TW202036165A - LED lighting device and exposure machine capable of improving the productivity and yield of edge exposure, and saving the cost of spare parts - Google Patents

LED lighting device and exposure machine capable of improving the productivity and yield of edge exposure, and saving the cost of spare parts Download PDF

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TW202036165A
TW202036165A TW108135575A TW108135575A TW202036165A TW 202036165 A TW202036165 A TW 202036165A TW 108135575 A TW108135575 A TW 108135575A TW 108135575 A TW108135575 A TW 108135575A TW 202036165 A TW202036165 A TW 202036165A
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module
light source
lens
lighting device
aforementioned
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TWI725565B (en
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田翠俠
馬鵬川
夏海
于大維
胡松立
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大陸商上海微電子裝備(集團)股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G02B19/0014Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938Using specific optical elements
    • G02B27/095Refractive optical elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938Using specific optical elements
    • G02B27/095Refractive optical elements
    • G02B27/0955Lenses
    • G02B27/0961Lens arrays
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938Using specific optical elements
    • G02B27/0988Diaphragms, spatial filters, masks for removing or filtering a part of the beam
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2008Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used

Abstract

An embodiment of the present invention discloses an LED lighting device and an exposure machine. The LED lighting device includes: an LED light source module, a light source control module, a uniform illumination module, an imaging module, and a field of view adjustment module; the light source control module is connected to the LED light source module, and is used to control the light emitting state of the LED light source module; the uniform illumination module is used to uniform the light beam emitted by the LED light source module; the field of view adjustment module is used to adjust the size of the field of view of the light beam emitted by the uniform illumination module/ the imaging module is used to project the light beam emitted by the field of view adjustment module to an illumination position. The scheme of the embodiment of the present invention can effectively solve the problems of switch delay of the lighting device, low illuminance and short service life, so as to improve the productivity and yield of edge exposure and save the cost of spare parts.

Description

一種LED照明裝置及曝光機 LED lighting device and exposure machine

本發明實施例關於邊緣曝光技術,特別關於一種LED照明裝置及曝光機。 The embodiment of the present invention relates to edge exposure technology, and particularly relates to an LED lighting device and exposure machine.

矽片邊緣曝光(WEE)是IC電路製造非常重要的工藝之一。因矽片邊緣存在裂紋,判斷方向的缺口(Notch),以及光刻膠的剩餘物、清洗的污染物及鍍膜、刻蝕、拋光的不均勻等缺陷問題,導致矽片邊緣不能使用或即使整個矽片邊緣佈滿晶片,但仍會因矽片邊緣的問題而成為廢片,這就需要將矽片邊緣部分區域的光刻膠提前曝光去除掉。 Wafer edge exposure (WEE) is one of the very important processes in IC circuit manufacturing. Due to cracks on the edge of the silicon wafer, notch to determine the direction, as well as defects such as photoresist residues, cleaning contaminants and uneven coating, etching, and polishing, the edge of the silicon wafer cannot be used or even the entire The edge of the silicon wafer is full of wafers, but it will still become a waste piece due to the problem of the edge of the silicon wafer. This requires the photoresist on the edge of the silicon wafer to be exposed and removed in advance.

電鍍在IC電路後道封裝工藝中,需要利用矽片邊緣做陽極,矽片中間的電鍍視窗為陰極,藉由控制陰陽極之間的電流大小及電鍍液的濃度來控制金屬凸塊(Bump)的高度。因光刻膠不導電,因此在電鍍工藝之前需要將矽片邊緣的光刻膠去掉,而去邊寬度大小取決於WEE工藝的去邊寬度需求。再者,在部分特殊的工藝中進一步會要求對矽片邊緣內部一定寬度的環形區域進行曝光,這對邊緣曝光系統的光斑尺寸調整、能量利用率、光源回應時間、曝光產率、產品使用壽命等諸多方面提出更高的要求。 Plating In the IC circuit packaging process, it is necessary to use the edge of the silicon wafer as the anode, and the electroplating window in the middle of the silicon wafer as the cathode. The metal bump is controlled by controlling the current between the anode and the cathode and the concentration of the plating solution. the height of. Because the photoresist is not conductive, the photoresist on the edge of the silicon wafer needs to be removed before the electroplating process, and the edge removal width depends on the edge removal width requirement of the WEE process. Moreover, in some special processes, it is further required to expose a certain width of the ring area inside the edge of the silicon wafer, which affects the spot size adjustment, energy utilization, light source response time, exposure yield, and product life of the edge exposure system. Many other aspects put forward higher requirements.

然而,先前邊緣曝光機採用汞燈作為光源,存在開關延時、照度低且壽命較短,頻繁更換,浪費備件成本的問題。 However, the previous edge exposure machines used mercury lamps as the light source, which had the problems of switching delay, low illuminance and short life, frequent replacement, and waste of spare parts cost.

本發明提供一種LED照明裝置及曝光機,可有效解決照明裝置開關延時、照度低及壽命短的問題,提高邊緣曝光的產率及良率,並節約備件成本。 The invention provides an LED lighting device and an exposure machine, which can effectively solve the problems of lighting device switching delay, low illuminance and short life, improve the yield and yield of edge exposure, and save the cost of spare parts.

第一方面,本發明實施例提供一種LED照明裝置,包含: In the first aspect, an embodiment of the present invention provides an LED lighting device, including:

LED光源模組,光源控制模組,勻光模組,成像模組及視場調整模組; LED light source module, light source control module, homogenization module, imaging module and field of view adjustment module;

前述光源控制模組與前述LED光源模組連接,用於控制前述LED光源模組的發光狀態; The aforementioned light source control module is connected to the aforementioned LED light source module for controlling the light-emitting state of the aforementioned LED light source module;

前述勻光模組用於對前述LED光源模組發出的光束進行勻光; The aforementioned homogenization module is used to homogenize the light beam emitted by the aforementioned LED light source module;

前述視場調整模組用於調整前述勻光模組出射的光束的視場大小; The aforementioned field of view adjustment module is used to adjust the size of the field of view of the light beam emitted by the aforementioned homogenization module;

前述成像模組用於將前述視場調整模組出射的光束投射到照明位置。 The aforementioned imaging module is used to project the light beam emitted by the aforementioned field of view adjustment module to the illumination position.

選擇性地,前述視場調整模組包含多個光闌,前述多個光闌開孔大小不同且可切換地進入照明光路中。 Optionally, the field of view adjustment module includes a plurality of apertures, and the apertures of the plurality of apertures are of different sizes and can be switched into the illumination light path.

選擇性地,前述多個光闌的開孔中心之間的距離均大於等於12mm。 Optionally, the distances between the centers of the openings of the plurality of diaphragms are all greater than or equal to 12 mm.

選擇性地,前述多個光闌的開孔沿曝光寬度方向的尺寸依次增大,其他方向的尺寸均相等。 Optionally, the size of the apertures of the plurality of diaphragms along the exposure width direction increases sequentially, and the sizes in other directions are all equal.

選擇性地,前述LED光源模組包含LED發光單元及聚焦透鏡。 Optionally, the aforementioned LED light source module includes an LED light-emitting unit and a focusing lens.

選擇性地,前述成像模組包含沿光路依次設置的第一雙凸透鏡、第一凸凹透鏡、第二雙凸透鏡、第三雙凸透鏡、第一凹凸透鏡以及第四雙凸透鏡; Optionally, the aforementioned imaging module includes a first biconvex lens, a first convex-concave lens, a second bi-convex lens, a third bi-convex lens, a first meniscus lens, and a fourth bi-convex lens arranged in sequence along the optical path;

前述第一雙凸透鏡設置於前述第一凸凹透鏡鄰近前述LED光源模組的一側。 The first biconvex lens is arranged on a side of the first convex-concave lens adjacent to the LED light source module.

