TW202038350A - Inkjet chip packaging structure - Google Patents

Abstract

An inkjet chip packaging structure is disclosed and comprises a circuit board, an inkjet chip and plural leads. The circuit board is in a rectangular shape and comprises two long sides, two short sides, plural circuit board pads, plural bare metal areas and an accommodation opening. The plural circuit board pads are disposed on two opposite sides of the accommodation opening. The inkjet chip is disposed within the accommodation opening and comprises plural chip pads. The plural chip pads are respectively disposed on the locations relative to the plural circuit board pads. The plural leads are made by semiconductor wire bonding process, and two ends of each the leads are respectively connected to the corresponding circuit board pad and chip pad, so that the inkjet chip is electrically connected with the bare metal areas through the plural leads.

Description

Inkjet chip packaging structure

This case is about a packaging structure, especially an inkjet chip packaging structure.

With the rapid development of science and technology, there are many areas that need to be overcome in the application of traditional Tape Auto-mated Bonding (TAB) in inkjet chip packaging. As shown in FIGS. 1 to 2B, the conventional inkjet chip packaging structure 1 includes a tape 11, an inkjet chip 12 and a plurality of wires 13. A plurality of exposed metal areas 11a are provided on the tape 11. A plurality of die pads 12a are provided on the inkjet wafer 12. The two ends of the wire 13 are respectively connected to the die pad 12 a of the inkjet chip 12 and the tape 11, so that the inkjet chip 12 is electrically connected to the exposed metal area 11 a of the tape 11 through the wire 13. When performing tape-to-reel automatic bonding, if positioning deviation occurs, if the wire 13 is electrically connected to the adjacent chip bonding pad 12a, a short circuit will occur, which will increase the product defect rate.

Therefore, the traditional tape-and-reel automatic bonding technology is gradually being replaced by flexible printed circuit boards (Flexible Printed Circuit, FPC). Therefore, how to use innovative packaging structures to make flexible printed circuit boards smoothly applied to inkjet chip packaging? Issues that need to be resolved.

The main purpose of this case is to provide an inkjet chip packaging structure that utilizes an innovative packaging structure to enable flexible printed circuit boards to be smoothly applied to inkjet chip packaging, increase production efficiency and reduce product defect rates.

To achieve the above objective, a broader implementation aspect of this case is to provide an inkjet chip packaging structure, which includes a circuit board, an inkjet chip and a plurality of wires. The circuit board has a rectangular shape, has two long sides and two short sides, and includes a plurality of circuit board solder pads, a plurality of metal exposed areas, and an accommodating opening. The circuit board solder pads are arranged on opposite sides of the accommodating opening. The inkjet chip is accommodated in the accommodating opening of the circuit board and includes a plurality of chip bonding pads. The chip bonding pads are respectively arranged corresponding to the positions of the circuit board bonding pads. The wires are made by a semiconductor wire bonding process, and the two ends of each wire are respectively connected to the corresponding circuit board bonding pads and the corresponding chip bonding pads, so that the inkjet chip is electrically connected to the bare metal area through the wires.

The embodiments embodying the features and advantages of this case will be described in detail in the later description. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of the case, and the descriptions and illustrations therein are essentially for illustrative purposes, rather than limiting the case.

Please refer to FIGS. 3 to 4B. In the first embodiment of the present invention, the inkjet chip packaging structure 10 includes a circuit board 2, an inkjet chip 3 and a plurality of wires 4. The circuit board 2 has a rectangular shape, has two long sides 21 and two short sides 22, and includes a plurality of metal exposed areas 2a, a plurality of circuit board soldering pads 2b, and an accommodating opening 2c. The circuit board soldering pads 2b are disposed on opposite sides of the receiving opening 2c corresponding to the short sides 22. In the first embodiment of the present case, the circuit board 2 is a flexible printed circuit board, but it is not limited to this. The inkjet chip 3 is accommodated in the accommodating opening 2c of the circuit board 2 and includes a plurality of chip bonding pads 3a. The chip bonding pads 3a are respectively disposed corresponding to the positions of the circuit board bonding pads 2b, so the chip bonding pads 3a are also disposed on opposite sides of the accommodating opening 2c corresponding to the short sides 22. In the first embodiment of the present case, the inkjet chip 3 has a rectangular shape, but it is not limited to this. The wires 4 are made by a semiconductor wire bonding process, and the two ends of each wire are respectively connected to the corresponding circuit board bonding pad 2b and the corresponding chip bonding pad 3a, so that the inkjet chip 3 is electrically connected to the exposed metal area 2a through the wire 4 . In the first embodiment of the present invention, each circuit board bonding pad 2b and the corresponding chip bonding pad 3a are connected through at least two wires 4, so that the inkjet chip 3 can achieve the electrical characteristics of high voltage and high current. The number of wires 4 matched with each circuit board pad 2b and the corresponding chip pad 3a can be changed according to electrical requirements, and is not limited thereto.

