Y軸方向的一對Y軸導軌42、在此Y軸導軌42上滑動之Y軸移動工作台45、和Y軸導軌42平行的Y軸滾珠螺桿43、以及連接於Y軸滾珠螺桿43的Y軸伺服馬達44、用於檢測Y軸伺服馬達44的旋轉速度及位置的Y軸編碼器46、以及保持這些的保持台41。The Y-axis direction movement mechanism 40 is an example of a horizontal movement mechanism. The Y-axis direction moving mechanism 40 relatively moves the holding mechanism 15 and the grinding mechanism 30 in a horizontal direction parallel to the holding surface 19. The Y-axis direction moving mechanism 40 includes a pair of Y-axis guide rails 42 parallel to the Y-axis direction, a Y-axis moving table 45 that slides on the Y-axis guide rail 42, and a Y-axis ball screw 43 that is parallel to the Y-axis guide rail 42. And a Y-axis servo motor 44 connected to the Y-axis ball screw 43, a Y-axis encoder 46 for detecting the rotation speed and position of the Y-axis servo motor 44, and a holding table 41 that holds these.

Y軸移動工作台45是以可在Y軸導軌42上滑動的方式設置。在Y軸移動工作台45的下表面固定有螺帽部45a(參照圖2)。於此螺帽部45a螺合有Y軸滾珠螺桿43。Y軸伺服馬達44是連結於Y軸滾珠螺桿43的一端部。The Y-axis moving table 45 is installed in a manner slidable on the Y-axis guide 42. A nut 45a is fixed to the lower surface of the Y-axis moving table 45 (refer to FIG. 2). The Y-axis ball screw 43 is screwed to the nut portion 45a. The Y-axis servo motor 44 is connected to one end of the Y-axis ball screw 43.

如圖1所示，在Y軸方向移動機構40中，是藉由以Y軸伺服馬達44使Y軸滾珠螺桿43旋轉，而讓Y軸移動工作台45沿著Y軸導軌42在Y軸方向上移動。在Y軸移動工作台45上載置有保持機構15的支撐構件16。從而，隨著Y軸移動工作台45往Y軸方向的移動，使包含工作夾台18的保持機構15在Y軸方向上移動。As shown in FIG. 1, in the Y-axis direction moving mechanism 40, the Y-axis ball screw 43 is rotated by the Y-axis servo motor 44, and the Y-axis moving table 45 is moved along the Y-axis guide 42 in the Y-axis direction. Move up. The supporting member 16 of the holding mechanism 15 is placed on the Y-axis moving table 45. Therefore, as the Y-axis moving table 45 moves in the Y-axis direction, the holding mechanism 15 including the work chuck table 18 is moved in the Y-axis direction.

再者，如圖2所示，支撐構件16是透過傾斜度變更構件17而被載置在Y軸移動工作台45上。傾斜度變更構件17是為了變更保持機構15中的工作夾台18的保持面19的傾斜度而使用。Furthermore, as shown in FIG. 2, the supporting member 16 is placed on the Y-axis moving table 45 through the inclination changing member 17. The inclination changing member 17 is used to change the inclination of the holding surface 19 of the work chuck table 18 in the holding mechanism 15.

在本實施形態中，若粗略地說，保持機構15是沿著Y軸方向在前方(-Y方向側)的晶圓載置位置與後方(+Y方向側)的磨削區域之間移動，前述晶圓載置位置是用於將矩形工件W載置於保持面19的位置，前述磨削區域是矩形工件W被磨削的區域。In this embodiment, roughly speaking, the holding mechanism 15 moves along the Y-axis direction between the front (-Y direction side) wafer placement position and the rear (+Y direction side) grinding area. The wafer mounting position is a position for mounting the rectangular workpiece W on the holding surface 19, and the aforementioned grinding area is an area where the rectangular workpiece W is ground.

