TWM582231U - Inkjet chip packaging structure - Google Patents

Abstract

An inkjet chip package structure comprising: a circuit board having a rectangular shape, having two long sides and two short sides, and comprising a plurality of circuit board pads, a plurality of metal bare regions, and a receiving opening, the circuit board The soldering pads are disposed on opposite sides of the receiving opening; an inkjet wafer is received in the receiving opening of the circuit board and includes a plurality of wafer pads, and the wafer pads are respectively disposed corresponding to the positions of the circuit board pads And a plurality of wires are formed by a semiconductor wire bonding process, and the opposite ends of each wire are respectively connected with corresponding circuit board pads and corresponding wafer pads, so that the inkjet wafers are electrically connected to the bare metal regions through the wires.

Description

Inkjet chip package structure

This case relates to a package structure, especially a package structure of an inkjet wafer.

With the rapid development of technology, the traditional Tape Auto-mated Bonding (TAB) has many problems to overcome when applying inkjet chip packaging. As shown in FIGS. 1 to 2B, the conventional ink-jet chip package structure 1 includes a tape 11, an ink-jet wafer 12, and a plurality of wires 13. The tape 11 is provided with a plurality of metal bare regions 11a. A plurality of wafer pads 12a are disposed on the inkjet wafer 12. The two ends of the wire 13 are respectively connected to the wafer pad 12a of the inkjet wafer 12 and the tape 11 so that the inkjet wafer 12 is electrically connected to the metal bare region 11a of the tape 11 through the wire 13. When the tape-and-tape automatic bonding is performed, if a positioning offset occurs, the wire 13 is electrically connected to the adjacent wafer pad 12a, which causes a short circuit and increases the product defect rate.

Therefore, the traditional tape and reel automatic bonding technology is gradually replaced by a Flexible Printed Circuit (FPC), so how to use the innovative package structure enables the flexible printed circuit board to be smoothly applied to the inkjet chip package. The issues that need to be addressed now.

The main purpose of this case is to provide an inkjet chip package structure, which utilizes an innovative package structure, so that the flexible printed circuit board can be smoothly applied to the inkjet chip package, thereby increasing production efficiency and reducing product defect rate.

To achieve the above object, a broader aspect of the present invention provides an ink jet chip package structure including a circuit board, an ink jet wafer, and a plurality of wires. The circuit board has a rectangular shape with two long sides and two short sides, and includes a plurality of circuit board pads, a plurality of metal bare areas, and a receiving opening. The circuit board pads are disposed on opposite sides of the receiving opening. The inkjet wafer is housed in a receiving opening of the circuit board and includes a plurality of wafer pads. The wafer pads are respectively disposed corresponding to the positions of the circuit board pads. The wires are formed by a semiconductor wire bonding process, and the opposite ends of each wire are respectively connected with corresponding circuit board pads and corresponding wafer pads, so that the ink-jet wafers are electrically connected to the bare metal regions through the wires.

Embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various embodiments, and is not intended to limit the scope of the invention.

Referring to FIGS. 3 to 4B, in the first embodiment of the present invention, the inkjet chip package structure 10 includes a circuit board 2, an inkjet wafer 3, and a plurality of wires 4. The circuit board 2 is a rectangular shape having two long sides 21 and two short sides 22, and includes a plurality of metal bare regions 2a, a plurality of circuit board pads 2b, and a receiving opening 2c. The circuit board pads 2b are disposed on the opposite sides of the accommodating opening 2c corresponding to the short sides 22. In the first embodiment of the present invention, the circuit board 2 is a flexible printed circuit board, but is not limited thereto. The inkjet wafer 3 is housed in the receiving opening 2c of the circuit board 2 and includes a plurality of wafer pads 3a. The wafer pads 3a are respectively disposed corresponding to the positions of the circuit board pads 2b. Therefore, the wafer pads 3a are also disposed on the opposite sides of the accommodating opening 2c corresponding to the short sides 22. In the first embodiment of the present invention, the inkjet wafer 3 is in a rectangular shape, but is not limited thereto. The wires 4 are formed by a semiconductor wire bonding process, and the corresponding circuit board pads 2b and the corresponding wafer pads 3a are respectively connected to the two ends of the wires, so that the inkjet chips 3 are electrically connected to the metal bare regions 2a through the wires 4. . In the first embodiment of the present invention, each of the circuit board pads 2b and the corresponding wafer pads 3a are connected through at least two wires 4, so that the ink-jet wafer 3 can realize the electrical characteristics of high voltage and high current. The number of the wires 4 of each of the circuit board pads 2b and the corresponding wafer pads 3a can be changed according to the electrical requirements, and is not limited thereto.

