TW202104482A - Adhesive sheet and laminate excellent in handleability even when heat treatment is performed - Google Patents

Adhesive sheet and laminate excellent in handleability even when heat treatment is performed Download PDF

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TW202104482A
TW202104482A TW109112421A TW109112421A TW202104482A TW 202104482 A TW202104482 A TW 202104482A TW 109112421 A TW109112421 A TW 109112421A TW 109112421 A TW109112421 A TW 109112421A TW 202104482 A TW202104482 A TW 202104482A
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adhesive
adhesive layer
less
adhesive sheet
active energy
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Chinese (zh)
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小鯖翔
小澤祐樹
荒井隆行
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日商琳得科股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/24Homopolymers or copolymers of amides or imides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer

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  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Liquid Crystal (AREA)
  • Laminated Bodies (AREA)

Abstract

The object of the present invention is to provide an adhesive sheet excellent in handleability even when heat treatment is performed. The solution of the present invention is an adhesive sheet which at least includes an adhesive layer. The aforementioned adhesive sheet is used to fix a workpiece to a substrate through the aforementioned adhesive layer during the manufacturing process and the workpiece is peeled off from the adhesive layer after completion of the manufacturing process. The adhesive layer is composed of an active energy ray curable adhesive. When the initial adhesive force of the adhesive sheet is set to F0 and the adhesive force of the adhesive sheet after being heated at 150 DEG C for 30 minutes and then further irradiated with active energy rays is set to F2, the ratio of the adhesive force F2 to the initial adhesive force F0 (F2/F0) is 0.3 or less.

Description

黏著片及積層體Adhesive sheet and laminate

本發明係有關於適用於工件(work)的固定及剝離之黏著片(sheet)以及使用了此黏著片之積層體。The present invention relates to an adhesive sheet suitable for fixing and peeling a work and a laminate using the adhesive sheet.

作為被加工物(工件)之光學部件和電子部件等的裝置(device),在加工、組裝(積層)、檢查等的製程中,會進行藉由黏著片的黏著劑層將此裝置固定於基板(基座)的步驟。然後,在製程結束之後,會將上述工件從基板剝離。As a device (device) such as optical components and electronic components of the workpiece (workpiece), in the process of processing, assembly (layering), inspection, etc., the device is fixed to the substrate by the adhesive layer of the adhesive sheet (Base) steps. Then, after the end of the manufacturing process, the above-mentioned workpiece is peeled off the substrate.

作為如以上所述之黏著劑層,專利文獻1公開了一種藉由照射預定條件的紫外線來降低黏著力之黏著劑層。在使用此黏著劑層的情況下,在製程結束之後,藉由以預定條件對黏著劑層照射紫外線,能夠降低對工件的黏著力,藉此可以變得容易將工件從基板剝離。 [現有技術文獻] [專利文獻]As the adhesive layer as described above, Patent Document 1 discloses an adhesive layer in which the adhesive force is reduced by irradiating ultraviolet rays under a predetermined condition. In the case of using this adhesive layer, after the process is completed, by irradiating the adhesive layer with ultraviolet rays under predetermined conditions, the adhesive force to the workpiece can be reduced, thereby making it easier to peel the workpiece from the substrate. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開第2000-275625號公報[Patent Document 1] Japanese Patent Laid-Open No. 2000-275625

[發明所欲解決的課題][The problem to be solved by the invention]

順道一提,在上述製程中,有時候會在工件藉由黏著劑層固定於基板的狀態下,對工件進行加熱處理,或進行工件被隨著一併加熱的處理(以下,有時將這些處理統稱為「加熱處理」)。By the way, in the above-mentioned process, sometimes the workpiece is heated while the workpiece is fixed to the substrate by the adhesive layer, or the workpiece is heated together (hereinafter, sometimes these The treatment is collectively referred to as "heat treatment").

在上述加熱處理中,黏著劑層也會與工件一起被加熱,然而受到這種加熱處理的黏著劑層對工件的黏著性會變得過高。因此,專利文獻1所公開的具備以往的黏著劑層之黏著片,雖然可使用於包括加熱處理的製程中,然而並沒有表現出在製程結束之後照射活性能量射線以使得工件能夠容易地剝離這種優異的操作性。In the above-mentioned heating treatment, the adhesive layer is also heated together with the workpiece, but the adhesiveness of the adhesive layer subjected to this heating treatment to the workpiece becomes too high. Therefore, although the adhesive sheet with the conventional adhesive layer disclosed in Patent Document 1 can be used in a process including heat treatment, it does not show that the work can be easily peeled off by irradiating active energy rays after the process is completed. Kind of excellent operability.

有鑑於上述情況,本發明的目的在於在進行加熱處理的情況下也可提供操作性優異的黏著片、以及使用了此黏著片之積層體。 [用於解決課題的手段]In view of the above-mentioned circumstances, the object of the present invention is to provide an adhesive sheet excellent in handleability even when heat treatment is performed, and a laminate using the adhesive sheet. [Means used to solve the problem]

為了達成上述目的,本發明提供一種黏著片,其係至少包括黏著劑層的黏著片,其中前述黏著片用於在製程中透過前述黏著劑層將工件固定於基板且在製程結束之後將前述工件從前述黏著劑層剝離之用途,且前述黏著劑層由活性能量射線硬化性黏著劑所構成,且其中在將前述黏著片的初期黏著力設為F0 ,且將在150℃下加熱30分鐘然後進一步照射活性能量射線之後前述黏著片的黏著力設為F2 時,前述黏著力F2 相對於初期黏著力F0 的比例(F2 /F0 )為0.3以下(發明1)。In order to achieve the above object, the present invention provides an adhesive sheet, which is an adhesive sheet including at least an adhesive layer, wherein the adhesive sheet is used to fix the workpiece on the substrate through the adhesive layer during the manufacturing process and to fix the workpiece after the process is completed. Use for peeling from the adhesive layer, and the adhesive layer is composed of an active energy ray-curable adhesive, and the initial adhesive force of the adhesive sheet is set to F 0 and heated at 150°C for 30 minutes Then, when the adhesive force of the adhesive sheet is F 2 after further irradiation with active energy rays, the ratio of the adhesive force F 2 to the initial adhesive force F 0 (F 2 /F 0 ) is 0.3 or less (Invention 1).

在上述發明(發明1)中,由於黏著劑層由活性能量射線硬化性黏著劑所構成的同時,黏著力F2 相對於初期黏著力F0 的比例(F2 /F0 )介於上述範圍內,因此可以利用黏著劑層的黏著力將工件穩固地固定於基板上的同時,即使在對此工件進行了熱處理的情況下,後續也能夠藉由對上述黏著劑層照射預定條件的活性能量射線,使得此黏著劑層的黏著力良好地下降,如此一來能夠容易地將工件從基板剝離。In the above invention (Invention 1), since the adhesive layer is composed of an active energy ray-curable adhesive, the ratio of the adhesive force F 2 to the initial adhesive force F 0 (F 2 /F 0 ) is within the above range Therefore, it is possible to use the adhesive force of the adhesive layer to firmly fix the workpiece on the substrate. Even if the workpiece is heat-treated, the adhesive layer can be subsequently irradiated with a predetermined condition of active energy The radiation makes the adhesive force of the adhesive layer drop well, so that the workpiece can be easily peeled off the substrate.

在上述發明(發明1)中,在對前述黏著劑層照射活性能量射線之後,前述黏著劑層在23℃下的儲存彈性模量以0.1MPa以上、2MPa以下為佳(發明2)。In the above invention (Invention 1), after the adhesive layer is irradiated with active energy rays, the storage elastic modulus of the adhesive layer at 23° C. is preferably 0.1 MPa or more and 2 MPa or less (Invention 2).

在上述發明(發明1、2)中,前述活性能量射線硬化性黏著劑以包括矽烷偶合劑為佳(發明3)。In the above inventions (Inventions 1 and 2), the active energy ray-curable adhesive preferably includes a silane coupling agent (Invention 3).

在上述發明(發明1~3)中,前述初期黏著力F0 以0.5N/25mm以上、80N/25mm以下為佳(發明4)。In the above inventions (Inventions 1 to 3), the aforementioned initial adhesive force F 0 is preferably 0.5 N/25 mm or more and 80 N/25 mm or less (Invention 4).

在上述發明(發明1~4)中,在150℃下加熱30分鐘之後前述黏著片的黏著力F1 以0.5N/25mm以上、80N/25mm以下為佳(發明5)。After heating at 150 deg.] C in the above inventions (Inventions 1 to 4) for 30 minutes the adhesion of the adhesive sheet F. 1 to 0.5N / 25mm or more, 80N / 25mm or less preferably (Invention 5).

在上述發明(發明1~5)中,前述黏著力F2 以0.01N/25mm以上、8N/25mm以下為佳(發明6)。In the above inventions (Inventions 1 to 5), the aforementioned adhesive force F 2 is preferably 0.01 N/25 mm or more and 8 N/25 mm or less (Invention 6).

在上述發明(發明1~6)中,前述工件以可撓式裝置為佳(發明7)。In the above inventions (Inventions 1 to 6), the aforementioned workpiece is preferably a flexible device (Invention 7).

在上述發明(發明1~7)中,前述用途以包括固定於前述基板上的前述工件之加熱為佳(發明8)。In the aforementioned inventions (Inventions 1 to 7), the aforementioned application preferably includes heating of the aforementioned workpiece fixed on the aforementioned substrate (Invention 8).

在上述發明(發明1~8)中,前述黏著片以包括2片剝離片且前述黏著劑層夾設於前述剝離片之間並接觸前述2片剝離片的剝離面為佳(發明9)。In the above inventions (Inventions 1 to 8), the adhesive sheet preferably includes two release sheets, and the adhesive layer is sandwiched between the release sheets and contacts the release surfaces of the two release sheets (Invention 9).

其次,本發明提供一種積層體,其將可撓式裝置、前述黏著片(發明1~9)的前述黏著劑層、及基板依此順序積層所形成(發明10)。 [本發明的效果]Next, the present invention provides a laminate in which a flexible device, the adhesive layer of the adhesive sheet (Inventions 1 to 9), and a substrate are laminated in this order (Invention 10). [Effects of the invention]

根據本發明的黏著片,在進行加熱處理的情況下也具有優異的操作性。再者,根據本發明的積層體具有優異的操作性。According to the pressure-sensitive adhesive sheet of the present invention, even in the case of heat treatment, it has excellent operability. Furthermore, the laminate according to the present invention has excellent operability.

以下,對本發明的實施形態進行說明。 根據本發明的一實施形態之黏著片,至少包括黏著劑層,且其以在黏著劑層的單面或雙面上積層剝離片所形成的黏著片為佳。Hereinafter, an embodiment of the present invention will be described. The adhesive sheet according to an embodiment of the present invention includes at least an adhesive layer, and it is preferably an adhesive sheet formed by laminating a release sheet on one or both sides of the adhesive layer.

根據本實施形態的黏著片係用於在製程中透過黏著劑層將被加工物(工件)固定於基板且在製程結束之後將此工件從此黏著劑層剝離之用途。特別是,根據本實施形態的黏著片,適用於在將作為工件之光學部件和電子部件等的裝置加工、組裝(積層)、檢查等的製程中,將此裝置藉由此黏著片的黏著劑層固定於基板。另外,上述基板係用於在製程中支撐和固定工件,且也包括基座等的概念。The adhesive sheet according to this embodiment is used for the purpose of fixing the workpiece (workpiece) to the substrate through the adhesive layer during the manufacturing process, and peeling the workpiece from the adhesive layer after the process is completed. In particular, the adhesive sheet according to this embodiment is suitable for processing, assembling (laminating), and inspecting devices such as optical components and electronic components as workpieces. The layer is fixed to the substrate. In addition, the above-mentioned substrate is used to support and fix the workpiece during the manufacturing process, and also includes concepts such as a base.

作為工件,並沒有特別限定,以具有柔軟度的光學部件或電子部件等的可撓式裝置(flexible device)為佳。再者,在上述製程中包括加熱製程之工件也可以作為上述工件。作為這種加熱製程,例如,可列舉出用於形成透明電極的佈線之金屬氣相沉積製程、和樹脂的硬化製程等。從這些觀點來看,作為工件,例如,以可撓式有機發光二極體(OLED)裝置、可撓式液晶裝置等為佳,且以可撓式OLED裝置為特佳。The workpiece is not particularly limited, but a flexible device such as an optical component or electronic component having flexibility is preferable. Furthermore, a workpiece including a heating process in the above-mentioned manufacturing process can also be used as the above-mentioned workpiece. As such a heating process, for example, a metal vapor deposition process for forming a wiring of a transparent electrode, a resin curing process, etc. can be cited. From these viewpoints, as the workpiece, for example, a flexible organic light emitting diode (OLED) device, a flexible liquid crystal device, etc. are preferred, and a flexible OLED device is particularly preferred.

工件的厚度並沒有特別限定,以容易表現出可撓性的厚度為佳,具體而言,以5μm以上為佳,以15μm以上為較佳,以30μm以上為特佳,且以40μm以上為更佳。再者,工件的厚度以5000μm以下為佳,以2000μm以下為較佳,以1000μm以下為特佳,且以500μm以下為更佳。The thickness of the workpiece is not particularly limited. It is preferably a thickness that easily exhibits flexibility. Specifically, 5 μm or more is preferable, 15 μm or more is more preferable, 30 μm or more is particularly preferable, and 40 μm or more is more preferable good. Furthermore, the thickness of the workpiece is preferably 5000 μm or less, preferably 2000 μm or less, particularly preferably 1000 μm or less, and more preferably 500 μm or less.

再者,作為工件在平面圖中的形狀,可以是圓形,也可以是多邊形,其中以多邊形為佳。工件在平面圖中的形狀為多邊形的情況下,構成多邊形的邊之總數並沒有特別限定,以3個邊以上為佳,且以4個邊以上為特佳。再者,構成多邊形的邊之總數以10個邊以下為佳,且以6個邊以下為特佳。其中,工件在平面圖中的形狀為多邊形的情況下,此多邊形以由4個邊所構成的四邊形為特佳。Furthermore, as the shape of the workpiece in a plan view, it may be circular or polygonal, and polygonal is preferable. When the shape of the workpiece in a plan view is a polygon, the total number of sides constituting the polygon is not particularly limited, and 3 sides or more are preferable, and 4 sides or more are particularly preferable. Furthermore, the total number of sides constituting the polygon is preferably 10 sides or less, and particularly preferably 6 sides or less. Among them, when the shape of the workpiece in a plan view is a polygon, this polygon is particularly preferably a quadrilateral formed by four sides.

再者,工件在平面圖中的形狀為多邊形的情況下,構成此多邊形的各邊的長度,可以都具有相同的長度,也可以具有不同的長度。工件在平面圖中的形狀為四邊形的情況下,以相反側的邊彼此平行為佳,其中以具有長邊和短邊的長方形為佳。在此情況下,長邊的長度以10mm以上為佳,以40mm以上為特佳,且以80mm以上為更佳。再者,上述長邊的長度以1500mm以下為佳,以800mm以下為特佳,且以500mm以下為更佳。另一方面,短邊的長度以5mm以上為佳,以10mm以上為特佳,且以20mm以上為更佳。再者,上述短邊的長度以1000mm以下為佳,以600mm以下為特佳,且以350mm以下為更佳。Furthermore, when the shape of the workpiece in a plan view is a polygon, the lengths of the sides constituting the polygon may all have the same length or different lengths. When the shape of the workpiece in a plan view is a quadrilateral, it is preferable that the sides on the opposite sides are parallel to each other, and a rectangle with long sides and short sides is preferable. In this case, the length of the long side is preferably 10 mm or more, particularly preferably 40 mm or more, and more preferably 80 mm or more. Furthermore, the length of the aforementioned long side is preferably 1500 mm or less, particularly preferably 800 mm or less, and more preferably 500 mm or less. On the other hand, the length of the short side is preferably 5 mm or more, particularly preferably 10 mm or more, and more preferably 20 mm or more. Furthermore, the length of the short side is preferably 1000 mm or less, particularly preferably 600 mm or less, and more preferably 350 mm or less.

再者,作為基板,只要工件能夠藉由此黏著片的黏著劑層固定於其上即可,並沒有特別限定,但以在上述製程中即使是在進行了加熱處理的情況下也不會產生變形或外觀變化的基板為佳。再者,工件藉由此黏著片的黏著劑層貼合於基板,而在上述製程中及剝離工件的製程中,黏著劑層和基板必須充分地固定。例如,若基板的表面粗糙,則基板與黏著劑層之間的密合性降低,可能會發生在製程中黏著劑層意外從基板剝離的問題。因此,以基板在工件固定側具有光滑的表面為佳。從這些觀點來看,可列舉出以玻璃基板作為基板為特佳。Furthermore, as a substrate, as long as the workpiece can be fixed on it by the adhesive layer of the adhesive sheet, it is not particularly limited, but it will not be produced even if the heat treatment is performed in the above process. A substrate that is deformed or changed in appearance is preferred. Furthermore, the workpiece is adhered to the substrate by the adhesive layer of the adhesive sheet, and in the above-mentioned process and the process of peeling the workpiece, the adhesive layer and the substrate must be sufficiently fixed. For example, if the surface of the substrate is rough, the adhesion between the substrate and the adhesive layer is reduced, and the adhesive layer may be accidentally peeled from the substrate during the manufacturing process. Therefore, it is better for the substrate to have a smooth surface on the fixed side of the workpiece. From these viewpoints, it is particularly preferable to use a glass substrate as a substrate.

在根據本實施形態的黏著片中,黏著劑層由活性能量射線硬化性黏著劑所構成。而且,在將根據本實施形態的黏著片的初期黏著力設為F0 ,且將在150℃下加熱30分鐘然後進一步照射活性能量射線之後上述黏著片的黏著力設為F2 時,上述黏著力F2 相對於初期黏著力F0 的比例(F2 /F0 )為0.3以下。In the adhesive sheet according to this embodiment, the adhesive layer is composed of an active energy ray-curable adhesive. Moreover, when the initial adhesive force of the adhesive sheet according to the present embodiment is F 0 , and the adhesive force of the adhesive sheet after heating at 150° C. for 30 minutes and then further irradiated with active energy rays is F 2 , the adhesive The ratio of the force F 2 to the initial adhesive force F 0 (F 2 /F 0 ) is 0.3 or less.

藉由將上述黏著力比例(F2 /F0 )設為0.3以下,可以將工件良好地固定於基板上,而且在製程結束之後,對上述黏著層照射活性能量射線以使得黏著劑層充分地硬化,進而能夠良好地降低黏著劑層對工件的黏著力。結果,能夠容易地將工件從基板剝離。特別是,即使是在上述製程包括工件的熱處理的情況下,在將工件從基板剝離時,黏著力也已經充分地下降,進而能夠容易地將工件從基板剝離。如此一來,根據本實施形態的黏著片具有優異的操作性。By setting the above-mentioned adhesive force ratio (F 2 /F 0 ) to 0.3 or less, the workpiece can be well fixed on the substrate, and after the end of the process, active energy rays are irradiated to the adhesive layer to make the adhesive layer sufficiently Hardening can reduce the adhesion of the adhesive layer to the workpiece. As a result, the workpiece can be easily peeled from the substrate. In particular, even in the case where the above-mentioned process includes heat treatment of the workpiece, when the workpiece is peeled from the substrate, the adhesive force has been sufficiently reduced, and the workpiece can be easily peeled from the substrate. In this way, the adhesive sheet according to this embodiment has excellent operability.

