TWI799989B - Surface treatment equipment and semiconductor device manufacturing equipment - Google Patents

Surface treatment equipment and semiconductor device manufacturing equipment Download PDF

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Publication number
TWI799989B
TWI799989B TW110134091A TW110134091A TWI799989B TW I799989 B TWI799989 B TW I799989B TW 110134091 A TW110134091 A TW 110134091A TW 110134091 A TW110134091 A TW 110134091A TW I799989 B TWI799989 B TW I799989B
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TW
Taiwan
Prior art keywords
equipment
semiconductor device
surface treatment
device manufacturing
manufacturing equipment
Prior art date
Application number
TW110134091A
Other languages
Chinese (zh)
Other versions
TW202312231A (en
Inventor
菊地広
李瑾
高野徹朗
Original Assignee
日商雅馬哈智能機器控股股份有限公司
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Priority to TW110134091A priority Critical patent/TWI799989B/en
Publication of TW202312231A publication Critical patent/TW202312231A/en
Application granted granted Critical
Publication of TWI799989B publication Critical patent/TWI799989B/en

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TW110134091A 2021-09-13 2021-09-13 Surface treatment equipment and semiconductor device manufacturing equipment TWI799989B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110134091A TWI799989B (en) 2021-09-13 2021-09-13 Surface treatment equipment and semiconductor device manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110134091A TWI799989B (en) 2021-09-13 2021-09-13 Surface treatment equipment and semiconductor device manufacturing equipment

Publications (2)

Publication Number Publication Date
TW202312231A TW202312231A (en) 2023-03-16
TWI799989B true TWI799989B (en) 2023-04-21

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ID=86690603

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110134091A TWI799989B (en) 2021-09-13 2021-09-13 Surface treatment equipment and semiconductor device manufacturing equipment

Country Status (1)

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TW (1) TWI799989B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201401383A (en) * 2012-03-15 2014-01-01 Tokyo Electron Ltd Bonding apparatus, bonding system, bonding method and computer strage medium
TW201802867A (en) * 2016-03-11 2018-01-16 邦德科技股份有限公司 Substrate bonding method
TW202006871A (en) * 2018-07-12 2020-02-01 日商東京威力科創股份有限公司 Substrate processing system and substrate processing method
TW202044694A (en) * 2018-12-26 2020-12-01 韓商Ｉｓｃ 股份有限公司 Electrical connection connector and manufacturing method therefor
TW202131385A (en) * 2019-10-08 2021-08-16 日商東京威力科創股份有限公司 Bonding device and bonding method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201401383A (en) * 2012-03-15 2014-01-01 Tokyo Electron Ltd Bonding apparatus, bonding system, bonding method and computer strage medium
TW201802867A (en) * 2016-03-11 2018-01-16 邦德科技股份有限公司 Substrate bonding method
TW202006871A (en) * 2018-07-12 2020-02-01 日商東京威力科創股份有限公司 Substrate processing system and substrate processing method
TW202044694A (en) * 2018-12-26 2020-12-01 韓商Ｉｓｃ 股份有限公司 Electrical connection connector and manufacturing method therefor
TW202131385A (en) * 2019-10-08 2021-08-16 日商東京威力科創股份有限公司 Bonding device and bonding method

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Publication number Publication date
TW202312231A (en) 2023-03-16

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