又，如圖1所示，在基台12上的後方(+Y方向側)豎立設置有支柱13。在支柱13的前表面設置有磨削矩形工件W的磨削機構30、及使磨削機構30在垂直於保持面19的Z軸方向(磨削進給方向)上移動的磨削進給機構14。Moreover, as shown in FIG. 1, the support|pillar 13 is erected in the back (+Y direction side) of the base 12. As shown in FIG. A grinding mechanism 30 for grinding a rectangular workpiece W and a grinding feeding mechanism for moving the grinding mechanism 30 in the Z-axis direction (grinding feed direction) perpendicular to the holding surface 19 are provided on the front surface of the pillar 13 14.

磨削進給機構14具備有：平行於Z軸方向的一對Z軸導軌21、於此Z軸導軌21上滑動的Z軸移動工作台23、和Z軸導軌21平行的Z軸滾珠螺桿20、Z軸伺服馬達22、用於檢測Z軸伺服馬達22的旋轉速度及位置的Z軸編碼器25、及安裝於Z軸移動工作台23的前表面(正面)的支持器24。支持器24保持有磨削機構30。The grinding feed mechanism 14 includes a pair of Z-axis guide rails 21 parallel to the Z-axis direction, a Z-axis moving table 23 sliding on the Z-axis guide 21, and a Z-axis ball screw 20 parallel to the Z-axis guide 21 , The Z-axis servo motor 22, a Z-axis encoder 25 for detecting the rotation speed and position of the Z-axis servo motor 22, and a supporter 24 mounted on the front surface (front) of the Z-axis moving table 23. The holder 24 holds a grinding mechanism 30.

Z軸移動工作台23是以可在Z軸導軌21上滑動的方式設置。在Z軸移動工作台23的後表面側(背面側)固定有螺帽部20a(參照圖2)。於此螺帽部20a螺合有Z軸滾珠螺桿20。Z軸伺服馬達22是連結於Z軸滾珠螺桿20的一端部。The Z-axis moving table 23 is installed in a manner slidable on the Z-axis guide rail 21. A nut portion 20a is fixed to the rear surface side (rear side) of the Z-axis moving table 23 (refer to FIG. 2). The Z-axis ball screw 20 is screwed to the nut portion 20a. The Z-axis servo motor 22 is connected to one end of the Z-axis ball screw 20.

如圖1所示，在磨削進給機構14中，是藉由Z軸伺服馬達22使Z軸滾珠螺桿20旋轉，而讓Z軸移動工作台23沿著Z軸導軌21在Z軸方向上移動。藉此，已安裝於Z軸移動工作台23的支持器24、及保持於支持器24的磨削機構30也和Z軸移動工作台23一起在Z軸方向上移動。As shown in FIG. 1, in the grinding feed mechanism 14, the Z-axis ball screw 20 is rotated by the Z-axis servo motor 22, and the Z-axis moving table 23 is moved along the Z-axis guide 21 in the Z-axis direction. mobile. Thereby, the holder 24 attached to the Z-axis moving table 23 and the grinding mechanism 30 held by the holder 24 also move in the Z-axis direction together with the Z-axis moving table 23.

磨削機構30具備有：固定於支持器24的主軸殼體31、可旋轉地保持在主軸殼體31的主軸32、旋轉驅動主軸32的馬達33、安裝於主軸32的下端的輪座34、及被輪座34所支撐的磨削輪35。The grinding mechanism 30 is provided with a spindle housing 31 fixed to the holder 24, a spindle 32 rotatably held on the spindle housing 31, a motor 33 for rotationally driving the spindle 32, a wheel seat 34 attached to the lower end of the spindle 32, And the grinding wheel 35 supported by the wheel seat 34.

主軸殼體31是以朝Z軸方向延伸的方式保持於支持器24。主軸32是以和工作夾台18的保持面19正交的方式於Z軸方向上延伸，且可旋轉地被主軸殼體31所支撐。The spindle housing 31 is held by the holder 24 so as to extend in the Z-axis direction. The main shaft 32 extends in the Z-axis direction so as to be orthogonal to the holding surface 19 of the work chuck table 18 and is rotatably supported by the main shaft housing 31.