另一方面,在上述黏著力比例(F2 /F0 )超過0.3的情況下,即使在製程結束之後對黏著層照射活性能量射線,黏著劑層對工件的黏著力也沒有充分地下降,造成工件變得難以從基板剝離。從有效避免這種問題的觀點來看,上述黏著力比例(F2 /F0 )以0.15以下為佳,以0.08以下為特佳,以0.05以下為更佳,且以0.04以下為最佳。另外,上述黏著力比例(F2 /F0 )的下限值並沒有特別限定,例如可為0.001以上,特別是也可為0.01以上,進一步而言也可為0.015以上。On the other hand, when the above-mentioned adhesive force ratio (F 2 /F 0 ) exceeds 0.3, even if the adhesive layer is irradiated with active energy rays after the end of the process, the adhesive force of the adhesive layer to the workpiece is not sufficiently reduced, resulting in the workpiece It becomes difficult to peel from the substrate. From the viewpoint of effectively avoiding this problem, the above-mentioned adhesive force ratio (F 2 /F 0 ) is preferably 0.15 or less, particularly preferably 0.08 or less, more preferably 0.05 or less, and most preferably 0.04 or less. In addition, the lower limit of the above-mentioned adhesive force ratio (F 2 /F 0 ) is not particularly limited, and may be, for example, 0.001 or more, particularly 0.01 or more, and further, 0.015 or more.

在根據本實施形態的黏著片中,前述初期黏著力F0 以0.5N/25mm以上為佳,以1.5N/25mm以上為較佳,以3N/25mm以上為更佳,以6N/25mm以上為特佳,且從提升耐久性(特別是耐起泡(blister)性)的觀點考量,以8N/25mm以上為佳,以10N/25mm以上為更佳,且以13N/25mm以上為最佳。再者,初期黏著力F0 以80N/25mm以下為佳,以60N/25mm以下為較佳,以50N/25mm以下為特佳,以35N/25mm以下為更佳,且以20N/25mm以下為最佳。藉由將初期黏著力F0 設為介於上述範圍內,變得容易將黏著力比例(F2 /F0 )調整至介於前述範圍內。再者,特別是藉由將初期黏著力F0 設為3N/25mm以上,使得在製程中變得容易良好地將工件保持於黏著劑層上。In the adhesive sheet according to this embodiment, the aforementioned initial adhesive force F 0 is preferably 0.5N/25mm or more, preferably 1.5N/25mm or more, more preferably 3N/25mm or more, and 6N/25mm or more Especially good, and from the viewpoint of improving durability (especially blister resistance), 8N/25mm or more is preferred, 10N/25mm or more is more preferred, and 13N/25mm or more is most preferred. Furthermore, the initial adhesion F 0 is preferably 80N/25mm or less, preferably 60N/25mm or less, particularly preferably 50N/25mm or less, more preferably 35N/25mm or less, and 20N/25mm or less as optimal. By setting the initial adhesive force F 0 to fall within the aforementioned range, it becomes easy to adjust the adhesive force ratio (F 2 /F 0 ) to fall within the aforementioned range. Furthermore, especially by setting the initial adhesive force F 0 to 3N/25mm or more, it becomes easy and good to hold the workpiece on the adhesive layer during the manufacturing process.

在根據本實施形態的黏著片中,在150℃下加熱30分鐘之後前述黏著片的黏著力F1 以0.5N/25mm以上,以1N/25mm以上為較佳,以5N/25mm以上為特佳,以10N/25mm以上為更佳,且從提升耐久性(特別是耐起泡性)的觀點考量,以14N/25mm以上為佳,且以17N/25mm以上為特佳。再者,黏著力F1 以80N/25mm以下為佳,以50N/25mm以下為較佳,以35N/25mm以下為特佳,且從提升耐久性(特別是耐起泡性)的觀點考量,以22N/25mm以下為更佳。藉由將黏著力F1 設為介於上述範圍內,變得容易將黏著力比例(F2 /F0 )調整至介於前述範圍內。再者,特別是藉由將黏著力F1 設為5N/25mm以上,即使在進行了加熱處理後工件或基板產生了釋氣(outgas),也能夠有效地抑制由於釋氣而在黏著劑層與工件或基板之間的界面所造成的浮起或剝離。In the adhesive sheet according to this embodiment, the adhesive force F 1 of the aforementioned adhesive sheet after heating at 150°C for 30 minutes is 0.5N/25mm or more, preferably 1N/25mm or more, and particularly preferably 5N/25mm or more , 10N/25mm or more is more preferable, and from the viewpoint of improving durability (especially blistering resistance), 14N/25mm or more is preferable, and 17N/25mm or more is particularly preferable. Furthermore, the adhesion force F 1 is preferably 80N/25mm or less, preferably 50N/25mm or less, and 35N/25mm or less is particularly preferable, and from the viewpoint of improving durability (especially blistering resistance), 22N/25mm or less is more preferable. By setting the adhesive force F 1 to fall within the above-mentioned range, it becomes easy to adjust the adhesive force ratio (F 2 /F 0 ) to fall within the above-mentioned range. Furthermore, in particular by the adhesive force F 1 to 5N / 25mm or more, even when the heat treatment after the workpiece or substrate outgassing generated (outgas), can be effectively suppressed in outgassing adhesive layer The floating or peeling caused by the interface with the workpiece or the substrate.

在根據本實施形態的黏著片中,前述黏著力F2 以0.01N/25mm以上為佳,以0.05N/25mm以上為較佳,以0.1N/25mm以上為特佳,且以0.2N/25mm以上為更佳。再者,從變得容易將工件從基板良好地剝離的觀點來看,黏著力F2 以8N/25mm以下為佳,以4N/25mm以下為較佳,以2N/25mm以下為特佳,以1N/25mm以下為更佳,且以0.5N/25mm以下為最佳。藉由將黏著力F2 設為介於上述範圍內,變得容易將黏著力比例(F2 /F0 )調整至介於前述範圍內。In the adhesive sheet according to this embodiment, the aforementioned adhesive force F 2 is preferably 0.01N/25mm or more, preferably 0.05N/25mm or more, particularly preferably 0.1N/25mm or more, and 0.2N/25mm The above is better. Furthermore, from the viewpoint of making it easier to peel the workpiece from the substrate well, the adhesive force F 2 is preferably 8N/25mm or less, 4N/25mm or less, and 2N/25mm or less is particularly preferred. 1N/25mm or less is more preferable, and 0.5N/25mm or less is the best. By setting the adhesive force F 2 to fall within the above range, it becomes easy to adjust the adhesive force ratio (F 2 /F 0 ) to fall within the above range.

在根據本實施形態的黏著片中,前述黏著力F2 相對於前述黏著力F1 的比例(F2 /F1 )以0.3以下為佳,以0.15以下為較佳,以0.08以下為特佳,且從提升耐久性(特別是耐起泡性)的觀點考量,以0.04以下為更佳。再者,此比例(F2 /F1 )以0.001以上為佳,以0.01以上為特佳,且從提升耐久性(特別是耐起泡性)的觀點考量,以0.015以上為更佳。藉由將(F2 /F1 )設為介於這些範圍內,變得容易將黏著力比例(F2 /F0 )調整至介於前述範圍內。In the adhesive sheet according to this embodiment, the ratio (F 2 /F 1 ) of the aforementioned adhesive force F 2 to the aforementioned adhesive force F 1 is preferably 0.3 or less, preferably 0.15 or less, and particularly preferably 0.08 or less And from the viewpoint of improving durability (especially foam resistance), 0.04 or less is more preferable. Furthermore, the ratio (F 2 /F 1 ) is preferably 0.001 or more, particularly preferably 0.01 or more, and from the viewpoint of improving durability (especially blistering resistance), it is more preferably 0.015 or more. By setting (F 2 /F 1 ) to fall within these ranges, it becomes easy to adjust the adhesive force ratio (F 2 /F 0 ) to fall within the aforementioned range.

在根據本實施形態的黏著片中,前述黏著力F1 相對於前述初期黏著力F0 的比例(F1 /F0 )以2.5以下為佳,以1.8以下為特佳,且以1.4以下為更佳。再者,此比例(F1 /F0 )以0.98以上為佳,以1.0以上為較佳,以1.1以上為特佳,且以1.15以上為更佳。藉由將(F1 /F0 )設為介於這些範圍內,變得容易將黏著力比例(F2 /F0 )調整至介於前述範圍內。In the adhesive sheet according to this embodiment, the ratio (F 1 /F 0 ) of the aforementioned adhesive force F 1 to the aforementioned initial adhesive force F 0 is preferably 2.5 or less, particularly preferably 1.8 or less, and 1.4 or less Better. Furthermore, the ratio (F 1 /F 0 ) is preferably 0.98 or more, preferably 1.0 or more, particularly preferably 1.1 or more, and more preferably 1.15 or more. By setting (F 1 /F 0 ) to fall within these ranges, it becomes easy to adjust the adhesive force ratio (F 2 /F 0 ) to fall within the aforementioned range.

此處,前述初期黏著力F0 、黏著力F1 、及黏著力F2 基本上係藉由根據JISZ0237:2009所規範的180度剝離法所測量出的黏著力,這些黏著力的測量方法的細節分別如後續描述的試驗例中所記載。Here, the aforementioned initial adhesive force F 0 , adhesive force F 1 , and adhesive force F 2 are basically the adhesive force measured by the 180-degree peeling method according to JISZ0237:2009, and these adhesive force measurement methods The details are as described in the test examples described later.

在根據本實施形態的黏著片中,從操作性特別是製程中的工件固定的觀點來看,在23℃下對玻璃的黏著力以24N/25mm以上為佳,以28N/25mm以上為特佳,且以32N/25mm以上為更佳。另一方面,從重工(rework)性的觀點來看,在23℃下對玻璃的黏著力的上限值以100N/25mm以下為佳,以76N/25mm以下為特佳,且以52N/25mm以下為更佳。In the adhesive sheet according to this embodiment, from the viewpoint of operability, especially the fixation of the workpiece in the process, the adhesion to glass at 23°C is preferably 24N/25mm or more, and 28N/25mm or more is particularly preferable , And more preferably 32N/25mm or more. On the other hand, from the viewpoint of reworkability, the upper limit of the adhesion to glass at 23°C is preferably 100N/25mm or less, particularly preferably 76N/25mm or less, and 52N/25mm The following is better.

此處,上述對玻璃的黏著力基本上係藉由根據JIS Z0237:2009所規範的180度剝離法所測量出的黏著力,且測量樣本的寬度設為25mm、長度設為100mm,將此測量樣本貼附至被黏著物,並在0.5 MPa、50℃下加壓20分鐘後,在常壓、預定的溫度、50%RH的條件下放置24小時,然後以300 mm/min的剝離速度進行測量,以得到上述黏著力。再者,在本說明書中的「對玻璃的黏著力」係意指對鈉鈣玻璃的黏著力。Here, the above-mentioned adhesive force to glass is basically the adhesive force measured by the 180-degree peel method specified in JIS Z0237:2009, and the width of the measurement sample is set to 25mm and the length is set to 100mm. This measurement The sample is attached to the adherend and pressurized at 0.5 MPa and 50°C for 20 minutes, and then placed under normal pressure, predetermined temperature, and 50% RH for 24 hours, and then peeled off at 300 mm/min Measure to get the above-mentioned adhesive force. Furthermore, the "adhesion to glass" in this specification means the adhesion to soda lime glass.

在根據本實施形態的黏著片中,在對黏著劑層照射活性能量射線之後,此黏著劑層在23℃下的儲存彈性模量G'2 以0.1MPa以上為佳,以0.3MPa以上為較佳,以0.4MPa以上為特佳,且以0.42MPa以上為更佳。藉由將上述儲存彈性模量G'2 設為0.1MPa以上,經過活性能量射線的照射後的黏著劑層良好地硬化,且可以變得更容易將製程結束後的工件從基板剝離。另外,上述儲存彈性模量G'2 的上限值並沒有特別限定,例如可為2MPa以下,特別是也可為1MPa以下,進一步而言也可為0.5MPa以下。In the adhesive sheet of the present embodiment, after the irradiation of an active energy ray adhesive layer, this adhesive layer a storage elastic modulus G 'at 23 ℃ of 2 or more preferably 0.1MPa to 0.3MPa or more is more Preferably, 0.4 MPa or more is particularly preferable, and 0.42 MPa or more is more preferable. By setting the storage elastic modulus G′ 2 to be 0.1 MPa or more, the adhesive layer after irradiation with active energy rays is cured well, and it becomes easier to peel the work after the process from the substrate. In addition, the upper limit of the storage elastic modulus G′ 2 is not particularly limited, and may be, for example, 2 MPa or less, particularly 1 MPa or less, and further, 0.5 MPa or less.

再者,在根據本實施形態的黏著片中,在對黏著劑層照射活性能量射線之前,此黏著劑層在23℃下的儲存彈性模量G'1 以0.01MPa以上為佳,以0.03MPa以上為特佳,且以0.05MPa以上為更佳。再者,上述儲存彈性模量G'1 以1MPa以下為佳,以0.5MPa以下為特佳,且以0.1MPa以下為更佳。藉由將在照射活性能量射線之前的黏著劑層的儲存彈性模量G'1 設為介於這些範圍內,變得容易將工件有效地固定於基板上,而且在照射活性能量射線之後的黏著劑層的儲存彈性模量G'2 變得容易調整至介於上述範圍內。Further, in the adhesive sheet of the present embodiment, the adhesive agent layer before the irradiation of an active energy ray, this adhesive layer a storage elastic modulus G 'at 23 ℃ apos more preferably 1 to 0.01MPa to 0.03MPa The above is particularly preferable, and more preferably 0.05 MPa or more. Furthermore, the storage elastic modulus G'1 is preferably 1 MPa or less, particularly preferably 0.5 MPa or less, and more preferably 0.1 MPa or less. With the storage modulus of the adhesive layer prior to irradiation with an active energy ray G '1 is set between these ranges, it becomes easy to work effectively fixed on the substrate, and the adhesion after irradiation with active energy rays storage elastic modulus of the adhesive layer G '2 can be easily adjusted to between above range.

再者,在根據本實施形態的黏著片中,上述儲存彈性模量G'2 相對於上述儲存彈性模量G'1 的比例(G'2 /G'1 )以2以上為佳,以4以上為較佳,以5以上為特佳,且以6以上為更佳。藉由將上述比例(G'2 /G'1 )設為2以上,根據本實施形態的黏著劑層透過照射活性能量射線而硬化的程度變得更明顯,且變得容易高度兼顧對於在照射活性能量射線之前的工件及基板之良好密合性、和在照射活性能量射線之後的剝離性。另外,上述比例(G'2 /G'1 )的上限值並沒有特別限定,例如可為20以下,特別是也可為12以下,進一步而言也可為8以下。Further, in the adhesive sheet of the present embodiment, the above-described storage elastic modulus G '2 with respect to the storage elastic modulus G' of Comparative Example 1 (G '2 / G' 1) or more preferably 2 to 4 The above is preferable, 5 or more is particularly preferable, and 6 or more is more preferable. By setting the above-mentioned ratio (G' 2 /G' 1 ) to 2 or more, the degree of hardening of the adhesive layer according to the present embodiment by irradiating active energy rays becomes more obvious, and it becomes easier to achieve a high degree of compatibility with Good adhesion of the workpiece and substrate before active energy rays, and peelability after active energy rays irradiation. In addition, the upper limit of the above-mentioned ratio (G' 2 /G' 1 ) is not particularly limited. For example, it may be 20 or less, particularly 12 or less, and further, 8 or less.

另外,上述在照射活性能量射線之後的黏著劑層在23℃下的儲存彈性模量G'1 、及在照射活性能量射線之前的黏著劑層在23℃下的儲存彈性模量G'2 的測量方法的細節,分別如後續描述的試驗例中所記載。Further, the storage elastic modulus above-described adhesive layer after irradiation with active energy rays at 23 ℃ the G 'storage modulus 1, and the adhesive layer prior to irradiation with an active energy ray at 23 ℃, G' 2 of The details of the measurement methods are as described in the test examples described later.

在根據本實施形態的黏著片中,相對於在對黏著劑層照射活性能量射線之前此黏著劑層的凝膠分率G1 ,在對黏著劑層照射活性能量射線之後此黏著劑層的凝膠分率G2 的比例(G2 /G1 )以1.00以上為佳,以1.05以上為特佳,且以1.10以上為更佳。藉由將上述比例(G2 /G1 )設為1.00以上,根據本實施形態的黏著劑層透過照射活性能量射線而硬化的程度變得更明顯,且變得容易高度兼顧對於在照射活性能量射線之前的工件及基板之良好密合性、和在照射活性能量射線之後的剝離性。另外,上述比例(G2 /G1 )的上限值並沒有特別限定,例如以1.5以下為佳,以1.2以下為特佳,且以1.14以下為更佳。In the adhesive sheet according to this embodiment, with respect to the gel fraction G 1 of the adhesive layer before the active energy ray is irradiated to the adhesive layer, the gel fraction of the adhesive layer after the active energy ray is irradiated to the adhesive layer The ratio of the glue fraction G 2 (G 2 /G 1 ) is preferably 1.00 or more, particularly preferably 1.05 or more, and more preferably 1.10 or more. By setting the above-mentioned ratio (G 2 /G 1 ) to 1.00 or more, the degree of hardening of the adhesive layer according to the present embodiment by irradiation with active energy rays becomes more pronounced, and it becomes easier to achieve a high degree of compatibility with active energy irradiation. Good adhesion to the workpiece and substrate before irradiation, and peelability after active energy ray irradiation. In addition, the upper limit of the aforementioned ratio (G 2 /G 1 ) is not particularly limited. For example, it is preferably 1.5 or less, particularly preferably 1.2 or less, and more preferably 1.14 or less.

在根據本實施形態的黏著片中,上述凝膠分率G1 以40%以上為佳,以60%以上為佳,以70%以上為特佳,以80%以上為更佳,且以86%以上為最佳。再者,上述凝膠分率G1 以99%以下為佳,以95%以下為較佳,以92%以下為特佳,且以89%以下為更佳。藉由將凝膠分率G1 設為介於上述範圍內,上述比例(G2 /G1 )變得容易調整至介於上述範圍內。In the adhesive sheet according to this embodiment, the gel fraction G 1 is preferably 40% or more, preferably 60% or more, particularly preferably 70% or more, more preferably 80% or more, and 86% % Or more is the best. Furthermore, the aforementioned gel fraction G 1 is preferably 99% or less, preferably 95% or less, particularly preferably 92% or less, and more preferably 89% or less. By setting the gel fraction G 1 to fall within the aforementioned range, the aforementioned ratio (G 2 /G 1 ) can be easily adjusted to fall within the aforementioned range.

