TW202111275A - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes a heat conductive plate and a heat sink. The heat conductive plate has a first surface and a second surface, which is opposite to the first surface. The heat sink is disposed on the first surface of the conductive plate. The heat sink has a heat dissipation surface and at least one groove. The heat dissipation surface is positioned at one side of the heat sink far from the heat conductive plate. The groove is disposed on the heat dissipation surface. One side of the groove is arc-shaped, and the whole of the groove is in the form of an arc-shaped sheet. The groove sequentially has a first wave peak, a wave valley and a second wave peak. In addition, an extension line perpendicular to each tangent of the groove being not in contact to the first wave peak and the second wave peak.

Description

Heat sink

The present invention relates to a heat dissipation device, in particular to a heat dissipation device using a heat radiation mechanism.

With the advancement of electronic technology, many electronic components, such as central processing unit (CPU) or graphics processing unit (GPU) due to fast processing speed or high power consumption, will Accompanied by the generation of a large amount of heat energy. In order to prevent the accumulation of heat from damaging the electronic components, in the traditional process, a heat sink with a heat sink (or heat sink) is used to assist in heat dissipation.

This type of heat dissipation device is the most typical passive heat dissipation element because it can perform heat dissipation without additional driving energy. In addition, this type of heat dissipation device is classified as a "passive heat dissipation element" in the field of electronic engineering design. It is attached to the heating surface with a metal with good thermal conductivity, light weight, and easy processing, and uses a composite heat exchange mode. Heat dissipation.

The traditional heat dissipation fin design is designed for heat conduction or heat convection. As shown in FIG. 1, the conventional heat dissipation device 10 has a heat conducting plate 11, a plurality of heat dissipation fins 12, and air flow channels 13 between the heat dissipation fins 12. The heat conducting plate 11 is used to contact the heating surface to transfer heat energy to the entire heat dissipation device 10. The heat dissipation fins 12 are parallel to each other and stand on the heat conducting plate 11. The design of the heat dissipation fins 12 can increase the surface area of the heat dissipation device 10 and thereby achieve a better heat dissipation effect.

Another method of heat transfer is heat radiation. The so-called thermal radiation heat dissipation solution uses the material itself to absorb heat energy and convert the heat energy into electromagnetic radiation (such as light energy) to dissipate it outwards, thereby achieving the effect of heat dissipation. When heat radiation is used to transfer heat energy, no medium is needed, and any object temperature will emit heat radiation as long as the temperature is higher than absolute zero. Graphene is currently on the market (graphene) is used as the main material of the thermal radiation heat dissipation solution, and the method is to spray graphene on the original heat dissipation device.

However, since the heat dissipation fins 12 are arranged in parallel, the radiation of light will be blocked or absorbed by the heat dissipation fins 12, which reduces the original heat dissipation effect. Therefore, how to provide a heat dissipation device based on a heat radiation mechanism to improve heat dissipation efficiency is indeed one of the current important issues.

In view of this, the object of the present invention is to provide a heat dissipation device based on a heat radiation heat dissipation mechanism to exert the heat radiation efficiency and increase the heat dissipation efficiency.

According to the above objective, the present invention provides a heat dissipation device, which includes a heat conducting plate and a heat sink. The heat-conducting plate has a ground surface and a second surface arranged opposite to each other. The heat sink is arranged on the first surface of the heat conducting plate and has a heat dissipation surface and at least one groove. The heat dissipation surface is located on the side away from the heat conducting plate. The groove is located on the heat dissipation surface, and one side of the groove is arc-shaped, and the whole of the groove is arc-shaped sheet, and the groove has a first wave crest, a wave trough and a second wave crest in sequence. An extension line perpendicular to the tangent line of the surface of the groove does not contact the first wave crest and the second wave crest.

In an embodiment of the present invention, the arc-shaped groove is a part of a circle, and the center of the circle is located between the first wave crest and the second wave crest.

In an embodiment of the present invention, the center of the circle is located on a vertical line of the midpoint between the first wave crest and the second wave crest.

In an embodiment of the present invention, when the heat sink has a plurality of grooves, there is a connecting surface between the grooves. The connecting surface is a flat surface, a curved surface, a wavy surface or a pointed surface.

In an embodiment of the present invention, when the heat sink has a plurality of grooves, the grooves are arranged in parallel along the long axis direction.

In one embodiment of the present invention, the heat sink further has an extended heat dissipation element, which is disposed on the heat dissipation surface or the connecting surface, and the extension line perpendicular to the tangent to the surface of the groove does not contact the extended heat dissipation element.

In an embodiment of the present invention, the extended heat dissipation element has a first surface and an opposite second surface. The first surface is connected to the connecting surface, and The surface area of the second surface is greater than the surface area of the first surface.