選擇性地,前述勻光模組包含第一石英棒。 Optionally, the aforementioned homogenization module includes a first quartz rod.

選擇性地,前述LED光源模組包含LED發光單元陣列。 Optionally, the aforementioned LED light source module includes an LED light emitting unit array.

選擇性地,前述勻光模組包含微透鏡陣列及第二石英棒; Optionally, the aforementioned homogenization module includes a microlens array and a second quartz rod;

前述微透鏡陣列沿光路設置於前述第二石英棒鄰近前述LED光源模組的一側。 The microlens array is arranged on the side of the second quartz rod adjacent to the LED light source module along the optical path.

選擇性地,前述第二石英棒的出射端面的面積大於入射端面的面積。 Optionally, the area of the exit end surface of the aforementioned second quartz rod is larger than the area of the entrance end surface.

選擇性地,該LED照明裝置進一步包含: Optionally, the LED lighting device further includes:

光學擋片,沿光路設置於前述LED光源模組及前述勻光模組之間,前述光學擋片用於調整前述LED光源模組出射光束的數值孔徑。 The optical baffle is arranged between the LED light source module and the homogenizing module along the optical path, and the optical baffle is used to adjust the numerical aperture of the light beam emitted by the LED light source module.

選擇性地,成像模組包含沿光路依次設置的第二凹凸透鏡、第五雙凸透鏡、第二凸凹透鏡、第三凸凹透鏡、第六雙凸透鏡、反射鏡、第一雙凹透鏡、第三凹凸透鏡、第七雙凸透鏡以及平面透鏡; Optionally, the imaging module includes a second concave-convex lens, a fifth bi-convex lens, a second convex-concave lens, a third convex-concave lens, a sixth bi-convex lens, a mirror, a first bi-concave lens, and a third concave-convex lens arranged in sequence along the optical path. , The seventh biconvex lens and flat lens;

第二凹凸透鏡設置於第五雙凸透鏡鄰近LED光源模組的一側。 The second concave-convex lens is arranged on the side of the fifth biconvex lens adjacent to the LED light source module.

第二方面,本發明實施例進一步提供一種曝光機,包含本發明任意實施例前述的LED照明裝置。 In the second aspect, an embodiment of the present invention further provides an exposure machine including the aforementioned LED lighting device in any embodiment of the present invention.

選擇性地,該曝光機進一步包含: Optionally, the exposure machine further includes:

第一運動零件,前述第一運動零件用於帶動LED照明裝置的視場調整模組運動,切換不同的光闌。 The first moving part, the aforementioned first moving part is used to drive the field of view adjustment module of the LED lighting device to move and switch different apertures.

本發明實施例提供的LED照明裝置採用LED光源模組,因LED發光單元能量照度高,能耗小,使用壽命長,回應較快,可有效解決LED照明裝置開關延時、照度低及壽命短的問題,提高邊緣曝光的產率及良率,並節約備件成本。 The LED lighting device provided by the embodiment of the present invention adopts the LED light source module. Because the LED light-emitting unit has high energy illuminance, low energy consumption, long service life, and quick response, it can effectively solve the problems of LED lighting device switching delay, low illuminance and short life. Problem, improve the yield and yield of edge exposure, and save the cost of spare parts.

10‧‧‧LED光源模組 10‧‧‧LED light source module

20‧‧‧光源控制模組 20‧‧‧Light source control module

30‧‧‧勻光模組 30‧‧‧Uniform light module

40‧‧‧視場調整模組 40‧‧‧Field of View Adjustment Module

50‧‧‧成像模組 50‧‧‧Imaging module

【圖1】為本發明實施例提供的一種LED照明裝置的示意圖。 [Figure 1] is a schematic diagram of an LED lighting device provided by an embodiment of the present invention.

【圖2】為本發明實施例提供的一種視場調整模組的示意圖。 [Figure 2] is a schematic diagram of a field of view adjustment module provided by an embodiment of the present invention.

【圖3】為本發明實施例提供的一種LED照明裝置的結構示意圖。 [Fig. 3] is a schematic structural diagram of an LED lighting device provided by an embodiment of the present invention.

【圖4】為視場調整模組與勻光模組的位置示意圖。 [Figure 4] is a schematic diagram of the position of the field of view adjustment module and the uniform light module.

【圖5】為本發明實施例提供的成像模組的示意圖。 [Figure 5] is a schematic diagram of an imaging module provided by an embodiment of the present invention.

【圖6】為本發明實施例提供的又一種LED照明裝置的示意圖。 [Figure 6] is a schematic diagram of yet another LED lighting device provided by an embodiment of the present invention.

【圖7】為一種微透鏡陣列的示意圖。 [Figure 7] is a schematic diagram of a microlens array.

【圖8】為本發明實施例提供的又一種成像模組的示意圖。 [Fig. 8] is a schematic diagram of another imaging module provided by an embodiment of the present invention.

【圖9】為本發明實施例提供的一種曝光機的示意圖。 [Fig. 9] is a schematic diagram of an exposure machine provided by an embodiment of the present invention.

下面結合圖式及實施例對本發明作進一步的詳細說明。可以理解的為,此處所描述的具體實施例僅用於解釋本發明,而非對本發明的限定。又進一步需要說明的為,為了便於描述,圖式中僅示出與本發明相關的部分而非全部結構。 The present invention will be further described in detail below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. It should be further noted that, for ease of description, only a part of the structure related to the present invention but not all of the structure is shown in the drawings.

本發明提供一種LED照明裝置,圖1是本發明實施例提供的一種LED照明裝置的示意圖,參考圖1,該裝置包含: The present invention provides an LED lighting device. FIG. 1 is a schematic diagram of an LED lighting device provided by an embodiment of the present invention. Referring to FIG. 1, the device includes:

LED光源模組10,光源控制模組20,勻光模組30,視場調整模組40及成像模組50; LED light source module 10, light source control module 20, homogenization module 30, field of view adjustment module 40 and imaging module 50;

光源控制模組20與LED光源模組10連接,用於控制LED光源模組10的發光狀態; The light source control module 20 is connected to the LED light source module 10 and is used to control the light-emitting state of the LED light source module 10;

勻光模組30用於對LED光源模組10發出的光束進行勻光; The homogenization module 30 is used to homogenize the light beam emitted by the LED light source module 10;

視場調整模組40用於調整勻光模組30出射的光束的視場大小; The field of view adjustment module 40 is used to adjust the field of view of the light beam emitted by the homogenization module 30;

成像模組50用於將視場調整模組40出射的光束投射到照明位置。 The imaging module 50 is used for projecting the light beam emitted by the field of view adjustment module 40 to the illumination position.

其中,LED光源模組10包含至少一個發光二極體(Light Emitting Diode,LED)發光單元,多個LED發光單元的發光波長可以相同亦可以不同。LED光源模組10的發光波段可以包含365nm、385nm、395nm、400nm、425nm等。具體的,LED發光單元能量照度高,與常規弧光燈相比LED發光單元能耗非常小,可有效節能,且LED發光單元的使用壽命較長,無需頻繁更換,此外LED發光單元的開啟及關閉時間僅 有25ms,回應較快,可有效解決照明裝置開關延時、照度低及壽命短的問題,提高邊緣曝光的產率及良率,並節約備件成本。 Wherein, the LED light source module 10 includes at least one light emitting diode (Light Emitting Diode, LED) light emitting unit, and the light emitting wavelengths of the multiple LED light emitting units may be the same or different. The light-emitting wavelength band of the LED light source module 10 may include 365 nm, 385 nm, 395 nm, 400 nm, 425 nm, and so on. Specifically, the LED light-emitting unit has high energy illuminance, and the energy consumption of the LED light-emitting unit is very small compared with the conventional arc lamp, which can effectively save energy, and the LED light-emitting unit has a long service life without frequent replacement. In addition, the LED light-emitting unit is turned on and off Time only It has 25ms, and the response is fast, which can effectively solve the problems of lighting device switching delay, low illuminance and short life, improve the yield and yield of edge exposure, and save the cost of spare parts.