再者,在根據本實施形態的黏著片中,上述凝膠分率G2 以85%以上為佳,以90%以上為較佳,以95%以上為特佳,且以99%以上為更佳。再者,上述凝膠分率G2 以100%以下為佳,以99.8以下為特佳,且以99.7%以下為更佳。藉由將凝膠分率G2 設為介於上述範圍內,上述比例(G2 /G1 )變得容易調整至介於上述範圍內。Furthermore, in the adhesive sheet according to this embodiment, the above-mentioned gel fraction G 2 is preferably 85% or more, more preferably 90% or more, particularly preferably 95% or more, and more preferably 99% or more good. Furthermore, the above-mentioned gel fraction G 2 is preferably 100% or less, particularly preferably 99.8 or less, and more preferably 99.7% or less. By setting the gel fraction G 2 to fall within the above range, the above ratio (G 2 /G 1 ) can be easily adjusted to fall within the above range.

此處,上述凝膠分率G1 及凝膠分率G2 的測量方法的細節,分別如後續描述的試驗例中所記載。Here, the details of the method for measuring the gel fraction G 1 and the gel fraction G 2 are as described in the test examples described later, respectively.

適用於根據本實施形態的黏著片之工件,與此黏著片的黏著劑層接觸的表面面積適合為10000 cm2 以下,較適合為5000 cm2 以下,特別適合為2500 cm2 以下,更適合為1000 cm2 以下,且最適合為200 cm2 以下。再者,此面積適合為9 cm2 以上,特別適合為16 cm2 以上,且更適合為25 cm2 以上。通常,與黏著劑層的接觸面積越小,會越難將工件保持於黏著劑層上,但根據本實施形態的黏著片,即使上述面積為10000 cm2 以下,也能夠將工件良好地保持於黏著劑層上。此外,通常,與黏著劑層的接觸面積越大,在將工件從黏著劑層剝離時,變得需要越大的剝離力,但根據本實施形態的黏著片,即使上述面積為9 cm2 以上,也能夠藉由活性能量射線的照射而容易地將工件從黏著劑層分離。Suitable for the work piece of the adhesive sheet according to this embodiment, the surface area in contact with the adhesive layer of the adhesive sheet is suitably 10000 cm 2 or less, more suitably 5000 cm 2 or less, especially 2500 cm 2 or less, more suitable for 1000 cm 2 or less, and most preferably 200 cm 2 or less. Furthermore, the area is suitably 9 cm 2 or more, particularly suitably 16 cm 2 or more, and more suitably 25 cm 2 or more. Generally, the smaller the contact area with the adhesive layer, the more difficult it is to hold the workpiece on the adhesive layer. However, according to the adhesive sheet of this embodiment, even if the above-mentioned area is 10000 cm 2 or less, the workpiece can be held well on the adhesive layer. On the adhesive layer. In addition, generally, the larger the contact area with the adhesive layer, the greater the peeling force is required when the workpiece is peeled from the adhesive layer. However, according to the adhesive sheet of this embodiment, even if the above-mentioned area is 9 cm 2 or more , It is also possible to easily separate the workpiece from the adhesive layer by the irradiation of active energy rays.

圖1繪示出作為根據本實施形態的黏著片的一範例之具體構造。 如圖1所示,根據一實施形態的黏著片1由2片剝離片12a和12b、和夾設於這2片剝離片12a、12b之間並接觸這2片剝離片12a、12b的剝離面之黏著劑層11所構成。另外,在本說明書中所謂剝離片的剝離面係意指在剝離片中具有剝離性的表面,而且也包括施加了剝離處理的表面以及不施加剝離處理也可表現出剝離性的表面之任一者。FIG. 1 illustrates the specific structure as an example of the adhesive sheet according to this embodiment. As shown in FIG. 1, the adhesive sheet 1 according to one embodiment is composed of two release sheets 12a and 12b, and the two release sheets 12a, 12b sandwiched between the two release sheets 12a, 12b and contact the release surfaces of the two release sheets 12a, 12b. The adhesive layer 11 is formed. In addition, the peeling surface of the peeling sheet in this specification means the peelable surface in the peeling sheet, and it also includes any one of the surface that has been subjected to peeling treatment and the surface that can exhibit peelability without peeling treatment. By.

1.各部件 1-1.黏著劑層 構成根據本實施形態的黏著片1的黏著劑層11之黏著劑,只要是具有活性能量射線硬化性且同時也滿足前述物性的黏著劑即可,並沒有特別限定。作為這種活性能量射線硬化性黏著劑,可以是包括具有活性能量射線硬化性的聚合物(活性能量射線硬化性聚合物)作為主要成分之黏著劑,也可以是包括不具有活性能量射線硬化性的聚合物(活性能量射線非硬化性聚合物)、和具有至少1個以上的活性能量射線硬化性基團的單體及/或低聚物的混合物作為主要成分之黏著劑。1. Parts 1-1. Adhesive layer The adhesive constituting the adhesive layer 11 of the adhesive sheet 1 according to the present embodiment is not particularly limited as long as it has active energy ray curability and also satisfies the aforementioned physical properties. As such an active energy ray-curable adhesive, it may include an adhesive that has active energy ray-curable properties (active energy ray-curable polymer) as a main component, or it may include an adhesive that does not have active energy ray-curable properties. A mixture of a polymer (active energy ray non-curable polymer) and a monomer and/or oligomer having at least one active energy ray hardenable group as the main component of the adhesive.

其中,從容易滿足前述物性的觀點來看,構成本實施形態中的黏著劑層11之黏著劑,以包括活性能量射線硬化性聚合物作為主要成分之黏著劑為佳。特別是,構成黏著劑層11之黏著劑,以含有在側鏈導入了具有活性能量射線硬化性的官能基(活性能量射線硬化性基團)之(甲基)丙烯酸酯(共)聚合物(A)(以下有時稱為「活性能量射線硬化性聚合物(A)」)作為上述活性能量射線硬化性聚合物、和交聯劑(B)之黏著性組合物(以下有時稱為「黏著性組合物P」)所形成的黏著劑(使得黏著性組合物P進行交聯所形成的黏著劑)為佳。另外,在本說明書中,所謂(甲基)丙烯酸係意味著丙烯酸及甲基丙烯酸兩者。其他類似的用語也是如此。再者,「聚合物」也包括「共聚物」的概念。Among them, from the viewpoint of easily satisfying the aforementioned physical properties, the adhesive constituting the adhesive layer 11 in this embodiment is preferably an adhesive including an active energy ray curable polymer as a main component. In particular, the adhesive constituting the adhesive layer 11 contains (meth)acrylate (co)polymer (meth)acrylate (co)polymers with active energy ray-curable functional groups (active energy ray-curable groups) introduced into the side chains ( A) (hereinafter sometimes referred to as "active energy ray curable polymer (A)") as an adhesive composition of the above active energy ray curable polymer and crosslinking agent (B) (hereinafter sometimes referred to as " Adhesive formed by adhesive composition P") (adhesive formed by crosslinking adhesive composition P) is preferable. In addition, in this specification, the (meth)acrylic system means both acrylic acid and methacrylic acid. The same goes for other similar terms. Furthermore, "polymer" also includes the concept of "copolymer".

(1)黏著性組合物P的成分 (1-1)活性能量射線硬化性聚合物(A) 活性能量射線硬化性聚合物(A),以使得具有含有官能基的單體單元之丙烯酸類共聚物(a1)、和具有可與上述官能基鍵結的官能基之含有不飽和基的化合物(a2)進行反應所得到的聚合物為佳。(1) Components of adhesive composition P (1-1) Active energy ray-curable polymer (A) Active energy ray-curable polymer (A) such that an acrylic copolymer (a1) having a functional group-containing monomer unit and an unsaturated group-containing compound having a functional group capable of bonding to the above-mentioned functional group ( a2) The polymer obtained by the reaction is preferred.

上述丙烯酸類共聚物(a1),以包含衍生自含有官能基的單體之結構單元、和衍生自(甲基)丙烯酸烷基酯單體或其衍生物之結構單元為佳。另外,如以上所述,含有官能基的單體所具有的官能基,不僅用於與含有不飽和基的化合物(a2)的反應,也用於與後續描述的交聯劑(B)的反應。當發生與交聯劑(B)的反應時,會在黏著劑中形成交聯結構(三維網格結構),且得到所期望的內聚力。The aforementioned acrylic copolymer (a1) preferably contains a structural unit derived from a monomer containing a functional group and a structural unit derived from an alkyl (meth)acrylate monomer or a derivative thereof. In addition, as described above, the functional group of the functional group-containing monomer is used not only for the reaction with the unsaturated group-containing compound (a2), but also for the reaction with the crosslinking agent (B) described later. . When the reaction with the cross-linking agent (B) occurs, a cross-linked structure (three-dimensional grid structure) is formed in the adhesive, and the desired cohesion is obtained.

作為丙烯酸類共聚物(a1)的結構單元中含有官能基的單體,以在分子內具有聚合性的雙鍵、羥基、羧基、氨基、取代氨基、和環氧基等的官能基之單體為佳。As a monomer containing a functional group in the structural unit of the acrylic copolymer (a1), a monomer having a functional group such as a polymerizable double bond, a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group in the molecule Better.

作為含有羥基的單體,例如,可列舉出(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸2-羥丙酯、(甲基)丙烯酸3-羥丙酯、(甲基)丙烯酸2-羥丁酯、(甲基)丙烯酸3-羥丁酯、(甲基)丙烯酸4-羥丁酯等,且上述材料可以單獨使用或者也可以組合2種以上使用。上述之中,從與含有不飽和基的化合物(a2)進行良好的反應且容易形成所期望的活性能量射線硬化性聚合物(A)的觀點來看,以使用(甲基)丙烯酸4-羥丁酯及(甲基)丙烯酸2-羥乙酯為佳,而且從變得容易滿足前述黏著物性的觀點來看,以使用丙烯酸4-羥丁酯及丙烯酸2-羥乙酯為特佳,且以使用丙烯酸4-羥丁酯為更佳。Examples of monomers containing hydroxyl groups include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, and (meth)acrylic acid. 2-hydroxybutyl, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, etc., and the above-mentioned materials may be used alone or in combination of two or more. Among the above, from the viewpoint of good reaction with the unsaturated group-containing compound (a2) and easy formation of the desired active energy ray-curable polymer (A), 4-hydroxy (meth)acrylic acid is used. Butyl ester and 2-hydroxyethyl (meth)acrylate are preferable, and from the viewpoint of making it easier to satisfy the aforementioned adhesive properties, it is particularly preferable to use 4-hydroxybutyl acrylate and 2-hydroxyethyl acrylate, and It is more preferable to use 4-hydroxybutyl acrylate.

作為含有羧基的單體,例如,可列舉出丙烯酸、甲基丙烯酸、巴豆酸、馬來酸、衣康酸、檸康酸等的烯鍵式不飽和羧酸。上述材料可以單獨使用,也可以組合2種以上使用。Examples of the carboxyl group-containing monomer include ethylenically unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, and citraconic acid. The above-mentioned materials may be used alone or in combination of two or more kinds.

作為含氨基的單體或含有取代氨基的單體,例如,可列舉出(甲基)丙烯酸氨基乙基酯、(甲基)丙烯酸正丁基氨基乙基酯等。上述材料可以單獨使用,也可以組合2種以上使用。Examples of the amino group-containing monomer or the substituted amino group-containing monomer include aminoethyl (meth)acrylate, n-butylaminoethyl (meth)acrylate, and the like. The above-mentioned materials may be used alone or in combination of two or more kinds.

在丙烯酸類共聚物(a1)中,作為構成此聚合物的單體單元,上述衍生自含有官能基的單體之結構單元以含有5質量%以上為佳,以含有10質量%以上為較佳,以含有20質量%以上為特佳,且以含有26質量%以上為更佳。再者,在丙烯酸類共聚物(a1)中,作為構成此聚合物的單體單元,上述衍生自含有官能基的單體之結構單元以含有50質量%以下為佳,以含有40質量%以下為特佳,且以含有35質量%以下為更佳。由於丙烯酸類共聚物(a1)中構成此聚合物的單體單元的含量介於上述範圍內,因此變得容易形成所期望的活性能量射線硬化性聚合物(A),且所得到的黏著劑也變得容易滿足前述黏著物性。再者,也變得具有優異的耐久性(耐酸性、耐鹼性、耐起泡性等)。In the acrylic copolymer (a1), as the monomer unit constituting the polymer, the above-mentioned structural unit derived from the functional group-containing monomer preferably contains 5% by mass or more, and more preferably contains 10% by mass or more It is particularly preferable to contain 20% by mass or more, and it is more preferable to contain 26% by mass or more. Furthermore, in the acrylic copolymer (a1), as the monomer unit constituting the polymer, the above-mentioned structural unit derived from the functional group-containing monomer preferably contains 50% by mass or less, and preferably contains 40% by mass or less It is particularly preferable, and it is more preferable to contain 35% by mass or less. Since the content of the monomer unit constituting the polymer in the acrylic copolymer (a1) is within the above range, it becomes easy to form the desired active energy ray-curable polymer (A), and the resulting adhesive It also becomes easier to satisfy the aforementioned adhesive properties. Furthermore, it has excellent durability (acid resistance, alkali resistance, foam resistance, etc.).

作為丙烯酸類共聚物(a1)的結構單元之(甲基)丙烯酸烷基酯單體,以烷基的碳原子數為1〜20的(甲基)丙烯酸烷基酯單體為佳。烷基可以是直鏈狀或支鏈狀的,也可以具有環狀結構。As the alkyl (meth)acrylate monomer as the structural unit of the acrylic copolymer (a1), an alkyl (meth)acrylate monomer having an alkyl group with 1 to 20 carbon atoms is preferred. The alkyl group may be linear or branched, and may have a cyclic structure.

作為上述烷基的碳原子數為1〜20的(甲基)丙烯酸烷基酯單體,特別是烷基的碳原子數為1~18的(甲基)丙烯酸烷基酯單體,例如,以使用(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯等為佳,且以使用丙烯酸甲酯為特佳。上述材料可以單獨使用1種,也可以組合2種以上使用。As the alkyl (meth)acrylate monomer having 1 to 20 carbon atoms in the above-mentioned alkyl group, particularly the alkyl (meth)acrylate monomer having 1 to 18 carbon atoms in the alkyl group, for example, It is preferable to use methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, etc., and it is particularly preferable to use methyl acrylate. The above-mentioned materials may be used singly or in combination of two or more kinds.

在丙烯酸類共聚物(a1)中,作為構成此聚合物的單體單元,烷基的碳原子數為1~18的(甲基)丙烯酸烷基酯單體以含有1質量%以上為佳,以含有4質量%以上為特佳,且以含有8質量%以上為更佳。再者,在丙烯酸類共聚物(a1)中,作為構成此聚合物的單體單元,烷基的碳原子數為1~18的(甲基)丙烯酸烷基酯單體以含有20質量%以下為佳,以含有16質量%以下為特佳,且以含有12質量%以下為更佳。In the acrylic copolymer (a1), as the monomer unit constituting the polymer, the alkyl (meth)acrylate monomer having 1 to 18 carbon atoms in the alkyl group preferably contains 1% by mass or more. It is particularly preferable to contain 4% by mass or more, and it is more preferable to contain 8% by mass or more. Furthermore, in the acrylic copolymer (a1), as the monomer unit constituting the polymer, the alkyl (meth)acrylate monomer having 1 to 18 carbon atoms in the alkyl group contains 20% by mass or less Preferably, the content is 16% by mass or less, and the content is more preferably 12% by mass or less.

再者,作為烷基的碳原子數為1〜20之(甲基)丙烯酸烷基酯單體,以含有作為均聚物的玻璃轉移溫度(Tg)為-30℃以下(以下有時稱為「低Tg丙烯酸烷基酯」)為佳。由於含有這種低Tg丙烯酸烷基酯作為結構單體單元,因此所得到的黏著劑變得容易表現出適當的黏彈性。如此一來,不僅在常溫環境下,即使在黏著劑暴露於高溫的情況下,也變得容易得到所期望的黏著力,變得容易滿足前述黏著物性。再者,也變得具有優異的耐久性(耐酸性、耐鹼性、耐起泡性等)。Furthermore, as an alkyl (meth)acrylic acid alkyl ester monomer with 1-20 carbon atoms, the glass transition temperature (Tg) as a homopolymer is -30°C or less (hereinafter sometimes referred to as "Low Tg alkyl acrylate") is better. Since such a low Tg alkyl acrylate is contained as a structural monomer unit, the resulting adhesive becomes easy to exhibit appropriate viscoelasticity. In this way, not only in a normal temperature environment, but even when the adhesive is exposed to high temperatures, it becomes easier to obtain the desired adhesive force, and it becomes easier to satisfy the aforementioned adhesive properties. Furthermore, it has excellent durability (acid resistance, alkali resistance, foam resistance, etc.).

作為低Tg丙烯酸烷基酯的較佳範例,例如,可列舉出丙烯酸正丁酯(Tg-55℃)、丙烯酸正辛酯(Tg-65℃)、丙烯酸異辛酯(Tg-58℃)、丙烯酸2-乙基己酯(Tg-70℃)、丙烯酸異壬酯(Tg-58℃)、丙烯酸異癸酯(Tg-60℃)、甲基丙烯酸異癸酯(Tg-41℃)、甲基丙烯酸正十二烷基酯(Tg-65℃)、丙烯酸十三烷基酯(Tg-55℃)、甲基丙烯酸十三烷基酯(Tg-40℃)等。其中,作為低Tg丙烯酸烷基酯,以均聚物的Tg為-45℃以下的丙烯酸烷基酯為較佳,且以Tg為-50℃以下的丙烯酸烷基酯為特佳。具體而言,以丙烯酸正丁酯及丙烯酸2-乙基己酯為特佳。上述材料可以單獨使用,也可以組合2種以上使用。As preferred examples of low Tg alkyl acrylates, for example, n-butyl acrylate (Tg-55°C), n-octyl acrylate (Tg-65°C), isooctyl acrylate (Tg-58°C), 2-ethylhexyl acrylate (Tg-70°C), isononyl acrylate (Tg-58°C), isodecyl acrylate (Tg-60°C), isodecyl methacrylate (Tg-41°C), N-dodecyl acrylate (Tg-65°C), tridecyl acrylate (Tg-55°C), tridecyl methacrylate (Tg-40°C), etc. Among them, as low Tg alkyl acrylates, alkyl acrylates having a homopolymer Tg of -45°C or less are preferred, and alkyl acrylates having a Tg of -50°C or less are particularly preferred. Specifically, n-butyl acrylate and 2-ethylhexyl acrylate are particularly preferred. The above-mentioned materials may be used alone or in combination of two or more kinds.