馬達33是連結於主軸32的上端側。主軸32是藉由此馬達33，而以在Z軸方向上延伸的旋轉軸為中心來旋轉。The motor 33 is connected to the upper end side of the main shaft 32. The main shaft 32 is rotated by the motor 33 with a rotation axis extending in the Z-axis direction as a center.

輪座34是形成為圓板狀，且固定於主軸32的下端(前端)。輪座34是支撐磨削輪35。The wheel base 34 is formed in a disc shape and is fixed to the lower end (front end) of the main shaft 32. The wheel base 34 supports the grinding wheel 35.

磨削輪35形成為具有與輪座34大致相同直徑。磨削輪35包含由不鏽鋼等金屬材料所形成之圓環狀的輪基台(環狀基台)36。在輪基台36的下表面，是涵蓋全周而固定有環狀地配置的複數個磨削磨石37。磨削磨石37是對已保持在保持機構15中工作夾台18的保持面19之矩形工件W的上表面進行磨削，其中前述保持機構15是配置在磨削區域。 再者，矩形工件W的被磨削面有形成器件的圖案面之情況、及圖案面的相反側的背面之情況。The grinding wheel 35 is formed to have approximately the same diameter as the wheel seat 34. The grinding wheel 35 includes an annular wheel base (annular base) 36 formed of a metal material such as stainless steel. On the lower surface of the wheel base 36, a plurality of grinding stones 37 arranged annularly covering the entire circumference are fixed. The grinding grindstone 37 is to grind the upper surface of the rectangular workpiece W that has been held on the holding surface 19 of the work chuck 18 in the holding mechanism 15, and the holding mechanism 15 is arranged in the grinding area. In addition, the surface to be ground of the rectangular workpiece W may be the pattern surface of the device and the back surface on the opposite side of the pattern surface.

如此，磨削機構30是藉由設置在旋轉之磨削輪35的環狀的磨削磨石37來對保持在保持機構15中的工作夾台18的保持面19，且以保持面19的中心為軸而旋轉之矩形工件W進行磨削。 再者，磨削時，如圖2所示，是藉由傾斜度變更構件17將工作夾台18之傾斜度調整成：圓錐狀的矩形工件W之上表面相對於磨削磨石37變得平行。In this way, the grinding mechanism 30 uses the ring-shaped grinding grindstone 37 provided on the rotating grinding wheel 35 to support the holding surface 19 of the work chuck 18 held in the holding mechanism 15 and to maintain the surface 19 The rectangular workpiece W whose center is the axis and rotates is ground. In addition, during grinding, as shown in FIG. 2, the inclination of the work chuck 18 is adjusted by the inclination changing member 17 so that the upper surface of the conical rectangular workpiece W becomes larger with respect to the grinding grindstone 37 parallel.

控制機構70是控制磨削裝置11的各個構件，並執行矩形工件W的磨削處理。以下，針對磨削裝置11中的磨削處理進行說明。The control mechanism 70 controls each member of the grinding device 11 and executes the grinding process of the rectangular workpiece W. Hereinafter, the grinding process in the grinding device 11 will be described.

首先，控制機構70或作業人員使矩形工件W保持在圖1所示之保持機構15中的工作夾台18的保持面19。之後，控制機構70控制馬達33，而使磨削輪35(磨削磨石37)與主軸32一起如在圖3藉由箭頭A所示地旋轉。 此外，控制機構70藉由配置於支撐構件16內的旋轉機構M而使工作夾台18旋轉。藉此，將保持於工作夾台18及其保持面19的矩形工件W如藉由箭頭B所示地旋轉。First, the control mechanism 70 or the operator holds the rectangular workpiece W on the holding surface 19 of the work chuck table 18 in the holding mechanism 15 shown in FIG. 1. After that, the control mechanism 70 controls the motor 33 to rotate the grinding wheel 35 (grinding stone 37) together with the main shaft 32 as shown by arrow A in FIG. 3. In addition, the control mechanism 70 rotates the work chuck table 18 by the rotation mechanism M disposed in the support member 16. Thereby, the rectangular workpiece W held on the work chuck table 18 and its holding surface 19 is rotated as indicated by the arrow B.