光源控制模組20用於控制LED光源模組10的開啟或關閉,光源控制模組20接收曝光劑量,並根據曝光劑量控制LED光源模組10的照度。此外,光源控制模組20進一步用於監控LED光源模組10的溫度以及壽命等參數,使LED光源模組10在照射期間光學穩定性自動維持在±5%以內,實現自動閉環校準,進一步提高邊緣曝光的產率及良率。光源控制模組20可以包含PLC控制器以及光耦合器器件等。 The light source control module 20 is used to control the turning on or off of the LED light source module 10. The light source control module 20 receives the exposure dose and controls the illuminance of the LED light source module 10 according to the exposure dose. In addition, the light source control module 20 is further used to monitor the temperature and lifespan of the LED light source module 10, so that the optical stability of the LED light source module 10 is automatically maintained within ±5% during the irradiation period, which realizes automatic closed-loop calibration and further improves The yield and yield of edge exposure. The light source control module 20 may include a PLC controller, an optical coupler device, and the like.

因LED發光單元出光端的光斑能量分佈不均勻,為了獲得均勻分佈的照射光斑,需要進行勻光,勻光模組30可以採用石英棒等勻光器件,本實施例並不做具體限定。此外,藉由設置視場調整模組40,可以方便的調整光束的視場大小,滿足不同的曝光寬度需求,提高工藝適應性。成像模組50用於將光束彙聚成像到矽片面上,實現指定區域的曝光。 Because the spot energy distribution at the light emitting end of the LED light-emitting unit is uneven, in order to obtain a uniformly distributed illumination spot, it is necessary to perform homogenization. The homogenization module 30 may use a homogenization device such as a quartz rod, which is not specifically limited in this embodiment. In addition, by providing the field of view adjustment module 40, the size of the field of view of the light beam can be conveniently adjusted to meet the requirements of different exposure widths and improve process adaptability. The imaging module 50 is used to converge and image the light beam on the surface of the silicon wafer to achieve exposure of a specified area.

本實施例提供的LED照明裝置採用LED光源模組10,因LED能量照度高,能耗小,使用壽命長,回應較快,可有效解決LED照明裝置開關延時、照度低及壽命短的問題,提高邊緣曝光的產率及良率,並節約備件成本。 The LED lighting device provided in this embodiment adopts the LED light source module 10. Because the LED has high energy illuminance, low energy consumption, long service life, and quick response, it can effectively solve the problems of LED lighting device switching delay, low illuminance and short life. Improve the yield and yield of edge exposure, and save the cost of spare parts.

圖2是本發明實施例提供的一種視場調整模組的示意圖,選擇性地,參考圖2,視場調整模組40包含多個光闌41,多個光闌41開孔大小不同且可切換地進入照明光路中。 2 is a schematic diagram of a field of view adjustment module provided by an embodiment of the present invention. Optionally, referring to FIG. 2, the field of view adjustment module 40 includes a plurality of apertures 41, and the apertures of the plurality of apertures 41 are of different sizes and can be Switch to enter the illumination light path.

其中,不同開孔大小的光闌41對應不同大小的視場,可以 藉由切換不同開孔的光闌41調整視場大小,從而調整曝光尺寸。示例性的,視場調整模組40可以包含光闌座42以及固定於光闌座42上的多個光闌41,藉由移動光闌座42實現不同光闌41的切換。 Among them, the aperture 41 with different opening sizes corresponds to different sizes of field of view, which can The size of the field of view is adjusted by switching the diaphragm 41 with different openings, thereby adjusting the exposure size. Exemplarily, the field of view adjustment module 40 may include an aperture base 42 and a plurality of apertures 41 fixed on the aperture base 42, and the switching of different apertures 41 is realized by moving the aperture base 42.

選擇性地,多個光闌41的開孔中心之間的距離均大於等於12mm。 Optionally, the distance between the aperture centers of the plurality of diaphragms 41 is greater than or equal to 12 mm.

具體的,若光闌41的中心距離太小,相鄰的光闌41之間容易對曝光視場產生影響,藉由設置光闌41的開孔中心之間的距離均大於等於12mm,保證曝光的穩定性,示例性的,相鄰光闌41的開孔中心距離可以設置為23mm,光闌41的外形尺寸可以設置為22mm×15mm。 Specifically, if the center distance of the aperture 41 is too small, the adjacent apertures 41 are likely to affect the exposure field of view. By setting the distance between the aperture centers of the aperture 41 to be greater than or equal to 12 mm, the exposure is guaranteed. For example, the distance between the centers of the openings of adjacent apertures 41 can be set to 23mm, and the outer dimension of the aperture 41 can be set to 22mm×15mm.

具體的,光闌41的開孔尺寸可以根據不同的曝光寬度要求進行設定,可以設置光闌41開孔沿曝光寬度方向的尺寸依次增大,各光闌41其他方向的尺寸可以設置為均相等,示例性的可以均設置為2mm、3mm或5mm等。表1示出光闌41開孔的具體尺寸。其中,開孔尺寸指光闌41開孔沿曝光寬度方向的尺寸,鏡頭倍率指成像模組的放大倍率,像尺寸指成像模組照明束所成的像的尺寸,負膠偏差及正膠偏差分別指採用負性光刻膠及採用正性光刻膠時的曝光尺寸偏差。負膠曝光寬度以及正膠曝光寬度分別指相應的開口尺寸時採用負膠及正膠進行曝光時的曝光寬度。可以根據不同的曝光寬度需要選擇相應的開孔尺寸。 Specifically, the aperture size of the aperture 41 can be set according to different exposure width requirements. The aperture of the aperture 41 can be set to increase in size along the exposure width direction, and the sizes of the apertures 41 in other directions can be set to be equal. , The exemplary can be set to 2mm, 3mm or 5mm. Table 1 shows the specific dimensions of the aperture of the diaphragm 41. Among them, the aperture size refers to the size of the aperture 41 along the exposure width direction, the lens magnification refers to the magnification of the imaging module, and the image size refers to the size of the image formed by the imaging module's illumination beam, negative glue deviation and positive glue deviation Refers to the exposure size deviation when using negative photoresist and using positive photoresist respectively. The negative glue exposure width and the positive glue exposure width respectively refer to the exposure width when the negative glue and the positive glue are used for exposure when the corresponding opening size is used. The corresponding opening size can be selected according to different exposure width needs.

表1

Figure 108135575-A0202-12-0008-2
Table 1
Figure 108135575-A0202-12-0008-2

圖3是本發明實施例提供的一種LED照明裝置的結構示意圖,選擇性地,參考圖3,LED光源模組10包含LED發光單元11及聚焦透鏡12。 FIG. 3 is a schematic structural diagram of an LED lighting device provided by an embodiment of the present invention. Optionally, referring to FIG. 3, the LED light source module 10 includes an LED light-emitting unit 11 and a focusing lens 12.

其中,聚焦透鏡12用於彙聚LED發光單元11發射的光束,使LED發光單元11發射的光束更多的進入勻光模組30,提高光能利用率。 Among them, the focusing lens 12 is used to converge the light beam emitted by the LED light-emitting unit 11, so that the light beam emitted by the LED light-emitting unit 11 enters the homogenizing module 30 more, and improves the light energy utilization rate.

選擇性地,繼續參考圖3,勻光模組30包含第一石英棒。 Optionally, referring to FIG. 3 continuously, the homogenization module 30 includes a first quartz rod.