另外,在將2種以上的低Tg丙烯酸烷基酯組合使用的情況下,從在製程結束之後可容易地將工件從基板剝離的觀點來看,以所使用的低Tg丙烯酸烷基酯之中Tg最低者的含量多為佳。In addition, when two or more kinds of low Tg alkyl acrylates are used in combination, from the viewpoint that the workpiece can be easily peeled from the substrate after the end of the process, among the low Tg alkyl acrylates used The content of the lowest Tg is better.

在丙烯酸類共聚物(a1)中,作為構成此聚合物的單體單元,低Tg丙烯酸烷基酯以含有35質量%以上為佳,以含有45質量%以上為特佳,且以含有55質量%以上為更佳。再者,在丙烯酸類共聚物(a1)中,作為構成此聚合物的單體單元,低Tg丙烯酸烷基酯以含有90質量%以下為佳,以含有80質量%以下為特佳,且以含有70質量%以下為更佳。由於上述低Tg丙烯酸烷基酯的含量介於上述範圍內,因此所得到的黏著劑變得容易滿足前述黏著物性。再者,也變得具有優異的耐久性(耐酸性、耐鹼性、耐起泡性等)。In the acrylic copolymer (a1), as the monomer unit constituting the polymer, the low Tg alkyl acrylate preferably contains 35 mass% or more, particularly preferably 45 mass% or more, and 55 mass% % Or more is more preferable. Furthermore, in the acrylic copolymer (a1), as the monomer unit constituting the polymer, the low Tg alkyl acrylate preferably contains 90% by mass or less, particularly preferably 80% by mass or less, and It is more preferable to contain 70% by mass or less. Since the content of the aforementioned low-Tg alkyl acrylate is within the aforementioned range, the resulting adhesive can easily satisfy the aforementioned adhesive properties. Furthermore, it has excellent durability (acid resistance, alkali resistance, foam resistance, etc.).

再者,在丙烯酸類共聚物(a1)中,也以包含含有氮原子的單體作為構成此聚合物的單體單元為佳。藉由包含含有氮原子的單體,能夠提升與玻璃等的被黏著物(基板)的密合性。作為含有氮原子的單體,可列舉出具有氨基的單體、具有醯胺基的單體、具有含氮雜環的單體等,其中,以具有含氮雜環的單體為佳。再者,從增加在所構成的黏著劑的高級結構中上述含有氮原子的單體衍生部分的自由度的觀點來看,此含有氮原子的單體除了為了形成丙烯酸類共聚物(a1)的聚合所使用的1個聚合性基團以外,以不包含反應性不飽和雙鍵基團為佳。Furthermore, in the acrylic copolymer (a1), it is also preferable to include a monomer containing a nitrogen atom as the monomer unit constituting the polymer. By including the monomer containing nitrogen atoms, it is possible to improve the adhesion with the adherend (substrate) such as glass. The monomer containing a nitrogen atom includes a monomer having an amino group, a monomer having an amide group, a monomer having a nitrogen-containing heterocyclic ring, and the like. Among them, a monomer having a nitrogen-containing heterocyclic ring is preferred. Furthermore, from the viewpoint of increasing the degree of freedom of the above-mentioned nitrogen atom-containing monomer derivation part in the higher structure of the formed adhesive, this nitrogen atom-containing monomer is in addition to forming the acrylic copolymer (a1) In addition to the one polymerizable group used in the polymerization, it is preferable that the reactive unsaturated double bond group is not included.

作為具有含有氮雜環的單體,例如,可列舉出N-(甲基)丙烯醯基嗎啉、N-乙烯基-2-吡咯烷酮、N-(甲基)丙烯醯基吡咯烷酮、N-(甲基)丙烯醯基哌啶、N-(甲基)丙烯醯吡咯烷、N-(甲基)丙烯醯基氮丙啶、(甲基)丙烯酸氮丙啶基乙基酯、2-乙烯基吡啶、4-乙烯基吡啶、2-乙烯基吡嗪、1-乙烯基咪唑、N-乙烯基咔唑、N-乙烯基鄰苯二甲醯亞胺等,其中,以可發揮更優異的黏著力的N-(甲基)丙烯醯基嗎啉為佳,且以N-丙烯醯基嗎啉為特佳。As the monomer having a nitrogen-containing heterocyclic ring, for example, N-(meth)acryloylmorpholine, N-vinyl-2-pyrrolidone, N-(meth)acryloylpyrrolidone, N-( (Meth)acrylic acid piperidine, N-(meth)acrylic acid pyrrolidine, N-(meth)acrylic acid aziridine, (meth)acrylic acid aziridinyl ethyl ester, 2-vinyl Pyridine, 4-vinylpyridine, 2-vinylpyrazine, 1-vinylimidazole, N-vinylcarbazole, N-vinylphthalimide, etc., among which, it can exert more excellent adhesion Strong N-(meth)acryloylmorpholine is preferred, and N-acryloylmorpholine is particularly preferred.

另外,作為含有氮原子的單體,例如,也可以使用(甲基)丙烯醯胺、N-甲基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-叔丁基(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-乙基(甲基)丙烯醯胺、N,N-二甲基氨基丙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-苯基(甲基)丙烯醯胺、二甲基氨基丙基(甲基)丙烯醯胺、N-乙烯基己內醯胺、(甲基)丙烯酸一甲基氨基乙基、(甲基)丙烯酸一乙氨基乙基、(甲基)丙烯酸一甲基氨基丙基、(甲基)丙烯酸單乙氨基丙酯、(甲基)丙烯酸二甲氨基乙酯等。In addition, as the monomer containing a nitrogen atom, for example, (meth)acrylamide, N-methyl(meth)acrylamide, N-methylol(meth)acrylamide, N- Tert-butyl(meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-ethyl(meth)acrylamide, N,N-dimethylaminopropyl (Meth)acrylamide, N-isopropyl(meth)acrylamide, N-phenyl(meth)acrylamide, dimethylaminopropyl(meth)acrylamide, N-ethylene Base caprolactam, (meth)acrylic acid-methylaminoethyl, (meth)acrylic acid-ethylaminoethyl, (meth)acrylic acid-methylaminopropyl, (meth)acrylic acid monoethylaminopropyl Ester, dimethylaminoethyl (meth)acrylate, etc.

以上含有氮原子的單體,可以單獨使用1種,也可以組合2種以上使用。The above nitrogen atom-containing monomers may be used singly or in combination of two or more kinds.

從提升與玻璃等的被黏著物的密合性的觀點來看,在丙烯酸類共聚物(a1)中,作為構成此聚合物的單體單元,含有氮原子的單體以含有1質量%以上為佳,以含有5質量%為較佳,且以含有8質量%以上為特佳。再者,從確保其他成分的調配量的觀點來看,含有氮原子單體的含量以20質量%以下為佳,以16質量%以下為較佳,且以12質量%以下為特佳。由於上述含有氮原子單體的含量介於上述範圍內,因此所得到的黏著劑變得容易滿足前述黏著物性。再者,也變得具有優異的耐久性(耐酸性、耐鹼性、耐起泡性等)。From the viewpoint of improving the adhesion to adherends such as glass, in the acrylic copolymer (a1), as the monomer unit constituting the polymer, the monomer containing a nitrogen atom contains 1% by mass or more Preferably, it is more preferable to contain 5% by mass, and it is particularly preferable to contain 8% by mass or more. Furthermore, from the viewpoint of ensuring the blending amount of other components, the content of the nitrogen atom-containing monomer is preferably 20% by mass or less, more preferably 16% by mass or less, and particularly preferably 12% by mass or less. Since the content of the above-mentioned nitrogen atom-containing monomer is within the above-mentioned range, the obtained adhesive becomes easy to satisfy the above-mentioned adhesive properties. Furthermore, it has excellent durability (acid resistance, alkali resistance, foam resistance, etc.).

可以利用一般的方法使上述含有官能基的單體、與(甲基)丙烯酸酯單體或其衍生物進行共聚合,以得到丙烯酸類共聚物(a1),而除了這些單體以外也可以使甲酸乙烯酯、乙酸乙烯酯、苯乙烯等進行共聚合。General methods can be used to copolymerize the above-mentioned functional group-containing monomers with (meth)acrylate monomers or their derivatives to obtain acrylic copolymers (a1), and in addition to these monomers, Vinyl formate, vinyl acetate, styrene, etc. are copolymerized.

丙烯酸類共聚物(a1)以利用溶液聚合法所得到的溶液聚合物為佳。由於為溶液聚合物,因此容易得到高分子量的聚合物,且由於在高溫下具有黏著力,因此可得到優異的黏著劑。The acrylic copolymer (a1) is preferably a solution polymer obtained by a solution polymerization method. Because it is a solution polymer, it is easy to obtain a high molecular weight polymer, and because it has adhesive force at high temperatures, an excellent adhesive can be obtained.

丙烯酸類共聚物(a1)的聚合樣態可以是隨機(random)共聚物,也可以是嵌段(block)共聚物。The polymerization state of the acrylic copolymer (a1) may be a random copolymer or a block copolymer.

作為含有不飽和基的化合物(a2),只要是具有能夠與丙烯酸類共聚物(a1)中含有官能基的單體單元之官能基產生反應的官能基即可,並沒有特別限定。含有不飽和基的化合物(a2)所具有的官能基,可以根據丙烯酸類共聚物(a1)所具有的官能基的種類適當地選擇。例如,在丙烯酸類共聚物(a1)所具有的官能基為羥基、氨基或取代氨基的情況下,作為含有不飽和基的化合物(a2)所具有的官能基,以異氰酸酯基或環氧基為佳,而在丙烯酸類共聚物(a1)所具有的官能基為環氧基的情況下,作為含有不飽和基的化合物(a2)所具有的官能基,以氨基、羧基或疊氮基為佳。The unsaturated group-containing compound (a2) is not particularly limited as long as it has a functional group capable of reacting with the functional group of the functional group-containing monomer unit in the acrylic copolymer (a1). The functional group that the unsaturated group-containing compound (a2) has can be appropriately selected according to the type of the functional group that the acrylic copolymer (a1) has. For example, when the functional group of the acrylic copolymer (a1) is a hydroxyl group, an amino group, or a substituted amino group, as the functional group of the unsaturated group-containing compound (a2), an isocyanate group or an epoxy group is used as the functional group Preferably, when the functional group of the acrylic copolymer (a1) is an epoxy group, the functional group of the unsaturated group-containing compound (a2) is preferably an amino group, a carboxyl group or an azide group .

再者,在上述含有不飽和基的化合物(a2)中,以在1分子中至少包含1個活性能量射線聚合性的碳-碳雙鍵為佳,以包含1〜6個為特佳,且以包含1~4個為更佳。作為這種含有不飽和基的化合物(a2)的具體範例,例如,可列舉出2-甲基丙烯醯氧基乙基異氰酸酯、間異丙烯基-α,α-二甲基芐基異氰酸酯、甲基丙烯醯基異氰酸酯、異氰酸烯丙酯、1,1-(雙丙烯醯氧基甲基)乙基異氰酸酯;藉由二異氰酸酯化合物或多異氰酸酯化合物、與(甲基)丙烯酸羥乙酯進行反應所得到的丙烯醯基單異氰酸酯化合物;藉由二異氰酸酯化合物或多異氰酸酯化合物、與多元醇化合物、和(甲基)丙烯酸羥乙酯進行反應所得到的丙烯醯基單異氰酸酯化合物;(甲基)丙烯酸縮水甘油酯;(甲基)丙烯酸、(甲基)丙烯酸2-(1-氮丙啶基)乙酯、2-乙烯基-2-噁唑啉、2-異丙烯基-2-噁唑啉等。Furthermore, in the above-mentioned unsaturated group-containing compound (a2), it is preferable to contain at least one active energy ray polymerizable carbon-carbon double bond in one molecule, and it is particularly preferable to contain 1 to 6 carbon-carbon double bonds, and It is more preferable to include 1 to 4. As specific examples of such an unsaturated group-containing compound (a2), for example, 2-methacryloxyethyl isocyanate, m-isopropenyl-α,α-dimethylbenzyl isocyanate, formaldehyde Acrylic isocyanate, allyl isocyanate, 1,1-(bisacryloxymethyl) ethyl isocyanate; by diisocyanate compound or polyisocyanate compound, and hydroxyethyl (meth)acrylate Acrylic monoisocyanate compound obtained by the reaction; an acryl monoisocyanate compound obtained by reacting a diisocyanate compound or a polyisocyanate compound with a polyol compound and hydroxyethyl (meth)acrylate; (methyl) ) Glycidyl acrylate; (meth)acrylic acid, 2-(1-aziridinyl)ethyl (meth)acrylate, 2-vinyl-2-oxazoline, 2-isopropenyl-2-oxa Oxazoline and so on.

相對於上述丙烯酸類共聚物(a1)中含有官能基的單體之莫耳數,上述含有不飽和基的化合物(a2)以使用50莫耳%以上的比例為佳,以使用60莫耳%以上的比例為較佳,以使用70莫耳%以上的比例為特佳,以使用80莫耳%以上的比例為更佳,且以使用88莫耳%以上的比例為最佳。再者,相對於上述丙烯酸類共聚物(a1)中含有官能基的單體之莫耳數,上述含有不飽和基的化合物(a2)以使用99莫耳%以下的比例為佳,以使用95莫耳%以下的比例為特佳,以使用92莫耳%以下的比例為更佳。由於上述含有不飽和基的化合物(a2)的含量介於上述範圍內,因此所得到的黏著劑變得容易滿足前述黏著物性。再者,也變得具有優異的耐久性(耐酸性、耐鹼性、耐起泡性等)。Relative to the number of moles of monomers containing functional groups in the acrylic copolymer (a1), the unsaturated group-containing compound (a2) is preferably used at a ratio of 50 mole% or more, and 60 mole% The above ratio is preferable, and it is particularly preferable to use a ratio of 70 mol% or more, and it is more preferable to use a ratio of 80 mol% or more, and it is most preferable to use a ratio of 88 mol% or more. Furthermore, with respect to the number of moles of monomers containing functional groups in the acrylic copolymer (a1), the unsaturated group-containing compound (a2) is preferably used in a ratio of 99 mole% or less, and 95% The ratio of mol% or less is particularly preferable, and it is more preferable to use a ratio of 92 mol% or less. Since the content of the above-mentioned unsaturated group-containing compound (a2) is within the above-mentioned range, the obtained adhesive becomes easy to satisfy the above-mentioned adhesive properties. Furthermore, it has excellent durability (acid resistance, alkali resistance, foam resistance, etc.).

藉由這種含有不飽和基的化合物(a2)所具有的官能基與前述丙烯酸類共聚物(a1)所具有的官能基進行反應,能夠得到活性能量射線硬化性聚合物(A)。The active energy ray-curable polymer (A) can be obtained by reacting the functional group of the unsaturated group-containing compound (a2) with the functional group of the aforementioned acrylic copolymer (a1).

在丙烯酸類共聚物(a1)和含有不飽和基的化合物(a2)的反應中,可以根據丙烯酸類共聚物(a1)所具有的官能基和含有不飽和基的化合物(a2)所具有的官能基的組合,適當地選擇反應的溫度、壓力、溶劑、時間、有無催化劑、催化劑的種類。如此一來,存在於丙烯酸類共聚物(a1)中的官能基與含有不飽和基的化合物(a2)中的官能基產生反應,不飽和基導入丙烯酸類共聚物(a1)中的側鏈,進而得到活性能量射線硬化性聚合物(A)。In the reaction of the acrylic copolymer (a1) and the unsaturated group-containing compound (a2), the functional group of the acrylic copolymer (a1) and the function of the unsaturated group-containing compound (a2) can be The combination of groups, the reaction temperature, pressure, solvent, time, presence or absence of catalyst, and type of catalyst are appropriately selected. In this way, the functional group existing in the acrylic copolymer (a1) reacts with the functional group in the unsaturated group-containing compound (a2), and the unsaturated group is introduced into the side chain of the acrylic copolymer (a1), Furthermore, an active energy ray-curable polymer (A) was obtained.

以上述方式得到的活性能量射線硬化性聚合物(A)的重量平均分子量(Mw)以10萬以上為佳,以20萬以上為較佳,以40萬以上為特佳,且以60萬以上為更佳。再者,此重量平均分子量(Mw)以150萬以下為佳,以120萬以下為特佳,且以90萬以下為更佳。另外,本說明書中的重量平均分子量(Mw)係藉由凝膠滲透色譜法(gel permeation chromatography,GPC)所測量出的標準聚苯乙烯換算的值。由於上述重量平均分子量(Mw)介於上述範圍內,因此所得到的黏著劑變得容易表現出前述黏著物性。再者,也變得具有優異的耐久性(耐酸性、耐鹼性、耐起泡性等)。The weight average molecular weight (Mw) of the active energy ray-curable polymer (A) obtained in the above manner is preferably 100,000 or more, preferably 200,000 or more, particularly preferably 400,000 or more, and 600,000 or more For better. Furthermore, the weight average molecular weight (Mw) is preferably 1.5 million or less, particularly preferably 1.2 million or less, and more preferably 900,000 or less. In addition, the weight average molecular weight (Mw) in this specification is a value converted from standard polystyrene measured by gel permeation chromatography (GPC). Since the above-mentioned weight average molecular weight (Mw) is within the above-mentioned range, the obtained adhesive becomes easy to exhibit the above-mentioned adhesive properties. Furthermore, it has excellent durability (acid resistance, alkali resistance, foam resistance, etc.).

(1-2)交聯劑(B) 交聯劑(B)藉由含有此交聯劑(B)的黏著性組合物P之加熱等觸發(trigger)活性能量射線硬化性聚合物(A)產生交聯,進而形成三維網格結構。如此一來,所得到的黏著劑的內聚力提高,且黏著力變得更高。(1-2) Crosslinking agent (B) The crosslinking agent (B) is triggered by heating or the like of the adhesive composition P containing the crosslinking agent (B) to generate the crosslinking of the active energy ray-curable polymer (A), thereby forming a three-dimensional grid structure. In this way, the cohesive force of the obtained adhesive is improved, and the adhesive force becomes higher.

作為上述交聯劑(B),只要是可與活性能量射線硬化性聚合物(A)所具有的官能基產生反應即可,例如,可列舉出異氰酸酯類交聯劑、環氧類交聯劑、胺類交聯劑、三聚氰胺類交聯劑、氮丙啶類交聯劑、肼類交聯劑、醛類交聯劑、噁唑啉類交聯劑、金屬醇鹽類交聯劑、金屬螯合物類交聯劑、金屬鹽類交聯劑、銨鹽類交聯劑等。此處,在活性能量射線硬化性聚合物(A)包括含有羥基的單體作為結構單體單元的情況下,以使用與羥基的反應性優異之異氰酸酯類交聯劑作為交聯劑(B)為佳。另外,交聯劑(B)可以單獨使用1種,也可以組合2種以上使用。The above-mentioned crosslinking agent (B) may be capable of reacting with the functional group of the active energy ray-curable polymer (A), for example, isocyanate-based crosslinking agents and epoxy-based crosslinking agents , Amine crosslinkers, melamine crosslinkers, aziridine crosslinkers, hydrazine crosslinkers, aldehyde crosslinkers, oxazoline crosslinkers, metal alkoxide crosslinkers, metals Chelate type crosslinking agent, metal salt type crosslinking agent, ammonium salt type crosslinking agent, etc. Here, when the active energy ray-curable polymer (A) includes a hydroxyl group-containing monomer as a structural monomer unit, an isocyanate-based crosslinking agent having excellent reactivity with the hydroxyl group is used as the crosslinking agent (B) Better. Moreover, a crosslinking agent (B) may be used individually by 1 type, and may be used in combination of 2 or more types.

