TW202045615A - 成形材料用樹脂組成物、成形體及結構體 - Google Patents

成形材料用樹脂組成物、成形體及結構體 Download PDF

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Publication number
TW202045615A
TW202045615A TW109109223A TW109109223A TW202045615A TW 202045615 A TW202045615 A TW 202045615A TW 109109223 A TW109109223 A TW 109109223A TW 109109223 A TW109109223 A TW 109109223A TW 202045615 A TW202045615 A TW 202045615A
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TW
Taiwan
Prior art keywords
temperature
resin composition
heat generation
aforementioned
components
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TW109109223A
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English (en)
Chinese (zh)
Inventor
下村恵人
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日商住友電木股份有限公司
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Publication of TW202045615A publication Critical patent/TW202045615A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
TW109109223A 2019-03-20 2020-03-19 成形材料用樹脂組成物、成形體及結構體 TW202045615A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2019-052396 2019-03-20
JP2019052396 2019-03-20

Publications (1)

Publication Number Publication Date
TW202045615A true TW202045615A (zh) 2020-12-16

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TW109109223A TW202045615A (zh) 2019-03-20 2020-03-19 成形材料用樹脂組成物、成形體及結構體

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JP (1) JP6885519B2 (ja)
TW (1) TW202045615A (ja)
WO (1) WO2020189711A1 (ja)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015137344A (ja) * 2014-01-24 2015-07-30 住友ベークライト株式会社 封止用エポキシ樹脂組成物、及び半導体装置
KR102451573B1 (ko) * 2014-11-20 2022-10-07 다우 글로벌 테크놀로지스 엘엘씨 촉진제 조성물
CN109890894B (zh) * 2016-11-02 2020-04-21 住友电木株式会社 环氧树脂组合物和结构体

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Publication number Publication date
JPWO2020189711A1 (ja) 2021-04-30
JP6885519B2 (ja) 2021-06-16
WO2020189711A1 (ja) 2020-09-24

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