具體的,第一石英棒藉由將光束在其內部進行多次反射,達到勻光的目的。其中,第一石英棒入射端面及出射端面的截面尺寸可以相同,即第一石英棒為長方體形。為了滿足均勻性需求,第一石英棒需要達到一定的長寬比。第一石英棒入射端面及出射端面的寬度與第一石英棒 沿光束傳輸方向的長度的比值,決定勻光效果,其中,第一石英棒入射端面及出射端面的寬度及高度由LED照明裝置的物方視場尺寸決定。示例性的,第一石英棒尺寸可以設置為9.4mm×9.4mm×175mm。 Specifically, the first quartz rod achieves the purpose of uniform light by reflecting the light beam multiple times inside it. Wherein, the cross-sectional dimensions of the incident end surface and the exit end surface of the first quartz rod may be the same, that is, the first quartz rod is a rectangular parallelepiped. In order to meet the uniformity requirement, the first quartz rod needs to achieve a certain aspect ratio. The width of the incident end face and the exit end face of the first quartz rod is the same as that of the first quartz rod The ratio of the length along the transmission direction of the light beam determines the uniform light effect. The width and height of the incident end surface and the output end surface of the first quartz rod are determined by the object field size of the LED lighting device. Exemplarily, the size of the first quartz rod may be set to 9.4mm×9.4mm×175mm.

此外,LED光源模組的出射數值孔徑較大時,則進入第一石英棒的光束的入射角度較大,光束不能滿足全反射條件,可以對第一石英棒的四個反射面鍍全反射膜,從而提高光能利用率。 In addition, when the exit numerical aperture of the LED light source module is large, the incident angle of the light beam entering the first quartz rod is relatively large, and the light beam cannot meet the condition of total reflection. The four reflective surfaces of the first quartz rod can be coated with total reflection film , Thereby improving the utilization rate of light energy.

圖4是視場調整模組與勻光模組的位置示意圖,參考圖4,第一石英棒固定於機械固定座31上,光闌41與機械固定座之間的距離可以設置為0.2mm,與第一石英棒出射端面的距離可以設置0.5mm。如此設置,保證光闌41移動時不會與機械固定座31產生摩擦,且使得光闌41對光束的折射、反射以及散射等作用較小,保證光闌41在調整視場大小的同時不會對光束產生影響。 Fig. 4 is a schematic diagram of the position of the field of view adjustment module and the homogenization module. Referring to Fig. 4, the first quartz rod is fixed on the mechanical fixing seat 31, and the distance between the aperture 41 and the mechanical fixing seat can be set to 0.2mm, The distance from the exit end surface of the first quartz rod can be set to 0.5 mm. This arrangement ensures that the diaphragm 41 will not rub against the mechanical fixing seat 31 when it moves, and the effect of the diaphragm 41 on the refraction, reflection, and scattering of the beam is small, and it is ensured that the diaphragm 41 does not adjust the size of the field of view. Affect the beam.

圖5是本發明實施例提供的成像模組的示意圖,選擇性地,參考圖5,成像模組50包含沿光路依次設置的第一雙凸透鏡51、第一凸凹透鏡52、第二雙凸透鏡53、第三雙凸透鏡54、第一凹凸透鏡55以及第四雙凸透鏡56; FIG. 5 is a schematic diagram of an imaging module provided by an embodiment of the present invention. Optionally, referring to FIG. 5, the imaging module 50 includes a first lenticular lens 51, a first convex-concave lens 52, and a second lenticular lens 53 arranged in sequence along the optical path. , The third biconvex lens 54, the first meniscus lens 55 and the fourth biconvex lens 56;

第一雙凸透鏡51設置於第一凸凹透鏡52鄰近LED光源模組的一側。 The first biconvex lens 51 is disposed on the side of the first convex-concave lens 52 adjacent to the LED light source module.

具體的,表2示出各透鏡的具體尺寸以及各透鏡之間的間距。其中,rij指沿光路傳輸方向第i個透鏡的第j個表面的半徑,其中i為大於或等於1,且小於或等於6的正整數,j為1或2,j等於1代表透鏡鄰近LED光源模組的表面,j等於2代表透鏡遠離LED光源模組的表 面。且rij為正數代表該表面沿光線傳輸方向向遠離LED光源模組的方向凸起,rij為負數代表該表面沿光線傳輸方向向鄰近LED光源模組的方向凸起。dm代表沿光路傳輸方向第m個透鏡沿光軸的厚度,m為大於或等於1,且小於或等於6的正整數。dpq代表沿光路傳輸方向第p個透鏡及第q個透鏡之間沿光軸的間距,p及q均為大於或等於1,且小於或等於m的整數。 Specifically, Table 2 shows the specific size of each lens and the spacing between each lens. Among them, rij refers to the radius of the j-th surface of the i-th lens along the optical path transmission direction, where i is a positive integer greater than or equal to 1 and less than or equal to 6, j is 1 or 2, and j is equal to 1 for the lens adjacent to the LED The surface of the light source module, j is equal to 2 means the lens is far away from the surface of the LED light source module surface. A positive number of rij means that the surface is convex in a direction away from the LED light source module along the light transmission direction, and a negative number of rij means that the surface is convex in a direction adjacent to the LED light source module along the light transmission direction. dm represents the thickness of the mth lens along the optical axis along the optical path transmission direction, and m is a positive integer greater than or equal to 1 and less than or equal to 6. dpq represents the distance along the optical axis between the p-th lens and the q-th lens along the optical path transmission direction, and p and q are both integers greater than or equal to 1 and less than or equal to m.

表2

Figure 108135575-A0202-12-0010-17
Table 2
Figure 108135575-A0202-12-0010-17

Figure 108135575-A0202-12-0011-4
Figure 108135575-A0202-12-0011-4

示例性的,參考表2,r11為第一雙凸透鏡51鄰近LED光源模組的表面的半徑,r11為負值代表第一雙凸透鏡51鄰近LED光源模組的表面向LED光源模組方向凸起。d1為第一雙凸透鏡51的厚度,d12為第一雙凸透鏡51與第一凸凹透鏡52之間沿光軸的間距。 Exemplarily, referring to Table 2, r11 is the radius of the surface of the first lenticular lens 51 adjacent to the LED light source module, and r11 is a negative value indicating that the surface of the first lenticular lens 51 adjacent to the LED light source module is convex toward the LED light source module . d1 is the thickness of the first lenticular lens 51, and d12 is the distance between the first lenticular lens 51 and the first convex-concave lens 52 along the optical axis.

此外,參考圖5,成像模組進一步包含第一遮雜散光光闌57,設置於第二雙凸透鏡53及第三雙凸透鏡54之間,用於去除環境中的雜散光。沿光路傳輸方向,第一遮雜散光光闌57及第二雙凸透鏡53以及第三雙凸透鏡54之間的間距分別為d8及d7,第一雙凸透鏡51與物面之間的間距為d0,第四雙凸透鏡56與像面之間的間距為d9。需要說明的是,本實施例中所提到的間距均為在中心光軸上的距離。 In addition, referring to FIG. 5, the imaging module further includes a first stray light blocking diaphragm 57, which is disposed between the second lenticular lens 53 and the third lenticular lens 54 for removing stray light in the environment. Along the transmission direction of the optical path, the distances between the first stray light blocking diaphragm 57, the second lenticular lens 53, and the third lenticular lens 54 are d8 and d7, respectively, and the distance between the first lenticular lens 51 and the object surface is d0, The distance between the fourth lenticular lens 56 and the image plane is d9. It should be noted that the pitches mentioned in this embodiment are all distances on the central optical axis.

