JP3163214U - Semiconductor device - Google Patents

Abstract

Provided is a semiconductor device which can cope with a case where the direction of a lead wire is multi-directional and can fix a lead wire coated with an insulator on a DCB substrate at low cost. A ring-shaped aluminum wire 5 is fixed to the DCB substrate 1 by bonding, and a conductor portion (copper wire 9) exposed at the tip of a lead wire 7 covered with an insulator 8 is inserted into the ring 6. By fixing with the solder 10, the lead wire 7 can be fixed to the DCB substrate 1 at low cost. Further, by fixing the ring-shaped aluminum wire 5 in a plurality of directions to the DCB substrate 1, it can be fixed to the DCB substrate 1 in accordance with the direction of the lead wire 7. [Selection] Figure 1

Description

  The present invention relates to a semiconductor device in which a lead wire covered with an insulating film is fixed to an insulating substrate with a conductive pattern.

Patent Documents 1 and 2 disclose a method of fixing a lead wire to a printed circuit board. The method will be described.
In Patent Document 1, a land having a lead wire insertion portion and a flexible connection metal fitting with one end narrowed is formed on the periphery of a through hole provided in a printed wiring board near the tip of the lead wire. Fix to. Then, after the leading end of the lead wire is inserted into the lead wire insertion portion of the connection fitting, the connection fitting is press-fitted into the through hole, and the width of the lead wire insertion portion is narrowed by the through hole. Further, it is described that automation is possible by fixing the vicinity of the tip of the lead wire inserted into the lead wire insertion portion to the land, and then soldering the vicinity of the tip of the lead wire and the land.

  Further, in Patent Document 2, in order to manually solder the exposed end portion of the lead wire of the parallel jumper, in the printed wiring board provided with the land to which the solder is attached, the lead wire is placed on the center line of the land. A slit portion with no solder attached, which is slightly narrower than the diameter, is formed. The lower side of the exposed end of the lead wire of the parallel jumper is fitted almost half way into the slit portion, and positioned right above the land. It is preferable that one end of the slit portion is closed with solder so that the end of the lead wire exposed end portion is brought into contact with this one end and positioned not only in the width direction but also in the length direction of the slit portion. As described above, it is described that a printed wiring board can be provided in which a lead wire exposed end portion of a parallel jumper is positioned right above a land and can be soldered efficiently and with high accuracy.

Japanese Patent Laid-Open No. 6-140751 (FIG. 1) Japanese Patent Laying-Open No. 2007-251077 (FIG. 1)

However, in Patent Document 1 and Patent Document 2 described above, a dedicated connection fitting is required, and the manufacturing cost increases.
In this conventional configuration, the direction of the lead wire fixed to the printed circuit board is unidirectional, and it is difficult to cope with the case of multiple directions.

  The object of the present invention is to solve the above-mentioned problems and cope with the case where the direction of the lead wire is multi-directional, and the lead wire coated with the insulating film on the DCB (Direct Copper Bonding) substrate can be fixed at low cost. It is to provide a semiconductor device.

  In order to achieve the above object, according to the invention described in claim 1 of the utility model registration claim, an insulating substrate with a conductive pattern, and a conductive wire fixed to the conductive pattern at a plurality of locations to form a ring, A semiconductor device having a lead wire coated with an insulating film, wherein the insulating film at the tip of the lead wire is removed, and the tip from which the insulating film has been removed is inserted into a ring of the conducting wire, and the tip and the lead The conductive pattern is fixed with a conductive adhesive.

  According to the invention described in claim 2 of the utility model registration claim, an insulating substrate with a conductive pattern, a conductor fixed to the conductive pattern, and a ring-shaped position terminal for positioning a lead wire on the conductor And a lead wire coated with an insulating film, removing the insulating film at the tip of the lead wire, inserting the tip from which the insulating film has been removed into the position terminal, and connecting the tip and the conductive pattern The structure is fixed with a conductive adhesive.

Moreover, according to the device described in claim 3 of the claim for utility model registration, in the device described in claim 1 or 2, the conductive adhesive may be solder.
According to the invention described in claim 4 of the utility model registration claim, in the invention described in claim 1, the conductive wire may be an aluminum wire, a copper wire or a gold wire.

