TW202032646A - 雷射加工裝置 - Google Patents

雷射加工裝置 Download PDF

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Publication number
TW202032646A
TW202032646A TW108146730A TW108146730A TW202032646A TW 202032646 A TW202032646 A TW 202032646A TW 108146730 A TW108146730 A TW 108146730A TW 108146730 A TW108146730 A TW 108146730A TW 202032646 A TW202032646 A TW 202032646A
Authority
TW
Taiwan
Prior art keywords
irradiation
semiconductor object
laser light
semiconductor
transmittance
Prior art date
Application number
TW108146730A
Other languages
English (en)
Chinese (zh)
Inventor
河口大祐
和仁陽太郎
伊崎泰則
Original Assignee
日商濱松赫德尼古斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商濱松赫德尼古斯股份有限公司 filed Critical 日商濱松赫德尼古斯股份有限公司
Publication of TW202032646A publication Critical patent/TW202032646A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW108146730A 2018-12-21 2019-12-19 雷射加工裝置 TW202032646A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-239496 2018-12-21
JP2018239496A JP7258542B2 (ja) 2018-12-21 2018-12-21 レーザ加工装置

Publications (1)

Publication Number Publication Date
TW202032646A true TW202032646A (zh) 2020-09-01

Family

ID=71101197

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108146730A TW202032646A (zh) 2018-12-21 2019-12-19 雷射加工裝置

Country Status (3)

Country Link
JP (1) JP7258542B2 (ja)
TW (1) TW202032646A (ja)
WO (1) WO2020130110A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023106017A1 (ja) * 2021-12-08 2023-06-15 株式会社デンソー ウェハ製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005098916A1 (ja) * 2004-03-30 2005-10-20 Hamamatsu Photonics K.K. レーザ加工方法及び半導体チップ
JP2007319881A (ja) * 2006-05-31 2007-12-13 Seiko Epson Corp 基体の製造方法、レーザ加工装置、表示装置、電気光学装置、電子機器
JP6113477B2 (ja) * 2012-12-06 2017-04-12 株式会社ディスコ ウエーハのレーザー加工方法およびレーザー加工装置
JP6655833B2 (ja) * 2016-03-31 2020-02-26 パナソニックＩｐマネジメント株式会社 スライス方法およびスライス装置

Also Published As

Publication number Publication date
WO2020130110A1 (ja) 2020-06-25
JP2020102522A (ja) 2020-07-02
JP7258542B2 (ja) 2023-04-17

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