藉由模擬得到,本實施例的成像模組最大彌散斑尺寸不超過0.25mm,對應光學半影不超過0.2mm;視場內不同波長的最大畸變<0.4%,在像面設置探測器,藉由設置條件追跡大量光線,對探測器上的光強數據進行分析可知,矽片面5×5mm照明區域的均勻性為2.5%。 Through simulation, the maximum diffuse spot size of the imaging module of this embodiment does not exceed 0.25mm, and the corresponding optical penumbra does not exceed 0.2mm; the maximum distortion of different wavelengths in the field of view is less than 0.4%, and the detector is set on the image plane. By setting conditions to trace a large number of light rays, and analyzing the light intensity data on the detector, it can be seen that the uniformity of the 5×5mm illumination area on the silicon wafer surface is 2.5%.

為方便安裝及降低零件成本,成像模組可以採用調節方式確保透鏡偏心、傾斜及空氣間隔精度。 In order to facilitate the installation and reduce the cost of parts, the imaging module can be adjusted to ensure the accuracy of lens eccentricity, tilt and air spacing.

圖6是本發明實施例提供的又一種LED照明裝置的示意圖,在上述實施例的基礎上,選擇性地,參考圖6,LED光源模組包含LED發光單元11陣列。 FIG. 6 is a schematic diagram of another LED lighting device provided by an embodiment of the present invention. Based on the above-mentioned embodiment, and optionally, referring to FIG. 6, the LED light source module includes an array of LED light-emitting units 11.

具體的,LED發光單元陣列可以包含m*n個LED發光單元11,其中,m及n均為大於或等於1的整數。示例性的,可以包含九個相同型號的LED發光單元11,排列成3*3的陣列。LED發光單元11陣列的角分佈採用朗伯分佈,使得LED光源模組10發出的光束近似一個同樣半徑同樣亮度的發光圓盤。LED發光單元11的發光波長可以為465nm、435nm、365nm或更短波長。LED發光單元11陣列的出射NA小於0.95。藉由採用LED發光單元11陣列,可提高LED光源模組10的照度,從而提高LED光源模組10的照度,提高曝光效率。具體的,可以根據照度需要調節LED發光單元11陣列中LED發光單元11的數量。 Specifically, the LED light emitting unit array may include m*n LED light emitting units 11, where m and n are both integers greater than or equal to 1. Exemplarily, it may include nine LED light emitting units 11 of the same model, arranged in a 3*3 array. The angular distribution of the LED light-emitting unit 11 array adopts a Lambertian distribution, so that the light beam emitted by the LED light source module 10 approximates a light-emitting disc with the same radius and the same brightness. The light emitting wavelength of the LED light emitting unit 11 may be 465 nm, 435 nm, 365 nm or shorter wavelengths. The emission NA of the LED light-emitting unit 11 array is less than 0.95. By adopting the LED light-emitting unit 11 array, the illuminance of the LED light source module 10 can be increased, thereby increasing the illuminance of the LED light source module 10 and improving the exposure efficiency. Specifically, the number of LED light-emitting units 11 in the LED light-emitting unit 11 array can be adjusted according to the need of illumination.

選擇性地,勻光模組30包含微透鏡陣列33及第二石英棒32; Optionally, the homogenization module 30 includes a micro lens array 33 and a second quartz rod 32;

微透鏡陣列33沿光路設置於第二石英棒32鄰近LED光源模組10的一側。 The micro lens array 33 is arranged on the side of the second quartz rod 32 adjacent to the LED light source module 10 along the optical path.

具體的,微透鏡陣列33由兩組相互垂直的柱面鏡疊加組成,可以將單個光源分解成多個照明光源,提高照明均勻性,利用微透鏡陣列33來收集光束的作用是初步勻光,藉由對微透鏡陣列33的曲率的設計來改變光束數值孔徑,使得進入第二石英棒32的光束的數值孔徑變 大,第二石英棒32中光束的反射次數增加,達到在第二石英棒32出射端面的光束分佈更加均勻的效果。圖7為一種微透鏡陣列的示意圖,示例性的,微透鏡陣列33的結構如圖7所示,尺寸為20mm*20mm*2mm(公差均為±0.1),通光口徑為18mm*18mm,半徑為4.35±0.13mm,透過率92%。 Specifically, the microlens array 33 is composed of two sets of mutually perpendicular cylindrical mirrors superimposed, which can decompose a single light source into multiple illumination light sources to improve the uniformity of illumination. The role of the microlens array 33 to collect light beams is preliminary uniform light. By designing the curvature of the microlens array 33 to change the numerical aperture of the beam, the numerical aperture of the beam entering the second quartz rod 32 is changed. Larger, the number of reflections of the light beam in the second quartz rod 32 is increased, achieving the effect that the light beam distribution at the exit end of the second quartz rod 32 is more uniform. Fig. 7 is a schematic diagram of a microlens array. Illustratively, the structure of the microlens array 33 is shown in Fig. 7, the size is 20mm*20mm*2mm (tolerances are both ±0.1), the aperture is 18mm*18mm, and the radius is It is 4.35±0.13mm and the transmittance is 92%.

第二石英棒32是一個入射端面與出射端面有一定比例M的石英積分棒,可以藉由改變M的值來控制石英棒出射數值孔徑。成像模組50的物面位於第二石英棒32的出射端面,把第二石英棒32出射端面的均勻視場放大,並在中繼像面形成均勻性1%以下的均勻性曝光視場。 The second quartz rod 32 is a quartz integrator rod with a certain ratio M between the entrance end face and the exit end face. The exit numerical aperture of the quartz rod can be controlled by changing the value of M. The object plane of the imaging module 50 is located on the exit end surface of the second quartz rod 32, amplifies the uniform field of view of the exit end surface of the second quartz rod 32, and forms a uniform exposure field with a uniformity of less than 1% on the relay image plane.

本實施例中採用微透鏡陣列33及第二石英棒32組合形成勻光模組30調節光束的均勻性,進一步提高勻光效果,且LED發光單元11陣列發出的光直接進入勻光模組30中,此過程沒有光能損失,大大提高光能利用率。 In this embodiment, the microlens array 33 and the second quartz rod 32 are combined to form the homogenization module 30 to adjust the uniformity of the light beam, and further improve the homogenization effect, and the light emitted by the LED light emitting unit 11 array directly enters the homogenization module 30 In this process, there is no loss of light energy, which greatly improves the utilization rate of light energy.

選擇性地,參考圖6,LED照明裝置進一步包含: Optionally, referring to FIG. 6, the LED lighting device further includes:

光學擋片60,沿光路設置於LED光源模組10及勻光模組30之間,光學擋片60用於調整LED光源模組10出射光束的數值孔徑。 The optical baffle 60 is arranged between the LED light source module 10 and the homogenizing module 30 along the optical path. The optical baffle 60 is used to adjust the numerical aperture of the light beam emitted by the LED light source module 10.

其中,LED光源模組10採用LED發光單元11陣列時,其具有一定的出射數值孔徑,並且數值孔徑關於LED發光單元11陣列的中心對稱。藉由設置光學擋片60可以一定程度上減小LED光源模組10的數值孔徑,使LED光源模組10發出的光線能夠最大限度的耦合進入勻光模組30,提高光能利用率。 Wherein, when the LED light source module 10 adopts the LED light emitting unit 11 array, it has a certain output numerical aperture, and the numerical aperture is symmetrical about the center of the LED light emitting unit 11 array. By providing the optical baffle 60, the numerical aperture of the LED light source module 10 can be reduced to a certain extent, so that the light emitted by the LED light source module 10 can be coupled into the uniform light module 30 to the maximum extent, and the light energy utilization rate is improved.

