TW202044694A - Electrical connection connector and manufacturing method therefor - Google Patents

Abstract

Provided is a connector located between a test device and a device to be tested so as to electrically connect the test device with the device to be tested. The connector is stacked in a vertical direction and has first and second conductive sheets capable of conducting in the vertical direction. The first conductive sheet includes an insulating material and can perform conduction in the vertical direction. The second conductive sheet includes the insulating material and can perform conduction in the vertical direction. The first and second conductive sheets are stacked and bonded so as to be capable of performing conduction in the vertical direction. The bonding is formed through chemical bonding between molecules of the insulating materials of the first and second conductive sheets.

Description

Connector for electrical connection and manufacturing method thereof

The invention relates to a connector which is located between the inspection device and the inspected device and electrically connects the inspection device and the inspected device.

In order to perform electrical inspection on the inspected device, a connector that contacts the inspected device and the inspection device to electrically connect the inspected device and the inspection device is used in the art. The connector transmits the electrical signal of the inspection device to the inspected device, and transmits the electrical signal of the inspected device to the inspection device. As such connectors, pogo pin test sockets and conductive rubber sheets are widely known in the art.

The pogo pin test socket has pogo pins that are pressed in the up and down directions according to an external force applied to the inspected device. The pogo pin test socket needs to accommodate the components of the pogo pin, so it is difficult to have a thinner thickness, and it is difficult to apply to the terminals of the inspected device with a fine pitch.

The conductive rubber sheet can be elastically deformed according to an external force applied to the inspected device. The conductive rubber sheet has a plurality of conductive parts that electrically connect the inspected device and the inspection device, and an insulating part that separates the conductive parts. The insulating part may include hardened silicone rubber. The conductive rubber sheet is advantageous in that it can be manufactured at less than the manufacturing cost of the pogo pin test socket, and has a very thin thickness that does not damage the terminals of the device under inspection. Therefore, in the inspection field of the inspected device, try to replace the pogo pin test socket with a conductive rubber sheet.

The pogo pin test socket is thicker than the conductive rubber sheet due to its structure for accommodating pogo pins. Therefore, in order to replace the pogo pin test socket with a conductive rubber sheet, the parts that attach the pogo pin test socket to the inspection device must be redesigned to be suitable for the conductive rubber sheet. Therefore, the general cost will only increase, and the inspection device cannot be used according to the original design. As a countermeasure to solve such disadvantages, a conductive rubber sheet having a thickness such as that of a pogo pin test socket can also be considered. However, when considering the structure of the conductive rubber sheet, it is difficult to manufacture the conductive rubber sheet to a specific thickness or more.

Regarding the replacement of the pogo pin test socket with a conductive rubber sheet, Korean Patent Publication No. 10-2006-0123910 proposes to arrange a similar conductive rubber sheet under a conductive rubber sheet. However, simply arranging two conductive rubber sheets up and down or using an adhesive to bond the two conductive rubber sheets together cannot solve the disadvantages such as increased resistance, decreased conductivity, and changes in the relative position of the sheets arranged up and down.

[The problem to be solved by the invention]

An embodiment of the present invention provides a multilayer connector having an increased thickness without decreasing conductivity due to an increase in resistance. An embodiment of the present invention provides a multilayer connector formed by chemical bonding of materials constituting the connector without using physical bonding. An embodiment of the present invention provides a multilayer connector in which the joint structure is not damaged even if it is repeatedly pressurized. An embodiment of the present invention provides a method of manufacturing the connector of the above embodiment. [Technical means to solve the problem]

One aspect of the embodiment of the present invention relates to a connector that is located between the inspection device and the inspected device to electrically connect the inspection device and the inspected device. The connector of one embodiment includes a first conductive sheet and a second conductive sheet laminated in the vertical direction. The first conductive sheet contains an insulating material and can conduct electricity in the vertical direction. The second conductive sheet contains an insulating material and can conduct electricity in the vertical direction. The first conductive sheet and the second conductive sheet are laminated and joined so as to be conductive in the vertical direction. The bonding is achieved by chemical bonding between the insulating material molecules of the first conductive sheet and the insulating material molecules of the second conductive sheet.

In one embodiment, the area where the first conductive sheet and the second conductive sheet are joined includes the atoms of the insulating substance molecules of the first conductive sheet, and the atomic groups formed by bonding the oxygen atoms and the atoms of the insulating substance molecules of the second conductive sheet . The radical may also be included in a partial area of the first conductive sheet and a partial area of the second conductive sheet.

In one embodiment, the first conductive sheet and the second conductive sheet respectively include: a plurality of conductive parts, which can conduct electricity in the vertical direction, and at least include an insulating material; and an insulating part, which separates the plurality of conductive parts in a horizontal direction , Contains insulating material. The conductive portion of the first conductive sheet and the conductive portion of the second conductive sheet are joined by chemical bonding between molecules of the insulating substance. In addition, the insulating portion of the first conductive sheet and the insulating portion of the second conductive sheet are joined by chemical bonding between molecules of the insulating substance.

In one embodiment, one of the first conductive sheet and the second conductive sheet has at least one protrusion protruding in the vertical direction, and the other of the first conductive sheet and the second conductive sheet has a fitting in the vertical direction The depression of the protrusion. The plurality of conductive portions of the first conductive sheet and the plurality of conductive portions of the second conductive sheet are aligned in the vertical direction by the fitting between the protruding portion and the recessed portion.

In one embodiment, the insulating material of the connector may be silicone rubber.

Another aspect of the embodiment of the present invention relates to a method for manufacturing a connector that is located between the inspection device and the inspected device to electrically connect the inspection device and the inspected device. A method of manufacturing a connector of an embodiment includes the steps of providing a first conductive sheet and a second conductive sheet. The first conductive sheet has a first surface facing in the up-down direction, can conduct electricity in the up-down direction and contains an insulating material. 2 The conductive sheet has a second surface corresponding to the first surface in the up and down direction, which can conduct electricity in the up and down direction and contains an insulating substance; the insulating substance molecules on the first surface and the insulating substance molecules on the second surface have adhesive functional groups The step of reorganizing the first surface and the second surface; and the first surface and the second surface are joined by a chemical bond between the adhesive functional group on the first surface and the adhesive functional group on the second surface. The step of electrically laminating the first conductive sheet and the second conductive sheet in the vertical direction.

In one embodiment, the adhesive functional group is a hydroxyl group, and the first surface and the second surface are joined by a chemical bond between the hydroxyl group on the first surface and the hydroxyl group on the second surface.

In one embodiment, through the step of recombining the first surface and the second surface, the functional group is then bonded to the atoms of the insulating substance molecules on the first surface and the atoms of the insulating substance molecules on the second surface. By the step of laminating the first conductive sheet and the second conductive sheet, the chemical bond between the adhesive functional group on the first surface and the adhesive functional group on the second surface is generated and the insulating substance molecules of the first conductive sheet The atom group formed by the atom, the oxygen atom and the atom of the insulating substance molecule of the second conductive sheet is contained in the area where the first surface and the second surface are joined.

In one embodiment, the step of recombining the first surface and the second surface is performed by irradiating the first surface and the second surface with ultraviolet rays in an atmosphere containing oxygen.

In one embodiment, the step of reforming the first surface and the second surface is performed by generating plasma on the first surface and the second surface in an atmosphere containing oxygen.

In one embodiment, the step of recombining the first surface and the second surface is performed by corona discharge on the first surface and the second surface in an atmosphere containing oxygen. [Effects of Invention]

According to the connector of an embodiment, conductive sheets are laminated, and the surfaces of the conductive sheets are reorganized to have adhesive functional groups, and are joined by chemical bonding between the adhesive functional groups. The bonding of the surface is achieved by chemical bonding between the insulating material molecules constituting the conductive sheet through adhesive functional groups. By bonding the conductive sheets as described above, the bonded and laminated conductive sheets can have a strong and highly reliable bonding structure. In particular, the multilayer connector of one embodiment eliminates the use of adhesive conductive sheets for bonding, and therefore can have an increased thickness without a decrease in conductivity caused by the adhesive. In addition, the conductive sheet is chemically bonded on the entire surface of the joint. Therefore, even if the connector is repeatedly pressurized due to repeated inspections of the inspected device, the connector with laminated conductive sheet can remain strong for a long time. The joint structure.

