TW202041320A - Creep feed grinding method - Google Patents

Abstract

An objective of the present invention is to have the same grinding amount of a plurality of plate-shaped works with different thicknesses when holding the plate-shaped works by a holding table to grind creep feed. The height of a grinding wheel for each of a plurality of plate-shaped works is determined in a grinding wheel height setting process. In a grinding process, the height of the grinding wheel is set to the height determined for each plate-shaped work to grind the plate-shaped works, thereby obtaining a constant grinding amount of each plate-shaped work even if the heights of the upper surfaces of the plate-shaped works are different when holding the plurality of plate-shaped works on a holding surface of a holding table to grind creep feed.

Description

Deep cut and slow advance grinding method

Invention field The present invention relates to a creep feed grinding method.

Background of the invention When the grinding wheel equipped with the grinding grindstone in a ring shape is rotated to perform deep-cut and slow-advance grinding on the upper surface of the plate-shaped workpiece, the grinding grindstone is positioned at a predetermined height and held there. The holding table of the plate-shaped workpiece faces the grinding grindstone and moves in the Y-axis direction, so that the lower surface and the side surface of the grinding grindstone are brought into contact with the plate-shaped workpiece (see Patent Documents 1 and 2). In addition, at this time, by holding a plurality of long plate-shaped workpieces with the holding table and moving the holding table in the Y-axis direction while grinding the plurality of plate-shaped workpieces, productivity can be improved. Prior art literature Patent literature

Patent Document 1: Japanese Patent Laid-Open No. 2010-016181 Patent Document 2: Japanese Patent Laid-Open No. 2009-069759

Summary of the invention Problems to be solved by the invention However, the thickness of a plurality of plate-shaped workpieces (for example, the thickness of the resin on the substrate) may be different from each other. At this time, when a plurality of plate-shaped workpieces are held by the holding table, since the distance between the grinding stone and the upper surface of the plate-shaped workpiece is different for each plate-shaped workpiece, it is difficult to place the plurality of plate-shaped workpieces The respective grinding amount becomes equal.

The purpose of the present invention is to make the grinding amount of each plate-shaped workpiece equal when performing deep-cut jog grinding by holding a plurality of plate-shaped workpieces with different thicknesses by a holding table. Means to solve the problem

The deep-cut slow-entry grinding method of this grinding method (this grinding method) is to rotate a grinding wheel with a grinding stone arranged in a ring shape, and to hold a plurality of plate-shaped workpieces on the holding table The lower surface of the grinding stone is positioned below the upper surface of the plate-shaped workpiece, and along the Y-axis direction parallel to the holding surface, the plate-shaped workpiece and the grinding The stone moves relatively, and the plate-shaped workpiece is ground by grinding the side and lower surface of the grinding stone. The aforementioned deep-cut and slow-entry grinding method includes the following steps: The holding step is to provide a gap in the Y-axis direction so that the grinding grindstone does not contact the adjacent plate-shaped workpiece during the grinding of one plate-shaped workpiece so that the plurality of plate-shaped workpieces are held in the holding step. surface; In the step of setting the height of the grinding stone, the height of the grinding stone is determined for each of the plurality of plate-shaped workpieces; and In the grinding step, the height of the grinding grindstone is changed after the grinding grindstone is not brought into contact with the previously ground plate-shaped workpiece until the grinding grindstone is brought into contact with the next plate-shaped workpiece The height is set in the height setting step of the grinding stone, and the plate-shaped workpiece is ground with the grinding stone.

In addition, the grinding method may further have the following steps: A height measuring step, measuring the height of the upper surface of the plurality of plate-shaped workpieces held on the holding surface in a manner of being separated in the Y-axis direction before the height setting step of the grinding stone; and The grinding amount setting step is to set a fixed grinding amount in the plate-shaped workpiece, In the grinding step, the height of the grinding stone is changed in accordance with the measured height of the upper surface of the plate-shaped workpiece, and the plate-shaped workpieces with different upper surface heights are ground by a fixed amount. Invention effect

In this grinding method, the height of the grinding stone is determined for each of a plurality of plate-shaped workpieces in the grinding stone height setting step, and the height of the grinding stone is set in the grinding step According to the height determined by each plate-shaped workpiece, the plate-shaped workpiece is ground. Thereby, when a plurality of plate-shaped workpieces are held by holding the holding surface of the table and deep-cut jog grinding is performed, even if the upper surface height (thickness) of each plate-shaped workpiece is different from each other, it is still possible Set the grinding amount of each plate-shaped workpiece to be fixed.