Further, according to the device described in claim 5 of the claim for utility model registration, in the device described in claim 1 or 4, the ring-shaped conducting wire may be arranged in a plurality of directions.
According to the device described in claim 6 of the utility model registration claim, in the device described in claim 2, the position terminals may be arranged in a plurality of directions.

  According to this device, a ring-shaped lead wire (for example, a ring-shaped aluminum wire) is fixed to an insulating substrate with a conductive pattern (for example, a DCB substrate), and the conductor portion is exposed at the tip of the lead covered with an insulating film on the ring. By inserting (for example, conducting wire) and soldering, the lead wire can be fixed to the DCB substrate at a low cost.

In addition, by fixing the ring-shaped conductive wires in a plurality of directions to the DCB substrate, it can be easily fixed to the DCB substrate in accordance with the direction of the lead wires.
In addition, a ring-shaped position terminal is fixed to an insulating substrate with a conductive pattern (for example, a DCB substrate), and a conductor portion (for example, a conductive wire) in which the tip of a lead covered with an insulating film is exposed on the ring is inserted and soldered. By attaching, the lead wire can be fixed to the DCB substrate at low cost.

  Further, by fixing the ring-shaped position terminals in a plurality of directions to the DCB substrate, it can be easily fixed to the DCB substrate in accordance with the direction of the lead wire.

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram of the semiconductor device of 1st Example of this invention, (a) is a principal part perspective view of a ring-shaped aluminum wire part, (b) is principal part sectional drawing of a ring-shaped aluminum wire part. It is a manufacturing method of the semiconductor device of 2nd Example of this invention, (a)-(c) is principal part manufacturing process sectional drawing shown to process order. It is a figure in the case of three cases which changed the direction in the layout drawing of the ring-shaped aluminum wire 5. FIG. It is a principal part top view of the semiconductor device of 3rd Example of this invention. It is a figure of the position terminal part vicinity of the A section of FIG. 4, (a) is a principal part perspective view, (b) is principal part sectional drawing. FIGS. 6A to 6C are diagrams illustrating a method for manufacturing the semiconductor device of FIGS. 4 and 5, and FIGS.

  Embodiments will be described in the following examples.

FIG. 1 is a block diagram of a semiconductor device according to a first embodiment of the present invention. FIG. 1 (a) is a perspective view of a main part near a ring-shaped aluminum wire, and FIG. FIG.
This semiconductor device includes a DCB substrate 1 that is an insulating substrate with a conductive pattern, a semiconductor chip (not shown) fixed to the conductive pattern 2 of the DCB substrate 1, a bonding wire (not shown) that connects the semiconductor chip and the conductive pattern, and a conductive pattern 2 And a lead wire 7 inserted into the ring 6 of the aluminum wire 5 and a solder 10 for fixing the lead wire 7 and the conductive pattern 2 to each other. In the figure, reference numeral 3 is a ceramic substrate, 4 is a backside copper foil, 8 is an insulating film, and 9 is a copper wire. The conductive pattern 2 is formed of copper foil or the like.

  Thus, by fixing the ring-shaped aluminum wire 5 to the conductive pattern 2 by wire bonding, the expensive position terminal 11 as shown in FIG. 5 becomes unnecessary, and the manufacturing cost can be reduced.

  In FIG. 1, the ring-shaped aluminum wire 2 is shown as a single piece. However, when the ring-shaped aluminum wires 2 are arranged in parallel to the two pieces and fixed to the two ring-shaped aluminum wires 5 through the copper wire 9 with the solder 10, Become.

  Here, “annular” refers to a state in which a hole through which the copper wire 9 is formed by the aluminum wire 5 bent in an arc shape and the conductive pattern 2 and a state in which a ring is formed by the aluminum wire 5 itself. At least.

Next, a method for manufacturing the semiconductor device of FIG. 1 will be described.
FIG. 2 shows a method of manufacturing a semiconductor device according to the second embodiment of the present invention. FIGS. 2A to 2C are cross-sectional views of the main part manufacturing process shown in the order of processes. This process sectional view is a sectional view corresponding to FIG.

