TW202104482A - 黏著片及積層體 - Google Patents

黏著片及積層體 Download PDF

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Publication number
TW202104482A
TW202104482A TW109112421A TW109112421A TW202104482A TW 202104482 A TW202104482 A TW 202104482A TW 109112421 A TW109112421 A TW 109112421A TW 109112421 A TW109112421 A TW 109112421A TW 202104482 A TW202104482 A TW 202104482A
Authority
TW
Taiwan
Prior art keywords
adhesive
adhesive layer
less
adhesive sheet
active energy
Prior art date
Application number
TW109112421A
Other languages
English (en)
Chinese (zh)
Inventor
小鯖翔
小澤祐樹
荒井隆行
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202104482A publication Critical patent/TW202104482A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/24—Homopolymers or copolymers of amides or imides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

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  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)
TW109112421A 2019-06-10 2020-04-14 黏著片及積層體 TW202104482A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019107811A JP7378230B2 (ja) 2019-06-10 2019-06-10 粘着シートおよび積層体
JP2019-107811 2019-06-10

Publications (1)

Publication Number Publication Date
TW202104482A true TW202104482A (zh) 2021-02-01

Family

ID=73657061

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109112421A TW202104482A (zh) 2019-06-10 2020-04-14 黏著片及積層體

Country Status (4)

Country Link
JP (1) JP7378230B2 (ja)
KR (1) KR20200141382A (ja)
CN (1) CN112063328A (ja)
TW (1) TW202104482A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022224643A1 (ja) * 2021-04-19 2022-10-27 日東電工株式会社 アクリル系粘着剤組成物、アクリル系粘着剤、粘着フィルム、および、フレキシブルデバイス
JP2022185716A (ja) * 2021-06-03 2022-12-15 デクセリアルズ株式会社 接着剤組成物、接着フィルム、接続構造体および接続構造体の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000275625A (ja) 1999-03-24 2000-10-06 Seiko Epson Corp プラスチックフィルム積層体及び液晶装置の製造方法
JP2007056210A (ja) * 2005-08-26 2007-03-08 Emulsion Technology Co Ltd バックグラインド用粘着性樹脂組成物、並びにバックグラインド用粘着シートおよびその製造方法
JP2007070558A (ja) 2005-09-09 2007-03-22 Toyo Ink Mfg Co Ltd 活性エネルギー線粘着力消失型感圧接着剤及びそれを用いた粘着シート
JP5488399B2 (ja) * 2010-10-29 2014-05-14 東亞合成株式会社 活性エネルギー線剥離型粘着剤組成物
JP6546378B2 (ja) 2013-11-19 2019-07-17 日東電工株式会社 樹脂シート
JP6356564B2 (ja) * 2014-09-29 2018-07-11 リンテック株式会社 粘着シート
JP7106244B2 (ja) 2015-10-29 2022-07-26 三菱ケミカル株式会社 粘着剤組成物、それを用いて得られる剥離性粘着剤、剥離性粘着シート、およびその剥離性粘着シートの使用方法
JP6389198B2 (ja) 2016-02-22 2018-09-12 リンテック株式会社 粘着シート、表示体およびそれらの製造方法
WO2017149981A1 (ja) 2016-02-29 2017-09-08 株式会社イーテック 粘着剤組成物及び粘着シート
JP6917166B2 (ja) 2017-03-15 2021-08-11 マクセルホールディングス株式会社 ダイシング用粘着テープ、ダイシング用粘着テープの製造方法、および半導体チップの製造方法
JP7170387B2 (ja) * 2017-08-21 2022-11-14 リンテック株式会社 粘着シートおよび表示体
JP7132702B2 (ja) * 2017-08-30 2022-09-07 リンテック株式会社 表示体および表示体の製造方法
KR102680601B1 (ko) * 2018-11-12 2024-07-03 린텍 가부시키가이샤 워크 가공용 시트

Also Published As

Publication number Publication date
KR20200141382A (ko) 2020-12-18
JP7378230B2 (ja) 2023-11-13
CN112063328A (zh) 2020-12-11
JP2020200388A (ja) 2020-12-17

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