異氰酸酯類交聯劑至少包含多異氰酸酯化合物。作為多異氰酸酯化合物,例如,可列舉出甲苯二異氰酸酯、二苯基甲烷二異氰酸酯、二甲苯二異氰酸酯等的芳族多異氰酸酯、六亞甲基二異氰酸酯等的脂肪族多異氰酸酯、異佛爾酮二異氰酸酯、氫化二苯甲烷二異氰酸酯等的脂環族多異氰酸酯等、及其縮二脲體、異氰脲酸酯體、還有上述與乙二醇、丙二醇、新戊二醇、三羥甲基丙烷、蓖麻油等的低分子量的含氫活性化合物的反應產物之加合物等。其中,從與羥基的反應性的觀點來看,以使用具有六亞甲基二異氰酸酯的脂肪族異氰酸酯、三羥甲基丙烷改性的甲苯二異氰酸酯等為佳。The isocyanate-based crosslinking agent contains at least a polyisocyanate compound. Examples of the polyisocyanate compound include aromatic polyisocyanates such as toluene diisocyanate, diphenylmethane diisocyanate, and xylene diisocyanate, aliphatic polyisocyanates such as hexamethylene diisocyanate, and isophorone diisocyanate. Alicyclic polyisocyanates such as isocyanate, hydrogenated diphenylmethane diisocyanate, etc., and its biuret body, isocyanurate body, and the above and ethylene glycol, propylene glycol, neopentyl glycol, trimethylol Adducts of reaction products of low molecular weight hydrogen-containing active compounds such as propane and castor oil. Among them, from the viewpoint of reactivity with a hydroxyl group, it is preferable to use an aliphatic isocyanate having hexamethylene diisocyanate, a trimethylolpropane-modified toluene diisocyanate, or the like.

相對於100質量份的活性能量射線硬化性聚合物(A),黏著性組合物P中的交聯劑(B)的含量以0.01質量份以上為佳,以0.1質量份以上為特佳,且以0.3質量份以上為更佳。再者,此含量以10質量份以下為佳,以5質量份以下為較佳,以2質量份以下為特佳,且以0.7質量份以下為更佳。由於交聯劑(B)的含量介於上述範圍內,因此所得到的黏著劑的內聚力適度變高,特別是在高溫下的黏著力變得更高,且變得容易滿足前述黏著物性。再者,也變得具有優異的耐久性(耐酸性、耐鹼性、耐起泡性等)。Relative to 100 parts by mass of the active energy ray-curable polymer (A), the content of the crosslinking agent (B) in the adhesive composition P is preferably 0.01 parts by mass or more, particularly preferably 0.1 parts by mass or more, and It is more preferably 0.3 parts by mass or more. Furthermore, the content is preferably 10 parts by mass or less, preferably 5 parts by mass or less, particularly preferably 2 parts by mass or less, and more preferably 0.7 parts by mass or less. Since the content of the crosslinking agent (B) is within the above range, the cohesive force of the obtained adhesive becomes moderately high, especially the adhesive force at high temperature becomes higher, and it becomes easy to satisfy the aforementioned adhesive properties. Furthermore, it has excellent durability (acid resistance, alkali resistance, foam resistance, etc.).

(1-3)光聚合起始劑(C) 在使用紫外線作為用於將活性能量射線硬化性黏著劑硬化之活性能量射線的情況下,黏著性組合物P以含有光聚合起始劑(C)為佳。如此一來,能夠減少聚合硬化時間及光照射量。(1-3) Photopolymerization initiator (C) In the case of using ultraviolet rays as the active energy ray for curing the active energy ray-curable adhesive, the adhesive composition P preferably contains a photopolymerization initiator (C). In this way, the polymerization curing time and the amount of light irradiation can be reduced.

作為光聚合起始劑(C),具體而言,可列舉出二苯甲酮、苯乙酮、安息香、安息香甲醚、安息香乙醚、安息香異丙醚、安息香異丁醚、安息香苯甲酸、安息香苯甲酸甲酯、安息香二甲基縮酮、2,4-二乙基噻噸酮、1-羥基環己基苯基酮、芐基二苯硫醚、四甲基秋蘭姆單硫化物、偶氮二異丁腈、苯基、二芐基、二乙醯基、β-氯蒽醌、(2,4,6-三甲基芐基二苯基)氧化膦、2-苯并噻唑-N,N-二乙基二硫代氨基甲酸酯、低聚{2-羥基-2-甲基-1-[4-(1-丙烯基)苯基]丙酮}、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、2-羥基-1-{4-[4-(4-(2-羥基-2-甲基-丙醯基)-芐基]苯基]-2-甲基-丙-1-酮等。上述材料可以單獨使用,也可以組合2種以上使用。Specific examples of the photopolymerization initiator (C) include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, and benzoin Methyl benzoate, benzoin dimethyl ketal, 2,4-diethyl thioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, double Nitrogen diisobutyronitrile, phenyl, dibenzyl, diacetyl, β-chloroanthraquinone, (2,4,6-trimethylbenzyldiphenyl) phosphine oxide, 2-benzothiazole-N , N-diethyldithiocarbamate, oligo{2-hydroxy-2-methyl-1-[4-(1-propenyl)phenyl]acetone}, 2,2-dimethoxy -1,2-diphenylethane-1-one, 2-hydroxy-1-{4-[4-(4-(2-hydroxy-2-methyl-propanyl)-benzyl]benzene Yl]-2-methyl-propan-1-one, etc. The above-mentioned materials may be used alone or in combination of two or more kinds.

相對於100質量份的活性能量射線硬化性聚合物(A),黏著性組合物P中的光聚合起始劑(C)的含量以0.4質量份以上為佳,以0.8質量份以上為特佳,且以1.2質量份以上為更佳。另一方面,此含量以10質量份以下為佳,以6質量份以下為特佳,且以4質量份以下為更佳。由於光聚合起始劑(C)的含量介於上述範圍內,因此能夠有效地減少聚合硬化時間及光照射量,且所得到的黏著劑變得容易表現出前述黏著物性。再者,也變得具有優異的耐久性(耐酸性、耐鹼性、耐起泡性等)。Relative to 100 parts by mass of the active energy ray-curable polymer (A), the content of the photopolymerization initiator (C) in the adhesive composition P is preferably 0.4 parts by mass or more, particularly preferably 0.8 parts by mass or more , And more preferably 1.2 parts by mass or more. On the other hand, this content is preferably 10 parts by mass or less, particularly preferably 6 parts by mass or less, and more preferably 4 parts by mass or less. Since the content of the photopolymerization initiator (C) is within the above range, the polymerization hardening time and the amount of light irradiation can be effectively reduced, and the resulting adhesive becomes easy to exhibit the aforementioned adhesive properties. Furthermore, it has excellent durability (acid resistance, alkali resistance, foam resistance, etc.).

(1-4)各種添加劑 在黏著性組合物P中,可以根據所需添加活性能量射線硬化性黏著劑中通常會使用的各種添加劑,例如矽烷偶合劑、紫外線吸收劑、硬化抑制劑、增黏劑、抗氧化劑、光穩定劑、軟化劑、填充劑等。(1-4) Various additives In the adhesive composition P, various additives commonly used in active energy ray-curable adhesives, such as silane coupling agents, ultraviolet absorbers, curing inhibitors, tackifiers, antioxidants, and light stabilizers, can be added as required. Agents, softeners, fillers, etc.

作為硬化抑制劑,例如,可列舉出乙炔醇、2-丙炔-1-醇、2-甲基-3-丁炔-2-醇、3-三甲基甲矽烷氧基丙炔等的乙炔化合物、N,N,N',N'-四甲基乙二胺、N,N-二甲基乙二胺、N,N-二乙基乙二胺、N,N-二丁基乙二胺、N,N-二丁基-1,3-丙二胺、N,N-二甲基-1,3-丙二胺、N,N,N',N'-四乙基乙二胺、N,N-二丁基-1,4-丁二胺、2,2'-聯吡啶等的胺化合物、蘋果酸二甲酯等的1,2-二酯類化合物等。上述材料可以單獨使用1種,也可以組合2種以上使用。Examples of hardening inhibitors include acetylene such as acetylene alcohol, 2-propyn-1-ol, 2-methyl-3-butyn-2-ol, and 3-trimethylsilyloxypropyne. Compound, N,N,N',N'-tetramethylethylenediamine, N,N-dimethylethylenediamine, N,N-diethylethylenediamine, N,N-dibutylethylenediamine Amine, N,N-dibutyl-1,3-propanediamine, N,N-dimethyl-1,3-propanediamine, N,N,N',N'-tetraethylethylenediamine , N,N-Dibutyl-1,4-butanediamine, 2,2'-bipyridine and other amine compounds, and 1,2-diester compounds such as dimethyl malate. The above-mentioned materials may be used singly or in combination of two or more kinds.

相對於100質量份的活性能量射線硬化性聚合物(A),黏著性組合物P中的硬化抑制劑的含量以0.1質量份以上為佳,以1質量份以上為特佳,且以3質量份以上為更佳。再者,此含量以18質量份以下為佳,以12質量份以下為特佳,且以6質量份以下為更佳。由於上述硬化抑制劑的含量介於上述範圍內,因此所得到的黏著劑具有變得容易表現出前述黏著物性的傾向。再者,也變得具有優異的耐久性(耐酸性、耐鹼性、耐起泡性等)。With respect to 100 parts by mass of the active energy ray-curable polymer (A), the content of the curing inhibitor in the adhesive composition P is preferably 0.1 parts by mass or more, particularly preferably 1 part by mass or more, and 3 parts by mass More than one portion is better. Furthermore, the content is preferably 18 parts by mass or less, particularly preferably 12 parts by mass or less, and more preferably 6 parts by mass or less. Since the content of the hardening inhibitor is within the above range, the resulting adhesive tends to easily express the above-mentioned adhesive properties. Furthermore, it has excellent durability (acid resistance, alkali resistance, foam resistance, etc.).

作為矽烷偶合劑,以在分子內具有至少1個烷氧基甲矽烷基且與活性能量射線硬化性聚合物(A)的互溶性良好之有機矽化合物為佳。在使用玻璃基板作為用於固定工件的基板的情況下,使用矽烷偶合劑可使得所得到的黏著劑變得容易表現出對此基板的高密合性。隨著對基板的密合性提高,在黏著劑層與基板密合的狀態下,變得容易將工件從黏著劑層剝離。As the silane coupling agent, an organosilicon compound having at least one alkoxysilyl group in the molecule and having good miscibility with the active energy ray-curable polymer (A) is preferred. In the case of using a glass substrate as a substrate for fixing a workpiece, the use of a silane coupling agent can make the resulting adhesive easily exhibit high adhesion to the substrate. As the adhesion to the substrate improves, it becomes easier to peel the workpiece from the adhesive layer in a state where the adhesive layer and the substrate are in close contact.

再者,作為矽烷偶合劑,以使用具有選自乙烯基、環氧基、苯乙烯基、丙烯醯基、甲基丙烯醯基、氨基、脲基、異氰酸酯基、異氰脲酸酯基、巰基、甲基及硫醇基中的至少1種官能基的矽烷偶合劑為佳。其中,從提升密合性的觀點來看,以使用含有環氧基及巰基中的至少1種官能基的矽烷偶合劑為佳,且以使用含有巰基的矽烷偶合劑為特佳。Furthermore, as the silane coupling agent, a silane coupling agent having a group selected from vinyl group, epoxy group, styryl group, acryl group, methacryl group, amino group, urea group, isocyanate group, isocyanurate group, and mercapto group can be used. , A silane coupling agent with at least one functional group among methyl group and thiol group is preferred. Among them, from the viewpoint of improving adhesion, it is preferable to use a silane coupling agent containing at least one of an epoxy group and a mercapto group, and it is particularly preferable to use a mercapto group-containing silane coupling agent.

如以上所述,在當矽烷偶合劑含有巰基的情況下,此矽烷偶合劑變得可與交聯劑(B)良好地反應。特別是,在交聯劑(B)為異氰酸酯類交聯劑的情況下,矽烷偶合劑中的巰基變得容易與異氰酸酯類交聯劑中的異氰酸酯基良好地反應。另一方面,如前述,交聯劑(B)也具有使活性能量線硬化性聚合物(A)進行交聯的作用。因此,在所形成的黏著劑中,活性能量射線硬化性聚合物(A)藉由交聯劑(B)進行交聯,且矽烷偶合劑透過巰基與此交聯劑(B)結合,進而形成三維網格結構。在這種黏著劑中,矽烷偶合劑所具有的烷氧基甲矽烷基與活性能量射線硬化性聚合物(A)具有適當的距離(特別是在交聯劑(B)為異氰酸酯類交聯劑的情況下,複數異氰酸酯基彼此之間的距離),可推測其在活性能量射線硬化聚合物(A)上為懸鍵的形式。由於烷氧基甲矽烷基如上述以與(經過交聯的)活性能量射線硬化性聚合物(A)具有適當的距離存在,因此可表現出優異的偶合效果,如此一來,即使在所得到的黏著劑經過熱處理的情況下,也變得容易表現出期望的黏著性,結果,根據本實施形態的黏著片變得具有更優異的操作性。As described above, in the case where the silane coupling agent contains a mercapto group, the silane coupling agent becomes able to react well with the crosslinking agent (B). In particular, when the crosslinking agent (B) is an isocyanate-based crosslinking agent, the mercapto group in the silane coupling agent easily reacts with the isocyanate group in the isocyanate-based crosslinking agent. On the other hand, as described above, the crosslinking agent (B) also has a function of crosslinking the active energy ray-curable polymer (A). Therefore, in the formed adhesive, the active energy ray-curable polymer (A) is cross-linked by the cross-linking agent (B), and the silane coupling agent is combined with the cross-linking agent (B) through the sulfhydryl group to form Three-dimensional grid structure. In this adhesive, the alkoxysilyl group of the silane coupling agent has an appropriate distance from the active energy ray-curable polymer (A) (especially when the crosslinking agent (B) is an isocyanate crosslinking agent In the case of the distance between the plural isocyanate groups), it can be inferred that it is in the form of dangling bonds on the active energy ray-curable polymer (A). Since the alkoxysilyl group exists at an appropriate distance from the (crosslinked) active energy ray-curable polymer (A) as described above, it can exhibit an excellent coupling effect. As a result, even in the obtained When the adhesive is heat-treated, it becomes easy to exhibit the desired adhesiveness. As a result, the adhesive sheet according to this embodiment has more excellent handling properties.

再者,在矽烷偶合劑含有上述官能基的情況下,矽烷偶合劑的一分子中的官能基的數量可以為1(單官能基型),或者也可以為複數(多官能基型),而從提升黏著劑層對基板的密合性的觀點來看,以多官能基型為佳。Furthermore, when the silane coupling agent contains the above-mentioned functional groups, the number of functional groups in one molecule of the silane coupling agent may be 1 (monofunctional type) or plural (multifunctional type), and From the viewpoint of improving the adhesion of the adhesive layer to the substrate, a polyfunctional type is preferred.

作為這種矽烷偶合劑,例如,可列舉出乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、甲基丙烯醯氧基丙基三甲氧基矽烷等的聚合性含有不飽和基的矽化合物、3-環氧丙氧基丙基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷等的具有環氧結構的矽化合物、3-巰基丙基三甲氧基矽烷、3-巰基丙基三乙氧基矽烷、3-巰基丙基二甲氧基甲基矽烷等的含有巰基的矽化合物、3-氨基丙基三甲氧基矽烷、N-(2-氨基乙基)-3-氨基丙基三甲氧基矽烷、N-(2-氨基乙基)-3-氨基丙基甲基二甲氧基矽烷等的含有氨基的矽化合物、3-氯丙基三甲氧基矽烷、3-異氰酸根合丙基三乙氧基矽烷、或上述的至少1者與甲基三乙氧基矽烷、乙基三乙氧基矽烷、甲基三甲氧基矽烷、乙基三甲氧基矽烷等的含有烷基的矽化合物之縮合物等。上述材料可以單獨使用1種,也可以組合2種以上使用。Examples of such silane coupling agents include polymerizable unsaturated group-containing silicon compounds such as vinyl trimethoxysilane, vinyl triethoxysilane, and methacryloxypropyl trimethoxysilane. , 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and other silicon compounds with epoxy structure, 3-mercaptopropyltrimethoxysilane Silane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyldimethoxymethylsilane and other mercapto group-containing silicon compounds, 3-aminopropyltrimethoxysilane, N-(2-amino Ethyl)-3-aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane and other amino-containing silicon compounds, 3-chloropropyltrimethyl Oxysilane, 3-isocyanatopropyltriethoxysilane, or at least one of the above and methyltriethoxysilane, ethyltriethoxysilane, methyltrimethoxysilane, ethyl Condensates of alkyl-containing silicon compounds such as trimethoxysilane. The above-mentioned materials may be used singly or in combination of two or more kinds.

相對於100質量份的活性能量射線硬化性聚合物(A),黏著性組合物P中的矽烷偶合劑的含量以0.01質量份以上為佳,以0.05質量份以上為特佳,且以0.10質量份以上為更佳。再者,此含量以1.0質量份以下為佳,以0.5質量份以下為特佳,且以0.3質量份以下為更佳。由於上述硬化抑制劑的含量介於上述範圍內,因此所得到的黏著劑具有變得容易表現出前述黏著物性的傾向。再者,也變得具有優異的耐久性(耐酸性、耐鹼性、耐起泡性等)。Relative to 100 parts by mass of the active energy ray-curable polymer (A), the content of the silane coupling agent in the adhesive composition P is preferably 0.01 parts by mass or more, particularly preferably 0.05 parts by mass or more, and 0.10 parts by mass More than one portion is better. Furthermore, this content is preferably 1.0 part by mass or less, particularly preferably 0.5 part by mass or less, and more preferably 0.3 part by mass or less. Since the content of the hardening inhibitor is within the above range, the resulting adhesive tends to easily express the above-mentioned adhesive properties. Furthermore, it has excellent durability (acid resistance, alkali resistance, foam resistance, etc.).

作為紫外線吸收劑,例如,可列舉出苯并三唑類、二苯甲酮類、苯甲酸酯類、苯并惡嗪酮類、三嗪類、水楊酸苯酯類、氰基丙烯酸酯類、鎳複合鹽類等的化合物。上述材料可以單獨使用1種,也可以組合2種以上使用。Examples of ultraviolet absorbers include benzotriazoles, benzophenones, benzoates, benzoxazinones, triazines, phenyl salicylate, and cyanoacrylates. , Nickel compound salts and other compounds. The above-mentioned materials may be used singly or in combination of two or more kinds.