  First, as shown in FIG. 1A, several wires 6 having a thickness of about 0.3 mm are bonded to the conductive pattern 2 of the DCB substrate 1 and a plurality of continuous rings 6 are formed with the aluminum wire 5. 3 are formed. The size of the ring 6 is such that the height from the conductive pattern 2 is about 0.5 mm to 0.7 mm. Thereafter, the aluminum wire 5 on which the ring 6 is not formed is cut and separated from the ring-shaped aluminum wire 5. A normal aluminum wire bonding apparatus is used to make the aluminum wire 5 into a ring shape. The annular aluminum wire 5 serves as the position terminal 11 shown in FIG.

  Next, as shown in FIG. 2B, the insulating film 8 at the tip of the lead wire 7 covered with the insulating film 8 is removed to expose a copper wire 9 having a thickness of about 0.3 mm to 0.5 mm. To. Subsequently, the copper wire 9 at the tip of the exposed lead wire 7 is inserted into the ring 6.

Next, as shown in FIG. 2C, the copper wire 9 at the tip of the exposed lead wire 7 and the conductive pattern 2 are fixed with solder 10.
That is, in the method of manufacturing the semiconductor device according to the second embodiment, a conductive wire is fixed to a conductive pattern of an insulating substrate with a conductive pattern at a plurality of locations, a ring is formed with the conductive wire, and the ring is covered with an insulating film. Removing the insulating film at the tip of the lead wire, inserting the tip from which the insulating film has been removed into the ring, positioning the tip, and fixing the tip and the conductive pattern with solder; Is included.
FIG. 3 is a diagram showing three cases in which the directions are changed in the layout of the ring-shaped aluminum wires 5. In the above description, the ring-shaped aluminum wire 5 is arranged in one direction. However, as shown in FIG. 5 can be easily inserted. These patterns are views of the ring-shaped aluminum wire 5 viewed from directly above.

  FIG. 4A shows a pattern that can be used when the direction in which the lead wire 7 is inserted is the longitudinal direction of the DCB substrate 1 and the direction perpendicular thereto. FIG. 6B shows a pattern that can be used when the direction in which the lead wire 7 is inserted is oblique with respect to the longitudinal direction of the DCB substrate 1. FIG. 6C shows a pattern in which the direction in which the lead wire 7 is inserted can correspond to the longitudinal direction of the DCB substrate 1, the direction perpendicular to the longitudinal direction, and the oblique direction. A plurality of aluminum wires 5 are bonded at a location where the ring-shaped aluminum wires 5 intersect.

In this way, by bonding a plurality of ring-shaped aluminum wires 5 having different directions to the conductive pattern 2, the lead wires 7 having different directions can be easily fixed to the conductive pattern 2.
Instead of the aluminum wire 5, a conductive wire that can be bonded, such as a copper wire or a gold wire, may be used. The DCB substrate 1 may be a printed circuit board. The lead wire 7 may be a single wire or a stranded wire.

  FIG. 4 is a plan view of an essential part of a semiconductor device according to a third embodiment of the present invention. In this semiconductor device, a lead wire 7 covered with an insulating film 8 is fixed to a DCB substrate 1 with solder 10 via a positioning terminal 11.

  5A and 5B are configuration diagrams in the vicinity of the position terminal of the portion A in FIG. 4, in which FIG. 5A is a perspective view of the main part, and FIG. 5B is a cross-sectional view of the main part. The perspective view of FIG. 4A is a view seen from the perspective direction indicated by the arrow in FIG.

  4 and 5, the semiconductor device includes a DCB substrate 1 which is an insulating substrate with a conductive pattern, semiconductor chips 14 and 15 fixed to the conductive pattern 2 of the DCB substrate 1, semiconductor chips 14 and 15 and the semiconductor chips 14. , 15 and the conductive wire 2 for connecting the conductive pattern 2, the positioning position terminal 11 fixed to the conductive pattern 2, the lead wire 7 inserted in the ring portion 12 formed on the position terminal 11, and the lead It is mainly composed of solder 10 for fixing the wire 7 and the position terminal 11. The lead wire 7 is connected to an external lead terminal (not shown). The DCB substrate 1 is a substrate on which a conductive pattern 2 such as a copper foil patterned on the ceramic substrate 3 is formed. The position terminal 11 is made from a copper material or the like by brazing. Moreover, the structure of the location relevant to this invention is described here. Next, a method for manufacturing the semiconductor device will be described.