It is worth noting that a plurality of circuit wires (not shown) are provided in the circuit board 2 so that the circuit board soldering pad 2b and the metal exposed area 2a can be electrically connected. In addition, an insulating material (not shown) is provided under each circuit board soldering pad 2b to provide support to the circuit board soldering pad 2b. This feature can be changed according to design requirements, and is not limited thereto.

It should be noted that the material of the circuit board bonding pad 2b and the chip bonding pad 3a is any conductive material. In the first embodiment of the present invention, the circuit board bonding pad 2b and the chip bonding pad 3a are made of metal material, but it is not limited thereto. In the first embodiment of the present case, the material of the wire 4 is any metal material used in the semiconductor bonding process, which can be changed according to the process requirements, and is not limited thereto.

Please refer to Figures 5 and 6, in the second embodiment of the present case, the structure of the inkjet chip packaging structure 10' is approximately the same as the inkjet chip packaging structure 10 in the first embodiment, except that the circuit board is soldered. The placement position of the pad 2b' and the die pad 3a'. In the second embodiment of the present invention, the circuit board bonding pads 2b' and the chip bonding pads 3a' are disposed on opposite sides of the accommodating opening 2c corresponding to the long sides 21, and each circuit board bonding pad 2b' corresponds to the chip The bonding pad 3a' is also connected through at least two wires 4 to realize the high voltage and high current electrical characteristics of the inkjet chip 3.

In summary, this case provides an inkjet chip packaging structure, using an innovative packaging structure, so that flexible printed circuit boards can be smoothly applied to inkjet chip packaging, increasing production efficiency and reducing product defect rates.

This case can be modified in many ways by those who are familiar with this technology, but it is not deviated from the protection of the patent application.

10.10': Inkjet chip packaging structure 2: circuit board 21: Long side 22: short side 2a: Metal exposed area 2b, 2b': circuit board solder pad 2c: containment opening 3: Inkjet wafer 3a, 3a': chip pad 4: Wire 1: Inkjet chip packaging structure 11: Reel 11a: Metal exposed area 12: Inkjet wafer 12a: chip pad 13: Wire

Figure 1 is a schematic diagram of the inkjet chip packaging structure in the prior art. 2A and 2B are partial enlarged schematic diagrams of the ink jet chip packaging structure in the prior art. Figure 3 is a schematic diagram of the inkjet chip packaging structure of the first embodiment of the present invention. 4A and 4B are partial enlarged schematic diagrams of the inkjet chip packaging structure of the first embodiment of the present invention. Figure 5 is a schematic diagram of the ink jet chip packaging structure of the second embodiment of the present invention. Figure 6 is a partially enlarged schematic diagram of the inkjet chip packaging structure of the second embodiment of the present invention.

10: Inkjet chip packaging structure

2: Flexible printed circuit board

21: Long side

22: Long side

2a: Metal exposed area

2c: containment opening

3: Inkjet wafer

4: Wire

Claims (5)

An inkjet chip packaging structure, including: A circuit board has a rectangular shape, has two long sides and two short sides, and includes a plurality of circuit board soldering pads, a plurality of exposed metal areas, and a receiving opening. The circuit board soldering pads are arranged in the receiving Opposite sides of the opening; An inkjet chip is accommodated in the accommodating opening of the circuit board and includes a plurality of chip bonding pads, the chip bonding pads are respectively arranged corresponding to the positions of the circuit board bonding pads; and A plurality of wires are produced by a semiconductor bonding process, and the two ends of each wire are respectively connected to the corresponding circuit board bonding pad and the corresponding chip bonding pad, so that the inkjet chip passes through the wires and the exposed metal areas Electrical connection. In the inkjet chip packaging structure described in item 1 of the scope of patent application, the circuit board is a flexible printed circuit board. In the inkjet chip package structure described in the first item of the patent application, each circuit board bonding pad and the corresponding chip bonding pad are connected by at least two wires. In the inkjet chip packaging structure described in the first item of the patent application, the circuit board bonding pads and the chip bonding pads are disposed in the accommodating opening and corresponding to opposite sides of the long sides. In the inkjet chip package structure described in the first item of the patent application, the circuit board bonding pads and the chip bonding pads are arranged in the accommodating opening and corresponding to opposite sides of the short sides.

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