相對於100質量份的活性能量射線硬化性聚合物(A),黏著性組合物P中的紫外線吸收劑的含量以1質量份以上為佳,以2質量份以上為特佳,且以3質量份以上為更佳。再者,此含量以15質量份以下為佳,以12質量份以下為特佳,且以8質量份以下為更佳。Relative to 100 parts by mass of the active energy ray-curable polymer (A), the content of the ultraviolet absorber in the adhesive composition P is preferably 1 part by mass or more, particularly preferably 2 parts by mass or more, and 3 parts by mass More than one portion is better. Furthermore, the content is preferably 15 parts by mass or less, particularly preferably 12 parts by mass or less, and more preferably 8 parts by mass or less.

(2)黏著性組合物P的製造 可以藉由製造出活性能量射線硬化性聚合物(A),且將所得到的活性能量射線硬化性聚合物(A)、和交聯劑(B)、根據需求的光聚合起始劑(C)及其他添加劑混合,以製造出黏著性組合物P。再者,也可以根據需求在黏著性組合物P中添加稀釋溶劑並充分地混合,以得到利用溶劑稀釋過的黏著性組合物P(塗佈溶液)。(2) Manufacturing of adhesive composition P The active energy ray curable polymer (A) can be produced by combining the obtained active energy ray curable polymer (A), the crosslinking agent (B), and the photopolymerization initiator (C) as required. ) And other additives to produce the adhesive composition P. In addition, a diluting solvent may be added to the adhesive composition P as required and mixed thoroughly to obtain the adhesive composition P (coating solution) diluted with the solvent.

另外,上述各成分的任一者,在以固體形式使用的情況下、或在未被稀釋的狀態下與其他成分混合後會發生沉澱的情況下,也可以先將此成分單獨地溶解或稀釋於稀釋溶劑中之後,才與其他成分混合。In addition, if any of the above-mentioned components is used in a solid form, or when precipitation occurs when mixed with other components in an undiluted state, the component may be dissolved or diluted separately first. It is mixed with other ingredients only after it is in the diluting solvent.

作為上述稀釋溶劑,例如,可列舉出己烷、庚烷、環己烷等的脂肪烴、甲苯、二甲苯等的芳香烴、二氯甲烷、氯乙烷等的鹵化烴、甲醇、乙醇、丙醇、丁醇、1-甲氧基-2-丙醇等的醇、丙酮、甲乙酮、2-戊酮、異佛爾酮(Isophorone)、環己酮等的酮、乙酸乙酯、乙酸丁酯等的酯、乙基溶纖(cellosolve)劑等的溶纖類溶劑等。Examples of the above-mentioned dilution solvent include aliphatic hydrocarbons such as hexane, heptane, and cyclohexane, aromatic hydrocarbons such as toluene and xylene, halogenated hydrocarbons such as dichloromethane and ethyl chloride, methanol, ethanol, and propylene. Alcohols such as alcohol, butanol, 1-methoxy-2-propanol, acetone, methyl ethyl ketone, 2-pentanone, isophorone (Isophorone), ketones such as cyclohexanone, ethyl acetate, butyl acetate And other esters, cellosolves such as ethyl cellosolve (cellosolve), etc.

以上述方式所製備出的塗佈溶液的濃度/黏度,只要是在可以塗佈(coating)的範圍內即可,並沒有特別限制,且能夠根據情況適當地選擇。例如,可將黏著性組合物P的濃度稀釋成10〜60質量%。另外,在得到塗佈溶液時,稀釋溶劑等的添加並非必要條件,只要黏著性組合物P具有可以塗佈的黏度等即可,也可以不添加稀釋溶劑。The concentration/viscosity of the coating solution prepared in the above-mentioned manner is not particularly limited as long as it is within a coating (coating) range, and can be appropriately selected according to the situation. For example, the concentration of the adhesive composition P can be diluted to 10-60% by mass. In addition, when obtaining the coating solution, the addition of a dilution solvent and the like is not essential, as long as the adhesive composition P has a viscosity etc. that can be applied, and the dilution solvent may not be added.

(3)黏著劑層的形成 黏著劑層11可以藉由使得塗佈後的黏著性組合物P進行交聯而形成。黏著性組合物P的交聯以藉由熱處理進行為佳。另外,此熱處理也能夠一併作為在塗佈黏著性組合物P之後的乾燥處理。(3) Formation of adhesive layer The adhesive layer 11 can be formed by crosslinking the adhesive composition P after application. The crosslinking of the adhesive composition P is preferably performed by heat treatment. In addition, this heat treatment can also be used as a drying treatment after the adhesive composition P is applied.

熱處理的加熱溫度以50〜150℃為佳,且以70〜120℃為特佳。再者,加熱時間以10秒~10分鐘為佳,且以50秒~2分鐘為特佳。再者,也以在加熱處理之後設置在常溫(例如,23℃、50%RH)下大約1~2週的固化期間為佳。The heating temperature of the heat treatment is preferably 50 to 150°C, and particularly preferably 70 to 120°C. Furthermore, the heating time is preferably 10 seconds to 10 minutes, and particularly preferably 50 seconds to 2 minutes. Furthermore, it is also preferable to set the curing period at normal temperature (for example, 23° C., 50% RH) for about 1 to 2 weeks after the heat treatment.

藉由上述的加熱處理(及固化),活性能量射線硬化性聚合物(A)可透過交聯劑(B)良好地交聯。By the above-mentioned heat treatment (and curing), the active energy ray-curable polymer (A) can be cross-linked satisfactorily through the cross-linking agent (B).

(4)黏著劑層的厚度 根據本實施形態的黏著片1的黏著劑層11的厚度(根據JIS K7130所測量出的值)的下限值以5μm以上為佳,以10μm以上為特佳,且以15μm以上為更佳。當黏著劑層11的厚度的下限值如以上所述時,黏著力變得更加優異。再者,黏著劑層11的厚度的上限值以50μm以下為佳,以40μm以下為特佳,以30μm以下為更佳,且以25μm以下為最佳。當黏著劑層11的厚度的上限值如以上所述時,變得容易表現出前述黏著物性,特別是易剝離性變得更加優異。再者,也變得具有優異的耐久性(耐酸性、耐鹼性、耐起泡性等)。另外,黏著劑層11可以形成為單層,也可以將複數層積層而形成。(4) The thickness of the adhesive layer The lower limit of the thickness (value measured according to JIS K7130) of the adhesive layer 11 of the adhesive sheet 1 according to the present embodiment is preferably 5 μm or more, particularly preferably 10 μm or more, and more preferably 15 μm or more. When the lower limit of the thickness of the adhesive layer 11 is as described above, the adhesive force becomes more excellent. Furthermore, the upper limit of the thickness of the adhesive layer 11 is preferably 50 μm or less, particularly preferably 40 μm or less, more preferably 30 μm or less, and most preferably 25 μm or less. When the upper limit of the thickness of the adhesive layer 11 is as described above, it becomes easy to express the aforementioned adhesive properties, and in particular, the easy peelability becomes more excellent. Furthermore, it has excellent durability (acid resistance, alkali resistance, foam resistance, etc.). In addition, the adhesive layer 11 may be formed as a single layer, or may be formed by stacking a plurality of layers.

1-2.剝離片 剝離片12a和12b係在使用黏著片1之前保護黏著劑層11,且在使用黏著片1(黏著劑層11)時被剝離。在根據本實施形態的黏著片1中,剝離片12a和12b中的一者或兩者並非絕對必要的。1-2. Peeling sheet The peeling sheets 12a and 12b protect the adhesive layer 11 before using the adhesive sheet 1, and are peeled off when the adhesive sheet 1 (adhesive layer 11) is used. In the adhesive sheet 1 according to the present embodiment, one or both of the release sheets 12a and 12b are not absolutely necessary.

作為剝離片12a和12b,例如,可使用聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、聚甲基戊烯膜、聚氯乙烯膜、氯乙烯共聚物膜、聚對苯二甲酸乙二酯膜、聚萘二甲酸乙二醇酯膜、聚對苯二甲酸丁二酯膜、聚氨酯膜、乙烯乙酸乙烯酯膜、離聚物樹脂膜、乙烯/(甲基)丙烯酸共聚物膜、乙烯/(甲基)丙烯酸酯共聚物膜、聚苯乙烯膜、聚碳酸酯膜、聚醯亞胺膜、氟樹脂膜等。再者,也可使用上述材料的交聯膜。此外,也可以使用上述材料的積層膜。As the release sheets 12a and 12b, for example, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, a polyvinyl chloride film, a vinyl chloride copolymer film, and a polyvinyl chloride film can be used. Ethylene phthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate film, ionomer resin film, ethylene/(meth)acrylic acid Copolymer film, ethylene/(meth)acrylate copolymer film, polystyrene film, polycarbonate film, polyimide film, fluororesin film, etc. Furthermore, crosslinked films of the above-mentioned materials can also be used. In addition, a laminated film of the above-mentioned materials can also be used.

上述剝離片12a和12b的剝離面(特別是與黏著劑層11接觸的表面)以對其施加剝離處理為佳。作為剝離處理所使用的剝離劑,例如,可列舉出醇酸類、聚矽氧類、氟類、不飽和聚酯類、聚烯烴類、蠟類的剝離劑。另外,在剝離片12a和12b之中,以其中一片剝離片為剝離力大的重剝離型剝離片而另一片剝離片為剝離力小的輕剝離型剝離片為佳。The peeling surfaces of the peeling sheets 12a and 12b (especially the surfaces in contact with the adhesive layer 11) are preferably peeled off. Examples of the release agent used in the release treatment include alkyd, silicone, fluorine, unsaturated polyester, polyolefin, and wax release agents. In addition, among the release sheets 12a and 12b, it is preferable that one of the release sheets is a heavy release type with a large release force and the other release sheet is a light release type with a small release force.

剝離片12a和12b的厚度並沒有特別限制,而通常為大約20~150μm。The thickness of the release sheets 12a and 12b is not particularly limited, but is usually about 20 to 150 μm.

2.黏著片的製造 作為黏著片1的一製造例,針對使用了前述黏著性組合物P的情況做說明。將黏著性組合物P的塗佈液塗佈在一片剝離片12a(或12b)的剝離面上,並進行加熱處理使得黏著性組合物P熱交聯以形成塗佈層之後,將另一片剝離片12b(或12a)的剝離面疊加於此塗佈層上。在需要固化期間的情況下,藉由將上述塗佈層放置一段固化期間後形成黏著劑層11,而在不需要固化期間的情況下,上述塗佈層直接作為黏著劑層11。藉由上述方式,可得到上述黏著片1。關於加熱處理及固化的條件如前述內容所記載。2. Manufacture of Adhesive Sheet As a manufacturing example of the adhesive sheet 1, the case where the said adhesive composition P is used is demonstrated. After applying the coating liquid of the adhesive composition P on the peeling surface of one peeling sheet 12a (or 12b), and performing heat treatment to thermally crosslink the adhesive composition P to form a coating layer, the other sheet is peeled off The peeling surface of the sheet 12b (or 12a) is superimposed on this coating layer. In the case where a curing period is required, the adhesive layer 11 is formed by placing the coating layer for a period of curing period, and in the case where a curing period is not required, the coating layer directly serves as the adhesive layer 11. In the above manner, the above-mentioned adhesive sheet 1 can be obtained. The conditions for heat treatment and curing are as described above.

作為上述黏著性組合物P的塗佈液的塗佈方法,例如,可以使用棒塗(bar coating)法、刮刀塗佈(knife coating)法、輥塗(roll coating)法、刮刀(blade coating)塗佈法、模具塗佈(die coating)法、凹版塗佈(gravure coating)法等。As a coating method of the coating liquid of the adhesive composition P, for example, a bar coating method, a knife coating method, a roll coating method, or a blade coating method can be used. Coating method, die coating method, gravure coating method, etc.

3.黏著片的使用 如前述內容所記載,根據本實施形態的黏著片1,適用於在將作為工件之光學部件和電子部件等的裝置(以可撓式裝置為佳)加工、積層、檢查等的製程中固定於基板。另外,在上述的製程結束之後,將工件從基板剝離。3. The use of adhesive sheet As described in the foregoing, the adhesive sheet 1 according to the present embodiment is suitable for fixing in the process of processing, laminating, and inspecting devices such as optical components and electronic components as workpieces (preferably flexible devices). Substrate. In addition, after the above-mentioned process is completed, the workpiece is peeled from the substrate.

圖2繪示出表現了黏著片1的使用狀態之積層體4的剖面圖。根據本實施形態的積層體4係將作為工件的可撓式裝置2、黏著片1的黏著劑層11、和基板3依此順序積層所形成。在這樣的積層體4中,可撓式裝置2透過黏著劑層11穩固地固定於基板3,因此此製程能夠順利進行而不會出問題。FIG. 2 shows a cross-sectional view of the laminated body 4 showing the state of use of the adhesive sheet 1. The laminated body 4 according to this embodiment is formed by laminating the flexible device 2 as a work, the adhesive layer 11 of the adhesive sheet 1, and the substrate 3 in this order. In such a laminated body 4, the flexible device 2 is firmly fixed to the substrate 3 through the adhesive layer 11, so this process can be performed smoothly without problems.

上述製程適合為包括對工件進行加熱處理、或進行工件被隨著一併加熱的處理之製程。作為這種加熱處理的範例,可列舉出金屬氣相沉積製程、密封樹脂等的樹脂硬化製程、退火製程等。根據本實施形態的黏著片1及積層體4,由於具備滿足前述物性的黏著層11,因此即使進行了加熱處理,也能夠在後續藉由進行活性能量射線的照射來良好地降低對工件的黏著力,如此一來能夠容易地將工件從黏著劑層11剝離。The above-mentioned process is suitably a process that includes heating the workpiece or heating the workpiece together. Examples of such heat treatment include a metal vapor deposition process, a resin hardening process such as a sealing resin, and an annealing process. According to the adhesive sheet 1 and the laminated body 4 of this embodiment, since the adhesive layer 11 that satisfies the aforementioned physical properties is provided, even if the heat treatment is performed, the adhesion to the workpiece can be reduced well by subsequent irradiation of active energy rays. In this way, the workpiece can be easily peeled from the adhesive layer 11.

上述加熱處理可以採用與一般的加熱處理相同的條件。例如,加熱溫度以40℃以上為佳,以80℃以上為特佳,且以120℃以上為更佳。再者,加熱溫度以200℃以下為佳,以180℃以下為特佳,且以160℃以下為更佳。再者,加熱時間以5分鐘以上為佳,以10分鐘以上為特佳,且以20分鐘以上為更佳。再者,加熱時間以60分鐘以下為佳,以50分鐘以下為特佳,且以40分鐘以下為更佳。The above-mentioned heat treatment can adopt the same conditions as the general heat treatment. For example, the heating temperature is preferably 40°C or higher, particularly preferably 80°C or higher, and more preferably 120°C or higher. Furthermore, the heating temperature is preferably 200°C or less, particularly preferably 180°C or less, and more preferably 160°C or less. Furthermore, the heating time is preferably 5 minutes or more, particularly preferably 10 minutes or more, and more preferably 20 minutes or more. Furthermore, the heating time is preferably 60 minutes or less, particularly preferably 50 minutes or less, and more preferably 40 minutes or less.

在完成上述製程之後,對黏著劑層11(或可撓式裝置2/基板3)照射活性能量射線,以硬化黏著劑層11,進而降低對工件的黏著力。如此一來,能夠容易地將工件從黏著劑層11剝離。After the above-mentioned process is completed, the adhesive layer 11 (or the flexible device 2/substrate 3) is irradiated with active energy rays to harden the adhesive layer 11, thereby reducing the adhesion to the workpiece. In this way, the workpiece can be easily peeled off from the adhesive layer 11.

作為這種用於剝離工件的活性能量射線,通常使用紫外線、電子束等,而以易於操作的紫外線為特佳。在使用紫外線的情況下,可以用高壓汞燈、聚變燈、氙氣燈等進行照射。再者,其照射條件以照度為50 mW/cm2 以上、1000 mW/cm2 以下為佳。再者,紫外線的積分光度以1500mJ/cm2 以上為佳,且以2000 mJ/cm2 以上為特佳。再者,紫外線的積分光度以5000 mJ/cm2 以下為佳,且以3000 mJ/cm2 以下為特佳。As such active energy rays for peeling the workpiece, ultraviolet rays, electron beams, etc. are generally used, and ultraviolet rays, which are easy to handle, are particularly preferred. In the case of using ultraviolet rays, high-pressure mercury lamps, fusion lamps, xenon lamps, etc. can be used for irradiation. Furthermore, the irradiation conditions are preferably 50 mW/cm 2 or more and 1000 mW/cm 2 or less. Furthermore, the integrated luminosity of the ultraviolet rays is preferably 1500 mJ/cm 2 or more, and particularly preferably 2000 mJ/cm 2 or more. Furthermore, the integrated luminosity of the ultraviolet rays is preferably 5000 mJ/cm 2 or less, and particularly preferably 3000 mJ/cm 2 or less.

以上說明的實施形態係為了易於理解本發明所記載,且並非用於限定本發明而記載的。因此,意味著上述實施形態中所公開的各要件也包含屬於本發明的技術範圍內的所有設計變更和均等物。The embodiments described above are described in order to facilitate the understanding of the present invention, and are not described in order to limit the present invention. Therefore, it means that each requirement disclosed in the above-mentioned embodiment also includes all design changes and equivalents falling within the technical scope of the present invention.

例如,也可以省略黏著片1中的剝離片12a和12b的其中一者或兩者。 [實施例]For example, one or both of the release sheets 12a and 12b in the adhesive sheet 1 may be omitted. [Example]

以下,透過實施例等更具體地說明本發明,然而本發明的範圍並不限定於這些實施例等。Hereinafter, the present invention will be explained more specifically through examples and the like, but the scope of the present invention is not limited to these examples and the like.

[實施例1] 1.黏著性組合物的調配 將50質量份丙烯酸2-乙基己酯、10質量份的丙烯酸正丁酯、10質量份的丙烯醯基嗎啉、和30質量份丙烯酸4-羥基丁酯共聚合所得到的丙烯酸類共聚物、與相對於此丙烯酸類共聚物的丙烯酸4-羥丁酯的莫耳數為90莫耳%之甲基異丁烯醯氧乙基異氰酸酯(MOI)進行反應,進而得到活性能量射線硬化性聚合物。此活性能量射線硬化性聚合物的重量平均分子量(Mw)以後續描述的方法測量得知為70萬。[Example 1] 1. Preparation of adhesive composition Acrylic copolymer obtained by copolymerizing 50 parts by mass of 2-ethylhexyl acrylate, 10 parts by mass of n-butyl acrylate, 10 parts by mass of acrylomorpholine, and 30 parts by mass of 4-hydroxybutyl acrylate , It reacts with methyl isobutylene oxyethyl isocyanate (MOI) whose molar number of 4-hydroxybutyl acrylate relative to the acrylic copolymer is 90 mol% to obtain an active energy ray-curable polymer. The weight average molecular weight (Mw) of this active energy ray-curable polymer is 700,000 measured by the method described later.