具體的,LED光源模組10與光學擋片60之間的距離為 L1,L1小於2mm。其中,LED光源模組10與光學擋片60之間的距離L1由LED光源模組10的出射端的數值孔徑及第二石英棒32的入射端面的大小決定,距離越近(L1越小),耦合進入微透鏡陣列33及第二石英棒32的光能量越多,光能利用率就會越高,當L1小於1mm時,耦合進入微透鏡陣列33及第二石英棒32的光能可達到100%。 Specifically, the distance between the LED light source module 10 and the optical baffle 60 is L1, L1 are less than 2mm. Wherein, the distance L1 between the LED light source module 10 and the optical baffle 60 is determined by the numerical aperture of the emitting end of the LED light source module 10 and the size of the incident end surface of the second quartz rod 32, the closer the distance (the smaller L1), The more light energy coupled into the microlens array 33 and the second quartz rod 32, the higher the utilization rate of light energy. When L1 is less than 1mm, the light energy coupled into the microlens array 33 and the second quartz rod 32 can reach 100%.

選擇性地,光學擋片60與前述微透鏡陣列33之間的距離為L2,L2<L4/2tanθ,其中,θ為前述LED光源模組10的最大半散射角。微透鏡陣列33與第二石英棒32之間的距離亦為L2,使得第二石英棒32能夠收集到從光學擋片60穿出的所有光束。 Optionally, the distance between the optical baffle 60 and the aforementioned microlens array 33 is L2, L2<L4/2tanθ, where θ is the maximum half-scattering angle of the aforementioned LED light source module 10. The distance between the micro lens array 33 and the second quartz rod 32 is also L2, so that the second quartz rod 32 can collect all the light beams passing through the optical baffle 60.

選擇性地,第二石英棒32的出射端面的面積大於入射端面的面積。 Optionally, the area of the exit end surface of the second quartz rod 32 is larger than the area of the entrance end surface.

具體的,LED光源模組10的出射截面為L3XL3的正方形,出射數值孔徑小於0.95,第二石英棒32的入射端面為L4 X L4的正方形,出射端面為L5 X L5的正方形,且L3<L4<L5,則可得到數值孔徑為0.40,視場大小為L5×L5mm的均勻區域。 Specifically, the exit cross-section of the LED light source module 10 is L3XL3 square, the exit numerical aperture is less than 0.95, the incident end face of the second quartz rod 32 is L4 X L4 square, the exit end face is L5 X L5 square, and L3<L4 <L5, a uniform area with a numerical aperture of 0.40 and a field of view of L5×L5mm can be obtained.

此外,藉由第二石英棒32的出射端面的面積大於入射端面的面積,使得第二石英棒32的出射光束的數值孔徑與後續光學系統匹配。當然,本實施例亦可藉由調整LED光源模組10與第二石英棒32之間的距離調整第二石英棒32的出射光束的數值孔徑,並達到與後續光學系統匹配的效果。 In addition, since the area of the exit end surface of the second quartz rod 32 is larger than the area of the incident end surface, the numerical aperture of the exit beam of the second quartz rod 32 matches the subsequent optical system. Of course, in this embodiment, the numerical aperture of the light beam emitted from the second quartz rod 32 can also be adjusted by adjusting the distance between the LED light source module 10 and the second quartz rod 32 to achieve the effect of matching with the subsequent optical system.

選擇性地,第二石英棒32的反射面上均鍍有全反射膜。 Optionally, the reflective surface of the second quartz rod 32 is plated with a total reflection film.

具體的,當LED光源模組10的出射光束的數值孔徑非常 大,在進入第二石英棒32中時,入射角度較大的光束不能滿足全反射條件,藉由對第二石英棒32的四個反射面鍍全反射膜,可以大大提高光能利用率。 Specifically, when the numerical aperture of the emitted light beam of the LED light source module 10 is very When entering the second quartz rod 32, the light beam with a larger incident angle cannot satisfy the total reflection condition. By coating the four reflecting surfaces of the second quartz rod 32 with a total reflection film, the light energy utilization rate can be greatly improved.

圖8是本發明實施例提供的又一種成像模組的示意圖,選擇性地,參考圖8,成像模組50包含沿光路依次設置的第二凹凸透鏡71、第五雙凸透鏡72、第二凸凹透鏡73、第三凸凹透鏡74、第六雙凸透鏡75、反射鏡76、第一雙凹透鏡77、第三凹凸透鏡78、第七雙凸透鏡79以及平面透鏡80; FIG. 8 is a schematic diagram of another imaging module provided by an embodiment of the present invention. Optionally, referring to FIG. 8, the imaging module 50 includes a second meniscus lens 71, a fifth lenticular lens 72, and a second convex and concave lens arranged in sequence along the optical path. Lens 73, third convex-concave lens 74, sixth bi-convex lens 75, mirror 76, first bi-concave lens 77, third meniscus lens 78, seventh bi-convex lens 79, and flat lens 80;

第二凹凸透71鏡設置於第五雙凸透鏡72鄰近LED光源模組10的一側。 The second concave-convex lens 71 is disposed on a side of the fifth biconvex lens 72 adjacent to the LED light source module 10.

具體的,表3示出各透鏡的具體尺寸以及各透鏡之間的間距。其中,Rij指沿光路傳輸方向第i個透鏡的第j個表面的半徑,其中i為大於或等於1,且小於或等於6的正整數,j為1或2,j等於1代表透鏡鄰近LED光源模組的表面,j等於2代表透鏡遠離LED光源模組的表面。且Rij為正數代表該表面沿光線傳輸方向向遠離LED光源模組的方向凸起,Rij為負數代表該表面沿光線傳輸方向向鄰近LED光源模組的方向凸起。Dm代表沿光路傳輸方向第m個透鏡沿光軸的厚度,m為大於或等於1,且小於或等於6的正整數。Dpq代表沿光路傳輸方向第p個透鏡及第q個透鏡之間沿光軸的間距,p及q均為大於或等於1,且小於或等於m的整數。 Specifically, Table 3 shows the specific size of each lens and the distance between each lens. Among them, Rij refers to the radius of the j-th surface of the i-th lens along the optical path transmission direction, where i is a positive integer greater than or equal to 1 and less than or equal to 6, j is 1 or 2, and j is equal to 1 for the lens adjacent to the LED The surface of the light source module, j is equal to 2 represents the surface of the lens away from the LED light source module. A positive number of Rij means that the surface is convex in a direction away from the LED light source module along the light transmission direction, and a negative number of Rij means that the surface is convex in a direction adjacent to the LED light source module along the light transmission direction. Dm represents the thickness of the m-th lens along the optical axis along the optical path transmission direction, and m is a positive integer greater than or equal to 1 and less than or equal to 6. Dpq represents the distance along the optical axis between the p-th lens and the q-th lens along the optical path transmission direction, and p and q are both integers greater than or equal to 1 and less than or equal to m.

表3

Figure 108135575-A0202-12-0016-5
table 3
Figure 108135575-A0202-12-0016-5

Figure 108135575-A0202-12-0017-6
Figure 108135575-A0202-12-0017-6

示例性的,參考表3,R11為第二凹凸透鏡71鄰近LED光源模組的表面的半徑,R11為正代表該表面沿光路向遠離LED光源模組的方向凸起。D1為第二凹凸透鏡71的厚度,D12為第二凹凸透鏡71與第五雙凸透鏡71之間的距離。 Exemplarily, referring to Table 3, R11 is the radius of the surface of the second meniscus lens 71 adjacent to the LED light source module, and R11 represents that the surface is convex along the optical path away from the LED light source module. D1 is the thickness of the second meniscus lens 71, and D12 is the distance between the second meniscus lens 71 and the fifth lenticular lens 71.