接著，控制機構70實施磨削步驟。在此步驟中，首先，控制機構70是使用Y軸方向移動機構40，而如圖3所示地將已保持在保持機構15的工作夾台18中的保持面19之矩形工件W的中心(旋轉中心)，定位到磨削機構30中的磨削磨石37的下表面所通過的水平方向的位置。亦即，可將磨削磨石37(磨削磨石37的下表面)配置在已保持於保持面19之矩形工件W的中心。Next, the control mechanism 70 performs a grinding step. In this step, first, the control mechanism 70 uses the Y-axis direction moving mechanism 40, and as shown in FIG. 3, holds the center of the rectangular workpiece W on the holding surface 19 of the work chuck table 18 of the holding mechanism 15 ( The center of rotation) is positioned in the horizontal direction through which the lower surface of the grinding stone 37 in the grinding mechanism 30 passes. That is, the grinding stone 37 (the lower surface of the grinding stone 37) can be arranged at the center of the rectangular workpiece W held on the holding surface 19.

此外，控制機構70是使用磨削進給機構14，而如在圖3藉由箭頭C所示地將包含磨削磨石37的磨削機構30朝接近於工作夾台18的方向(-Z方向)磨削進給。如此進行，控制機構70藉由磨削磨石37將已保持於旋轉之工作夾台18的保持面19之矩形工件W磨削到成為事先設定的厚度為止。In addition, the control mechanism 70 uses the grinding feed mechanism 14, and as shown by the arrow C in FIG. 3, the grinding mechanism 30 including the grinding grindstone 37 is moved in the direction close to the work chuck 18 (-Z Direction) grinding feed. In this manner, the control mechanism 70 uses the grinding stone 37 to grind the rectangular workpiece W held on the holding surface 19 of the rotating work chuck 18 until the thickness is set in advance.

再者，在磨削步驟中，正在被磨削的矩形工件W的厚度是藉由未圖示的厚度測定機構來適當測定。又，在圖3及圖4中，是將磨削進給機構14及磨削機構30簡化來顯示。In addition, in the grinding step, the thickness of the rectangular workpiece W being ground is appropriately measured by a thickness measuring mechanism not shown. In addition, in FIGS. 3 and 4, the grinding feed mechanism 14 and the grinding mechanism 30 are simplified and shown.

磨削步驟之後，控制機構70會實施退離步驟。在退離步驟中，控制機構70會停止由磨削進給機構14所進行之磨削機構30的磨削進給。之後，控制機構70在使磨削磨石37及工作夾台18旋轉的狀態下，使用Y軸方向移動機構40(參照圖1及圖2)來使磨削磨石37與工作夾台18在水平方向上相對地移動成讓磨削機構30的磨削磨石37從工作夾台18的旋轉中心(中心軸18b)前往工作夾台18的外周。在本實施形態中，是以從旋轉之矩形工件W的中心18a(參照圖3)前往矩形工件W的外周的方式使磨削磨石37與工作夾台18在水平方向上相對地移動。又，在本實施形態中，Y軸方向移動機構40是使工作夾台18(保持機構15)如在圖4中藉由箭頭D所示地朝-Y方向移動。如此進行，控制機構70即如圖2所示，使磨削磨石37從矩形工件W離開。After the grinding step, the control mechanism 70 will implement the retreat step. In the retreat step, the control mechanism 70 stops the grinding and feeding of the grinding mechanism 30 by the grinding and feeding mechanism 14. After that, the control mechanism 70 uses the Y-axis direction moving mechanism 40 (refer to FIGS. 1 and 2) to make the grinding stone 37 and the work chuck 18 rotate while rotating the grinding stone 37 and the work chuck 18 Relatively move in the horizontal direction so that the grinding grindstone 37 of the grinding mechanism 30 moves from the rotation center (central axis 18b) of the work chuck 18 to the outer periphery of the work chuck 18. In this embodiment, the grinding stone 37 and the work chuck 18 are relatively moved in the horizontal direction from the center 18a (see FIG. 3) of the rotating rectangular workpiece W to the outer periphery of the rectangular workpiece W. In addition, in this embodiment, the Y-axis direction moving mechanism 40 moves the work chuck table 18 (holding mechanism 15) in the -Y direction as shown by the arrow D in FIG. 4. In this way, the control mechanism 70 moves the grinding stone 37 away from the rectangular workpiece W as shown in FIG. 2.