將100質量份所得到的活性能量射線硬化性聚合物(以固體成分換算,以下亦同)、0.75質量份作為交聯劑的具有六亞甲基二異氰酸酯之脂肪族異氰酸酯(由日本聚氨酯工業公司所製造,產品名為「Coronate HX」)、5質量份的硬化抑製劑(由東洋化學公司所製造,產品名為「BXX5638」)、3.0質量份作為光聚合起始劑的2-羥基-1-{4-[4-(2-羥基-2-甲基-丙醯基)-芐基]苯基}-2-甲基-丙烷-1-酮(由BASF公司所製造,產品名為「Irgacure 127」)混合於溶劑中,以得到黏著性組合物。100 parts by mass of the obtained active energy ray-curable polymer (calculated as solid content, the same applies hereinafter) and 0.75 parts by mass of aliphatic isocyanate with hexamethylene diisocyanate as a crosslinking agent (produced by Nippon Polyurethane Industry Co., Ltd. Manufactured, the product name is "Coronate HX"), 5 parts by mass of hardening inhibitor (manufactured by Toyo Chemical Company, the product name is "BXX5638"), and 3.0 parts by mass of 2-hydroxy-1 as a photopolymerization initiator -{4-[4-(2-Hydroxy-2-methyl-propanyl)-benzyl]phenyl}-2-methyl-propane-1-one (manufactured by BASF, the product name is " Irgacure 127”) is mixed in a solvent to obtain an adhesive composition.

2.黏著片的製造 將所得到的黏著性組合物的塗佈溶液,使用刮刀塗佈機塗佈於使用聚矽氧類剝離劑對聚對苯二甲酸乙二醇酯膜的單面進行了剝離處理而得到的重剝離型剝離片(由琳得科(Lintec)公司所製造,產品名為「SP-PET751130」)之剝離處理面。接著,在90℃下對塗佈層進行1分鐘的加熱處理,以形成塗佈層。2. Manufacture of Adhesive Sheet The obtained coating solution of the adhesive composition was applied using a knife coater to the weight obtained by peeling off one side of the polyethylene terephthalate film using a silicone-based release agent. The peel-off processing surface of the peel-off type peeling sheet (manufactured by Lintec, the product name is "SP-PET751130"). Next, the coating layer was heated at 90°C for 1 minute to form the coating layer.

之後,將上述所得到的重剝離型剝離片上的塗佈層、和使用聚矽氧類剝離劑對聚矽對苯二甲酸乙二醇酯膜的單面進行了剝離處理而得到的輕剝離型剝離片(由琳得科公司所製造,產品名為「SP-PET 382120」),以此輕剝離型剝離片的剝離處理面與塗佈層接觸的方式互相貼合,並在23℃和50%RH的條件下固化7天,進而製作出由重剝離型剝離片/黏著劑層(厚度:10μm)/輕剝離型剝離片之結構所構成的黏著片。另外,黏著劑層的厚度係根據JIS K7130使用恆壓厚度測量器(由TECLOCK公司所製造,產品名為「PG-02」)所測量出的值。After that, the coating layer on the heavy release release sheet obtained above and the light release type obtained by peeling off one side of the polyethylene terephthalate film using a silicone-based release agent The peeling sheet (manufactured by Lindeco, the product name is "SP-PET 382120"), the lightly peeling peeling sheet is attached to each other in such a way that the peeling surface of the peeling sheet is in contact with the coating layer, and the temperature is at 23°C and 50°C. After curing for 7 days under the condition of %RH, an adhesive sheet composed of a heavy peeling release sheet/adhesive layer (thickness: 10μm)/light peeling peeling sheet was produced. In addition, the thickness of the adhesive layer is a value measured in accordance with JIS K7130 using a constant pressure thickness gauge (manufactured by TECLOCK, product name "PG-02").

此處,前述重量平均分子量(Mw)係使用凝膠滲透色譜法(GPC)在以下的條件下所測量(GPC測量)的聚苯乙烯換算的重量平均分子量。 <測量條件> ‧GPC測量裝置:由東曹(Tosoh)公司所製造,HLC-8320 ‧GPC管柱(依下列順序通過):由東曹(Tosoh)公司所製造 TSK gel super H-H TSK gel super HM-H TSK gel super H2000 ‧測量溶劑:四氫呋喃(tetrahydrofuran) ‧測量溫度:40℃Here, the aforementioned weight average molecular weight (Mw) is a weight average molecular weight in terms of polystyrene measured (GPC measurement) using gel permeation chromatography (GPC) under the following conditions. <Measurement conditions> ‧GPC measuring device: manufactured by Tosoh, HLC-8320 ‧GPC string (pass in the following order): manufactured by Tosoh TSK gel super H-H TSK gel super HM-H TSK gel super H2000 ‧Measuring solvent: tetrahydrofuran (tetrahydrofuran) ‧Measuring temperature: 40℃

[實施例2~12、比較例2~3] 將構成丙烯酸類共聚物的單體的種類及比例、MOI的使用量、活性能量射線硬化性聚合物的重量平均分子量、交聯劑的種類及調配量、光聚合起始劑的種類及調配量、矽烷偶合劑的種類及調配量、以及黏著劑層的厚度更改為如表1所示以外,其餘以相同於實施例1的方式製作黏著片。[Examples 2 to 12, Comparative Examples 2 to 3] The type and ratio of monomers constituting the acrylic copolymer, the amount of MOI used, the weight average molecular weight of the active energy ray curable polymer, the type and amount of crosslinking agent, and the type and amount of photopolymerization initiator , The type and amount of silane coupling agent, and the thickness of the adhesive layer are changed as shown in Table 1, and the rest is the same as in Example 1 to make an adhesive sheet.

[比較例1] 藉由將50質量份丙烯酸2-乙基己酯、10質量份的丙烯酸正丁酯、10質量份的丙烯醯基嗎啉、和30質量份丙烯酸4-羥基丁酯共聚合,以得到丙烯酸類共聚物。此丙烯酸類共聚物的重量平均分子量(Mw)以後續描述的方法測量得知為65萬。另外,在表1「活性能量線硬化性聚合物的重量平均分子量」的欄位中,針對比較例1,記載了對於丙烯酸類共聚物的上述測定結果。[Comparative Example 1] By copolymerizing 50 parts by mass of 2-ethylhexyl acrylate, 10 parts by mass of n-butyl acrylate, 10 parts by mass of acrylomorpholine, and 30 parts by mass of 4-hydroxybutyl acrylate to obtain acrylic Copolymer. The weight average molecular weight (Mw) of this acrylic copolymer is 650,000 measured by the method described later. In addition, in the column of "weight average molecular weight of active energy ray-curable polymer" in Table 1, the above-mentioned measurement results for the acrylic copolymer are described for Comparative Example 1.

將100質量份所得到的丙烯酸類共聚物、0.75質量份作為交聯劑的具有六亞甲基二異氰酸酯之脂肪族異氰酸酯(由日本聚氨酯工業公司所製造,產品名為「Coronate HX」)、5質量份的硬化抑製劑(由東洋化學公司所製造,產品名為「BXX5638」)、3.0質量份作為光聚合起始劑的2-羥基-1-{4-[4-(2-羥基-2-甲基-丙醯基)-芐基]苯基}-2-甲基-丙烷-1-酮(由BASF公司所製造,產品名為「Irgacure 127」)混合於溶劑中,以得到黏著性組合物。100 parts by mass of the obtained acrylic copolymer, 0.75 parts by mass of aliphatic isocyanate with hexamethylene diisocyanate as a crosslinking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., product name "Coronate HX"), 5 Parts by mass of hardening inhibitor (manufactured by Toyo Chemical Company, product name "BXX5638"), 3.0 parts by mass of 2-hydroxy-1-{4-[4-(2-hydroxy-2) as a photopolymerization initiator -Methyl-propanyl)-benzyl]phenyl}-2-methyl-propan-1-one (manufactured by BASF, product name "Irgacure 127") is mixed in a solvent to obtain adhesiveness combination.

除了使用如上述所得到的黏著性組合物以外,其餘以相同於實施例1的方式製造黏著片。Except that the adhesive composition obtained as described above was used, the adhesive sheet was manufactured in the same manner as in Example 1.

[試驗例1](凝膠分率的測量) 將在實施例及比較例中所得到的黏著片切割成80mm×80mm的尺寸,且將此黏著劑層包覆於聚酯網(網眼尺寸為200)之中,用精密天平秤量其質量,並藉由扣除上述聚酯網本身的質量,進而計算出只有黏著劑的質量。此時的質量設為M1。[Test Example 1] (Measurement of Gel Fraction) The adhesive sheets obtained in the examples and comparative examples were cut into a size of 80mm×80mm, and the adhesive layer was wrapped in a polyester mesh (mesh size of 200), and the mass was measured with a precision balance. And by deducting the quality of the polyester net itself, and then calculate the quality of only the adhesive. The mass at this time is set to M1.

接著,將包覆於上述聚酯網中的黏著劑,在室溫(23℃)下浸入乙酸乙酯中24小時。之後,取出黏著劑,在溫度為23℃、相對濕度為50%的環境下風乾24小時,並進一步在80℃的烘箱中乾燥12小時。在乾燥之後,用精密天平秤量其質量,並藉由扣除上述聚酯網本身的質量,進而計算出只有黏著劑的質量。此時的質量設為M2。Next, the adhesive coated in the polyester net was immersed in ethyl acetate at room temperature (23° C.) for 24 hours. After that, the adhesive was taken out, air-dried for 24 hours in an environment with a temperature of 23°C and a relative humidity of 50%, and further dried in an oven at 80°C for 12 hours. After drying, weigh its mass with a precision balance, and by subtracting the mass of the polyester net itself, the mass of only the adhesive is calculated. The mass at this time is set to M2.

針對以上述方式得到的質量M1及M2,以(M2/M1)×100的算法,算出在照射活性能量射線之前的狀態下的黏著劑層的凝膠分率G1 (%)。結果如表2所示。 Regarding the masses M1 and M2 obtained in the above manner, the gel fraction G 1 (%) of the adhesive layer in the state before the active energy ray is irradiated is calculated by the algorithm of (M2/M1)×100. The results are shown in Table 2.

再者,對在實施例及比較例中所得到的黏著片的黏著劑層,在下列的紫外線照射條件下隔著重剝離型剝離片照射紫外線。針對此經紫外線照射的黏著劑層,以與上述相同的方式測量出凝膠分率,並將照射了活性能量射線之後的黏著劑層的凝膠分率設為G2 (%)。結果如表2所示。 <紫外線照射條件> ‧使用高壓汞燈 ‧照度為200 mW/cm2 ,積分光度為2000 mJ/cm2 ‧UV照度·光量計使用Eye Graphics公司所製造的產品「UVPF-A1」In addition, the adhesive layer of the adhesive sheet obtained in the Example and the comparative example was irradiated with ultraviolet rays through the heavy peelable release sheet under the following ultraviolet irradiation conditions. With respect to the adhesive layer irradiated with ultraviolet rays, the gel fraction was measured in the same manner as described above, and the gel fraction of the adhesive layer after the active energy ray was irradiated was G 2 (%). The results are shown in Table 2. <Ultraviolet radiation conditions> ‧Using a high-pressure mercury lamp ‧Illuminance is 200 mW/cm 2 , integrated luminosity is 2000 mJ/cm 2 ‧UV illuminance and light meter use the product "UVPF-A1" manufactured by Eye Graphics

進一步算出凝膠分率G2 (%)相對於如上述所測量到的凝膠分率G1 (%)的比例(G2 /G1 )。其結果亦如表2所示。Furthermore, the ratio (G 2 /G 1 ) of the gel fraction G 2 (%) to the gel fraction G 1 (%) measured as described above was calculated. The results are also shown in Table 2.

[試驗例2](儲存彈性模量的測量) 將剝離片從在實施例及比較例中所得到的黏著片剝離,並將複數層積層出厚度為3mm的黏著劑層。從所得到黏著劑層的積層體衝壓出直徑為8mm的圓柱體(高度為3mm),並將其作為樣本。[Test Example 2] (Measurement of Storage Elastic Modulus) The release sheet was peeled from the adhesive sheets obtained in the examples and comparative examples, and a plurality of layers were laminated to form an adhesive layer having a thickness of 3 mm. A cylinder with a diameter of 8 mm (height of 3 mm) was punched out from the laminate of the obtained adhesive layer, and this was used as a sample.

根據JIS K7244-6:1999的標準,使用黏彈性測量裝置(由Physica公司所製造,產品名為「MCR300」),利用扭轉剪力法,在以下的條件下測量出上述樣本的儲存彈性模量(MPa)。結果如表2中在照射活性能量射線之前的狀態下的儲存彈性模量G'1 所示。 測量頻率:1 Hz 測量溫度:23℃According to JIS K7244-6:1999, using a viscoelasticity measuring device (manufactured by Physica, the product name is "MCR300"), the torsional shear method is used to measure the storage elastic modulus of the above sample under the following conditions (MPa). The results are shown in Table 2 in the storage elastic modulus G′ 1 in the state before the active energy ray is irradiated. Measuring frequency: 1 Hz Measuring temperature: 23℃

再者,在前述紫外線照射條件下,對以與上述相同的方式所得到的樣本照射紫外線之後,以與上述相同的方式測量出儲存彈性模量(MPa)。結果如表2中在照射活性能量射線之後的儲存彈性模量G'2 所示。Furthermore, under the aforementioned ultraviolet irradiation conditions, after irradiating the sample obtained in the same manner as described above with ultraviolet rays, the storage elastic modulus (MPa) was measured in the same manner as described above. The results are shown in Table 2 as the storage elastic modulus G′ 2 after irradiation with active energy rays.

進一步算出儲存彈性模量G'2 (MPa)相對於如上述所測量到的儲存彈性模量G'2 (MPa)的比例(G'2 /G'1 )。其結果亦如表2所示。Further calculates a storage elastic modulus G '2 (MPa) is measured as described above with respect to the storage elastic modulus G' 2 (MPa) ratio (G '2 / G' 1 ). The results are also shown in Table 2.

[試驗例3](黏著力的測量) 將輕剝離型剝離片從在實施例及比較例中所得到的黏著片剝離,並將露出的黏著劑層貼合至具有作為襯底材料的易黏著層之聚對苯二甲酸乙二醇酯(PET)膜(由東洋紡公司所製造,產品名為「PET A4300」),厚度:25μm)的易黏著層,進而得到重剝離型剝離片/黏著劑層/PET膜之積層體。將所得到的積層體切割成寬度為25mm、長度為100mm,並將其作為樣本。[Test Example 3] (Measurement of Adhesion) The lightly peelable release sheet was peeled off from the adhesive sheets obtained in the examples and comparative examples, and the exposed adhesive layer was bonded to polyethylene terephthalate having an easy-adhesive layer as a backing material (PET) film (manufactured by Toyobo, product name "PET A4300", thickness: 25μm) easy-adhesive layer, and then a layered body of heavy peeling release sheet/adhesive layer/PET film. The obtained laminate was cut into a width of 25 mm and a length of 100 mm, and this was used as a sample.

在23℃、50%RH的環境下,將重剝離型剝離片從上述樣本剝離,且在23℃、50%RH的環境下,使用2kg的橡膠輥(rubber roller)對作為樹脂膜的環烯烴聚合物(COP)膜(厚度:40μm)的單面貼附露出的黏著劑層。之後,在剝離速度為300mm/min、剝離角度為180度的條件下,將黏著劑層從樹脂膜剝離,並測量此時的黏著力(N/25mm)。另外,除了此處記載的條件以外,其餘根據JIS Z0237:2009的標準進行測量。將藉此得到的黏著力定義為照射活性能量射線之前的黏著力F0 (N/25mm)。結果如表2所示。In an environment of 23°C and 50%RH, the heavy-peelable release sheet was peeled from the above sample, and in an environment of 23°C and 50%RH, a 2kg rubber roller was used to apply the cycloolefin as the resin film. The exposed adhesive layer is attached to one side of a polymer (COP) film (thickness: 40μm). After that, under the conditions of a peeling speed of 300 mm/min and a peeling angle of 180 degrees, the adhesive layer was peeled from the resin film, and the adhesive force (N/25mm) at this time was measured. In addition, the measurement was performed in accordance with the standard of JIS Z0237:2009 except for the conditions described here. The adhesive force thus obtained is defined as the adhesive force F 0 (N/25mm) before the active energy ray is irradiated. The results are shown in Table 2.

再者,將以與上述相同的方式所製作出的樣本在150℃、50%RH的高溫條件下放置30分鐘,以進行加熱處理。之後,放回室溫環境下,直到樣本的溫度下降至室溫。以與上述相同的方式測量此樣本的黏著力,並將其作為加熱處理後的黏著力F1 (N/25mm)。結果如表2所示。Furthermore, the sample produced in the same manner as described above was placed under high temperature conditions of 150° C. and 50% RH for 30 minutes for heating treatment. After that, put it back to room temperature until the temperature of the sample drops to room temperature. The adhesive force of this sample was measured in the same way as above, and it was taken as the adhesive force F 1 (N/25mm) after the heat treatment. The results are shown in Table 2.

再者,將以與上述相同的方式所製作出的樣本在150℃、50%RH的高溫條件下放置30分鐘以進行加熱處理之後,放回室溫環境下。在前述紫外線照射條件下,隔著重剝離型剝離片對溫度回到室溫的樣本的黏著劑層照射紫外線。以與上述相同的方式測量出上述經過紫外線照射的黏著劑層的黏著力,並將其作為在加熱處理及照射活性能量射線之後的黏著力F2 (N/25mm)。結果如表2所示。Furthermore, the sample produced in the same manner as described above was placed under a high temperature condition of 150° C. and 50% RH for 30 minutes for heating treatment, and then returned to a room temperature environment. Under the aforementioned ultraviolet irradiation conditions, the adhesive layer of the sample whose temperature has returned to room temperature is irradiated with ultraviolet rays through the heavy peeling release sheet. The adhesive force of the adhesive layer irradiated with ultraviolet rays was measured in the same manner as described above, and this was used as the adhesive force F 2 (N/25 mm) after heat treatment and active energy ray irradiation. The results are shown in Table 2.

進一步分別算出黏著力F1 (N/25mm)相對於如上述所測量到的初期黏著力F0 (N/25mm)的比例(F1 /F0 )、黏著力F2 (N/25mm)相對於初期黏著力F0 (N/25mm)的比例(F2 /F0 )、以及黏著力F2 (N/25mm)相對於黏著力F1 (N/25mm)的比例(F2 /F1 )。這些結果如表2所示。Further each adhesive force F 1 (N / 25mm) calculating the ratio as described above on the measured initial adhesive force F 0 (N / 25mm) to (F 1 / F 0), the adhesive force F 2 (N / 25mm) relative The ratio of the initial adhesion force F 0 (N/25mm) (F 2 /F 0 ), and the ratio of the adhesion force F 2 (N/25mm) to the adhesion force F 1 (N/25mm) (F 2 /F 1 ). These results are shown in Table 2.