In addition, in this grinding method, before the grinding stone height setting step, the measuring step of measuring the height of the upper surface of each plate-shaped workpiece and the grinding of setting a fixed amount of grinding in the plate-shaped workpiece may be carried out. Volume setting steps. In addition, in the grinding step, the height of the grinding stone may be changed in accordance with the measured height of the upper surface of the plate-shaped workpiece. Thereby, it becomes easier to set the grinding amount of each plate-shaped workpiece whose upper surface heights are different from each other to be fixed.

The form used to implement the invention As shown in Fig. 1(a), the plate-shaped workpiece 1 to be ground in the deep-cut creep grinding method (this grinding method) of the present embodiment is formed in a substantially rectangular shape. And, as shown in Fig. 1(b), the plate-shaped workpiece 1 has a substrate made of resin such as PCB 2, element wafers 3 arranged on the upper and lower surfaces of the substrate 2, and electrodes 4 erected on each element wafer 3 , And the resin layer 5 that seals each element wafer 3 and the electrode 4. The electrode 4 is, for example, a Cu electrode. The resin forming the resin layer 5 is, for example, epoxy resin.

In this embodiment, although a plurality of plate-shaped workpieces 1 are processed, the thickness of each plate-shaped workpiece 1 is different from each other. The reason for the difference in thickness is that the thickness of the resin layer 5 in each plate-shaped workpiece 1 is typically different from each other.

Next, the structure of the grinding apparatus used in this grinding method is demonstrated. As shown in FIG. 2, the grinding device 11 of this embodiment includes a rectangular parallelepiped base 12, a pillar 13 extending upward, a calculation unit 70 for performing predetermined calculations, and controls for controlling each member of the grinding device 11. Component 71.

On the upper surface side of the base 12, an opening part 12a is provided, and the waterproof cover C is arrange|positioned so that the opening part 12a may be covered. In addition, on the side of the pillar 13 of the waterproof cover C, a holding assembly 15 including a holding table 18 is arranged. In addition, a Y-axis direction moving unit 40 that moves the holding unit 15 in the Y-axis direction is provided inside the base 12.

The holding assembly 15 includes a holding table 18 and a supporting member 16. The holding table 18 has a holding surface 19 for holding a plate-shaped workpiece 1 (refer to FIG. 1(a)(b)). The supporting member 16 is a supporting and holding Workbench 18. The holding surface 19 of the holding table 18 communicates with a suction source not shown. The supporting member 16 is provided with a holding table 18 on its upper surface, and is moved along the Y axis together with the holding table 18 by the Y-axis direction moving assembly 40.

In this embodiment, roughly speaking, the holding table 18 moves between the front plate-shaped workpiece placement position and the rear grinding area, and the aforementioned plate-shaped workpiece placement position is used to place the plate-shaped workpiece 1 Placed on the holding surface 19, the aforementioned grinding area is an area for grinding the plate-shaped workpiece 1. In addition, by moving the holding table 18 in the grinding area, the grinding stone 37 of the grinding assembly 26 grinds the plate-shaped workpiece 1 held on the holding table 18.

The Y-axis direction moving assembly 40 is provided with a pair of Y-axis guide rails 42 parallel to the Y-axis direction, a Y-axis moving table 45 sliding on the Y-axis guide rail 42, and a Y-axis ball screw 43 parallel to the Y-axis guide rail 42. And the Y-axis servo motor 44 connected to the Y-axis ball screw 43, and the holding table 41 which hold|maintains these.

The Y-axis moving table 45 is installed in a manner slidable on the Y-axis guide 42. A nut part (not shown) is fixed to the lower surface of the Y-axis moving table 45. A Y-axis ball screw 43 is screwed into this nut part. The Y-axis servo motor 44 is connected to one end of the Y-axis ball screw 43.

In the Y-axis direction moving assembly 40, the Y-axis ball screw 43 is rotated by the Y-axis servo motor 44, and the Y-axis moving table 45 is moved in the Y-axis direction along the Y-axis guide 42. The support member 16 holding the assembly 15 is placed on the Y-axis moving table 45. Therefore, as the Y-axis moving table 45 moves in the Y-axis direction, the holding assembly 15 including the holding table 18 is moved in the Y-axis direction.