此外,參考圖8,成像模組進一步包含第二遮雜散光光闌81,設置於第二凸凹透鏡73及第三凸凹透鏡74之間,用於去除環境中的雜散光。沿光路傳輸方向,第二遮雜散光光闌81及第二凸凹透鏡73以及第三凸凹透鏡74之間的間距分別為D31及D41,第二凹凸透鏡71與物面之間的間距為D0。 In addition, referring to FIG. 8, the imaging module further includes a second stray light blocking diaphragm 81, which is disposed between the second convex-concave lens 73 and the third convex-concave lens 74 to remove stray light in the environment. Along the optical path transmission direction, the distances between the second stray light blocking diaphragm 81, the second convex-concave lens 73, and the third convex-concave lens 74 are D31 and D41, respectively, and the distance between the second meniscus lens 71 and the object surface is D0.

藉由採用上述成像模組,可以得到遠心准直視場,且對上述成像模組進行模擬及實測得到,模擬光束的均勻性可達3.69%,實測光束均勻性可達3.9%。 By using the above imaging module, a telecentric collimated field of view can be obtained, and the simulation and actual measurement of the above imaging module show that the uniformity of the simulated beam can reach 3.69%, and the uniformity of the measured beam can reach 3.9%.

本實施例進一步提供一種曝光機,圖9是本發明實施例提 供的一種曝光機的示意圖,參考圖9,該曝光機100包含本發明任意實施例所提供的LED照明裝置200。 This embodiment further provides an exposure machine. FIG. 9 is an example of the present invention. For a schematic diagram of an exposure machine provided, referring to FIG. 9, the exposure machine 100 includes the LED lighting device 200 provided by any embodiment of the present invention.

選擇性地,該曝光機100進一步包含: Optionally, the exposure machine 100 further includes:

第一運動零件,第一運動零件用於帶動LED照明裝置200的視場調整模組運動,切換不同的光闌。 The first moving part, the first moving part is used to drive the field of view adjustment module of the LED lighting device 200 to move and switch different apertures.

具體的,曝光機100進一步包含運動零件300、控制零件400及監測零件500,可以完成6寸、8寸以及12寸矽片的邊緣曝光、分段曝光、環形曝光盒直線曝光等多種功能。其中: Specifically, the exposure machine 100 further includes a moving part 300, a control part 400, and a monitoring part 500, which can perform various functions such as edge exposure, segment exposure, and linear exposure of a ring exposure box for 6-inch, 8-inch, and 12-inch silicon wafers. among them:

運動零件300包含WEE運動元件及預對準運動元件。其中WEE運動組件包含X及Y運動平臺及光闌自動切換D軸(即第一運動零件)。D軸主要完成視場的自動切換及調整,滿足不同視場大小的需求;X及Y運動平臺承載實施的LED照明裝置200,藉由X及Y運動平臺的相互配合運動,實現照明光束在矽片面上的不同位置調整,同時實現不同矽片曝光工位的自動切換,並實現Y向的直線曝光。 The moving part 300 includes a WEE moving element and a pre-aligned moving element. The WEE motion component includes X and Y motion platforms and the diaphragm automatically switches to the D axis (ie the first moving part). The D axis mainly completes the automatic switching and adjustment of the field of view to meet the needs of different field of view sizes; the X and Y motion platforms carry the implemented LED lighting device 200, through the coordinated movement of the X and Y motion platforms, the illuminating beam is realized in the silicon Adjust the different positions on one side, and realize the automatic switching of different silicon wafer exposure stations at the same time, and realize the linear exposure in the Y direction.

預對準組件主要包含定心台、旋轉升降臺、CCD鏡頭光源及切換軸等。定心台提供水準向直線運動(實現矽片偏心的補償);旋轉升降臺提供垂向升降(實現矽片垂向定位以及與定心台的矽片交接)及水準向旋轉(帶動矽片旋轉);CCD鏡頭光源實現對矽片邊緣形貌數據的採集;切換軸提供水準向直線運動(實現CCD鏡頭光源的位置切換以適應不同尺寸的矽片,比如實現6寸、8寸、12寸矽片工位的自動切換)。 The pre-alignment components mainly include a centering table, a rotating lift table, a CCD lens light source, and a switching axis. The centering table provides horizontal linear movement (to realize the compensation of silicon wafer eccentricity); the rotating lifting table provides vertical lifting (to achieve the vertical positioning of the silicon wafer and the transfer of the silicon wafer with the centering table) and horizontal rotation (to drive the silicon wafer to rotate ); The CCD lens light source realizes the collection of the edge shape data of the silicon wafer; the switching axis provides horizontal linear movement (the position of the CCD lens light source is switched to adapt to different sizes of silicon wafers, such as 6-inch, 8-inch, 12-inch silicon Automatic switching of film stations).

預對準過程主要是完成矽片(包含6寸、8寸及12寸矽片)的定心及定向功能,實現矽片標記(比如notch標記)的精確定位,為後 續邊緣曝光功能的實現奠定基礎。 The pre-alignment process is mainly to complete the centering and orientation functions of silicon wafers (including 6-inch, 8-inch and 12-inch silicon wafers), and realize the precise positioning of silicon wafer marks (such as notch marks). Continue to lay the foundation for the realization of the edge exposure function.

監測零件500包含ESS感測器元件。ESS感測器(energy spot sensor)用於測量LED照明裝置的光強,並回應不同的光強輸出一定線性度對應的電壓值ESS=gain×UThe monitoring part 500 includes an ESS sensor element. The ESS sensor (energy spot sensor) is used to measure the light intensity of the LED lighting device, and respond to different light intensities to output a voltage value ESS = gain × U corresponding to a certain linearity.

控制零件400包含光源控制器、控制主機殼、電腦軟硬體系統等元件組成。藉由控制LED照明裝置200、運動零件300、監測零件500協調完成邊緣曝光流程示。其中計算曝光參數,主要是根據邊緣曝光的劑量控制照度、掃描速度、視場大小、矽片尺寸之間的關係,計算旋轉R軸的曝光運動速度。對於同一個目標劑量,以上主要變數的關係為: The control part 400 includes a light source controller, a control mainframe, a computer software and hardware system and other components. By controlling the LED lighting device 200, the moving parts 300, and the monitoring parts 500, the edge exposure process is completed in coordination. The calculation of exposure parameters is mainly to control the relationship between the illuminance, scanning speed, field of view size, and silicon wafer size according to the dose of edge exposure, and to calculate the exposure movement speed of the rotating R axis. For the same target dose, the relationship between the above main variables is:

Figure 108135575-A0202-12-0019-7
Figure 108135575-A0202-12-0019-7

其中,I為照度;dl為視場大小;v掃描速度;W為矽片周長,其中目標劑量dDose根據不同的光刻膠等確定,矽片尺寸是確定的;視場大小dl是不變的,以上公式中僅有照度I與掃描速度v為可控的變數,藉由調節照度及掃描速度實現曝光功能。 Among them, I is the illuminance; dl is the size of the field of view; v scan speed; W is the circumference of the silicon wafer, where the target dose dDose is determined according to different photoresists, etc. The size of the silicon wafer is determined; the field of view size dl is unchanged In the above formula, only the illuminance I and the scanning speed v are controllable variables, and the exposure function is realized by adjusting the illuminance and the scanning speed.

本實施例提供的曝光機100藉由採用LED照明裝置200,LED照明裝置200採用LED光源模組,因LED能量照度高,能耗小,使用壽命長,回應較快,可有效解決LED照明裝置開關延時、照度低及壽命短的問題,提高邊緣曝光的產率及良率,並節約備件成本。 The exposure machine 100 provided in this embodiment adopts the LED lighting device 200, and the LED lighting device 200 uses the LED light source module. Because of the high LED energy illuminance, low energy consumption, long service life, and fast response, it can effectively solve the LED lighting device The problems of switching delay, low illuminance and short lifespan improve the yield and yield of edge exposure and save the cost of spare parts.

