TW202110950A - 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及聚醯亞胺或聚醯亞胺前驅物 - Google Patents

硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及聚醯亞胺或聚醯亞胺前驅物 Download PDF

Info

Publication number
TW202110950A
TW202110950A TW109120195A TW109120195A TW202110950A TW 202110950 A TW202110950 A TW 202110950A TW 109120195 A TW109120195 A TW 109120195A TW 109120195 A TW109120195 A TW 109120195A TW 202110950 A TW202110950 A TW 202110950A
Authority
TW
Taiwan
Prior art keywords
group
formula
preferable
resin composition
curable resin
Prior art date
Application number
TW109120195A
Other languages
English (en)
Chinese (zh)
Inventor
野崎敦靖
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202110950A publication Critical patent/TW202110950A/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/065—Polyamides; Polyesteramides; Polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/32—Compounds containing nitrogen bound to oxygen
    • C08K5/33—Oximes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW109120195A 2019-06-17 2020-06-16 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及聚醯亞胺或聚醯亞胺前驅物 TW202110950A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-111873 2019-06-17
JP2019111873 2019-06-17

Publications (1)

Publication Number Publication Date
TW202110950A true TW202110950A (zh) 2021-03-16

Family

ID=74040036

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109120195A TW202110950A (zh) 2019-06-17 2020-06-16 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及聚醯亞胺或聚醯亞胺前驅物

Country Status (5)

Country Link
JP (1) JP7289353B2 (fr)
KR (1) KR20220008885A (fr)
CN (1) CN114008527A (fr)
TW (1) TW202110950A (fr)
WO (1) WO2020255859A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112979949B (zh) * 2021-03-03 2023-03-10 广东工业大学 一种透明光敏聚酰亚胺树脂、聚酰亚胺薄膜及其制备方法
JP7405309B2 (ja) * 2021-06-25 2023-12-26 住友ベークライト株式会社 ネガ型感光性ポリマー、ポリマー溶液、ネガ型感光性樹脂組成物、硬化膜および半導体装置
CN118019780A (zh) * 2021-09-30 2024-05-10 富士胶片株式会社 聚酰亚胺、聚酰亚胺前驱体、组合物及聚酰亚胺的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102574985B (zh) * 2009-09-30 2015-02-25 日立化成株式会社 树脂组合物和使用该组合物的预浸料、带有树脂的金属箔、粘接膜以及覆金属箔叠层板
TWI704418B (zh) * 2015-06-30 2020-09-11 日商富士軟片股份有限公司 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法及半導體元件
KR20200023403A (ko) 2017-06-24 2020-03-04 디자이너 몰러큘스, 인코퍼레이티드 경화성 폴리이미드

Also Published As

Publication number Publication date
CN114008527A (zh) 2022-02-01
KR20220008885A (ko) 2022-01-21
WO2020255859A1 (fr) 2020-12-24
JP7289353B2 (ja) 2023-06-09
JPWO2020255859A1 (fr) 2020-12-24

Similar Documents

Publication Publication Date Title
TWI758415B (zh) 感光性樹脂組成物、含雜環聚合物前體、硬化膜、積層體、硬化膜的製造方法及半導體裝置
TWI742285B (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體裝置
TWI728137B (zh) 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體裝置、積層體的製造方法、半導體裝置的製造方法及聚醯亞胺前驅物
KR102626093B1 (ko) 경화성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 및, 반도체 디바이스
TWI732893B (zh) 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體元件、積層體的製造方法、半導體元件的製造方法及聚醯亞胺前驅物
TW202110950A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及聚醯亞胺或聚醯亞胺前驅物
TWI802640B (zh) 感光性樹脂組成物、樹脂、硬化膜、積層體、硬化膜之製造方法、半導體元件
TW202104367A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件
TW202024788A (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體裝置
TW202024187A (zh) 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
TW202104368A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件
TW202045590A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件
TW202024232A (zh) 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
TW202010735A (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
JP7265627B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリイミド、ポリベンゾオキサゾール、ポリイミド前駆体、又は、ポリベンゾオキサゾール前駆体
TW202116876A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件、樹脂及樹脂的製造方法
TW202204476A (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜之製造方法、及半導體器件
TWI819121B (zh) 硬化膜的製造方法、硬化膜、積層體的製造方法及半導體元件的製造方法
TW202112907A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件、樹脂及樹脂的製造方法
TW202130701A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及樹脂
TW202045588A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及聚合物前驅物
TW202104511A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及熱鹼產生劑
TW202110958A (zh) 硬化性樹脂組成物、硬化性樹脂組成物的製造方法、硬化膜、積層體、硬化膜的製造方法及半導體器件
JP7334248B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
TW202028304A (zh) 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件