The pillar 13 is erected at the rear of the base 12. A grinding unit 26 for grinding the plate-like workpiece 1 and a Z-axis direction moving unit 14 that moves the grinding unit 26 up and down in the Z-axis direction are provided on the front surface of the support 13.

The Z-axis direction moving assembly 14 is provided with a pair of Z-axis guide rails 21 parallel to the Z-axis direction, a Z-axis moving table 20 sliding on the Z-axis guide 21, and a Z-axis ball screw 22 parallel to the Z-axis guide 21, And the Z axis servo motor 24.

The Z-axis moving table 20 is installed in a manner slidable on the Z-axis guide rail 21. A nut part (not shown) is fixed to the rear surface (back surface) of the Z-axis moving table 20. The Z-axis ball screw 22 is screwed to the nut portion. The Z-axis servo motor 24 is connected to one end of the Z-axis ball screw 22.

In the Z-axis direction moving assembly 14, the Z-axis ball screw 22 is rotated by the Z-axis servo motor 24, and the Z-axis moving table 20 is moved in the Z-axis direction along the Z-axis guide 21.

The grinding unit 26 is installed on the front surface (front surface) of the Z-axis moving table 20. The grinding unit 26 includes a support structure 28 fixed to the Z-axis moving table 20 of the Z-axis direction moving unit 14, a spindle housing 30 fixed to the support structure 28, a spindle 32 held in the spindle housing 30, and A wheel seat 34 at the lower end of the main shaft 32 and a grinding wheel 36 supported on the wheel seat 34. The grinding assembly 26 supports the grinding wheel 36 to be rotatable.

The support structure 28 is a state in which other members of the grinding unit 26 are supported, and is attached to the Z-axis moving table 20 of the Z-axis direction moving unit 14. The spindle housing 30 is held by the support structure 28 so as to extend in the Z-axis direction. The main shaft 32 extends in the Z-axis direction and is rotatably supported by the main shaft housing 30.

A rotational drive source (not shown) such as a motor is connected to the upper end side of the main shaft 32. With this rotating drive source, the main shaft 32 rotates around the rotation axis extending in the Z-axis direction.

The wheel base 34 is formed in a disk shape and is fixed to the lower end (front end) of the main shaft 32. As shown in FIG. 3, the wheel base 34 has a spindle mounting surface 34a. The main shaft 32 is connected to the center of the wheel base 34 through the main shaft installation surface 34a. In addition, the wheel base 34 supports the grinding wheel 36 through the wheel mounting surface 34b which is the opposite surface of the spindle mounting surface 34a.

The grinding wheel 36 is formed to have approximately the same diameter as the wheel seat 34. As shown in FIG. 3, the grinding wheel 36 includes an annular wheel base (annular base) 38 formed of a metal material such as stainless steel. On the lower surface of the wheel base 38, a plurality of grinding grindstones 37 arranged annularly covering the entire circumference are fixed. The grinding grindstone 37 grinds the plate-shaped workpiece 1 by rotating with the spindle 32 in a state in which it is in contact with the plate-shaped workpiece 1 held on the holding surface 19 of the holding table 18.

In addition, in the present embodiment, the grinding assembly 26 grinds the plate-shaped workpiece 1 on the holding table 18 in a state inclined with respect to the holding table 18 in the Y-axis direction. In this regard, in the present embodiment, as shown in FIG. 3, the grinding unit 26 is inclined so that the +Y side becomes higher, and the part on the -Y side of the grinding stone 37 is ground in a plate shape. Workpiece 1.

In addition, as shown in FIG. 2, a height measuring part 51 is provided on the side of the opening 12 a in the base 12. The height measuring part 51 includes a support column 52 fixed to the base 12, a first extension 531 and a second extension 532 provided on the upper end of the support column 52, and a first height attached to the front end of the first extension 531 The measurement unit 54 and the second height measurement unit 55 attached to the tip of the second extension 532.