如以上，在本實施形態中，是在磨削步驟之後所實施的退離步驟中，藉由使磨削磨石37與矩形工件W在水平方向上相對地移動，而使磨削磨石37從矩形工件W離開。亦即，在退離步驟中使一邊彼此相接觸一邊旋轉的磨削磨石37與矩形工件W以維持彼此相接觸的狀態在水平方向上相對地移動。As described above, in the present embodiment, in the retreat step performed after the grinding step, the grinding stone 37 and the rectangular workpiece W are moved relative to each other in the horizontal direction to make the grinding stone 37 Leave from the rectangular workpiece W. That is, in the retreat step, the grinding grindstone 37 and the rectangular workpiece W, which rotate while contacting each other, move relatively in the horizontal direction while maintaining contact with each other.

從而，即使在磨削步驟之後馬上在磨削後的矩形工件W上存在有厚度的偏差(厚度差)的情況下，仍然可以藉由在退離步驟中的磨削磨石37與矩形工件W的水平移動，而以磨削磨石37來刮除矩形工件W的較厚的部分。藉此，可以將矩形工件W的厚度差變小。Therefore, even if there is a thickness deviation (thickness difference) in the rectangular workpiece W after the grinding step immediately after the grinding step, the grinding stone 37 and the rectangular workpiece W in the retreating step can still be used. The horizontal movement of the grindstone 37 is used to scrape off the thicker part of the rectangular workpiece W. Thereby, the thickness difference of the rectangular workpiece W can be reduced.

亦即，在連結矩形工件W中的相向的邊的中心之線的周邊部分被磨削時，磨削距離會變短，且施加於磨削磨石37的負荷變得較小，而變得容易將被磨削部分形成為預定的厚度。另一方面，在矩形工件W之對角線的周邊部分被磨削時，磨削距離變長，且施加於磨削磨石37的負荷變得較大，而變得易於使被磨削部分變得較厚。因此，在磨削步驟之後馬上有以下情況：如圖5所示地在矩形工件W產生厚度差。That is, when the peripheral portion of the line connecting the centers of the opposing sides in the rectangular workpiece W is ground, the grinding distance becomes shorter, and the load applied to the grinding stone 37 becomes smaller and becomes It is easy to form the ground portion to a predetermined thickness. On the other hand, when the peripheral part of the diagonal of the rectangular workpiece W is ground, the grinding distance becomes longer, and the load applied to the grinding stone 37 becomes larger, and it becomes easier to make the ground part Become thicker. Therefore, immediately after the grinding step, there is a case where a thickness difference is generated in the rectangular workpiece W as shown in FIG. 5.

有關於此，在本實施形態中，可實施上述之退離步驟，而藉由對矩形工件W相對地水平移動的磨削磨石37來刮除矩形工件W中的較厚的部分。藉此，如圖6所示，變得可讓矩形工件W中的厚度差變小。In this regard, in this embodiment, the above-mentioned retreat step can be implemented, and the thicker part of the rectangular workpiece W can be scraped off by the grinding stone 37 that moves the rectangular workpiece W relatively horizontally. As a result, as shown in FIG. 6, the thickness difference in the rectangular workpiece W can be reduced.

再者，在本實施形態中，是在工作夾台18的保持面19保持有1片矩形工件W。有關於此，亦可在保持面19載置複數片(例如2片)矩形工件W，並同時對這些矩形工件W進行磨削。In addition, in the present embodiment, one rectangular workpiece W is held on the holding surface 19 of the work chuck table 18. In this regard, it is also possible to place a plurality of pieces (for example, two pieces) of rectangular workpieces W on the holding surface 19 and to grind these rectangular workpieces W at the same time.

