JP7527279B2 - 基板処理システム - Google Patents

基板処理システム Download PDF

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Publication number
JP7527279B2
JP7527279B2 JP2021520809A JP2021520809A JP7527279B2 JP 7527279 B2 JP7527279 B2 JP 7527279B2 JP 2021520809 A JP2021520809 A JP 2021520809A JP 2021520809 A JP2021520809 A JP 2021520809A JP 7527279 B2 JP7527279 B2 JP 7527279B2
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JP
Japan
Prior art keywords
polishing
series data
time series
time
substrate processing
Prior art date
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JP2021520809A
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English (en)
Japanese (ja)
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JPWO2020235581A1 (https=
JPWO2020235581A5 (https=
Inventor
恒男 鳥越
雅規 畠山
良 中込
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
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Publication date
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Publication of JPWO2020235581A1 publication Critical patent/JPWO2020235581A1/ja
Publication of JPWO2020235581A5 publication Critical patent/JPWO2020235581A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2021520809A 2019-05-22 2020-05-20 基板処理システム Active JP7527279B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019095619 2019-05-22
JP2019095619 2019-05-22
PCT/JP2020/019869 WO2020235581A1 (ja) 2019-05-22 2020-05-20 基板処理システム

Publications (3)

Publication Number Publication Date
JPWO2020235581A1 JPWO2020235581A1 (https=) 2020-11-26
JPWO2020235581A5 JPWO2020235581A5 (https=) 2023-04-17
JP7527279B2 true JP7527279B2 (ja) 2024-08-02

Family

ID=73459387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021520809A Active JP7527279B2 (ja) 2019-05-22 2020-05-20 基板処理システム

Country Status (7)

Country Link
US (1) US20220234164A1 (https=)
JP (1) JP7527279B2 (https=)
KR (1) KR102734004B1 (https=)
CN (1) CN113853275B (https=)
SG (1) SG11202112854XA (https=)
TW (1) TW202044394A (https=)
WO (1) WO2020235581A1 (https=)

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* Cited by examiner, † Cited by third party
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WO2022003983A1 (ja) * 2020-07-03 2022-01-06 日本電気株式会社 時系列データ処理方法、時系列データ処理装置、時系列データ処理システム、記録媒体
CN115697631B (zh) * 2020-12-18 2025-08-19 应用材料公司 计算机实现的抛光基板和匹配抛光系统间抛光性能的方法
US11710228B2 (en) 2021-03-05 2023-07-25 Applied Materials, Inc. Detecting an excursion of a CMP component using time-based sequence of images and machine learning
JP7601685B2 (ja) * 2021-03-31 2024-12-17 株式会社ディスコ 研削装置
KR102546071B1 (ko) * 2021-05-18 2023-06-22 세메스 주식회사 기판 처리 장치 및 데이터 변화 판단 방법
JP7698502B2 (ja) * 2021-07-29 2025-06-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
JP2023122817A (ja) * 2022-02-24 2023-09-05 株式会社荏原製作所 研磨終点検出方法、研磨終点検出システム、研磨装置、およびコンピュータ読み取り可能な記録媒体
JP2024016960A (ja) * 2022-07-27 2024-02-08 アズビル株式会社 刃具検査装置および方法
JP2024019962A (ja) * 2022-08-01 2024-02-14 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
KR102605515B1 (ko) * 2022-09-15 2023-12-29 (주)성화에스티 인공지능 기반, 피가공물 두께에 기초한 가공 시스템
US20240210916A1 (en) * 2022-12-22 2024-06-27 Applied Materials, Inc. Machine and deep learning techniques for predicting ecological efficiency in substrate processing
JP2024093733A (ja) * 2022-12-27 2024-07-09 株式会社荏原製作所 研磨方法、研磨装置、および記録媒体
JP2024137176A (ja) * 2023-03-24 2024-10-07 株式会社Ｓｃｒｅｅｎホールディングス 分析装置、分析方法および分析プログラム
JP2024155301A (ja) * 2023-04-21 2024-10-31 株式会社荏原製作所 研磨方法、研磨装置、および温度調節プログラム
CN119115781B (zh) * 2024-11-08 2025-01-28 江苏元夫半导体科技有限公司 抛光终点检测方法、装置、电子设备及存储介质

Citations (1)

* Cited by examiner, † Cited by third party
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JP2000202768A (ja) 1999-01-12 2000-07-25 Tdk Corp 研磨方法及び装置、及び薄膜磁気ヘッドの製造方法

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JP2001138218A (ja) * 1999-11-12 2001-05-22 Nec Corp Ｃｍｐ加工機
US7156717B2 (en) * 2001-09-20 2007-01-02 Molnar Charles J situ finishing aid control
JP4068404B2 (ja) * 2002-06-26 2008-03-26 大日本スクリーン製造株式会社 基板処理システム、基板処理装置、基板処理方法、プログラム及び記録媒体
JP4355193B2 (ja) * 2003-11-10 2009-10-28 株式会社ルネサステクノロジ 半導体デバイスの製造方法及び半導体デバイス製造システム
JP2006310504A (ja) * 2005-04-28 2006-11-09 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
TWI422798B (zh) * 2006-10-06 2014-01-11 荏原製作所股份有限公司 加工終點檢測方法、研磨方法及研磨裝置
JP2009004442A (ja) * 2007-06-19 2009-01-08 Renesas Technology Corp 半導体ウェハの研磨方法
JP2013176828A (ja) 2012-02-29 2013-09-09 Ebara Corp 研磨終点検出装置の遠隔監視システム
JP6370084B2 (ja) * 2014-04-10 2018-08-08 株式会社荏原製作所 基板処理装置
CN106457507B (zh) * 2014-04-22 2019-04-09 株式会社荏原制作所 研磨方法
JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
US11565365B2 (en) * 2017-11-13 2023-01-31 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for monitoring chemical mechanical polishing
JP2020053550A (ja) * 2018-09-27 2020-04-02 株式会社荏原製作所 研磨装置、研磨方法、及び機械学習装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000202768A (ja) 1999-01-12 2000-07-25 Tdk Corp 研磨方法及び装置、及び薄膜磁気ヘッドの製造方法

Also Published As

Publication number Publication date
KR102734004B1 (ko) 2024-11-26
KR20220011144A (ko) 2022-01-27
US20220234164A1 (en) 2022-07-28
CN113853275B (zh) 2023-08-29
WO2020235581A1 (ja) 2020-11-26
JPWO2020235581A1 (https=) 2020-11-26
TW202044394A (zh) 2020-12-01
SG11202112854XA (en) 2021-12-30
CN113853275A (zh) 2021-12-28

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