The first height measuring unit 54 and the second height measuring unit 55 are, for example, laser-type distance measuring devices, and are arranged on the upper part of the plate-shaped workpiece 1 held by the holding table 18 in the grinding area. The height of the upper surface of the plate-shaped workpiece 1 is measured by the contact method. In addition, it is also possible to use a contact type measuring device in which a measuring head is brought into contact with the upper surface of the plate-shaped workpiece 1 in the plate-shaped workpiece 1 to measure the height of the upper surface. Furthermore, the contact type measuring instrument is equipped with a drive source that moves the measuring head up and down, and moves the measuring head up and down for each plate-shaped workpiece 1 to repeat the contact and separation of the measuring head to measure the respective plate-shaped workpieces 1 The height of the upper surface.

Furthermore, the height of the upper surface of the plate-shaped workpiece 1 is, for example, from the holding surface 19 of the holding table 18 along the Z-axis direction of the plate-shaped workpiece 1 to the upper end surface (also referred to as FIG. 1(b)) of the upper resin layer 5 That is, the distance between the upper surface of the plate-shaped workpiece 1).

Next, each step of the grinding method will be described. In this grinding method, a grinding wheel 36 having a grinding stone 37 arranged in a ring shape is rotated, and a plurality of plate-shaped workpieces 1 are held on the holding surface 19 of the holding table 18, and the grinding The lower surface of the grinding stone 37 is positioned below the upper surface of these plate-like workpieces 1, and the plate-like workpiece 1 and the grinding stone 37 are relatively moved along the Y-axis direction parallel to the holding surface 19, and The plate-shaped workpiece 1 is ground by grinding the side surface and the lower surface of the grindstone 37.

(1) Keep steps In this step, the control unit 71 arranges the holding table 18 at the front (-Y side) plate-shaped workpiece placement position. In this state, as shown in FIG. 4, the user can place a plurality of plate-shaped workpieces 1 on the holding surface 19 of the holding table 18 so that the longitudinal direction is along the X-axis direction, and the Y-axis Separate from each other in the direction.

Furthermore, the interval along the Y-axis direction of adjacent plate-shaped workpieces 1 is set to the following length: during grinding of one plate-shaped workpiece 1, the grinding grindstone 37 is not allowed to contact the adjacent plate The length of the shaped workpiece 1.

For example, when the size of the plate-shaped workpiece 1 is 240 mm×75 mm, the outer diameter of the grinding stone 37 is 504 mm, the inner diameter of the grinding stone 37 is 486 mm, and the diameter of the holding surface 19 of the holding table 18 is 580 mm Next, the interval between adjacent plate-shaped workpieces 1 is set to about 35 mm.

After the plate-shaped workpiece 1 is placed, a suction source not shown is controlled by the control unit 71, and the suction force is transmitted to the holding surface 19, and the holding surface 19 sucks and holds a plurality of plate-shaped workpieces 1.

(2) Height measurement steps In this step, the control unit 71 moves the holding table 18 to the starting position of height measurement in the grinding area at the rear (+Y side). The height measurement start position is, for example, the position on the most -Y side in the grinding area.

And, as shown in FIG. 5, the control unit 71 adjusts the winding position of the extension portions 531 and 532 of the height measurement unit 51, so that the first height measurement unit 54 is arranged in the plate-shaped workpiece 1 located on the most +Y side. The second height measuring unit 55 is arranged at the upper part of the center part in the X direction of the plate-shaped workpiece 1 at the upper part of the end part on the −X direction side.

In addition, the control unit 71 controls the Y-axis direction moving unit 40 to move the holding table 18 in the +Y direction as indicated by the arrow B. Thereby, the first height measuring unit 54 moves relative to the holding table 18 along the one-point chain line a while outputting a measurement signal corresponding to the height of the plate-shaped workpiece 1 located below it to the calculating unit 70. In addition, the calculation unit 70 calculates the height of each plate-shaped workpiece 1 along the one-point chain line a based on the measurement signal, and transmits it to the control unit 71.

In this way, the control unit 71 obtains the height of the upper surface of the center portion in the X direction of all the plate-shaped workpieces 1 on the holding table 18. Here, the one-point chain line a is the scanning position of the upper surface height measurement in the first height measurement unit 54.

In addition, by the movement of the holding table 18, as shown in FIG. 5, the second height measuring unit 55 also moves relative to the holding table 18 along the one-point chain line b, and will correspond to the plate shape located below it. The measurement signal of the height of the workpiece 1 is output to the calculation component 70. In addition, the calculation unit 70 calculates the height of the one-point chain line b along each plate-shaped workpiece 1 according to the measurement signal, and transmits it to the control unit 71.