即使在此情況下，也會在磨削步驟之後馬上有以下情況：如圖7所示地在矩形工件W1及矩形工件W2產生有厚度差。並且，可以藉由實施上述之退離步驟，而如圖8所示，讓矩形工件W1及矩形工件W2中的厚度差變小。Even in this case, immediately after the grinding step, there may be a case where there is a difference in thickness between the rectangular workpiece W1 and the rectangular workpiece W2 as shown in FIG. 7. In addition, by implementing the above-mentioned retreat step, as shown in FIG. 8, the thickness difference between the rectangular workpiece W1 and the rectangular workpiece W2 can be reduced.

11:磨削裝置 12:基台 12a:開口部 13:支柱 14:磨削進給機構 15:保持機構 16:支撐構件 17:傾斜度變更構件 18:工作夾台 18a:中心 18b:中心軸 19:保持面 20:Z軸滾珠螺桿 20a,45a:螺帽部 21:Z軸導軌 22:Z軸伺服馬達 23:Z軸移動工作台 24:支持器 25:Z軸編碼器 30:磨削機構 31:主軸殼體 32:主軸 33:馬達 34:輪座 35:磨削輪 36:輪基台(環狀基台) 37:磨削磨石 40:Y軸方向移動機構 41:保持台 42:Y軸導軌 43:Y軸滾珠螺桿 44:Y軸伺服馬達 45:Y軸移動工作台 46:Y軸編碼器 70:控制機構 A,B,C,D:箭頭 J:蛇腹罩蓋 M:旋轉機構 W,W1,W2:矩形工件 X,+X,-X,+Y,-Y,Z,+Z,-Z:方向11: Grinding device 12: Abutment 12a: opening 13: Pillar 14: Grinding feed mechanism 15: Keep the organization 16: support member 17: Inclination change component 18: Work clamp table 18a: Center 18b: central axis 19: Keep the noodles 20: Z-axis ball screw 20a, 45a: Nut part 21: Z axis guide 22: Z-axis servo motor 23: Z-axis moving table 24: Supporter 25: Z axis encoder 30: Grinding mechanism 31: Spindle housing 32: Spindle 33: Motor 34: wheel seat 35: Grinding wheel 36: Wheel abutment (ring abutment) 37: Grinding grindstone 40: Y-axis direction moving mechanism 41: hold the stage 42: Y-axis guide 43: Y-axis ball screw 44: Y-axis servo motor 45: Y-axis moving table 46: Y axis encoder 70: control mechanism A, B, C, D: arrow J: Snake belly cover M: Rotating mechanism W, W1, W2: rectangular workpiece X,+X,-X,+Y,-Y,Z,+Z,-Z: direction

圖1是顯示磨削裝置之構成的說明圖。 圖2是從側面顯示磨削裝置之構成的說明圖。 圖3是顯示磨削裝置中的磨削步驟的說明圖。 圖4是顯示磨削裝置中的退離步驟的說明圖。 圖5是顯示在磨削步驟之後馬上形成於矩形工件之厚度差的說明圖。 圖6是顯示退離步驟後的矩形工件的說明圖。 圖7是顯示在磨削步驟之後馬上形成於矩形工件之厚度差的說明圖。 圖8是顯示退離步驟後的矩形工件的說明圖。Fig. 1 is an explanatory diagram showing the structure of the grinding device. Fig. 2 is an explanatory view showing the structure of the grinding device from the side. Fig. 3 is an explanatory diagram showing a grinding step in the grinding device. Fig. 4 is an explanatory diagram showing a step of retreating in the grinding device. Fig. 5 is an explanatory diagram showing the thickness difference formed in the rectangular workpiece immediately after the grinding step. Fig. 6 is an explanatory diagram showing the rectangular workpiece after the retreat step. Fig. 7 is an explanatory diagram showing the thickness difference formed in the rectangular workpiece immediately after the grinding step. Fig. 8 is an explanatory diagram showing the rectangular workpiece after the retreat step.

