TW202041364A - 積層體、附被鍍層基板的製造方法、導電性薄膜的製造方法 - Google Patents

積層體、附被鍍層基板的製造方法、導電性薄膜的製造方法 Download PDF

Info

Publication number
TW202041364A
TW202041364A TW109109882A TW109109882A TW202041364A TW 202041364 A TW202041364 A TW 202041364A TW 109109882 A TW109109882 A TW 109109882A TW 109109882 A TW109109882 A TW 109109882A TW 202041364 A TW202041364 A TW 202041364A
Authority
TW
Taiwan
Prior art keywords
layer
plated
precursor
transparent substrate
group
Prior art date
Application number
TW109109882A
Other languages
English (en)
Chinese (zh)
Inventor
一木孝彦
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202041364A publication Critical patent/TW202041364A/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
TW109109882A 2019-03-28 2020-03-25 積層體、附被鍍層基板的製造方法、導電性薄膜的製造方法 TW202041364A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-064446 2019-03-28
JP2019064446 2019-03-28

Publications (1)

Publication Number Publication Date
TW202041364A true TW202041364A (zh) 2020-11-16

Family

ID=72610540

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109109882A TW202041364A (zh) 2019-03-28 2020-03-25 積層體、附被鍍層基板的製造方法、導電性薄膜的製造方法

Country Status (4)

Country Link
JP (1) JP7112591B2 (fr)
CN (1) CN113631369B (fr)
TW (1) TW202041364A (fr)
WO (1) WO2020196079A1 (fr)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2533056Y2 (ja) * 1991-11-07 1997-04-16 東洋インキ製造株式会社 感光性インキシート
GB0518609D0 (en) * 2005-09-13 2005-10-19 Eastman Kodak Co Method of forming a flexible heating element
JP4616852B2 (ja) * 2007-03-12 2011-01-19 三菱製紙株式会社 ハロゲン化銀感光材料
JP2010204214A (ja) * 2009-02-27 2010-09-16 Fujifilm Corp フォトマスクブランクス及びフォトマスク
JP5632617B2 (ja) * 2010-02-01 2014-11-26 三菱製紙株式会社 透明導電性材料
JP2011198686A (ja) * 2010-03-23 2011-10-06 Mitsubishi Paper Mills Ltd 光透過性導電シート
CN103460132B (zh) * 2011-04-08 2016-04-27 太阳油墨制造株式会社 感光性组合物、其固化皮膜以及使用了它们的印刷电路板
JP6497850B2 (ja) * 2013-05-08 2019-04-10 コベストロ、ドイチュラント、アクチエンゲゼルシャフトＣｏｖｅｓｔｒｏ Ｄｅｕｔｓｃｈｌａｎｄ Ａｇ ハロー防止層を有するホログラフィック記録媒体およびその製造
JP5961201B2 (ja) * 2013-09-26 2016-08-02 富士フイルム株式会社 粘着剤組成物、粘着シート、タッチパネル用積層体および静電容量式タッチパネル
JP2015161708A (ja) * 2014-02-26 2015-09-07 三菱製紙株式会社 光画像記録材料
CN107407981B (zh) * 2015-03-26 2020-06-02 富士胶片株式会社 触控面板
JP6340378B2 (ja) * 2015-05-11 2018-06-06 富士フイルム株式会社 導電性積層体の製造方法、導電性積層体、タッチセンサー

Also Published As

Publication number Publication date
JPWO2020196079A1 (fr) 2020-10-01
WO2020196079A1 (fr) 2020-10-01
CN113631369A (zh) 2021-11-09
JP7112591B2 (ja) 2022-08-03
CN113631369B (zh) 2023-05-02

Similar Documents

Publication Publication Date Title
TWI695226B (zh) 被鍍覆層形成用組合物、帶被鍍覆層前體層的膜、帶圖案狀被鍍覆層的膜、導電性膜、觸控面板
JP6727309B2 (ja) 被めっき層形成用組成物、被めっき層、被めっき層付き基板、導電性フィルム、タッチパネルセンサー、タッチパネル
JP7402908B2 (ja) 導電性部材、タッチパネルセンサー、タッチパネル、成形体の製造方法
JP6275861B2 (ja) 積層体、導電性積層体およびその製造方法、タッチパネルセンサー、タッチパネル、転写フィルム
CN111902567B (zh) 前体薄膜、基板、触摸面板及其传感器、导电性薄膜及其制造方法和被镀覆层形成用组合物
CN111902885B (zh) 导电性膜、触控面板传感器、触控面板
WO2019189003A1 (fr) Film conducteur, capteur de panneau tactile et panneau tactile
TW202041364A (zh) 積層體、附被鍍層基板的製造方法、導電性薄膜的製造方法
TW201940610A (zh) 前驅物薄膜、附被鍍層基板、導電性薄膜、觸控面板感測器、觸控面板、導電性薄膜的製造方法及被鍍層形成用組成物
TW202105414A (zh) 導電性基板的製造方法
JP2023031084A (ja) 透明発熱体
JP6951312B2 (ja) 被めっき層形成用組成物、被めっき層前駆体層付き基板、被めっき層付き基板、導電性フィルム、タッチパネルセンサー、タッチパネル
JP2023034580A (ja) 透明発熱体、車載ヘッドランプカバーおよびセンサーカバー