In this way, the control unit 71 obtains the height of the upper surface of the end portion on the −X direction side of all the plate-shaped workpieces 1 on the holding table 18. Here, the one-point chain line b is the scanning position of the upper surface height measurement in the second height measurement unit 55.

In addition, after this height measurement step is completed, the holding table 18 moving to the +Y side is arranged at the grinding start position in the grinding area. The grinding start position is, for example, the position on the most +Y side in the grinding area, and is among the plurality of plate-like workpieces 1 held on the holding table 18, and the grinding grindstone 37 does not touch the most -Y side plate The position of the shaped workpiece 1. In addition, in FIG. 5, for convenience of description, the illustration of the grinding stone 37 etc. arrange|positioned above the holding table 18 is abbreviate|omitted.

(3) Setting steps of grinding amount In this step, the control unit 71 sets the grinding amount of the plate-shaped workpiece 1 according to, for example, an instruction from the user. The grinding amount is the same (fixed) among the plurality of plate-shaped workpieces 1. The grinding amount is, for example, the amount of grinding the upper resin layer 5 and the electrode 4 to expose the electrode 4.

(4) Steps for setting the height of the grinding stone In this step, the control unit 71 is based on, for example, the height of the upper surface of the center portion in the X direction of each plate-shaped workpiece 1 measured in the height measurement step, and the grinding set in the grinding amount setting step. The height of the grinding stone 37 when grinding the plate-shaped workpiece 1 is determined for each plate-shaped workpiece 1.

As described above, the grinding amount is the same among the plurality of plate-shaped workpieces 1. Therefore, the height of the grinding grindstone 37 is set to be higher on the one hand when grinding the plate-shaped workpiece 1 with a higher upper surface height, and on the other hand, when grinding the plate-shaped workpiece 1 with a lower upper surface height. In this case, set it lower.

(5) Grinding steps In this step, the control unit 71 grinds the plate-shaped workpiece 1 by grinding the grindstone 37. At this time, the control unit 71 sets the height of the grinding stone 37 when grinding each plate-shaped workpiece 1 to the height determined for each plate-shaped workpiece 1 in the grinding stone height setting step.

That is, first, the control unit 71 rotates the grinding wheel 36 through the spindle 32 shown in FIG. 1, and feeds the grinding unit 26 including the grinding wheel 36 downward by the Z-axis direction moving unit 14.

Here, as described above, the holding table 18 is arranged at the grinding start position on the most +Y side in the grinding area. Then, while keeping the table 18 at the grinding start position, the grinding stone 37 of the grinding wheel 36 is arranged at a position where the plate-shaped workpiece 1 located on the most -Y side can be ground from the -Y side.

Then, the control unit 71 controls the Z-axis direction moving unit 14 and sets the height of the grinding stone 37 to correspond to the height of the plate-shaped workpiece 1 located on the most -Y side in the grinding stone height setting step. . After that, by controlling the Y-axis direction moving assembly 40 and moving the holding table 18 toward the -Y side, as shown in FIGS. 6 to 8, the plate-shaped workpiece 1 located on the most -Y side is ground.

Also, in the grinding step, as shown in FIG. 6, the control unit 71 also arranges the first height measuring unit 54 on the upper part of the center part in the X direction in the plate-shaped workpiece 1 to be ground, and sets the second height The measurement unit 55 is arranged on the upper portion of the end of the plate-shaped workpiece 1 on the −X direction side. In this way, the control unit 71 measures the height of the plate-shaped workpiece 1 on the holding table 18 along the one-point chain lines a and b in the opposite direction to the height measurement step. In addition, the control unit 71 fine-tunes the height of the grinding stone 37 by feedback control using the result of the height measurement during grinding.

In addition, as shown in FIGS. 6 to 8, in the plate-shaped workpiece 1, the center part in the X-axis direction is ground earlier than the end part. Therefore, the control unit 71 can implement the feedback of the height of the grinding stone 37 relatively early by using the measurement result from the second height measuring unit 55 that measures the height of the end of the plate-shaped workpiece 1 in the X-axis direction. control.