[試驗例4](製程評估) 準備作為工件的環烯烴聚合物(COP)膜(厚度:40μm)。將輕剝離型剝離片從在實施例及比較例中所得到的黏著片剝離,並將露出的黏著劑層貼合至上述工件的單面,進而得到重剝離型剝離片/黏著劑層/COP膜之積層體。將所得到的積層體切割成寬度為2.5cm、長度為10cm(黏著劑層與工件接觸的表面的面積:25 mm2 )。[Test Example 4] (Process Evaluation) A cycloolefin polymer (COP) film (thickness: 40 μm) as a workpiece was prepared. The lightly peelable release sheet was peeled from the adhesive sheets obtained in the examples and comparative examples, and the exposed adhesive layer was bonded to one side of the above-mentioned workpiece to obtain a heavy peelable release sheet/adhesive layer/COP The laminated body of the film. The obtained laminate was cut into a width of 2.5 cm and a length of 10 cm (the area of the surface of the adhesive layer in contact with the workpiece: 25 mm 2 ).

在23℃、50%RH的環境下,將重剝離型剝離片從上述積層體剝離,且將露出的黏著劑層貼附至鈉鈣玻璃(由日本板玻璃公司所製造),使用栗原製作所公司所製造的高壓滅菌釜(autoclave)在0.5MPa、50℃下加壓20分鐘,並將其作為樣本。將所得到的樣本在150℃、50%RH的高溫條件下放置30分鐘,以進行加熱處理。針對上述加熱處理後的樣本,確認在COP膜與黏著劑層之間的界面上浮起及剝離的狀態、以及COP膜固定於黏著劑層上的狀態,並根據以下的基準進行製程評估。結果如表2的製程評估A所示。 ◎:界面沒有發生浮起/剝離,且COP膜良好地固定於黏著劑層上。 ○:僅在積層體的邊緣部分發現界面有少許的浮起/剝離,而COP膜良好地固定於黏著劑層上。 △:雖然COP膜固定於黏著劑層上,但發現界面有浮起/剝離。 ╳:發現界面有浮起/剝離,而且COP膜無法固定於黏著劑層上。In an environment of 23°C and 50% RH, the heavy-peelable release sheet was peeled from the laminate, and the exposed adhesive layer was attached to soda lime glass (manufactured by Nippon Plate Glass Co., Ltd.), using Kurihara Manufacturing Co., Ltd. The manufactured autoclave was pressurized at 0.5 MPa and 50°C for 20 minutes, and this was used as a sample. The obtained sample was placed under high temperature conditions of 150° C. and 50% RH for 30 minutes for heat treatment. For the above heat-treated samples, the state of floating and peeling at the interface between the COP film and the adhesive layer, and the state of the COP film fixed on the adhesive layer were confirmed, and the process evaluation was performed according to the following criteria. The results are shown in Table 2 Process Evaluation A. ⊚: No floating/peeling occurs at the interface, and the COP film is well fixed to the adhesive layer. ○: A slight floating/peeling of the interface was observed only at the edge portion of the laminate, and the COP film was well fixed to the adhesive layer. △: Although the COP film is fixed on the adhesive layer, floating/peeling at the interface is observed. ╳: It is found that the interface is floating/peeling, and the COP film cannot be fixed on the adhesive layer.

接著,針對在上述製程評估A中得到「◎」、「○」或「△」的積層體,在前述紫外線照射條件下,從其COP膜之側的表面照射紫外線。接著,將COP膜從黏著劑層剝離,並針對此時的狀態根據以下的基準進行製程評估。結果如表2的製程評估B所示。 ◎:幾乎不需要剝離力就能夠容易地將COP膜剝離。 ○:雖然需要剝離力,但能夠將COP膜剝離。 ╳:無法將COP膜剝離。Next, with respect to the laminate obtained in the above process evaluation A with "⊚", "◯" or "△", under the aforementioned ultraviolet irradiation conditions, ultraviolet rays are irradiated from the surface on the side of the COP film. Next, the COP film was peeled from the adhesive layer, and the state at this time was evaluated according to the following criteria. The results are shown in Table 2 Process Evaluation B. ⊚: The COP film can be easily peeled off with almost no peeling force. ○: Although a peeling force is required, the COP film can be peeled off. ╳: The COP film cannot be peeled off.

[試驗例5](耐酸性及耐鹼性的評估) 將在實施例及比較例中所得到的黏著片的黏著劑層夾設於環烯烴聚合物(COP)膜(厚度:40μm)、與鈉鈣玻璃(由日本板玻璃公司所製造)之間,以製作出積層體。[Test Example 5] (Evaluation of acid resistance and alkali resistance) The adhesive layer of the adhesive sheet obtained in the examples and comparative examples was sandwiched between a cycloolefin polymer (COP) film (thickness: 40 μm) and soda lime glass (manufactured by Nippon Plate Glass Co., Ltd.), To make a laminated body.

將上述積層體浸漬於加熱至50℃的硫酸水溶液(硫酸濃度:0.1N)中30分鐘。之後,將上述積層體從硫酸水溶液中取出,以目視確認黏著劑層是否有氣泡、浮起或剝離,並根據以下基準評估耐酸性。結果如表2所示。 ○:完全沒有氣泡、浮起及剝離。 ╳:經確認有氣泡、浮起或剝離。The laminate was immersed in an aqueous sulfuric acid solution (sulfuric acid concentration: 0.1N) heated to 50° C. for 30 minutes. After that, the layered body was taken out from the sulfuric acid aqueous solution, and whether the adhesive layer had bubbles, floating, or peeling was visually confirmed, and the acid resistance was evaluated based on the following criteria. The results are shown in Table 2. ○: No bubbles, floating, and peeling occurred at all. ╳: It is confirmed that there are bubbles, floating or peeling.

再者,將以與上述相同的方式製造的積層體浸漬於加熱至50℃的氫氧化鈉水溶液(氫氧化鈉濃度:0.1N)中30分鐘。之後,將上述積層體從氫氧化鈉水溶液中取出,以目視確認黏著劑層是否有氣泡、浮起或剝離,並根據與上述相同的基準評估耐鹼性。結果如表2所示。Furthermore, the layered body manufactured in the same manner as described above was immersed in an aqueous sodium hydroxide solution (sodium hydroxide concentration: 0.1 N) heated to 50° C. for 30 minutes. After that, the laminate was taken out from the sodium hydroxide aqueous solution, and whether the adhesive layer had bubbles, floats, or peeling was visually confirmed, and the alkali resistance was evaluated based on the same criteria as the above. The results are shown in Table 2.

[試驗例6](耐起泡(blister)性的評估) 將在實施例及比較例中所得到的黏著片的黏著劑層夾設於單面設置了由氧化銦錫(ITO)所構成的透明導電膜之聚對苯二甲酸乙二醇酯膜(由尾池工業公司所製造,ITO-PET膜,厚度:125μm)的透明導電膜、與鈉鈣玻璃(由日本板玻璃公司所製造)之間,以得到出積層體。[Test Example 6] (Evaluation of Blister Resistance) The adhesive layers of the adhesive sheets obtained in the examples and comparative examples were sandwiched on one side of a polyethylene terephthalate film (made of transparent conductive film made of indium tin oxide (ITO)). ITO-PET film, thickness: 125μm) made by Oike Kogyo Co., Ltd., a transparent conductive film, and soda lime glass (manufactured by Nippon Plate Glass Co., Ltd.) to obtain a laminate.

將所得到的積層體在50℃、0.5MPa的條件下進行30分鐘的高壓滅菌處理之後,在常壓、23℃、50%RH的條件下放置15小時。接著,將其在85℃、85%RH的耐久條件下保存72小時。然後,以目視確認黏著劑層是否有氣泡、浮起或剝離,並根據以下基準評估耐起泡性。結果如表2所示。 ◎:完全沒有氣泡、浮起及剝離。 ○:僅在積層體的邊緣部分發現少許的氣泡、浮起或剝離。 △:整個積層體出現5處以下的氣泡、浮起或剝離。 ╳:整個積層體出現6處以上的氣泡、浮起或剝離。After autoclaving the obtained layered body under the conditions of 50°C and 0.5 MPa for 30 minutes, it was allowed to stand for 15 hours under the conditions of normal pressure, 23°C, and 50% RH. Next, it was stored for 72 hours under durable conditions of 85°C and 85% RH. Then, visually confirm whether the adhesive layer has bubbles, float, or peel, and evaluate the blistering resistance based on the following criteria. The results are shown in Table 2. ◎: There is no air bubbles, floating, and peeling at all. ○: A few bubbles, floating, or peeling are found only in the edge portion of the laminate. △: 5 bubbles, floating, or peeling occurred in the entire laminate. ╳: There are more than 6 bubbles, floating or peeling in the whole laminate.

再者,將在實施例及比較例中所得到的黏著片的黏著劑層夾設於環烯烴聚合物(COP)膜(厚度:40μm)、與鈉鈣玻璃(由日本板玻璃公司所製造)之間,以製作出積層體,並針對此積層體,以與上述相同的方式評估耐起泡性。結果如表2所示。Furthermore, the adhesive layers of the adhesive sheets obtained in the examples and comparative examples were sandwiched between a cycloolefin polymer (COP) film (thickness: 40 μm) and soda lime glass (manufactured by Nippon Plate Glass Co., Ltd.) In the meantime, a layered body was produced, and for this layered body, the blistering resistance was evaluated in the same manner as described above. The results are shown in Table 2.

此處,表1中所記載的縮寫等的詳細內容如下。 [活性能量射線硬化性聚合物] 2EHA:丙烯酸2-乙基己酯 BA:丙烯酸正丁酯 ACMO:N-丙烯醯基嗎啉 MA:丙烯酸甲酯 4HBA:丙烯酸4-羥基丁酯 MOI:甲基丙烯醯氧基乙基異氰酸酯 [交聯劑] Coronate HX:具有六亞甲基二異氰酸酯之脂肪族異氰酸酯(由日本聚氨酯工業公司所製造,產品名為「Coronate HX」) BHS8515:三羥甲基丙烷改性的甲苯二異氰酸酯(由東洋化學公司所製造,產品名為「BHS8515」) [光聚合起始劑] Irgacure 127:2-羥基-1-{4-[4-(2-羥基-2-甲基-丙醯基)-芐基]苯基}-2-甲基-丙烷-1-酮(由BASF公司所製造,產品名為「Irgacure 127」) Omnirad 500:質量比為1:1的1-羥基環己基苯基酮和二苯甲酮的混合物(由BASF公司所製造,產品名為「Omnirad 500」) [矽烷偶合劑] X-12-1156:含巰基的矽烷偶合劑(信越化學工業公司所製造,產品名為「X-12-1156」,多官能基型矽烷偶合劑) KBM-403:含環氧基的矽烷偶合劑(信越化學工業公司所製造,產品名為「KBM-403」,單官能基型矽烷偶合劑)Here, the details of the abbreviations and the like described in Table 1 are as follows. [Active energy ray-curable polymer] 2EHA: 2-ethylhexyl acrylate BA: n-butyl acrylate ACMO: N-acryloylmorpholine MA: methyl acrylate 4HBA: 4-hydroxybutyl acrylate MOI: Methacryloxyethyl isocyanate [Crosslinking agent] Coronate HX: Aliphatic isocyanate with hexamethylene diisocyanate (manufactured by Japan Polyurethane Industry Co., Ltd., product name "Coronate HX") BHS8515: Trimethylolpropane modified toluene diisocyanate (manufactured by Toyo Chemical Co., Ltd., product name "BHS8515") [Photopolymerization initiator] Irgacure 127: 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propanyl)-benzyl]phenyl}-2-methyl-propane-1-one (from BASF Manufactured by the company, the product name is "Irgacure 127") Omnirad 500: a mixture of 1-hydroxycyclohexyl phenyl ketone and benzophenone with a mass ratio of 1:1 (manufactured by BASF, product name "Omnirad 500") [Silane Coupling Agent] X-12-1156: Silane coupling agent containing sulfhydryl group (manufactured by Shin-Etsu Chemical Co., Ltd., product name is "X-12-1156", multifunctional silane coupling agent) KBM-403: Epoxy-containing silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., product name is "KBM-403", monofunctional silane coupling agent)

[表1]

Figure 02_image001
[Table 1]
Figure 02_image001

[表2]

Figure 02_image003
[Table 2]
Figure 02_image003

由表2中的初期黏著力F0 及黏著力F1 的結果可清楚得知,在實施例中所製造的黏著片,在照射紫外線之前的狀態下,能夠對工件表現出優異的黏著力。特別是,在實施例中所製造的黏著片,在進行了加熱處理之後,也表現出良好的黏著力F1 。由製程評估A的結果可清楚得知,表現出這種特性之根據實施例的黏著片,在預定的加熱處理之後也能夠良好地固定住工件。From the results of the initial adhesion force F 0 and the adhesion force F 1 in Table 2, it is clear that the adhesive sheet manufactured in the embodiment can exhibit excellent adhesion to the workpiece in the state before the ultraviolet ray is irradiated. In particular, the adhesive sheets manufactured in the examples also exhibited good adhesive force F 1 after heat treatment. From the result of process evaluation A, it is clear that the adhesive sheet according to the embodiment exhibiting this characteristic can also hold the workpiece well after the predetermined heat treatment.

另一方面,從黏著力F2 的結果可清楚得知,在實施例中所製造的黏著片由於照射紫外線而對工件的黏著力顯著地下降。由製程評估B的結果可清楚得知,表現出這種特性之根據實施例的黏著片,藉由照射預定的紫外線,能夠容易地將工件剝離。 [產業利用性]On the other hand, it is clear from the results of the adhesive force F 2 that the adhesive sheet manufactured in the example has a significant decrease in adhesive force to the workpiece due to ultraviolet radiation. From the result of process evaluation B, it is clear that the adhesive sheet according to the embodiment exhibiting such characteristics can easily peel off the workpiece by irradiating predetermined ultraviolet rays. [Industrial Utilization]

根據本發明的黏著片,適合用於在可撓式裝置的加工、積層、檢查等的製程中所使用的製程用黏著片,特別是適合用於包括加熱處理的製程中所使用的製程用黏著片。The adhesive sheet according to the present invention is suitable for process adhesive sheets used in processes such as processing, lamination, and inspection of flexible devices, and is particularly suitable for process adhesive sheets used in processes including heat treatment sheet.

1:黏著片 11:黏著劑層 12a,12b:剝離片 2:工件(可撓式裝置) 3:基板 4:積層體1: Adhesive sheet 11: Adhesive layer 12a, 12b: peeling sheet 2: Workpiece (flexible device) 3: substrate 4: Layered body

[圖1]係根據本發明的一實施形態之黏著片的剖面圖。 [圖2]係根據本發明的一實施形態之積層體的剖面圖。[Fig. 1] is a cross-sectional view of an adhesive sheet according to an embodiment of the present invention. Fig. 2 is a cross-sectional view of a laminate according to an embodiment of the present invention.

1:黏著片 1: Adhesive sheet

11:黏著劑層 11: Adhesive layer

12a,12b:剝離片 12a, 12b: peeling sheet

Claims (10)

一種黏著片,其係至少包括黏著劑層的黏著片,其中前述黏著片用於在製程中透過前述黏著劑層將工件固定於基板且在製程結束之後將前述工件從前述黏著劑層剝離之用途,且前述黏著劑層由活性能量射線硬化性黏著劑所構成,且其中在將前述黏著片的初期黏著力設為F0 ,且將在150℃下加熱30分鐘然後進一步照射活性能量射線之後前述黏著片的黏著力設為F2 時,前述黏著力F2 相對於初期黏著力F0 的比例(F2 /F0 )為0.3以下。An adhesive sheet, which is an adhesive sheet comprising at least an adhesive layer, wherein the adhesive sheet is used for fixing a workpiece to a substrate through the adhesive layer during a manufacturing process and peeling the workpiece from the adhesive layer after the process is completed , And the adhesive layer is composed of an active energy ray curable adhesive, and the initial adhesive force of the adhesive sheet is set to F 0 , and the adhesive will be heated at 150° C. for 30 minutes and then further irradiated with active energy rays. When the adhesive force of the adhesive sheet is F 2 , the ratio of the aforementioned adhesive force F 2 to the initial adhesive force F 0 (F 2 /F 0 ) is 0.3 or less. 如請求項1所述之黏著片,其中在對前述黏著劑層照射活性能量射線之後,前述黏著劑層在23℃下的儲存彈性模量為0.1MPa以上、2MPa以下。The adhesive sheet according to claim 1, wherein after the adhesive layer is irradiated with active energy rays, the storage elastic modulus of the adhesive layer at 23° C. is 0.1 MPa or more and 2 MPa or less. 如請求項1所述之黏著片,其中前述活性能量射線硬化性黏著劑包括矽烷偶合劑。The adhesive sheet according to claim 1, wherein the active energy ray-curable adhesive includes a silane coupling agent. 如請求項1所述之黏著片,其中前述初期黏著力F0 為0.5N/25mm以上、80N/25mm以下。The adhesive sheet according to claim 1, wherein the aforementioned initial adhesive force F 0 is 0.5N/25mm or more and 80N/25mm or less. 如請求項1所述之黏著片,其中在150℃下加熱30分鐘之後前述黏著片的黏著力F1 為0.5N/25mm以上、80N/25mm以下。The adhesive sheet according to claim 1, wherein the adhesive force F 1 of the adhesive sheet after heating at 150° C. for 30 minutes is 0.5 N/25 mm or more and 80 N/25 mm or less. 如請求項1所述之黏著片,其中前述初期黏著力F0 為0.01N/25mm以上、8N/25mm以下。The adhesive sheet according to claim 1, wherein the aforementioned initial adhesive force F 0 is 0.01N/25mm or more and 8N/25mm or less. 如請求項1所述之黏著片,其中前述工件係可撓式裝置。The adhesive sheet according to claim 1, wherein the aforementioned workpiece is a flexible device. 如請求項1所述之黏著片,其中前述用途包括固定於前述基板上的前述工件之加熱。The adhesive sheet according to claim 1, wherein the aforementioned use includes heating of the aforementioned workpiece fixed on the aforementioned substrate. 如請求項1所述之黏著片,其中前述黏著片包括2片剝離片,且前述黏著劑層夾設於前述剝離片之間並接觸前述2片剝離片的剝離面。The adhesive sheet according to claim 1, wherein the adhesive sheet includes two release sheets, and the adhesive layer is sandwiched between the release sheets and contacts the release surfaces of the two release sheets. 一種積層體,其將可撓式裝置、如請求項1~9中任一項所述之黏著片的前述黏著劑層、及基板依此順序積層所形成。A laminated body formed by laminating a flexible device, the aforementioned adhesive layer of the adhesive sheet according to any one of claims 1 to 9, and a substrate in this order.
TW109112421A 2019-06-10 2020-04-14 Adhesive sheet and laminate excellent in handleability even when heat treatment is performed TW202104482A (en)

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