It should be noted that a plurality of circuit wires (not shown) are disposed in the circuit board 2, so that the circuit board pad 2b and the metal bare region 2a are electrically connected. In addition, an insulating material (not shown) is disposed under each of the circuit board pads 2b to provide a supporting force to the circuit board pads 2b. This feature may be changed according to design requirements, and is not limited thereto.

It should be noted that the material of the circuit board pad 2b and the wafer pad 3a is any conductive material. In the first embodiment of the present invention, the circuit board pad 2b and the wafer pad 3a are made of metal, but are not limited thereto. In the first embodiment of the present invention, the material of the wire 4 is any metal material used in the semiconductor wire-bonding process, and may be changed according to the process requirements, and is not limited thereto.

Referring to FIG. 5 and FIG. 6, in the second embodiment of the present invention, the structure of the ink-jet chip package structure 10' is substantially the same as that of the ink-jet chip package structure 10 of the first embodiment, except that the board is soldered. The pad 2b' and the placement position of the wafer pad 3a'. In the second embodiment of the present invention, the circuit board pad 2b' and the wafer pad 3a' are disposed on the opposite sides of the receiving opening 2c corresponding to the long side 21, and each of the circuit board pads 2b' and the corresponding wafer The pad 3a' is also connected through at least two wires 4 to achieve the electrical characteristics of the high voltage and high current of the inkjet wafer 3.

In summary, the present invention provides an inkjet chip package structure, which utilizes an innovative package structure to enable a flexible printed circuit board to be smoothly applied to an inkjet chip package, thereby increasing production efficiency and reducing product defect rate.

This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.

10, 10'‧‧‧Inkjet chip package structure  2‧‧‧ boards  21‧‧‧Longside  22‧‧‧ Short side  2a‧‧‧Metal bare area  2b, 2b'‧‧‧ circuit board pads  2c‧‧‧ accommodating opening  3‧‧‧Inkjet wafer  3a, 3a'‧‧‧ wafer pads  4‧‧‧ wire  1‧‧‧Inkjet chip package structure  11‧‧‧ Tapes  11a‧‧‧metal exposed area  12‧‧‧Inkjet wafer  12a‧‧‧ wafer pads  13‧‧‧Wire  

Figure 1 is a schematic illustration of an ink jet chip package structure of the prior art.  2A and 2B are partial enlarged views of the prior art inkjet chip package structure.  Fig. 3 is a schematic view showing the structure of the ink-jet chip package of the first embodiment of the present invention.  4A and 4B are partial enlarged views of the ink-jet chip package structure of the first embodiment of the present invention.  Fig. 5 is a schematic view showing the structure of the ink-jet chip package of the second embodiment of the present invention.  Figure 6 is a partially enlarged schematic view showing the structure of the ink-jet chip package of the second embodiment of the present invention.  

Claims (5)

An inkjet chip package structure comprising:  A circuit board is a rectangular shape having two long sides and two short sides, and includes a plurality of circuit board pads, a plurality of metal bare areas, and a receiving opening, wherein the circuit board pads are disposed in the housing The opposite sides of the opening;  An ink-jet wafer is received in the receiving opening of the circuit board and includes a plurality of wafer pads, respectively, corresponding to positions of the circuit board pads;  a plurality of wires are formed by a semiconductor wire bonding process, and the opposite ends of each wire are respectively connected with the corresponding circuit board pads and the corresponding wafer pads, so that the inkjet chips pass through the wires and the bare metal regions Electrical connection.   The inkjet chip package structure of claim 1, wherein the circuit board is a flexible printed circuit board. The ink-jet chip package structure of claim 1, wherein each of the circuit board pads and the corresponding wafer pads are connected by at least two wires. The ink-jet chip package structure of claim 1, wherein the circuit board pads and the wafer pads are disposed on the receiving opening and correspond to opposite sides of the long sides. The ink-jet chip package structure of claim 1, wherein the circuit board pads and the wafer pads are disposed on the receiving opening and correspond to opposite sides of the short sides.