The embodiments of the present invention are illustrated for the purpose of explaining the technical idea of the present invention. The scope of rights of the present invention is not limited to the following embodiments or specific descriptions of these embodiments.

As long as there is no other definition, all technical terms and scientific terms used in the present invention have the meanings commonly understood by those with common sense in the technical field to which the present invention belongs. All the terms used in the present invention are selected for the purpose of describing the present invention more clearly, not for limiting the scope of rights of the present invention.

As long as the expressions such as "include", "have", "have", etc. used in the present invention do not mention other meanings in the sentence or sentence containing the corresponding expression, it should be understood as having the possibility of including other embodiments The open-ended terms (open-ended terms).

As long as no other meanings are mentioned, the singular expression described in the present invention may include the plural meaning, and this situation is equally applicable to the singular expression described in the scope of the invention application.

The expressions such as "first" and "second" used in the present invention are used to distinguish plural constituent elements from each other, and do not limit the order or importance of corresponding constituent elements.

In the present invention, when a certain component is referred to as being “connected” or “coupled” to another component, it should be understood that the certain component can be directly connected or combined with another component, or can be Use other new components as a medium to connect or combine.

The direction indicator of "upper" used in the present invention is based on the direction in which the connector is positioned relative to the inspection device, and the direction indicator of "lower" refers to the opposite direction of upper. The direction indicator of "up and down direction" used in the present invention includes an upper direction and a lower direction, but it should be understood that it does not refer to a specific one of the upper direction and the lower direction.

The embodiments will be described with reference to the embodiments shown in the accompanying drawings. In the accompanying drawings, the same or corresponding components are given the same reference signs. In addition, in the description of the following embodiments, repeated description of the same or corresponding constituent elements may be omitted. However, even if the description of the relevant constituent elements is omitted, it does not mean that such constituent elements are not included in a certain embodiment. Furthermore, the disclosed embodiment of the manufacturing method may include part or all of the steps shown in the figure. The steps shown in the figure can be carried out sequentially, at least two of the steps shown in the figure can be carried out at the same time, or at least one of the steps shown in the figure can be carried out depending on another step.

The embodiments described below and the examples shown in the accompanying drawings relate to a connector for electrically connecting two electronic devices. In the application example of the connector of the embodiment, one of the above two electronic devices may be an inspection device, and the other of the above two electronic devices may be an inspected device inspected by the inspection device. Therefore, the connector of the embodiment can be used to electrically connect the inspection device and the inspected device when the inspected device is electrically inspected. As an example, the connector of the embodiment can be used for the final electrical inspection of the inspected device in the subsequent process in the manufacturing process of the semiconductor device. However, the inspection example of the connector of the application embodiment is not limited to the above-mentioned inspection.

Fig. 1 shows an example of a connector to which an embodiment is applied. In order to illustrate the embodiments, FIG. 1 shows an exemplary shape of a connector, an electronic device configuring the connector, and an electronic device contacting the connector.

1, a connector 100 of an embodiment is disposed between two electronic devices and electrically connects the two electronic devices. In the example shown in FIG. 1, one of the two electronic devices may be the inspection device 10, and the other may be the inspected device 20 inspected by the inspection device 10. When performing an electrical inspection on the inspected device 20, the connector 100 contacts the inspection device 10 and the inspected device 20 respectively to electrically connect the inspection device 10 and the inspected device 20 to each other.

As an example, the connector 100 is a sheet-shaped structure that can be coupled to the test socket 30. The test socket 30 may have a frame 31 for holding and supporting the connector 100, and can be attached to the socket housing 40 in a removable manner by the frame 31. The socket housing 40 can be attached to the inspection device 10 in a removable manner. The socket housing 40 accommodates the device to be inspected 20 that is transported to the inspection device 10 by the conveying device, so that the device to be inspected 20 is located in the inspection device 10.

The inspected device 20 may be a semiconductor package, but it is not limited to this. The semiconductor packaging system uses resin materials to encapsulate semiconductor IC (Integrated Circuit) chips, multiple lead frames, and multiple terminals into a hexahedral semiconductor device. The aforementioned semiconductor IC chip may be a memory IC chip or a non-memory IC chip. As the above-mentioned terminal, pins or solder balls can be used. The device under inspection 20 shown in FIG. 1 has a plurality of hemispherical terminals 21 on its lower side.

The inspection device 10 can inspect the electrical characteristics, functional characteristics, and operating speed of the inspected device 20. The inspection device 10 may have a plurality of terminals 11 capable of outputting electrical test signals and receiving response signals in the board for performing inspection.

The connector 100 can be arranged in such a way that it contacts the terminal 11 of the inspection device 10 through the test socket 30 and the socket housing 40. The terminal 21 of the inspected device 20 is electrically connected to the corresponding terminal 11 of the inspection device 10 through the connector 100. That is, the connector 100 electrically connects the terminal 21 of the inspected device and the terminal 11 of the inspection device corresponding to the terminal 21 of the inspected device along the vertical direction VD, thereby performing the inspection of the inspected device 20 by the inspection device 10.

The connector 100 of an embodiment includes a first conductive sheet 110 and a second conductive sheet 120 that can conduct VD in the vertical direction, respectively. In the connector 100, the first conductive sheet 110 and the second conductive sheet 120 are laminated so as to be conductive in the vertical direction VD and joined in the vertical direction VD. FIG. 1 shows the laminated form in which the second conductive sheet is arranged above the first conductive sheet, but this is only an example.

The first conductive sheet 110 and the second conductive sheet 120 include an insulating material having elasticity, and most of the components other than the constituent elements that perform VD conduction in the vertical direction may include insulating material molecules. The bonding of the first conductive sheet 110 and the second conductive sheet 120 is realized on the corresponding surface facing the upper and lower direction VD of the conductive sheet by chemical bonding between the molecules of the material forming the conductive sheet (for example, molecules of insulating substances).

The connector 100 includes laminated first and second conductive sheets 110 and 120, so the connector 100 has flexibility, and has an increased thickness and an increased pressing amount in the vertical direction VD. If an external force is applied to the connector 100 at the bottom in the vertical direction VD, the first conductive sheet 110 and the second conductive sheet 120 can be elastically deformed in the downward direction and the horizontal direction HD. The aforementioned external force can be generated by the pusher device pressing the inspected device 20 toward the inspection device 10 side. With this external force, the terminal 21 of the inspected device and the connector 100 can contact in the vertical direction VD, and the connector 100 and the terminal 11 of the inspection device can contact in the vertical direction VD. If the above-mentioned external force is removed, the connector 100 can be restored to its original shape.

The first conductive sheet 110 includes a plurality of first conductive portions 111 and first insulating portions 112. The plurality of first conductive portions 111 are configured to conduct electricity in the vertical direction VD, and the first insulating portion 112 insulates the plurality of first conductive portions 111. The second conductive sheet 120 has a structure similar to that of the first conductive sheet 110. The second conductive sheet 120 includes a plurality of second conductive portions 121 and second insulating portions 122. The plurality of second conductive portions 121 are configured to be conductive in the vertical direction VD, and the second insulating portion 122 insulates the plurality of second conductive portions 121.

