TW202044394A - 基板處理系統 - Google Patents

基板處理系統 Download PDF

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Publication number
TW202044394A
TW202044394A TW109116511A TW109116511A TW202044394A TW 202044394 A TW202044394 A TW 202044394A TW 109116511 A TW109116511 A TW 109116511A TW 109116511 A TW109116511 A TW 109116511A TW 202044394 A TW202044394 A TW 202044394A
Authority
TW
Taiwan
Prior art keywords
time series
series data
aforementioned
substrate processing
time
Prior art date
Application number
TW109116511A
Other languages
English (en)
Chinese (zh)
Inventor
鳥越恒男
畠山雅規
中込良
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202044394A publication Critical patent/TW202044394A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW109116511A 2019-05-22 2020-05-19 基板處理系統 TW202044394A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019095619 2019-05-22
JP2019-095619 2019-05-22

Publications (1)

Publication Number Publication Date
TW202044394A true TW202044394A (zh) 2020-12-01

Family

ID=73459387

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109116511A TW202044394A (zh) 2019-05-22 2020-05-19 基板處理系統

Country Status (7)

Country Link
US (1) US20220234164A1 (https=)
JP (1) JP7527279B2 (https=)
KR (1) KR102734004B1 (https=)
CN (1) CN113853275B (https=)
SG (1) SG11202112854XA (https=)
TW (1) TW202044394A (https=)
WO (1) WO2020235581A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI826877B (zh) * 2020-12-18 2023-12-21 美商應用材料股份有限公司 拋光基板及匹配拋光系統之間的拋光效能的方法
TWI896971B (zh) * 2022-07-27 2025-09-11 日商阿自倍爾股份有限公司 刀具檢查裝置以及方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022003983A1 (ja) * 2020-07-03 2022-01-06 日本電気株式会社 時系列データ処理方法、時系列データ処理装置、時系列データ処理システム、記録媒体
US11710228B2 (en) 2021-03-05 2023-07-25 Applied Materials, Inc. Detecting an excursion of a CMP component using time-based sequence of images and machine learning
JP7601685B2 (ja) * 2021-03-31 2024-12-17 株式会社ディスコ 研削装置
KR102546071B1 (ko) * 2021-05-18 2023-06-22 세메스 주식회사 기판 처리 장치 및 데이터 변화 판단 방법
JP7698502B2 (ja) * 2021-07-29 2025-06-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
JP2023122817A (ja) * 2022-02-24 2023-09-05 株式会社荏原製作所 研磨終点検出方法、研磨終点検出システム、研磨装置、およびコンピュータ読み取り可能な記録媒体
JP2024019962A (ja) * 2022-08-01 2024-02-14 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
KR102605515B1 (ko) * 2022-09-15 2023-12-29 (주)성화에스티 인공지능 기반, 피가공물 두께에 기초한 가공 시스템
US20240210916A1 (en) * 2022-12-22 2024-06-27 Applied Materials, Inc. Machine and deep learning techniques for predicting ecological efficiency in substrate processing
JP2024093733A (ja) * 2022-12-27 2024-07-09 株式会社荏原製作所 研磨方法、研磨装置、および記録媒体
JP2024137176A (ja) * 2023-03-24 2024-10-07 株式会社Ｓｃｒｅｅｎホールディングス 分析装置、分析方法および分析プログラム
JP2024155301A (ja) * 2023-04-21 2024-10-31 株式会社荏原製作所 研磨方法、研磨装置、および温度調節プログラム
CN119115781B (zh) * 2024-11-08 2025-01-28 江苏元夫半导体科技有限公司 抛光终点检测方法、装置、电子设备及存储介质

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JP2000202768A (ja) * 1999-01-12 2000-07-25 Tdk Corp 研磨方法及び装置、及び薄膜磁気ヘッドの製造方法
JP2001138218A (ja) * 1999-11-12 2001-05-22 Nec Corp Ｃｍｐ加工機
US7156717B2 (en) * 2001-09-20 2007-01-02 Molnar Charles J situ finishing aid control
JP4068404B2 (ja) * 2002-06-26 2008-03-26 大日本スクリーン製造株式会社 基板処理システム、基板処理装置、基板処理方法、プログラム及び記録媒体
JP4355193B2 (ja) * 2003-11-10 2009-10-28 株式会社ルネサステクノロジ 半導体デバイスの製造方法及び半導体デバイス製造システム
JP2006310504A (ja) * 2005-04-28 2006-11-09 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
TWI422798B (zh) * 2006-10-06 2014-01-11 荏原製作所股份有限公司 加工終點檢測方法、研磨方法及研磨裝置
JP2009004442A (ja) * 2007-06-19 2009-01-08 Renesas Technology Corp 半導体ウェハの研磨方法
JP2013176828A (ja) 2012-02-29 2013-09-09 Ebara Corp 研磨終点検出装置の遠隔監視システム
JP6370084B2 (ja) * 2014-04-10 2018-08-08 株式会社荏原製作所 基板処理装置
CN106457507B (zh) * 2014-04-22 2019-04-09 株式会社荏原制作所 研磨方法
JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
US11565365B2 (en) * 2017-11-13 2023-01-31 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for monitoring chemical mechanical polishing
JP2020053550A (ja) * 2018-09-27 2020-04-02 株式会社荏原製作所 研磨装置、研磨方法、及び機械学習装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI826877B (zh) * 2020-12-18 2023-12-21 美商應用材料股份有限公司 拋光基板及匹配拋光系統之間的拋光效能的方法
TWI896971B (zh) * 2022-07-27 2025-09-11 日商阿自倍爾股份有限公司 刀具檢查裝置以及方法

Also Published As

Publication number Publication date
JP7527279B2 (ja) 2024-08-02
KR102734004B1 (ko) 2024-11-26
KR20220011144A (ko) 2022-01-27
US20220234164A1 (en) 2022-07-28
CN113853275B (zh) 2023-08-29
WO2020235581A1 (ja) 2020-11-26
JPWO2020235581A1 (https=) 2020-11-26
SG11202112854XA (en) 2021-12-30
CN113853275A (zh) 2021-12-28

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