In an embodiment of the present invention, the material of the heat-conducting plate or the heat sink includes a heat-to-radiation material.

In an embodiment of the present invention, the heat dissipating device further includes a heat transfer radiation layer which covers at least part of the outer surface of the heat conducting plate or the heat sink.

Based on the above, a heat sink of the present invention utilizes a heat sink having an arc-shaped sheet-shaped groove, and the extension line perpendicular to the tangent to the surface of the groove does not contact the first wave crest and the second wave crest. The heat dissipation device based on the form of heat transfer radiation can directly emit the main radiation generated in the groove from between the first wave crest and the second wave crest, which can greatly increase the heat dissipation effect.

10‧‧‧Heat sink

11‧‧‧Thermal board

12‧‧‧Heat sink

13‧‧‧Air flow channel

20, 20a, 30‧‧‧heat sink

201, 202‧‧‧Opening

21、31‧‧‧Thermal board

211‧‧‧The first side

212‧‧‧Second Side

22‧‧‧Heat sink

221‧‧‧Radiating surface

222a, 222b, 222c, 222d‧‧‧ groove

322a, 322b, 322c, 322d‧‧‧ groove

223a, 223b, 223c‧‧‧connection surface

223a’, 223b’, 223c’‧‧‧Connecting surface

223a”, 223b”, 223c”‧‧‧to the surface

231a, 231b, 231c, 231d, 231e‧‧‧Extended cooling element

331a, 331b, 331c, 331d, 331e‧‧‧Extended cooling element

232‧‧‧First surface

233‧‧‧Second Surface

234‧‧‧Extended surface

C01, C02, C11, C12‧‧‧Circle center

Line segments L11, L12, L13, L14‧‧‧

P01, P03‧‧‧First wave

P02, P04‧‧‧Second wave peak

R11, R12‧‧‧Radius

L01‧‧‧Connect

L02‧‧‧Vertical line

V01‧‧‧wave valley

S01‧‧‧Setting area

Y‧‧‧ direction

Figure 1 shows a schematic diagram of a conventional heat dissipation device.

FIG. 2 is a schematic diagram of a heat dissipation device according to the first preferred embodiment of the present invention.

FIG. 3 is a schematic side view of the heat dissipation device with openings according to the first preferred embodiment of the present invention.

FIG. 4A and FIG. 4B are schematic diagrams showing changes of the connection surface of the heat sink according to the first preferred embodiment of the present invention.

FIG. 5 is a schematic diagram of a heat dissipation device according to the second preferred embodiment of the present invention.

FIG. 6 is a partial enlarged schematic diagram of the heat dissipation device according to the second preferred embodiment of the present invention.

FIG. 7 is a schematic side view of the heat dissipation device according to the second preferred embodiment of the present invention.

FIG. 8 is a schematic diagram of a heat dissipation device according to the third preferred embodiment of the present invention.

The following will explain the content of the present invention through examples. The examples of the present invention are not intended to limit the application of the present invention to any specific environment as described in the examples. Application or special method can be implemented. Therefore, the description of the embodiments is only for the purpose of explaining the present invention, not for limiting the present invention. It should be noted that, in the following embodiments and drawings, elements that are not directly related to the present invention have been omitted and are not shown, and the dimensional relationship between the elements in the drawings is only for ease of understanding, and is not intended to limit the actual ratio. In addition, in the following embodiments, the same elements will be described with the same reference numerals.

Please refer to FIG. 2, the heat dissipation device 20 of the first preferred embodiment of the present invention includes a heat conducting plate 21 and a heat sink 22. Wherein, the heat conducting plate 21 and the heat sink 22 may be separate components through a combination, or may be an integrally formed element, which is not limited herein. In this embodiment, the heat conducting plate 21 and the heat sink 22 are integrally formed as an example.

The heat dissipating device 20 of the present invention is designed based on the heat radiation mechanism. Therefore, the material of the heat conducting plate 21 and the heat sink 22 can be materials with heat transfer radiation, such as porous alumina. In addition, the outer surfaces of the heat conducting plate 21 and the heat sink 22 can also be coated or covered with a heat transfer radiation layer, the material of which is, for example, liquid ceramic or graphene. Among them, the heat transfer radiation layer can be coated or coated on the outer surface of the entire heat conducting plate 21 and the heat sink 22, or can be selectively coated or coated on a specific part of the outer surface (for example, coating on the outer surface of the text will be The groove surface of the narrated part).

Next, please continue to refer to FIG. 2, the heat conducting plate 21 has a first surface 211 and a second surface 212 oppositely disposed, wherein the heat sink 22 is disposed on the first surface 211 of the heat conducting plate 21, and the heat conducting plate 21 The second surface 212 can be in contact with a heat source (not shown), such as a processor or a power chip.