In the first conductive sheet 110 and the second conductive sheet 120 to be joined, the first conductive portion 111 and the second conductive portion 121 are at least partially joined by the chemical bond between the insulating substance molecules, and the first insulating portion 112 and the second The insulating portion 122 is joined by chemical bonding between molecules of the insulating substance. In addition, in the first conductive sheet 110 and the second conductive sheet 120 to be joined, the first conductive portion 111 and the second conductive portion 121 are aligned in the vertical direction VD, and the first conductive portion 111 and the second conductive portion 121 are in each The ends are contacted in a conductive manner. The first conductive portion 111 is in contact with the lower end of the second conductive portion 121 at its upper end in a conductive manner, and is in contact with the terminal 11 of the inspection device 10 at its lower end. The second conductive portion 121 is in contact with the terminal 21 of the device under inspection 20 at its upper end, and is in contact with the upper end of the first conductive portion 111 at its lower end in a conductive manner. Thereby, in the connector 100, the first conductive portion 111 and the second conductive portion 121 contacting and joining in the vertical direction VD are connected to the terminal 11 and the terminal corresponding to the first conductive portion 111 and the second conductive portion 121 A conductive path in the up and down direction is formed between 21. Therefore, the test signal of the inspection device 10 can be transmitted from the terminal 11 through the first and second conductive portions 111, 121 to the terminal 21 of the inspected device 20, and the response signal of the inspected device 20 can be transmitted from the terminal 21 through the first and The second conductive parts 111 and 121 are transmitted to the terminal 11 of the inspection device 10. The upper and lower ends of the first conductive portion 111 may form the same plane as the upper surface and the lower surface of the first insulating portion 112 or slightly protrude from it. The upper and lower ends of the second conductive portion 121 and the upper surface and the lower surface of the second insulating portion 122 may form the same plane or slightly protrude from it.

The planar arrangement of the above-mentioned conductive parts can be arranged in various ways according to the planar arrangement of the terminals 21 of the device under inspection 20. In the first conductive sheet 110, the first conductive parts 111 may be arranged in a matrix form or a pair of matrix forms in the quadrangular first insulating part 112. Alternatively, the first conductive portions 111 may be arranged in a plurality of rows along each side of the first insulating portion 112 of the quadrilateral. The second conductive portions 121 of the second conductive sheet 120 may have the same planar arrangement as that of the first conductive portions 111.

For the description of the embodiment of the connector, refer to FIGS. 2 to 6. 2 to 6 schematically show the shape of the connector, the shape of the conductive part, the shape of the element constituting the conductive part, and the shape of the insulating part. These are only examples selected for understanding the embodiment.

Figures 2 and 3 show a connector 를 of one embodiment of the separation of the conductive sheet, and Figure 4 shows the bonding and lamination of the conductive sheet shown in Figure 2.

2 and 3, the connector 100 of an embodiment includes a first conductive sheet 110 and a second conductive sheet 120 that are bonded and laminated along the vertical direction VD. The first conductive sheet 110 includes a plurality of first conductive portions 111 and first insulating portions 112. The plurality of first conductive portions 111 are separated from each other in the horizontal directions HD1 and HD2 by the first insulating portion 112, and are insulated from each other by the first insulating portion 112. The second conductive sheet 120 includes a plurality of second conductive portions 121 and second insulating portions 122. The plurality of second conductive portions 121 are separated from each other in the horizontal directions HD1 and HD2 by the second insulating portion 122, and are insulated from each other by the second insulating portion 122.

In the laminated first and second conductive sheets 110, 120, the first and second conductive portions 111, 121 that are in contact with each other function as conductive portions between the inspection device and the device to be inspected, and perform signal transmission in the vertical direction VD . The first and second conductive portions 111 and 121 may have a cylindrical shape extending in the vertical direction VD. In this cylindrical shape, the diameter in the middle can be smaller than the diameters of the upper and lower ends. Alternatively, the diameter of the end contacting the terminal of the device to be inspected or the terminal of the inspection device may be equal to or smaller than the diameter of the end located on the opposite side of such an end.

Each conductive part may include a plurality of conductive particles contacting in the vertical direction, or may include one or more conductors arranged in the vertical direction and in a linear or fibrous shape. In one embodiment, the first conductive portion 111 includes a plurality of first conductive metal particles 113 that can be contacted in a VD manner in the vertical direction, and the second conductive portion 121 includes a plurality of first conductive metal particles 113 that can be contacted in a VD manner in the vertical direction. A plurality of second conductive metal particles 123. The first and second conductive metal particles 113 and 123 may be the same or different. Conductive metal particles that can be contacted in a manner that can conduct electricity in the up and down direction form a conductive path in a conductive portion for signal transmission in the up and down direction.

The surface of the core particle can be coated with a highly conductive metal to form the conductive metal particle. The core particles may include metal materials such as iron, nickel, and cobalt, or may include elastic resin materials. As the highly conductive metal coated on the surface of the core particle, gold, silver, rhodium, platinum, chromium, etc. can be used.

In each conductive part, an insulating material can fill between conductive metal particles. The insulating material may be the same as the insulating material forming the insulating part. That is, the conductive part partially contains the insulating material forming the insulating part, and the insulating material of the conductive part can exist from one end of the conductive part to the other end. In addition, the insulating material forming the insulating portion can hold the plurality of conductive metal particles in the shape of the conductive portion. Therefore, each conductive portion containing an insulating material has elasticity in the vertical direction VD and the horizontal directions HD1 and HD2. When the conductive parts are pressed downward by the terminals of the inspected device, the conductive parts can slightly expand in the horizontal directions HD1 and HD2, and the insulating parts can allow such expansion of the conductive parts.

Each insulating portion can form a quadrilateral elastic area of each conductive sheet. Each insulating part is formed as a single elastic body, and has elasticity in the vertical direction VD and the horizontal direction HD. The insulating part maintains the shape of the conductive part and maintains the conductive part in the up-down direction.

Each insulating part contains an insulating substance. The first insulating portion 112 and the second insulating portion 122 may include the same or different insulating materials. In detail, each insulating part is formed by hardening a liquid insulating material. As an example, a liquid insulating material dispersed with the conductive metal particles is injected into a mold for forming a conductive sheet. After that, the conductive metal particles are arranged and contacted in the vertical direction by a magnetic field applied to each position of the conductive part. The conductive portion can be formed, and thereafter, the liquid insulating material is hardened to form the insulating portion. As another example, the conductive part can be formed by hardening and forming a liquid insulating material that does not contain conductive metal particles to form a material in the shape of a conductive sheet. After that, a through hole is formed at each position of the conductive part of the material . , The through hole is filled with a liquid insulating material dispersed with conductive metal particles, and the conductive metal particles in the through hole are contacted in a manner that can conduct electricity in the vertical direction by magnetic force.

The insulating material constituting the conductive sheet is insulating and elastic. This insulating material constitutes the insulating part of the conductive sheet and constitutes a part of the conductive part of the conductive sheet. In the connector of an embodiment, the insulating material may be silicone rubber, but it is not limited thereto. As the insulating material, a material with insulation and elasticity can be used.

When silicone rubber is used as an insulating material, as the liquid silicone rubber material used to form the insulating part, addition-molding liquid silicone rubber, condensation silicone rubber, and vinyl-containing materials can be used. Liquid silicone rubber, etc. As a specific example, the liquid silicone rubber material may include dimethyl polysiloxane rubber, methyl vinyl polysiloxane rubber, methyl phenyl vinyl polysiloxane rubber, etc., but is not limited to this. .

In the connector of the embodiment, the first conductive sheet 110 and the second conductive sheet 120 are laminated and joined along the vertical direction VD. In the laminated first conductive sheet 110 and the second conductive sheet 120, the first conductive portion 111 and the second conductive portion 121 are in contact with each other in a manner capable of being aligned and conductive in the vertical direction VD, and are at least partially joined to each other. Therefore, the connector 100 can conduct electricity in the vertical direction VD between the terminal of the inspected device and the terminal of the inspection device. The connector 100 having the first conductive sheet 110 and the second conductive sheet 120 joined to each other can be used as a laminated structure having an increased thickness, which is arranged between the inspection device and the inspection device.