In addition, as shown in FIGS. 9 to 11, since the control unit 71 finishes the grinding of a plate-shaped workpiece 1 (1a), the grinding grindstone 37 does not contact the plate-shaped workpiece 1. (1a) After that, until the grinding stone 37 is brought into contact with the next plate-shaped workpiece 1(1b), the Z-axis direction movement assembly 14 is controlled to change the height of the grinding stone 37 to correspond to the next plate-shaped workpiece 1(1b) The height set in the grinding stone height setting step.

In this way, in the grinding step, the height of the grinding stone 37 is changed in accordance with the height of the upper surface of each plate-shaped workpiece 1 measured in the height measuring step, so that the height of the grinding stone 37 is changed for each plate-shaped workpiece with different upper surface heights. Work piece 1 is ground at a fixed amount.

As described above, in this grinding method, the height of the grinding stone 37 is determined for each of the plurality of plate-shaped workpieces 1 in the grinding stone height setting step, and the grinding stone 37 is determined in the grinding step. The height of the stone 37 is set to a height determined for each plate-shaped workpiece 1, and the plate-shaped workpiece 1 is ground. Thereby, when a plurality of plate-shaped workpieces 1 are held by the holding surface 19 of the table 18 and deep-cut jog grinding is performed, even when the upper surface height (thickness) of each plate-shaped workpiece 1 is different from each other Next, the grinding amount of each plate-shaped workpiece 1 can still be set to be fixed.

In addition, this grinding method implements the measuring step of measuring the height of the upper surface of each plate-shaped workpiece 1 before the step of setting the height of the grinding grindstone, and the grinding amount setting for setting a fixed amount of grinding in the plate-shaped workpiece 1. step. In addition, in the grinding step, the height of the grinding stone 37 is set to a height determined in consideration of the measured height of the upper surface of the plate-shaped workpiece 1. That is, in the grinding step, the height of the grinding stone 37 can be changed in accordance with the measured height of the upper surface of the plate-shaped workpiece 1. Thereby, it becomes easier to set the grinding amount of each plate-shaped workpiece 1 whose upper surface heights are different from each other to be constant.

In addition, in this embodiment, in the grinding stone height setting step, the height of the grinding stone 37 is determined so that the grinding amount of each plate-shaped workpiece 1 becomes constant. It may be substituted for this, and for example, in the case where different types of plate-shaped workpieces 1 are held on the holding surface 19 of the holding table 18, the height setting step of the grinding grindstone is performed according to the size of each plate-shaped workpiece 1. The height of the grinding stone 37 is determined by changing the thickness after cutting, that is, the thickness of the finished product. As a result, the plate-shaped workpiece 1 can be subjected to deep-cut jog grinding with an appropriate thickness of the finished product according to its kind.

In addition, in this grinding method, the grinding unit 26 grinds the plate-shaped workpiece 1 on the holding table 18 in a state inclined in the Y-axis direction with respect to the holding table 18. In this regard, in the form shown in FIG. 3, the grinding unit 26 is inclined so that the +Y side becomes higher, and the part of the grinding stone 37 located on the -Y side grinds the plate-shaped workpiece 1. However, it is not limited to this, and the grinding unit 26 may be inclined so that the -Y side becomes higher, and the part of the grinding stone 37 on the +Y side may be configured to grind the plate-shaped workpiece 1. At this time, at the time of grinding, the holding table 18 moves from the -Y side to the +Y side.

In the height measurement step of the present embodiment, the control unit 71 obtains the upper surface height of the end portion on the −X direction side of the plate-shaped workpiece 1 and the upper surface height of the center portion of the plate-shaped workpiece 1 in the X direction. Alternatively, the control component 71 only obtains the height of any one of them.

In the grinding stone height setting step of the present embodiment, the control unit 71 is based on the height of the upper surface of the center portion in the X direction of each plate-shaped workpiece 1 measured in the height measurement step and the The grinding amount set in the amount setting step determines the height of the grinding stone 37 when the plate-shaped workpiece 1 is ground. Alternatively, the control unit 71 uses both the upper surface height of the end on the -X direction side of each plate-shaped workpiece 1, or both the upper surface height of the end and the upper surface height of the center portion, for the grinding The grinding amount set in the cutting amount setting step determines the height of the grinding stone 37 together.