The heat sink 22 has a heat dissipation surface 221, four grooves 222a, 222b, 222c, 222d, and three connection surfaces 223a, 223b, 223c. The heat dissipation surface 221 is located on a side away from the heat conducting plate 21. The four grooves 222a, 222b, 222c, and 222d on the heat dissipation surface 221 are arranged in parallel along the long axis direction. Viewed from one side of the heat sink 20 in the direction Y, one side of the grooves 222a, 222b, 222c, 222d is arc-shaped, and the grooves 222a, 222b, 222c, 222d are arc-shaped. When viewed as a whole, they are in the shape of a curved sheet. Each groove has a first wave crest, a wave trough, and a second wave crest in sequence. Taking the groove 222b as an example, it has a first wave crest P01, a wave trough V01, and a second wave crest P02, and is similar to one of the surfaces of the groove 222b An extension line perpendicular to the tangent line does not touch the first wave crest P01 and the second wave crest P02. In other words, after the heat is transferred to the radiation, the main heat radiation emitted from the surface of the groove can be directly shot into the air without being blocked by the heat sink or absorbed again.

The connecting surface 223a is arranged between the groove 222a and the groove 222b, the connecting surface 223b is arranged between the groove 222b and the groove 222c, and the connecting surface 223c is arranged between the groove 222c and the groove 222d. In this embodiment, the connecting surfaces 223a, 223b, and 223c are flat surfaces. In other embodiments, the connecting surfaces 223a', 223b', and 223c' may also be pointed surfaces (as shown in Figure 4A). , Or the connecting surfaces 223a", 223b", and 223c" can be curved surfaces (as shown in Figure 4B), or can be wavy surfaces (not shown in the figure), which is not limited here. The choice of connecting surfaces You can choose different designs for different purposes such as beautiful appearance or increasing heat dissipation efficiency.

Please refer to FIG. 3 again, in order for the heat dissipating device 20 to be combined with the heat generating surface, it can be provided with openings 201 and 202 penetrating through the heat conducting plate 21. The openings 201 and 202 can be screw holes and are screwed to the heating surface by screws. Of course, in other embodiments, the heat dissipation device can also be combined with the heat-generating surface by heat-dissipating paste or thermally conductive glue, which is not limited here.

Next, please refer to FIG. 5 again to illustrate the heat dissipation device 20a of the second preferred embodiment of the present invention. The difference from the heat dissipation device 20 of the first preferred embodiment is that the heat dissipation device 20a further includes five extended heat dissipation elements 231a, 231b, 231c, 231d, and 231e. In this embodiment, the extended heat dissipation elements 231a, 231e are respectively disposed on the heat dissipation surface 221 of the heat sink 22, and the extended heat dissipation elements 231b, 231c, 231d are respectively disposed on the connection surfaces 223a, 223b, 223c of the heat sink 22 on.

Please match the descriptions shown in Figs. 5 and 6. The following is an example of the groove 222b and the extended heat dissipation elements 231b and 231c. The arc-shaped groove 222b is a part of a circle, and the center C01 of the arc is located on a vertical line L02 of the line L01 between the first wave crest P01 and the second wave crest P02. With this structure, an extension line perpendicular to any line of the surface of the groove 222b will pass through the center C01 without contacting the heat sink.

In addition, the extended heat dissipating element 231b has a first surface 232 and an The first surface 232 is opposite to the second surface 233. The first surface 232 is connected to the connecting surface 223a and extends upward. Specifically, the extended heat dissipation element 231b also has an extended surface 234, which extends from the first wave crest P01 approximately toward the center C01 and is connected to the second surface 233. According to this structure, the surface area of the second surface 233 of the extended heat dissipation element 231b is larger than the surface area of the first surface 232. In other words, the extended heat dissipation element 231b can increase the overall surface area to increase the heat dissipation efficiency.

Please refer to Figure 7 again, the following is a brief description of the setting range of the extended heat dissipation element. As shown in FIG. 7, the area S01 where one of the extended heat dissipation elements 231c is provided can be composed of four line segments. The line segment L11 is the line connecting the first wave peak P01 of the groove 222b and the circle center C01, the line segment L12 is the line connecting the second wave peak P02 of the groove 222b and the circle center C01, and the line segment L13 is the first wave peak of the groove 222c The connection line between P03 and a circle center C02, and the line segment L14 is the connection line between a second wave peak P04 of the groove 222c and the circle center C02. In the range of the setting area S01, the extension line perpendicular to any tangent line of the surface of the groove does not contact the extension heat dissipation element. In this way, the main heat radiation generated by the surface of the groove can be directed into the air without being blocked or absorbed by the extended heat dissipation element. Therefore, as long as the extended heat dissipation element is located in the setting area S01, its appearance is not limited.