2 and 3, the first conductive sheet 110 may have a first surface 114 bonded to the second conductive sheet 120, and the second conductive sheet 120 may have a second surface 124 bonded to the first conductive sheet 110. The first surface 114 is one of the surfaces of the first conductive sheet 110 facing the vertical direction VD. The second surface 124 is one of the surfaces of the second conductive sheet 120 facing the vertical direction VD, and corresponds to the first surface 114 in the vertical direction VD. As shown in FIGS. 2 and 3, the first surface 114 may be the upper surface of the first conductive sheet 110 in the vertical direction, and the second surface 124 may be the lower surface of the second conductive sheet 120 in the vertical direction. Therefore, the first surface 114 may include an upper surface of the first insulating portion 112 in the up-down direction VD and an upper end surface of the first conductive portion 111 in the up-down direction VD. The second surface 124 may include a lower surface of the second insulating portion 122 in the upper-lower direction VD and a lower end surface of the second conductive portion 121 in the upper-lower direction VD. By bonding the first surface 114 and the second surface 124 to each other, the first conductive sheet 110 and the second conductive sheet 120 are bonded and laminated in the vertical direction.

In the conductive sheet before bonding of the connector constituting the embodiment, as shown in FIG. 4, the molecules of the insulating substance existing on the first surface 114 and the second surface 124 have adhesive functions that can realize bonding by chemical bonding Base 115, 125. By chemical bonding between the adhesive functional group 115 of the first surface 114 and the adhesive functional group 125 of the second surface 124, the first surface 114 and the second surface 124 can be bonded to each other. As an example, the adhesive functional group may be a hydrophilic functional group. As a specific example, the adhesive functional group may be a hydroxyl group (-OH). The adhesive functional groups used in the examples are not limited to hydroxyl groups, and may include functional groups capable of chemical bonding.

The first surface 114 and the second surface 124 may have adhesive functional groups 115 and 125 by surface reorganization. Here, surface reorganization refers to changing the chemical state of the surface of the first conductive sheet and the surface of the second conductive sheet, such as increasing a lower surface energy. The first surface 114 is a surface reorganized in such a way that one of the surfaces of the first conductive sheet 110 facing the vertical direction VD has an adhesive functional group 115. The second surface 124 is a surface reorganized in such a way that one of the surfaces of the second conductive sheet 120 facing the vertical direction VD has the adhesive functional group 125. As described above, the first and second surfaces are reorganized to have adhesive functional groups, so that the molecules of the insulating substance existing on the first and second surfaces form adhesive functional groups. Therefore, as shown in FIG. 4, the first surface 114 has a first recombination molecule 116 with an adhesive functional group 115 bonded to the atom of the insulating substance molecule, and the second surface 124 has an adhesive bond to the atom of the insulating substance molecule. The second recombinant molecule 126 of the functional group 125. When the insulating material is silicone rubber, the silicone rubber molecules on the first and second surfaces are recombined in a way that the silicone atoms of the silicone rubber molecules bond with the functional groups.

The first recombination molecule 116 and the second recombination molecule 126 can be formed by irradiating the surface of the conductive sheet with ultraviolet rays, generating plasma, or performing corona discharge on the surface of the conductive sheet in an oxygen-containing environment, so that the atoms of the insulating substance molecules (such as , The silicone atom of the silicone rubber molecule) is bonded to the functional group. The first recombinant molecule 116 and the second recombinant molecule 126 can be formed on almost the entire first surface and the second surface. The first recombinant molecule 116 and the second recombinant molecule 126 can be formed on the first surface and the second surface with a thickness of tens to hundreds of nanometers. Figure 4 is a simplified representation of this recombinant molecule.

According to one embodiment, in the reorganized insulating material molecules on the first surface 114 and the second surface 124, the hydroxyl groups (-OH) as the adhesive functional groups 115 and 125 are bonded to the atoms of the insulating material molecules. When the insulating material is silicone rubber, in the reorganized silicone rubber molecules on the first surface 114 and the second surface 124, the hydroxyl group (-OH) is bonded to the silicone atom. The first and second surfaces 114 and 124 are hydrophilic due to the hydroxyl group (-OH). The hydroxyl group of the first surface 114 and the hydroxyl group of the second surface 124 can be chemically bonded by contacting the first surface 114 and the second surface 124 for a specific time or pressing toward each other. Therefore, the first recombinant molecule 116 on the first surface 114 and the second recombinant molecule 126 on the second surface 124 can be bonded to each other through the chemical bond between the hydroxyl group of the first recombinant molecule and the hydroxyl group of the second recombinant molecule, thereby The first surface 114 and the second surface 124 can be joined.

In the first and second surfaces 114, 124 where the insulating substance molecules are recombined with adhesive functional groups, the reorganized insulating substance molecules are bonded to the atoms constituting the insulating substance molecules with oxygen atoms and hydrogen atoms. Atomic group (-OH atomic group, hydroxyl). When the insulating substance molecule is a silicone rubber molecule, the atomic group formed by the bonding of the oxygen atom and the hydrogen atom is bonded to the silicone oxygen atom, so the recombined silicone rubber molecule has an atomic group of -Si-OH. By laminating and bonding the first conductive sheet 110 and the second conductive sheet 120, the -Si-OH atomic group on the first surface 114 and the -Si-OH atomic group on the second surface 124 are chemically bonded, thereby generating polysilicon oxygen atoms , The atomic group formed by the bonding of oxygen atom and polysilicon oxygen atom (ie, the atomic group of -Si-O-Si-) and H ₂ O. In detail, the hydrogen bond acts between the -Si-OH atomic group in the first surface 114 and the -Si-OH atomic group in the second surface 124. After hydrogen is bonded, H ₂ O is generated, and the polysiloxy atom and the oxygen atom form a covalent bond with the polysiloxy atom. H ₂ O can evaporate from the joined first surface 114 and second surface 124. Thus, the -Si-O-Si- atomic group remains in the region where the first and second surfaces are joined. That is, the first surface 114 and the second surface 124 can share the radical of -Si-O-Si- to be joined to each other. In the -Si-O-Si- atomic group, one polysiloxane atom is the polysiloxane atom of the polysiloxane rubber molecule on the first surface, and the other polysiloxane atom is the polysiloxane atom on the second surface The molecular polysiloxy atom.

Therefore, the area where the first surface 114 of the first conductive sheet 110 and the second surface 124 of the second conductive sheet 120 are joined includes the atoms of the insulating substance molecules in the first surface 114, oxygen atoms, and the second surface 124. A group of atoms formed by bonding atoms of molecules of an insulating material (when the insulating material is silicone rubber, it is a group of atoms of -Si-O-Si-). Such atomic groups can also diffuse to the inside of the first surface 114 and the second surface 124 with a small depth. Therefore, such radicals can diffuse in a partial area of the first conductive sheet 110 and a partial area of the second conductive sheet 120 to be included in the area where the first conductive sheet 110 and the second conductive sheet 120 are joined.

4, by joining the first surface 114 and the second surface 124 to each other, the connector 100 can include between the first conductive sheet 110 and the second conductive sheet 120 the insulating material molecules recombined by the first conductive sheet 110 The bonding area 141 is generated by the chemical bonding between the molecules of the recombined insulating material with the second conductive sheet 120. The bonding area 141 may be formed in a layered shape along the horizontal direction HD between the first and second conductive sheets, and may have a thickness of tens to hundreds of nanometers. In FIG. 4, the bonding area 141 is shown in an exaggerated size. The bonding area 141 may be formed across the upper surface of the first insulating portion 112, the upper end surface of the first conductive portion 111, the lower surface of the second insulating portion 122, and the lower end surface of the second conductive portion 121. The bonding region 141 may include an atomic group formed by chemical bonding between the adhesive functional groups (hydroxyl groups) of the first and second recombinant molecules. When the insulating material is silicone rubber, in the bonding area 141, the polysilicon oxygen atoms and oxygen atoms of the first conductive sheet are bonded with the polysilicon oxygen atoms of the second conductive sheet to form atomic groups (-Si-O -Si atomic group) is included in the bonding region 141. Such atomic groups may diffuse to the entire bonding region 141 and be included.