6A to 6C are main part manufacturing process perspective views showing the manufacturing method of the semiconductor device of FIGS. 4 and 5 in the order of steps. FIG. 6C is a cross-sectional view corresponding to FIG.
First, as shown in FIG. 2A, a position terminal 11 for positioning the tip of the lead wire 7 is fixed to the conductive pattern 2 of the DCB substrate 1. A conductor for positioning the position terminal 11 may be interposed between the position terminal 11 and the conductive pattern 2. In this case, the bonding of the conductor is preferably performed by ultrasonic bonding or the like.

  Next, as shown in FIG. 2B, the insulating film 8 at the tip of the lead wire 7 covered with the insulating film 8 is removed, and the copper wire 9 is exposed. Subsequently, the exposed copper wire 9 is inserted into the ring portion 12 of the position terminal 11.

Next, as shown in FIG. 2C, the exposed copper wire 9 and the ring portion 12 of the position terminal 11 are fixed with solder 10, and the lead wire 7 is fixed to the DCB substrate 1.
That is, the manufacturing method of the semiconductor device includes a step of fixing a position terminal for positioning the lead wire to the conductive pattern of the insulating substrate with the conductive pattern, and the tip of the lead wire covered with the insulating film on the position terminal. Removing the insulating film, inserting the tip from which the insulating film has been removed into the position terminal to position the tip, and fixing the tip to the conductor and the conductive pattern with solder. Yes.
If the position terminal is replaced with a position terminal having a plurality of orientations as shown in FIG. 3, it can also be applied to fixing lead wires having different orientations.

DESCRIPTION OF SYMBOLS 1 DCB board 2 Conductive pattern 3 Ceramic board 4 Back surface copper foil 5 Aluminum wire 6 Ring 7 Lead wire 8 Insulating film 9 Copper wire 10 Solder 11 Position terminal 12 Ring part 14, 15 Semiconductor chip 16 Bonding wire

Claims (8)

An insulating substrate with a conductive pattern; a conductive wire fixed to the conductive pattern at a plurality of locations to form a ring; and a lead wire coated with an insulating film; and removing the insulating film at the tip of the lead wire; A semiconductor device, wherein a tip from which an insulating film has been removed is inserted into a ring of the conducting wire, and the tip and the conductive pattern are fixed with a conductive adhesive. An insulating substrate with a conductive pattern, a conductor fixed to the conductive pattern, a ring-shaped position terminal for positioning a lead wire on the conductor, and a lead wire coated with an insulating film, the lead wire The semiconductor device is characterized in that the insulating film at the tip of the insulating film is removed, the tip from which the insulating film has been removed is inserted into the position terminal, and the tip and the conductive pattern are fixed with a conductive adhesive. The semiconductor device according to claim 1, wherein the conductive adhesive is solder. The semiconductor device according to claim 1, wherein the conducting wire is an aluminum wire, a copper wire, or a gold wire. The semiconductor device according to claim 1, wherein the ring-shaped conducting wire is arranged in a plurality of directions. The semiconductor device according to claim 2, wherein the position terminals are arranged in a plurality of directions. A step of fixing a conductive wire to a conductive pattern of an insulating substrate with a conductive pattern at a plurality of locations, forming a ring with the conductive wire, and removing the insulating film at the tip of the lead wire covered with the insulating film on the ring, A method of manufacturing a semiconductor device, comprising: inserting a tip from which the film has been removed into the ring to position the tip; and fixing the tip and the conductive pattern with solder. A step of fixing a lead wire positioning position terminal to a conductive pattern of an insulating substrate with a conductive pattern, and removing the insulating film at the tip of the lead wire covered with the insulating film on the position terminal, and removing the insulating film A method of manufacturing a semiconductor device, comprising: inserting the formed tip into the position terminal and positioning the tip; and fixing the tip, the conductor and the conductive pattern with solder.