注意,上述僅為本發明的較佳實施例及所運用技術原理。本發明所屬領域具有通常知識者會理解,本發明不限於在此前述的特定實施例,對本發明所屬領域具有通常知識者來說能夠進行各種明顯的變化、 重新調整、相互結合及替代而不會脫離本發明的保護範圍。因此,雖然藉由以上實施例對本發明進行較為詳細的說明,但是本發明不僅限於以上實施例,在不脫離本發明構思的情況下,進一步可以包含更多其他等效實施例,而本發明的範圍由所附的申請專利範圍決定。 Note that the above are only the preferred embodiments of the present invention and the applied technical principles. Those with ordinary knowledge in the field to which the present invention pertains will understand that the present invention is not limited to the specific embodiments described above, and various obvious changes can be made to those with ordinary knowledge in the field to which the present invention pertains. Readjustment, mutual combination and substitution will not depart from the protection scope of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, it may further include more other equivalent embodiments. The scope is determined by the scope of the attached patent application.

10‧‧‧LED光源模組 10‧‧‧LED light source module

20‧‧‧光源控制模組 20‧‧‧Light source control module

30‧‧‧勻光模組 30‧‧‧Uniform light module

40‧‧‧視場調整模組 40‧‧‧Field of View Adjustment Module

50‧‧‧成像模組 50‧‧‧Imaging module

Claims (14)

一種LED照明裝置,其特徵係,其包含: An LED lighting device, its characteristics are: LED光源模組,光源控制模組,勻光模組,成像模組及視場調整模組; LED light source module, light source control module, homogenization module, imaging module and field of view adjustment module; 前述光源控制模組與前述LED光源模組連接,用於控制前述LED光源模組的發光狀態; The aforementioned light source control module is connected to the aforementioned LED light source module for controlling the light-emitting state of the aforementioned LED light source module; 前述勻光模組用於對前述LED光源模組發出的光束進行勻光; The aforementioned homogenization module is used to homogenize the light beam emitted by the aforementioned LED light source module; 前述視場調整模組用於調整前述勻光模組出射的光束的視場大小; The aforementioned field of view adjustment module is used to adjust the size of the field of view of the light beam emitted by the aforementioned homogenization module; 前述成像模組用於將前述視場調整模組出射的光束投射到照明位置。 The aforementioned imaging module is used to project the light beam emitted by the aforementioned field of view adjustment module to the illumination position. 如申請專利範圍第1項所記載之LED照明裝置,其中, Such as the LED lighting device described in item 1 of the scope of patent application, in which, 前述視場調整模組包含多個光闌,前述多個光闌開孔大小不同且可切換地進入照明光路中。 The aforementioned field of view adjustment module includes a plurality of diaphragms, and the plurality of diaphragm openings are of different sizes and can be switched into the illumination light path. 如申請專利範圍第2項所記載之LED照明裝置,其中, Such as the LED lighting device described in item 2 of the scope of patent application, in which, 前述多個光闌的開孔中心之間的距離均大於等於12mm。 The distances between the centers of the apertures of the aforementioned multiple diaphragms are all greater than or equal to 12 mm. 如申請專利範圍第2項所記載之LED照明裝置,其中, Such as the LED lighting device described in item 2 of the scope of patent application, in which, 前述多個光闌的開孔沿曝光寬度方向的尺寸依次增大,其他方向的尺寸均相等。 The size of the apertures of the plurality of apertures along the exposure width direction increases sequentially, and the sizes in other directions are all equal. 如申請專利範圍第1項所記載之LED照明裝置,其中, Such as the LED lighting device described in item 1 of the scope of patent application, in which, 前述LED光源模組包含LED發光單元及聚焦透鏡。 The aforementioned LED light source module includes an LED light-emitting unit and a focusing lens. 如申請專利範圍第5項所記載之照明裝置,其中, Such as the lighting device described in item 5 of the scope of patent application, in which, 前述成像模組包含沿光路依次設置的第一雙凸透鏡、第一凸凹透鏡、第二雙凸透鏡、第三雙凸透鏡、第一凹凸透鏡以及第四雙凸透鏡; The aforementioned imaging module includes a first bi-convex lens, a first convex-concave lens, a second bi-convex lens, a third bi-convex lens, a first meniscus lens, and a fourth bi-convex lens arranged in sequence along the optical path; 前述第一雙凸透鏡設置於前述第一凸凹透鏡鄰近前述LED光源模組的一側。 The first biconvex lens is arranged on a side of the first convex-concave lens adjacent to the LED light source module. 如申請專利範圍第5項所記載之LED照明裝置,其中, Such as the LED lighting device described in item 5 of the scope of patent application, in which, 前述勻光模組包含第一石英棒。 The aforementioned homogenization module includes a first quartz rod. 如申請專利範圍第1項所記載之LED照明裝置,其中, Such as the LED lighting device described in item 1 of the scope of patent application, in which, 前述LED光源模組包含LED發光單元陣列。 The aforementioned LED light source module includes an LED light emitting unit array. 如申請專利範圍第1或8項所記載之LED照明裝置,其中, Such as the LED lighting device described in item 1 or 8 of the scope of patent application, in which, 前述勻光模組包含微透鏡陣列及第二石英棒; The aforementioned homogenization module includes a microlens array and a second quartz rod; 前述微透鏡陣列沿光路設置於前述第二石英棒鄰近前述LED光源模組的一側。 The microlens array is arranged on the side of the second quartz rod adjacent to the LED light source module along the optical path. 如申請專利範圍第9項所記載之LED照明裝置,其中, Such as the LED lighting device described in item 9 of the scope of patent application, in which, 前述第二石英棒的出射端面的面積大於入射端面的面積。 The area of the exit end surface of the aforementioned second quartz rod is larger than the area of the entrance end surface. 如申請專利範圍第8項所記載之LED照明裝置,其中,進一步包含: Such as the LED lighting device described in item 8 of the scope of patent application, which further includes: 光學擋片,沿光路設置於前述LED光源模組及前述勻光模組之間,前述光學擋片用於調整前述LED光源模組出射光束的數值孔徑。 The optical baffle is arranged between the LED light source module and the homogenizing module along the optical path, and the optical baffle is used to adjust the numerical aperture of the light beam emitted by the LED light source module. 如申請專利範圍第8項所記載之LED照明裝置,其中, Such as the LED lighting device described in item 8 of the scope of patent application, in which, 前述成像模組包含沿光路依次設置的第二凹凸透鏡、第五雙凸透鏡、第二凸凹透鏡、第三凸凹透鏡、第六雙凸透鏡、反射鏡、第一雙凹透鏡、第三凹凸透鏡、第七雙凸透鏡以及平面透鏡; The aforementioned imaging module includes a second concave-convex lens, a fifth double-convex lens, a second convex-concave lens, a third convex-concave lens, a sixth double-convex lens, a mirror, a first double-concave lens, a third concave-convex lens, and a seventh concave-convex lens, a fifth double-convex lens, a second convex-convex lens, a third convex-concave lens, a sixth double-convex lens, and a second concave-convex lens. Double convex lens and flat lens; 第二凹凸透鏡設置於第五雙凸透鏡鄰近LED光源模組的一側。 The second concave-convex lens is arranged on the side of the fifth biconvex lens adjacent to the LED light source module. 一種曝光機,其特徵係,其包含申請專利範圍第1至12項中任一項所記載之LED照明裝置。 An exposure machine characterized by the LED lighting device described in any one of items 1 to 12 in the scope of patent application. 如申請專利範圍第13項所記載之曝光機,其中,進一步包含: Such as the exposure machine described in item 13 of the scope of patent application, which further includes: 第一運動零件,前述第一運動零件用於帶動LED照明裝置的視場調整模組運動,切換不同的光闌。 The first moving part, the aforementioned first moving part is used to drive the field of view adjustment module of the LED lighting device to move and switch different apertures.
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