3 and 4, the first surface 114 includes the recombined upper surface of the first insulating portion and the recombined upper end surface of the first conductive portion, and the second surface 124 includes the recombined lower surface of the second insulating portion and the second conductive portion. The reorganized lower end of the department. In the laminated first and second conductive sheets 110, 120, the insulating part and the conductive part positioned up and down are joined by the chemical bonding of adhesive functional groups, so that the laminated first and second conductive sheets are firm Joining structure. According to this bonding structure, even if the laminated and bonded first and second conductive sheets are repeatedly pressed downward for a long time, the bonded first and second conductive sheets 110 and 120 will not separate. There is a bonding structure between the insulating material of the first conductive part and the insulating material of the second conductive part in the first conductive portion 111 and the second conductive portion 121 that are in contact and joined in the vertical direction VD, and there is no substance that deteriorates the conductivity . Thereby, the connector 100 has a bonding structure that does not reduce the conductivity.

The connector of an embodiment may have aligning portions respectively provided on the first conductive sheet and the second conductive sheet. When the first conductive sheet and the second conductive sheet are laminated by the above-mentioned alignment part, the position of the first conductive sheet and the second conductive sheet in the horizontal direction can be fixed, and the first conductive portion and the second conductive portion can be moved up and down. Orientation. As an example of the above-mentioned alignment portion, one of the first conductive sheet and the second conductive sheet may have at least one protruding portion protruding in the vertical direction, and the other of the first conductive sheet and the second conductive sheet may have The shape is complementary to the protruding part and the recessed part of the protruding part is fitted in the vertical direction. The cross-sectional shape of the protrusion can be any of a circle, an ellipse, an oblong, and a quadrilateral, and the cross-sectional shape of the recess can correspond to the cross-sectional shape of the protrusion. 5 and 6 show examples in which the alignment portion for aligning the conductive portion is provided on the first and second conductive sheets.

Referring to FIG. 5, at least one of the plurality of first conductive parts 111 may have a protrusion 117 protruding in the vertical direction VD, and at least one of the plurality of second conductive parts 121 may have a recess 127. The protruding portion 117 may be the upper end of the first conductive portion 111, and the recessed portion 127 may be the lower end of the second conductive portion 121. The protrusion 117 and the recess 127 are formed in such a manner that the protrusion 117 is fitted into the recess 127 in the vertical direction VD. Therefore, when the first conductive sheet 110 and the second conductive sheet 120 are laminated, the first conductive portion 111 and the second conductive portion 121 can be fitted between the protrusion 117 and the recess 127 in the vertical direction VD. Align and touch up and down VD. The reorganized first surface 114 of the first conductive sheet includes the surface of the protrusion 117, and the reorganized second surface 124 of the second conductive sheet includes the surface of the recess 127. The protruding part 117 and the recessed part 127 may also be joined by chemical bonding between adhesive functional groups.

Only one of the plurality of first conductive portions 111 may have the protrusion 117, and only the second conductive portion 121 corresponding to the first conductive portion having the protrusion 117 may have the recess 127. The protruding part 117 may be provided to the first conductive parts 111 positioned in a row or to all the first conductive parts 111. The second conductive portion 121 corresponding to the first conductive portion 111 may have a recess 127. The protruding portion 117 can also be formed across two or more first conductive portions 111, and the recessed portion 127 can be formed in a manner corresponding to the shape of the protruding portion 117. The second conductive portion 121 of the second conductive sheet 120 may have the aforementioned protruding portion 117, and the first conductive portion 111 of the first conductive sheet 110 may have the aforementioned recessed portion 127.

Referring to FIG. 6, the first insulating portion 112 may have at least one protruding portion 118 protruding in the vertical direction VD, and the second insulating portion 122 may have at least one recessed portion 128 depressed in the vertical direction VD. The protruding portion 118 and the recessed portion 128 are formed in such a manner that the protruding portion 118 is fitted to the recessed portion 128 in the vertical direction VD. Therefore, when the first conductive sheet 110 and the second conductive sheet 120 are laminated, the first conductive portion 111 and the second conductive portion 121 can be fitted between the protrusion 118 and the recess 128 in the up-down direction VD. Align and touch up and down VD. The reorganized first surface 114 of the first conductive sheet includes the surface of the protrusion 118, and the reorganized second surface 124 of the second conductive sheet includes the surface of the recess 128. The protruding portion 118 and the recessed portion 128 may also be joined by chemical bonding between adhesive functional groups.

The first insulating portion 112 may have a protrusion 118, and the second insulating portion 122 may have a recess 128 formed at a position corresponding to the position of the protrusion 118. The protrusion 118 may be formed at the center or each corner of the first insulating portion 112, and the recess 128 may be formed at a position corresponding to the position of the protrusion 118. The second conductive portion 121 may have the aforementioned protruding portion 118, and the first conductive portion 111 may have the aforementioned recessed portion 128.

The connector 100 may have a third conductive sheet laminated on any one of the laminated first conductive sheet 110 and the second conductive sheet 120 so as to be conductive in the vertical direction. According to the third conductive sheet, the connector 100 can have a thicker thickness, and can have a greater amount of pressing in the up and down direction. The third conductive sheet may be configured similarly to the first conductive sheet 110 or the second conductive sheet 120, and may be bonded to the first conductive sheet 110 or the second conductive sheet 110 or the second conductive sheet 110 or the second conductive sheet 110 or the second conductive sheet in a manner that can conduct up and down directions by using adhesive functional groups through the above-mentioned surface reorganization. 2 Conductive sheet 120.

Referring to Figs. 7 to 16, an embodiment of the method of manufacturing the connector will be described. With the manufacturing method of the embodiment, a connector that is located between the inspection device and the inspected device and electrically connects the inspection device and the inspected device can be manufactured. FIGS. 8 to 16 schematically show the shape of the connector, the shape of the component elements of the connector, and the shape of the device. These are only examples selected for understanding the embodiment.

Fig. 7 shows the steps of a method of manufacturing a connector according to an embodiment. Referring to FIG. 7, a method of manufacturing a connector according to an embodiment includes: step S100, which is to provide first and second conductive sheets that can conduct in the vertical direction and contain insulating materials; and step S200, which is based on the first and second The insulating substance molecules in the corresponding surface of the conductive sheet have adhesive functional groups to reorganize the corresponding surface; and step S300, which is to join the corresponding surface by chemical bonding between the adhesive functional groups. The first conductive sheet and the second conductive sheet are conductively laminated in the vertical direction.

Through step S100, the first conductive sheet and the second conductive sheet shown in FIG. 2 constituting the connector of an embodiment can be provided. Figures 8 and 9 schematically show examples of forming conductive sheets.

Referring to FIG. 8, the conductive sheet of one embodiment can be formed using a forming mold 511 and the first and second magnetic field applying parts 521 and 522 arranged on the upper and lower sides of the forming mold 511. The liquid forming material 513 can be injected into the forming cavity 512 of the forming mold 511. The liquid forming material 513 may include one of the liquid insulating material and the conductive metal particles exemplified above. As the above-mentioned liquid insulating material, one of the above-exemplified liquid silicone rubbers can be used. The conductive metal particles are dispersed in the liquid silicone rubber material. After the liquid forming material 513 is injected into the forming cavity 512, the first and second magnetic field applying parts 521 and 522 apply a magnetic field to each position of the conductive part in the vertical direction VD. The first magnetic field applying portion 521 and the second magnetic field applying portion 522 are arranged to face each other in the up-down direction of the molding die 511 (ie, the connector up-down direction). When a magnetic field is applied, the conductive metal particles are arranged and contacted in the vertical direction at each position of the conductive part by magnetic force, thereby forming the conductive part. After a plurality of conductive metal particles contact in a manner capable of conducting VD in the vertical direction, the liquid insulating material of the liquid molding material 513 hardens. Thereby, by step S100, the first conductive sheet 110 and the second conductive sheet 120 shown in FIGS. 2 and 3 can be provided.