1, 1a, 1b: plate-shaped workpiece 2: substrate 3: Component chip 4: electrode 5: Resin layer 11: Grinding device 12: Abutment 12a: opening 13: Pillar 14: Moving component in Z axis direction 15: Keep components 16: support member 18: Keep the workbench 19: Keep the face 20: Z-axis moving table 21: Z axis guide 22: Z axis ball screw 24: Z axis servo motor 26: Grinding components 28: Support structure 30: Spindle housing 32: Spindle 34: wheel seat 34a: Spindle installation surface 34b: Wheel mounting surface 36: Grinding wheel 37: Grinding grindstone 38: Wheel abutment 40: Moving component in Y axis direction 41: hold the stage 42: Y axis guide 43: Y-axis ball screw 44: Y axis servo motor 45: Y-axis moving table 51: Height measurement department 52: Support column 531: first extension 532: second extension 54: The first height measurement unit 55: The second height measurement unit 70: Computing components 71: control components a, b: a little chain line B: Arrow C: Waterproof cover +X, -X, +Y, -Y, +Z, -Z, Z: direction

Fig. 1(a) is a plan view of a plate-shaped workpiece ground in the grinding method of this embodiment (this grinding method), and Fig. 1(b) is a cross-sectional view taken from the line A-A in Fig. 1(a) Figure. Fig. 2 is a perspective view showing the configuration of a grinding device used in the grinding method. Fig. 3 is a cross-sectional view showing the configuration of the grinding wheel. Fig. 4 is a top view showing the holding step in the present grinding method. Fig. 5 is a top view showing the height measurement step in the grinding method. Fig. 6 is a top view showing the holding table, the grinding grindstone, the first height measuring unit, and the second height measuring unit just after the grinding is started in the grinding step of the grinding method. Fig. 7 is a cross-sectional view showing the holding table, the grinding stone, and the second height measuring unit shown in Fig. 6. Fig. 8 is a cross-sectional view showing the holding table, the grinding stone, and the first height measuring unit shown in Fig. 6. 9 is a top view showing the holding table, the grinding grindstone, the first height measuring unit, and the second height measuring unit immediately after grinding a plate-shaped workpiece in the grinding step of the grinding method. Fig. 10 is a cross-sectional view showing the holding table, the grinding stone, and the second height measuring unit shown in Fig. 9. Fig. 11 is a cross-sectional view showing the holding table, the grinding stone, and the first height measuring unit shown in Fig. 9.

1, 1a, 1b: plate-shaped workpiece

14: Moving component in Z axis direction

18: Keep the workbench

19: Keep the face

34: wheel seat

37: Grinding grindstone

38: Wheel abutment

40: Moving component in Y axis direction

55: The second height measurement unit

b: a little chain line

B: Arrow

Claims (2)

A deep-cut slow-advance grinding method is to rotate a grinding wheel with a grinding grindstone arranged in a ring shape, and hold a plurality of plate-shaped workpieces on the holding surface of the holding table, and the grinding grindstone The lower surface of the plate-shaped workpiece is positioned lower than the upper surface of the plate-shaped workpiece, and along the Y-axis direction parallel to the holding surface, the plate-shaped workpiece and the grinding stone are moved relatively, and by the grinding The side and lower surface of the grindstone are used to grind the plate-shaped workpiece. The aforementioned deep-cut and slow-entry grinding method includes the following steps: The holding step is to provide a gap in the Y-axis direction so that the grinding grindstone does not contact the adjacent plate-shaped workpiece during the grinding of one plate-shaped workpiece so that the plurality of plate-shaped workpieces are held in the holding step. surface; In the step of setting the height of the grinding stone, the height of the grinding stone is determined for each of the plurality of plate-shaped workpieces; and In the grinding step, the height of the grinding grindstone is changed after the grinding grindstone is not brought into contact with the previously ground plate-shaped workpiece until the grinding grindstone is brought into contact with the next plate-shaped workpiece The height is set in the height setting step of the grinding stone, and the plate-shaped workpiece is ground with the grinding stone. For example, the deep-cut jog-advance grinding method of claim 1, which further has the following steps: A height measuring step, measuring the height of the upper surface of the plurality of plate-shaped workpieces held on the holding surface in a manner of being separated in the Y-axis direction before the height setting step of the grinding stone; and The grinding amount setting step is to set a fixed grinding amount in the plate-shaped workpiece, In the grinding step, the height of the grinding stone is changed in accordance with the measured height of the upper surface of the plate-shaped workpiece, and the plate-shaped workpieces with different upper surface heights are ground by a fixed amount. .

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