Finally, please refer to FIG. 8 again to illustrate a heat dissipation device 30 according to the third preferred embodiment of the present invention. FIG. 7 is a side view of the heat sink 30. The heat sink 30 has a heat conducting plate 31, a heat sink 32 having a plurality of grooves 322a-322d, and extended heat-dissipating elements 331a-331e. The difference from the aforementioned second preferred embodiment is that the radius of each arc-shaped groove corresponding to the circle is different. For example, the radius R11 of the groove 322a from its corresponding center C11 is smaller than the radius R12 of the groove 322b from its corresponding center C12. In this structural aspect, the extension line perpendicular to any line of the surface of each groove does not contact the heat sink or the extended heat dissipation element. Therefore, the main heat radiation generated by the surface of the groove can be directly directed to the air. , Without being blocked or absorbed by the extended heat-dissipating element.

In summary, a heat sink of the present invention utilizes a heat sink having an arc-shaped sheet-shaped groove, and the extension line perpendicular to the tangent to the surface of the groove does not contact the first wave crest and the second wave crest. Heat dissipation device based on the form of heat transfer radiation The main radiation generated in the groove can be directly emitted between the first wave crest and the second wave crest, which can greatly increase the heat dissipation effect. Since the electromagnetic wave leaving the arc surface in the form of radiation (such as infrared or far infrared, etc.), its main radiation direction is perpendicular to the tangent line at any point, so that the main heat radiation generated by the arc surface can be caused by the adjacent The radiating fins are directly emitted from each other without being blocked or absorbed by the radiating fins, so the heat dissipation effect can be greatly increased. In addition, if the center of the circle corresponding to the arc-shaped groove is set on the vertical line of the midpoint of the connection between the first wave crest and the second wave crest, and the appropriate design of the extended heat dissipation element is used, the heat dissipation device can have the largest heat dissipation surface area. , And has a relatively suitable appearance. Furthermore, the heat dissipation device provided by the present invention is not only applied to the field of heat dissipation, but also to other thermal-related application fields such as waste heat recovery, thermal energy conduction applications or heaters.

The present invention meets the requirements of an invention patent, and Yan filed a patent application according to law. However, the above are only the preferred embodiments of the present invention, and the scope of the patent application in this case cannot be limited by this. For those who are familiar with the technique of this case, the equivalent modifications or changes made in accordance with the spirit of the invention of this case should be included in the scope of the following patent applications.

20‧‧‧Heat sink

21‧‧‧Thermal board

211‧‧‧The first side

212‧‧‧Second Side

22‧‧‧Heat sink

221‧‧‧Radiating surface

222a, 222b, 222c, 222d‧‧‧ groove

223a, 223b, 223c‧‧‧connection surface

P01‧‧‧The first wave

P02‧‧‧Second wave

V01‧‧‧wave valley

Y‧‧‧ direction

Claims (11)

A heat dissipating device includes: a heat conducting plate having a first surface and a second face disposed opposite to each other; and a heat sink disposed on the first surface and having: a heat dissipating surface located far away from the heat conducting plate Side; at least one groove, located on the heat dissipation surface, one side of the groove is arc-shaped, and the whole of the groove is arc-shaped sheet, and has a first wave crest, a wave valley and a first Two wave crests, wherein an extension line perpendicular to the tangent line of the surface of the groove does not contact the first wave crest and the second wave crest. In the heat dissipation device described in claim 1, wherein the arc-shaped groove is a part of a circle, and the center of the circle is located between the first wave crest and the second wave crest. As for the heat dissipation device described in claim 2, wherein the center of the circle is located on a vertical line of the midpoint between the first wave crest and the second wave crest. As for the heat dissipation device described in item 1 of the scope of patent application, when the heat sink has a plurality of grooves, there is a connecting surface between the grooves. As for the heat dissipating device described in item 4 of the scope of patent application, each of the grooves is arranged in parallel along the long axis direction. According to the heat dissipation device described in item 4 of the scope of patent application, the connecting surface is a flat surface, a curved surface, a wavy surface, or a pointed surface. The heat dissipation device according to claim 4, wherein the heat dissipation fin further includes: an extended heat dissipation element disposed on the connection surface of the heat dissipation fin and the extension line perpendicular to the tangent line of the surface of the groove Do not touch the extended heat dissipation element. The heat dissipation device according to claim 7, wherein the extended heat dissipation element has a first surface and an opposite second surface, the first surface is connected to the connecting surface, and the surface area of the second surface is larger than The surface area of the first surface. According to the heat dissipation device described in the first item of the scope of patent application, the material of the heat conducting plate or the heat sink includes a material that converts heat to radiation. The heat dissipating device described in item 1 of the scope of patent application further includes a heat-to-radiation The layer covers at least part of the outer surface of the heat conducting plate or the heat sink. In the heat dissipation device described in item 1 of the scope of patent application, the heat conducting plate and the heat sink are integrally formed.

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