9, a forming mold can be used to form a material 531 in the shape of a conductive sheet from a liquid insulating material that does not contain conductive metal particles (as an example, the above-mentioned liquid silicone rubber). In the molded material 531, a through hole 532 is formed at each position of the conductive portion. The through hole 532 is filled with a liquid insulating material in which the conductive metal particles are dispersed. The conductive metal particles in the through hole 532 are arranged and contacted in the vertical direction by magnetic force, and the liquid insulating material in the through hole is hardened. Thereby, through step S100, the first conductive sheet 110 and the second conductive sheet 120 shown in FIG. 2 can be provided.

As shown in FIG. 2, the first conductive sheet 110 includes: a plurality of first conductive portions 111 which can conduct electricity in the vertical direction VD and contains at least an insulating material; and a first insulating portion 112 which makes the plurality of first conductive portions 111 They are separated and insulated from each other in the horizontal direction HD, and contain insulating materials. The first conductive sheet 110 has a first surface 114 that is one of the surfaces facing the vertical direction VD. As shown in FIG. 2, the second conductive sheet 120 includes: a plurality of second conductive portions 121 that can conduct electricity in the vertical direction VD and at least contain an insulating material; and a second insulating portion 122 that makes the plurality of second conductive portions 121 They are separated and insulated from each other in the horizontal direction HD, and contain insulating materials. The second conductive sheet 120 has a second surface 124 corresponding to the first surface 114 as one of the surfaces facing the vertical direction VD.

In step S200, the insulating substance molecules on the first surface of the first conductive sheet (as an example, silicone rubber molecules) and the insulating substance molecules on the second surface of the second conductive sheet (as an example, silicone rubber) Molecules) recombine in such a way that they have adhesive functional groups. The adhesive functional group on the first surface and the adhesive functional group on the second surface can be bonded by chemical bonding. As an example, the adhesive functional group is hydroxyl (-OH), but it is not limited to this. The first surface and the second surface can be joined by a chemical bond between the hydroxyl group of the insulating substance molecule bonded to the first surface and the hydroxyl group of the insulating substance molecule bonded to the second surface.

If the first surface and the second surface are recombined, the first surface and the second surface may have recombined molecules with hydroxyl (-OH) formed on the insulating substance molecules. Such recombinant molecules can span the first surface and the second surface and have a thickness of tens to hundreds of nanometers depending on the surface recombination time. When the surface recombination time is longer, the recombined molecules can also be formed to a thickness of several nanometers. The first surface and the second surface are hydrophilic due to the hydroxyl group. If the first surface and the second surface of the surface recombination are brought into contact, the recombination molecules on the first surface and the recombination molecules on the second surface can be bonded by the chemical bonding between the hydroxyl groups. In addition, according to the example of surface reorganization disclosed below, the surface roughness of the first surface and the second surface is increased, so that the bonding force can be improved. The step S200 of reorganizing the first surface and the second surface can be performed by various surface reorganization methods, so that the insulating substance molecules on the first surface and the insulating substance molecules on the second surface have hydroxyl groups.

As the first example of surface reorganization, the step S200 of reorganizing the first surface and the second surface can be performed by irradiating the first surface of the first conductive sheet and the second surface of the second conductive sheet with ultraviolet rays in an atmosphere containing oxygen . Fig. 10 schematically shows the first example of surface reorganization.

10, by irradiating ultraviolet light 612 on the first surface 114 and the second surface 124 from an ultraviolet light source 611 in an oxygen-containing environment, the insulating substance molecules in the first surface 114 and the second surface 124 (as an example, polysilicon Oxygen rubber molecules) can be recombined with adhesive functional groups (hydroxyl groups) 115 and 125. The above-mentioned oxygen-containing environment may be an atmospheric environment. As the ultraviolet light source 611, for example, an excimer lamp can be used, but it is not limited to this. The ultraviolet light source 611 can irradiate ultraviolet rays having a wavelength of 10 nm to 400 nm, for example. UV irradiation can be performed at room temperature, but it is not limited to this. The time of irradiating ultraviolet rays can be variously set according to the output of the ultraviolet light source 611.

If the first surface 114 and the second surface 124 are irradiated with ultraviolet rays 612 from the ultraviolet light source 611, oxygen in the environment absorbs the ultraviolet rays and turns into ozone. Ozone decomposes organic matter on the first surface 114 and the second surface 124 to exert a cleaning effect. In the first surface 114 and the second surface 124 that absorb ultraviolet rays, the hydroxyl group is bonded to the atom of the insulating substance molecule (as an example, the polysiloxane atom of the silicone rubber molecule), so the above-mentioned recombinant molecules can be formed on each surface. As described above, by irradiating the first surface 114 and the second surface 124 with ultraviolet rays 612 from the ultraviolet light source 611 in an oxygen-containing environment, the first surface 114 and the second surface 124 can be recombined to have hydroxyl groups.

Plasma can be used to perform surface reformation in an oxygen-containing environment. The plasma can be generated on the first surface and the second surface, or sprayed on the first surface and the second surface.

As a second example of surface reformation, the step S200 of reforming the first surface and the second surface can be performed by generating plasma on the first surface and the second surface in an atmosphere containing oxygen. Fig. 11 schematically shows the second example of surface reorganization.

11, the above-mentioned plasma can be generated in the vacuum chamber 621. The upper electrode 622 and the lower electrode 623 are arranged in the vacuum chamber 621. The first conductive sheet 110 and the second conductive sheet 120 are respectively stacked on the lower electrode 623 such that the first surface 114 and the second surface 124 face upward. Air or oxygen is injected into the vacuum chamber 621 as a processing gas to form an oxygen-containing environment in the vacuum chamber 621. The plasma 624 is ignited in the vacuum chamber 621. The plasma 624 may be low temperature plasma. The first surface 114 and the second surface 124 are reorganized by the plasma 624. Thereby, the above-mentioned recombinant molecule is formed on the first and second surfaces 114, 124, and a hydroxyl group is bonded to the atom of the recombinant molecule (for example, the silicone atom of the silicone rubber molecule).

As a third example of surface reorganization, the step S200 of reorganizing the first surface and the second surface can be performed by spraying atmospheric pressure slurry on the first surface and the second surface in an atmosphere containing oxygen. Figure 12 schematically shows the third example of surface reorganization.

12, by spraying atmospheric plasma 632 on the first surface 114 (or the second surface of the second conductive sheet) of the first conductive sheet 110 from the plasma generator 631, the second surface of the first conductive sheet 110 The insulating substance molecules (as an example, silicone rubber molecules) in the first surface 114 and the second surface of the second conductive sheet are recombined with adhesive functional groups (hydroxyl groups), so that the recombined molecules can be formed on each surface. The sprayed atmospheric pressure slurry 632 can clean the first surface 114 and activate it. The atmospheric pressure slurry 632 can be sprayed in an atmospheric environment. Alternatively, the spraying of the atmospheric pressure slurry 632 can be performed in an environment of a process gas containing oxygen. As shown in FIG. 12, the plasma generator 631 may take the shape of a torch. The plasma generator 631 in the torch shape can also be repeatedly moved along the first surface 114 in the horizontal direction to spray the atmospheric piezoelectric plasma 632 to the first surface 114.

Fig. 13 shows another example of the plasma generator in the surface reforming method of the third example. Referring to FIG. 13, the plasma generator 633 can take a bar shape to reorganize the first surface 114 or the second surface in the horizontal direction.

As a fourth example of surface reorganization, the step S200 of reorganizing the first surface and the second surface can be performed by corona discharge on the first surface and the second surface in an atmosphere containing oxygen. Figure 14 schematically shows the fourth example of surface reorganization.