14:磨削進給機構14: Grinding feed mechanism

15:保持機構15: Keep the organization

18:工作夾台18: Work clamp table

19:保持面19: Keep the noodles

30:磨削機構30: Grinding mechanism

32:主軸32: Spindle

34:輪座34: wheel seat

35:磨削輪35: Grinding wheel

36:輪基台(環狀基台)36: Wheel abutment (ring abutment)

37:磨削磨石37: Grinding grindstone

A,B,D:箭頭A, B, D: arrow

W:矩形工件W: Rectangular workpiece

X,+Y,-Y,+Z,-Z:方向X, +Y, -Y, +Z, -Z: direction

Claims (1)

一種板狀工件之磨削方法，是使用了磨削裝置的板狀工件之磨削方法，前述磨削裝置具備：工作夾台，藉由保持面保持多角形的板狀工件，並以該保持面的中心為軸而旋轉；磨削機構，以環狀的磨削磨石對已保持在該工作夾台的板狀工件進行磨削；磨削進給機構，使該磨削機構在垂直於該保持面的方向上移動；及水平移動機構，使該磨削機構與該工作夾台在平行於該保持面的水平方向上相對地移動，前述板狀工件之磨削方法包含以下步驟： 磨削步驟，使用該水平移動機構來將該工作夾台的該軸定位到該磨削磨石的下表面所通過之水平方向的位置，並使用該磨削進給機構來將該磨削機構朝接近該工作夾台的方向磨削進給，並藉由該磨削磨石將已保持在旋轉之該工作夾台的該保持面的板狀工件磨削到成為事先設定的厚度為止；及 退離步驟，在該磨削步驟之後，停止由該磨削進給機構所進行之磨削進給，並使用該水平移動機構來使該磨削機構與該工作夾台在水平方向上相對地移動成讓該磨削磨石從該工作夾台的該軸前往該工作夾台的外周，藉此使該磨削磨石離開該板狀工件。A method of grinding a plate-shaped workpiece is a method of grinding a plate-shaped workpiece using a grinding device. The aforementioned grinding device is provided with a work clamp table that holds a polygonal plate-shaped workpiece by a holding surface, and uses the holding surface to hold a polygonal plate-shaped workpiece. The center of the surface is the axis and rotates; the grinding mechanism uses a ring-shaped grinding stone to grind the plate-shaped workpiece that has been held on the work clamp; the grinding feed mechanism makes the grinding mechanism vertical to Moving in the direction of the holding surface; and a horizontal moving mechanism for relatively moving the grinding mechanism and the work clamp table in a horizontal direction parallel to the holding surface. The aforementioned method for grinding a plate-shaped workpiece includes the following steps: In the grinding step, the horizontal movement mechanism is used to position the shaft of the work chuck to a position in the horizontal direction through which the lower surface of the grinding stone passes, and the grinding feed mechanism is used to perform the grinding mechanism Grinding and feeding in the direction approaching the working chuck, and grinding the plate-shaped workpiece that has been held on the holding surface of the rotating working chuck with the grinding stone until it reaches the preset thickness; and Retreat step, after the grinding step, stop the grinding feed performed by the grinding feed mechanism, and use the horizontal movement mechanism to make the grinding mechanism and the work chuck face in the horizontal direction Move so that the grinding grindstone is moved from the shaft of the work chuck to the outer periphery of the work chuck, thereby causing the grinding grindstone to leave the plate-shaped workpiece.
TW109131328A 2019-10-02 2020-09-11 Grinding method for plate-like workpiece decreases the thickness difference of the rectangular workpiece TW202114813A (en)

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JP2019182035A JP7312077B2 (en) 2019-10-02 2019-10-02 Grinding method for plate-shaped work
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CN115431163A (en) * 2021-06-01 2022-12-06 均豪精密工业股份有限公司 Method and apparatus for polishing sheet-like workpiece

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TWI766702B (en) * 2021-05-26 2022-06-01 均豪精密工業股份有限公司 Polishing method for sheet-like object and polishing device
CN115431163A (en) * 2021-06-01 2022-12-06 均豪精密工业股份有限公司 Method and apparatus for polishing sheet-like workpiece
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