14, by corona discharge on the first surface 114 (or the second surface) in an oxygen-containing environment, the first surface 114 can be recombined with adhesive functional groups (hydroxyl groups), thereby forming a Recombinant molecules in which the atoms of insulating molecules (as an example, the silicone atoms of silicone rubber molecules) are bonded to hydroxyl groups. The first conductive sheet 110 (or the second conductive sheet) is deposited on the ground electrode 641, and the corona flame 643 is generated from the corona discharge electrode 642 on the first surface 114 (or the second surface). By corona discharge treatment, the first surface 114 (or the second surface) is recombined with adhesive functional groups (hydroxyl groups), and a recombined molecule with a hydroxyl group bonded to the atoms of the insulating substance molecule can be formed. The corona discharge electrode 642 may be in the shape of a torch and can be moved along the first surface 114. Alternatively, the corona discharge electrode 642 may also have a strip shape. The oxygen-containing environment in this example can be an atmospheric environment or an oxygen environment. The corona flame 643 contains particles charged by high-frequency ionization, and such particles oxidize the first surface 114 by colliding with the first surface 114. The silicone rubber molecules on the first surface 114 form adhesive functional groups (hydroxyl groups) due to surface oxidation, and the surface energy of the first surface 114 increases to have bonding properties.

According to step S300, the first conductive sheet and the second conductive sheet are laminated so as to be electrically conductive in the vertical direction, so that the first surface and the second surface are joined. For step S300, refer to FIG. 15 and FIG. 16. Fig. 15 schematically shows the layering and joining of the first and second conductive sheets of surface reorganization, and Fig. 16 schematically shows an example of the surface reorganization and reorganization molecules of the conductive sheet.

The first surface 114 of the first conductive sheet 110 and the second surface 124 of the second conductive sheet 120 are recombined to have adhesive functional groups (hydroxyl (-OH)) 115 and 125, so they are hydrophilic. Hydrophilic hydroxyl groups are formed on the first surface 114 and the second surface 124, so as long as the first conductive sheet and the second conductive sheet are contacted in the vertical direction VD, the chemical bond between the adhesive functional groups 115 and 125 can be achieved. (Chemical bonding between hydroxyl groups) The first surface 114 and the second surface 124 are joined. The first conductive sheet 110 and the second conductive sheet 120 are laminated in a conductive manner. That is, the first conductive portion 111 of the first conductive sheet 110 and the second conductive portion 121 of the second conductive sheet 120 are aligned and contacted in the vertical direction VD.

16, in the first recombined molecule 116 on the first surface 114, the atom of the insulating substance molecule (as an example, the silicone atom of the silicone rubber molecule) is bonded with an adhesive functional group (hydroxyl (-OH) )), in the second recombinant molecule 126 on the second surface 124, an adhesive functional group (hydroxyl (-OH)) is bonded to the atom of the insulating substance molecule (as an example, the silicone atom of the silicone rubber molecule) ). Therefore, the first recombination molecule 116 on the first surface 114 and the second recombination molecule 126 on the second surface 124 include the atoms of the insulating substance molecule, the atom group formed by bonding the oxygen atom and the hydrogen atom. When the insulating substance molecule is a silicone rubber molecule, the first recombination molecule 116 and the second recombination molecule 126 include the -O-H atomic group (hydroxyl group) bonded to the silicone atom.

By laminating the first conductive sheet 110 and the second conductive sheet 120 in the vertical direction VD, the first surface 114 and the second surface 124 are in contact with each other in the vertical direction VD. The -Si-OH atomic group of the first recombinant molecule 116 is chemically bonded to the -Si-OH atomic group of the second recombinant molecule 126, so that the first recombinant molecule 116 on the first surface 114 and the second recombinant molecule 126 on the second surface 124 Chemical bonding. Thereby, the first surface 114 and the second surface 124 are joined in the vertical direction. By joining the first surface 114 and the second surface 124, the joining area 141 can be formed between the first conductive sheet 110 and the second conductive sheet 120. The first recombination molecule 116 on the first surface and the second recombination molecule 126 on the second surface are chemically bonded to form a junction area 141. That is, after the chemical bonding between the hydroxyl group of the first recombination molecule 116 and the hydroxyl group of the second recombination molecule 126, a junction area 141 is formed, and the junction area 141 is bonded to the insulating substance molecule of the first surface 114 and the second surface 124. Material molecule

The first recombination molecule 116 is chemically bonded to the second recombination molecule 126 corresponding to it, thereby generating an atomic group and H ₂ O formed by bonding the atom to which the adhesive functional group is bonded and the oxygen atom. In this case, the aforementioned atomic group includes the atom of the first recombinant molecule 116 to which the adhesive functional group is bonded, the oxygen atom, and the atom of the second recombinant molecule 126 to which the adhesive functional group is bonded. When the insulating substance molecule is a silicone rubber molecule, the -Si-OH atomic group of the first recombination molecule 116 and the HO-Si- atomic group of the second recombination molecule 126 corresponding to it are formed by hydrogen bonding. The chemical bonding generates polysilicon oxygen atoms, atomic groups formed by bonding oxygen atoms and polysilicon oxygen atoms (ie, -Si-O-Si- atomic groups) and H ₂ O. Specifically, the hydrogen bond acts between the -Si-OH atomic group in the first recombinant molecule 116 and the -Si-OH atomic group in the second recombinant molecule 126. After hydrogen is bonded, H ₂ O is generated, and the polysiloxy atom, the oxygen atom and the polysiloxy atom form a covalent bond. If a certain time elapses, the generated H ₂ O may evaporate from the bonding area 141, or may evaporate from the bonding area 141 by heating. Alternatively, a very small amount of H ₂ O may be present in the bonding area 141.

In the first and second surfaces 114 and 124 to be joined, the silicone rubber molecules on the first surface 114 and the silicone rubber molecules on the second surface 124 can be covalently bonded by the atomic group of -Si-O-Si- Knot. That is, the first and second surfaces 114 and 124 share the radical of -Si-O-Si- and are joined to each other. Therefore, the area where the first and second surfaces 114 and 124 are joined (for example, the joining area 141) is formed after the chemical bond between the hydroxyl group of the first recombinant molecule 116 and the hydroxyl group of the second recombinant molecule 126, and the polysilicon oxygen atom and oxygen A group of atoms formed by bonding atoms (-Si-O-Si- group of atoms). In the atomic group of -Si-O-Si-, one polysiloxane atom is the polysiloxane atom of the polysiloxane rubber molecule in the first surface 114, and the other polysiloxane atom is the polysiloxane in the second surface 124 The polysiloxane atom of the oxygen rubber molecule.

As shown in FIG. 15, in the laminated first and second conductive sheets 110 and 120, almost all the insulating parts and conductive parts positioned vertically can be joined by chemical bonding of adhesive functional groups. Therefore, the laminated first and second conductive sheets 110 and 120 have a strong and highly reliable bonding structure, and therefore, even if the device to be inspected is repeatedly inspected and pressed downward, they will not separate from each other. In addition, the laminated first and second conductive sheets 110 and 120 have a bonding structure that does not reduce conductivity.

Regarding step S300, a suitable clamp can be used to align the first conductive sheet and the second conductive sheet in a manner that can conduct electricity in the vertical direction. Alternatively, when the first conductive sheet and the second conductive sheet are provided with the alignment part described with reference to FIG. 5 or FIG. 6, the first conductive sheet and the second conductive sheet can be laminated so as to be conductive in the vertical direction. Wrong alignment.

After the step of laminating the first and second conductive sheets, one of the laminated first and second conductive sheets can press the other. The recombined first surface of the first conductive sheet and the recombined second surface of the second conductive sheet may not be formed as a complete flat surface, but may have a slight surface roughness and slight unevenness. With the aforementioned pressurization, the first surface and the second surface can be joined at a higher level.

After the lamination step of the first and second conductive sheets, the first and second surfaces of the bonding may be hardened by heating to stabilize the insulating material. Such hardening can be performed for a specific time at a temperature below the temperature at which the physical properties of the insulating material are not changed.

After the first and second conductive sheets are laminated, the third conductive sheet can be joined and laminated on the first conductive sheet or the second conductive sheet so as to be conductive in the vertical direction. The third conductive sheet may have a configuration similar to the first conductive sheet or the second conductive sheet. The insulating substance molecules on the other surface of the first conductive sheet or the second conductive sheet upward and downward can be recombined with adhesive functional groups, and the insulating substance molecules on the surface of the corresponding third conductive sheet can have Recombination followed by sexual functional groups. One of the laminated first and second conductive sheets can be laminated with the third conductive sheet.

Above, the technical idea of the present invention has been explained by some embodiments and examples shown in the accompanying drawings, but it should be understood that the technology of the present invention can be understood by those with common sense in the technical field to which the present invention belongs. Various substitutions, changes, and changes are made within the scope of thought and scope. In addition, such replacements, changes and changes should be understood as falling within the scope of the attached invention application patent.

10: Check the device 11: Terminal 20: Device under inspection 21: Terminal 30: Test socket 31: Frame 40: socket shell 100: connector 110: The first conductive sheet 111: The first conductive part 112: The first insulating part 113: The first conductive metal particles 114: Surface 1 115: Adhesive functional group 116: The first recombinant molecule 117: protrusion 118: protrusion 120: The second conductive sheet 121: The second conductive part 122: The second insulating part 123: The second conductive metal particles 124: Surface 2 125: Adhesive functional group 126: The second recombinant molecule 127: Depressed part 128: Depressed part 141: Joint area 511: forming die 512: forming cavity 513: Liquid forming material 521: The first magnetic field application part 522: The second magnetic field application part 531: material 532: Through hole 611: Ultraviolet light source 612: Ultraviolet 621: vacuum chamber 622: Upper electrode 623: Lower electrode 624: Plasma 631: Plasma Generator 632: atmospheric pressure 633: Plasma Generator 641: Ground electrode 642: corona discharge electrode 643: Corona Flame S100, S200, S300: steps VD: Up and down direction HD: horizontal direction HD1, HD2: horizontal direction

Fig. 1 is a cross-sectional view schematically showing an example of a connector to which an embodiment is applied.

Fig. 2 is a cross-sectional view of a connector showing an embodiment of the separation of conductive sheets.

Fig. 3 is a cross-sectional perspective view showing a conductive sheet of the connector of an embodiment.

Fig. 4 schematically shows the lamination and bonding of the first conductive sheet and the second conductive sheet.

Fig. 5 is a cross-sectional view schematically showing a connector of an embodiment, and showing the alignment portions provided to the first and second conductive sheets.

Fig. 6 is a cross-sectional view schematically showing the connector of an embodiment, and showing another example of the alignment portion provided to the first and second conductive sheets.

FIG. 7 is a block diagram showing the steps of a method of manufacturing a connector according to an embodiment.

Fig. 8 is a cross-sectional view schematically showing an example of a formed conductive sheet.

Fig. 9 is a cross-sectional view schematically showing another example of forming a conductive sheet.

Fig. 10 schematically shows the first example of surface reorganization.

Fig. 11 schematically shows the second example of surface reorganization.

Figure 12 schematically shows the third example of surface reorganization.

Fig. 13 shows another example of the plasma generator in the third example of surface reforming.

Figure 14 schematically shows the fourth example of surface reorganization.

Fig. 15 is a cross-sectional view schematically showing the lamination and bonding of the first and second conductive sheets of surface reorganization.

Figure 16 schematically shows an example of surface reorganization and reorganization molecules of the conductive sheet.

100: connector

110: The first conductive sheet

111: The first conductive part

112: The first insulating part

114: Surface 1

115: Adhesive functional group

116: The first recombinant molecule

120: The second conductive sheet

121: The second conductive part

122: The second insulating part

124: Surface 2

125: Adhesive functional group

126: The second recombinant molecule

141: Joint area

VD: Up and down direction

HD: horizontal direction

Claims (12)

A connector, which is located between the inspection device and the inspected device and electrically connects the inspection device and the inspected device, and includes: The first conductive sheet, which contains an insulating material, can conduct electricity in the vertical direction; and The second conductive sheet, which contains an insulating material, can conduct electricity in the above-mentioned up and down direction; and The first conductive sheet and the second conductive sheet are laminated and joined so as to be conductive in the vertical direction, The bonding is achieved by chemical bonding between the insulating material molecules of the first conductive sheet and the insulating material molecules of the second conductive sheet. The connector of claim 1, wherein the area where the first conductive sheet and the second conductive sheet are joined includes atoms of the insulating substance molecules of the first conductive sheet, oxygen atoms and atoms of the insulating substance molecules of the second conductive sheet A group of atoms bonded together, The atomic group is also included in a partial area of the first conductive sheet and a partial area of the second conductive sheet. The connector of claim 1, wherein the first conductive sheet and the second conductive sheet respectively include: a plurality of conductive parts, which can conduct electricity in the above-mentioned vertical direction, and at least contain an insulating substance; and an insulating part, which makes the plurality of conductive parts conductive The parts are separated in the horizontal direction and contain insulating materials; The conductive portion of the first conductive sheet and the conductive portion of the second conductive sheet are joined by chemical bonding between molecules of the insulating substance. The connector of claim 3, wherein the insulating portion of the first conductive sheet and the insulating portion of the second conductive sheet are joined by chemical bonding between molecules of the insulating substance. The connector of claim 3, wherein one of the first conductive sheet and the second conductive sheet has at least one protrusion protruding in the vertical direction, and the other of the first conductive sheet and the second conductive sheet One has a recess in which the protrusion is fitted in the vertical direction, The plurality of conductive portions of the first conductive sheet and the plurality of conductive portions of the second conductive sheet are aligned in the vertical direction by the fitting between the protruding portion and the recessed portion. Such as the connector of claim 1, wherein the above-mentioned insulating material is silicone rubber. A method for manufacturing a connector, which is located between an inspection device and an inspected device and electrically connects the inspection device and the inspected device, and includes: The step of providing a first conductive sheet and a second conductive sheet, wherein the first conductive sheet has a first surface facing in the up-down direction, can conduct electricity in the up-down direction and contains an insulating material, and the second conductive sheet has a connection along the up-down direction. The second surface corresponding to the first surface can be conductive along the above-mentioned up and down direction and contain insulating materials; The step of recombination in such a way that the insulating substance molecules on the first surface and the insulating substance molecules on the second surface have adhesive functional groups; and The first surface and the second surface are joined by a chemical bond between the adhesive functional group of the first surface and the adhesive functional group of the second surface, and the first surface can be electrically conductively laminated in the vertical direction. 1 Conductive sheet and the steps of the above-mentioned second conductive sheet. Such as the method for manufacturing a connector of claim 7, wherein the adhesive functional group is a hydroxyl group, The first surface and the second surface are joined by a chemical bond between the hydroxyl groups on the first surface and the hydroxyl groups on the second surface. The method for manufacturing a connector of claim 7, wherein by the step of recombining the first surface and the second surface, the adhesive functional group is bonded to the atom of the insulating substance molecule on the first surface and the first surface 2Atoms of insulating molecules on the surface, By laminating the first conductive sheet and the second conductive sheet, a chemical bond between the adhesive functional group on the first surface and the adhesive functional group on the second surface is formed and the first conductive sheet The atom group formed by bonding the atoms of the insulating substance molecule and the oxygen atom with the atoms of the insulating substance molecule of the second conductive sheet is included in the region where the first surface and the second surface are joined. The method for manufacturing a connector according to claim 7, wherein the step of recombining the first surface and the second surface is performed by irradiating the first surface and the second surface with ultraviolet rays in an atmosphere containing oxygen. The method of manufacturing a connector according to claim 7, wherein the step of recombining the first surface and the second surface is performed by generating plasma on the first surface and the second surface in an atmosphere containing oxygen . The method of manufacturing a connector of claim 7, wherein the step of recombining the first surface and the second surface is performed by corona discharge of the first surface and the second surface in an atmosphere containing oxygen .

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